JP2000260836A - Environmental testing device for electronic components - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance testing reliability and accuracy by simplifying mechanism, miniaturizing size, and reducing cost and at the same time, making testing conditions uniform for each cassette. SOLUTION: An environmental testing device is provided with a connection plate part 4... whose position is fixed while the connection plate part is arranged in a plurality of stages, a plurality of cassette support parts 5 for supporting a cassette 2 that is connected to each connection plate part 4,a plurality of heater parts 6 for heating the cassettes 2 supported by each cassette support part 5, a first linked elevating mechanism part 7 for connecting the cassette 2 of each cassette support part 5 to each connection part 4 by simultaneously causing the plurality of cassette support parts 5 to be elevated or its connection to be conceled, and a second linked elevating mechanism part 8 for bringing each heater part 6 to the cassette 2 of each cassette support part 5 by simultaneously elevating the plurality of heater parts 6 or canceling its contact.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an environmental test apparatus for an electronic component for performing an environmental test of an electronic component such as a semiconductor wafer held in a cassette.

[0002]

2. Description of the Related Art Conventionally, there has been known an environmental test apparatus for an electronic component which performs a durability test or a pass / fail judgment test by applying a temperature load to a semiconductor wafer (electronic component) held in a cassette. This type of environmental test apparatus includes a drive circuit for applying a test signal to a semiconductor wafer. Usually, this drive circuit is disposed outside the test tank to avoid high temperatures and housed inside the test tank. The cassette thus connected was connected to the drive circuit via a connector provided inside the test tank.

On the other hand, the present applicant has already provided a heater portion in direct contact with the cassette inside the test tank, thereby locally heating only the cassette and avoiding an increase in the temperature inside the entire test tank. We proposed an environmental test device for electronic components (Japanese Patent Application No. 10-314615). According to the apparatus, a drive circuit for applying a test signal to a semiconductor wafer can be arranged inside the test tank, so that wiring for connecting the cassette and the drive circuit can be shortened, and individual semiconductor chip portions in the cassette can be achieved. Variation in wiring length between the (electronic component) and the drive circuit can be eliminated.

[0004]

However, the proposed environmental test apparatus for electronic components has the following points to be improved.

First, since a mechanism for connecting or disconnecting a drive circuit to or from each cassette and a mechanism for contacting or releasing contact with a heater unit for each cassette are provided for each cassette, a drive unit is included. The number of mechanical components required is the number corresponding to the number of cassettes that can be set at the same time, and the test apparatus is likely to be complicated, large, and costly.

Second, since an independent mechanism is used for each cassette, for example, the contact position and the contact pressure of the heater unit tend to vary due to mechanical errors, and the heater unit is affected by a time error. It is difficult to make the test conditions for each cassette uniform, for example, the heating time tends to vary.

The present invention has been made to solve such a problem, and further simplifies the mechanism inside the apparatus, reduces the size and size, and reduces the cost. It is an object of the present invention to provide an electronic component environmental test device that can further enhance the reliability and accuracy of a test.

[0008]

SUMMARY OF THE INVENTION The present invention relates to a cassette 2 for holding electronic components (semiconductor wafers W) and a test apparatus main body for performing an environmental test on the electronic components held in the cassettes 2. When the electronic component environmental test device 1 including the electronic component 3 is configured, the test device main body 3 includes a plurality of connection plate portions 4.
, A plurality of cassette supports 5 supporting the cassettes 2 connected to each other, a plurality of heaters 6 heating the cassettes 2 supported by the cassette supports 5, and a plurality of cassette supports 5 Are simultaneously moved up and down so that each cassette support 5 ...
The first interlocking elevating mechanism 7 for connecting or disconnecting the cassettes 2 supported by the plurality of connecting plates 4 to and from the connecting plates 4, and the plurality of heaters 6 are simultaneously moved up and down so that the heaters 6 are connected to the respective cassettes. It is characterized by comprising a second interlocking elevating mechanism 8 for making contact with or releasing contact with the cassettes 2 supported by the supports 5.

In this case, according to a preferred embodiment, the first interlocking elevating mechanism 7 includes a first frame 9 that supports a plurality of cassette supports 5 and a first frame 9 that guides the first frame 9. A guide unit 10 and a first lifting / lowering drive unit 11 for raising / lowering the first frame unit 9 are provided. The first frame unit 9 further includes a plurality of elastic supports for supporting the cassette supporting units 5. ... The second interlocking lifting mechanism 8 includes a second frame 13 that supports the plurality of heaters 6.
Guide portion 14 for guiding the second frame portion 13
The second frame 13 has a plurality of elastic support portions 16 for supporting the respective heater portions 6 so as to be elastically displaceable.

The connecting plate portions 4 and the cassette supporting portions 5 are provided.
And the heater sections 6 can be configured by unit mechanism sections U that are attached to and detached from unit support sections 17 provided on the test apparatus main body 3.

When the first frame unit 9 is raised and lowered by the first lifting drive unit 11 of the first interlocking lifting mechanism unit 7, the plurality of cassette support units 5 supported by the first frame unit 9 are simultaneously placed. The cassettes 2 moving up and down and supported by the cassette support portions 5 are simultaneously connected or disconnected from the plurality of connection plate portions 4 having fixed positions. further,
If the second frame unit 13 is moved up and down by the second up / down drive unit 15 of the second interlocking up / down mechanism unit 8, the second frame unit 13
Are also moved up and down at the same time, and the heaters 6 are simultaneously brought into contact with or released from the cassettes 2 supported by the cassette supports 5. At this time, each cassette support 5 is provided by the elastic support 12 (16).
(Each heater section 6 ...) is supported so as to be elastically displaceable, so that mechanical errors can be absorbed and the pressing force can be dispersed.

[0012]

Next, preferred embodiments according to the present invention will be described in detail with reference to the drawings.

First, the configuration of an electronic component environmental test apparatus 1 according to the present embodiment will be described with reference to FIGS.

FIG. 3 shows an external view of the test apparatus main body 3 in the environmental test apparatus 1. The test apparatus main body 3 is a front panel 2
A test tank 22 having a plurality of entrances 21 provided at 0 is provided. An equipment box 23 is provided on the right side of the test tank 22. A display 25 and an operation panel 26 are arranged on a front panel 24 of the equipment box 23, and a housing 27 such as a computer is provided at a lower part. Note that 28
.. Are setting display sections arranged beside the entrances 21.

FIG. 4 shows a cassette 2 for holding one semiconductor wafer (electronic component) W. The cassette 2 is housed in a test tank 22 (test apparatus main body 3) to perform a target environmental test. The cassette 2 has a quadrangular cassette base 71 at the lowermost portion, and a reinforcing frame 72 is fixed to the peripheral edge of the lower surface of the cassette base 71. And
On the left and right sides of the cassette base 71 and the reinforcing frame 72,
A slit rail section 5 provided on a cassette support section 5 described later.
The engagement sides 72p and 72q to be loaded in ps and 5qs are formed. Also, a cassette base 7 serving as a back surface of the cassette 2
A plurality of one-side connectors (for example, inlets) 73... The one-side connectors 73 are usually provided with ten to twenty connectors of sixty terminals. Further, a disc-shaped contactor 74 having a built-in sub-heater is mounted on the upper surface of the cassette base 71, and the semiconductor wafer W is held between the contactor 74 and the disc-shaped wafer tray 75. In this case, the contactor 74 is a glass substrate having a large number of contacts that come into contact with the circuit of the semiconductor wafer W, and each contact is connected to one side connector 73.

FIGS. 1 and 2 show the internal structure of the test apparatus main body 3. Reference numerals 31 and 32 denote fixed frames which are horizontally fixed to the upper part and the lower part in the test tank 22, respectively. Four guide shafts 10s are vertically provided between the fixed frames 31 and 32 to constitute the first guide portion 10, and the first frame portions 9 are guided by the respective guide shafts 10s so as to be able to move up and down. The first frame portion 9 includes an upper frame member 33, a lower frame member 34, a left frame member 35, and a right frame member 36, and four reinforcing frame members 37 provided on outer surfaces of the left frame member 35 and the right frame member 36. ...
Guide shafts 1 are attached to linear bearings 38 attached to the four corners of upper frame member 33 and lower frame member 34.
0s ... is inserted. On the inner surfaces of the left frame member 35 and the right frame member 36, horizontal support plates 39 are fixed at regular intervals in the vertical direction, and guide pins 40 are set up at two positions before and after each horizontal support plate 39. I do.

On the other hand, reference numeral 5 denotes a cassette support portion, which is formed in a U-shape by a left support plate portion 5p, a right support plate portion 5q and a rear support plate portion 5r as shown in FIG. And the inner edge of the right support plate 5q, the engagement side 72 of the cassette 2
Slit rail part 5p to which p and 72q are loaded (inserted)
s and 5qs are provided. Reference numerals 43, 43 denote position adjusters provided on the rear support plate 5r for positioning the loaded cassette 2.

Insertion holes are provided at the four corners of the cassette supporting portion 5 so that the above-mentioned guide pins 40 are inserted into the insertion holes, and the cassette supporting portions 5 are further mounted by springs 41 mounted on the guide pins 40. Is biased downward. As a result, the cassette support 5 is moved to the horizontal support plate 39.
And the cassette support 5 is supported by the first frame 9 so as to be elastically displaceable.
2 are configured.

Then, a plurality of cassette support portions 5 having the same configuration are arranged at regular intervals in the vertical direction. In addition, the drive cylinder 42 (first lifting drive unit 11) is attached downward on the upper surface of the fixed frame 31 disposed on the upper side,
The drive rod 42r is connected to the upper frame member 33 through an opening provided in the fixed frame 31. Therefore, the first interlocking elevating mechanism 7 in which the first frame 9 is moved up and down by the drive control of the drive cylinder 42 is configured.

On the other hand, four guide shafts 44 are vertically provided between the fixed frames 31 and 32 in the vertical direction. The guide shafts 44 are arranged inside the guide shafts 10s described above, and penetrate the first frame 9 and the cassette support portions 5. Therefore, the upper frame member 33 and the lower frame member 34 are provided with the respective guide shafts 4.
4 are provided, and linear bearings 45, which are guided vertically by guide shafts 44, are mounted on the left support plate 5p and the right support plate 5q of each cassette support 5, respectively.

A plurality of connecting plate portions 4 are attached to the guide shafts 44 located inside the first frame portion 9 at regular intervals in the vertical direction. Thereby, the connection plate portions 4 are fixed in position with respect to the fixed frames 31 and 32 and are arranged below the cassette support portions 5. An arbitrary connecting plate portion 4 (the same applies to other portions) is provided with each guide shaft 44.
And a circuit board 53 having support legs disposed on the upper surface of the board main body 51 via 52.
And a connector board portion 55 disposed on the circuit board portion 53 with a reinforcing frame 54 interposed therebetween. In this case, the circuit board section 53 includes a drive circuit that supplies a test signal to the semiconductor wafer W, and the connector board section 5
The cassette 2 supported by the cassette support 5 is provided on the upper surface of the cassette 5.
A plurality of other connectors (for example, outlets) 56... Connected to the one-side connectors 73. In addition, 5
Numerals 7 are positioning pins protruding upward from the connector board portion 55, and have a function of being inserted into positioning holes provided on the cassette 2 side to accurately position the connector board portion 55 and the cassette 2.

Between the upper frame member 33 and the lower frame member 34 of the first frame section 9, four guide shafts 61 penetrating the upper frame member 33 and the lower frame member 34 are vertically movable. Arrange. Therefore, the upper frame member 33 and the lower frame member 3
4, a linear bearing 62 that guides each guide shaft 61 so as to be able to move up and down freely is attached, and the left support plate 5p and the right support plate 5q of the cassette support 5 and the substrate body 51 are provided with: An insertion hole through which each guide shaft 61 is inserted is provided. On the other hand, each of the guide shafts 61 is arranged inside the guide shafts 44, and the lower frame member 3
A support plate 63 for fixing each of the guide shafts 61. Thereby, the support plate 6
3 and the respective guide shafts 61 constitute a second frame portion 13, and the linear bearings 62 constitute a second guide portion 14 for guiding the second frame portion 13.
Further, a drive cylinder 64 (second lifting / lowering drive unit 15) is mounted on the lower surface of the lower frame member 34 upward, and the drive rod 64r is connected to the support plate 63 through an opening provided in the lower frame member 34. Therefore, the second interlocking elevating mechanism 8 in which the second frame 13 is moved up and down by the drive control of the drive cylinder 64 is configured.

Further, each guide shaft 61 supports a plurality of heater portions (main heaters) 6 at regular intervals. In this case, the bottoms of the heaters 6 are supported by stoppers 61s fixed to the guide shafts 61. Therefore, each of the heater sections 6.
1 can be displaced upward along. Each heater section 6 is located above each cassette support section 5. An arbitrary heater section 6 (the same applies to the other sections) includes a heater support plate section 65 fixed to each guide shaft 61.
Temperature control plate 66 supported by and located on the upper side
And an adapter 67 located on the lower side. The adapter 67 is formed in a disk shape and is attached to the lower surface of the temperature control plate 66 so that the heating surface matches the heat receiving surface of the contactor 74 described above. Since each guide shaft 44 penetrates through the heater support plate portion 65, the heater support plate portion 6
5 are provided with linear bearings 68 which are guided by the respective guide shafts 44 so as to be able to move up and down. in this case,
Each guide shaft 44 has a function of fixing each connection plate portion 4.
..) And the respective heater portions 6..., The connection plate portions 4, the cassettes 2, and the heater portions 6.
Are accurately positioned by the respective guide shafts 44.

Next, a method of using the environmental test apparatus 1 according to the present embodiment and the operation of each unit will be described with reference to FIGS.

First, when not in use, each cassette support 5
And the heater portions 6 are stopped at the raised position.

On the other hand, in use, the cassettes 2 shown in FIG. 4 prepared in advance are accommodated in the test tanks 22 from the respective entrances 21 of the test apparatus main body 3 shown in FIG. In this case, as shown in FIG. 2, the engaging sides 72p and 72q of the cassette 2 are inserted into the slit rails 5ps and 5qs of the cassette support 5. When all the cassettes 2 are accommodated in the test tank 22 and the start switch is turned on, the drive cylinder 42 is driven and controlled, and as shown in FIG. 5, the first frame portion 9 is moved from the position 9o indicated by a virtual line. It descends to the position shown by the solid line. At this time, the connecting plate portions 4 fixed to the guide shafts 44 maintain the same position, and the cassette supporting portions 5.
And the heaters 6 descend together with the first frame 9. As a result, the cassettes 2 supported by the cassette support portions 5 abut on the connection plate portions 4 and the connector board portions 5.
5 are inserted into positioning holes provided on the cassette 2 side, and the cassette 2 and the connector board 55 are inserted.
Are accurately positioned, and one connector 73 of the cassette 2 is connected to the other connector 56 of the connector board 55. That is, all the cassettes 2 are connected to all the connector board parts 55 at the same time. Further, the first frame portion 9 is displaced to a position slightly lower than the position where the cassette 2 contacts the connecting plate portion 4. As a result, the cassette support portions 5 are slightly floated with respect to the horizontal support plates 39 and are urged downward by the springs 41, so that mechanical errors can be absorbed and the pressing force can be dispersed. Can be

Next, the drive of the drive cylinder 64 is controlled, and as shown in FIG. 6, the second frame portion 13 descends from the position 13o indicated by the imaginary line to the position indicated by the solid line. As a result, the respective heater portions 6 descend together with the second frame portion 13 and come into contact with the upper surfaces of the cassettes 2 supported by the respective cassette support portions 5. In this case, the second frame part 1
3 is displaced slightly below the position where the heaters 6 contact the cassettes 2. As a result, the heaters 6 are slightly floated with respect to the stoppers 61s, and the heaters 6 contact the cassettes 2 only by their own weight.

By the above operation, each cassette 2 is set in the test apparatus main body 3, and the semiconductor wafer W is heated to 125 ° C. by the heater section (main heater) 6 and the sub-heater built in the contactor 74. Further, the inside of the test tank 22 is maintained at a relatively low temperature of 45 ° C. by a ventilation fan and a ventilation duct (not shown). On the other hand, a one-side connector 73 is provided from the drive circuit of the circuit board 53 to the semiconductor wafer W.
And a test signal is applied via the other connector 56, and a target environmental test is performed for a preset test time. When the environmental test is completed, the drive cylinder 64
Is controlled and the second frame 13 is raised, so that the contact between all the heaters 6 and all the cassettes 2 is released at the same time, and the drive of the drive cylinder 42 is controlled and the first frame 9 is moved. Rise, the connections between all the cassettes 2 and all the connection plates 4 are released at the same time.

As described above, according to the environmental test apparatus 1 according to the above-described embodiment, the plurality of cassette supports 5 are simultaneously moved up and down to support the cassettes 2 supported by the cassette supports 5.
Are connected to or disconnected from each of the connection plate portions 4..., And the plurality of heater portions 6 are simultaneously moved up and down so that each of the heater portions 6 is supported by each of the cassette support portions 5. Is provided with a second interlocking elevating mechanism 8 for making contact with or releasing contact with the cassettes 2..., The mechanism inside the environmental test apparatus 1 can be further simplified, reduced in size and cost, and the cassettes 2. By making the test conditions uniform for each test, the reliability and accuracy of the test can be further improved.

On the other hand, FIGS. 7 to 10 show modified embodiments. In the modified embodiment, the connection plate portions 4, the cassette support portions 5,.
And the heater sections 6 are constituted by unit mechanism sections U which are attached to and detached from unit support sections 17 provided on the test apparatus main body 3. This unit mechanism U is shown in FIG. The unit mechanism unit U includes four support shafts 100 (FIG. 9)
And FIG. 10), and the four corners of the connection plate portion 4 are fixed to the lower ends of the support shafts 100. Also, linear bearings 101,..., 102 through which the support shafts 100 are inserted are provided in the cassette support portion 5 and the heater portion 6 corresponding to the positions of the support shafts 100,.
Are attached, and the respective spindles 100 are inserted through the linear bearings 101 provided on the cassette supporting portion 5.
The linear bearings 102 provided in the heater section 6 are inserted. A pair of mounting plates 103, 103 protruding in the left-right direction are fixed to the cassette supporting portion 5, and a pair of mounting plates 1 protruding in the left-right direction are similarly mounted on the heater portion 6.
04 and 104 are fixed. In this case, the positions of the mounting plates 103 and 104 are offset in the front-rear direction as shown in FIGS.

On the other hand, the test apparatus main body 3 in the modified embodiment
Is provided with a fixed frame 110 constituted by frame members 110a, 110b, 110c,..., A drive cylinder 42 (first lifting drive unit 11) is disposed on the front side of the upper surface of the fixed frame 110, and the drive cylinder 42 is provided on the rear side. 64 (second lifting drive unit 15) is provided. Also,
The first frame portion 9 includes the drive rod 4 of the drive cylinder 42.
2r, and four support shafts 112 whose upper ends are connected to the support plate 111.
And the second frame portion 13 includes a support plate 11 coupled to the drive rod 64r of the drive cylinder 64.
3 and four support shafts 114... Further, a linear bearing 115 and a support shaft 114 that guide the support shafts 112 so as to be able to move up and down freely on the fixed frame 110.
Linear guides 116... Which guide the shafts up and down are attached, and these linear bearings 115.
6 constitute a first guide portion 10 for guiding the first frame portion 9 and a second guide portion 14 for guiding the second frame portion 13, respectively. Therefore, also in the modified embodiment, a first interlocking elevating mechanism 7 and a second interlocking elevating mechanism 8 having the same functions as those in FIGS. 1 and 2 are configured.

The test apparatus main body 3 is provided with a unit support 17 to which the unit mechanism U is attached and detached. First, the engaging grooves 117, which are inserted into the mounting shafts 103 provided on the unit mechanism unit U, on the support shafts 112, which are located on the left and right, respectively.
And a pair of right and left mounting plate supporting portions 118... Which are vertically movable, and are coupled to fixing portions 119 fixed to the support shafts 112 via springs 120.
A plurality of such mounting plate support portions 118, fixing portions 119, and springs 120 are arranged at regular intervals in the vertical direction. Thereby, the mounting plate support portions 118 (cassette support portions 5) are elastically displaceably supported with respect to the support shafts 112 (first frame portion 9).
2 are configured. Similarly, the mounting plates 104 provided on the unit mechanism U are mounted on the support shafts 114 located on the left and right.
A pair of right and left mounting plate supports 122 having an engaging groove 121 inserted therein are vertically movably loaded, and are coupled to a fixing portion 123 fixed to the support shaft 112 via a spring 124. The mounting plate supporting portions 122, the fixing portions 123, and the springs 124,
Multiple units are arranged at regular intervals in the vertical direction. This allows
The mounting plate support portions 122 (heater portions 6) are elastically supported by the support shafts 114 (second frame portion 13) so as to be elastically displaceable. Also, the left and right frame members 11 constituting the fixed frame 110
0b and 110c have a pair of left and right connection board support portions 12 that support both sides of the connection plate portions 4.
5 is fixed. A plurality of the connection board supporting parts 125 are provided at regular intervals in the vertical direction. The connection plate 4
Linear guides 116 for smoothing and positioning at the time of attachment / detachment are interposed between the connection board supporting portions 125 corresponding to both sides of the connector. Thus, the unit support portion 17 is configured. 7 to 10, the same parts as those in FIGS. 1 and 2 are denoted by the same reference numerals to clarify the configuration, and a detailed description is omitted.

Therefore, when not in use, the cassette support portions 5 and the heater portions 6 are stopped at the raised position.
In use, the drive of the drive cylinder 42 is controlled, and the first frame 9 is lowered. At this time, the first frame unit 9
The cassettes 2 are displaced below the position where they come into contact with the connecting plate portions 4. Thereby, each spring 12
The cassettes 2... Urged downward by 0... Are simultaneously connected to the connection plates 4. Next, drive cylinder 6
4 is driven and controlled, and the second frame portion 13 descends. At this time, the second frame portion 13 is displaced to a position lower than the position where the heater portions 6 contact the cassettes 2. Each of the heater portions 6 urged downward by each spring 124. 2 are simultaneously contacted (pressed) with the upper surface of.

In the modified embodiment, the same effects as in the embodiment shown in FIGS. 1 and 2 can be obtained. In addition, since the unit mechanism unit U which can be arbitrarily attached to and detached from the test apparatus main body 3 is provided, maintenance is improved, and even if a failure or the like occurs, the unit mechanism unit U can be replaced in units.
Since it is excellent in cost performance and can be assembled in the unit mechanism unit U, productivity can be improved.

The embodiment has been described in detail above.
The present invention is not limited to such an embodiment,
The configuration, shape, material, quantity, numerical value, and the like of the details can be arbitrarily changed, added, or deleted without departing from the gist of the present invention. For example, the electronic component is exemplified by the semiconductor wafer W, but may be any circuit element such as a commercialized semiconductor chip, circuit board, or capacitor. Further, since the heater units 6 have a function of locally heating the cassette 2, the concept that the heater units 6 contact the cassette 2 includes the case where the heater units 6 approach each other. Further, the operation of raising and lowering the cassette support portions 5 and the heater portions 6 with respect to the connection plate portions 4 is relative, for example, the cassette support portions 5.
Is fixed, and the connection plates 4 are raised to perform connection.

[0036]

As described above, the environmental test apparatus for an electronic component according to the present invention supports, on a test apparatus main body, a plurality of connecting plate portions fixed in position and a cassette connected to each connecting plate portion. A plurality of cassette supports, a plurality of heaters for heating the cassettes supported by the respective cassette supports, and the plurality of cassette supports being simultaneously moved up and down to connect the cassettes supported by the respective cassette supports to respective connection plate parts. A first interlocking elevating mechanism for connecting or disconnecting a plurality of heaters, and a second interlocking elevating for simultaneously raising or lowering a plurality of heaters so that each heater contacts or releases a cassette supported by each cassette support. Because of the provision of the mechanism, the following remarkable effects are obtained.

Since a drive circuit for applying a test signal to an electronic component (semiconductor wafer) can be disposed inside the test tank, the wiring for connecting the cassette and the drive circuit can be shortened, and each electronic component and the drive circuit in the cassette can be shortened. In addition to enjoying the basic effect of eliminating variations in the length of wiring between them, further simplification of the mechanism inside the device, downsizing, and cost reduction can be achieved.

By making the test conditions uniform for each cassette, the reliability and accuracy of the test can be further improved.

[Brief description of the drawings]

FIG. 1 is a front structural view including a cross section of a test apparatus main body in an environmental test apparatus according to a preferred embodiment of the present invention;

FIG. 2 is a plan configuration diagram including a cross section of the test apparatus main body,

FIG. 3 is an external front view of the test apparatus main body,

FIG. 4 is a partial cross-sectional front view of a cassette in the environmental test apparatus;

FIG. 5 is an explanatory diagram of the operation of the environmental test apparatus,

FIG. 6 is an operation explanatory diagram of the environmental test apparatus,

FIG. 7 is a front configuration view including a cross section of a test apparatus main body in an environmental test apparatus according to a modified embodiment of the present invention;

FIG. 8 is a front configuration diagram of a unit mechanism in the environmental test apparatus,

FIG. 9 is a plan configuration diagram including a cross section of a heater portion of the test apparatus main body,

FIG. 10 is a plan configuration diagram including a cross section of the cassette support portion of the test apparatus main body,

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Environmental test apparatus for electronic components 2 ... Cassette 3 Test apparatus main body 4 ... Connection plate part 5 ... Cassette support part 6 ... Heater part 7 First interlocking elevating mechanism part 8 Second interlocking elevating mechanism part 9 First frame part 10 ... No. One guide unit 11 First elevating drive unit 12 Elastic support unit 13 Second frame unit 14 Second guide unit 15 Second elevating drive unit 16 Elastic support unit 17 Unit support unit W Semiconductor wafer (electronic component) U ... Unit mechanism

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Kazunori Asanuma 246 Sachidaka, Sazaka, Nagano Prefecture Inside Orion Machinery Co., Ltd. (72) Inventor Masaaki Ishizaka 4-3-1 Tsunashima Higashi, Kohoku-ku, Yokohama-shi, Kanagawa Prefecture Matsushita Communication Industrial Co., Ltd. F-term (reference) 4M106 AA01 BA14 CA59 CA60 DH01 DH44 DH60 DJ23

Claims (7)

[Claims] An electronic component environmental test apparatus comprising: a cassette for holding electronic components; and a test device main body for performing an environmental test on the electronic components held in the cassette, wherein the position is fixed to the test device main body. A plurality of connection plate portions, a plurality of cassette support portions for supporting cassettes connected to each connection plate portion, a plurality of heater portions for heating the cassette supported by each cassette support portion, and a plurality of cassette support portions The first interlocking elevating mechanism for connecting / disconnecting the cassette supported by each cassette support unit to / from each connection plate unit by simultaneously raising / lowering the unit, and simultaneously raising / lowering a plurality of heater units, each heater unit An environmental test apparatus for electronic components, comprising: a second interlocking elevating mechanism for making or releasing contact with a cassette supported by a cassette support. A first frame supporting a plurality of cassette supports, a first guide for guiding the first frame, and raising and lowering the first frame; The environmental test apparatus for an electronic component according to claim 1, further comprising a first lifting drive unit. 3. The electronic component environmental test apparatus according to claim 2, wherein said first frame portion has a plurality of elastic support portions for supporting each cassette support portion so as to be elastically displaceable. 4. The second interlocking elevating mechanism includes a second frame supporting a plurality of heaters, a second guide for guiding the second frame, and a second elevating mechanism for elevating the second frame. The environmental test apparatus for an electronic component according to claim 1, further comprising a second lifting drive unit. 5. The environmental test apparatus for an electronic component according to claim 4, wherein said second frame portion has a plurality of elastic support portions for supporting each heater portion so as to be elastically displaceable. 6. The unit according to claim 1, wherein the connection plate, the cassette support, and the heater are configured by a unit mechanism that is attached to and detached from a unit support included in the test apparatus main body. Environmental test equipment for electronic components. 7. The electronic component environmental test apparatus according to claim 1, wherein said electronic component is a semiconductor wafer.