JP2000266809A - Device and method for modifying location of ic lead - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device and method for modifying the locations of IC leads capable of improving the reliability of tests on electric characteristics. SOLUTION: A device in relation to this invention for modifying the locations of IC leads includes and is constituted of an IC socket 4 provided with guide plates 41 and a pusher 5 mounted to be used on the surface of the IC socket 4 at which the guide plates 41 are arranged. As the pusher 5 comprises a surface opposing to the IC socket 4 in a shape along an inclined surface, it is possible to bring the IC leads into contact with pins 3 at correct locations. Therefore, it is possible to reduce the occurrence of contact failures and to improve the reliability of tests on electric characteristics.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an IC lead position correcting device and an IC lead position correcting method. In particular,
The present invention relates to a device and a method for correcting the position of an IC lead used for testing an IC package.

[Prior art]

Conventionally, for an assembled IC,
A temperature test, an electric characteristic test, and the like are performed to check a temperature characteristic and an electric characteristic. In performing these tests, an apparatus that automatically supplies an IC, which is a device under test, to a test system and automatically sorts and stores the ICs based on test results, a so-called handler, is used. For example, when the handler is used for examining electrical characteristics, an IC provided with pins for electrically connecting to a test circuit is provided.
A method has been used in which electrical characteristics are examined by bringing a lead portion of an IC to be measured (hereinafter, referred to as an IC lead) into contact with the pin using a socket. FIG. 5A is a schematic diagram (a plan view) of an electric measurement test of an IC using a conventional IC socket. FIG. 5 (a)
5 (c) and 5 (b) are cross-sectional views along the AA 'plane and the BB' plane shown in FIG. When the test of the IC 1 is performed using the IC socket 54 and the pusher 55, as shown in FIG.
Press down in the direction of the guide plate 541 installation surface of the C socket 54 (in the direction of arrow C) to push the IC lead 2 and the IC socket 54.
An electrical characteristic test is performed by contacting the pin 53 provided in the first position. As shown in FIG. 5A, the IC 1 is installed on an IC socket 54, and an IC lead 2 is formed on the outer periphery of the IC 1 so as to extend therefrom. In the conventional IC socket 54, a plurality of guide plates 541 are respectively installed substantially in parallel so as to form a comb shape,
A pin 53 is provided so as to protrude from the bottom of the comb-shaped groove 56 formed between the guide plates 541. The pins 53 are formed to protrude above the plurality of guide plates 541. In addition, the pusher 55
Is mounted on the IC socket 54 and is used to move the pusher 55 in the direction of arrow C to bring the IC lead 2 into contact with the pin 53.

However, in the conventional IC socket 54 and pusher 55 shown in FIGS. 5 (a) to 5 (c), as shown in FIG.
When the pusher 55 is pressed against the IC socket 54 and the pin 53 comes into contact with the side surface of the IC lead 2 when the pusher 55 is pressed against the IC socket 54, the IC lead 2 is bent, The problem that the pin 53 does not contact occurs. Thus, if the IC lead 2 is bent or does not contact the pin 53 at all, a correct test result cannot be obtained.

In order to solve the above-mentioned problem, Japanese Utility Model Application
1-93990 discloses an IC socket as shown in the plan view of FIG. The conventional IC socket 64 shown in FIG. 6A is different from the IC socket 64 shown in FIG.
6 (b) and 6 (b).
(C) shows the AA ′ plane and B shown in FIG.
It is sectional drawing in the -B 'plane. Conventional IC socket 6
4 includes a plurality of guide plates 64, as shown in FIG.
Each of the guide plates 641 has a pin 63 disposed so as to protrude from a bottom surface of a groove 66 formed between the guide plates 641. Are formed so as to protrude above the pins 63, and a taper 642 is provided at the upper end of the guide plate 641. The taper 642 refers to a portion where a surface inclined in the direction of the pin 63 adjacent to the upper surface of the guide plate 641 is formed.

[0005]

However, the conventional IC socket shown in FIG. 6 has the following problems. In recent years, the size of IC packages has been reduced, and the number of IC leads has tended to increase with the progress of miniaturization. IC leads have also been miniaturized and miniaturized, so that they are more easily bent. For this reason, even a slight bend causes insufficient contact with the pin. Also, IC
Even if there is a slight displacement when the package is installed in the IC socket, poor contact between the IC lead and the pin occurs.
On the other hand, in the IC socket 64 shown in FIG.
When the IC lead 2 is displaced as shown in FIG. 6C, the taper 642 is provided so that the IC lead 2 is connected to the pin 6 as shown in FIG.
3 to correct the position. However, even if the position of the IC lead 2 can be corrected on the pin 63, as shown in FIG.
There may be a case where the C lead 2 is not accurately set substantially at the center of the pin 63. As described above, since the IC leads are also miniaturized and miniaturized with the miniaturization of the IC package, even if there is a slight displacement when the IC package is installed in the IC socket, the IC lead and the pin may be displaced. Poor contact occurs. For this reason, as shown in FIG. 6D, if the IC lead 2 is not installed so as to be located substantially at the center of the pin 63, the above-described contact failure occurs, and an accurate test result is obtained. There was a problem that it was not possible.

The present invention has been made in view of the above-mentioned problems in the prior art. An object of the present invention is to provide an IC lead position correcting device and an IC lead position correcting method that can improve the reliability of an electrical characteristic test.

[0007]

Means for Solving the Problems The first invention of the present application, which is provided to solve the above problems, has a plurality of guide plates extending substantially in parallel from the same plane and arranged between the guide plates. A pin installed so as to protrude from the bottom surface of the formed groove, wherein the guide plate is formed so as to protrude above the pin, and a surface inclined in the direction of an adjacent pin is formed by the guide plate. An IC socket provided at each upper end of the IC socket, and the I socket for contacting an IC lead and the pin.
An IC lead position correcting device, which is used by being installed on a C socket, wherein the surface facing the IC socket has a pusher having a shape along the inclined surface.

[0008] The IC of the first invention of the present application having the above configuration.
According to the lead position correcting device, the guide plate is formed so as to protrude above the pin, and a surface inclined in the direction of the adjacent pin is provided at the upper end of the guide plate.
The IC socket is used by being placed on the IC socket to make an IC lead and the pin contact with each other.
Since the surface facing the socket has a pusher having a shape along the inclined surface, the IC lead and the pin can be brought into contact at a correct position, thereby reducing the occurrence of poor contact. Thus, the reliability of the electrical characteristic test can be improved.

Further, the second invention of the present application provides a plurality of guide plates extending substantially in parallel from the same plane and installed so as to protrude from the bottom of a groove formed between the guide plates. An IC socket, wherein the guide plate is formed so as to protrude above the pin, and a surface inclined in the direction of the adjacent pin is provided at each upper end of the plurality of guide plates. And a pusher having a wavy cross section suitable for each upper end of the plurality of guide plates.

The IC of the second invention of the present application having the above configuration
According to the lead position correcting device, the guide plate is formed so as to protrude above the pins, and an IC socket having a surface inclined in the direction of the adjacent pin is provided at each upper end of the plurality of guide plates. And a pusher having a wavy cross section adapted to each upper end of the plurality of guide plates, so that the IC lead and the pin are brought into contact with each other so that the IC lead is substantially at the center of the pin. Therefore, the occurrence of poor contact can be reduced, and the reliability of the electrical characteristic test can be improved.

The third invention of the present application is directed to a plurality of guide plates having a comb shape, and a pin provided so as to protrude from a bottom surface of a comb-shaped groove formed between the guide plates. The guide plate is formed so as to protrude above the pins, and an IC socket having a tapered upper end at each of the plurality of guide plates is brought into contact with an IC lead and the pins. And a pusher which is used by being set on the IC socket, and a taper having a shape substantially matching the taper is provided on a surface of the pusher facing the IC socket. Is a position correcting device.

The IC according to the third invention of the present application having the above configuration.
According to the lead position correcting device, an IC socket having a taper at each upper end of the plurality of guide plates, and an IC socket
A pusher installed and used on the IC socket to contact the lead with the pin,
By providing a taper having a shape substantially matching the taper on the surface of the pusher facing the IC socket, by matching the taper provided on the IC socket with the pin provided on the pusher, I
Since the C lead and the pin can be brought into contact with each other without displacement, the occurrence of poor contact can be suppressed, and the reliability of the electrical characteristic test can be improved.

The position correcting device for an IC lead according to the fourth invention of the present application is the device for correcting the position of an IC lead according to any one of the first invention to the third invention of the present application,
A space equal to or larger than the cross-sectional diameter of the IC lead is secured on the pin with the surface of the pusher facing the IC socket and the upper end of the guide plate in contact with each other.

The IC according to the fourth invention of the present application having the above configuration.
According to the lead position correcting device, a space equal to or larger than the cross-sectional diameter of the IC lead is secured on the pin with the surface of the pusher facing the IC socket and the upper end of the guide plate in contact with each other. Since the pusher is joined to the IC socket and the IC lead is placed in the space above the pin, the IC lead can be reliably placed at substantially the center on the pin.

According to a fifth aspect of the present invention, there are provided a plurality of guide plates extending substantially in parallel from the same plane, and provided so as to protrude from a bottom portion of a groove formed between the guide plates. Wherein the guide plate is formed so as to protrude above the pin, and a surface inclined in the direction of the adjacent pin is provided at each upper end of the guide plate.
A socket and a pusher, which is used by being placed on the IC socket to contact an IC lead and the pin, and has a surface facing the IC socket having a shape along the inclined surface, is provided on the pin. After the position of the IC lead is corrected by the surface inclined in the pin direction after the IC lead is set in the IC, the position of the IC lead is corrected again by overlapping the IC socket and the pusher. This is a lead position correction method.

The IC according to the fifth invention of the present application having the above configuration.
According to the lead position correcting method, after the IC lead is set on the pin, the IC is inclined by the surface inclined in the pin direction.
After the position of the lead is corrected, the position of the IC lead is corrected again by overlapping the IC socket and the pusher, so that the IC lead and the IC lead are positioned substantially at the center of the pin. Since the pins can be brought into contact, the occurrence of poor contact can be reduced, and the reliability of the electrical characteristic test can be improved.

According to a sixth aspect of the present invention, there are provided a plurality of guide plates extending substantially in parallel from the same plane, and provided so as to protrude from a bottom portion of a groove formed between the guide plates. An IC socket, wherein the guide plate is formed so as to protrude above the pin, and a surface inclined in the direction of the adjacent pin is provided at each upper end of the plurality of guide plates. Using a pusher having a wavy cross section suitable for each upper end of the plurality of guide plates, the position of the IC lead was corrected by a surface inclined in the pin direction after installing the IC lead on the pin. Thereafter, the position of the IC lead is corrected again by overlapping the IC socket with the pusher.

The IC according to the sixth invention of the present application having the above configuration.
According to the lead position correcting method, after the IC lead is set on the pin, the IC is inclined by the surface inclined in the pin direction.
After the position of the lead is corrected, the position of the IC lead is corrected again by overlapping the IC socket and the pusher, so that the IC lead and the IC lead are positioned substantially at the center of the pin. Since the pins can be brought into contact with each other, the occurrence of poor contact can be minimized, and the reliability of the electrical characteristic test can be improved.

In a seventh aspect of the present invention, a plurality of guide plates forming a comb shape, and a pin provided so as to protrude from a bottom surface of a comb-shaped groove formed between the guide plates are provided. The guide plate is formed so as to protrude above the pins, and an IC socket having a tapered upper end at each of the plurality of guide plates is brought into contact with an IC lead and the pins. After installing the IC lead on the pin using a pusher provided on the surface facing the IC socket, the taper having a shape substantially matching the taper is used for installation on the IC socket. After the position of the IC lead is corrected by the taper provided at the upper end of each of the guide plates, the taper provided at the upper end of each of the plurality of guide plates is provided on the surface of the pusher facing the IC socket. It was a position correction method of the IC leads and performs position correction again IC lead by overlapping and tapered.

The IC of the seventh invention of the present application having the above configuration
According to the method of correcting the position of the lead, after the IC lead is mounted on the pin, the position of the IC lead is corrected by the taper provided at the upper end of each of the guide plates. The position of the IC lead is corrected again by overlapping the provided taper with the taper provided on the surface of the pusher facing the IC socket, so that the IC lead is installed at substantially the center of the pin. The contact between the IC lead and the pin can be performed in a state where the contact is made, so that the occurrence of poor contact can be suppressed, and the reliability of the electrical characteristic test can be improved.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an IC lead position correcting apparatus and an IC lead position correcting method according to an embodiment of the present invention will be described with reference to the drawings. This is only an example showing the IC lead position correcting device and the IC lead position correcting method. FIG. 1 is a plan view showing an IC lead position correcting device according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of the IC lead position correcting device shown in FIG. FIG.
FIG. 2 is a cross-sectional view of the IC lead position correcting device shown in FIG. FIG. 4 is a diagram showing a method for correcting the position of an IC lead using the device for correcting the position of an IC lead shown in FIG.

As shown in FIGS. 1 and 2, an IC lead position correcting device according to an embodiment of the present invention includes an IC socket 4 provided with a guide plate 41, and a guide plate for the IC socket 4. 41 and a pusher 5 used by being stacked on the installation surface. The IC socket 4 and the pusher 5 are originally used for testing the electrical characteristics of the IC lead 2 portion installed on the IC 1, but the IC socket 2 and the pusher 5 are used to test the electrical characteristics of the IC lead 2 generated during the electrical characteristic test. It also has a function to correct misalignment. IC1 is
As shown in FIG. 1, it is installed on the IC socket 4,
An IC lead 2 is formed to extend around the outer periphery of the IC 1. When testing the IC 1 using the IC socket 4 and the pusher 5, the pusher 5
An electrical characteristic test is conducted by contacting the IC lead 2 with the pin 3 provided on the IC socket 4 by pressing and moving the IC lead 2 toward the guide plate 41 installation surface of the socket 4. As shown in FIG. 3, the IC socket 4 has a plurality of guide plates 41 extending substantially in parallel from the same plane and protrudes from the bottom surface of the groove 6 formed between the guide plates 41. The guide plate 41 is formed so as to protrude above the pin 3, and a taper 42 is provided at an upper end of each of the plurality of guide plates 41. . The plurality of guide plates 41 arranged to extend substantially parallel from the same plane means to form a comb shape by extending substantially parallel from the same plane. The groove 6 formed between the guide plates 41 is
The comb-shaped groove 6 constituted by a plurality of guide plates 41
Means Furthermore, the upper surface of each guide plate 41 refers to a surface of the guide plate 41 that contacts the pusher 5. The pins 3 are arranged so as to be substantially parallel to the guide plate 41. On the other hand, as shown in FIG. 3, the pusher 5 is installed and used on the IC socket 4 to make the IC lead 2 and the pin 3 come into contact with each other. By providing the taper 51 having a shape substantially coinciding with the taper 42, in the pusher 5, the surface facing the IC socket 4 has a corrugated cross section adapted to each upper end of the plurality of guide plates 41. . In other words, the wavy cross section has a shape that substantially matches the upper end portions of the plurality of guide plates 41. In other words, the taper 42 refers to a portion of a surface inclined in the direction of the pin 3 adjacent to the upper surface of the guide plate 41. Further, the taper 5 having a shape substantially matching the taper 42.
In other words, 1 is a portion in which the surface facing the IC socket 4 has a shape along the surface inclined in the direction of the pin 3 adjacent to the upper surface of the guide plate 41. As described above, the IC socket 4 of the pusher 5
A space larger than the cross-sectional diameter of the IC lead 2 is secured on the pin 3 in a state where the upper surface of the guide plate 41 is in contact with the surface opposing the surface. Here, the transverse diameter of the IC lead 2 refers to the diameter of a cross section of the IC lead 2 in the lateral direction. In this manner, by securing a space above the cross-sectional diameter of the IC lead 2 on the pin 3, the IC lead 2 can be reliably installed at substantially the center on the pin 3.

Next, an IC using the device for correcting the position of the IC lead 2 shown in FIGS.
A method of correcting the position of the lead will be described with reference to FIG. First, as shown in FIG. 3, the IC lead 2 is placed above the pin 3. In this case, as shown in FIG. 4A, even if the IC lead 2 is displaced from the pin 3 and is not disposed on the pin 3, the guide plate 41 is provided with the taper 42. Therefore, the position of the IC lead 2 is corrected by itself, and as shown in FIG. 4B, the IC lead 2 and the pin 3 can be brought into contact. Further, in this case, the IC
Even if the lead 2 and the pin 3 can be brought into contact, as shown in FIG.
If it is not installed so as to be located substantially at the center of the pin 3, it causes a contact failure and a correct test result cannot be obtained. Therefore, as shown in FIG. 4C, the pusher 5 is pressed on the guide plate 41 so that the taper 42 provided on the guide plate 41 and the taper 51 provided on the pusher 5 match. Then, the position is corrected so that the IC lead 2 is set substantially at the center of the pin 3 (see FIG. 4D). As described above, since the IC lead 2 can be disposed substantially at the center of the pin 3, the occurrence of poor contact can be reduced, and the reliability of the electrical characteristic test can be improved.

[Brief description of the drawings]

FIG. 1 is a plan view showing an IC lead position correcting device according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of the IC lead position correcting device shown in FIG.

FIG. 3 is a cross-sectional view of the IC lead position correcting device shown in FIG.

FIG. 4 is a diagram (a cross-sectional view taken along the line AA ′ in FIG. 1) illustrating a method for correcting the position of the IC lead using the device for correcting the position of the IC lead illustrated in FIG. 1;

FIG. 5 is a diagram showing an example of a conventional IC socket.

FIG. 6 is a diagram showing an example of a conventional IC socket.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC 2 IC lead 3.553.63 pin 4.54.64 IC socket 5.55.65 Pusher 6.56.66 groove 51 taper 41.541.641 guide plate 42.642 taper

Claims (7)

[Claims] A plurality of guide plates extending substantially in parallel from the same plane, and pins provided so as to protrude from a bottom surface of a groove formed between the guide plates. ,
The guide plate is formed so as to protrude above the pins, and a surface inclined in the direction of an adjacent pin is provided at an upper end of each of the plurality of guide plates to contact an IC socket with an IC lead. An IC lead position correcting device, comprising: a pusher having a surface facing the IC socket and having a shape along the inclined surface. 2. A vehicle comprising: a plurality of guide plates extending substantially in parallel from the same plane; and pins disposed so as to protrude from a bottom surface of a groove formed between the guide plates. ,
The guide plate is formed so as to protrude above the pins, and an IC socket having a surface inclined in the direction of the adjacent pin is provided at each upper end of the plurality of guide plates, and each of the plurality of guide plates A position correcting device for an IC lead, comprising: a pusher having a wave-like cross section adapted to an upper end portion. 3. A guide comprising: a plurality of guide plates forming a comb shape; and pins provided so as to protrude from a bottom portion of a comb-shaped groove formed between the guide plates. The board is formed so as to protrude above the pins, and is mounted on the IC socket in which a taper is provided at each upper end of the plurality of guide plates, and an IC lead is provided for contacting the IC lead with the pins. And a pusher which is used as a pusher, and a taper having a shape substantially matching the taper is provided on a surface of the pusher facing the IC socket. 4. A space equal to or larger than the cross-sectional diameter of an IC lead is secured on said pin in a state where a surface of said pusher facing said IC socket and an upper end of said guide plate are in contact with each other. The device for correcting the position of an IC lead according to any one of claims 1 to 3. 5. A semiconductor device comprising: a plurality of guide plates extending substantially in parallel from the same plane; and pins provided so as to protrude from a bottom surface of a groove formed between the guide plates. ,
The guide plate is formed so as to protrude above the pins, and a surface inclined in the direction of an adjacent pin is provided at an upper end of each of the plurality of guide plates to contact an IC socket with an IC lead. Using a pusher having a shape facing the IC socket and having a shape along the inclined surface, wherein the IC lead is mounted on the pin and used in the direction of the pin. After correcting the position of the IC lead by the surface inclined to
A method for correcting the position of an IC lead, wherein the position of the IC lead is corrected again by overlapping the IC socket and the pusher. 6. A guide plate comprising a plurality of guide plates extending substantially in parallel from the same plane and a pin provided so as to project from a bottom surface of a groove formed between the guide plates. ,
The guide plate is formed so as to protrude above the pins, and an IC socket having a surface inclined in the direction of the adjacent pin is provided at each upper end of the plurality of guide plates, and each of the plurality of guide plates Using a pusher having a wave-shaped cross section adapted to the upper end, after mounting the IC lead on the pin and then correcting the position of the IC lead by a surface inclined in the pin direction, the IC socket and the pusher And correcting the position of the IC lead again by superimposing the ICs. 7. A guide comprising: a plurality of guide plates forming a comb shape; and pins arranged so as to protrude from a bottom surface of a comb-shaped groove formed between the guide plates. The board is formed so as to protrude above the pins, and is mounted on the IC socket in which a taper is provided at each upper end of the plurality of guide plates, and an IC lead is provided for contacting the IC lead with the pins. Using a pusher provided on the surface facing the IC socket, the taper having a shape substantially matching the taper is used to place an IC lead on the pin, and then to an upper end of each of the guide plates. After correcting the position of the IC lead by the provided taper, the taper provided at the upper end of each of the plurality of guide plates and the taper provided on the surface of the pusher facing the IC socket are overlapped. Position correction method of the IC leads and performs position correction again IC lead by Rukoto.