JP2000286325A - Wafer aligning device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wafer aligning device, with which two wafers of different size can be aligned without replacing a guide means, contamination by the particles in a replacement chamber can be prevented, and the operation hours of the device can be increased. SOLUTION: A pair of plates 105 and 105', which are arranged pinching a wafer 103 and can be moved in a direction almost orthogonally intersecting with wafer insertion direction, is provided, and the first guide means 109 and 109' having circular arc surfaces 107 and 107' which can be brought into contact with the side face of a small wafer 103, are provided on the places 105 and 105'. Moreover, second guide means 113 and 113', consisting of a plurality of rollers (cylinders) 111 and 111' which are formed on the plates 105 and 105' and can be brought into contact with the side face of a large wafer 103, are provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a wafer alignment apparatus for centering two kinds of wafers having different sizes and aligning a notch / orientation flat of the wafer.

[0002]

2. Description of the Related Art In a semiconductor manufacturing apparatus, as shown in FIG.
To the inside of the exchange chamber 4.

When the wafer 2 is transferred into the exchange chamber 4, the interior of the exchange chamber 4 is sealed and evacuated, and at the same time, the wafer is aligned by the wafer alignment device 10 provided in the exchange chamber 4.
The position alignment of the wafer 2 and the detection of the notch / orientation flat of the wafer 2 are performed.

[0004] The wafer alignment apparatus 10
Guide means 5, 5 'having an arc-shaped surface movable in a direction substantially perpendicular to the insertion direction of the wafer 2 and capable of contacting the side surface of the wafer 2; An optical switch (detection means) 7 for detecting an orientation flat /
Rotating means 6 for rotatingly driving the wafer 2.

[0005] First, guide means 5, 5 'sandwich the wafer 2 and perform centering (position alignment) of the wafer 2. Next, the state in which the guide means 5, 5 'means sandwiches the wafer 2 is released, the rotating means 6 rotates the wafer, and the notch / orientation flat 2a of the wafer 2 is detected by the optical switch 7, and the notch / orientation of the wafer 2 is detected. The orientation of the orientation flat 2a is performed.

[0006]

However, the conventional wafer alignment apparatus 10 having the above configuration has the following problems.

(1) The guide means 5, 5 'corresponding to the size (diameter) of the wafer 2 is required, and when changing the size of the wafer 2, the guide means 5, 5' need to be replaced. (2) The position of the optical switch 7 also needs to be changed according to the size of the wafer 2.

(3) The semiconductor manufacturing apparatus dislikes particles (molecules and particles). On the other hand, replacement of the guide means 5 and 5 ′ and change of the position of the optical switch 7 necessary for changing the size of the wafer 2 are performed in the replacement chamber 4.

Therefore, the inside of the exchange chamber 4 may be contaminated by particles. (4) The apparatus must be stopped for a long time to replace the guide means 5, 5 'and to change the position of the optical switch 7.

The present invention has been made in view of the above problems, and a first object of the present invention is to perform alignment of two kinds of wafers having different sizes without replacing the guide means, and An object of the present invention is to provide a wafer alignment apparatus capable of preventing contamination by particles and increasing the operation time of the apparatus.

A second object is to perform alignment of two kinds of wafers having different sizes without changing the position of a detecting means for detecting a notch / orientation flat of a wafer, to prevent contamination by particles in an exchange chamber, An object of the present invention is to provide a wafer alignment apparatus capable of increasing the operation time of the apparatus.

[0012]

According to a first aspect of the present invention, there is provided a wafer alignment apparatus for performing centering of two kinds of wafers having different sizes and alignment of a notch / orientation flat of the wafer. A pair of plates disposed so as to sandwich the wafer and movable in a direction substantially perpendicular to the wafer insertion direction, and a second plate provided on each plate and having an arcuate surface capable of contacting a side surface of the small wafer. One guide means, provided on each plate,
A wafer alignment apparatus comprising: a second guide unit including a plurality of cylinders that can contact a side surface of a large wafer.

The first guide means centers a small one of the wafers having different sizes. The centering of a large wafer among the wafers having different sizes is performed by the second guide means.

By providing the first and second guide means, two types of wafers having different sizes can be centered without replacing the guide means, and contamination by particles in the exchange chamber can be prevented. Operating time can be increased.

According to a second aspect of the present invention, there is provided a wafer alignment apparatus for performing centering of two kinds of wafers having different sizes and alignment of a notch / orientation flat of the wafer, wherein the wafer alignment apparatus is arranged so as to sandwich the wafer. A pair of plates movable in a direction substantially perpendicular to the wafer insertion direction, a first guide means provided on each plate, and a plurality of cylinders capable of contacting the side surface of a small wafer; And a second guide means comprising a plurality of cylinders provided to be able to contact the side surface of the large wafer.

The first guide means centers a small wafer among wafers of different sizes. The centering of a large wafer among the wafers having different sizes is performed by the second guide means.

By providing the first and second guide means, two types of wafers having different sizes can be centered without replacing the guide, contamination by particles in the replacement chamber can be prevented, and The operating time can be increased.

According to a third aspect of the present invention, there is provided a wafer alignment apparatus according to the first or second aspect, wherein the column is a roller. By using the cylinder as a roller, a smooth operation can be obtained when the wafer is centered.

The invention according to claim 4 is the invention according to any one of claims 1 to 3, wherein the notch /
A wafer alignment apparatus, wherein detection means for detecting an orientation flat is provided for two types of wafers having different sizes.

By providing the detecting means for detecting the notch / ori-fla of the wafer corresponding to the two kinds of wafers having the different sizes, the centering of the two kinds of wafers having different sizes can be performed without changing the position of the detecting means. This can prevent contamination by particles in the exchange chamber and increase the operation time of the apparatus.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS 1. First Embodiment (Corresponding to Claims 1, 3, and 4) FIGS. 1 and 2 show the overall configuration of a wafer alignment apparatus according to a first embodiment. This will be described with reference to FIG. 2 which is an enlarged view of a portion, and FIG. 3 which is a sectional view of the roller in FIG.

In FIG. 1, a pair of plates 105 arranged in the exchange chamber 100 so as to sandwich the wafer 103 and movable in a direction (arrow B) substantially perpendicular to the wafer insertion direction (arrow A direction in the figure). , 105 '.
Further, between the plate 105 and the plate 105 ', there is provided a rotating means 106 for rotating and driving the wafer 103.

As shown in FIG. 2, each plate 105, 1
05 ', first guide means 109, 109' having arcuate surfaces 107, 107 'capable of contacting the side surfaces of a small wafer (a 6-inch wafer in the present embodiment) and a large wafer (this embodiment). The second guide means 113 comprising rollers 111, 111 'as a plurality of (three in this embodiment) cylinders capable of contacting the side surface of the 8-inch wafer in the embodiment,
113 '.

As shown in FIG. 3, the rollers 111 and 111 'are provided on shafts 11 and 11 which are erected on the plates 105 and 105'.
1a and a roller body 111c rotatably provided with respect to the shaft 111a via a bearing 111b provided at the tip of the shaft 111a.

Further, as shown in FIG. 1, an optical switch (detection means) 1 for detecting a notch / ori flat on a 6-inch wafer.
15 and an optical switch (detection means) 117 for detecting a notch / orientation flat of an 8-inch wafer.

Next, the operation of the above configuration will be described. (1) In the case of a 6-inch wafer As shown in FIG. 4 (a), a 6-inch wafer 103S, which is a small wafer, is sandwiched between the arcuate surfaces 107 and 107 'of the first guide means 109 and 109' to form a 6-inch wafer. Wafer 1
The centering of 03S is performed.

Then, the first guide means 109, 10
The state of sandwiching the wafer 9 'is released, and the rotating means 106
The inch wafer 103S is rotated, and 6
When the notch / ori-flat of the inch wafer 103S is detected,
The notch / orientation flat of the inch wafer 103S is aligned.

(2) In the case of an 8-inch wafer As shown in FIG. 4B, an 8-inch wafer 103L which is a large wafer is sandwiched between rollers 111 and 111 'of second guide means 113 and 113'. 8 inch wafer 1
Then, the state in which the wafer is sandwiched between the second guide means 113 and 113 'is released, and the rotating means 106 rotates the 8-inch wafer 1
Rotate 03L and use the optical switch 117 to set the 8 inch wafer 1
Detects a 03L notch / origin flat and detects an 8-inch wafer 1
The position of the notch / orientation flat 103a of 03L is adjusted.

According to the wafer alignment apparatus having such a configuration, the following effects can be obtained. (1) By providing the first and second guide means 109 and 109 ', two types of wafers 103S and 103L having different sizes can be centered without replacing the guide means. It is possible to prevent contamination by the particles, and to increase the operation time of the apparatus.

(2) Since the second guide means 113, 113 'are rollers 111, 111', the wafer 10
Smooth operation can be obtained during 3L centering.

Particularly, in this embodiment, the shafts 111a, 111a,
By providing roller bodies 111c and 111c 'via bearings 111b and 111b' with respect to 111a ', eccentricity of roller bodies 111c and 111c' can be minimized, and accurate centering can be performed. it can.

(3) By providing the optical switches 115 and 117 for detecting the notches / oriflas of the wafers 103S and 103L in correspondence with the two kinds of wafers 103S and 103L having different sizes, the position of the optical switches is not changed. Centering of two types of wafers 103S and 103L having different sizes can be performed, contamination by particles in the exchange chamber can be prevented, and the operation time of the apparatus can be increased. 2. Second Embodiment (Corresponding to Claims 2, 3, and 4) In this embodiment and the first embodiment, the same parts are denoted by the same reference numerals, and duplicate description is omitted. Omitted.

As shown in FIG. 5 and FIG. 6 which is an enlarged view of the plate portion in FIG. 5 showing the overall configuration of the wafer alignment apparatus of the second embodiment, a plate 105 has four rollers 131, 132, 133, and 134 are provided, and rollers 131 ', 132', 133 ', and 134' are provided on the plate 105 'at positions symmetrical to the rollers 131, 132, 133, and 134 on the plate 105. I have.

The rollers 131, 132, 133, 134,
The structures of 131 ', 132', 133 'and 134' are shown in FIG.
Are the same as those shown in FIG. Of these eight rollers, the rollers 132, 133, 134 on the plate 105
And rollers 132 ', 133', 1 on the plate 105 '.
Reference numeral 34 'constitutes first guide means capable of contacting a 6-inch wafer which is a small wafer.

The rollers 131,1 on the plate 105
32,134 and rollers 131 'on the plate 105',
132 'and 134' constitute second guide means capable of contacting an 8-inch wafer which is a large wafer.

Next, the operation of the above configuration will be described. (1) In the case of a 6-inch wafer As shown in FIG. 7A, the 6-inch wafer 103S, which is a small wafer, has a plate 105 serving as the first guide means.
Upper rollers 132, 133, 134 and plate 105 '
The 6-inch wafer 103S is sandwiched between the upper rollers 132 ', 133', and 134 'to perform centering.

The rollers 132, 133, and 134 on the plate 105, which are the first guide means, and the plate 1
The roller 132 ′, 133 ′, and 134 ′ on 05 ′ release the state of sandwiching the wafer, the rotating means 106 rotates the 6-inch wafer 103S, and the optical switch 115 detects the notch / ori-fla of the 6-inch wafer 103S. , Alignment of notch / orientation flat of 6 inch wafer 103S.

(2) In the case of an 8-inch wafer As shown in FIG. 7B, an 8-inch wafer 103L, which is a large wafer, has a plate 105 serving as a second guide means.
Upper rollers 131, 132, 134 and plate 105 '
The 8-inch wafer 103L is centered by the upper rollers 131 ', 132', and 134 ', and the rollers 131, 132, and 134 on the plate 105, which is the second guide means, and on the plate 105'. The state in which the wafer is sandwiched between the rollers 131 ', 132', and 134 'is released, the rotating means 106 rotates the 8-inch wafer 103L, and the optical switch 117 detects the notch / orientation flat of the 8-inch wafer 103L. The notch / orientation flat of the inch wafer 103L is aligned.

According to the wafer alignment apparatus having such a configuration, the following effects can be obtained. (1) Rollers 132, 133, 134 on the plate 105
And rollers 132 ', 133', 1 on the plate 105 '.
34 'and 6 inch wafer 103S which is a small wafer
Constitutes a first guide means capable of contacting the
5, rollers 131, 132, 134 and plate 10
The rollers 131 ', 132', and 134 'on the 5' constitute second guide means capable of contacting the 8-inch wafer 103L, which is a large wafer. Kinds of wafers 103S, 103
The centering of L can be performed, contamination by particles in the exchange room 100 can be prevented, and the operating time of the apparatus can be increased.

(2) Each guide means is provided with rollers 131, 132,
133,134,131 ', 132', 133 ', 134'
With this configuration, a smooth operation can be obtained when the wafers 103S and 103L are centered.

In this embodiment, similarly to the first embodiment, the eccentricity of the roller main body can be minimized by providing the roller main body via the bearing with respect to the shaft. , Accurate centering can be performed.

(3) By providing the optical switches 115 and 117 for detecting the notches / oriflas of the wafers 103S and 103L in correspondence with the two kinds of wafers 103S and 103L having different sizes, the position of the optical switches is not changed. Centering of two types of wafers 103S and 103L having different sizes can be performed, contamination by particles in the exchange chamber can be prevented, and the operation time of the apparatus can be increased.

The present invention is not limited to the above embodiment. In the above embodiment, a 6-inch wafer and 8
In the above description, the centering with the inch wafer and the alignment of the notch / orientation flat of the wafer can be performed, but by appropriately selecting the first and second guide means, various sizes can be obtained. A wafer alignment apparatus for centering the wafer and aligning the notch / orientation flat of the wafer can be realized.

[0044]

As described above, according to the first and second aspects of the present invention, since the first and second guide means are provided, the two different sizes can be used without replacing the guide means. Centering of different types of wafers,
Contamination due to particles in the exchange chamber can be prevented, and the operating time of the apparatus can be increased.

According to the third aspect of the present invention, since the cylinder is a roller, a smooth operation can be obtained when the wafer is centered. According to the fourth aspect of the present invention, the detecting means for detecting the notch / ori-fla of the wafer is provided corresponding to the two kinds of wafers having the different sizes. Centering of two types of wafers can be performed, contamination by particles in the exchange chamber can be prevented, and the operating time of the apparatus can be increased.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating an overall configuration of a wafer alignment device according to a first embodiment.

FIGS. 2A and 2B are enlarged views of a plate portion in FIG. 1, wherein FIG. 2A is a top view and FIG. 2B is a left side view of FIG.

FIG. 3 is a sectional view of a roller in FIG. 2;

FIG. 4 is a diagram illustrating the operation of FIG.

FIG. 5 is a diagram illustrating an overall configuration of a wafer alignment device according to a second embodiment.

FIG. 6 is an enlarged view of a plate portion in FIG.

FIG. 7 is a diagram illustrating the operation of FIG.

FIG. 8 is a diagram illustrating a conventional wafer alignment apparatus.

[Explanation of symbols]

 103 Wafer 105,105 'Plate 107,107' Arc surface 109,109 'First guide means 111,111' Roller 113,113 'Second guide means

Claims (4)

[Claims] 1. A wafer alignment apparatus for centering two types of wafers having different sizes and for positioning a notch / orientation flat of a wafer, wherein the wafer alignment apparatus is arranged so as to sandwich the wafer and is substantially perpendicular to the wafer insertion direction. A pair of plates movable in a direction orthogonal to each other, first guide means provided on each plate and having an arcuate surface capable of contacting a side surface of a small wafer, and a side surface of a large wafer provided on each plate And a second guide means comprising a plurality of cylinders which can contact the wafer. 2. A wafer alignment apparatus for centering two types of wafers having different sizes and aligning a notch / orientation flat of the wafer, wherein the wafer alignment apparatus is disposed so as to sandwich the wafer and is substantially perpendicular to the wafer insertion direction. A pair of plates movable in orthogonal directions, a first guide means provided on each plate and comprising a plurality of cylinders capable of contacting the side surface of the small wafer, and a first guide means provided on each plate, 2. A wafer alignment apparatus, comprising: a second guide means comprising a plurality of cylinders which can be brought into contact with a side surface. 3. The wafer alignment apparatus according to claim 1, wherein the column is a roller. 4. The wafer alignment according to claim 1, wherein detection means for detecting the notch / ori-fla of the wafer is provided corresponding to the two kinds of wafers having different sizes. apparatus.