JP2000271685A - Manufacture of resin-coated container - Google Patents
Manufacture of resin-coated containerInfo
- Publication number
- JP2000271685A JP2000271685A JP11084558A JP8455899A JP2000271685A JP 2000271685 A JP2000271685 A JP 2000271685A JP 11084558 A JP11084558 A JP 11084558A JP 8455899 A JP8455899 A JP 8455899A JP 2000271685 A JP2000271685 A JP 2000271685A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resin film
- temperature
- adhesive
- heat treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、キャップ状等に加
工される成形品に好適な樹脂密着性が優れた樹脂被覆容
器の製造方法に関し、特に、電子部品等の外装容器、例
えば、電解コンデンサ素子を収納するコンデンサキャッ
プ等に使用することができる樹脂被覆容器の製造方法に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a resin-coated container having excellent resin adhesion suitable for a molded article processed into a cap or the like, and more particularly to an outer container for electronic parts, such as an electrolytic capacitor. The present invention relates to a method for manufacturing a resin-coated container that can be used for a capacitor cap or the like that stores elements.
【0002】[0002]
【従来の技術】アルミニウム電解コンデンサの多くは、
アルミニウム又はアルミニウム合金板を絞り加工により
成形した有底円筒状のコンデンサキャップ内に電解液を
含浸させたコンデンサ素子を収納し、そしてコンデンサ
キャップの開口部をゴム等で封口し、更に外周面を電気
絶縁又は内容表示を目的として塩化ビニル樹脂又はポリ
オレフィン樹脂等からなる熱収縮チューブで被覆した構
成を有している。2. Description of the Related Art Many aluminum electrolytic capacitors are:
A capacitor element impregnated with electrolyte is housed in a bottomed cylindrical capacitor cap formed by drawing an aluminum or aluminum alloy plate by drawing.The opening of the capacitor cap is sealed with rubber or the like, and the outer peripheral surface is electrically It has a configuration in which it is covered with a heat-shrinkable tube made of vinyl chloride resin or polyolefin resin for the purpose of insulation or content display.
【0003】近時の小型のアルミニウム電解コンデンサ
では熱収縮チューブの被覆が困難であり、また外装容器
が小さくなるために収納したコンデンサ素子が容器内面
と接触し、絶縁性が阻害されるという問題点がある。In recent years, it has been difficult to cover a heat-shrinkable tube with a small aluminum electrolytic capacitor, and since the outer container has become smaller, the stored capacitor element has come into contact with the inner surface of the container, thus impairing insulation. There is.
【0004】また、最近の環境保護に伴うダイオキシン
対策として、脱塩化ビニル化が進められており、大型の
アルミニウム電解コンデンサにおいても、コンデンサを
覆う塩化ビニル樹脂膜の省略が望まれている。Further, as a measure against dioxin associated with environmental protection in recent years, vinyl chloride has been decomposed, and even in a large aluminum electrolytic capacitor, it is desired to omit a vinyl chloride resin film covering the capacitor.
【0005】その対策として、予めアルミニウム又はア
ルミニウム合金板の表面を絶縁樹脂層で被覆した積層材
を絞りしごき加工(以下、DI加工という。)して外装
容器を形成し、この中にコンデンサ素子を入れて、口を
絞ることにより、チューブの被覆を省略して絶縁性を向
上させる技術が実用化されている。絶縁樹脂層の被覆方
法としては、上述のようにアルミニウム又はアルミニウ
ム合金素材の表面に樹脂フィルムを貼り合せることによ
り、その表面を被覆する方法等がある。As a countermeasure, a laminated material in which the surface of an aluminum or aluminum alloy plate is previously coated with an insulating resin layer is drawn and ironed (hereinafter referred to as DI processing) to form an outer container, in which a capacitor element is formed. A technique has been put into practical use in which a tube is covered and the insulation is improved by squeezing the mouth. As a method of coating the insulating resin layer, there is a method of coating the surface of the aluminum or aluminum alloy material by bonding a resin film to the surface as described above.
【0006】上述のアルミニウム又はアルミニウム合金
素材に樹脂フィルムをラミネートした積層材としては、
特開平1−238931号公報にポリアミド樹脂と金属
素材表面との間に熱処理したエポキシ樹脂塗膜したもの
が開示されている。また、特許第2623598号公報
に金属板の少なくとも片面に、ナイロン系樹脂をラミネ
ートしたものが開示されている。[0006] As a laminated material obtained by laminating a resin film on the above-mentioned aluminum or aluminum alloy material,
Japanese Patent Application Laid-Open No. 1-238931 discloses a heat-treated epoxy resin coating between a polyamide resin and a metal material surface. Japanese Patent No. 2623598 discloses a metal plate in which a nylon resin is laminated on at least one surface of a metal plate.
【0007】[0007]
【発明が解決しようとする課題】しかし、上述の従来の
積層材(特開平1−238931号公報、特許第262
3598号公報)では、DI加工を施した場合、樹脂が
硬化して加工前の樹脂の密着性が良好であっても、樹脂
の密着性が低下して加工後に層間剥離等が起こり易いと
いう問題点がある。However, the above-mentioned conventional laminated material (Japanese Patent Laid-Open No. 1-238931, Japanese Patent No.
No. 3598), when DI processing is performed, even if the resin is hardened and the adhesiveness of the resin before processing is good, the adhesiveness of the resin is reduced and delamination or the like easily occurs after the processing. There is a point.
【0008】このため、DI加工後に比較的高温で熱処
理が行われている。特許第2623598号公報では、
容器の加工後の密着性を向上させるため、樹脂膜の融点
から加熱減量が10重量%以下の加熱温度範囲で熱処理
することが開示されている。しかし、まとめて熱処理を
行うと個々の容器の固着が生じてしまうという問題点が
ある。Therefore, heat treatment is performed at a relatively high temperature after DI processing. In Japanese Patent No. 2623598,
It is disclosed that in order to improve the adhesion after processing the container, heat treatment is performed in a heating temperature range in which the loss on heating from the melting point of the resin film is 10% by weight or less. However, there is a problem that when the heat treatment is performed collectively, the individual containers are fixed.
【0009】その対策として、特許第2595668号
公報に提案されているように、容器を個々に処理するよ
うな熱処理方法及び熱処理装置を使用する必要があり、
現行のコンデンサキャップと比較して、生産性の面から
極めて不利であるという問題点がある。As a countermeasure, as proposed in Japanese Patent No. 2595668, it is necessary to use a heat treatment method and a heat treatment apparatus for individually treating containers.
There is a problem that it is extremely disadvantageous in terms of productivity as compared with the current capacitor cap.
【0010】本発明はかかる問題点に鑑みてなされたも
のであって、絞りしごき加工後の樹脂密着性が優れ、熱
処理による容器の同士の固着を防止することができる樹
脂密着性が優れた樹脂被覆容器の製造方法を提供するこ
とを目的とする。The present invention has been made in view of the above problems, and has excellent resin adhesion after drawing and ironing, and excellent resin adhesion that can prevent sticking of containers by heat treatment. An object of the present invention is to provide a method for manufacturing a coated container.
【0011】[0011]
【課題を解決するための手段】本発明に係る樹脂被覆容
器の製造方法は、金属又は合金からなる基材と、前記基
材の少なくとも1面に形成された樹脂膜とを軟化温度が
40℃以上で前記樹脂膜の軟化温度以下である接着剤に
より接着した樹脂被覆材を絞りしごき加工する工程と、
前記接着剤の軟化温度以上で前記樹脂膜の融点以下の温
度で熱処理する工程と、を有することを特徴とする。According to a method of manufacturing a resin-coated container according to the present invention, a base material made of a metal or an alloy and a resin film formed on at least one surface of the base material are softened at a temperature of 40 ° C. A step of squeezing and ironing the resin coating material bonded by an adhesive having a softening temperature of the resin film or lower,
Heat treating at a temperature not lower than the softening temperature of the adhesive and not higher than the melting point of the resin film.
【0012】この場合、前記熱処理は、前記樹脂膜の融
点から50℃低い温度以上で前記樹脂膜の融点以下の温
度で行うことが好ましい。In this case, it is preferable that the heat treatment is performed at a temperature of 50 ° C. lower than the melting point of the resin film and lower than the melting point of the resin film.
【0013】本発明においては、金属又は合金からなる
基材の少なくとも1面に樹脂膜が接着剤を介して形成さ
れた樹脂被覆材を絞りしごき加工した後、接着剤の軟化
温度以上で樹脂膜の融点以下の温度で熱処理することに
より、樹脂膜の密着性が優れていると共に、樹脂膜の固
着が生じない容器を形成することができる。このため、
一度に複数個の容器を同時に熱処理することができ、生
産性を向上させることができる。In the present invention, after a resin coating material having a resin film formed on at least one surface of a metal or alloy substrate via an adhesive is drawn and ironed, the resin film is heated at a temperature not lower than the softening temperature of the adhesive. By performing the heat treatment at a temperature equal to or lower than the melting point, a container having excellent adhesion of the resin film and free from adhesion of the resin film can be formed. For this reason,
A plurality of containers can be heat-treated at the same time, and productivity can be improved.
【0014】[0014]
【発明の実施の形態】以下、本発明の実施例に係る樹脂
被覆容器の製造方法について詳細に説明する。本願発明
者等は鋭意実験研究の結果、金属又は合金からなる基材
の少なくとも1面に室温以上の樹脂膜の軟化温度を有す
る接着剤層を介して樹脂膜を形成した樹脂被覆金属材を
DI加工して容器を成形した後、接着剤の軟化温度乃至
樹脂膜の融点以下の加熱温度範囲で熱処理することによ
り、容器を密着させて熱処理しても容器に固着を生じな
いことを見出した。DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a method for manufacturing a resin-coated container according to an embodiment of the present invention will be described in detail. As a result of intensive experimental research, the present inventors have found that a resin-coated metal material having a resin film formed on at least one surface of a substrate made of a metal or an alloy via an adhesive layer having a softening temperature of the resin film at room temperature or higher is converted to DI. After processing to form a container, it was found that heat treatment was performed in a heating temperature range from the softening temperature of the adhesive to the melting point of the resin film or lower.
【0015】以下本発明の樹脂密着性が優れた容器及び
その製造方法の限定理由について詳細に説明する。Hereinafter, the container of the present invention having excellent resin adhesion and the reason for limiting the production method thereof will be described in detail.
【0016】金属又は合金からなる基材 基材の品種は、特に限定されるものではないが、例え
ば、アルミニウム基材、銅基材、鉄基材及びこれらの合
金からなる合金基材を使用することができる。基材の厚
さは、0.2乃至0.6mmとすることが好ましい。更
に、樹脂膜との密着性を向上させるため、表面をりん酸
−クロム酸塩等による化成処理及び電解エッチング等の
エッチング処理からなる群から選択された1種の皮膜が
形成されているものを使用することができる。The type of the base material made of a metal or an alloy is not particularly limited. For example, an aluminum base material, a copper base material, an iron base material, and an alloy base material made of these alloys are used. be able to. The thickness of the base material is preferably 0.2 to 0.6 mm. Furthermore, in order to improve the adhesion to the resin film, the surface is formed with one kind of film selected from the group consisting of a chemical conversion treatment with phosphoric acid-chromate and an etching treatment such as electrolytic etching. Can be used.
【0017】樹脂膜 樹脂膜としては、特に限定されるものではないが、例え
ば、ポリステル系樹脂であれば、ポリエチレンテレフタ
レート樹脂、ポリエチレンナフタレート樹脂、ポリエチ
レンイソフタレート樹脂、ポリブチレンテレフタレート
樹脂等及びそれらの共重合体からなる樹脂膜とすること
ができる。また、ポリアミド系樹脂であれば、ナイロン
6、ナイロン66、ナイロン系エストラマ及びナイロン
系ポリマを使用することができる。[0017] As the resin film resin film is not particularly limited, for example, if Porisuteru resin, polyethylene terephthalate resin, polyethylene naphthalate resin, polyethylene isophthalate resin, polybutylene terephthalate resin, etc. and their It can be a resin film made of a copolymer. In addition, as long as it is a polyamide resin, nylon 6, nylon 66, nylon elastomer, and nylon polymer can be used.
【0018】接着剤 接着剤は、特に限定されるものではなく、例えば、ポリ
イソシアネート系接着剤、ポリエステル系接着剤及びア
クリル系接着剤等を使用することができる。 Adhesive The adhesive is not particularly limited. For example, a polyisocyanate-based adhesive, a polyester-based adhesive, an acrylic-based adhesive, or the like can be used.
【0019】熱処理:接着剤の軟化温度以上で樹脂膜の
融点以下の温度 熱処理の温度が接着剤の軟化温度未満では、樹脂膜の密
着性の回復に時間がかかり、生産性を低下させる。一
方、熱処理の温度が樹脂膜の融点を超えると、熱処理の
際に固着が生じてしまい、容器同士が固着してしまう。
従って、熱処理は接着剤の軟化温度以上で樹脂膜の融点
以下の温度とする。なお、樹脂膜の融点よりも50℃低
い温度が接着剤の軟化温度よりも高い場合には、熱処理
は樹脂膜の融点から50℃低い温度以上で樹脂膜の融点
以下の温度とすることが好ましい。 Heat treatment: The temperature of the resin film becomes higher than the softening temperature of the adhesive.
If the temperature of the heat treatment below the melting point is lower than the softening temperature of the adhesive, it takes time to recover the adhesiveness of the resin film, and the productivity is reduced. On the other hand, if the temperature of the heat treatment exceeds the melting point of the resin film, fixation occurs during the heat treatment, and the containers adhere to each other.
Therefore, the heat treatment is performed at a temperature equal to or higher than the softening temperature of the adhesive and equal to or lower than the melting point of the resin film. When the temperature lower by 50 ° C. than the melting point of the resin film is higher than the softening temperature of the adhesive, the heat treatment is preferably performed at a temperature of 50 ° C. or lower from the melting point of the resin film to a temperature lower than the melting point of the resin film. .
【0020】[0020]
【実施例】以下、本発明の実施例方法により樹脂被覆容
器を製造し、その樹脂被覆の密着性及び樹脂被覆の固着
状態について試験した結果を比較例と比較して具体的に
説明する。EXAMPLES A resin-coated container is manufactured by the method of the present invention, and the results of tests on the adhesion of the resin coating and the state of fixation of the resin coating are described in detail with reference to comparative examples.
【0021】基材には厚さが0.3mmのアルミニウム
板を使用し、樹脂膜には厚さが25μmのポリエチレン
テレフタレート樹脂フィルムを使用し、接着剤には市販
のイソシアネート系接着剤を使用した。なお、樹脂膜で
あるポリエチレンテレフタレート樹脂フィルムの融点は
255℃であり、接着剤の軟化温度は115℃である。An aluminum plate having a thickness of 0.3 mm was used as a substrate, a polyethylene terephthalate resin film having a thickness of 25 μm was used as a resin film, and a commercially available isocyanate-based adhesive was used as an adhesive. . The melting point of the polyethylene terephthalate resin film as the resin film is 255 ° C., and the softening temperature of the adhesive is 115 ° C.
【0022】室温(20℃)で樹脂被覆材はアルミニウ
ム板に接着剤を乾燥後の厚さが10μmとなるように塗
布した後、ポリエチレンテレフタレート樹脂フィルムを
ラミネートロールにより圧着することにより作製した。At room temperature (20 ° C.), the resin coating material was prepared by applying an adhesive to an aluminum plate so that the thickness after drying was 10 μm, and then pressing a polyethylene terephthalate resin film with a laminating roll.
【0023】この樹脂被覆材を使用して、外側に樹脂面
を有した直径が10mm、高さが20mmの樹脂被覆容
器を絞りしごき加工により成形した。この樹脂被覆容器
を100個まとめてステンレス容器に入れ、表1に示す
種々の条件で熱処理をした。熱処理後の樹脂被覆容器側
面の被覆した樹脂膜の密着性をエッジ部からのテープ剥
離により評価した。樹脂密着性の評価は、非常に良好な
ものを◎、良好なものを○、若干悪いものを△、悪い場
合を×とした。この結果を表1に示す。なお、表1中に
示す「−」は評価できないことを示す。Using this resin-coated material, a resin-coated container having a resin surface on the outside and having a diameter of 10 mm and a height of 20 mm was formed by drawing and ironing. 100 resin-coated containers were put together in a stainless steel container and heat-treated under various conditions shown in Table 1. The adhesiveness of the coated resin film on the side of the resin-coated container after the heat treatment was evaluated by peeling the tape from the edge. The evaluation of resin adhesion was evaluated as ◎ for very good, 、 for good, △ for slightly bad, and x for bad. Table 1 shows the results. In addition, "-" shown in Table 1 shows that evaluation cannot be performed.
【0024】[0024]
【表1】 [Table 1]
【0025】上記表1に示すように、実施例No.1乃至
3は密着性が優れると共に、固着が生じなかった。な
お、実施例No.3は本発明の請求項2を満足しているた
め、密着性が極めて優れたものであった。As shown in Table 1, Examples Nos. 1 to 3 were excellent in adhesion and did not adhere. In addition, since Example No. 3 satisfied the claim 2 of the present invention, the adhesiveness was extremely excellent.
【0026】一方、比較例No.4及び5は密着性及び固
着状態について良好な結果を得ることができなかった。
比較例No.4は熱処理温度が接着剤の軟化温度以下であ
るため、固着状態にはならなかったものの、密着性が乏
しかった。比較例No.5は熱処理温度が樹脂膜の融点を
超えているため、固着状態になった。このため、樹脂膜
の密着性の評価については、評価することができなかっ
た。On the other hand, in Comparative Examples Nos. 4 and 5, good results could not be obtained in terms of adhesion and fixation.
In Comparative Example No. 4, since the heat treatment temperature was equal to or lower than the softening temperature of the adhesive, the adhesive did not adhere, but the adhesion was poor. Comparative Example No. 5 was in a fixed state because the heat treatment temperature exceeded the melting point of the resin film. For this reason, it was not possible to evaluate the adhesion of the resin film.
【0027】[0027]
【発明の効果】以上詳述したように本発明においては、
熱処理温度を接着剤の軟化温度乃至樹脂膜の融点とする
ことにより、容器同士が固着しないと共に、樹脂膜の密
着性が優れる容器を得ることができる。また、容器を一
つ毎に分けて熱処理する必要なく、複数個の容器を同時
に処理することができため、容器の生産性を向上させる
ことができる。As described in detail above, in the present invention,
By setting the heat treatment temperature to the softening temperature of the adhesive or the melting point of the resin film, it is possible to obtain a container in which the containers are not adhered to each other and the adhesion of the resin film is excellent. In addition, a plurality of containers can be processed at the same time without having to heat-treat the containers one by one, so that the productivity of the containers can be improved.
【0028】更に、この容器成形品は、特にコンデンサ
キャップ等の電子部品に適用することができる。Further, the container molded product can be applied particularly to an electronic component such as a capacitor cap.
Claims (2)
の少なくとも1面に形成された樹脂膜とを軟化温度が4
0℃以上で前記樹脂膜の軟化温度以下である接着剤によ
り接着した樹脂被覆材を絞りしごき加工する工程と、前
記接着剤の軟化温度以上で前記樹脂膜の融点以下の温度
で熱処理する工程と、を有することを特徴とする樹脂被
覆容器の製造方法。A softening temperature of a substrate made of a metal or an alloy and a resin film formed on at least one surface of the substrate are 4
A step of squeezing and ironing a resin coating material bonded by an adhesive having a temperature equal to or higher than 0 ° C. and equal to or lower than the softening temperature of the resin film, and a step of performing a heat treatment at a temperature equal to or higher than the softening temperature of the adhesive and equal to or lower than the melting point of the resin film. And a method for producing a resin-coated container.
0℃低い温度以上で前記樹脂膜の融点以下の温度で行う
ことを特徴とする請求項1に記載の樹脂被覆容器の製造
方法。2. The method according to claim 1, wherein the heat treatment is performed at a temperature from the melting point of the resin film.
The method for producing a resin-coated container according to claim 1, wherein the temperature is lower than 0 ° C and lower than the melting point of the resin film.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11084558A JP2000271685A (en) | 1999-03-26 | 1999-03-26 | Manufacture of resin-coated container |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11084558A JP2000271685A (en) | 1999-03-26 | 1999-03-26 | Manufacture of resin-coated container |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2000271685A true JP2000271685A (en) | 2000-10-03 |
Family
ID=13833983
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11084558A Pending JP2000271685A (en) | 1999-03-26 | 1999-03-26 | Manufacture of resin-coated container |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2000271685A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018043274A (en) * | 2016-09-15 | 2018-03-22 | 昭和電工パッケージング株式会社 | Covering material of aluminum alloy rolled sheet material for small sized electronic appliance case |
-
1999
- 1999-03-26 JP JP11084558A patent/JP2000271685A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018043274A (en) * | 2016-09-15 | 2018-03-22 | 昭和電工パッケージング株式会社 | Covering material of aluminum alloy rolled sheet material for small sized electronic appliance case |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6340518B1 (en) | Flexible metal-clad laminates and preparation of the same | |
JPH01192546A (en) | Laminated steel plate having two-layer film structure and preparation thereof | |
GB2091634A (en) | Transfer lamination of vapour deposited copper thin sheets and films | |
JP2000271685A (en) | Manufacture of resin-coated container | |
JP2001164202A (en) | Pressure-sensitive adhesive tape-rolled material and method of producing the pressure-sensitive adhesive tape | |
JPH08281866A (en) | Production of flexible metal foil laminated sheet | |
JP3552896B2 (en) | Laminate aluminum or aluminum alloy plate for drawing and ironing and method for producing the same | |
JP2000036443A (en) | Electrolytic capacitor outer case and manufacture thereof | |
JP3186206B2 (en) | Outer container for electronic components | |
JP4113475B2 (en) | RESIN FILM COVERED METAL PLATE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT CONTAINER | |
JPS61182942A (en) | Substrate for heat-resistant flexible printed wiring and manufacture thereof | |
JP2933220B2 (en) | Polyamide resin-metal laminate | |
JP2857669B2 (en) | Polyamide resin-metal laminate | |
JP2000025154A (en) | Laminated aluminum panel for drawing/squeezing processing and production thereof | |
JP2623598B2 (en) | Manufacturing method of aluminum electrolytic capacitor | |
JPS61236882A (en) | Cover-lay film | |
JPH03271362A (en) | Vapor-deposited electric insulating metal film | |
JP2000239863A (en) | Resin coated aluminum or aluminum alloy material | |
JPH10303085A (en) | Capacitor cap and its manufacture | |
JPH03264390A (en) | Insulating transfer foil | |
JP4163362B2 (en) | Synthetic resin-metal laminate | |
JPH04219178A (en) | Production of metallic material coated with resin | |
JPH06310834A (en) | Transfer sheet for injection molded printted-wiring body | |
JP3952382B2 (en) | Method for producing resin-coated metal sheet | |
JPH02277221A (en) | Manufacture of outer package container for electronic component |