JPH0114670Y2 - - Google Patents
Info
- Publication number
- JPH0114670Y2 JPH0114670Y2 JP1985183020U JP18302085U JPH0114670Y2 JP H0114670 Y2 JPH0114670 Y2 JP H0114670Y2 JP 1985183020 U JP1985183020 U JP 1985183020U JP 18302085 U JP18302085 U JP 18302085U JP H0114670 Y2 JPH0114670 Y2 JP H0114670Y2
- Authority
- JP
- Japan
- Prior art keywords
- laser
- laser beam
- pair
- curved surface
- light shielding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000003287 optical effect Effects 0.000 claims description 12
- 238000010521 absorption reaction Methods 0.000 claims description 4
- 230000031700 light absorption Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000001154 acute effect Effects 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
Description
【考案の詳細な説明】
〔考案の技術分野〕
この考案は、走査光学系により被加工物を走査
するように振られたレーザ光の両端部をカツトす
るレーザ光カツト装置を有するレーザ加工装置に
関する。[Detailed description of the invention] [Technical field of the invention] This invention relates to a laser processing apparatus having a laser beam cutting device that cuts both ends of a laser beam that is swung to scan a workpiece by a scanning optical system. .
レーザ光による表面焼入れまたは合金化の一例
として、第5図に示すように、被加工物Wをテー
ブルに搭載して矢失1方向に移動させるととも
に、レーザ発振器から放出されたレーザ光を、上
記被加工物Wの移動方向と直交する方向に振らせ
て、それらの相対運動により、破線2で示すよう
に被加工物Wの表面をジグザグ状に走査する方法
がある。この場合、所要深さの焼入れ層あるいは
合金化層が得られるように、レーザ光のパワー密
度およびスポツト径が調整され、また被加工物W
についてもレーザ光の吸収をよくするために、そ
の表面にレーザ光吸収部材を塗布することがあ
る。
As an example of surface hardening or alloying using a laser beam, as shown in FIG. There is a method in which the workpiece W is swung in a direction perpendicular to the moving direction of the workpiece W, and the surface of the workpiece W is scanned in a zigzag pattern as shown by the broken line 2 by the relative movement thereof. In this case, the power density and spot diameter of the laser beam are adjusted so that a hardened layer or alloyed layer of the required depth can be obtained, and the workpiece W
In order to improve absorption of laser light, a laser light absorbing material is sometimes coated on the surface of the material.
ところで上記方法により被加工物Wの所要部分
を焼入れ(または合金化)すると、レーザ光の走
査方向両端部にレーザ光の重なり部分ができ、ま
たレーザ光の走査を揺動反射鏡などでおこなう場
合は、レーザ光の走査速度が走査領域の中央部に
くらべて両端部で遅くなるため、第6図に示すよ
うに、両端部の焼入れ層(または合金化層)3の
深さが中央部にくらべて深くなる。それ故、従来
よりレーザ光を過剰に振つてその両端部を遮光す
ることにより、所要部分を均一に焼入れまたは合
金化しようとする方法がある。 By the way, when the required portions of the workpiece W are hardened (or alloyed) using the above method, overlapping parts of the laser beams are created at both ends in the scanning direction of the laser beams, and when the scanning of the laser beams is performed using a swinging reflector or the like. Since the scanning speed of the laser beam is slower at both ends than at the center of the scanning area, the depth of the hardened layer (or alloyed layer) 3 at both ends is lower than that at the center, as shown in Figure 6. It's deeper than that. Therefore, there is a conventional method of uniformly hardening or alloying the required portions by emitting excessive laser light and shielding both ends of the laser beam.
たとえば特開昭54−118848号公報には、被加工
物とレーザ光走査装置との間に、振られたレーザ
光の両端部を遮光する熱伝導性のよい金属からな
る遮光板を配置することが示されている。また実
願昭57−1800号には、第7図に示すように、被加
工物Wとレーザ光走査光学系4との間に、遮光に
より発生する熱を放散する熱放散部5の設けられ
た遮光板6を配置することが示されている。 For example, JP-A-54-118848 discloses that a light shielding plate made of a metal with good thermal conductivity is disposed between the workpiece and the laser beam scanning device to shield both ends of the deflected laser light. It is shown. Furthermore, as shown in FIG. 7, Utility Model Application No. 1800 discloses that a heat dissipation section 5 is provided between the workpiece W and the laser beam scanning optical system 4 to dissipate heat generated due to light shielding. It is shown that a light shielding plate 6 is provided.
しかしこのような遮光板では、走査光学系で振
られかつ被加工物上で所定のスポツト径が得られ
るように集束されたレーザ光が直角に近い鋭角で
入射するため、過熱されやすく、特にパワー密度
の大きい大出力レーザ光に耐えられない。 However, with such a light-shielding plate, the laser beam that has been swung by the scanning optical system and focused to obtain a predetermined spot diameter on the workpiece is incident at an acute angle close to a right angle, so it is easily overheated, especially when the power Cannot withstand high-density, high-power laser light.
この考案は、レーザ光の入射に対して十分な強
度をもち、パワー密度の大きいレーザ光に耐える
レーザ光カツト装置をもつレーザ加工装置を構成
することにある。
The purpose of this invention is to construct a laser processing apparatus having a laser beam cutting device that has sufficient intensity for incident laser beams and can withstand laser beams with high power density.
この考案は、走査光学系により被加工物を走査
するように振られたレーザ光の両端部をカツトす
るようにしたレーザ加工装置において、そのレー
ザ光カツト装置を、レーザ光をその外側方に発散
する如く反射する凸曲面を有する一対の遮光部
と、反射されたレーザ光を吸収する凹曲面を有す
る一対のレーザ光吸収部とで構成するとともに、
一対の遮光部間隔を任意に変更できるようにし
て、パワー密度の大きいレーザ光に耐え、かつ走
査領域を容易に調整できるようにしたものであ
る。
This idea is based on a laser processing device that cuts both ends of a laser beam that is swung to scan a workpiece by a scanning optical system. a pair of light shielding parts having a convex curved surface that reflects the reflected laser light, and a pair of laser light absorption parts having a concave curved surface that absorbs the reflected laser light;
The distance between the pair of light shielding parts can be changed arbitrarily to withstand laser light with high power density, and the scanning area can be easily adjusted.
以下、図面を参照してこの考案を実施例に基づ
いて説明する。
Hereinafter, this invention will be explained based on examples with reference to the drawings.
第1図にこの考案の一実施例であるレーザ光カ
ツト装置を、また第4図にその配置を示す。この
レーザ光カツト装置10は、被加工物Wと、矢印
11で示すように揺動して、レーザ発振器12か
ら放出されたレーザ光Lを上記被加工物Wを走査
するように振る走査光学系4との間に配置され、
上記走査光学系4により振られたレーザ光の走査
方向の両端部を遮光する一対の遮光部14と、こ
の遮光部14で反射されたレーザ光を吸収する一
対のレーザ光吸収部15と、これら遮光部14お
よびレーザ光吸収部15を支持する支持体16
と、一対の遮光部間隔を変化させる調整機構17
とから構成されている。 FIG. 1 shows a laser beam cutting device which is an embodiment of this invention, and FIG. 4 shows its arrangement. This laser beam cutting device 10 includes a workpiece W and a scanning optical system that swings as shown by an arrow 11 and swings a laser beam L emitted from a laser oscillator 12 so as to scan the workpiece W. placed between 4 and
A pair of light shielding parts 14 that shield both ends in the scanning direction of the laser light deflected by the scanning optical system 4; a pair of laser light absorption parts 15 that absorb the laser light reflected by the light shielding parts 14; Support body 16 that supports the light shielding part 14 and the laser light absorption part 15
and an adjustment mechanism 17 that changes the distance between the pair of light shielding parts.
It is composed of.
上記一対の各遮光体14は、基体19と、この
基体19と一体かつその一端部上から走査光学系
4方向に突設された凸曲面部20とからなり、無
酸素銅で構成されている。上記凸曲面部20は、
その一側面が凸曲面21をなし、また背面22が
その凸曲面21と鋭角に交差する傾斜面で構成さ
れており、一対の遮光部14は、この凸曲面21
がレーザ光の走査方向外側方に向けて、背面22
が互に対向する如く配置されている。 Each of the pair of light shielding bodies 14 includes a base body 19 and a convex curved surface portion 20 that is integral with the base body 19 and protrudes from one end thereof in the four directions of the scanning optical system, and is made of oxygen-free copper. . The convex curved surface portion 20 is
One side of the convex curved surface 21 is formed, and the back surface 22 is an inclined surface that intersects the convex curved surface 21 at an acute angle.
is facing outward in the scanning direction of the laser beam, and the rear surface 22
are arranged so as to face each other.
上記凸曲面部20の凸曲面21は、振られたレ
ーザ光の一部すなわち走査方向両端部のレーザ光
を反射させるように鏡面をなし、かつ第2図に示
すように、先端部が基体19上面の延長上に中心
をもつ所定半径rの円筒面23で構成され、その
基体19側(円筒面の半径rが基体19上面と角
度αをなす点から基体19までその接線24を含
む平面で構成され、破線25で示すように入射し
たレーザ光を発散する如く反射する。また背面2
2は、偏向されたレーザ光に沿つて傾斜し、その
傾斜は基体19の一端面におよび、この面に振ら
れたレーザ光が入射しても、ごくわずかしか入射
しないようになつている。 The convex curved surface 21 of the convex curved surface portion 20 has a mirror surface so as to reflect a part of the deflected laser light, that is, the laser light at both ends in the scanning direction, and as shown in FIG. It is composed of a cylindrical surface 23 having a predetermined radius r and whose center is on an extension of the upper surface, and the base 19 side thereof (from the point where the radius r of the cylindrical surface makes an angle α with the upper surface of the base 19 to the base 19 is a plane including the tangent 24 thereof). It reflects the incident laser beam in a diverging manner as shown by the broken line 25.
2 is inclined along the deflected laser beam, and the inclination extends to one end surface of the base 19, so that even if the deflected laser beam is incident on this surface, only a small amount will be incident thereon.
また上記一対の各レーザ光吸収部15は、上記
遮光部14の凸曲面部20と同一幅をもつL字形
ブロツク状に形成され、その内側に形成された凹
曲面27が上記凸曲面部20の凸曲面21と対向
するように遮光体14の基体19に一体に取り付
けられている。この基体19に取り付けられた一
対のレーザ光吸収部15の上端部の端面間隔D
は、凸曲面部20の先端部間隔dよりも広く(D
>d)、かつその端面は、上記凸曲面部20の背
面22とほぼ同じ角度で傾斜し振られたレーザ光
の入射をさまたげないようになつている。 Further, each of the pair of laser light absorbing sections 15 is formed in an L-shaped block shape having the same width as the convex curved surface section 20 of the light shielding section 14, and the concave curved surface 27 formed inside the L-shaped block has the same width as the convex curved surface section 20 of the above-mentioned light shielding section 14. It is integrally attached to the base body 19 of the light shielding body 14 so as to face the convex curved surface 21 . End face distance D between the upper ends of the pair of laser light absorbers 15 attached to this base 19
is wider (D
>d), and its end face is inclined at approximately the same angle as the back surface 22 of the convex curved surface portion 20 so as not to obstruct the incidence of the deflected laser light.
上記凹曲面27は、上記凸曲面部20の凸曲面
21で反射されたレーザ光を吸収させるための面
であり、この反射レーザ光を有効に吸収するよう
に、粗面化された耐熱性黒色被膜で覆われてい
る。また、このレーザ光吸収部15の内部には、
第3図に示すように、このレーザ光吸収部15の
幅方向両側面部に取り付けられた導管28に連通
する中空部29が設けられている。この導管28
および中空部29は、上記凹曲面27のレーザ光
吸収による発熱を放散させるための熱交換部であ
り、冷却媒体が流通する。 The concave curved surface 27 is a surface for absorbing the laser beam reflected by the convex curved surface 21 of the convex curved surface portion 20, and is a heat-resistant black surface that is roughened so as to effectively absorb this reflected laser beam. covered with a membrane. Moreover, inside this laser light absorption section 15,
As shown in FIG. 3, hollow portions 29 are provided that communicate with conduits 28 attached to both side surfaces in the width direction of the laser light absorbing portion 15. As shown in FIG. This conduit 28
The hollow portion 29 is a heat exchange portion for dissipating heat generated by absorption of laser light by the concave curved surface 27, and a cooling medium flows therethrough.
支持体16は、中央部に開孔31に形成された
底板32と、この底板32の周辺部上に取り付け
られた各一対の端部ブロツク33および側部ブロ
ツク34からなる。上記レーザ光吸収部15が一
体に取り付けられた一対の遮光部14の各基体1
9は、この支持体16の底板32上に支持され、
かつ側部ブロツク34をガイドとしてこの底板3
2上を任意に変位できるようになつている。 The support 16 consists of a bottom plate 32 having an aperture 31 formed in its center, and a pair of end blocks 33 and side blocks 34 mounted on the periphery of the bottom plate 32. Each base 1 of a pair of light shielding parts 14 to which the laser light absorbing part 15 is integrally attached
9 is supported on the bottom plate 32 of this support 16,
and this bottom plate 3 using the side block 34 as a guide.
2 can be moved arbitrarily.
調整機構17は、上記一対の端部ブロツク33
を回転自在に貫通して、先端部が上記一対のレー
ザ光吸収部15にそれぞれ螺合する一対の調整ね
じ36を有する。各調整ねじ(36は、端部ブロ
ツク33を挟んで各調整ねじ36に取り付けられ
たストツプリング37で軸方向に移動しないよう
なつており、後端部のつまみ部38を回転するこ
とにより、一対のレーザ光吸収部15およびこれ
と一体の遮光部14を独立させることができ、ま
た一対の遮光部間隔dを任意に設定できるように
なつている。なお、第3図に示されている38
は、上記調整ねじ36の先端部が螺合するねじ孔
である。 The adjustment mechanism 17 includes the pair of end blocks 33
It has a pair of adjusting screws 36 that rotatably pass through the laser beam absorbing portion 15 and whose distal ends are screwed into the pair of laser light absorbing portions 15, respectively. Each adjusting screw (36) is prevented from moving in the axial direction by a stop ring 37 attached to each adjusting screw 36 with the end block 33 in between, and by rotating the knob 38 at the rear end, a pair of The laser light absorption section 15 and the light shielding section 14 integrated therewith can be made independent, and the distance d between the pair of light shielding sections can be set arbitrarily.
is a screw hole into which the tip of the adjustment screw 36 is screwed.
ところで上記のようにレーザ光カツト装置を構
成すると、相対向する一対の遮光部14により、
振られたレーザ光の走査方向両端部を確実に遮光
し、しかも振られたレーザ光に沿つて傾斜した凸
曲面部20の背面は、一対の遮光部14間を通つ
て被加工物Wに走査するレーザ光をさまたげない
ので、シヤープな走査領域が得られる。またこの
レーザ光カツト装置の凸曲面部20を構成する凸
曲面21がこの面に入射するレーザ光を発散する
ように反射するので、その反射光を吸収するレー
ザ光吸収部15の凹曲面27に対して、反射光の
局部的な集中をなくし、この凹曲面27の加熱に
対する負担を軽減する。また凸曲面部14の凸曲
面からなる反射面は、この面に入射するレーザ光
のスポツト径を大きくし、パワー密度の大きいレ
ーザ光に対しても損傷することなく、大出力レー
ザ光に対して十分に耐える。さらに、このレーザ
光カツト装置は、一対の遮光部14をそれぞれ独
立に動かすことができ、かつ一対の遮光部間隔d
を任意に調整でき、被加工物Wに対する走査領域
を容易に調整できるという便利さがある。 By the way, when the laser beam cutting device is configured as described above, the pair of opposing light shielding parts 14 allows
The back surface of the convex curved surface portion 20 that reliably blocks both ends of the deflected laser beam in the scanning direction, and is inclined along the deflected laser beam, passes between the pair of light blocking portions 14 to scan the workpiece W. Since the laser light is not obstructed, a sharp scanning area can be obtained. In addition, since the convex curved surface 21 constituting the convex curved surface section 20 of this laser beam cutting device reflects the laser beam incident on this surface in a diverging manner, the concave curved surface 27 of the laser beam absorption section 15 that absorbs the reflected light On the other hand, the local concentration of reflected light is eliminated, and the burden of heating this concave curved surface 27 is reduced. In addition, the reflective surface made of the convex curved surface of the convex curved surface portion 14 increases the spot diameter of the laser beam incident on this surface, and can withstand high power laser beams without being damaged even by laser beams with high power density. Tolerable enough. Further, in this laser beam cutting device, the pair of light shielding parts 14 can be moved independently, and the distance d between the pair of light shielding parts 14 is
can be arbitrarily adjusted, and the scanning area for the workpiece W can be easily adjusted.
被加工物を走査するように走査光学系により振
られたレーザ光をその走査方向外側方に発散する
如く遮光部の凸曲面部で反射させ、その反射光を
レーザ光吸収部の凹曲面で吸収するようにすると
ともに、凸曲面部の背面を振られたレーザ光に沿
つて傾斜させたので、パワー密度の大きいレーザ
光に対しても、損傷することなく走査方向両端部
のレーザ光を遮光でき、かつ被加工物上にシヤー
プな走査領域を形成することができる。また一対
の遮光部を任意に動かすことができるので、走査
領域を容易に調整することができる。
The laser beam swung by the scanning optical system to scan the workpiece is reflected by the convex curved surface of the light shielding part so as to diverge outward in the scanning direction, and the reflected light is absorbed by the concave curved surface of the laser light absorption part. In addition, since the back surface of the convex curved surface is tilted along the oscillating laser beam, the laser beam at both ends in the scanning direction can be blocked without being damaged even by laser beams with high power density. , and a sharp scanning area can be formed on the workpiece. Furthermore, since the pair of light shielding parts can be moved arbitrarily, the scanning area can be easily adjusted.
第1図ないし第4図はこの考案の一実施例説明
図で、第1図AおよびB図はそれぞれレーザ光カ
ツト装置の平面図および一部断面で示した正面
図、第2図はその遮光部の形状を示す断面図、第
3図AおよびB図はそれぞれレーザ光吸収部の断
面で示した正面図および一部断面で示した側面
図、第4図はレーザ光カツト装置の配置を示す
図、第5図は被加工物に対するレーザ光の走査方
法説明図、第6図はレーザ光による表面焼入状態
を示す断面図、第7図は従来の遮光板の配置およ
びその構成を示す図である。
4……走査光学系、10……レーザ光カツト装
置、12……レーザ発振器、14……遮光部、1
5……レーザ光吸収部、16……支持体、17…
…調整機構、20……凸曲面部、21……凸曲
面、22……背面、27……凹曲面、28……導
管、29……中空部、36……調整ねじ、W……
被加工物。
Figures 1 to 4 are explanatory diagrams of one embodiment of this invention, Figures 1A and B are a plan view and a partially sectional front view of the laser beam cutting device, respectively, and Figure 2 is its light shielding device. 3A and B are respectively a front view and a partially sectional side view of the laser beam absorbing section, and FIG. 4 is a diagram showing the arrangement of the laser beam cutting device. Fig. 5 is an explanatory diagram of a method of scanning a workpiece with a laser beam, Fig. 6 is a cross-sectional view showing the state of surface hardening by the laser beam, and Fig. 7 is a diagram showing the arrangement and configuration of a conventional light shielding plate. It is. 4... Scanning optical system, 10... Laser beam cutting device, 12... Laser oscillator, 14... Light shielding section, 1
5... Laser light absorption section, 16... Support body, 17...
... Adjustment mechanism, 20 ... Convex curved surface part, 21 ... Convex curved surface, 22 ... Back surface, 27 ... Concave curved surface, 28 ... Conduit, 29 ... Hollow part, 36 ... Adjustment screw, W ...
Workpiece.
Claims (1)
のレーザ発振器から放出されたレーザ光を振らせ
る走査光学系と、上記被加工物と上記走査光学系
との間に配設され、上記走査光学系により振られ
たレーザ光の両端部を遮光するレーザ光カツト装
置とを具備し、 上記レーザ光カツト装置は上記レーザ光の端部
をその外側方に発散する如く反射する鏡面からな
る凸曲面を有しかつこの凸曲面の背面が上記レー
ザ光に沿つて傾斜した一対の遮光部と、上記レー
ザ光の一対の遮光部間通過をさまたげないように
上記一対の遮光部の凸曲面に対向してこの凸曲面
で反射されたレーザ光を吸収する少くとも表面が
レーザ吸収部材で構成された凹曲面を有しかつこ
の凹曲面のレーザ光吸収による発熱を放散させる
熱交換部が一体に設けられた一対のレーザ光吸収
部と、上記各一対の遮光部およびレーザ光吸収部
を一体に変位させて上記一対の遮光部の相対向す
る背面間隔を調整する調整機構とから構成されて
いることを特徴とするレーザ加工装置。[Claims for Utility Model Registration] A laser oscillator, a scanning optical system that swings a laser beam emitted from the laser oscillator so as to scan a workpiece, and a space between the workpiece and the scanning optical system. and a laser beam cutting device arranged to block both ends of the laser beam swung by the scanning optical system, the laser beam cutting device reflecting the end portions of the laser beam so as to diverge outwardly. a pair of light shielding parts having a convex curved surface made of a mirror surface, the back surface of the convex curved surface being inclined along the laser beam; and a pair of light shielding parts configured to prevent the laser light from passing between the pair of light shielding parts. A heat exchanger having a concave curved surface, at least the surface of which is made of a laser absorbing member, which faces the convex curved surface and absorbs the laser light reflected by the convex curved surface, and which dissipates the heat generated by the absorption of the laser light by the concave curved surface. a pair of laser light absorbing parts integrally provided with a pair of laser light absorbing parts, and an adjustment mechanism that adjusts the spacing between opposing back surfaces of the pair of light shielding parts by integrally displacing each pair of the light shielding part and the laser light absorbing part. A laser processing device characterized in that:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985183020U JPH0114670Y2 (en) | 1985-11-29 | 1985-11-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985183020U JPH0114670Y2 (en) | 1985-11-29 | 1985-11-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6293359U JPS6293359U (en) | 1987-06-15 |
JPH0114670Y2 true JPH0114670Y2 (en) | 1989-04-28 |
Family
ID=31129366
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985183020U Expired JPH0114670Y2 (en) | 1985-11-29 | 1985-11-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0114670Y2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10235484A (en) * | 1997-02-24 | 1998-09-08 | Mitsubishi Electric Corp | Laser beam machine |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2716272B2 (en) * | 1991-01-08 | 1998-02-18 | 日本電気株式会社 | Laser processing equipment |
-
1985
- 1985-11-29 JP JP1985183020U patent/JPH0114670Y2/ja not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10235484A (en) * | 1997-02-24 | 1998-09-08 | Mitsubishi Electric Corp | Laser beam machine |
Also Published As
Publication number | Publication date |
---|---|
JPS6293359U (en) | 1987-06-15 |
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