JP2000277509A - 基板処理装置 - Google Patents

基板処理装置

Info

Publication number
JP2000277509A
JP2000277509A JP11086289A JP8628999A JP2000277509A JP 2000277509 A JP2000277509 A JP 2000277509A JP 11086289 A JP11086289 A JP 11086289A JP 8628999 A JP8628999 A JP 8628999A JP 2000277509 A JP2000277509 A JP 2000277509A
Authority
JP
Japan
Prior art keywords
gas
substrate
blowing nozzles
reaction chamber
ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11086289A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000277509A5 (enExample
Inventor
Masao Yoshino
正朗 芳野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Denki Electric Inc
Original Assignee
Kokusai Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Co Ltd filed Critical Kokusai Electric Co Ltd
Priority to JP11086289A priority Critical patent/JP2000277509A/ja
Publication of JP2000277509A publication Critical patent/JP2000277509A/ja
Publication of JP2000277509A5 publication Critical patent/JP2000277509A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
JP11086289A 1999-03-29 1999-03-29 基板処理装置 Pending JP2000277509A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11086289A JP2000277509A (ja) 1999-03-29 1999-03-29 基板処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11086289A JP2000277509A (ja) 1999-03-29 1999-03-29 基板処理装置

Publications (2)

Publication Number Publication Date
JP2000277509A true JP2000277509A (ja) 2000-10-06
JP2000277509A5 JP2000277509A5 (enExample) 2006-05-18

Family

ID=13882688

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11086289A Pending JP2000277509A (ja) 1999-03-29 1999-03-29 基板処理装置

Country Status (1)

Country Link
JP (1) JP2000277509A (enExample)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007273750A (ja) * 2006-03-31 2007-10-18 Mitsui Eng & Shipbuild Co Ltd プラズマ成膜装置およびプラズマ成膜装置のクリーニング方法
JP2008503036A (ja) * 2004-06-18 2008-01-31 ライボルト オプティクス ゲゼルシャフト ミット ベシュレンクテル ハフツング 媒体インジェクタ
WO2009066389A1 (ja) * 2007-11-22 2009-05-28 Canon Anelva Corporation スパッタ装置およびスパッタ方法
JP2009295260A (ja) * 2008-06-09 2009-12-17 Showa Denko Kk 磁気記録媒体の製造方法、磁気記録媒体、磁気記録再生装置及び成膜装置
KR100982987B1 (ko) 2008-04-18 2010-09-17 삼성엘이디 주식회사 화학 기상 증착 장치
JP2011077143A (ja) * 2009-09-29 2011-04-14 Dainippon Screen Mfg Co Ltd 熱処理装置
KR101183141B1 (ko) * 2005-08-29 2012-09-14 주성엔지니어링(주) 가스분배판 및 이를 포함하는 플라즈마 발생장치
CN103215566A (zh) * 2012-01-20 2013-07-24 东京毅力科创株式会社 气体供给喷头和基板处理装置
CN103430285A (zh) * 2011-03-22 2013-12-04 应用材料公司 用于化学气相沉积腔室的衬里组件
JP2014515561A (ja) * 2011-05-31 2014-06-30 ラム リサーチ コーポレーション プラズマエッチングリアクタのセラミックシャワーヘッドのためのガス分配システム
JP2016103437A (ja) * 2014-11-28 2016-06-02 東京エレクトロン株式会社 プラズマ処理装置
US10208380B2 (en) * 2015-12-04 2019-02-19 Applied Materials, Inc. Advanced coating method and materials to prevent HDP-CVD chamber arcing
CN115537779A (zh) * 2022-10-12 2022-12-30 拓荆科技股份有限公司 气体输送结构及气相沉积设备

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008503036A (ja) * 2004-06-18 2008-01-31 ライボルト オプティクス ゲゼルシャフト ミット ベシュレンクテル ハフツング 媒体インジェクタ
KR101183141B1 (ko) * 2005-08-29 2012-09-14 주성엔지니어링(주) 가스분배판 및 이를 포함하는 플라즈마 발생장치
JP2007273750A (ja) * 2006-03-31 2007-10-18 Mitsui Eng & Shipbuild Co Ltd プラズマ成膜装置およびプラズマ成膜装置のクリーニング方法
WO2009066389A1 (ja) * 2007-11-22 2009-05-28 Canon Anelva Corporation スパッタ装置およびスパッタ方法
KR100982987B1 (ko) 2008-04-18 2010-09-17 삼성엘이디 주식회사 화학 기상 증착 장치
JP2009295260A (ja) * 2008-06-09 2009-12-17 Showa Denko Kk 磁気記録媒体の製造方法、磁気記録媒体、磁気記録再生装置及び成膜装置
JP2011077143A (ja) * 2009-09-29 2011-04-14 Dainippon Screen Mfg Co Ltd 熱処理装置
KR20140018939A (ko) * 2011-03-22 2014-02-13 어플라이드 머티어리얼스, 인코포레이티드 화학 기상 증착 챔버를 위한 라이너 조립체
US9695508B2 (en) 2011-03-22 2017-07-04 Applied Materials, Inc. Liner assembly for chemical vapor deposition chamber
CN103430285A (zh) * 2011-03-22 2013-12-04 应用材料公司 用于化学气相沉积腔室的衬里组件
KR101884003B1 (ko) 2011-03-22 2018-07-31 어플라이드 머티어리얼스, 인코포레이티드 화학 기상 증착 챔버를 위한 라이너 조립체
JP2014514744A (ja) * 2011-03-22 2014-06-19 アプライド マテリアルズ インコーポレイテッド 化学気相堆積チャンバ用のライナアセンブリ
CN103430285B (zh) * 2011-03-22 2016-06-01 应用材料公司 用于化学气相沉积腔室的衬里组件
JP2014515561A (ja) * 2011-05-31 2014-06-30 ラム リサーチ コーポレーション プラズマエッチングリアクタのセラミックシャワーヘッドのためのガス分配システム
TWI594802B (zh) * 2012-01-20 2017-08-11 Tokyo Electron Ltd Gas supply head and substrate processing apparatus
CN103215566B (zh) * 2012-01-20 2016-12-28 东京毅力科创株式会社 气体供给喷头和基板处理装置
JP2013149872A (ja) * 2012-01-20 2013-08-01 Tokyo Electron Ltd ガス供給ヘッド及び基板処理装置
CN103215566A (zh) * 2012-01-20 2013-07-24 东京毅力科创株式会社 气体供给喷头和基板处理装置
JP2016103437A (ja) * 2014-11-28 2016-06-02 東京エレクトロン株式会社 プラズマ処理装置
US10208380B2 (en) * 2015-12-04 2019-02-19 Applied Materials, Inc. Advanced coating method and materials to prevent HDP-CVD chamber arcing
CN115537779A (zh) * 2022-10-12 2022-12-30 拓荆科技股份有限公司 气体输送结构及气相沉积设备

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