JP3926503B2 - Laser processing machine - Google Patents

Laser processing machine Download PDF

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Publication number
JP3926503B2
JP3926503B2 JP08992999A JP8992999A JP3926503B2 JP 3926503 B2 JP3926503 B2 JP 3926503B2 JP 08992999 A JP08992999 A JP 08992999A JP 8992999 A JP8992999 A JP 8992999A JP 3926503 B2 JP3926503 B2 JP 3926503B2
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Japan
Prior art keywords
laser beam
aperture
window
cover
laser
Prior art date
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Expired - Fee Related
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JP08992999A
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Japanese (ja)
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JP2000280086A (en
Inventor
薫 松村
潔 山木
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Via Mechanics Ltd
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Hitachi Via Mechanics Ltd
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Priority to JP08992999A priority Critical patent/JP3926503B2/en
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Description

【0001】
【発明の属する技術分野】
本発明は、窓を備えたアパーチャにより、レーザ発振器から放射されたレーザビームを前記窓の大きさに制限するようにしたレーザ加工機に関する。
【0002】
【従来の技術】
例えば、レーザによりプリント基板に穴明けをするレーザ穴明け機では、加工精度および作業性を向上させるため、アパーチャによりレーザ発振器から放射されたレーザビームのビーム径を所定の大きさに整える。このようなレーザ加工機のアパーチャを図6、7により説明する。
図6は従来のレーザ穴明け機の光学系の全体構成図であり、図7は図6のA部断面図である。図で、1はレーザ発振器で、レーザビーム2を出力する。3a〜3cはミラーである。4はアパーチャで、レーザビーム2を透過させずかつ熱伝導率が大きい銅等の材質で形成されている。アパーチャ4は所定の位置に窓4a(この場合は円形の貫通穴で、直径は1〜8mm程度である。)を備え、レーザビーム2の入射側の側面4bは円錐面に形成されている。アパーチャ4は窓4aの軸心がレーザビーム2のビーム径の軸心に一致するように配置される。5はレンズ等からなる光学ユニット、6はプリント基板である。
【0003】
次に、従来のレーザ加工機の動作を説明する。
レーザ発振器1から放射されたレーザビーム2は、ミラー3a、3bにより直角に曲げられ、アパーチャ4に入射する。そして、窓4aを通過した通過ビーム2aは、ミラー3cにより直角に曲げられた後、光学ユニット5で集光され、プリント基板6に穴を加工する。また、側面4bで反射された反射ビーム2bは、レーザ発振器1以外の場所に反射され、反射ビーム2bによりレーザ発振器が破損することを防止する。なお、レーザ加工機全体が図示をしないカバーにより周囲から遮蔽されているから、反射ビーム2bがレーザ加工機の外部に漏れることはない。
【0004】
このように、レーザビーム2のビーム径を予め整えると、異なる穴径を加工する場合も、プリント基板6の表面からの光学ユニット5の高さを固定できる。この結果、穴の加工精度が向上するだけでなく、作業性も向上する。
【0005】
【発明が解決しようとする課題】
しかし、アパーチャ4が銅製である場合、反射ビーム2bのほとんどが側面4bで反射され、その勢力は衰えない。また、反射ビーム2bは指向性が高い。このため、レーザ出力にもよるが、レーザ加工機内の反射ビーム2bが入射する個所は徐々に加熱されて、局部的に150度Cに達する場合がある。例えば、加熱された個所がミラー3bの保持部であると、保持部が熱変形することによりミラー3bの位置がずれて、レーザビーム2の光軸が傾き、加工部に供給される加工エネルギが低下して、所望の加工を行うことができなくなる。
【0006】
本発明の目的は、上記従来技術における課題を解決し、アパーチャで反射されるレーザビームを適切に処理することができるレーザ加工機を提供するにある。
【0007】
【課題を解決するための手段】
上記の目的を達成するため、本発明は、窓を備えたアパーチャにより、レーザ発振器から放射されたレーザビームを前記窓の大きさに制限するようにしたレーザ加工機において、前記アパーチャの前記レーザビーム入射側の側面が前記窓の外縁から外周方向に前記レーザビーム入射方向下流側に対して角度θ(90°>θ≧45°)傾斜した円錐面に形成され、前記アパーチャを収納したカバーが、円筒状で、その内面は黒化処理された反射率の小さい材料からなり、前記アパーチャを前記カバー内に取り付けたときの当該カバーの前記レーザビーム入射方向最上流側の端部から前記アパーチャの窓の位置の前記レーザビームの光軸に沿った長さをL、前記カバーの内径をD、入射する前記レーザビームの直径をK、前記窓の最小直径をdとしたとき、
D>K
であって、前記角度θによって表される
L>(D−d)/2tan2θ
を満足する寸法に形成され、前記窓の中心と前記レーザビームの中心に一致させ、前記アパーチャで反射された前記レーザビームを前記カバーの内面に照射させることを特徴とする。
【0009】
【発明の実施の形態】
以下、本発明を図示の実施の形態に基づいて説明する。
図1は本発明に係るレーザ加工機の光学系の全体構成図、図2は図1のB視図、図3は図2のC−C断面図、図4は図3のD部拡大図であり、図6、7と同じものまたは同一機能のものは同一符号を付して説明を省略する。図で、10、11はアパーチャである。アパーチャ10は、図4に示すように、レーザビーム2の入射側の側面10bが窓10aの外縁から角度θ(図示の場合、θ=75度)の円錐面に形成され、外周には雄ねじ12が形成されている。なお、アパーチャ10と11は窓10a、11aおよび側面10b、11bの軸方向の長さが異なるが、他の寸法(外径、雄ねじ12の長さおよび角度θ等)は同一である。13は円筒形のカバーで、反射率が小さい材質、例えばカーボンで形成され、一方の内側端部に雄ねじ12と螺合する雌ねじ14が形成されている。カバー13はホルダ15の一方の側からホルダ15に密着するようにして挿入され、図示を省略する手段によりホルダ15に固定されている。16はホルダ15を貫通する冷却水通路で、接続端子17を介して図示を省略する冷却水循環装置に接続されている。18はサポートで、ホルダ15と一体であり、ボルト19によりエアシリンダ20のピストン21に固定されている。
【0010】
次に、各部の寸法について説明する。
カバー13の被覆長さL、すなわちアパーチャ10をカバー13に螺合させたときのカバー13の端部Mから窓10aの端部Nまでの距離と、カバー13の内径D、レーザビーム2の直径K、窓10aの最小直径dおよび角度θの間には下記式1〜3の関係がある。
(1)D>K 式1
(2)L>(D−d)/2・tan2θ 式2
(3)90>θ≧45 式3
次に、本実施の形態の動作を説明する。
予めエアシリンダ20を動作させ、窓10aと窓11aのいずれか一方の中心(ここでは窓10a)を、レーザビーム2の中心に一致させて位置決めする。レーザ発振器1から放射されたレーザビーム2は、ミラー3a、3bにより直角に曲げられ、アパーチャ10に入射する。そして、窓10aを通過した通過ビーム2aは、ミラー3cにより直角に曲げられた後、光学ユニット5で集光され、プリント基板6に穴を加工する。
【0011】
一方、反射ビーム2bは、上記式2、3の関係により、図4に示すように、最も中心側である窓10aの端部Nで反射された反射ビーム2bnもカバー13の内面に入射し、カバー13に吸収されて熱に変わる。カバー13は水冷されたホルダ15に密着して固定されているから、温度はほとんど上昇しない。また、アパーチャ10も雌ねじ14を介して冷却されるから、温度上昇値は小さく、窓10aの直径が熱により拡大することはない。
【0012】
なお、上記ではカバー13全体をカーボンとしたが、例えば、ホルダ15を銅製とし、反射ビーム2bが照射される部分に筒状のカーボンを圧入あるいは接着するようにしてもよい。また、カバー13とホルダ15を一体の銅製として、内面を黒化処理しても良いし、鉄製として内面を四三酸化鉄皮膜処理してもよい。
【0013】
また、上記実施の形態では、アパーチャの数を2個としたが、窓径の異なる多数のアパーチャを用意して切換え手段に保持させ、窓の中心をレーザビームの軸心に一致させるように構成すると、加工できる穴径の種類をさらに増やすことができる。
【0014】
また、角度θを90>θ≧45としたが、被覆長さLを長くできる場合には、θをできるだけ大きくして窓10a部の軸心方向の肉厚を厚くするようにすればアパーチャ10の寿命を長くすることができる。
【0015】
図5は本発明の他の実施の形態を示す図で、上記の図4に対応する図である。図で、30はエアノズルで、カバー13に固定されており、端部30aは図示を省略する圧縮空気源に接続されている。この実施の形態では、カバー13およびアパーチャ10を空気により冷却するので、装置構成が簡単になる。
【0016】
【発明の効果】
以上説明したように、本発明によればアパーチャで反射されたレーザビームを全てカバー円筒形内面に照射させるようにしたので、反射ビームを確実に吸収することが可能となり、この結果、レーザビームの光軸の狂い、レーザ加工機内の構成部品の変形などの発生を予防することができる。
【図面の簡単な説明】
【図1】本発明に係るレーザ加工機の光学系の全体構成図である。
【図2】図1のB視図である。
【図3】図2のC−C断面図である。
【図4】図3のD部拡大図である。
【図5】本発明の他の実施の形態を示す図である。
【図6】従来のレーザ穴明け機の光学系の全体構成図である。
【図7】図6のA部拡大図である。
【符号の説明】
2 レーザビーム
2b 反射ビーム
10 アパーチャ
10b 側面
13 カバー
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a laser beam machine in which a laser beam emitted from a laser oscillator is limited to the size of the window by an aperture having a window.
[0002]
[Prior art]
For example, in a laser drilling machine that drills a printed circuit board with a laser, the diameter of a laser beam emitted from a laser oscillator is adjusted to a predetermined size by an aperture in order to improve processing accuracy and workability. The aperture of such a laser beam machine will be described with reference to FIGS.
FIG. 6 is an overall configuration diagram of an optical system of a conventional laser drilling machine, and FIG. 7 is a cross-sectional view of section A in FIG. In the figure, reference numeral 1 denotes a laser oscillator which outputs a laser beam 2. Reference numerals 3a to 3c denote mirrors. Reference numeral 4 denotes an aperture, which is made of a material such as copper that does not transmit the laser beam 2 and has high thermal conductivity. The aperture 4 includes a window 4a (in this case, a circular through hole having a diameter of about 1 to 8 mm) at a predetermined position, and the side surface 4b on the incident side of the laser beam 2 is formed in a conical surface. The aperture 4 is disposed so that the axis of the window 4 a coincides with the axis of the beam diameter of the laser beam 2. Reference numeral 5 denotes an optical unit composed of a lens or the like, and 6 denotes a printed circuit board.
[0003]
Next, the operation of the conventional laser beam machine will be described.
The laser beam 2 emitted from the laser oscillator 1 is bent at a right angle by the mirrors 3 a and 3 b and enters the aperture 4. The passing beam 2a that has passed through the window 4a is bent at a right angle by the mirror 3c and then condensed by the optical unit 5 to process a hole in the printed circuit board 6. Further, the reflected beam 2b reflected by the side surface 4b is reflected to a place other than the laser oscillator 1 to prevent the laser oscillator from being damaged by the reflected beam 2b. Since the entire laser beam machine is shielded from the surroundings by a cover (not shown), the reflected beam 2b does not leak outside the laser beam machine.
[0004]
Thus, when the beam diameter of the laser beam 2 is adjusted in advance, the height of the optical unit 5 from the surface of the printed circuit board 6 can be fixed even when processing different hole diameters. As a result, not only the hole machining accuracy is improved, but also the workability is improved.
[0005]
[Problems to be solved by the invention]
However, when the aperture 4 is made of copper, most of the reflected beam 2b is reflected by the side surface 4b, and the power does not decay. Further, the reflected beam 2b has high directivity. For this reason, although it depends on the laser output, the portion of the laser beam machine where the reflected beam 2b is incident is gradually heated and may reach 150 degrees C locally. For example, if the heated part is the holding part of the mirror 3b, the position of the mirror 3b is shifted due to thermal deformation of the holding part, the optical axis of the laser beam 2 is inclined, and the processing energy supplied to the processing part is increased. As a result, the desired processing cannot be performed.
[0006]
An object of the present invention is to solve the above-described problems in the prior art and provide a laser beam machine capable of appropriately processing a laser beam reflected by an aperture.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides a laser beam machine in which a laser beam emitted from a laser oscillator is limited to a size of the window by an aperture having a window, and the laser beam of the aperture is provided. A side surface on the incident side is formed in a conical surface inclined at an angle θ (90 °> θ ≧ 45 °) from the outer edge of the window toward the outer peripheral direction toward the downstream side in the laser beam incident direction. It is cylindrical, and its inner surface is made of a blackened material with low reflectivity, and when the aperture is mounted in the cover, the window of the aperture from the end on the most upstream side in the laser beam incident direction of the cover The length along the optical axis of the laser beam at the position of L is L, the inner diameter of the cover is D, the diameter of the incident laser beam is K, and the minimum diameter of the window is d. When,
D> K
Where L> (D−d) / 2 tan 2θ expressed by the angle θ.
The laser beam reflected by the aperture is irradiated onto the inner surface of the cover so that the center of the window coincides with the center of the laser beam.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described based on the illustrated embodiments.
1 is an overall configuration diagram of an optical system of a laser beam machine according to the present invention, FIG. 2 is a view as viewed from B in FIG. 1, FIG. 3 is a cross-sectional view taken along a line CC in FIG. 6 having the same function or the same function as those in FIGS. In the figure, reference numerals 10 and 11 denote apertures. As shown in FIG. 4, the side surface 10b on the incident side of the laser beam 2 is formed as a conical surface at an angle θ (θ = 75 degrees in the figure) from the outer edge of the window 10a. Is formed. The apertures 10 and 11 are different in the axial lengths of the windows 10a and 11a and the side surfaces 10b and 11b, but the other dimensions (the outer diameter, the length of the male screw 12, the angle θ, etc.) are the same. Reference numeral 13 denotes a cylindrical cover, which is formed of a material having a low reflectivity, for example, carbon, and has an internal thread 14 that is engaged with the external thread 12 at one inner end. The cover 13 is inserted from one side of the holder 15 so as to be in close contact with the holder 15, and is fixed to the holder 15 by means not shown. Reference numeral 16 denotes a cooling water passage penetrating the holder 15, and is connected via a connection terminal 17 to a cooling water circulation device (not shown). Reference numeral 18 denotes a support which is integral with the holder 15 and is fixed to the piston 21 of the air cylinder 20 by a bolt 19.
[0010]
Next, the dimension of each part is demonstrated.
The covering length L of the cover 13, that is, the distance from the end M of the cover 13 to the end N of the window 10 a when the aperture 10 is screwed to the cover 13, the inner diameter D of the cover 13, and the diameter of the laser beam 2. There is a relationship of the following formulas 1-3 between K, the minimum diameter d of the window 10a, and the angle θ.
(1) D> K Formula 1
(2) L> (D−d) / 2 · tan 2θ Equation 2
(3) 90> θ ≧ 45 Equation 3
Next, the operation of the present embodiment will be described.
The air cylinder 20 is operated in advance, and the center of one of the window 10a and the window 11a (here, the window 10a) is positioned so as to coincide with the center of the laser beam 2. The laser beam 2 emitted from the laser oscillator 1 is bent at right angles by the mirrors 3 a and 3 b and enters the aperture 10. The passing beam 2a that has passed through the window 10a is bent at a right angle by the mirror 3c and then condensed by the optical unit 5 to process a hole in the printed circuit board 6.
[0011]
On the other hand, as shown in FIG. 4, the reflected beam 2b is also incident on the inner surface of the cover 13 as reflected by the end N of the window 10a which is the most central side, as shown in FIG. It is absorbed by the cover 13 and turns into heat. Since the cover 13 is fixed in close contact with the water-cooled holder 15, the temperature hardly rises. Further, since the aperture 10 is also cooled through the female screw 14, the temperature rise value is small, and the diameter of the window 10a does not expand due to heat.
[0012]
In the above description, the entire cover 13 is made of carbon. However, for example, the holder 15 may be made of copper, and cylindrical carbon may be press-fitted or bonded to a portion irradiated with the reflected beam 2b. Further, the cover 13 and the holder 15 may be made of integral copper, and the inner surface may be blackened, or the inner surface may be made of iron and the iron trioxide film may be treated.
[0013]
In the above embodiment, the number of apertures is two. However, a large number of apertures having different window diameters are prepared and held by the switching means, and the center of the window is aligned with the axis of the laser beam. Then, the kind of hole diameter which can be processed can be increased further.
[0014]
Further, the angle θ is set to 90> θ ≧ 45. However, when the covering length L can be increased, the aperture 10 can be increased by increasing θ as much as possible to increase the axial thickness of the window 10a. Can extend the lifetime of
[0015]
FIG. 5 is a diagram showing another embodiment of the present invention and corresponds to FIG. 4 described above. In the figure, reference numeral 30 denotes an air nozzle, which is fixed to the cover 13, and the end 30a is connected to a compressed air source (not shown). In this embodiment, since the cover 13 and the aperture 10 are cooled by air, the apparatus configuration is simplified.
[0016]
【The invention's effect】
As described above, according to the present invention, since the record Zabimu reflected by the aperture so as to irradiate the cover all the cylindrical inner surface, it is possible to reliably absorb the reflected beam, this result, the laser beam It is possible to prevent the occurrence of the optical axis deviation and the deformation of the components in the laser processing machine.
[Brief description of the drawings]
FIG. 1 is an overall configuration diagram of an optical system of a laser beam machine according to the present invention.
FIG. 2 is a view as seen from B in FIG.
FIG. 3 is a cross-sectional view taken along the line CC of FIG.
4 is an enlarged view of a portion D in FIG. 3;
FIG. 5 is a diagram showing another embodiment of the present invention.
FIG. 6 is an overall configuration diagram of an optical system of a conventional laser drilling machine.
7 is an enlarged view of a part A in FIG. 6;
[Explanation of symbols]
2 Laser beam 2b Reflected beam 10 Aperture 10b Side surface 13 Cover

Claims (1)

窓を備えたアパーチャにより、レーザ発振器から放射されたレーザビームを前記窓の大きさに制限するようにしたレーザ加工機において、
前記アパーチャの前記レーザビーム入射側の側面が前記窓の外縁から外周方向に前記レーザビーム入射方向下流側に対して角度θ(90°>θ≧45°)傾斜した円錐面に形成され、
前記アパーチャを収納したカバーが、円筒状で、その内面は黒化処理された反射率の小さい材料からなり、前記アパーチャを前記カバー内に取り付けたときの当該カバーの前記レーザビーム入射方向最上流側の端部から前記アパーチャの窓の位置の前記レーザビームの光軸に沿った長さをL、前記カバーの内径をD、入射する前記レーザビームの直径をK、前記窓の最小直径をdとしたとき、
D>K
であって、前記角度θによって表される
L>(D−d)/2tan2θ
を満足する寸法に形成され、前記窓の中心と前記レーザビームの中心に一致させ、前記アパーチャで反射された前記レーザビームを前記カバーの内面に照射させることを特徴とするレーザ加工機。
In a laser processing machine in which a laser beam emitted from a laser oscillator is limited to the size of the window by an aperture having a window,
The side surface of the aperture on the laser beam incident side is formed as a conical surface inclined at an angle θ (90 °> θ ≧ 45 °) with respect to the downstream side of the laser beam incident direction from the outer edge of the window toward the outer periphery.
The cover containing the aperture has a cylindrical shape, and its inner surface is made of a blackened material with a low reflectivity, and when the aperture is mounted in the cover, the laser beam incident direction most upstream side of the cover L is the length along the optical axis of the laser beam from the end of the aperture along the optical axis of the laser beam, D is the inner diameter of the cover, K is the diameter of the incident laser beam, and d is the minimum diameter of the window. When
D> K
Where L> (D−d) / 2 tan 2θ expressed by the angle θ.
The laser processing machine is characterized in that the laser beam is formed to have a size satisfying the above condition, coincides with the center of the window and the center of the laser beam, and irradiates the inner surface of the cover with the laser beam reflected by the aperture.
JP08992999A 1999-03-30 1999-03-30 Laser processing machine Expired - Fee Related JP3926503B2 (en)

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US7057134B2 (en) 2003-03-18 2006-06-06 Loma Linda University Medical Center Laser manipulation system for controllably moving a laser head for irradiation and removal of material from a surface of a structure
EP1766442A1 (en) * 2004-04-05 2007-03-28 Micronic Laser Systems Ab Aperture stop assembly for high power laser beams
KR100812582B1 (en) * 2004-04-05 2008-03-13 마이크로닉 레이저 시스템즈 에이비 Aperture stop assembly for high power laser beams
KR101684485B1 (en) * 2014-12-22 2016-12-09 재단법인 포항산업과학연구원 Laser Welding Device and Welding Method of Thin Plate Using Laser Welding Device
DE102021112833A1 (en) 2021-05-18 2022-11-24 Precitec Gmbh & Co. Kg Aperture for a laser processing head

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