JPH0729657A - Flexible printed board for magnetic recording device - Google Patents

Flexible printed board for magnetic recording device

Info

Publication number
JPH0729657A
JPH0729657A JP5168224A JP16822493A JPH0729657A JP H0729657 A JPH0729657 A JP H0729657A JP 5168224 A JP5168224 A JP 5168224A JP 16822493 A JP16822493 A JP 16822493A JP H0729657 A JPH0729657 A JP H0729657A
Authority
JP
Japan
Prior art keywords
flexible printed
conductor pattern
magnetic head
control circuit
beam lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5168224A
Other languages
Japanese (ja)
Inventor
Ichiro Amino
一郎 網野
Yoshinari Takayama
嘉也 高山
Naoharu Morita
尚治 森田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP5168224A priority Critical patent/JPH0729657A/en
Publication of JPH0729657A publication Critical patent/JPH0729657A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Abstract

PURPOSE:To provide a subminiaturized flexible printed board having a higher density which is directly connectable to a magnetic head and its control circuit by protruding a conductor pattern from the end part of a base having the conductor pattern nipped by insulator layers to form a beam lead. CONSTITUTION:A flexible printed board A has a base body (a) having a conductor pattern 2 nipped by insulator layers 1, 3, and the pattern 2 is protruded from the end part side surface of the body (a) to form a beam lead 4. Thus, the beam lead having a minute width and an extremely fine pitch can be provided to allow the direct connection to a miniaturized magnetic head and its control circuit part. As the base 1, a one 1-200mum in thickness of polyimide resin which has a linear expansion ratio suitable to the pattern 2 consisting of a good conductive metal such as gold, silver or copper to prevent chamfer, and has satisfactory heat resistance and mechanical strength is preferably used to impart flexibility and workability.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、磁気記録装置の磁気ヘ
ッドと制御回路部との接続に好適なフレキシブルプリン
ト基板に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible printed board suitable for connecting a magnetic head of a magnetic recording device and a control circuit section.

【0002】[0002]

【従来の技術】近年、磁気記録装置は大容量化と共に小
型化し、今後もさらに小型化が進むものと予想される。
従来、磁気記録装置における磁気ヘッドと制御回路部と
の間の信号の伝達経路には、小型化に対応するために可
撓性を有するフレキシブルプリント基板が用いられてお
り、該磁気ヘッドとフレキシブルプリント基板との接続
には、絶縁導線を用いて半田付けが行なわれている。
2. Description of the Related Art In recent years, magnetic recording devices have become larger in capacity and smaller in size, and further miniaturization is expected to continue in the future.
Conventionally, a flexible printed circuit board having flexibility has been used for a signal transmission path between a magnetic head and a control circuit unit in a magnetic recording device in order to cope with miniaturization. For connection with the substrate, soldering is performed using an insulated conductor.

【0003】[0003]

【発明が解決しようとする課題】ところが、上記のよう
な絶縁導線による半田付け接続では、断線などの接続不
良を発見し難いという問題がある。また、今後さらに磁
気ヘッドあるいは制御回路部の小型化が進めば、これら
部品の電極部は微小で極細ピッチとなり、半田付けを要
する絶縁導線を接続に介在させることが困難となる。こ
のため、フレキシブルプリント基板を、これら磁気ヘッ
ドおよび制御回路部に直接的に接続することが必要とな
る。
However, there is a problem that it is difficult to find a connection failure such as a disconnection in the soldering connection using the insulated conductor as described above. Further, if the magnetic head or the control circuit section is further miniaturized in the future, the electrode sections of these components will be minute and have an extremely fine pitch, and it will be difficult to interpose an insulated conductive wire that requires soldering in the connection. Therefore, it is necessary to directly connect the flexible printed board to the magnetic head and the control circuit section.

【0004】本発明の目的は上記問題を解消し、特に高
密度で極小化が要求されるハードディスク装置等の磁気
記録装置の磁気ヘッドおよびその制御回路部に対する直
接的な接続が可能なフレキシブルプリント基板を提供す
ることである。
An object of the present invention is to solve the above-mentioned problems, and in particular, a flexible printed circuit board which can be directly connected to a magnetic head of a magnetic recording apparatus such as a hard disk drive which is required to be miniaturized at a high density and its control circuit section. Is to provide.

【0005】[0005]

【課題を解決するための手段】本発明者らは、フレキシ
ブルプリント基板の導体回路パターンを該基板の端部側
面から突き出させることによって、上記磁気ヘッドおよ
びその制御回路部に対して直接的な接続を可能とし、本
発明を完成した。即ち、本発明は、ハードディスク装置
等の磁気記録装置の磁気ヘッドと制御回路部との接続に
用いられるフレキシブルプリント基板であって、基板本
体は導体パターンが複数の絶縁体層に挟まれてなり、該
基板本体の端部側面から該導体パターンが突出してビー
ムリードを形成していることを特徴とするフレキシブル
プリント基板である。
The present inventors have made direct connection to the magnetic head and its control circuit section by projecting the conductor circuit pattern of the flexible printed board from the end side surface of the board. And the present invention has been completed. That is, the present invention is a flexible printed circuit board used for connecting a magnetic head of a magnetic recording device such as a hard disk drive and a control circuit section, in which the substrate body has a conductor pattern sandwiched between a plurality of insulator layers. A flexible printed circuit board is characterized in that the conductor pattern is projected from a side surface of an end portion of the substrate body to form a beam lead.

【0006】[0006]

【実施例】以下、本発明の実施例を示し、図を用いて詳
細に説明する。なお、本発明がこれに限定されるもので
ないことは言うまでもない。図1は、本発明のフレキシ
ブルプリント基板の一実施例を模式的に示す一部切欠斜
視図である。同図において、Aは本発明のフレキシブル
プリント基板であって、導体パターン2が絶縁体層1お
よび3に挟まれて基板本体aが形成され、該基板本体a
の端部側面から該導体パターン2が突出してビームリー
ド4を形成して成るものである。また、図2(a),
(b)は、本発明のフレキシブルプリント基板の他の実
施例を模式的に示す斜視図である。同図が図1と相違す
る部分は、導体パターン2の一方の絶縁体層が、該導体
パターン2と共に突出してビームリード4を形成してい
ることである。このような構造のフレキシブルプリント
基板とすることによって、微小幅で極細ピッチのビーム
リードが得られ、小型化した磁気ヘッドおよびその制御
回路部に対しても直接的な接続が可能となる。
Embodiments of the present invention will be described below with reference to the drawings. Needless to say, the present invention is not limited to this. FIG. 1 is a partially cutaway perspective view schematically showing an embodiment of the flexible printed circuit board of the present invention. In the figure, A is a flexible printed circuit board of the present invention, in which a conductor pattern 2 is sandwiched between insulator layers 1 and 3 to form a substrate body a.
The conductor pattern 2 projects from the side surface of the end of the beam lead 4 and is formed. In addition, as shown in FIG.
(B) is a perspective view which shows typically the other Example of the flexible printed circuit board of this invention. 1 is different from FIG. 1 in that one of the insulating layers of the conductor pattern 2 projects with the conductor pattern 2 to form a beam lead 4. By using the flexible printed circuit board having such a structure, a beam lead having a minute width and an extremely fine pitch can be obtained, and a direct connection can be made even to a miniaturized magnetic head and its control circuit section.

【0007】導体パターン2を挟む絶縁体層1と3は、
形状,性質等において同様のものであってもよいが、通
常は一方の層をベース基板、他方の層を保護膜とするこ
とが好ましい。ベース基板となる絶縁体層は、フレキシ
ブルプリント基板Aの強度,弾性,可撓性等の機械的諸
性質をほぼ決定するものであり、他方、保護膜となる層
は、導体パターン2の表面の保護および絶縁を保つもの
であるが、両者の機能および役割は目的に応じて配分さ
れるものであってもよい。例えば、保護膜であっても、
機械的強度の一因を担う等である。本実施例では、便宜
上、一方の絶縁体層をベース基板1、他方の絶縁体層を
保護膜3と呼ぶ。
The insulator layers 1 and 3 sandwiching the conductor pattern 2 are
Although they may be similar in shape and properties, it is usually preferable to use one layer as a base substrate and the other layer as a protective film. The insulator layer serving as the base substrate substantially determines mechanical properties such as strength, elasticity, and flexibility of the flexible printed circuit board A, while the layer serving as the protective film is formed on the surface of the conductor pattern 2. The protection and insulation are maintained, but the functions and roles of both may be distributed according to the purpose. For example, even if it is a protective film,
For example, it plays a role in mechanical strength. In this embodiment, for convenience, one insulator layer is referred to as the base substrate 1 and the other insulator layer is referred to as the protective film 3.

【0008】ベース基板1は、導体パターン2と絶縁性
をもって接触するものであればどのようなものでもよ
く、絶縁性物質による単一の層若しくは複数の積層、又
は内部に金属シールド層を有する積層等が例示される。
絶縁性物質としては、ポリエステル系樹脂,エポキシ系
樹脂,ウレタン系樹脂,ポリスチレン系樹脂,ポリエチ
レン系樹脂,ポリアミド系樹脂,ポリイミド系樹脂,A
BS樹脂,ポリカーボネート樹脂,シリコーン系樹脂な
ど、熱硬化性樹脂や熱可塑性樹脂を問わず使用できる。
上記絶縁性物質のうち、耐熱性や機械的強度が良好であ
り、かつ、導体パターン2に対して線膨張率を適合させ
てパターン形成時のカールや反りを防止できる材料とし
て、ポリイミド系樹脂を用いることが好ましい。ベース
基板1の厚みは、フレキシブルプリント基板に良好な加
工性及び可撓性を付与するために、1〜200μm、好
ましくは10〜100μmが良い。
The base substrate 1 may be of any type as long as it is in contact with the conductor pattern 2 in an insulating manner, and may be a single layer or a plurality of laminated layers made of an insulating material, or a laminated layer having a metal shield layer inside. Etc. are illustrated.
As the insulating material, polyester resin, epoxy resin, urethane resin, polystyrene resin, polyethylene resin, polyamide resin, polyimide resin, A
Any thermosetting resin or thermoplastic resin such as BS resin, polycarbonate resin, or silicone resin can be used.
Of the above-mentioned insulating substances, polyimide resin is used as a material that has good heat resistance and mechanical strength and that can adapt the linear expansion coefficient to the conductor pattern 2 to prevent curling and warping during pattern formation. It is preferable to use. The thickness of the base substrate 1 is 1 to 200 μm, preferably 10 to 100 μm, in order to impart good workability and flexibility to the flexible printed board.

【0009】保護膜3は、導体パターン2の表面の保護
および絶縁を保つものとして機能するものであればどの
ようなものでもよい。また、上記ベース基板と同一の材
質、構造であってもよいが、耐熱性の点からポリイミド
系樹脂を用いることが好ましい。保護膜3は、ベース基
板上及び導体パターンに対して、あらかじめ形成された
絶縁フィルムを接着剤や自体の溶着によって密着する
か、塗布,蒸着法など公知の薄膜形成方法を用いて直接
生成するものであってよい。
The protective film 3 may be of any type as long as it functions to protect the surface of the conductor pattern 2 and maintain insulation. Further, although the same material and structure as the above-mentioned base substrate may be used, it is preferable to use a polyimide resin from the viewpoint of heat resistance. The protective film 3 is formed by adhering an insulating film formed in advance to the base substrate and the conductor pattern by adhesion of an adhesive or itself, or directly by using a known thin film forming method such as coating or vapor deposition. May be

【0010】導体パターン2は、良導体金属からなる回
路パターンであり、材質として特に好ましい金,銀,銅
等の他、白金,ニッケル,アルミニウム,鉄,クロム,
モリブデン,タングステン,亜鉛,スズ,又はこれらの
合金などが例示される他、例えば、銅箔からなる回路パ
ターンに対して金メッキや半田メッキを施す等、上記良
導体金属による多層構造であってもよい。またこの多層
構造は、端子部など接続に係る部分のみに設けるもので
あってもよい。導体パターン2のパターン形状は、接続
すべき相手の部品によって回路の本数,1本の回路幅,
ピッチ,厚みなど自由に選択される。導体パターン2
は、独立した工程で形成された後に、絶縁体層によって
挟まれるものであってもよく、あるいは、公知のプリン
ト基板のごとく、エッチングや蒸着によってベース基板
上に形成されるものであってもよい。
The conductor pattern 2 is a circuit pattern made of a good conductor metal, and is particularly preferable as a material, such as gold, silver, and copper, as well as platinum, nickel, aluminum, iron, chromium,
Other than molybdenum, tungsten, zinc, tin, or alloys thereof, for example, a multilayer structure made of the above-mentioned good conductor metal such as gold plating or solder plating on a circuit pattern made of copper foil may be used. Further, this multi-layer structure may be provided only in a portion related to connection such as a terminal portion. The pattern shape of the conductor pattern 2 depends on the other component to be connected, the number of circuits, the width of one circuit,
Pitch and thickness can be freely selected. Conductor pattern 2
May be sandwiched between insulating layers after being formed in an independent process, or may be formed on a base substrate by etching or vapor deposition like a known printed circuit board. .

【0011】ビームリードは、上記導体パターン2の延
長であって、高密度で極小化する磁気ヘッドまたはその
制御回路部に対して直接的な接続が可能なように、基板
本体aの端部側面から該導体パターン2が突出してなる
ものである。ビームリードは、図1の4aのように、一
方の部品とのみ直接接続されるように片方だけに形成さ
れるものであってもよく、また、磁気ヘッドおよび制御
回路部の両方と直接接続されるように、同図の4bのよ
うに、反対端からも突出してなるものであってもよい。
ビームリードの突き出し長さは、部品の種類や該部品と
の位置関係に対して好適に選択されるものであって、特
定されるものではない。ビームリードの形成法は、導体
パターン2が独立した工程で形成された後に絶縁体層に
よって挟まれるものである場合は、該導体パターン2を
端部から突き出すようにして挟めばよい。また、既に形
成された基板本体aに対しては、公知の方法を用いて絶
縁層を除去すればよく、特にレーザー光による加工が精
度や加工性の点で有効な方法として例示され、その中で
もエキシマレーザーで代表されるような紫外レーザー光
が有用である。
The beam lead is an extension of the above-mentioned conductor pattern 2 and is provided on the side surface of the end portion of the substrate main body a so that it can be directly connected to the magnetic head which is miniaturized at a high density or its control circuit portion. The conductor pattern 2 is projected from the. The beam lead may be formed only on one side so as to be directly connected to only one component, as in 4a of FIG. 1, and may be directly connected to both the magnetic head and the control circuit section. As shown in FIG. 4b, the protrusion may be formed from the opposite end.
The protruding length of the beam lead is suitably selected according to the type of component and the positional relationship with the component, and is not specified. In the method of forming the beam lead, when the conductor pattern 2 is formed by an independent process and then sandwiched by the insulating layers, the conductor pattern 2 may be sandwiched so as to protrude from the end. Further, for the already formed substrate body a, the insulating layer may be removed by using a known method, and processing by laser light is particularly exemplified as an effective method in terms of accuracy and workability. An ultraviolet laser light represented by an excimer laser is useful.

【0012】本発明のフレキシブルプリント基板は、ハ
ードディスク装置に代表されるような超小型化した磁気
記録装置の微小な磁気ヘッドに対して特に有用に用いら
れるだけでなく、アナログ信号用等の汎用磁気ヘッド
や、光磁気ディスク等の特殊な磁気ヘッドにも用いるこ
とができる。
The flexible printed circuit board according to the present invention is not only particularly usefully used for a minute magnetic head of an ultra-miniaturized magnetic recording device represented by a hard disk device, but also for general-purpose magnetic signals for analog signals. It can also be used for heads and special magnetic heads such as magneto-optical disks.

【0013】制御回路部は、上記磁気ヘッドに対して記
録すべき信号や消去するための信号を印加し、あるい
は、該磁気ヘッドからの信号を受けるためのものであ
る。該制御回路部の態様は、複数の電子部品から成るブ
ロックや、1チップに集積されたもの、あるいはこれら
の中間的なもの等、種々のものが例示される。特に、1
チップに集積された制御回路部に対しては、本発明のフ
レキシブルプリント基板はTABフィルムとして用いる
ことができ、シリコンウェハー上に形成された状態での
回路チップを、本発明のフレキシブルプリント基板上に
直接実装することができる。即ち、本発明のフレキシブ
ルプリント基板は、磁気ヘッドと制御回路部の両方が共
に極小化したときに、その双方の直接接続に最も効果を
奏する。
The control circuit section is for applying a signal to be recorded or a signal for erasing to the magnetic head or for receiving a signal from the magnetic head. As the mode of the control circuit unit, various ones such as a block composed of a plurality of electronic components, one integrated on one chip, or an intermediate one of these are exemplified. Especially 1
For a control circuit unit integrated on a chip, the flexible printed circuit board of the present invention can be used as a TAB film, and a circuit chip formed on a silicon wafer can be mounted on the flexible printed circuit board of the present invention. Can be implemented directly. That is, the flexible printed circuit board of the present invention is most effective for direct connection between both the magnetic head and the control circuit section when both are minimized.

【0014】ビームリードと磁気ヘッドまたはその制御
回路部との接続方法は、溶着や圧着など公知のボンディ
ング法が用いられる。
As a method for connecting the beam lead and the magnetic head or the control circuit portion thereof, a known bonding method such as welding or pressure bonding is used.

【0015】[0015]

【発明の効果】以上詳述したように、本発明のフレキシ
ブルプリント基板は、高密度で極小化する磁気記録装置
の磁気ヘッドおよびその制御回路部に対して、直接的な
接続が可能である。特にハードディスク装置等の磁気ヘ
ッドと制御回路部の両方が共に極小化したときに、その
直接的な接続性が最も効果を奏する。
As described above in detail, the flexible printed circuit board of the present invention can be directly connected to the magnetic head of the magnetic recording apparatus which is miniaturized at a high density and its control circuit section. In particular, when both the magnetic head of the hard disk drive and the control circuit section are both minimized, the direct connectivity is most effective.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明のフレキシブルプリント基板の一実施例
を模式的に示す一部切欠斜視図である。
FIG. 1 is a partially cutaway perspective view schematically showing an embodiment of a flexible printed circuit board of the present invention.

【図2】本発明のフレキシブルプリント基板の他の実施
例を模式的に示す斜視図である。
FIG. 2 is a perspective view schematically showing another embodiment of the flexible printed board of the present invention.

【符号の説明】[Explanation of symbols]

A フレキシブルプリント基板 a 基板本体 1 ベース基板 2 導体パターン 3 保護膜 4 ビームリード A flexible printed circuit board a board body 1 base board 2 conductor pattern 3 protective film 4 beam lead

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 磁気記録装置の磁気ヘッドと制御回路部
との接続に用いられるフレキシブルプリント基板であっ
て、基板本体は導体パターンが絶縁体層に挟まれてな
り、該基板本体の端部側面から該導体パターンが突出し
てビームリードを形成していることを特徴とするフレキ
シブルプリント基板。
1. A flexible printed circuit board used for connecting a magnetic head and a control circuit section of a magnetic recording apparatus, wherein a substrate body is formed by sandwiching a conductor pattern between insulating layers, and an end side surface of the substrate body. A flexible printed circuit board, characterized in that the conductor pattern is projected therefrom to form a beam lead.
【請求項2】 導体パターンを挟む一方の絶縁体層が、
該導体パターンと共に突出してビームリードを形成して
いることを特徴とする請求項1記載のフレキシブルプリ
ント基板。
2. The one insulating layer sandwiching the conductor pattern,
2. The flexible printed circuit board according to claim 1, wherein a beam lead is formed so as to project together with the conductor pattern.
【請求項3】 磁気記録装置がハードディスク装置であ
る請求項1または2記載のフレキシブルプリント基板。
3. The flexible printed circuit board according to claim 1, wherein the magnetic recording device is a hard disk device.
JP5168224A 1993-07-07 1993-07-07 Flexible printed board for magnetic recording device Pending JPH0729657A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5168224A JPH0729657A (en) 1993-07-07 1993-07-07 Flexible printed board for magnetic recording device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5168224A JPH0729657A (en) 1993-07-07 1993-07-07 Flexible printed board for magnetic recording device

Publications (1)

Publication Number Publication Date
JPH0729657A true JPH0729657A (en) 1995-01-31

Family

ID=15864087

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5168224A Pending JPH0729657A (en) 1993-07-07 1993-07-07 Flexible printed board for magnetic recording device

Country Status (1)

Country Link
JP (1) JPH0729657A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1651021A1 (en) * 2004-10-25 2006-04-26 Nitto Denko Corporation Suspension board with circuit
JP2012104210A (en) * 2010-10-12 2012-05-31 Nitto Denko Corp Suspension substrate with circuit and method for manufacturing the same
JP2012238357A (en) * 2011-05-11 2012-12-06 Dainippon Printing Co Ltd Suspension substrate, suspension, suspension with element, and hard disk drive

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1651021A1 (en) * 2004-10-25 2006-04-26 Nitto Denko Corporation Suspension board with circuit
US7525764B2 (en) 2004-10-25 2009-04-28 Nitto Denko Corporation Suspension board with circuit
JP2012104210A (en) * 2010-10-12 2012-05-31 Nitto Denko Corp Suspension substrate with circuit and method for manufacturing the same
JP2015187906A (en) * 2010-10-12 2015-10-29 日東電工株式会社 Suspension substrate with circuit and method for manufacturing the same
JP2012238357A (en) * 2011-05-11 2012-12-06 Dainippon Printing Co Ltd Suspension substrate, suspension, suspension with element, and hard disk drive

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