JP2000284260A - Production of liquid crystal device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to suppress the occurrence of the set misalignment of a panel even in the case of the hybrid panel composed of substrates consisting of different materials. SOLUTION: The plastic substrate 11 expands or contracts with respect to its original dimension when the plastic substrate 11 subjected to a heat- treatment is peeled from above a supporting member 30. The pattern dimension AG×BG of an inside surface structure forming part 12z set on the inside surface of the glass substrate 12 is, thereupon, previously formed smaller than the pattern dimension AP×BP of the inside surface structure forming part 11z formed on the inside surface of the plastic substrate 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a liquid crystal device, and more particularly to a manufacturing technique for manufacturing a liquid crystal panel.

[0002]

2. Description of the Related Art In general, a liquid crystal panel forms a liquid crystal cell by bonding two substrates with a sealing material, injects liquid crystal into the inside of the liquid crystal cell through an opening of the sealing material, and seals the opening with a sealing material. Formed by sealing.
A plurality of transparent electrodes made of ITO or the like are formed on the inner surfaces of the two substrates, respectively, and electrode wires connected to the transparent electrodes are gathered at the outer edge of the substrates to form an external terminal group. In many cases, of the two substrates, the other substrate is formed so as to be planarly larger than the one substrate, and is formed on the overhanging area of the other substrate that protrudes outside the plate surface of the one substrate. An external terminal group in which a number of external terminals are arranged is formed. The end of the flexible wiring board may be crimped to the external terminal group, or a driver IC or the like may be directly mounted on the external terminal group.

In recent years, since the size and weight of portable devices have been remarkably reduced, the demand for thinner liquid crystal panels has been increasing. For this reason, it is necessary to make the substrate constituting the liquid crystal panel thinner. However, when the substrate is made thinner, the substrate is more likely to be damaged, and the flexibility causes bending, so that it is difficult to handle the substrate in the manufacturing process.
As the above substrate, a glass substrate having a thickness of about 1 mm is generally used. However, the thickness has been reduced to about 0.7 mm. Become. On the other hand, a plastic substrate made of a laminated resin sheet or the like is used in some cases. A plastic substrate is a very promising material because it can be made thinner and the substrate itself is not easily damaged, but it is difficult to bend due to its high flexibility, and the cost of the substrate is higher than that of a glass substrate. It is.

Accordingly, a method has been proposed in which a manufacturing process is flowed in a state where a thin glass substrate or a plastic substrate is partially adhered to the surface of a support member made of a thick glass plate or the like. In this method, since the substrate is bonded to the support member, various processes can be performed without breaking the substrate or bending the substrate.

[0005]

Although the glass substrate and the plastic substrate have advantages and disadvantages as described above, a glass substrate is used as one substrate of the liquid crystal panel in order to make use of the characteristics of both. It is conceivable to form a hybrid panel using a plastic substrate as the other substrate. In this case, the rigidity of the liquid crystal panel can be secured by the glass substrate, and the overall thickness of the liquid crystal panel can be reduced by using the plastic substrate.

However, in a hybrid panel, there is a difference in the coefficient of thermal expansion between a glass substrate and a plastic substrate. When two mother substrates are bonded to each other, there is a problem that the electrode pattern regions formed on the inner surfaces of both substrates are shifted from each other, that is, a so-called misalignment occurs.

Particularly, when the plastic substrate is bonded to the above-mentioned support member to form an electrode pattern or the like on the inner surface, and then the plastic substrate is peeled off from the support member, the plastic substrate is supported. A large dimensional change occurs in the plastic substrate due to thermal deformation of the adhesive tape to be adhered on the member, and the liquid crystal cell is likely to be displaced. Further, in the above-described hybrid panel, since the bonding strength between the plastic substrate and the sealant is relatively weak, when the plastic substrate is bonded to the support member and bonded to the glass substrate to form a liquid crystal cell. Then, when the plastic substrate shrinks when the plastic substrate and the support member are separated from each other, the adhesiveness with the sealant is lost, bubbles are mixed in the cell, and disconnection of the electrode pattern or the like occurs. Alternatively, there is a problem that the uniformity of the cell gap is reduced and color unevenness occurs.

Accordingly, the present invention is to solve the above-mentioned problem, and an object of the present invention is to provide a liquid crystal device capable of suppressing the occurrence of panel misalignment even in a hybrid panel or the like composed of substrates of different materials. It is to provide a manufacturing method.

[0009]

In order to solve the above-mentioned problems, a method of manufacturing a liquid crystal device according to the present invention is directed to a liquid crystal device in which a liquid crystal is sealed between a pair of substrates, one of which has a different thermal expansion ratio from the other. A method for manufacturing a liquid crystal device for manufacturing a device,
One of the substrates and the other substrate each constitute a pair of laminate units separately adhered to the surface of the support member via an adhesive layer, and in each of the pair of laminate units, one of the substrates is formed. In a method for manufacturing a liquid crystal device having an electrode forming step of forming an electrode pattern and a heat treatment step with respect to a substrate and the other substrate, the heat of the other substrate of the substrate generated after the heat treatment step in the electrode formation step The electrode pattern is formed on the one substrate in a size obtained by adding a correction to a normal size in consideration of a deformation amount.

[0010] According to the present invention, the electrode pattern is formed on the one substrate in a size obtained by correcting the normal size on the one substrate in consideration of the amount of thermal deformation of the other substrate generated after the heat treatment step. Thereby, even if the two substrates expand and contract to different degrees after the heat treatment process, the difference in expansion and contraction in the planar direction between the two substrates can be compensated, so that the pattern shape of the inner surface structure is less likely to shift. Therefore, the displacement of the liquid crystal device can be reduced, the yield of the liquid crystal device can be improved, and the occurrence of color unevenness can be suppressed.

Further, the method for manufacturing a liquid crystal device according to the present invention comprises:
A method of manufacturing a liquid crystal device for manufacturing a liquid crystal device in which liquid crystal is sealed between a pair of substrates having different thermal expansion and contraction rates from one another, wherein one of the substrates and the other A pair of laminate units each of which is separately adhered to the surface of a support member via an adhesive layer is formed, and in each of the pair of laminate units, an electrode pattern is formed on one of the substrates and the other substrate. In the method of manufacturing a liquid crystal device having an electrode forming step and a heat treatment step, the electrode pattern is formed on the one substrate based on the thermal expansion and contraction rate of the other substrate with respect to a regular size. It is characterized in that it is formed with a dimension corrected by the correction.

According to the invention, in the electrode forming step, the electrode pattern is formed on the one substrate in a size obtained by correcting a normal size on the one substrate based on the thermal expansion and contraction rate of the other substrate. Even if the two substrates expand and contract to different extents after the heat treatment step, the difference in expansion and contraction in the planar direction between the two substrates can be compensated, so that the pattern shape of the inner surface structure is less likely to shift. In addition, misalignment of the liquid crystal device can be reduced, the yield of the liquid crystal device can be improved, and the occurrence of color unevenness can be suppressed.

Further, the method for manufacturing a liquid crystal device according to the present invention comprises:
A method of manufacturing a liquid crystal device for manufacturing a liquid crystal device in which liquid crystal is sealed between a pair of substrates having different thermal expansion and contraction rates from one another, wherein one of the substrates and the other A pair of laminate units each of which is separately adhered to the surface of a support member via an adhesive layer is formed, and in each of the pair of laminate units, an electrode pattern is formed on one of the substrates and the other substrate. In the method of manufacturing a liquid crystal device having an electrode forming step of forming a substrate and a heat treatment step, in the electrode forming step, the dimension of the electrode pattern of the one substrate is reduced by the thermal expansion and contraction between the one substrate and the other substrate. It is characterized in that it is formed with a length corresponding to a dimensional change of the substrate due to a difference in rate.

According to the invention, in the electrode forming step, the dimension of the electrode pattern on the one substrate is adjusted to a dimensional change of the substrate due to a difference in the thermal expansion and contraction rate between the one substrate and the other substrate. By forming with a length that is
Even if the two substrates expand and contract to different extents after the heat treatment step, the difference in the expansion and contraction in the planar direction between the two substrates can be compensated, so that the pattern shape of the inner surface structure is less likely to shift, The misalignment of the liquid crystal device can be reduced, the yield of the liquid crystal device can be improved, and the occurrence of color unevenness can be suppressed.

In each of the above inventions, the one substrate and the other substrate each have a size capable of forming an electrode pattern for a plurality of liquid crystal panels, and a plurality of liquid crystal panels are formed in the electrode forming step of the one substrate. Correction from the normal size may be added to the interval between the minute electrode patterns.

In each of the above inventions, the electrode forming step is performed using a photolithography method including an exposure process through a mask pattern, and the correction for the electrode pattern is performed by adjusting an exposure position in the exposure process. is there.

In each of the above inventions, the heat treatment step may include an alignment film firing step, and the correction of the electrode pattern may be performed in consideration of at least deformation of the other substrate after the alignment film firing step.

In each of the above inventions, each of the substrates has a rectangular planar shape, and the difference in thermal expansion and contraction is calculated for each of two directions along two sets of opposing sides of the substrate, and each of the two directions is calculated. Preferably, the electrode pattern is corrected on the one substrate to a regular size so as to compensate for the thermal expansion difference.

According to the present invention, when a substrate having a rectangular planar shape is used, the difference in expansion and contraction is compensated for in each of two directions, particularly along two sets of opposing sides. It is possible to compensate for a large difference in expansion and contraction. A rectangular substrate is commonly used in a manufacturing process of a liquid crystal device, and when manufacturing a liquid crystal device using such a substrate,
When viewed in two directions along the two opposite sides, it has been confirmed that the expansion ratios are different from each other. Although the cause is not always clear, it seems to be due to the fact that the two sets of opposing sides have different lengths from each other, and the presence of directionality in the pattern shape of the internal structure formed on the substrate. .

In each of the above inventions, it is preferable that one of the substrates is a glass substrate and the other substrate is a plastic film substrate.

According to the present invention, the glass substrate has high rigidity but is brittle, and is easily broken when it is thin. On the other hand, the plastic substrate is flexible and hard to be broken, so that it can be thinned and easily deformed. By forming a liquid crystal device by bonding a glass substrate and a plastic substrate, rigidity can be ensured by the glass substrate and thinning can be achieved by the plastic substrate. In this case, deformation of the plastic substrate due to the flexibility is a problem. However, by adhering to the support member as described above, the plastic substrate can be made to flow reliably in the manufacturing process. When the alignment is performed, the cell structure can be formed with higher precision. In the case where a glass substrate and a plastic substrate are used as described above, the above-described means is particularly effective because a difference in expansion and contraction due to heat treatment by the substrate material easily occurs between the two substrates.

In each of the above inventions, a plurality of electrodes and a plurality of parallel electrode wirings connected to the electrodes are formed on the inner surface of the substrate, and are arranged so as to overlap each other in a plane. A terminal portion of the electrode wiring on one side of the substrate and an inner connection portion of an external terminal on the other side of the substrate are configured to be conductively connected via a vertical conductor, and the terminal portion and the inner connection portion According to the present invention, it is desirable to form one of the two electrodes wider than the other, in order to electrically connect one of the electrodes of the substrate to the external terminals included in the external terminal group formed on the other of the substrate. When configured so that one terminal portion of the substrate and the other inside connection portion of the substrate are conductively connected via, by forming one of the terminal portion and the inside connection portion to be wider than the other,
Even if the difference in expansion and contraction occurs between the substrates, it is possible to prevent a decrease in the contact area while suppressing the possibility of a short circuit to an adjacent portion, and to perform reliable vertical conduction.

[0023]

[First Embodiment] Next, a first embodiment according to the present invention will be described. FIG. 1 shows that the plastic substrate 11 is supported by the support member 3 via the adhesive sheet 20.
FIG. 2 is a schematic perspective view schematically showing a state where it is adhered to a “0”. The plastic substrate 11 is a mother substrate set so that a large number of electrode pattern regions 11x are arranged.
It is adhered on a flat surface of a support member 30 having high rigidity such as a glass plate.

The adhesive sheet 20 is a so-called double-sided tape having an adhesive layer on both sides, and is formed by forming an adhesive layer on the front and back of a base material made of a polyester film or the like. In consideration of the subsequent peeling operation, it is preferable to use an adhesive sheet 20 having a property of reducing the adhesive strength by various post-treatments such as irradiation with active energy rays such as ultraviolet rays and electron beams and heating. In particular, it is desirable to use a heat-peelable pressure-sensitive adhesive, which is formed on the illustrated surface side of the base material and adheres to the plastic substrate 11 so that the resin foams by heat treatment and loses its adhesive strength. . Since this kind of adhesive has an extremely low adhesive strength of 0.1 N / 20 mm or less due to heating, even when the substrate is peeled off from the support member used for transport after the substrate bonding step described later, the adhesive is applied to the liquid crystal cell at the time of peeling. This is because there is little danger of applying a large stress, and the possibility that the liquid crystal cell is damaged or deformed can be reduced. As an example of this type of pressure-sensitive adhesive, there is a heat-releasable sheet “Riba Alpha” (trade name, manufactured by Nitto Denko Corporation).

Various materials including a synthetic resin can be used for the plastic substrate 11, but in particular, at least one
It is preferable that the layer has at least one air-permeable layer and at least one crosslinked resin cured material layer. Examples of the air-permeable layer include resin layers of vinyl alcohol-based resin (particularly, ethylene-vinyl alcohol copolymer), acrylonitrile-based resin, vinylidene chloride-based resin, polyamide-based resin, and SiO ₂ , SiO _x (1 <x < 2), Al ₂ O ₃ ,
Fe ₂ O ₃ , MgCO ₃ , CeO ₂ , ZnO, Ti
O ₂ , ZrO ₂ , ITO, BaTiO ₃ , LiNb
A transparent inorganic material layer such as O ₃ , KTaO ₃ , PbO, calcium aluminate, glass, or a mixture thereof may be used.

As the crosslinked resin cured material layer, there are heat-curable resins such as phenoxy ether type crosslinkable resin, epoxy resin, acrylic resin, acrylic epoxy resin, melamine resin, phenol resin and urethane resin. Phenoxy ether type crosslinkable resins are important. In this case, it is desirable to add a crosslinking agent capable of reacting with active hydrogen such as an isocyanate group, a carboxyl group, and a mercapto group. There is also an active energy ray-curable resin as the crosslinked resin cured material layer. For example, as the ultraviolet-curable resin, a photopolymerizable prepolymer and / or a monomer may be added, if necessary, to another monofunctional or polyfunctional resin. Monomer, various polymers, photopolymerization initiator (acetophenones,
A resin composition containing benzophenones, Michler's ketone, benzyl, benzoin, benzoin ether, benzyl ketals, thioxanthones, and the like, and a sensitizer (amines, diethylaminoethyl methacrylate, and the like) is used. Examples thereof include polyester acrylate, polyester urethane acrylate, epoxy acrylate, and polyol acrylate.

FIG. 5 shows a schematic manufacturing process in this embodiment. As described above, the plastic substrate 1 is bonded to the support member 30 shown in FIG.
Various processes are performed on 1. A conductive layer such as a transparent conductive film made of ITO or the like is formed on the surface of the plastic substrate 11, and the conductive layer is patterned to form an electrode (eg, generally one of a segment electrode and a common electrode, or a pixel electrode, a counter electrode, etc.). Electrode forming step for forming an alignment film, forming an alignment film such as a polyimide resin after baking after forming a resin on the electrode, and alignment processing for performing a rubbing process or the like on the alignment film. Process. These steps are all steps for forming an inner surface structure on the inner surface of the plastic substrate 11.

When the heat-resistant temperature of the adhesive sheet 20 is equal to or lower than the formation temperature of the (transparent) conductive layer for forming the electrode, the plastic substrate 11 is not bonded to the support member 30. Plastic substrate 1
A conductive layer is formed on the surface of the substrate;

Also on the glass substrate 12 (not shown), a step of forming an inner surface structure such as an electrode and an alignment film is performed in the same manner as described above. 0.7 to 0.7
When glass having a thickness of about 1.2 mm is used, it is not necessary to adhere to the support member 30 and the glass can be flowed in the same manner as in a normal manufacturing process.

Next, the plastic substrate 11 may be peeled off from the support member 30 after the above steps are completed, but the process may proceed to the next step as it is. Here, a case will be described where the process proceeds to the next step in a state where the plastic substrate is directly adhered to the support member.

As described above, an electrode made of a transparent conductor or the like and an alignment film or an insulating film are formed, and are formed at predetermined positions on the inner surface of the glass substrate 12 which has been subjected to the alignment treatment so as to surround a predetermined region. The sealing material to be used is arranged, and the spacers are sprayed. Then, as shown in FIG. 5B, the surface of the plastic substrate 11 on the support member 30 is opposed to the inner surface of the glass substrate 12. Then, both boards are connected to camera 3
The plastic substrate 11 and the glass substrate 12 are bonded to each other via a sealing material by positioning them by positioning means including the components 1 and 32 and a mechanism (not shown). here,
FIG. 5C shows the plastic substrate 11 in the present embodiment.
2 shows a state in which both substrates are overlapped in a bonding step of the glass substrate 12 and the glass substrate 12. At least two positioning marks 11y and 12y are formed in advance on both mother boards, respectively, and the positioning marks 11y and 12y are superimposed while observing them with the cameras 31 and 32 so that the relative positioning of the two boards is performed. I do. After that, the sealing material is cured by heat treatment, light irradiation, or the like to complete the liquid crystal cell, and then the plastic substrate 11 is separated from the support member 30.

Of course, the above manufacturing process is merely an example of the present invention, and the step of peeling the plastic substrate 11 from the support member 30 is performed after the inner surface structure is formed, and the plastic substrate 11 is bonded to the glass substrate 12. You may go before.

Next, as is well known, the plastic substrate 1
1 is removed, liquid crystal is injected into the liquid crystal cell from the opening of the sealing material, the opening of the sealing material is sealed, and each electrode pattern region is individually cut and separated as shown in FIG. And the liquid crystal panel 10 shown in FIG. 3 is formed. The liquid crystal panel 10 shown in FIG. 2 and FIG. 3 shows a state after being separated from the mother substrate and before attaching a polarizing plate or the like. Is completed, and before separating the electrode pattern regions, a large-sized plastic substrate 11 and a large-sized glass substrate 12 are bonded to each other as shown by a chain line in FIG.

In this liquid crystal panel 10, a panel substrate 11 ′ having a plastic substrate 11 as one substrate and a panel substrate 12 ′ having a glass substrate 12 as the other substrate are adhered to each other by a sealing material 13. Liquid crystal is injected between the substrates in a region surrounded by the sealing material 13 (liquid crystal sealing region 10A). An electrode 14 and an alignment film 16 are stacked on the inner surface (opposing surface) of the panel substrate 11 ',
The electrode 15 and the alignment film 17 are stacked on the inner surface (opposing surface) of the panel substrate 12 '. The electrode 14 of the panel substrate 11 ′ is led out as an electrode wiring from the liquid crystal enclosing area 10 A to the bonding portion of the sealing material 13 or through the bonding portion to the outside, and a terminal portion described later is provided at a tip portion thereof. .

The panel substrate 12 'has a panel area larger than the panel substrate 11', and has an extended area 12'a which extends outside the plate surface (outer shape) of the panel substrate 11 '. An external terminal group 19 composed of a plurality of external terminals connected to the electrode wiring is formed on the surface of the overhang region 12'a of the panel substrate 12 '. The electrodes 15 of the panel substrate 12 ′ are also led out of the liquid crystal sealing region as electrode wirings through the adhesive portion of the sealing material 13, and their leading ends are directly connected to the external terminals of the external terminal group 19.

The terminal portion of the electrode wiring connected to the electrode 14 of the panel substrate 11 ′ is arranged so as to planarly overlap with an inner connecting portion, which will be described later, of some of the external terminals in the external terminal group 19. The terminal portion and the inside connection portion of the external terminal are conductively connected to each other via a vertical conductor 130 formed of a conductive paste, an anisotropic conductive film, or the like.

In the embodiment described above, FIG.
As shown in (a), the electrode and the insulation are formed in an inner surface structure (electrode pattern) forming portion 11z in which electrode pattern regions 11x corresponding to the liquid crystal panel set on the inner surface of the plastic substrate 11 on the support member 30 are arranged. A film, an electrode wiring, an alignment film and the like are sequentially formed in a predetermined pattern shape. On the other hand, also on the inner surface of the glass substrate 12,
Electrodes, insulating films, electrode wiring, alignment films and the like are sequentially formed in a predetermined pattern shape in the inner surface structure forming portion 12z in which a large number of electrode pattern regions 12x are arranged.

These electrode pattern areas 11x, 12x
Represents one liquid crystal panel 10 as shown by a dashed line in FIG.
Each region refers to a region of the mother substrates 11, 12 in which the electrodes 14, 15 formed on the inner surface of each of the panel substrates 11 ', 12' and the wiring structure pattern are formed. Therefore, one liquid crystal panel corresponds to one electrode pattern region. In the inner surface structure forming portions 11z and 12z of the plastic substrate 11 and the glass substrate 12, which are the mother substrates, the electrode 1 is located between the electrode pattern regions 11x and 12x.
There are gaps 4 and 15 and intervals where no wiring is formed. The electrode pattern region is defined for convenience in the following description.

In the above-described manufacturing process, the plastic substrate 1 may be used for forming a transparent electrode or firing an alignment film.
1 may be heated to, for example, about 100 to 150 ° C. For example, the alignment film 16 is formed on the surface of the electrode 14 on the plastic substrate 11 in a state where the alignment film 16 is bonded to the support member 30. The firing temperature and the firing time of the alignment film 16 are, for example, about 120 ° C. and 2 hours. Similarly, the counter electrode 15 and the alignment film 17 are similarly formed on the other substrate, the glass substrate 12, and the alignment film 17 is also baked on the glass substrate 12. Thereafter, when the plastic substrate 11 is separated from the support member 30, the plastic substrate 11 that has been heated at the time of firing the alignment film 16 loses the support of the support member 30 and contracts. Note that the above description relates to the heat treatment step at the time of firing the alignment film. Similarly, when the electrode 14 is formed by a transparent conductor on the support member 30, the plastic substrate is also formed at the time of this film formation. 11 is heated. Transparent conductors such as ITO (indium tin oxide) are formed by vapor deposition or sputtering, but generally the resistance does not decrease sufficiently unless heated to about 100 to 150 ° C.

As described above, although depending on the material of the plastic substrate 11, the plastic substrate 1 is usually heated.
1 shrinks to some extent, while the glass substrate 12 hardly shrinks by heating, so that the inner surface structure pattern formed on the inner surface of the plastic substrate 11 and the inner surface pattern formed on the inner surface of the glass substrate 12 There is a possibility that pattern misalignment may occur with the inner surface structure pattern that has been set. In this embodiment, in particular, the plastic substrate 11 is
Since the adhesive layer of the adhesive sheet 20 shown in FIG. 1 is subjected to a heat treatment in a state where it is adhered, the adhesive layer of the adhesive sheet 20 shown in FIG. For this reason, when the plastic substrate 11 that has undergone the heat treatment is peeled off from the support member 30, the plastic substrate 11 expands and contracts to its original size (regular size).

Therefore, in this embodiment, the pattern dimension AG × BG of the inner surface structure forming portion 12z set on the inner surface of the glass substrate 12 is formed on the inner surface by correcting in advance in consideration of the heat shrinkage of the plastic substrate 11. It is previously formed smaller than the pattern dimension AP × BP of the inner surface structure forming portion 11z to be formed. In this case, the inner surface structure forming portion 12z has a pattern dimension at the time of the initial design, that is, a regular dimension.
May be reduced, and conversely, the inner surface structure forming portion 11z may be formed larger. Further, only one of the inner surface structure forming portions 11z and 12z may be changed in size, or both may be changed in size.

In particular, the pattern dimensions AG × BG and AP × B
Regarding the relationship with P, for example, when the inner surface structure forming portion 11z of the plastic substrate 11 and the inner surface structure forming portion 12z of the glass substrate 12 have the same dimensions before the manufacturing process, a heat treatment or the like is performed. A large number of dimensional differences due to thermal shrinkage of both structural parts after manufacturing are measured, and a standard expansion / shrinkage ratio P = (AG−AP) / AG in the drawing is calculated from a standard value of the degree of shrinkage calculated by statistical processing of the measurement data group. And the expansion / contraction ratio T = (BG−BP) / BG in the illustrated horizontal direction are separately obtained. Based on the statistical standard obtained in this way,
The inner surface structure forming portion 12z of the glass substrate 12 before the manufacturing process is separately (1-P) times and (1-P) in the vertical direction and the horizontal direction.
T) Set the dimensions at the multiplied magnification. This makes it possible to compensate for a difference in expansion and contraction caused by heat between the plastic substrate 11 and the glass substrate 12, and to reduce misalignment of the liquid crystal panel due to shrinkage of the plastic substrate 11 after being separated from the support member 30.

In particular, as described above, when a rectangular substrate is used, the degree of expansion and contraction in the vertical direction and the horizontal direction are obtained, and the pattern dimensions are adjusted separately in the vertical and horizontal directions. The product failure or performance degradation due to the above can be further reduced.

In this embodiment, since the expansion and contraction of the glass substrate 12 due to heat can be generally ignored, the plastic substrate 1
1 itself stretch degree P ₀ = (1−AP ₁ ) / AP ₀ (AP ₀
The dimensions of the plastic substrate prior to the manufacturing process, the dimensions of the plastic substrate after AP ₁ manufacturing process) and T _{0 =} (1-B
Only based on P ₁ ) / BP ₀ (BP ₀ is the size of the plastic substrate before the manufacturing process, BP ₁ is the size of the plastic substrate after the manufacturing process), the pattern size of the inner surface structure forming portion 11z and / or the inner surface structure formation The compensation is performed by changing the pattern size of the portion 12z. For example, when only the inner surface structure forming portion 12z is changed, the original pattern size is changed to (1-P
_The internal structure is formed to have a size multiplied by ( ₀ ) times and (1-T ₀ ) to compensate for shrinkage of the plastic substrate 11.

The present inventor has shown that the length in the illustrated vertical direction is about 2
00mm, horizontal length about 300mm, thickness 0.1
The large-sized plastic substrate 11 having a length of about 20 mm is adhered on a supporting member 30 made of a glass plate having a length of about 220 mm in the vertical direction in the figure and a length of about 336 mm in the horizontal direction via an adhesive sheet, and is oriented on the inner surface thereof. After performing a part of the manufacturing process including a heat treatment process (firing process) for forming a film, the film was separated from the support member 30 before being bonded to the glass substrate 12.
The firing temperature and firing time are the same as those described above at 120 ° C. for 2 hours. At this time, the plastic substrate 11 shrinks from the beginning, and the shrinkage ratio usually fluctuates in a range of about 0.03 to 0.05% in the vertical direction in the drawing. on the other hand,
In the illustrated lateral direction, the variation usually ranges from about 0.05 to 0.07%. A serious misalignment actually occurs when the plastic substrate 11 shrinks by 0.1% or more. However, even if the plastic substrate 11 shrinks within the above range, the plastic substrate 11 remains adhered to the support member 30. Glass substrate 12
After the plastic substrate 11 is peeled off from the support member 30 after being bonded to the
, The adhesiveness to the sealing material 13 may be partially lost, so that bubbles may be mixed into the cells after the liquid crystal is sealed, or the thickness of the cells may vary, resulting in color unevenness.

In this embodiment, the plastic substrate 1 is determined based on a statistical standard value of the variation, that is, an average value, a median value, or the like, in consideration of the above-described variation range of the shrinkage ratio.
A contraction of 1 was compensated. For example, the pattern size of the inner surface structure forming portion 12z on the glass substrate 12 is reduced by 0.04% in the vertical direction in the drawing and 0.06% in the horizontal direction in the drawing to form the glass substrate 12. Substrate 1
1 to form a liquid crystal cell. By this method, the color unevenness occurrence rate and the cell failure occurrence rate of the completed liquid crystal panel were greatly reduced.

In the present embodiment, as shown in FIG. 6, in a liquid crystal panel constituted by separating each electrode pattern region after bonding the plastic substrate 11 and the glass substrate 12, the electrodes 14 on the panel substrate 11 ' The terminal portion 14b formed at the tip of the extracted electrode wiring 14a is
The inside connection portion 192 of the external terminal 192 in the external terminal group 19 formed on the overhang region 12'a of the panel substrate 12 '
a and a vertical conductor 130
Are conductively connected. Also, the electrode 1 of the panel substrate 11 ′
The electrode wiring 15a drawn out of 5 is connected to the external terminal 191.

Here, the terminal portion 14b is formed wider than the opposing inner connection portion 192a. For this reason, even if there is a difference in the degree of expansion and contraction caused by the heat treatment between the panel substrate 11 'which is a part of the plastic substrate 11 and the panel substrate 12' which is a part of the glass substrate 12, the terminal portion 1
It is possible to suppress a decrease in the conductive area due to a positional shift between the inner connection portion 192a and the inner connection portion 192a in the planar direction. In addition,
Conversely, the inner connection portion 192a may be formed wider than the width of the terminal portion 14b. By forming the terminal portion and the inner connection portion to have different widths as described above, even if a difference in expansion and contraction occurs between the substrates, the conductive area can be kept constant while suppressing the risk of a short circuit to an adjacent portion. By holding, vertical conduction can be reliably performed.

[Second Embodiment] Next, a second embodiment of the present invention will be described with reference to FIG. In this embodiment, since the configuration of the liquid crystal panel 10 and the configurations of the plastic substrate 11 and the glass substrate 12 which are the mother substrates are all the same as those of the above-described first embodiment, the same portions are denoted by the same reference numerals. The description is omitted. In this embodiment, the inner surface structure forming unit 12 set on the inner surface of the glass substrate 12
The pattern interval AG of each electrode pattern region 12x in z
S and BGS are previously corrected in consideration of the thermal shrinkage of the plastic substrate 11 and are made smaller in advance with respect to the pattern intervals APS and BPS of the electrode pattern regions 11x in the inner surface structure forming portion 11z formed on the inner surface. deep. In this case, with respect to the pattern interval at the time of the initial design,
The pattern interval of the inner surface structure forming portion 12z may be made smaller than the regular size for the interval, or the pattern interval of the inner surface structure forming portion 11z may be made larger.
Further, only one of the inner surface structure forming portions 11z and 12z may be changed in size, or both may be changed in size.

In particular, the pattern intervals AGS, BGS and AP
Regarding the relationship with S and BPS, for example,
Using the expansion and contraction ratios P and S in the vertical and horizontal dimensions of the inner surface structure forming portions 11z and 12z described in the embodiment,
The size of the space in the inner surface structure forming portion 12z may be set at a magnification of (1-P) times and (1-T) times separately for the space between the vertical and horizontal electrode pattern regions 11x and 12x.

As another method for setting the distance between the electrode pattern areas 11x and 12x, the degree of expansion / contraction of the distance between the electrode pattern areas is measured, and the distance between the electrode pattern areas is determined based on the measured value or a statistical standard value. The dimensions may be set. That is, the distance between the electrode pattern regions 11x in the inner structure forming portion 11z of the plastic substrate 11 and the inner structure forming portion 1 of the glass substrate 12 before the manufacturing process.
If the distance between the electrode pattern regions 12x in 2z is the same size, a large number of distance differences due to heat shrinkage of both structural parts after the heat treatment or the like are measured, and the statistics of the measurement data group are measured. From the standard value of the degree of contraction calculated by the dynamic processing, the expansion ratio PS = (AGS-A)
PS) / AGS, and the expansion / contraction ratio TS in the horizontal direction in the figure.
(BGS-BPS) / BGS are separately obtained. Based on the statistical standard values thus obtained, the intervals AGS and BGS of the respective electrode pattern regions 12x in the inner surface structure forming portion 12z of the glass substrate 12 before the manufacturing process are separately set in the vertical direction and the horizontal direction. The dimensions are set at a magnification of (1-PS) times and (1-TS) times. This makes it possible to compensate for a difference in expansion and contraction caused by heat between the plastic substrate 11 and the glass substrate 12, and to reduce misalignment of the liquid crystal panel due to shrinkage of the plastic substrate 11 after being separated from the support member 30.

In particular, as described above, when a rectangular substrate is used, the electrode pattern regions 11x, 1
By obtaining the degree of expansion and contraction at intervals of 2 × and adjusting the pattern dimensions separately in the vertical and horizontal directions in advance, it is possible to further reduce product defects or performance degradation due to pattern deviation as described later.

In the case of this embodiment, since the expansion and contraction of the glass substrate 12 due to heat can be usually ignored, the plastic substrate 1
The degree of expansion P ₀ of the interval between the electrode pattern regions 11x of the device 1 itself.
= (1−APS ₁ ) / APS ₀ (APS ₀ is the illustrated vertical distance of the electrode pattern region 11x on the plastic substrate before the manufacturing process, and APS ₁ is the illustrated vertical direction of the electrode pattern region 11x on the plastic substrate after the manufacturing process. Interval) and TS ₀ = (1−BPS ₁ ) / BPS ₀ (BP
S ₀ is the horizontal space between the electrode pattern regions 11 x on the plastic substrate before the manufacturing process, and BPS ₁ is the electrode pattern region 11 on the plastic substrate after the manufacturing process.
x only in the illustrated horizontal direction) and the pattern interval of the electrode pattern region 11x of the inner surface structure forming portion 11z and / or the electrode pattern region 12x of the inner surface structure forming portion 12z.
Is compensated by changing the pattern interval. For example, when only the inner surface structure forming portion 12z is changed, the internal structure is formed to have dimensions that are (1-PS ₀ ) times and (1-TS ₀ ) times the original pattern interval, respectively, to prevent shrinkage of the plastic substrate 11. Make compensation.

In each of the above embodiments, the liquid crystal panel 1
Although an example was described in which one of the substrates constituting the glass substrate 0 was a glass substrate and the other was a plastic substrate, the present invention is not limited to such a case, and a pair of substrates constituting a liquid crystal panel is As long as they have mutually different thermal expansion and contraction rates, the same effects as above can be obtained.

[0055]

As described above, according to the present invention, the inner surfaces of the two substrates are previously adjusted so as to compensate for the difference in expansion and contraction in the planar direction between the two substrates due to the processing during the manufacturing process. By correcting at least one of the formed electrode patterns, even if two substrates made of different materials expand and contract to different degrees during the manufacturing process, the electrode pattern shape of the inner surface structure is less likely to shift. Therefore, misalignment of the liquid crystal device can be reduced, the yield of the liquid crystal device can be improved, and the occurrence of color unevenness can be suppressed.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view showing a support structure of a plastic substrate used in a first embodiment of a method for manufacturing a liquid crystal device according to the present invention.

FIG. 2 is a schematic cross-sectional view illustrating a schematic structure of a liquid crystal panel manufactured according to the first embodiment.

FIG. 3 is a schematic plan view showing a schematic structure of a liquid crystal panel manufactured according to the first embodiment.

FIG. 4 is a schematic plan view (a) of a plastic substrate and a schematic plan view (b) of a glass substrate in the first embodiment.

FIGS. 5A to 5C are schematic explanatory views illustrating a state in a manufacturing process according to the first embodiment.

FIG. 6 is a partially enlarged plan view of the liquid crystal panel manufactured according to the first embodiment.

FIG. 7 is a schematic plan view (a) of a plastic substrate and a schematic plan view (b) of a glass substrate in a second embodiment of the method for manufacturing a liquid crystal device according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Liquid crystal panel 11 Plastic substrate 11x, 12x Electrode pattern area 11z, 12z Inner-surface structure forming part 11 ', 12' Panel substrate 12 Glass substrate 13 Seal material 14, 15 Electrode 14a Electrode wiring 14b Terminal part 16, 17 Alignment film 19 External terminal Group 130 Upper and lower conductors 191, 192 External terminal 192a Inner connection portion

 ────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yoshiaki Otsuki 3-3-5 Yamato, Suwa City, Nagano Prefecture Seiko Epson Corporation F-term (reference) 2H090 JA06 JA09 JB03 JC02 JC08 JC12 JD11 JD13 JD18 LA01 5G435 AA04 AA17 BB12 EE33 FF00 FF01 HH02 HH12 KK05 LL07

Claims (9)

[Claims] 1. A method for manufacturing a liquid crystal device in which a liquid crystal is sealed between a pair of substrates having different thermal expansion and contraction rates from one another, wherein one of the substrates is provided. And a pair of laminated units separately adhered to the surface of the support member via an adhesive layer, respectively, of the other substrate, and in each of the pair of laminated units, one of the substrates and the other substrate On the other hand, in a method of manufacturing a liquid crystal device having an electrode forming step of forming an electrode pattern and a heat treatment step, in the electrode forming step, the amount of thermal deformation of the other of the substrates that occurs after the heat treatment step is taken into consideration. A method of manufacturing a liquid crystal device, wherein the electrode pattern is formed on the one substrate with a size obtained by correcting a normal size. 2. A liquid crystal device manufacturing method for manufacturing a liquid crystal device in which a liquid crystal is sealed between a pair of substrates, one of which has a different thermal expansion ratio from the other, wherein one of the substrates is provided. And a pair of laminated units separately adhered to the surface of the support member via an adhesive layer, respectively, of the other substrate, and in each of the pair of laminated units, one of the substrates and the other substrate On the other hand, in a method of manufacturing a liquid crystal device having an electrode forming step of forming an electrode pattern and a heat treatment step, the electrode forming step includes forming the electrode pattern on the one substrate based on the thermal expansion and contraction rate of the other substrate. Is formed in a size obtained by adding a correction to a regular size. 3. A liquid crystal device manufacturing method for manufacturing a liquid crystal device in which a liquid crystal is sealed between a pair of substrates, one of which has a different thermal expansion ratio from the other, wherein one of the substrates is one of the substrates. And a pair of laminated units separately adhered to the surface of the support member via an adhesive layer, respectively, of the other substrate, and in each of the pair of laminated units, one of the substrates and the other substrate On the other hand, in a method of manufacturing a liquid crystal device having an electrode forming step of forming an electrode pattern and a heat treatment step, in the electrode forming step, the dimensions of the electrode pattern of the one substrate are changed to the one substrate and the other substrate. Forming a liquid crystal device having a length corresponding to a dimensional change of the substrate due to a difference in the thermal expansion ratio between the substrate and the substrate. 4. The method for manufacturing a liquid crystal device according to claim 1, wherein the one substrate and the other substrate each have a size capable of forming an electrode pattern for a plurality of liquid crystal panels. A method of manufacturing a liquid crystal device, the method comprising: in the electrode forming step of the one substrate, correcting a distance between electrode patterns of a plurality of liquid crystal panels from a regular dimension. 5. The method for manufacturing a liquid crystal device according to claim 1, wherein the electrode forming step is performed by using a photolithography method including an exposure process through a mask pattern. The method of manufacturing a liquid crystal device according to claim 1, wherein the correction of the pattern is performed by adjusting an exposure position in the exposure processing. 6. The method according to claim 1, wherein the heat treatment step includes a step of firing an alignment film, and the correction of the electrode pattern is performed at least after the step of firing the alignment film. A method for manufacturing a liquid crystal device, wherein the method is performed in consideration of deformation of the liquid crystal device. 7. One of claims 1 to 6
In the paragraph, both of the substrates have a rectangular planar shape,
The thermal expansion difference is calculated for each of two directions along two opposing sides of the substrate, and the electrode pattern is normalized on the one substrate so as to compensate for the thermal expansion difference for each of the two directions. A method for manufacturing a liquid crystal device, wherein a dimension is corrected. 8. The liquid crystal device according to claim 1, wherein one of the substrates is a glass substrate, and the other substrate is a plastic film substrate. Method. 9. Any one of claims 1 to 8
In the paragraph, on the inner surface of the substrate, a plurality of electrodes and a plurality of parallel electrode wirings connected to the electrodes are formed, and are arranged so as to overlap each other two-dimensionally. The terminal portion of the electrode wiring and the inside connection portion of the external terminal on the other side of the substrate are configured to be conductively connected via a vertical conductor, and one of the terminal portion and the inside connection portion is connected to the other side. A method for manufacturing a liquid crystal device, wherein a liquid crystal device is also formed to have a wide width.