JP2000281373A - Method for dividing brittle material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for dividing a brittle material, such as glass or ceramics, which is capable of enhancing the yield of work for cracking the material up to 100% when working the material in the method for cracking the brittle material by imparting a heat source thereto by irradiation with a laser, or the like, thereby generating thermal stress therein. SOLUTION: The method for dividing the brittle material by forming a groove 3 on the surface of the brittle material 4 and irradiating the material with the laser beam 5 along the groove 3, thereby dividing the brittle material 4 along the groove 3 consists of a stage for positioning the laser beam 5 in such a manner that the material end 2 constituting the beginning part for the division is irradiated with the laser beam 5, a stage for generating a crack 6 along the groove 3 of the material end 2 by irradiation with the laser beam 5 for a prescribed time in the position and a stage for irradiating the brittle material with the laser beam 5 along the groove 3 from the material end 2 where the crack 6 occurs, thereby dividing the brittle material 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for cutting brittle materials such as glass or ceramics.

[0002]

2. Description of the Related Art FIG. 9 is a view showing a conventional method for dividing a brittle material, which is similar to the method disclosed in Japanese Patent Application Laid-Open No. 54-106524. The method for dividing the brittle material shown in FIG.
Is irradiated to the groove 3 of the planned dividing line in the brittle material 4 with a beam diameter 10 of the division width L or less, a crack 6 is generated by thermal stress generated at the irradiation position, and the laser beam 5 is irradiated in the scanning direction 8 along the groove 3. , The crack 6 is guided in the direction along the groove 3 to divide the material. In addition, the groove 3 is formed by a cutting tool for brittle material having a tip having a super-hardness such as diamond mounted thereon, etching, or the like.

Examples of brittle materials include glass and alumina ceramics, as well as quartz and semiconductor materials. Further, as the laser beam, CO ₂ may be used depending on the material of the processing material.
Laser light, YAG laser light, or the like is appropriately selected.

When the dividing method shown in FIG. 9 is applied to, for example, glass, the direction of cracks at the end of the material cannot be controlled. Therefore, the sectional shape of the dividing is, as shown in FIG. A crack 26 may be formed on the material edge 2 in FIG. For this reason, even if the laser beam irradiation conditions are appropriate,
There is a concern that a work yield of 0% cleavage may not be obtained.

FIG. 11 is a view showing another method of dividing the brittle material, which is similar to that disclosed in Japanese Patent Application Laid-Open No. 7-323385. In the method of dividing the brittle material shown in FIG. 11, a laser beam 5 supplied from a laser light source (not shown) is used to form a dividing line 27 without forming a groove in the brittle material 4.
The hot air from the nozzle 9 is irradiated with a laser beam having a beam diameter 10 smaller than the division width L by a heat source (not shown). At this time, hot air is supplied from the nozzle 9 onto the planned division line 27 to locally heat the planned division line 27, thereby giving a temperature gradient sufficient to induce the crack 6 and
Is scanned in the scanning direction 8 along the planned dividing line 27 to divide the material. As the heat source, hot air, an infrared heater, or a laser beam can be used.

When the dividing method shown in FIG. 11 is applied to, for example, glass, since there is no groove, the control of cracks becomes unstable, and the sectional shape of the dividing is divided along the dividing line 27 as shown in FIG. As a result, cracks 26 may occur at the material end 2 on the dividing surface 3a, and even if the cutting conditions are appropriate, there is a concern that a work yield of 100% cutting may not be obtained.

Further, in the dividing method shown in FIG. 9, in order to continuously obtain a cut material of the brittle material, a plurality of grooves are formed in advance on the entire length or the end of the brittle material, and then irradiated with a laser beam diameter smaller than the division width. Is performed, it is possible to obtain the cutout material continuously. This dividing method is disclosed in Japanese Patent Application Laid-Open No. 60-16349.
1 is similar to that shown in Japanese Patent Publication No. This is a laser beam 5 supplied from a laser light source (not shown).
Is irradiated on the groove 3 of the brittle material, a crack 6 is generated by a thermal stress generated at the irradiation position, and the laser beam 5 is scanned in a scanning direction 8 along the groove 3 so that the crack 6 is formed.
To divide the material.

When the above dividing method is applied to glass, for example, as shown in FIG.
Cracks 6 with cracks also occur in the grooves 3 adjacent to the groove, and the material is divided even in other parts, and even if the cutting conditions are appropriate, there is a concern that a work yield of 100% cutting may not be obtained.

FIG. 14 is a cross-sectional view of the Japanese Patent Application Laid-Open No. 54-106.
This shows a method similar to another division method disclosed in Japanese Patent Application Laid-Open No. 524/524. In the method of dividing the brittle material shown in FIG. 14, when the material is divided at mutually deviated positions 16 on the front surface and the back surface of the workpiece to which the two brittle materials 4 are bonded, laser light supplied from a laser light source (not shown) 5 is radiated to a groove (planned division line) 17 on the surface of the workpiece with a beam diameter smaller than the division width, a crack 6 is generated due to thermal stress generated at the irradiation position, and laser light is applied to the groove (planned division line). ) By scanning in the scanning direction along 17, the crack 6 is formed in a groove (planned dividing line).
Guide in the direction along 17 to split the material.

When the dividing method of FIG. 14 is applied to, for example, glass of a liquid crystal panel having a structure in which two brittle materials are bonded to each other, first, grooves are formed on the front and rear surfaces of all panels, and then laser irradiation is performed. Perform When processing is performed in this order, the groove forming process and the laser irradiation process can be executed independently, and the movement of the panel, which is the workpiece, between the two processes can be simplified, so that the cutting time can be reduced. However, the groove 17 of the surface glass during laser irradiation
The crack 6 is also generated in the groove 19 of the back glass on the opposite side,
Even if the groove 17 can be divided stably,
Since the groove 9 is partially divided, a unique thermal stress distribution is generated in the groove 19, so that the groove 19 cannot be divided along the predetermined dividing line. There is a fear that the work yield cannot be obtained.

FIGS. 15 and 16 show still another method of dividing a brittle material, which is similar to that disclosed in Japanese Patent Application Laid-Open No. Hei 7-328781. The method for dividing the brittle material in FIGS. 15 and 16 does not form a groove in the brittle material 4,
By irradiating the laser beam 5 supplied from a laser light source (not shown) onto at least two points of the dividing line 27 to generate a unique thermal stress distribution in the laser irradiating part, the tensile stress is higher than that of the one-point laser irradiating. To increase. The crack 6 is generated by the tensile stress, and the laser beam 5 is scanned in the scanning direction 8 along the dividing line 27 to guide the crack 6 in the direction along the dividing line 27 to divide the material. Further, the laser irradiation position of the laser beam 5 may be perpendicular to the scanning direction 8 as shown in FIG. 15, or parallel to the scanning direction 8 as shown in FIG.

When the dividing method shown in FIGS. 15 and 16 is applied to, for example, glass, as shown in FIG.
8 is asymmetrical with respect to the planned dividing line 27, the generated thermal stress is also asymmetrical, and the crack direction of the material end 2 of the brittle material 4 cannot be controlled. 29 is the low temperature direction of the temperature distribution 28. For this reason, as shown in FIG. 10, a crack 26 that adversely affects the quality of the material end portion 2 occurs in the divided cross-sectional shape, and even if the laser beam irradiation conditions are appropriate, a work yield of 100% cleavage can be obtained. There is a fear that it cannot be obtained. Further, as the division width of the brittle material becomes narrower, the temperature distribution becomes more asymmetric, and the division cannot be performed stably.

[0013]

SUMMARY OF THE INVENTION The present invention relates to a method for cutting a brittle material such as glass or ceramics by applying a heat source by laser irradiation or the like to generate a thermal stress. 1
It is an object of the present invention to provide a method for dividing a brittle material that can be increased to 00%.

[0014]

According to a first aspect of the present invention, there is provided a method for dividing a brittle material, comprising the steps of: forming a groove on the surface of the brittle material; and irradiating the groove with the laser beam. A method of dividing a brittle material along the brittle material, wherein the step of positioning the laser beam so that the laser beam is applied to at least a material end serving as a division start portion, and applying the laser beam for a predetermined time at the position. Irradiating a crack along the groove at the end of the material and irradiating laser light along the groove from the end of the cracked material to split the brittle material. And

According to a second aspect of the present invention, in the method for dividing a brittle material, at least a region of the brittle material including a division start portion is heated to a temperature higher than a room temperature during laser beam irradiation.

According to a third aspect of the present invention, in the method of dividing a brittle material, a groove is formed on the surface of the brittle material, and the brittle material is divided a plurality of times along the groove. A groove is formed in the line, and the groove is irradiated with laser light. After the first division is completed, a groove is formed in the adjacent second planned division line, and the groove is irradiated with laser light to be divided. And repeating this.

According to a fourth aspect of the present invention, there is provided a method for dividing a brittle material, wherein each brittle material is divided by a predetermined dividing line at a position shifted from each other on a front surface and a back surface of a workpiece to which two brittle materials are bonded. When forming, a groove is formed on the first planned dividing line on one of the front surface and the back surface,
This groove is irradiated with laser light, and after the first division is completed, a groove is formed in the second planned dividing line on the other surface, and the groove is irradiated with laser light to perform division. And

According to a fifth aspect of the present invention, in the method for dividing a brittle material, a groove is formed on a surface of the brittle material, and a first laser beam is irradiated along the groove, thereby forming a groove along the groove. A method for dividing a brittle material, wherein the brittle material is split, wherein a position opposite to an end face of the brittle material with respect to the groove is simultaneously irradiated with a second laser beam.

According to a sixth aspect of the present invention, in the method for dividing a brittle material, a second laser beam having an intensity distribution similar to that of the first laser beam is applied to a distance from the groove to an end face of the brittle material. It irradiates twice the position.

In the first aspect, the step of positioning the laser beam so that the laser beam is irradiated onto at least the material end serving as the division start portion, and irradiating the laser beam at the position for a predetermined time to form the material end The step of generating a crack along the groove and the step of irradiating a laser beam along the groove from the end of the cracked material to divide the material constitutes a cutting operation. Control the crack direction,
Cracks are formed at the edges of the material in the groove direction.

According to a second aspect of the present invention, in the method for dividing a brittle material, the brittle material is destroyed by raising at least a region including a division start portion of the brittle material to a temperature higher than room temperature when irradiating a laser beam. Increase toughness.

According to a third aspect of the present invention, in the case where a groove is formed on the surface of the brittle material and the material is divided a plurality of times along the groove, a groove is formed on the first predetermined dividing line, and the laser beam is formed in the groove. After the first division is completed, a groove is formed on the adjacent second planned division line, and the groove is irradiated with laser light to perform division, and this is repeated to perform laser irradiation. Cracks occur only in the middle groove.

According to a fourth aspect of the present invention, in the case where the material is divided along a predetermined dividing line at a position deviated from the front surface and the back surface of the workpiece to which the two brittle materials are bonded, a first surface is provided on the surface of the workpiece. A groove is formed in the planned dividing line, and the groove is irradiated with a laser beam, and after the first division is completed, on the back surface of the workpiece, at a position displaced from the first planned dividing line on the front surface. A groove is formed in the second predetermined dividing line, and a laser beam is irradiated to the groove to generate a crack on each side.

According to a fifth aspect of the present invention, there is provided a brittle material dividing method in which a groove is formed on a surface of a brittle material and a first laser beam is irradiated along the groove to divide the material along the groove. Then, by simultaneously irradiating the second laser beam to a position opposite to the end face of the material with respect to the groove, the temperature distribution with respect to the groove (planned division line) is made symmetric during laser irradiation.

According to a sixth aspect of the present invention, in the method for dividing a brittle material according to the fifth aspect, a second laser beam having an intensity distribution similar to that of the first laser is applied to a distance from the groove to an end face of the brittle material. By irradiating twice the position, the temperature distribution with respect to the groove (planned division line) is made symmetric during laser irradiation.

[0026]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a method for dividing a brittle material according to the present invention will be described with reference to the accompanying drawings.

Embodiment 1 FIGS. 1 and 2 show a method for dividing a brittle material according to a first embodiment of the present invention. 1 and 2,
1 is an arrow indicating the position of the laser irradiation unit, 2 is a material end, 3
Is a groove of a planned dividing line, 4 is a brittle material, 5 is a laser beam, 6 is a crack, 7 is an arrow indicating a position when the laser irradiation part is moved to the outside of the brittle material, and 8 is a scanning direction of the laser beam 5 It is. In this division method, first, as shown in FIG. 1A, the laser irradiation part is positioned to the arrow 1 so that the material end 2 of the brittle material 4 becomes the division start part of the groove 3. Next, as shown in FIG. 1B, the position is irradiated with laser light 5 for a predetermined time (for example, 0.1 to 0.5 seconds) to generate a crack 6 at the material end 2. Then, as shown in FIG. 2A, the target position of the laser irradiation part is once moved to the arrow 7 outside the brittle material 4. Next, as shown in FIG. 2B, the brittle material 4 is divided by irradiating a laser 5 light along the groove 3.

In this dividing method, the brittle material 4 is, for example, 0.7 mm thick used for glass of a liquid crystal panel.
The laser beam 5 used was a CO ₂ laser beam. The groove 3 was formed with a cutting tool for brittle material having a tip having a super-hardness such as diamond attached.

As the conditions for dividing the brittle material, the following laser output, division speed and division width L were selected. Laser output: 60 W Division speed: 100 mm / s Division width L: 5 mm

In the conventional method shown in FIG. 9, since the direction of cracks at the material edge cannot be controlled, cracks which adversely affect the quality at the material edge occur, and the work yield of cutting is about 70%. Then, as a result of implementing the method of the present embodiment under the above-mentioned division conditions, it was confirmed by experiments and the like that the work yield of the cutting was improved to nearly 100%.

In this embodiment, a non-alkali glass is used as the brittle material. However, quartz, a semiconductor material, or the like can be used in addition to other glass and alumina ceramics. Further, as the laser light, CO ₂ laser light, YAG laser light, or the like can be appropriately selected depending on the material of the processing material.

Embodiment 2 FIGS. 3 and 4 show a method of dividing a brittle material according to a second embodiment of the present invention. According to this dividing method, first, as shown in FIG. 3A, before the laser irradiation, the division start portion of the groove 3 is heated to a temperature higher than room temperature by a hot plate 11 or hot air from the nozzle 9 shown in FIG. (3
After heating to about 0 to 40 ° C.), the laser irradiation part is positioned to the arrow 1 so that the material end 2 becomes the division start part. Then, as shown in FIG. 3B, the position is irradiated with a laser beam 5 for a predetermined time (for example, 0.1 to 0.5 seconds) to generate a crack 6 at the material end 2. Then, as shown in FIG. 4A, the target position of the laser irradiation part is once moved to the arrow 7 outside the brittle material 4. Next, as shown in FIG. 4B, the brittle material 4 is divided by irradiating a laser beam 5 along the groove 3.

In this division method, a non-alkali glass having a thickness of 0.7 mm used for glass of a liquid crystal panel, for example, was used as the brittle material, and a CO ₂ laser beam was used as the laser beam 5. The groove 3 was formed with a cutting tool for brittle material having a tip having a super-hardness such as diamond attached.

As the conditions for dividing the brittle material, the following laser output, division speed and division width L were selected. Laser output: 60 W Division speed: 100 mm / s Division width L: 4 mm

In the conventional method shown in FIG. 11, laser irradiation is performed in a state where a groove is not formed and a predetermined dividing line is heated.
Although division was performed, in this method, since there was no groove, the control of cracks became unstable, and even when the laser light irradiation conditions were appropriate, the work yield of cutting was about 70%. Then, as a result of implementing the method of the present embodiment under the above-mentioned division conditions, it was confirmed by experiments and the like that the work yield of the cutting was improved to nearly 100%.

In this embodiment, non-alkali glass is used as the brittle material, but quartz or semiconductor material can be used in addition to other glass and alumina ceramics. Further, as the laser light, CO ₂ laser light, YAG laser light, or the like can be appropriately selected depending on the material of the processing material.

Third Embodiment FIG. 5 shows a method for dividing a brittle material according to a third embodiment of the present invention. First, as shown in FIG. 5 (a), when a cut material is continuously obtained with a split width L of twice or less the laser beam diameter 10 as shown in FIG. 12 is formed, and the laser beam 5 is irradiated along the groove 3. After the division is completed, as shown in FIG. 5B, a groove 14 is formed in the planned dividing line 13 of the second adjacent cutout material, and the material is divided in the same manner as the first. Then the above steps are repeated.

In this division method, for example, a non-alkali glass having a thickness of 0.7 mm used for glass of a liquid crystal panel was used as the brittle material, and a CO ₂ laser beam was used as the laser beam 5. The groove 3 was formed with a cutting tool for brittle material having a tip having a super-hardness such as diamond attached.

As the conditions for dividing the brittle material, the following laser output, division speed and division width L were selected. Laser output: 60 W Division speed: 100 mm / s Division width L: 5 mm

In the conventional method shown in FIG. 13, after a plurality of grooves are formed in advance on the entire length or end of the hard and brittle material, laser irradiation is performed to divide the material. Even when cracks were generated and the material was divided at other portions, and the laser beam irradiation conditions were appropriate, the work yield of the cleaving was about 60%. Then, as a result of implementing the method of the present embodiment under the above-mentioned division conditions, it was confirmed by experiments and the like that the work yield of the cutting was improved to nearly 100%.

In this embodiment, a non-alkali glass is used as the brittle material. However, other glass or alumina ceramics, as well as quartz or a semiconductor material, can be used. Further, as the laser light, CO ₂ laser light, YAG laser light, or the like can be appropriately selected depending on the material of the processing material.

Fourth Embodiment FIG. 6 shows a method for dividing a brittle material according to a fourth embodiment of the present invention. This dividing method is shown in FIG.
As shown in (a) and (b), two brittle materials 4
When the material is to be divided at a predetermined dividing line at a position 16 shifted from the front surface and the back surface of the workpiece to which the a and 4b are bonded, first, a groove 17 is formed on the surface of the brittle material 4a, and then the laser beam 5 is applied. Irradiate and split. Next, after turning the materials 4a and 4b upside down to form grooves 19 in the planned dividing lines on the back surface of the material 4b, the laser light 5 is irradiated to divide the grooves.

In this dividing method, for example, a non-alkali glass having a thickness of 0.7 mm used for a glass of a liquid crystal panel was used as the brittle material, and a CO ₂ laser beam was used as the laser beam 5. The groove 3 was formed with a cutting tool for brittle material having a tip having a super-hardness such as diamond attached.

As the conditions for dividing the brittle material, a laser output, a dividing speed, a dividing width L, and an interval L2 between mutually displaced positions were selected. Laser output: 60 W Division speed: 100 mm / s Division width L: 6 mm Interval L2 between mutually shifted positions: 1 mm

In the conventional method shown in FIG. 14, there is also a groove on the back surface opposite to the groove on the front surface during laser irradiation, and the groove is also cracked, and cannot be divided along the dividing line. Even under appropriate cutting conditions, the work yield of cutting is about 6
It was 0%. Then, as a result of performing the method of the present embodiment under the above-mentioned division conditions, it was confirmed by experiments and the like that the work yield of the cutting was improved to nearly 100%.

In this embodiment, non-alkali glass is used as the brittle material. However, other glass or alumina ceramics, as well as quartz or semiconductor materials, can be used. Further, as the laser light, CO ₂ laser light, YAG laser light, or the like can be appropriately selected depending on the material of the processing material. In addition, there is a liquid crystal panel as a workpiece (part) in which two brittle materials are bonded together.

Embodiment 5 FIG. 7 shows a method of dividing a brittle material according to a fifth embodiment of the present invention. As shown in FIG. 7, this dividing method uses a laser beam 21 different from the laser beam 5 irradiating the groove 3 at an irradiation position 22 opposite to the end face 23 of the brittle material 4 with the groove 3 as a reference. The brittle material 4 is split by irradiating it in the same scanning direction 8 as the light 5.

In this division method, for example, a non-alkali glass having a thickness of 0.7 mm used for glass of a liquid crystal panel was used as the brittle material, and a CO ₂ laser beam was used as the laser beam 5. The groove 3 was formed with a cutting tool for brittle material having a tip having a super-hardness such as diamond attached.

As the conditions for dividing the brittle material, the following laser output, division speed and division width were selected. (A) Laser light 5 irradiated on groove 3 Laser output: 40 W Division speed: 50 mm / s Division width: 3 mm (b) Laser light 2 different from laser light 5 irradiated on groove 3
1 Laser output: 60 W Division speed: 50 mm / s Irradiation position from groove: 7.5 mm

In the conventional method shown in FIGS. 15 and 16, since the temperature distribution is asymmetric with respect to the groove, the generated thermal stress is also asymmetric, and the crack direction at the material end cannot be controlled. Therefore, even under appropriate cutting conditions, the work yield of the cutting was about 70%. Then, as a result of implementing the method of the present embodiment under the above-mentioned division conditions, it was confirmed by experiments and the like that the work yield of the cutting was improved to nearly 100%.

In this embodiment, a non-alkali glass is used as the brittle material. However, quartz or a semiconductor material can be used in addition to other glass and alumina ceramics. Further, as the laser light, CO ₂ laser light, YAG laser light, or the like can be appropriately selected depending on the material of the processing material.

Sixth Embodiment FIG. 8 shows a method of dividing a brittle material according to a sixth embodiment of the present invention. As shown in FIG. 8, this dividing method is performed at a position twice as long as the distance (division width) a from the groove 3 to the end face 23 of the brittle material 4, that is, an asymmetric position at a distance 2a from the groove 3. 24, the brittle material 4 is divided by irradiating the laser beam 25 having the same intensity distribution as the laser beam 5 irradiating the groove 3 along the scanning direction 8.

In this division method, a non-alkali glass having a thickness of 0.7 mm used for glass of a liquid crystal panel, for example, was used as the brittle material, and a CO ₂ laser beam was used as the laser beam 5. The groove 3 was formed with a cutting tool for brittle materials having a tip having a superhardness such as diamond attached.

As the conditions for dividing the brittle material, the following laser output, division speed and division width a were selected. (A) Laser light 5 irradiated on groove 3 Laser output: 40 W Division speed: 50 mm / s Division width a: 3 mm (b) Laser light 25 different from laser light 5 irradiated on groove 3 Laser output: 40 W Division speed : 50 mm / s Irradiation position from groove: 6 mm

In the conventional method shown in FIGS. 15 and 16, since the temperature distribution is asymmetric with respect to the groove, the generated thermal stress is also asymmetric, and the crack direction at the material end cannot be controlled. Therefore, even under appropriate cutting conditions, the work yield of the cutting was about 70%. Then, as a result of implementing the method of the present embodiment under the above-mentioned division conditions, it was confirmed by experiments and the like that the work yield of the cutting was improved to nearly 100%.

In this embodiment, non-alkali glass is used as the brittle material, but quartz or semiconductor material can be used in addition to other glass and alumina ceramics. Further, as the laser light, CO ₂ laser light, YAG laser light, or the like can be appropriately selected depending on the material of the processing material.

[0057]

As described above, according to the first aspect of the present invention, the crack direction at the material end can be controlled and a stable crack can be generated at the material end in the groove direction. Cracks that adversely affect the quality of the part do not occur, and the work yield of the cleaving can be improved.

According to the second aspect of the present invention, by increasing the fracture toughness of the brittle material, a crack is stably generated at the material end in the groove direction, and cracks which adversely affect the quality at the material end are prevented. It is possible to improve the work yield of the cutting without causing it.

According to the third aspect of the present invention, since there is no groove on the scheduled dividing line adjacent to the groove during laser irradiation, the material can be divided even if the division width is small, and the work yield of the cutting is improved. be able to.

Further, according to the fourth aspect of the present invention, the material can be divided stably one surface at a time, and the work yield of the cutting can be improved.

According to the fifth aspect of the present invention, the material can be divided even if the division width is small, and the work yield of the cutting can be improved.

Further, according to the sixth aspect of the present invention, the material can be divided even if the division width is small, and the work yield of the cutting can be improved.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram of a method for dividing a brittle material according to a first embodiment of the present invention.

FIG. 2 is an explanatory diagram of a method for dividing a brittle material according to the first embodiment of the present invention.

FIG. 3 is an explanatory view of a brittle material dividing method according to a second embodiment of the present invention.

FIG. 4 is an explanatory diagram of a method for dividing a brittle material according to a second embodiment of the present invention.

FIG. 5 is an explanatory diagram of a method for dividing a brittle material according to a third embodiment of the present invention.

FIG. 6 is an explanatory diagram of a method for dividing a brittle material according to a fourth embodiment of the present invention.

FIG. 7 is an explanatory view of a method for dividing a brittle material according to a fifth embodiment of the present invention.

FIG. 8 is an explanatory diagram of a method for dividing a brittle material according to a sixth embodiment of the present invention.

FIG. 9 is an explanatory view of a conventional method of dividing a brittle material.

FIG. 10 is a schematic view of a divided sectional shape of a conventional method for dividing a brittle material.

FIG. 11 is an explanatory view of a conventional method of dividing a brittle material.

FIG. 12 is a schematic view of a divided cross-sectional shape of a conventional method for dividing a brittle material.

FIG. 13 is an explanatory view of a conventional method for dividing a brittle material.

FIG. 14 is an explanatory diagram of a conventional dividing method of a workpiece to which two brittle materials are bonded.

FIG. 15 is an explanatory view of a conventional method of dividing a brittle material.

FIG. 16 is an explanatory view of a conventional method of dividing a brittle material.

FIG. 17 is a schematic diagram of a temperature distribution during division in a conventional method for dividing a brittle material.

[Explanation of symbols]

1 Arrow indicating the position of the laser irradiation part, 2 Material end (division start part), 3 grooves, 4 Brittle material, 5 Laser light, 6
Crack, 7 Arrow indicating the position of laser beam irradiation part once moved to outside of material, 8 Scanning direction, 9 nozzle, 10 Beam diameter, 11 Hot plate, 12
Groove (scheduled line of first cut material), 13 Second cut line of cut material (no groove), 14 groove (scheduled line of second cut material), 15 1st cut material, 16 Offset from each other, 17 surface grooves, 18
Planned dividing line on the back side (without groove), 19 Groove on the back side, 20
Surface cross section, 21 different laser beams, 22 irradiation positions, 23 end faces, 25 laser beams having the same intensity distribution, 26 cracks, 27 scheduled dividing lines (without grooves), 2
8 Temperature distribution (two-dot chain line), 29 Low temperature direction of temperature distribution, a, L division width, 2a distance, 3a glass division plane, L2 Distance between mutually shifted positions.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Masaharu Moriyasu 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Mitsui Electric Co., Ltd. (72) Inventor Toshio Kagawa 2-3-2 Marunouchi, Chiyoda-ku, Tokyo 3 F term in Ryo Denki Co., Ltd. (reference) 4E068 AA03 AE00 AJ03 CA10 CA16 CB06 CD04 DB12 DB13 4G015 FA06 FB01 FC01 FC14

Claims (6)

[Claims] 1. A brittle material dividing method for forming a groove on a surface of a brittle material and irradiating a laser beam along the groove to divide the brittle material along the groove, the method comprising: A step of positioning the laser light so that the laser beam is irradiated on the material edge to be a part, and a step of irradiating the laser beam at the position for a predetermined time to generate a crack along the groove of the material edge, Irradiating a laser beam from the end of the cracked material along the groove to divide the brittle material, thereby dividing the brittle material. 2. The dividing method according to claim 1, wherein a region including at least a division start portion of the brittle material is heated to a temperature higher than a room temperature during laser light irradiation. 3. A groove is formed on the surface of the brittle material, and when the brittle material is divided a plurality of times along the groove, a groove is formed on a first planned dividing line, and the groove is irradiated with laser light. After the first division is completed, a groove is formed in the adjacent second planned division line, the groove is irradiated with a laser beam to perform division, and this is repeated. Split method. 4. When each brittle material is divided by a dividing line at a position deviated from the front surface and the back surface of the workpiece to which the two brittle materials are bonded, one of the front surface and the back surface is used. Forming a groove in the first planned dividing line on the surface,
This groove is irradiated with laser light, and after the first division is completed, a groove is formed in the second planned dividing line on the other surface, and the groove is irradiated with laser light to perform division. Method of dividing brittle material. 5. A method of dividing a brittle material, wherein a groove is formed on a surface of the brittle material and a first laser beam is irradiated along the groove to divide the brittle material along the groove. A method for dividing a brittle material, comprising simultaneously irradiating a second laser beam to a position opposite to an end surface of the brittle material with respect to the groove. 6. A second laser beam having an intensity distribution similar to that of the first laser beam is applied to a position twice as long as a distance from the groove to an end face of the brittle material. 5. The dividing method according to 5.