JP2000260743A - Rotary type substrate processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase recovery rate of a liquid used, reduce apparatus price, prevent vibrations, and separate the liquid from the atmosphere in a rotary type single-substrate processing apparatus. SOLUTION: A cup 20, receiving liquid scattered by a substrate 1, is provided around a rotating mechanism 1 which horizontally supports and rotates the substrate 1. An upper liquid guide 30 and a lower liquid guide 40, both of which are cylindrical and moved vertically, are combined with the cup 20. The upper liquid guide 30 overlaps the lower liquid guide 40 at the lower waiting position for closing a liquid inlet port formed between both the guides and introduces a first liquid scattered by the substrate 1 outside the cup 20, when it is moved up to a recovering position from the waiting position. The lower liquid guide 40 is moved upward to the recovering position from the waiting position and leads a second liquid, scattered by the substrate 1, into the cup 20.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rotary substrate processing apparatus used for wet-processing substrates such as semiconductor wafers and glass substrates for liquid crystal, and more particularly to a single-wafer processing apparatus for processing the substrates one by one. The present invention relates to a rotary substrate processing apparatus.

[0002]

2. Description of the Related Art A single wafer type rotary substrate processing apparatus used for manufacturing a semiconductor device or a liquid crystal panel mounts a substrate horizontally on a rotor in a processing tank, and rotates the rotor at a predetermined speed. By spraying a liquid on the upper surface of the substrate, the upper surface is wet-processed. The liquid sprayed on the upper surface of the substrate scatters around due to centrifugal force. In addition, the rotor is rotated at a high speed in order to remove the liquid accumulated on the substrate after the liquid is sprayed, and the liquid also scatters around the substrate at this time. In order to collect these scattered liquids, a cup is provided around the rotation mechanism.

In this type of rotary substrate processing apparatus, chemical processing such as etching and cleaning with pure water may be continuously performed in the same tank. In this case, it is necessary to separate and collect the used chemical solution and the waste liquid (liquid mixture of pure water and the chemical solution) generated in the cleaning process, and the following three known separation and collection mechanisms are known.

The first is a three-way valve system shown in FIG. In this embodiment, a drain pipe 4 is provided at the bottom of a cup 3 provided around a rotation mechanism 2 for rotating a substrate 1, and a three-way valve 4a is provided in the middle of the pipe. And the three-way valve 4a
By operating, the chemical liquid and the waste liquid are separated and collected.

The second method is a cup elevating type shown in FIGS. 6 and 7. This is an elastic member 5 such as a bellows or telesco.
, The cup 3 can be moved up and down, and a partition 3a for vertically dividing the inner space of the cup 3 is provided on the inner surface of the cup 3. When recovering the chemical solution, the cup 3 is fixed at a height such that the partition 3a is below the substrate 1 as shown in FIG. As a result, the chemical solution is collected in the space above the partition 3a in the cup 3, and is taken out of the cup 3 via the flexible tube 6a. When recovering the waste liquid, as shown in FIG.
Fix the cup 3 at a height above the substrate 1. As a result, the waste liquid is collected in a space below the partition 3a in the cup 3, and is led out of the cup 3 via the flexible pipe 6b.

A third method is a rotor elevating type shown in FIGS. 8 and 9. This is a cup 3 with a partition 3a.
Is fixed, and the rotating mechanism 2 is moved up and down by the cylinder 7 instead. By moving the rotating mechanism 2 up and down, the chemical solution and the waste liquid are separated and collected as in the case of the cup elevating type. However, unlike the cup elevating type, since the cup 3 is fixed, the flexible pipe 6
The a and 6b become unnecessary, and the chemical solution and the waste liquid collected in the cup 3 are supplied to the pocket 8 attached to the outer surface of the cup 3.
a, 8b is led out of the cup 3.

[0007]

However, these separation and recovery mechanisms have the following problems.

In the case of the three-way valve system shown in FIG. 5, a part of the cup 2 and part of the drain pipe 4 are shared between the chemical solution and the waste liquid. The remaining pure water is mixed into the chemical. For this reason, the chemical liquid collected during this time must be used as a waste liquid, which causes a decrease in the chemical liquid collection rate.

In the case of the cup elevating type shown in FIGS. 6 and 7, the cup 3 provided around the rotating mechanism 2 must be moved up and down with respect to the rotating mechanism 2, so that a bellows, a telescopic or the like is provided between the two. It is necessary to seal with the elastic member 5. Also, the liquid collected in the cup 3 is transferred to the cup 3
The flexible pipe 6
It is necessary to use a and 6b. As a chemical solution here, for example, in the case of an etching process, very corrosive hydrogen fluoride or the like is used. Therefore, depending on the type of the chemical solution, the materials of the elastic member 5 and the flexible pipes 6a and 6b are limited. It will be expensive.

In the case of the rotor elevating type shown in FIGS. 8 and 9, since the cup 3 is of a fixed type, it is not necessary to use a flexible pipe as an outlet pipe for introducing liquid from inside the cup to outside the cup. However, the elastic member 5 as a seal member for sealing between the roller 2 and the cup 3 is still required. For this reason, the cost required for the elastic member 5 remains as a major problem. In addition, since the rotating mechanism 2 needs to have a movable structure that can move up and down, there is a problem that vibration is likely to increase.

An object of the present invention is not only to ensure a high chemical solution recovery rate, but also to reduce the cost of the apparatus by eliminating as much as possible the movable parts requiring a flexible material, and to reduce vibration. An object of the present invention is to provide a rotary type substrate processing apparatus with a small number.

[0012]

In order to achieve the above object, the present applicant has previously filed a patent application for a rotary substrate processing apparatus of a two-stage cup type in Japanese Patent Application No. 9-288016.

This prior application apparatus, as shown in FIGS. 10 to 12, has a rotating mechanism 2 for horizontally supporting and rotating a substrate 1 to be processed, and recovering a liquid scattered from the substrate 1 by the rotation of the substrate 1. And a cup 3 provided around the rotation mechanism 2 for the sake of simplicity. The cup 3 is divided into a movable upper cup 3A having a cylindrical shape and a fixed lower cup 3B that accommodates the upper cup 3A. Movable upper cup 3
A moves up and down by the synchronous operation of the cylinders 7 and 7. The upper end of the upper cup 3A is an annular upper liquid guide portion 3 'inclined inward. Below the upper liquid guide section 3 ', an annular lower liquid guide section 3 "that is inclined inward is provided as a partition section that partitions the inner space up and down.

In the standby state for loading and unloading the substrate 1, FIG.
As shown at 0, the upper cup 3A is held at a position where the upper liquid guide portion 3 'is below the substrate 1. At the time of chemical treatment, as shown in FIG. 11, the upper liquid guide 3 'is located above the substrate 1 and the lower liquid guide 3 "
The upper cup 3A moves up to a lower position of the chemical solution recovery. When the substrate 1 is rotated in this state, the chemical solution on the substrate 1 is collected outside the lower cup 3B (inside the upper cup 3A), and is guided from the first pockets 8a, 8a to a gas-liquid separation box or the like for the chemical solution. During the cleaning process using pure water, the upper cup 20A further moves up to the waste liquid collecting position where the lower liquid guide portion 3 ″ is above the substrate 1, as shown in FIG. The waste liquid on the substrate 1 is collected in the fixed lower cup 3B, and the second pockets 8b, 8b
Through a waste liquid gas-liquid separation box or the like.

Thus, in the prior application, the movable portion requiring the flexible material is eliminated as much as possible, and the cost of the device is reduced. Further, the vibration is suppressed by fixing the rotating mechanism.

However, on the other hand, the space between the upper liquid guide portion 3 'and the lower liquid guide portion 3 ", which is the liquid inlet for the upper cup 3A, is always open. There is a problem that the vapor of the chemical liquid escapes upward from between the liquid guide portion 3 'and the lower liquid guide portion 3 ", and an atmosphere having a high concentration of the chemical solution and an atmosphere having a low concentration of the chemical solution generated from the waste liquid are mixed. In order to solve this problem, a downflow is provided, but there is a problem that equipment cost and operating cost of a motor for driving the fan increase. Also, it is difficult to completely separate the atmosphere of the chemical solution and the waste solution even by the downflow.

That is, in the prior application apparatus, it is difficult to separate and separate the respective atmospheres, even if the chemical solution and the waste solution can be separated and recovered.

The upper cup 3A must be lowered to a standby position where the upper liquid guide 3 'is below the substrate 1. At this time, the lower liquid guide portion 3 "descends far below the substrate 1 more than necessary. On the other hand, when the lower liquid guide portion 3" rises to the waste liquid collecting position, the upper liquid guide portion 3 'becomes the chemical liquid collecting portion. It rises more than necessary above the position. For this reason, the vertical stroke of the upper cup 3A is very large. The magnitude of this stroke, especially the downward movement of the lower cup more than necessary, causes an increase in the depth of the lower cup 3B, which leads to an increase in the height of the apparatus.

The rotary substrate processing apparatus of the present invention eliminates these disadvantages while retaining the advantages of the prior application apparatus, and is provided around a rotation mechanism to recover one of two types of liquids. The lower movable liquid guide having a tubular shape, which moves up and down between the cup and the standby position below the substrate position and the recovery position above the substrate position, and guides one of the liquid scattered from the substrate at the upper recovery position into the cup. And a cylinder movable up and down independently of the lower liquid guide between a standby position below the substrate position and a recovery position above the lower liquid guide, and guiding the other liquid scattered from the substrate to an outside of the cup at the upper recovery position. And an upper liquid guide.

In the rotary substrate processing apparatus of the present invention, the double action of the two-stage annular liquid guide which rises and falls independently of the cup suppresses the escape of the chemical vapor while retaining the advantages of the prior application apparatus. In addition, the operation stroke of the elevating unit is suppressed.

That is, at the standby position below the substrate position,
The upper liquid guide and the lower liquid guide are overlapped. Thereby, the liquid outlet formed between the upper liquid guide and the lower liquid guide is closed. Further, unnecessary lowering of the lower liquid guide is avoided. When recovering the other of the two types of liquids, only the upper liquid guide is raised to a recovery position above the substrate position. Thus, the liquid outlet formed between the upper liquid guide and the lower liquid guide is opened, and the other liquid that escapes from the substrate is discharged from the liquid outlet to the outside of the cup. When recovering one liquid, the lower liquid guide is raised to a recovery position above the substrate position. Thereby, one liquid that escapes from the substrate is collected in the cup.

When recovering one liquid, at this time, if the upper liquid guide is not raised and only the lower liquid guide is raised and overlapped with the upper liquid guide, the liquid outlet between the upper liquid guide and the lower liquid guide is provided. Is closed. Further, an unnecessary rise of the upper liquid guide is avoided. The upper liquid guide is driven upward in two stages from the lower standby position, and when the upper liquid guide is driven to the first raised position, the lower liquid guide is held in the lower standby position, and the upper liquid guide is driven in two stages. If the lower liquid guide is connected to the upper liquid guide so that the lower liquid guide is pulled up to the upper collecting position when driven to the eye raising position, the drive mechanism for the lower liquid guide becomes unnecessary, and the lower liquid guide becomes unnecessary. Unnecessary descent of the liquid guide is avoided.

If the upper and lower liquid guides are provided above the rotation mechanism with an annular anti-scattering cover inserted inside each liquid guide when the liquid guide is raised to the upper recovery position, the liquid is effectively scattered. In addition to the above, when the upper liquid guide and the lower liquid guide are raised to the upper recovery position, the liquid outlet formed between the upper liquid guide and the lower liquid guide can be prevented by the scattering prevention cover. Closed.

[0024]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic longitudinal sectional view of a rotary substrate processing apparatus according to an embodiment of the present invention, showing a standby state. FIG.
Is a schematic vertical sectional view of the rotary type substrate processing apparatus, showing a state during chemical processing. FIG. 3 is a schematic vertical sectional view of the rotary type substrate processing apparatus, showing a cleaning process. FIG. 4 is a schematic longitudinal sectional view of the rotary type substrate processing apparatus, showing a drying process.

As shown in FIGS. 1 to 4, a rotary substrate processing apparatus according to an embodiment of the present invention comprises: a rotating mechanism 10 for horizontally supporting and rotating a substrate 1 to be processed; A cup 20 provided around the rotation mechanism 10 for collecting liquid scattered from the substrate 1, a cylindrical upper liquid guide 30 and a lower liquid guide 40 combined with the cup 20, and provided above the rotation mechanism 10. And a provided annular anti-scattering cover 50. These are provided in a casing 60 which also serves as a processing tank. A clean fan 70 is provided on the ceiling surface of the casing 60 to form a down flow.

The rotating mechanism 10 comprises a rotor 11 for horizontally supporting the substrate 1 and a driving unit 12 for the rotor. Cup 20
Collects waste liquid. The cup 20 is cylindrical and fixed, and has a double peripheral wall 21. On the outer side of the peripheral wall 21, an annular collecting portion 20 'is integrally provided for collecting a chemical solution.

As shown in FIGS. 3 and 4, the waste liquid collected in the cup 20 is taken out below the cup 20 via conduits 22, 22 connected to the bottom surface of the cup 20 and serving as an exhaust duct. The waste liquid is sent to a gas-liquid separation box 23. As shown in FIGS. 1 and 2, the chemical solution collected in the collecting section 20 ′ provided outside the cup 20 is collected by the collecting section 2.
It is taken out below the collecting section 20 ′ via conduits 24, 24 connected to the bottom of 0 ′ and sent to a gas-liquid separation box 25 for a chemical solution. Both liquid recovery systems are arranged at 90 ° circumferential displacement in the horizontal plane to avoid interference.

The upper liquid guide 30 combined with the cup 20 includes a cylindrical portion 31 fitted to the outside of the cup 20 and an inclined portion 3 which is inclined inward from the upper end of the cylindrical portion 31 and extends upward.
2 and the inclined portion 32 protrudes above the cup 20. The upper liquid guide 30 is used for collecting a chemical solution, and is supported so as to be able to move up and down with the inner surface of the peripheral wall of the chemical liquid collecting portion 20 ′ as a guide surface. It is driven in two stages.

In the standby position, the upper end (inner edge) of the inclined portion 32
Are located below the rotor 11. The first-stage ascending position is a chemical liquid collecting position, in which the upper end (inner edge) of the inclined portion 32 is located above the substrate 1 on the rotor 11.
The second-stage ascent position is a pull-up position where the lower-stage liquid guide 40 is pulled up to the waste liquid collecting position.

The lower liquid guide 40 is connected to the upper liquid guide 3.
0 and used for collecting waste liquid. Like the upper liquid guide 30, the lower liquid guide 40 has a cylindrical portion 41 and an inclined portion 42 which is inclined inward from the upper end of the cylindrical portion 41 and extends upward. The cylindrical portion 41 is inserted into the double peripheral wall 21 of the cup 20. The inclined portion 32 protruding above the cup 20 is provided with the upper liquid guide 3.
It is located below the 0 inclined portion 32 and is inclined inward at the same angle as the inclined portion 32 or at a slightly smaller angle.

The lower liquid guide 40 is supported by the peripheral wall 21 of the cup 20 as a guide so as to be movable up and down. At the lowest standby position, the upper end (inner edge) of the inclined portion 42 is separated from the rotor 11 as in the upper liquid guide 30. It is located below. The upper liquid guide 30 and the lower liquid guide 40 are connected by a plurality of rods 33 that are arranged at intervals in the circumferential direction. Each rod 33 is connected to the upper liquid guide 30.
And extends downward from the inclined portion 32. Each rod 33 is passed through a guide 43 attached to the outer surface of the upper end of the cylindrical portion 41 so as to be able to move up and down, and is prevented from falling off by a stopper at the lower end.

Thus, when the upper liquid guide 30 is at the standby position, each rod 33 is inserted deeply into each guide 43 so that the lower liquid guide 40 is held at the standby position, and the upper liquid guide 30 is tilted. The portion 32 overlaps the inclined portion 42 of the lower liquid guide 40 (FIG. 1). While the upper liquid guide 30 is raised to the first raised position (chemical liquid recovery position), each rod 33 is pulled out from each guide 43, and the lower liquid guide 40 is held at the standby position (FIG. 2). When the upper liquid guide 30 rises to the second raised position (pulling position), the lower liquid guide 40 is pulled up by the upper liquid guide 30 and moves to the waste liquid collecting position.

Upper liquid guide 30 and lower liquid guide 4
The upper end opening diameter of the inclined portions 32 and 42 is set to be larger than the outer diameter of the rotor 11 in order to avoid interference with the rotor 11 when 0 rises.

An annular scattering prevention cover 50 provided above the rotation mechanism 10 includes a cylindrical portion 51 concentrically disposed above the rotor 11 and a flange portion 52 projecting inward from the upper end of the cylindrical portion 51. And Cylindrical part 51
Secures a gap with the rotor 11 for setting and resetting the substrate 1 on the rotor 11. Further, the outer diameter is smaller than the upper end opening diameter of the inclined portions 32 and 42 so as not to hinder the elevation of the upper liquid guide 30 and the lower liquid guide 40. The height of the cylindrical portion 51 is the upper liquid guide 3.
0 is raised to the second raised position (pulling position), and the lower liquid guide 40 is raised to the waste liquid collecting position, and the inclined portions 32 and 42 of both guides are set so as to fit outside the cylindrical portion 51. Have been.

Next, the function of the rotary substrate processing apparatus according to the embodiment of the present invention will be described.

The setting of the substrate 1 on the rotor 11 is shown in FIG.
, Ie, the upper liquid guide 30 is lowered to the standby position. In this state, the upper liquid guide 30 and the lower liquid guide 40 are located at substantially the same height below the rotor 11, and the inclined portion 32 of the upper liquid guide 30 overlaps the inclined portion 42. For this reason, the chemical solution inlet between the inclined portions 32 and 42 is closed over the entire circumference,
The escape of the chemical vapor into the casing 60 is prevented.

In the casing 60, a down flow is always formed by the clean fan 70. During standby,
This downflow passes through the inside of the scattering prevention cover 50, enters the cup 20 through an annular small gap formed between the rotor 11 and the liquid guides 30, 40, and enters the waste liquid collecting conduits 22, 22. And through the gas-liquid separation box 23 and the like to the outside of the casing 60. For this reason, the escape of the waste liquid vapor into the casing 60 is prevented. Therefore, even if the downflow is relatively weak, the atmosphere can be separated from the chemical solution and the waste solution.

Further, since the lower liquid guide 40 is at substantially the same height as the upper liquid guide 30, the lower liquid guide 40 is prevented from lowering more than necessary, and the depth of the cup 20 is suppressed.

When performing the chemical processing, the upper liquid guide 30 is driven to the chemical processing position, as shown in FIG.
Thereby, the chemical solution inlet between the inclined portions 32 and 42 is opened. Further, the inclined portion 32 of the upper liquid guide 30 is fitted to the cylindrical portion 51 of the scattering prevention cover 50 with a slight gap. The lower liquid guide 40 remains at the standby position. In this state, the substrate 1 rotates, and a chemical solution is sprayed on the substrate 1 from the chemical solution ejection nozzle 80 in the scattering prevention cover 50. After the spraying, the substrate 1 is rotated at a high speed to remove the chemical solution on the substrate 1. The chemical solution on the substrate 1 moves outward due to the centrifugal force accompanying the rotation of the substrate 1, and the inclined portions 32, 42
The liquid flows into the collecting section 20 ′ outside the cup 20 from the chemical solution inlet between the two and is collected.

At this time, there is a scattering prevention cover 50 above the rotor 11 and outside the upper liquid guide 3
The zero inclined portion 32 is fitted. Therefore, the scattering of the chemical solution from above the substrate 1 is prevented, and the escape of the chemical vapor is suppressed to a minimum. Further, since the lower liquid guide 40 remains at the standby position and the gap between the lower liquid guide 40 and the rotor 11 is very small, the downflow mainly flows from the chemical liquid inlet between the inclined portions 32 and 42 to the recovery portion 20 ′ outside the cup 20. Inflow. For this reason,
Invasion of the chemical vapor into the cup 20 is also minimized. Therefore, also in this case, the atmosphere of the chemical liquid and the waste liquid are separated.

After the chemical treatment, a cleaning treatment is performed. At this time, as shown in FIG. 3, the upper liquid guide 30 is driven from the chemical solution processing position to the lifting position above it. As a result, the lower liquid guide 40 moves up to the waste liquid collecting position,
The gap between the rotor 11 and the rotor 11 is increased, and the inclined portion 32 is fitted to the cylindrical portion 51 of the scattering prevention cover 50 with a slight gap. Further, the inclined portion 32 of the upper liquid guide 30 is continuously fitted to the cylindrical portion 51 of the scattering prevention cover 50 with a slight gap.

In this state, the substrate 1 rotates, and the substrate 1
Above, pure water is sprayed from the pure water jet nozzle 90 in the scattering prevention cover 50. When the spraying is completed, the substrate 1 is rotated at a high speed to remove the waste liquid on the substrate 1. The waste liquid on the substrate 1 moves outward due to the centrifugal force caused by the rotation of the substrate 1 and is guided by the inclined portion 42 of the lower liquid guide 40 so that the cup 20
It flows into and is collected.

At this time, a scattering prevention cover 50 is provided above the rotor 11, and the liquid guide 30,
The 40 inclined portions 32 and 40 are doubly fitted. Therefore, scattering of the waste liquid from the substrate 1 is prevented. Further, the chemical solution inlet between the inclined portions 32 and 42 is substantially closed by the cylindrical portion 51 of the scattering prevention cover 50, and the downflow is mainly caused by the increased clearance between the lower liquid guide 40 and the rotor 11. 20. Therefore, here too, the escape of the chemical liquid vapor is suppressed to a minimum, and the atmosphere separation between the chemical liquid and the waste liquid is achieved.

When the cleaning process is completed, a drying process is performed. At this time, as shown in FIG. 4, while the upper liquid guide 30 and the lower liquid guide 40 are held at the collection position, the gas ejection nozzle 100 in the scattering prevention cover 50 While the nitrogen gas is purged, the nitrogen gas is purged to the center of the lower surface of the substrate 1 through the rotating mechanism 10. These purge gases are supplied together with the downflow to waste liquid collecting conduits 22 and 22 from inside the cup 20.
And through the gas-liquid separation box 23 and the like to the outside of the casing 60.

According to such separation and recovery, the chemical liquid and the waste liquid do not mix. Therefore, there is no decrease in the efficiency of recovering the chemical solution due to the mixing of the waste liquid.

Since the rotation mechanism 10 is fixed, vibration is small.

Since the rotating mechanism 10 is fixed and the cup 20 for collecting the waste liquid is also of a fixed type, there is no need for an elastic member to seal between them, and no flexible pipe is required. Therefore, even when a highly corrosive chemical is used, the apparatus cost does not increase.

The upper liquid guide 30 and the lower liquid guide 40
The double action of the sloping part 3 which is the chemical solution inlet
Since the space between the ports 2 and 42 is closed during standby, escape of the chemical vapor is prevented, and the atmosphere of the chemical liquid and the waste liquid can be separated. Also, a clean fan 7 for preventing the escape of the chemical vapor.
Zero equipment and operating costs are saved. In addition, since the lower liquid guide 40 is prevented from lowering more than necessary,
0 becomes shallower, and the device height is reduced.

By the combination of the movable liquid guides 30 and 40 and the scattering prevention cover 50, the scattering of the chemical solution and the waste liquid can be prevented, the escape of the chemical solution vapor can be prevented, and the atmosphere separation between the chemical solution and the waste solution can be further completed.

Since only the upper liquid guide 30 is forcibly driven, the guide driving mechanism is simple.

As for the guide drive, the upper liquid guide 30 and the lower liquid guide 40 can be driven independently. According to the independent drive, when the lower liquid guide 40 is at the waste liquid collecting position, the upper liquid guide 30 can be overlapped with the lower liquid guide 40, so that the operation of moving the upper liquid guide 30 above the chemical liquid collecting position becomes unnecessary. .

[0052]

As described above, the rotary substrate processing apparatus according to the present invention is configured such that a cup provided around a rotation mechanism is combined with an upper and lower liquid guide which can be raised and lowered independently. Liquid mixing can be avoided, and a high chemical liquid recovery rate can be secured. In addition, a movable part requiring a flexible material can be eliminated as much as possible, and the cost of the apparatus can be reduced. Furthermore, since the rotation mechanism can be fixed, vibration can be suppressed. In addition to this, it is possible to prevent the escape of the chemical liquid vapor and to separate the atmosphere between the chemical liquid and the waste liquid, and it is possible to suppress the cost required for preventing the escape of the chemical liquid vapor and to suppress the height of the apparatus.

[Brief description of the drawings]

FIG. 1 is a schematic vertical sectional view of a rotary substrate processing apparatus according to an embodiment of the present invention, showing a standby state.

FIG. 2 is a schematic vertical cross-sectional view of the rotary substrate processing apparatus, showing a state of processing a chemical solution.

FIG. 3 is a schematic vertical sectional view of the rotary substrate processing apparatus, showing a cleaning process.

FIG. 4 is a schematic vertical sectional view of the rotary substrate processing apparatus, showing a drying process.

FIG. 5 is a schematic longitudinal sectional view showing the structure of a conventional rotary substrate processing apparatus (three-way valve type).

6A and 6B show the structure of a conventional rotary substrate processing apparatus (cup elevating type) in the case of a chemical liquid collecting operation, wherein FIG. 6A is a schematic plan view and FIG. 6B is a schematic longitudinal sectional view.

FIGS. 7A and 7B show the structure of a conventional rotary substrate processing apparatus (cup elevating type) in the case of a waste liquid collecting operation, wherein FIG. 7A is a schematic plan view, and FIG.

FIGS. 8A and 8B show the structure of a conventional rotary substrate processing apparatus (rotor elevating type) in the case of a chemical solution recovery operation, in which FIG. 8A is a schematic plan view, and FIG.

9A and 9B show the structure of a conventional rotary substrate processing apparatus (rotor elevating type) in the case of a waste liquid collecting operation, in which FIG. 9A is a schematic plan view, and FIG. 9B is a schematic longitudinal sectional view.

FIGS. 10A and 10B show a rotary substrate processing apparatus of the prior application, wherein FIG. 10A is a schematic plan view, and FIG.

FIG. 11 shows a chemical solution processing of the rotary substrate processing apparatus,
(A) is a schematic plan view, (b) is a schematic longitudinal sectional view.

FIG. 12 shows a cleaning process of the rotary type substrate processing apparatus,
(A) is a schematic plan view, (b) is a schematic longitudinal sectional view.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 10 Rotation mechanism 11 Rotor 12 Driving part 20 Waste liquid collecting cup 20 'Chemical liquid collecting part 30 Upper liquid guide 31 Cylindrical part 32 Inclined part 33 Rod 40 Lower liquid guide 41 Cylindrical part 42 Inclined part 43 Guide 50 Splash prevention cover 60 Casing 70 Clean fan 80 Chemical liquid injection nozzle 90 Pure water injection nozzle 100 Gas injection nozzle

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Takashi Murata 1-10 Fuso-cho, Amagasaki City, Hyogo Prefecture Within Sumitomo Precision Industries Co., Ltd. (72) Inventor Daisuke Sugano 1-10 Fuso-cho, Amagasaki City, Hyogo Prefecture Sumitomo Precision Co., Ltd. F-term (reference) in Kogyo Co., Ltd. 5F043 DD13 EE07 EE08 EE33 EE35 EE40

Claims (3)

[Claims] 1. A single-wafer type rotary substrate processing apparatus that horizontally supports and rotates a substrate to be processed by a rotation mechanism and separates and recovers two types of liquid scattered from the substrate by the rotation. A cup provided around the rotation mechanism for collecting one of the liquids, and one liquid which rises and falls between the standby position below the substrate position and the upper collection position, and scatters from the substrate at the upper collection position , Which rises and falls independently of the lower liquid guide between a standby position below the substrate position and an upper collecting position, and scatters from the substrate at the upper collecting position. A cylindrical upper movable liquid guide for guiding the other liquid to the outside of the cup. 2. The upper liquid guide is moved from the lower standby position by 2
When the upper liquid guide is driven to the second raised position, the lower liquid guide is held at the lower standby position when the upper liquid guide is driven to the first raised position. The rotary substrate processing apparatus according to claim 1, wherein the rotary substrate processing apparatus is connected to the upper liquid guide so as to be pulled up to an upper collecting position. 3. A liquid splash preventing cover, which is inserted inside each liquid guide when the upper liquid guide and the lower liquid guide are raised to the upper collecting position, is provided above the rotation mechanism. The rotary substrate processing apparatus according to claim 1.