JP2000263258A - Method for working non-metal material substrate and device therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To attain a high cleaving speed and to promote rounding of a cleaved edge part. SOLUTION: When a crack 5 is generated by irradiating a non-metal material substrate 1 surface with a laser beam 3-2 while blowing inert gases 8-1, 8-2 containing fluorine and the crack propagates, the surface of the substrate 1 is turned to a plasma state by irradiation of the laser beam 3-2 and blowing of the inert gases 8-1, 8-2 containing fluorine, the development of the crack 5 is accelerated, and further the edge part of the generated crack 5 is etched by fluorine gas and rounded.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method and an apparatus for processing a non-metallic material substrate.

[0002]

2. Description of the Related Art Various methods are known for cutting a non-metallic material substrate such as a glass substrate. Among the cutting methods, there is a cutting method by laser irradiation.

FIG. 9 is a conceptual diagram showing a conventional method for processing a non-metallic material substrate.

In this processing method, a laser beam (for example, a CO ₂ laser beam) 3-1 propagated as a parallel beam is condensed by a condenser lens 4 and irradiated on a processing glass substrate 1 as a laser beam 3-2. Then, cracks 5 due to thermal stress are generated on the processing glass substrate 1 using light energy, and the processing glass substrate 1 is moved at a desired speed in the direction of arrow 2 to propagate the cracks 5. This is a so-called cutting method for dividing the glass substrate 1 for use. When the processing glass substrate 1 is divided by using this cleavage, FIG.
As shown in FIG. 5, the cut cross sections of the divided glass substrate 1-1 and glass substrate 1-2 are substantially vertical end faces. FIG. 10 is a cross-sectional view of the glass substrate cut by the processing method shown in FIG.

[0005]

However, the conventional glass substrate processing method has the following problems.

(1) Since the split sections 6a and 6b are vertical end faces, when the split edges 7-1, 7-2, 7-3 and 7-4 come into contact with other members (not shown), the split sections are cut. Edge part 7-1
7-4, cracks 5 are generated, and the cracks 5 are likely to develop and cracks are likely to occur in the glass substrate 1 for processing.

(2) Due to the contact described in (1), chipping of the glass piece easily occurs from the cleaved edge portions 7-1 to 7-4.

(3) In order to solve the problems (1) and (2), the cleaved edge portions 7-1 to 7-4 must be rounded using a grindstone or an abrasive. Water treatment is required. However, since the cut glass substrates 1-1 and 1-2 are immersed in water, a drying process must be provided.
The cost is high because of the expense. Also, the glass substrate 1
If (1-1, 1-2) gets wet with water, it affects the electrical and optical properties.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method and an apparatus for processing a non-metallic material substrate which solves the above-mentioned problems, has a high cutting speed, and can promote the rounding of the cut edge.

[0010]

In order to achieve the above object, a method for processing a non-metallic material substrate according to the present invention comprises moving a non-metallic material substrate at a desired speed and applying a laser beam to a surface of the non-metallic material substrate. Irradiation, the thermal energy of the laser beam is used to generate a crack in the non-metallic material substrate by thermal stress, and the non-metallic material substrate is cut by expanding the crack. An inert gas containing fluorine is blown onto the irradiated surface of the non-metallic material substrate.

In addition to the above configuration, in the method of processing a nonmetallic material substrate according to the present invention, a laser beam may be moved instead of moving the nonmetallic material substrate.

In addition to the above structure, the method of processing a non-metallic material substrate according to the present invention further comprises the steps of:
It is preferable to blow an inert gas containing fluorine while irradiating the laser beam again.

In addition to the above structure, the method for processing a non-metallic material substrate according to the present invention further comprises:
F ₄ , C ₃ F ₈ , C ₂ F ₆ , XeF _2, etc.
It is preferable to use a He gas or an Ar gas containing various types.

In the method for processing a non-metallic material substrate of the present invention, in addition to the above configuration, it is preferable to use a laser beam of CO ₂ , CO, excimer or the like as the laser beam.

In addition to the above structure, the method for processing a non-metallic material substrate according to the present invention is characterized in that the shape of the laser beam applied to the surface of the non-metallic material substrate is substantially circular, substantially elliptical or linear having a desired width and a desired length. Preferably, either one is used.

In addition to the above structure, the method of processing a non-metallic material substrate according to the present invention comprises fixing the non-metallic material substrate on a grooved work table, irradiating the non-metallic material substrate with a laser beam, and irradiating the laser beam to the groove. It is preferred that it be above the groove of the work table with the attachment.

In addition to the above structure, in the method for processing a non-metallic material substrate of the present invention, it is preferable to perform rapid heating and rapid cooling by rapidly cooling immediately after the laser beam irradiation surface of the non-metallic material substrate.

In addition to the above structure, in the method of processing a nonmetallic material substrate according to the present invention, the processing is preferably performed in a box with a forced exhaust mechanism.

According to the present invention, there is provided an apparatus for processing a non-metallic material substrate, comprising: a moving stage capable of fixing the non-metallic material substrate and moving the non-metallic material substrate at a desired speed in at least one axial direction; And a laser oscillating device for irradiating the non-metallic material substrate with a blowing device for blowing an inert gas containing fluorine onto the surface of the nonmetallic material substrate.

In addition to the above configuration, the apparatus for processing a nonmetallic material substrate of the present invention preferably has a laser beam moving mechanism for moving a laser beam.

In addition to the above configuration, the apparatus for processing a nonmetallic material substrate of the present invention preferably has a transport mechanism for transporting fluorine gas with an inert gas.

In addition to the above configuration, in the apparatus for processing a nonmetallic material substrate of the present invention, it is preferable to use a laser oscillation device such as CO ₂ , CO, excimer, etc. as the laser oscillation device.

In addition to the above-described structure, the apparatus for processing a non-metallic material substrate according to the present invention provides a deformation mechanism capable of deforming a laser beam from a laser oscillation apparatus into a substantially circular shape, a substantially elliptical shape, or a linear shape having a desired width and length. It is preferred to have

In addition to the above configuration, the apparatus for processing a non-metallic material substrate of the present invention preferably has a work table for fixing the non-metallic material substrate on the moving stage, and a groove is preferably formed on the work table. .

In addition to the above structure, the apparatus for processing a non-metallic material substrate of the present invention preferably has a rapid cooling device for rapidly cooling the surface of the non-metallic material substrate.

In addition to the above configuration, the apparatus for processing a non-metallic material substrate according to the present invention may have a reciprocating mechanism for reciprocating the non-metallic material substrate or the laser beam in a desired direction.

[0027] In addition to the above configuration, in the apparatus for processing a non-metallic material substrate according to the present invention, it is preferable that a box with a forced exhaust mechanism is provided in a processing portion of the non-metallic material substrate.

According to the processing method of the present invention, a crack is generated by irradiating a laser beam while blowing an inert gas containing fluorine (He gas, Ar gas, or the like) onto the substrate surface.
When the crack is propagated, the laser beam irradiation and the blowing of an inert gas containing fluorine cause the substrate surface to be in a plasma state, the crack growth speed becomes faster, and the edge surface of the generated crack becomes Rounded by etching with fluorine gas.

In particular, when a glass substrate is used as the non-metallic material substrate, the blowing of the inert gas containing fluorine can strongly promote the etching of the edge portion.

The etching is promoted by transporting the fluorine gas with an inert gas.

According to the processing method of the present invention, the size of the processing apparatus can be reduced by cutting the laser beam by moving the stage instead of moving the stage.

Furthermore, according to the processing method of the present invention, a fluorine-based gas (CF ₄ , C ₃ F ₈ , C ₂ F ₆ ,
XeF ₂ etc.) according to the material of the substrate. In addition, since these fluorine-based gases react by being sprayed locally on the substrate surface heated to a high temperature (500 to 800 ° C.) by laser beam irradiation, the etching of the substrate surface and the growth of cracks are promoted, No adverse effect on the substrate surface. Further, since the fluorine gas blowing process is a clean dry process, HF hardly occurs.

According to the processing method of the present invention, a non-metallic material substrate (glass, ceramics, sapphire, LiNb
O ₃ , LiTaO ₅ , Si with an insulating film, etc.) are used because a laser beam such as CO ₂ , CO, excimer, etc., in which the laser beam is well absorbed, is used, so that cutting can be performed at high speed.

According to the processing method of the present invention, the shape of the laser beam applied to the substrate surface can be selected from any of a substantially circular shape, a substantially elliptical shape, and a linear shape. be able to.

According to the processing method of the present invention, since the non-metallic material substrate is fixed on the grooved work table, and the laser beam is irradiated on the substrate surface above the groove, the edge of the front surface and the rear surface of the cut substrate are cut. An inert gas containing fluorine is blown to the portions, and both edges can be rounded.

According to the processing method of the present invention, a very high temperature difference is given to the substrate by rapidly cooling immediately after the surface of the substrate irradiated with the laser beam. Can be improved.

According to the processing method of the present invention, after cutting by laser beam irradiation while blowing a gas containing fluorine, the laser beam is irradiated while blowing a gas containing fluorine again on the substrate edge portion cut again. In addition, the substrate edge can be more rounded.

According to the processing method of the present invention, since the non-metallic material substrate is cut in a box with a forced exhaust mechanism, moisture and dust in the air do not adhere to the substrate. In addition, a safe operation can be performed without an inert gas containing fluorine leaking to the outside.

According to the processing apparatus of the present invention, it is possible to cut a non-metallic material substrate and to round off the cut edge.

According to the processing apparatus of the present invention, a lower price,
A small device can be provided.

According to the processing device of the present invention, the type of the laser oscillation device can be selected according to the type of the non-metallic material substrate, and it can be used as a processing device for a wide range of non-metallic material substrates.

According to the processing apparatus of the present invention, it is possible to perform linear cutting, curve cutting, high-speed cutting, high dimensional accuracy cutting, and the like on various non-metallic material substrates by using a laser beam shape deformation mechanism. Can be.

According to the processing apparatus of the present invention, the cut front and back edges of the nonmetallic material substrate can be rounded.

According to the processing apparatus of the present invention, a nonmetallic material substrate can be cut with higher speed and higher dimensional accuracy.

According to the processing apparatus of the present invention,
An apparatus having a rounding step and a further rounding step can be provided.

According to the processing apparatus of the present invention, it is possible to provide an apparatus having a dry-clean processing step and a safer processing step.

[0047]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.

FIG. 1 is a conceptual diagram showing one embodiment of a method for processing a non-metallic material substrate according to the present invention.

This method uses a non-metallic material substrate (hereinafter referred to as a “substrate”).
That. 1) While moving 1 in the direction of arrow 2 at a desired speed, while irradiating the CO ₂ laser beam 3-2 from one end (left end in the figure) of the substrate 1, the direction of arrows 8-1 and 8-2 Is sprayed with He gas containing CF ₄ (hereinafter referred to as “8-1, 8-2”) to gradually generate and propagate a crack 5 from one end to the other end (the right end in the figure), thereby cutting the steel. It is a way to make it.

As the CO ₂ laser beam, a laser beam 3-2 obtained by condensing a parallel beam 3-1 by passing through a condenser lens 4 is used. This laser beam 3-2 may use either continuous oscillation or pulse oscillation.
He gases 8-1 and 8-2 containing CF ₄ are blown along the propagation direction of the laser beam 3-2. This gas pressure is preferably in the range of 0.5 kg / cm ² to several kg / cm ² . It is preferable that the gas pressure is higher to promote the rounding of the cleaved edge portion. The substrate 1 may be made of quartz glass, multi-component glass (borosilicate glass, soda lime glass, non-alkali glass, etc.), ceramics, sapphire, Li
NbO ₅ or the like can be used.

In particular, a multi-component glass or ceramic substrate that requires rounding of the cleaved edge portion is suitable for this processing method.

Next, the working method shown in FIG. 1 will be described in detail.

The substrate 1 is a non-alkali glass substrate (size: thickness 1.1 mm, length 500 mm, width 750 mm)
The substrate 1 is moved at 20 mm / sec by using
Irradiate an O ₂ laser beam (approximately circular with a continuous oscillation output of 80 W and a beam spot diameter of 1.5 mm) 3-2 and a CF
₄ with 500 cc / min of He gas
2kg / c in the directions of arrows 8-1 and 8-2
The cracks 5 could be generated in the substrate 1 by spraying at a pressure of m ² , and the cracks 5 could be propagated to divide and split the substrate 1 into two. The cut edge of the substrate 1 was rounded to such an extent that the hand would not be damaged even if touched.

[0054] Incidentally, as a result of fracture not flush the CF ₄ in order to confirm the effect of He gas containing CF _4, cleaving rate was found to be about 8% slower. Further, the cleaved edge portion was clearly a vertical edge, and it was confirmed that the effect of introducing the fluorine gas was effective.

FIG. 2 is a conceptual diagram showing another embodiment of the method for processing a non-metallic material substrate according to the present invention.

In this processing method, a gap g is provided between the substrate 1-1 and the substrate 1-2 cut by the processing method shown in FIG. 1, and He gas containing CF ₄ is again supplied to the gap g with an arrow. 8
The edge portions 9-1, 9-2, 9-3, 9-4 of the substrates 1-1, 1-2 cut by irradiating the CO ₂ laser beam 3-2 while spraying in the directions of -1, 8-2. This is a method of rounding.

The substrate 1-1 and the substrate 1-2 are cleaved while being moved at a desired speed.

FIG. 3 is a schematic view of a cleaved edge portion after being rounded by the method shown in FIG.

Edge portions 9-1 to 9-1 on the front and back surfaces of substrate 1
9-4 could be rounded. In FIG. 2, the focal point of the CO ₂ laser beam 3-2 is the substrate 1-1 (1).
It is preferable that light is condensed to a substantially center part of the thickness of -2).

FIG. 4 is a conceptual diagram of a processing apparatus to which the method for processing a nonmetallic material substrate according to the present invention is applied.

The processing apparatus comprises a moving stage 16 capable of moving the substrate 1 at least in one axial direction at a desired speed and a laser oscillator 10 for irradiating the surface of the substrate 1 with a laser beam 3-2. And a spraying device for blowing an inert gas containing fluorine onto the surface of the substrate 1.

The substrate 1 is fixed on a grooved work table 14 by vacuum suction. The work table 14 is moved by the motor (not shown) in the X-axis direction, the Y-axis direction, the Z-axis direction, and the θ-axis direction (a rotation angle based on the X axis in the XY plane) by the XYZθ moving stage 16. It has become. The parallel beam 3 emitted from the CO ₂ laser oscillator 10 is reflected in the hood 12 by the total reflection mirrors 11-1 and 11-2 while being reflected by arrows 3-3.
The light propagates in the directions 0 and 3-1 and is guided to the condenser lens 4.
The laser beam is condensed by the condensing lens 4 as shown by an arrow 3-2, and is irradiated on the substrate 1.

Here, the irradiation position of the laser beam is set on the surface of the substrate 1 directly above the grooves 15-1 and 15-2 of the work table 14. From the outer periphery of the laser beam 3-2, an inert gas containing at least one fluorine-based gas such as CF ₄ , C ₃ F ₈ , C ₂ F ₆ , XeF ₂ passes through the nozzle 13 through arrows 8-1 and 8 -Sprayed in two directions. The inert gas containing the fluorine-based gas enters the groove 15-1 through a small gap of the crack generated in the substrate 1, and
The cleaved edge portion on the back surface of is etched.

The work table 14 is in the X-axis direction,
The substrate 1 can be moved in the forward direction and the reverse direction in any of the axial direction, the Z-axis direction, and the θ-axis direction. That is, the work table 14 can reciprocate the substrate 1.

In FIG. 4, a total reflection mirror 11-1 and
A hood mechanism (for example, a bellows structure,
By providing a zoom structure), the work table 1
The substrate 1 can be cut by moving the laser beam 3-2 instead of moving the substrate 4. As a result, XYZθ
The moving stage 16 can have a simple structure, and a low-cost device can be realized. Further, instead of the CO ₂ laser oscillator 10, a CO laser oscillator, an excimer laser oscillator, or the like may be used.

FIG. 5 is a conceptual view showing another embodiment of the method for processing a non-metallic material substrate according to the present invention. FIG. 5A is a front view of a work table to which a non-metallic material substrate is fixed, and FIG. 5B is a side view of the work table to which a non-metallic material substrate is fixed.

As shown in FIGS. 5A and 5B, the arrow 2-
While irradiating a CO ₂ laser beam onto the substrate 1 fixed on a work table 14 moving at a desired speed in one direction, an inert gas containing fluorine gas is blown to simultaneously perform cutting and rounding. In this process, CO ₂
When the shape of the laser beam 3-2 is substantially circular or substantially elliptical, it is irradiated onto the substrate 1 in a defocused state. Also,
If the shape of the CO ₂ laser beam 3-2 is substantially linear with a width W and a length L, a ZnSe cylinder or tube is inserted between the condenser lens 4 and the substrate 1, and the condenser lens 4 and the cylinder are inserted. The width W and the length L are controlled by adjusting the distance of the (or circular tube) or the distance between the column (or circular tube) and the substrate 1.

The substrates 1-1 and 1-2 cut into two as shown in FIGS. 5A and 5B have rounded edges as shown in FIGS. 6A and 6B. Is performed.

FIG. 6 is a conceptual view showing another embodiment of the method for processing a non-metallic material substrate according to the present invention. FIG. 6A is a front view of a work table to which a non-metallic material substrate is fixed, and FIG. 6B is a side view of the work table to which a non-metallic material substrate is fixed.

That is, in this working method, the work table 14 is fixed with a slight gap between the cut substrates 1-1 and 1-2 on the work table 14, and the work table 14 is
This is a method of irradiating a CO ₂ laser beam 3-2 and blowing an inert gas containing fluorine while moving the CO ₂ laser beam 3-2 at a desired speed.

Here, the laser beam shown in FIGS. 5A and 5B is a CO ₂ laser beam, and FIGS.
The laser beam shown in (b) may be an excimer laser beam in addition to CO ₂ laser beam.

FIG. 7 is a conceptual diagram showing another embodiment of the method for processing a non-metallic material substrate according to the present invention. FIG. 7A is a front view of a work table to which a non-metallic material substrate is fixed, and FIG. 7B is a side view of the work table to which a non-metallic material substrate is fixed.

FIGS. 7A and 7B show FIGS. 5A and 5B, respectively.
Are obtained by adding other steps to the processing method shown in FIG. That is, in FIGS. 7A and 7B, a quenching agent is sprayed in the direction of arrow 17 immediately after the irradiation surface of the CO ₂ laser beam 3-2 moving on the substrate 1 to rapidly heat and cool, It is intended to promote cutting at a higher speed. Examples of the quenching agent include Freon gas (Hydrofluorocarbon, trade name: HFC1) which does not destroy the ozone layer.
34a, hydrochloroalkane, trade name HFA134
d, trade name of a quick-freezing agent minus 96, Freeze It 2000, etc.) can be used.

As shown in FIGS. 8 (a) and 8 (b), the two cut substrates 1-1 and 1-2 shown in FIGS. 7 (a) and 7 (b) have rounded edges. Will be

FIG. 8 is a conceptual diagram showing another embodiment of the method for processing a non-metallic material substrate according to the present invention. FIG.
8A is a front view of a work table to which a non-metallic material substrate is fixed, and FIG. 8B is a side view of the work table to which a non-metallic material substrate is fixed.

The present invention is not limited to the above embodiment.
First, in FIG. 4, if the processing portion (portion surrounded by the broken line 18) is covered with a box with a forced exhaust device and the processing is performed while performing the forced exhaust, dry-clean and highly safe processing can be realized. it can.

Here, He is the best gas for carrying the fluorine gas in promoting the rounding.
r gas may be used. Further, He gas in which H ₂ is mixed with CF ₄ may be used. Furthermore, CF ₄ , C ₃ F ₈ ,
It is also possible to use a fluorine gas for etching other than C ₂ F ₆ and XeF ₂ .

As described above, according to the present invention, (1) the cutting speed can be further increased by laser beam irradiation while blowing an inert gas such as He or Ar containing fluorine gas, Can be rounded together.

(2) By irradiating a laser beam while blowing an inert gas containing fluorine gas again onto the cleaved edge portion, the edge portion can be further rounded.

(3) Laser beams such as CO ₂ , CO, and excimer can be selectively used depending on the type and processing shape of the nonmetallic material substrate, and the laser beam shape can be selectively used in a substantially circular shape, a substantially elliptical shape, a substantially linear shape, and the like. Can be.

(4) Using a grooved work table for fixing the non-metallic material substrate, irradiating the substrate directly above the groove with a laser beam and blowing an inert gas containing fluorine onto the substrate, In addition, the cutting edge portion on the back surface can be rounded.

(5) In addition to laser beam irradiation and fluorine-based gas blowing, rapid cooling immediately after the laser beam irradiation portion on the substrate can improve the cutting speed and the cutting dimensional accuracy.

[0083]

In summary, according to the present invention, the following excellent effects are exhibited.

It is possible to provide a method of processing a nonmetallic material substrate and a device therefor, which have a high cutting speed and can promote the rounding of the cut edge portion.

[Brief description of the drawings]

FIG. 1 is a conceptual diagram showing one embodiment of a method for processing a nonmetallic material substrate according to the present invention.

FIG. 2 is a conceptual diagram showing another embodiment of the method for processing a nonmetallic substrate of the present invention.

FIG. 3 is a schematic view of a cleaved edge portion after being rounded by the method shown in FIG. 2;

FIG. 4 is a conceptual diagram of a processing apparatus to which the method for processing a non-metallic material substrate according to the present invention is applied.

FIG. 5 is a conceptual diagram showing another embodiment of the method for processing a nonmetallic material substrate of the present invention.

FIG. 6 is a conceptual diagram showing another embodiment of the method for processing a nonmetallic material substrate of the present invention.

FIG. 7 is a conceptual diagram showing another embodiment of the method for processing a non-metallic material substrate according to the present invention.

FIG. 8 is a conceptual diagram showing another embodiment of the method for processing a nonmetallic substrate of the present invention.

FIG. 9 is a conceptual diagram showing a conventional method for processing a non-metallic material substrate.

FIG. 10 is a cross-sectional view of the glass substrate cut by the processing method shown in FIG.

[Explanation of symbols]

 Reference Signs List 1 substrate (non-metallic material substrate) 3-2 laser beam 5 crack 8-1, 8-2 inert gas

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) B23K 26/10 B23K 26/10 26/12 26/12 26/14 26/14 Z 26/16 26/16 31/00 31/00 C03B 33/09 C03B 33/09 C03C 15/02 C03C 15/02

Claims (18)

[Claims] A non-metallic material substrate is moved at a desired speed,
The surface of the non-metallic material substrate is irradiated with a laser beam, and the thermal energy of the laser beam is used to generate a crack in the non-metallic material substrate due to thermal stress. A method of processing a non-metallic material substrate, comprising blowing an inert gas containing fluorine onto the surface of the non-metallic material substrate irradiated with the laser beam. 2. The method for processing a non-metallic material substrate according to claim 1, wherein the laser beam is moved instead of moving the non-metallic material substrate. 3. The method for processing a nonmetallic material substrate according to claim 1, wherein an inert gas containing fluorine is blown onto the edge of the cut nonmetallic material substrate while irradiating the laser beam again. 4. As the inert gas containing fluorine,
_{CF 4, C 3 F 8,} C 2 F 6, XeF 2 , etc. at least one inclusive nonmetallic material substrate processing methods according to any one of claims 1 to 3, using a He gas or Ar gas. 5. The method according to claim 1, wherein the laser beam is CO ₂ , C
5. A method according to claim 1, wherein a laser beam such as O or excimer is used.
The method for processing a nonmetallic substrate according to any one of the above. 6. A laser beam shape applied to the surface of the non-metallic material substrate is substantially circular, substantially elliptical, or linear having a desired width and a desired length.
6. The method for processing a nonmetallic material substrate according to any one of items 1 to 5. 7. The non-metallic material substrate is fixed on a grooved work table, the laser beam is irradiated on the non-metallic material substrate, and the irradiation position is on the groove of the grooved work table. The method for processing a nonmetallic material substrate according to any one of claims 1 to 6. 8. The processing of a non-metallic material substrate according to claim 1, wherein the non-metallic material substrate is rapidly cooled immediately after the laser beam irradiation surface to perform rapid heating and rapid cooling. Method. 9. The method for processing a nonmetallic material substrate according to claim 1, wherein the processing is performed in a box with a forced exhaust mechanism. 10. A moving stage capable of fixing a non-metallic material substrate and moving the non-metallic material substrate at least in one axial direction at a desired speed, and a laser oscillation device for irradiating a laser beam to a surface of the non-metallic material substrate. An apparatus for processing a non-metallic material substrate, comprising: a blowing device for blowing an inert gas containing fluorine onto the surface of the non-metallic material substrate. 11. The apparatus for processing a nonmetallic material substrate according to claim 10, further comprising a laser beam moving mechanism for moving the laser beam. 12. The non-metallic material substrate processing apparatus according to claim 10, further comprising a transport mechanism for transporting the fluorine gas with an inert gas. 13. The laser oscillation device according to claim 13, wherein the laser oscillation device comprises CO ₂ ,
11. A laser oscillation device such as CO, excimer or the like.
13. The processing apparatus for a non-metallic material substrate according to any one of items 1 to 12. 14. A deformation mechanism capable of deforming a laser beam from the laser oscillation device into a substantially circular shape, a substantially elliptical shape, or a linear shape having a desired width and length.
14. The apparatus for processing a nonmetallic material substrate according to any one of 0 to 13. 15. The non-metallic material substrate according to claim 10, further comprising a work table for fixing the non-metallic material substrate on the moving stage, wherein a groove is formed on the work table. Processing equipment. 16. The apparatus for processing a nonmetallic material substrate according to claim 10, further comprising a quenching device for quenching the surface of the nonmetallic material substrate. 17. The apparatus for processing a nonmetallic material substrate according to claim 10, further comprising a reciprocating mechanism for reciprocating the nonmetallic material substrate or the laser beam in a desired direction. 18. The apparatus for processing a nonmetallic material substrate according to claim 10, wherein a box with a forced exhaust mechanism is provided in the processing section of the nonmetallic material substrate.