JP2000277882A - Flexible printed board with contact - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a flexible printed board with contact which can attain bonds with a high connect reliability with fine terminals containing Au at least in the surface portions, including bonds with terminals of a suspension board with circuits in a hard disc drive. SOLUTION: A conductive pattern 2 is provided in an insulator layer 1, and bump contacts 3 are provided at positions corresponding to outer terminals on one surface 1a of the insulator layer 1 and connected to the inner conductor pattern 2 through conductive paths 4. An Au layer 3a is provided on the surfaces of the bump contacts 3. Openings 5 are formed at positions corresponding to the contacts 3 at the back sides into the other surface 1b of the insulator layer 1, thereby exposing the conductor pattern 2 in the openings 5. The opening 5 is used as a bonding ultrasonic wave injection hole, to thereby obtain a good bond state with an Au-plated terminal of an object.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention belongs to the technical field of a flexible printed circuit board having contacts. In particular, the usefulness of the present invention is remarkable because relays used near magnetic heads of hard disk drivers, which require a fine pitch and strict connection reliability under vibration while transmitting a specific signal current The technical field of circuit boards.

[0002]

2. Description of the Related Art Hard disk drivers, which are one type of magnetic storage devices for computers, have made remarkable technological advances in terms of speeding up, increasing density, and increasing capacity. Magnetic heads for reading and writing include a thin-film magnetic head (TFH) in which the coil portion is made thinner than a conventional metal-in-gap (MIG), and a reading / writing dual-purpose magnetic head with dramatically increased storage capacity. Large thin film-magnetoresistive composite heads (MRH) are being used.

A magnetic head in a hard disk driver must perform reading and writing without making contact with the surface of a magnetic disk that rotates at a high speed while maintaining a minute interval on the order of submicrons. A suspension board is used to elastically press the magnetic head toward the magnetic disk surface while resisting the air flow generated in the minute gap at that time, and to maintain the gap. The suspension board is a kind of leaf spring-shaped cantilever made of an elastic metal foil such as a stainless steel foil, and a magnetic head is attached to a tip portion thereof. Control wiring is laid from the main unit side of the device to the magnetic head at the tip, so that this wiring does not affect the elasticity of the suspension board.
In recent years, as shown by reference numeral 50 in FIG.
A suspension board with circuit formed as described above has been put to practical use.

[0004] A carriage assembly is provided as a mechanism for moving the suspension board with magnetic head / circuit with respect to the magnetic disk precisely and accurately. The mechanism of the carriage assembly is generally a kind of swing arm mechanism, which extends an arm from the base end located near the outside of the magnetic disk toward the center of the magnetic disk to control the motor at the base end. Thus, the distal end of the arm can be freely moved. The above-mentioned suspension board with circuit is attached to the tip of this arm. Due to the rigidity of the arm and the elasticity of the suspension board with circuit, the magnetic head can be preferably moved while maintaining a minute constant spacing with respect to the surface of the magnetic disk.

On the circuit side, a control circuit board for sending a read / write signal to the magnetic head and operating the magnetic head is provided near the base end of the carriage assembly. Normally, as shown in FIG. 9A, a connection relay is provided between the control circuit board 30 at the base end and the suspension board with circuit 50 at the front end, as shown in FIG. And a flexible printed circuit board (hereinafter, relay FPC) 40 for connection.

As shown in FIG. 9A (the arm of the carriage assembly is not shown), the relay FPC 40
Is a thin and narrow band-shaped flat cable provided along the arm from the base end to the distal end of the arm, and has a required number of circuit patterns 43 in the insulating layer 44. At both ends of the relay FPC 40, a plurality of contacts 41 and 42 for connecting to the terminals of the control circuit board 30 and the terminals of the suspension board with circuit 50, respectively, are provided. These contacts conduct with the internal circuit pattern 43,
Are in contact with each other.

Terminal 5 of suspension board with circuit 50
1 is usually gold plated. With respect to this gold-plated terminal, the contact 42 of the conventional relay FPC 40 is formed as a contact (so-called bump contact) projecting in a hemispherical shape. As shown in FIG. 9B, a deep portion 421 serving as a base of the bump contact is usually formed of copper or nickel, and the surface thereof is provided with a pre-soldering for improving the connectivity by melting. Layer 422 is pre-coated. The pre-coating of a preliminary solder layer on the bump contact surface is described in detail in JP-A-10-256688.

[0008]

However, the present inventors have examined in detail the bonding state between a pre-coated bump contact of a preliminary solder layer and a gold-plated terminal as in the prior art. I found that there was a problem to be solved. First, when the solder 422 on the surface of the bump contact in FIG. 9B is melted, it spreads in a skirt shape on the surface of the terminal as shown in FIG. 9C, so that a plurality of terminals are arranged at a fine pitch and approach each other. In this case, the spread solder 422 causes a short circuit between the wirings. Next, since the joint between the bump contact and the terminal becomes a joint between the solder and gold, a solder / gold eutectic is generated and embrittlement is likely to occur. In some cases, conduction failure may occur. In addition, even if it is in a conductive state at the time of joining, when an external force is applied, cracks become large,
In some cases, conduction may be interrupted.

In addition to the above connection, a relay FPC
There is also a method in which the insulating layer 40 is partially removed to expose a section of the circuit pattern to form a beam-shaped contact called a flying lead, which is bent and connected to a partner terminal. However, since the flying lead has a thin wire, it is easily broken during handling or crimping to a terminal, and coating with a resin for reinforcement has been proposed. .

The present invention solves the above problem and achieves not only bonding with terminals of a suspension board with a circuit in a hard disk drive but also bonding with fine terminals having at least a surface layer of gold with high connection reliability. To provide a flexible printed circuit board with contacts.

[0011]

The flexible printed circuit board with contacts (hereinafter, also referred to as "FPC with contacts") of the present invention has the following features.

(1) A flexible printed circuit board having bump contacts for connection to external terminals having at least a surface layer made of gold, wherein a conductor pattern is provided inside an insulator layer, and one surface of the insulator layer is provided on one side of the insulator layer. A bump contact is provided at a position corresponding to the external terminal, the bump contact has at least a surface layer of gold and is connected to a conductive pattern by a conductive path, and the other surface of the insulator layer has a bump contact. An opening is provided at a position corresponding to the contact on the back surface, and the conductive pattern is exposed inside the opening.

(2) One opening is provided independently of the one bump contact, and inside the opening,
The flexible printed circuit board with contacts according to the above (1), wherein one conductor pattern connected to the bump contact is exposed.

(3) The flexible printed circuit board with contacts according to the above (1), wherein a metal is further filled in the opening.

(4) At least one of the insulator layers
The contact-provided flexible printed circuit board according to the above (1), wherein a portion around the bump contact and bonded to an external substrate supporting the external terminal has an adhesive property.

(5) The external terminal is a gold-plated terminal provided on a suspension board with a circuit on which a magnetic head of a hard disk driver is mounted, and the flexible printed board with contacts is the suspension board with a circuit, and a magnetic head. (1) which is used for relaying connection with a control circuit board for operating
Flexible printed circuit board with contacts as described.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An FPC with contacts according to the present invention is shown in FIG.
As shown in (b), the structure has a structure in which a conductor pattern 2 is provided inside an insulator layer 1. On one surface 1a of the insulator layer 1, a bump contact 3 is provided at a position corresponding to an external terminal. This bump contact 3 is a surface layer 3 made of gold.
a in the example shown in FIG.
b and a surface layer 3a. Bump contact 3
Are connected to the conductor pattern 2 immediately below the inner direction by the conduction path 4. On the other surface 1b of the insulator layer 1, an opening 5 is provided at a position corresponding to the back surface of the bump contact, and the conductor pattern 2 is exposed inside the opening. The bump contact 3 is a connection target that has at least a surface layer of gold, such as a gold-plated terminal or a gold-shaped contact. The FPC with contacts has at least a structure at one end shown in FIG. 1B, and a preferred embodiment at the other end will be described later.

With such a configuration, first, the bonding between the bump contact of the FPC with the contact and the terminal on the other side is the bonding between gold and gold. In addition, Figure 1
As shown in (a), the bump contact 3 is connected to the terminal 51 of the other party.
In the state of contact with the opening 5, as shown in FIG.
By inserting a bonding tool T into the conductor pattern and injecting ultrasonic energy into the conductor pattern, the bump contact 3 and the partner terminal 51 can be brought into a preferable bonding state by welding gold to gold. That is, the feature of the present invention lies not only in the bonding between gold and gold, but also in a preferable ultrasonic bonding state due to the opening structure. The portion where the gold contacts are welded to each other by the ultrasonic wave is not in a state in which the solder layer 422 is spread in a skirt shape as shown in FIG. 9B, and is a preferable joint within a range smaller than the outer shape of the bump contact. No embrittlement occurs.

As described above, the FPC with contacts of the present invention is intended to be connected to at least one having a surface layer made of gold, but the usefulness of the present invention is most remarkable.
As shown as A in FIG. 1A, this is a case where a gold-plated terminal 51 of a suspension board with circuit 50 on which a magnetic head 60 of a hard disk driver is mounted is to be connected. Hereinafter, preferred embodiments of each part will be described in order while explaining the manufacturing method.

In order to form a conductor pattern inside the insulator layer, as shown in FIGS. 2A to 2C, a conductor pattern 2 is formed on the first insulating layer 11 and the conductor pattern 2 is formed. Is preferably coated with the second insulating layer 12. More specifically, for example, as shown in FIG. 2A, the first insulating layer 11 is used as a base film,
2 is prepared, and the conductive layer 21 is patterned into a conductor pattern as shown in FIG. 2B, and the conductor pattern is formed by the second insulating layer 12 as shown in FIG. Is covered. In addition, FIG.
In order to reach the embodiment shown in (1), a known method such as an additive method and a subtractive method may be used.

The thickness of the first insulating layer and the second insulating layer is 5
１００100 μm, preferably 5-50 μm. As the material of the first insulating layer and the second insulating layer, a material used for a known FPC may be used, but a polyimide resin is preferable in terms of mechanical strength and electrical characteristics. Also, both materials are
The same material or different materials may be used.

Since the first insulating layer is first laminated with the conductor layer (or conductor pattern), its outer surface 1a becomes flat as shown in FIG. On the other hand, since the outer surface 1b of the second insulating layer 12 is formed after the formation of the conductor pattern 2, the outer surface 1b is affected by the conductor pattern 2 and has irregularities. Therefore, it is more preferable that the flat outer surface 1a side of the first insulating layer be the side on which the bump contact is provided.

The insulating layer on the side where the bump contacts are provided may be made of a material having a property such as adhesiveness, which is preferable for bonding with a mating substrate. Further, an adhesive layer may be further laminated on the surface of the insulating layer on the side where the bump contact is provided. FIG.
In the example of (d), the adhesive layer 6 is laminated on the outer surface 1a of the first insulating layer 11.

When a material having adhesiveness is used for the first insulating layer, the material is preferably a heat-fusible polyimide. When forming the adhesive layer, the material is thermoplastic polyimide,
Thermoplastic polyamic acids. The method of forming the adhesive layer on the first insulating layer includes a method of applying a solution of the resin, a method of thermocompression bonding a sheet of the resin, a method of wetting the surface of the resin sheet with a solvent and bonding the same. No.

Although the pattern of the conductor pattern itself is not limited, the flexible printed circuit board with the contact is
In a carriage assembly of a hard disk driver, when used for relaying a connection between a suspension board with a circuit and a control circuit board, a main portion of the pattern excluding both ends is formed from a base end of an arm of the carriage assembly to a tip end. A plurality of conductors form a flat cable-like pattern extending in parallel over the portion. The patterns at both ends are patterns according to the arrangement of the terminals of the partner and the positions of the terminals of the partner with respect to the longitudinal direction of the arm. Although the number of conductors required for one magnetic head is four in MRH or the like generally used at present, the required number of circuits may be set according to the technological progress of the magnetic head.

The material of the conductor pattern is copper, nickel,
Any known good conductor metal used for FPC, such as gold, solder, or an alloy thereof, may be used. The thickness of the conductor pattern is 1 to 50 μm, preferably 2 to 35 μm. The pitch of the conductor pattern (the width of one conductor + the width of the gap between conductors) is about 10 to 300 μm, about 100 μm for a normal one, and about 30 μm for a fine pitch.
m.

Next, as shown in FIG. 2E, from the surface of the first insulating layer (in the figure, from the surface of the adhesive layer 6 because the adhesive layer 6 is present), a terminal to be connected is connected. An opening 7 is formed at a position corresponding to, and the conductive pattern 2 is exposed on the inner bottom surface thereof. In the position corresponding to the back side of the opening 7,
An opening 5 is formed from the surface of the second insulating layer, and the conductive pattern 2 is exposed on the inner bottom surface.

The opening 7 is an opening which becomes a conductive path by being filled with metal, and one opening corresponds to one circuit (one conductor pattern) so as not to short-circuit between the circuits.
The opening diameter is preferably about 10 to 200 μm.

As shown in FIG. 4A, a normal arrangement of the openings 7 is such that the openings 7 are arranged on a straight line intersecting at right angles to the longitudinal direction of the flat cable-shaped conductor pattern. When the conductor pattern has a fine pitch, taking into account the correspondence with the terminal to be connected, as shown in FIG. And the distance between adjacent contacts may be increased.

The opening 5 is a hole into which ultrasonic energy for injecting a bump contact and a partner terminal is injected. Therefore, it is not always necessary to make one opening correspond to one circuit, and an appropriate opening may be formed in consideration of the injection property of ultrasonic energy such as insertion of a bonding tool. For example, as shown in FIG. 6 (a), one conductor pattern is exposed in one opening, as shown in FIG. 6 (b), all conductor patterns are exposed in one opening, In addition, one for each of the 2-3 conductor patterns
There are various types such as providing one opening. The opening shape is circular,
It is arbitrary such as a square. In the mode shown in FIG. 6A, when the bonding tool is brought into contact with the conductor pattern, the position of the conductor pattern can be clearly recognized by the opening, so that the alignment between the bonding tool and the conductor pattern by image processing becomes easy. This is a preferred mode because the opening also serves as a guide to the conductor pattern.

In the case of the embodiment shown in FIG. 6A, a hard material that can preferably transmit ultrasonic vibrations to the conductor pattern may be provided on the surface of the conductor pattern to form a conduction path for ultrasonic waves.
As a method for forming such a conductive path, for example, metal plating on the conductor pattern surface can be mentioned. When metal plating is performed on the conductor pattern surface, the metal m is deposited to an arbitrary height in the opening 5 as shown in FIG.
As shown in FIG. 7 (b), there is a mode of depositing up to the height of the entrance of the opening, or as shown in FIG. 7 (c), a mode of depositing up to the height protruding from the outer surface 1b of the second insulating layer 12. Can be Such an embodiment is preferable when the diameter of the opening is too small to insert the bonding tool.
Further, in order to prevent oxidation of the metal m of the conductive path, the surface layer of each of the conductive paths shown in FIGS.
As shown in (a) to (c), a mode in which a gold layer is used may be used.

The position of the opening 5 may be any position corresponding to the bump contact on the back surface. However, the expression that the opening corresponds to the bump contact on the back surface means that when the outline of the bump contact is projected on the back surface, Not only strict correspondence such as matching the centroid, but also correspondence such that there is a deviation between the positions within a range where the ultrasonic wave effectively acts on the bump contact from the back surface.

The method for forming the opening 7 for the conduction path and the opening 5 for injecting ultrasonic energy is not limited, and any known method for forming an opening for a resin such as laser ablation, chemical etching, or plasma etching may be used. . In particular, the opening 7 for the conduction path has a small opening diameter, and in consideration of the effect on the bump contact height, it is preferable to perform a precise machining that is sharply dug down from the base of the opening. is there.

The order and steps of forming these openings are not limited. For example, if the second insulating layer shown in FIG. 2C is formed by an additive method, a layer having an opening is formed from the beginning.
Alternatively, a processing procedure may be used in which an opening is formed after the insulating layer is formed in a precursor state, and the insulating layer is subjected to a predetermined treatment to obtain a final material. In addition, an insulating layer may be formed as a final material, and then an opening may be formed at an arbitrary stage.

Next, as shown in FIG. 2 (f), the metal is filled in the opening 7 by electroplating using the conductor pattern 2 as a cathode to form a conductive path. The base portion (deep layer) 3b of the bump contact is formed by projecting from the surface of the insulating layer (the adhesive layer in the figure). Further, the surface layer 3a made of gold is formed to obtain the FPC with contacts of the present invention. As a method for forming the surface layer 3a, gold plating is preferable.

The material of the conductive path is preferably an inexpensive good conductor metal, and examples thereof include copper, nickel, and nickel alloy. It is preferable that the material of the conductive path has crystallographic consistency with the material of the conductor pattern, has good adhesion, and is hardly diffused. For example, if the material of the conductor pattern is copper, the material of the conductive path for this is
Copper, nickel, and nickel alloys are preferred combinations.

The shape of the bump contact may be a bump contact 3 shown in FIG. 2 (f), as shown in FIG. As in the case of 3, the protrusion may be minutely protruded without expanding from about the hole diameter of the opening. The basic portion 3b of the bump contact is not necessarily required to be protruded, and the end surface of the conduction path may be regarded as the basic portion 3b of the bump contact and protruded on the gold surface layer 3a thereon. Further, as shown in FIG. 5, the base portion 3b of the bump contact is formed by the first insulating layer 1
1 may be lower than the surface 1a and protrude from the gold surface layer 3a. The outer diameter of the bump contact is 10 to 200 μm, preferably 20 to 100 μm. The height of the bump contact when the surface of the first insulating layer (and the surface of the adhesive layer, if any) is used as a reference plane is 10 to 200 μm, preferably about 10 μm.

The material of the base portion 3b of the bump contact 3 may be the same as the material of the conductive path, or may be changed from the time of projecting. For example, the conduction path is made of copper, and the base portion 3b is made of nickel. The thickness of the gold surface layer is about 1 to 10 μm, preferably 1 to 10 μm from the viewpoint of connection reliability.
About 5 μm.

As described in the description of the related art, the other end side (base end side) of the FPC with contacts is preferably such that the conductor pattern is formed by a control circuit board provided near the base end of the carriage assembly. An aspect in which the bump contact 8 is provided as shown in FIG. 1A or an aspect in which various connection structures are provided so as to enable connection may be employed.

[0040]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In the present invention, an FPC with contacts used for relaying connection between a suspension board with circuit and a control circuit board in a hard disk driver was actually manufactured. The shape of the main part of the FPC with contacts except for both ends is a substantially linear strip shape, but the shape of both ends is slightly modified to a shape corresponding to the connection with the other party. Have been. Here, a detailed description of both ends will be omitted, and a description will be given assuming that the entire shape including both ends is a simple rectangular band.

First, as shown in FIG.
After coating polyamic acid, drying and curing are performed on a strip-shaped copper foil 21 having a thickness of 250 μm and a width of 250 mm and a total length of 100 m, a first insulating layer 11 made of polyimide and having a thickness of 25 μm is formed. did.

Next, as shown in FIG. 2B, by a known etching method (subtractive method), four conductors each having a predetermined length extend in parallel with the longitudinal direction of the laminated body. Pattern 2 was obtained.

Next, as shown in FIG. 2C, a polyamic acid film is bonded to cover the conductor pattern 2,
At this time, the opening 5 (pore diameter 100 μm) shown in FIG.
Was first formed by chemical etching, and the conductor pattern 2 was exposed on the inner bottom surface thereof. In the present embodiment, the openings correspond to the conductor patterns on a one-to-one basis. Thereafter, the resultant was cured to form a second insulating layer 12 made of polyimide and having a thickness of 12.5 μm. The position of the opening 5 corresponds to a position directly behind the opening 7 described later. In the present embodiment, FIG.
Was not provided.

Next, as shown in FIG. 2E, the surface of the first insulating layer 11 is irradiated with a YAG 355 nm laser at a position corresponding to a gold-plated terminal of a suspension with a circuit to be connected, with a hole diameter of 50 μm. An opening 7 was formed, and the conductor pattern 2 was exposed on the inner bottom surface.

Next, as shown in FIG. 2 (f), the opening 7 is filled with copper by electroplating using the conductor pattern 2 as a cathode to form a conductive path. The base portion 3b of the bump contact was formed by projecting from the surface of the insulating layer 11 by 5 μm. In addition, a 3 μm thick gold
Precipitated into the surface layer 3a, the outer shape is cut into a predetermined shape,
An FPC with a contact of the present invention was obtained.

Using this FPC with contacts, FIG.
As shown in the figure, when the bonding with the gold-plated terminal of the suspension with a circuit was attempted using a bonding tool connected to the ultrasonic transducer, the bonding did not appear to spread like a skirt in appearance, but the bump The joint was formed near the top of the contact, and as a result of a fracture test of the joint surface, it was found that there was no destruction at the joint and a favorable joint state without embrittlement. Further, n = 1000 of these samples were manufactured, and the short circuit between the adjacent circuits was examined. However, there was no example in which the gold at the bonding portion was widened and the adjacent contacts were short-circuited. From these, it was found that the FPC with contacts according to the present invention can achieve connection with high connection reliability to the gold-plated terminal of the suspension with circuit.

[0047]

As described above, the F with contact of the present invention is used.
The PC uses gold for the surface layer of the bump contact and has an opening structure, so that the bump contact and the partner terminal can form a preferable joint between the gold surface layers by ultrasonic welding. Was. In particular, in connection between a suspension board with a circuit of a hard disk driver and a control circuit board, both fine pitch and high connection reliability are required. According to the present invention, a connection relay contact that can sufficiently cope with them. Attached FPCs can now be provided.

[Brief description of the drawings]

FIG. 1 is a sectional view showing the structure of an FPC with contacts of the present invention.

FIG. 2 is a diagram illustrating an example of a manufacturing process of the FPC with contacts of the present invention.

FIG. 3 is a sectional view taken along line XX of the laminate shown in FIG. 2 (c).

FIG. 4 is a view showing an example of the arrangement of conductive paths and openings for forming bump contacts provided in the FPC with contacts of the present invention.

FIG. 5 is a diagram showing an example of the structure of a bump contact provided in the FPC with contacts of the present invention.

FIG. 6 is a view showing an example of the arrangement of bonding openings provided in the FPC with contacts of the present invention.

FIG. 7 is a diagram showing an example of a mode in which a hard material is filled in a bonding opening to form a conduction path of ultrasonic energy.

8 is a diagram showing an example of a mode in which the surface layer of the conduction path in the mode of FIG. 7 is a gold layer.

FIG. 9 is a diagram showing a usage state of a conventional FPC with a contact for connection relay and a problem thereof.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Insulator layer 2 Conductor pattern 3 Bump contact 3a Surface layer made of gold 4 Conducting path 5 Opening for bonding

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[Procedure amendment]

[Submission date] May 1, 2000 (2000.5.1)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0001

[Correction method] Change

[Correction contents]

[0001]

BACKGROUND OF THE INVENTION The present invention belongs to the technical field of flexible printed circuit board having contacts, in particular, while convey a specific signal current, fine pitch, strictly required reliability of connection under vibration It is, belonging to the technical field of the relay circuit board used in the vicinity of the magnetic head of a hard disk driver.

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] 0010

[Correction method] Change

[Correction contents]

The object of the present invention is to solve the above problems, the junction between the fine gold terminal of suspension board with a circuit of a hard disk drive can be achieved with high connection reliability, to provide a flexible printed circuit board with contacts That is.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0012

[Correction method] Change

[Correction contents]

(1) The magnetic head of the hard disk driver
Suspension board with circuit mounted with
In connection with the control circuit board for operating the head
The suspension board with circuit is
A flexible printed circuit board having a bump terminal for connecting to the gold-plated terminal, wherein a conductor pattern is provided inside the insulator layer,
On one surface of the insulator layer, a bump contact is provided at a position corresponding to the gold-plated terminal. The bump contact has at least a surface layer of gold and is connected to a conductor pattern by a conductive path. On the other surface of the is provided an opening at a position corresponding to the back surface of the bump contact, inside the opening,
The conductor pattern is exposed, and
Ultrasonic energy can be injected into the conductor pattern from the mouth,
A bump contact on the flexible printed circuit board;
With gold-plated terminals on the suspension board with gold and gold
A flexible printed circuit board with contacts, wherein the flexible printed circuit board is configured to be in an ultrasonic bonding state .

[Procedure amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0016

[Correction method] Deleted

[Procedure amendment 6]

[Document name to be amended] Statement

[Correction target item name] 0019

[Correction method] Change

[Correction contents]

The contact with FPC of the present invention, as described above, I der least in the surface layer is intended connection what is gold, as shown as A in FIG. 1 (a), the hard disk driver it is an object of connecting a gold-plated terminals 51 of the suspension board with a circuit 50 having the magnetic head 60. Hereinafter, preferred embodiments of each part will be described in order while explaining the manufacturing method.

[Procedure amendment 7]

[Document name to be amended] Statement

[Correction target item name] 0025

[Correction method] Change

[Correction contents]

[0025] While not limited to the pattern itself of the conductive pattern, the flexible printed circuit board with the contacts,
In the carriage assembly of a hard disk driver, because those used for relaying connection with the suspension board with a circuit and the control circuit board, the main portion of the pattern excluding the both ends, over the distal end portion from the proximal end of the arm of the carriage assembly A plurality of conductors form a flat cable-like pattern extending in parallel. The patterns at both ends are patterns according to the arrangement of the terminals of the partner and the positions of the terminals of the partner with respect to the longitudinal direction of the arm. The number of conductors required for one magnetic head is four in MRH or the like generally used at present,
The required number of circuits may be set according to the technological progress of the magnetic head.

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5D042 TA10 5E023 BB23 CC05 HH08 HH30 5E077 BB32 CC06 DD03 JJ21 JJ30 5E344 AA02 AA22 BB02 BB06 CC13 CD28 CD31 DD07 EE13

Claims (5)

[Claims] 1. A flexible printed circuit board having bump contacts for connection to external terminals having at least a surface layer made of gold, wherein a conductor pattern is provided inside an insulator layer, and one surface of the insulator layer has A bump contact is provided at a position corresponding to the external terminal, the bump contact has at least a surface layer of gold and is connected to a conductor pattern by a conductive path, and a bump contact is provided on the other surface of the insulator layer. A flexible printed circuit board with a contact, wherein an opening is provided at a corresponding position on the back surface, and the conductive pattern is exposed inside the opening. 2. An opening is provided independently for the one bump contact, and one conductor pattern connected to the bump contact is exposed inside the opening. Flexible printed circuit board with contacts as described. 3. The flexible printed circuit board with contacts according to claim 1, wherein a metal is further filled in the opening. 4. The insulator layer according to claim 1, wherein at least a portion of the insulator layer, which is located around the bump contact and is bonded to an external substrate supporting the external terminal, has an adhesive property. Flexible printed circuit board with contacts. 5. The external terminal is a gold-plated terminal provided on a suspension board with a circuit on which a magnetic head of a hard disk driver is mounted, and the flexible printed circuit board with the contact comprises the suspension board with a circuit and the magnetic head. The flexible printed circuit board with contacts according to claim 1, which is used for relaying connection with a control circuit board for operation.