JP2000280086A - Laser processing machine - Google Patents
Laser processing machineInfo
- Publication number
- JP2000280086A JP2000280086A JP11089929A JP8992999A JP2000280086A JP 2000280086 A JP2000280086 A JP 2000280086A JP 11089929 A JP11089929 A JP 11089929A JP 8992999 A JP8992999 A JP 8992999A JP 2000280086 A JP2000280086 A JP 2000280086A
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- aperture
- cover
- laser
- window
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、窓を備えたアパー
チャにより、レーザ発振器から放射されたレーザビーム
を前記窓の大きさに制限するようにしたレーザ加工機に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser beam machine in which an aperture provided with a window limits a laser beam emitted from a laser oscillator to the size of the window.
【0002】[0002]
【従来の技術】例えば、レーザによりプリント基板に穴
明けをするレーザ穴明け機では、加工精度および作業性
を向上させるため、アパーチャによりレーザ発振器から
放射されたレーザビームのビーム径を所定の大きさに整
える。このようなレーザ加工機のアパーチャを図6、7
により説明する。図6は従来のレーザ穴明け機の光学系
の全体構成図であり、図7は図6のA部断面図である。
図で、1はレーザ発振器で、レーザビーム2を出力す
る。3a〜3cはミラーである。4はアパーチャで、レ
ーザビーム2を透過させずかつ熱伝導率が大きい銅等の
材質で形成されている。アパーチャ4は所定の位置に窓
4a(この場合は円形の貫通穴で、直径は1〜8mm程
度である。)を備え、レーザビーム2の入射側の側面4
bは円錐面に形成されている。アパーチャ4は窓4aの
軸心がレーザビーム2のビーム径の軸心に一致するよう
に配置される。5はレンズ等からなる光学ユニット、6
はプリント基板である。2. Description of the Related Art For example, in a laser drilling machine that drills a printed circuit board with a laser, a beam diameter of a laser beam emitted from a laser oscillator by an aperture is set to a predetermined size in order to improve processing accuracy and workability. Prepare. The aperture of such a laser beam machine is shown in FIGS.
This will be described below. FIG. 6 is an overall configuration diagram of an optical system of a conventional laser drilling machine, and FIG. 7 is a sectional view of a portion A in FIG.
In the figure, reference numeral 1 denotes a laser oscillator which outputs a laser beam 2. 3a to 3c are mirrors. Reference numeral 4 denotes an aperture which is made of a material such as copper which does not transmit the laser beam 2 and has a high thermal conductivity. The aperture 4 has a window 4a at a predetermined position (in this case, a circular through hole having a diameter of about 1 to 8 mm), and a side face 4 on the incident side of the laser beam 2.
b is formed in a conical surface. The aperture 4 is arranged such that the axis of the window 4 a coincides with the axis of the beam diameter of the laser beam 2. 5 is an optical unit composed of a lens or the like, 6
Is a printed circuit board.
【0003】次に、従来のレーザ加工機の動作を説明す
る。レーザ発振器1から放射されたレーザビーム2は、
ミラー3a、3bにより直角に曲げられ、アパーチャ4
に入射する。そして、窓4aを通過した通過ビーム2a
は、ミラー3cにより直角に曲げられた後、光学ユニッ
ト5で集光され、プリント基板6に穴を加工する。ま
た、側面4bで反射された反射ビーム2bは、レーザ発
振器1以外の場所に反射され、反射ビーム2bによりレ
ーザ発振器が破損することを防止する。なお、レーザ加
工機全体が図示をしないカバーにより周囲から遮蔽され
ているから、反射ビーム2bがレーザ加工機の外部に漏
れることはない。Next, the operation of a conventional laser beam machine will be described. The laser beam 2 emitted from the laser oscillator 1 is
It is bent at right angles by the mirrors 3a and 3b, and the aperture 4
Incident on. Then, the passing beam 2a passing through the window 4a
Is bent by the mirror 3c at a right angle, and then condensed by the optical unit 5 to form a hole in the printed circuit board 6. Further, the reflected beam 2b reflected by the side surface 4b is reflected to a place other than the laser oscillator 1, and prevents the laser oscillator from being damaged by the reflected beam 2b. Since the entire laser processing machine is shielded from the surroundings by a cover (not shown), the reflected beam 2b does not leak outside the laser processing machine.
【0004】このように、レーザビーム2のビーム径を
予め整えると、異なる穴径を加工する場合も、プリント
基板6の表面からの光学ユニット5の高さを固定でき
る。この結果、穴の加工精度が向上するだけでなく、作
業性も向上する。When the beam diameter of the laser beam 2 is adjusted in advance, the height of the optical unit 5 from the surface of the printed circuit board 6 can be fixed even when a different hole diameter is processed. As a result, not only the hole machining accuracy is improved, but also the workability is improved.
【0005】[0005]
【発明が解決しようとする課題】しかし、アパーチャ4
が銅製である場合、反射ビーム2bのほとんどが側面4
bで反射され、その勢力は衰えない。また、反射ビーム
2bは指向性が高い。このため、レーザ出力にもよる
が、レーザ加工機内の反射ビーム2bが入射する個所は
徐々に加熱されて、局部的に150度Cに達する場合が
ある。例えば、加熱された個所がミラー3bの保持部で
あると、保持部が熱変形することによりミラー3bの位
置がずれて、レーザビーム2の光軸が傾き、加工部に供
給される加工エネルギが低下して、所望の加工を行うこ
とができなくなる。However, the aperture 4
Is made of copper, most of the reflected beam 2b
Reflected by b, its power does not decay. The reflected beam 2b has high directivity. For this reason, depending on the laser output, the portion of the laser beam machine where the reflected beam 2b enters may be gradually heated and locally reach 150 ° C. in some cases. For example, if the heated location is the holding portion of the mirror 3b, the position of the mirror 3b is shifted due to the thermal deformation of the holding portion, the optical axis of the laser beam 2 is tilted, and the processing energy supplied to the processing portion is reduced. And the desired processing cannot be performed.
【0006】本発明の目的は、上記従来技術における課
題を解決し、アパーチャで反射されるレーザビームを適
切に処理することができるレーザ加工機を提供するにあ
る。An object of the present invention is to solve the above-mentioned problems in the prior art and to provide a laser beam machine capable of appropriately processing a laser beam reflected by an aperture.
【0007】[0007]
【課題を解決するための手段】上記の目的を達成するた
め、請求項1の発明は、窓を備えたアパーチャにより、
レーザ発振器から放射されたレーザビームを前記窓の大
きさに制限するようにしたレーザ加工機において、レー
ザビームの吸収率が高い材質で形成され、内面が平行の
中空のカバーを設け、このカバーを前記内面が前記レー
ザビームと平行になるようにして前記アパーチャのレー
ザビーム入射側に配置し、前記アパーチャで反射された
前記レーザビームを前記内面に照射させるように構成し
たことを特徴とする。To achieve the above object, according to the first aspect of the present invention, an aperture having a window is provided.
In a laser processing machine that limits a laser beam emitted from a laser oscillator to the size of the window, a hollow cover that is formed of a material having a high laser beam absorptivity and whose inner surface is parallel is provided. The inner surface is arranged on the laser beam incident side of the aperture so as to be parallel to the laser beam, and the laser beam reflected by the aperture is irradiated on the inner surface.
【0008】また、請求項2の発明は、請求項1におい
て、前記カバーの冷却手段を設け、前記カバーを冷却す
るように構成したことを特徴とする。[0008] The invention of claim 2 is characterized in that, in claim 1, cooling means for the cover is provided to cool the cover.
【0009】[0009]
【発明の実施の形態】以下、本発明を図示の実施の形態
に基づいて説明する。図1は本発明に係るレーザ加工機
の光学系の全体構成図、図2は図1のB視図、図3は図
2のC−C断面図、図4は図3のD部拡大図であり、図
6、7と同じものまたは同一機能のものは同一符号を付
して説明を省略する。図で、10、11はアパーチャで
ある。アパーチャ10は、図4に示すように、レーザビ
ーム2の入射側の側面10bが窓10aの外縁から角度
θ(図示の場合、θ=75度)の円錐面に形成され、外
周には雄ねじ12が形成されている。なお、アパーチャ
10と11は窓10a、11aおよび側面10b、11
bの軸方向の長さが異なるが、他の寸法(外径、雄ねじ
12の長さおよび角度θ等)は同一である。13は円筒
形のカバーで、反射率が小さい材質、例えばカーボンで
形成され、一方の内側端部に雄ねじ12と螺合する雌ね
じ14が形成されている。カバー13はホルダ15の一
方の側からホルダ15に密着するようにして挿入され、
図示を省略する手段によりホルダ15に固定されてい
る。16はホルダ15を貫通する冷却水通路で、接続端
子17を介して図示を省略する冷却水循環装置に接続さ
れている。18はサポートで、ホルダ15と一体であ
り、ボルト19によりエアシリンダ20のピストン21
に固定されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the illustrated embodiments. 1 is an overall configuration diagram of an optical system of a laser processing machine according to the present invention, FIG. 2 is a view as viewed from B in FIG. 1, FIG. 3 is a cross-sectional view taken along line CC of FIG. 6 and 7 having the same functions or the same functions as those in FIGS. In the figure, reference numerals 10 and 11 are apertures. As shown in FIG. 4, the aperture 10 has a side surface 10 b on the incident side of the laser beam 2 formed in a conical surface having an angle θ (θ = 75 degrees in the illustrated case) from the outer edge of the window 10 a, and a male screw 12 on the outer periphery. Are formed. The apertures 10 and 11 are provided with windows 10a, 11a and side faces 10b, 11
Although the length of b in the axial direction is different, other dimensions (outer diameter, length of male screw 12, angle θ, etc.) are the same. Reference numeral 13 denotes a cylindrical cover, which is formed of a material having a low reflectance, for example, carbon, and has a female screw 14 screwed to the male screw 12 at one inner end. The cover 13 is inserted from one side of the holder 15 so as to be in close contact with the holder 15,
It is fixed to the holder 15 by means not shown. A cooling water passage 16 penetrates the holder 15 and is connected to a cooling water circulation device (not shown) via a connection terminal 17. Reference numeral 18 denotes a support, which is integral with the holder 15, and a piston 21 of an air cylinder 20 is
It is fixed to.
【0010】次に、各部の寸法について説明する。カバ
ー13の被覆長さL、すなわちアパーチャ10をカバー
13に螺合させたときのカバー13の端部Mから窓10
aの端部Nまでの距離と、カバー13の内径D、レーザ
ビーム2の直径K、窓10aの最小直径dおよび角度θ
の間には下記式1〜3の関係がある。 (1)D>K 式1 (2)L>(D−d)/2・tan2θ 式2 (3)90>θ≧45 式3 次に、本実施の形態の動作を説明する。予めエアシリン
ダ20を動作させ、窓10aと窓11aのいずれか一方
の中心(ここでは窓10a)を、レーザビーム2の中心
に一致させて位置決めする。レーザ発振器1から放射さ
れたレーザビーム2は、ミラー3a、3bにより直角に
曲げられ、アパーチャ10に入射する。そして、窓10
aを通過した通過ビーム2aは、ミラー3cにより直角
に曲げられた後、光学ユニット5で集光され、プリント
基板6に穴を加工する。Next, the dimensions of each part will be described. The covering length L of the cover 13, that is, from the end M of the cover 13 when the aperture 10 is screwed to the cover 13,
a, the inner diameter D of the cover 13, the diameter K of the laser beam 2, the minimum diameter d of the window 10a, and the angle θ.
Have the relationship of the following formulas 1-3. (1) D> K Equation 1 (2) L> (D−d) / 2 · tan2θ Equation 2 (3) 90> θ ≧ 45 Equation 3 Next, the operation of the present embodiment will be described. The air cylinder 20 is operated in advance, and the center of one of the window 10a and the window 11a (the window 10a in this case) is aligned with the center of the laser beam 2 and positioned. The laser beam 2 emitted from the laser oscillator 1 is bent at a right angle by the mirrors 3a and 3b, and enters the aperture 10. And window 10
The beam 2a that has passed through a is bent at a right angle by the mirror 3c and then condensed by the optical unit 5 to form a hole in the printed board 6.
【0011】一方、反射ビーム2bは、上記式2、3の
関係により、図4に示すように、最も中心側である窓1
0aの端部Nで反射された反射ビーム2bnもカバー1
3の内面に入射し、カバー13に吸収されて熱に変わ
る。カバー13は水冷されたホルダ15に密着して固定
されているから、温度はほとんど上昇しない。また、ア
パーチャ10も雌ねじ14を介して冷却されるから、温
度上昇値は小さく、窓10aの直径が熱により拡大する
ことはない。On the other hand, the reflected beam 2b is, as shown in FIG.
The reflected beam 2bn reflected at the end N of the cover 0a
3 and is absorbed by the cover 13 and converted into heat. Since the cover 13 is tightly fixed to the water-cooled holder 15, the temperature hardly rises. Further, since the aperture 10 is also cooled via the female screw 14, the temperature rise value is small, and the diameter of the window 10a does not increase due to heat.
【0012】なお、上記ではカバー13全体をカーボン
としたが、例えば、ホルダ15を銅製とし、反射ビーム
2bが照射される部分に筒状のカーボンを圧入あるいは
接着するようにしてもよい。また、カバー13とホルダ
15を一体の銅製として、内面を黒化処理しても良い
し、鉄製として内面を四三酸化鉄皮膜処理してもよい。Although the entire cover 13 is made of carbon in the above description, for example, the holder 15 may be made of copper, and cylindrical carbon may be press-fitted or bonded to a portion irradiated with the reflected beam 2b. Further, the cover 13 and the holder 15 may be made of integral copper and the inner surface may be blackened, or the inner surface may be made of iron and the inner surface may be treated with triiron tetroxide coating.
【0013】また、上記実施の形態では、アパーチャの
数を2個としたが、窓径の異なる多数のアパーチャを用
意して切換え手段に保持させ、窓の中心をレーザビーム
の軸心に一致させるように構成すると、加工できる穴径
の種類をさらに増やすことができる。In the above embodiment, the number of apertures is two. However, a large number of apertures having different window diameters are prepared and held by the switching means so that the center of the window coincides with the axis of the laser beam. With this configuration, the types of hole diameters that can be processed can be further increased.
【0014】また、角度θを90>θ≧45としたが、
被覆長さLを長くできる場合には、θをできるだけ大き
くして窓10a部の軸心方向の肉厚を厚くするようにす
ればアパーチャ10の寿命を長くすることができる。Although the angle θ is set to 90> θ ≧ 45,
When the coating length L can be increased, the life of the aperture 10 can be extended by increasing θ as much as possible and increasing the thickness of the window 10a in the axial direction.
【0015】図5は本発明の他の実施の形態を示す図
で、上記の図4に対応する図である。図で、30はエア
ノズルで、カバー13に固定されており、端部30aは
図示を省略する圧縮空気源に接続されている。この実施
の形態では、カバー13およびアパーチャ10を空気に
より冷却するので、装置構成が簡単になる。FIG. 5 shows another embodiment of the present invention, and corresponds to FIG. 4 described above. In the figure, reference numeral 30 denotes an air nozzle, which is fixed to the cover 13, and the end 30a is connected to a compressed air source (not shown). In this embodiment, since the cover 13 and the aperture 10 are cooled by air, the device configuration is simplified.
【0016】[0016]
【発明の効果】以上説明したように、本発明によれば、
窓を備えたアパーチャにより、レーザ発振器から放射さ
れたレーザビームを前記窓の大きさに制限するようにし
たレーザ加工機において、レーザビームの吸収率が高い
材質で形成され、内面が平行の中空のカバーを設け、こ
のカバーを前記内面が前記レーザビームと平行になるよ
うにして前記アパーチャのレーザビーム入射側に配置
し、前記アパーチャで反射された前記レーザビームを前
記内面に照射させるように構成したから、反射ビームを
確実に吸収することができる。この結果、レーザビーム
の光軸の狂い、レーザ加工機内の構成部品の変形などの
発生を予防することができる。As described above, according to the present invention,
In a laser beam machine that limits a laser beam emitted from a laser oscillator to the size of the window by an aperture having a window, the laser beam is formed of a material having a high absorptivity of the laser beam, and the inner surface of the hollow is parallel. A cover was provided, and the cover was arranged on the laser beam incident side of the aperture so that the inner surface became parallel to the laser beam, and the inner surface was configured to irradiate the laser beam reflected by the aperture to the inner surface. Therefore, the reflected beam can be reliably absorbed. As a result, it is possible to prevent the deviation of the optical axis of the laser beam, the deformation of the components in the laser beam machine, and the like.
【図1】本発明に係るレーザ加工機の光学系の全体構成
図である。FIG. 1 is an overall configuration diagram of an optical system of a laser processing machine according to the present invention.
【図2】図1のB視図である。FIG. 2 is a view as viewed from B in FIG. 1;
【図3】図2のC−C断面図である。FIG. 3 is a sectional view taken along line CC of FIG. 2;
【図4】図3のD部拡大図である。FIG. 4 is an enlarged view of a part D in FIG. 3;
【図5】本発明の他の実施の形態を示す図である。FIG. 5 is a diagram showing another embodiment of the present invention.
【図6】従来のレーザ穴明け機の光学系の全体構成図で
ある。FIG. 6 is an overall configuration diagram of an optical system of a conventional laser drilling machine.
【図7】図6のA部拡大図である。FIG. 7 is an enlarged view of a portion A in FIG. 6;
2 レーザビーム 2b 反射ビーム 10 アパーチャ 10b 側面 13 カバー 2 laser beam 2b reflected beam 10 aperture 10b side 13 cover
Claims (2)
振器から放射されたレーザビームを前記窓の大きさに制
限するようにしたレーザ加工機において、レーザビーム
の吸収率が高い材質で形成され、内面が平行の中空のカ
バーを設け、このカバーを前記内面が前記レーザビーム
と平行になるようにして前記アパーチャのレーザビーム
入射側に配置し、前記アパーチャで反射された前記レー
ザビームを前記内面に照射させるように構成したことを
特徴とするレーザ加工機。1. A laser processing machine in which an aperture provided with a window limits a laser beam emitted from a laser oscillator to the size of the window, wherein the laser beam is formed of a material having a high absorptivity of the laser beam. A parallel hollow cover is provided, and the cover is arranged on the laser beam incident side of the aperture so that the inner surface is parallel to the laser beam, and the inner surface is irradiated with the laser beam reflected by the aperture. A laser processing machine characterized in that the laser processing machine is configured to perform the following.
ーを冷却するように構成したことを特徴とする請求項1
に記載のレーザ加工機。2. The apparatus according to claim 1, further comprising cooling means for cooling said cover.
2. The laser beam machine according to claim 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP08992999A JP3926503B2 (en) | 1999-03-30 | 1999-03-30 | Laser processing machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP08992999A JP3926503B2 (en) | 1999-03-30 | 1999-03-30 | Laser processing machine |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2000280086A true JP2000280086A (en) | 2000-10-10 |
JP3926503B2 JP3926503B2 (en) | 2007-06-06 |
Family
ID=13984399
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP08992999A Expired - Fee Related JP3926503B2 (en) | 1999-03-30 | 1999-03-30 | Laser processing machine |
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Country | Link |
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JP (1) | JP3926503B2 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002316291A (en) * | 2001-04-18 | 2002-10-29 | Amada Co Ltd | Laser beam machine |
WO2005098483A1 (en) * | 2004-04-05 | 2005-10-20 | Micronic Laser Systems Ab | Aperture stop assembly for high power laser beams |
KR100812582B1 (en) * | 2004-04-05 | 2008-03-13 | 마이크로닉 레이저 시스템즈 에이비 | Aperture stop assembly for high power laser beams |
US8624158B2 (en) | 2003-03-18 | 2014-01-07 | Loma Linda University Medical Center | Manipulation apparatus for system that removes material from a surface of a structure |
KR20160077382A (en) * | 2014-12-22 | 2016-07-04 | 재단법인 포항산업과학연구원 | Laser Welding Device and Welding Method of Thin Plate Using Laser Welding Device |
DE102021112833A1 (en) | 2021-05-18 | 2022-11-24 | Precitec Gmbh & Co. Kg | Aperture for a laser processing head |
-
1999
- 1999-03-30 JP JP08992999A patent/JP3926503B2/en not_active Expired - Fee Related
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002316291A (en) * | 2001-04-18 | 2002-10-29 | Amada Co Ltd | Laser beam machine |
JP4583652B2 (en) * | 2001-04-18 | 2010-11-17 | 株式会社アマダ | Laser processing machine |
US8624158B2 (en) | 2003-03-18 | 2014-01-07 | Loma Linda University Medical Center | Manipulation apparatus for system that removes material from a surface of a structure |
WO2005098483A1 (en) * | 2004-04-05 | 2005-10-20 | Micronic Laser Systems Ab | Aperture stop assembly for high power laser beams |
KR100812582B1 (en) * | 2004-04-05 | 2008-03-13 | 마이크로닉 레이저 시스템즈 에이비 | Aperture stop assembly for high power laser beams |
KR20160077382A (en) * | 2014-12-22 | 2016-07-04 | 재단법인 포항산업과학연구원 | Laser Welding Device and Welding Method of Thin Plate Using Laser Welding Device |
KR101684485B1 (en) | 2014-12-22 | 2016-12-09 | 재단법인 포항산업과학연구원 | Laser Welding Device and Welding Method of Thin Plate Using Laser Welding Device |
DE102021112833A1 (en) | 2021-05-18 | 2022-11-24 | Precitec Gmbh & Co. Kg | Aperture for a laser processing head |
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