JP2000258905A - Pattern like resist layer for patterned plating - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pattern like resist layer capable of forming the cross-sectional shape into a prescribed shape except rectangle, unneccessitated in working such as etching in post treatment and used for patterned plating. SOLUTION: The pattern like resist layer used at the time of performing the patterned plating on a conductive substrate is formed by laminating to form the cross-sectional shape into a stair like state having difference in level. The resist layer is composed preferably of an ultraviolet setting type, a thermosetting type, a heat drying type or an electrostatic deposition type resist ink, a liquid resist, a dry film resist, an insulating paste or a solder resist.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a patterned resist layer used when performing patterned plating used in manufacturing an aperture grill or the like.

[0002]

2. Description of the Related Art A conventional pattern-like resist layer required for performing patterned plating has a rectangular cross-sectional shape. For example, in the case of a printed wiring board, an attempt to reduce the distance between adjacent wirings as much as possible by thinning the wiring or forming a wiring such as a semi-additive method or a full-additive method in order to achieve a higher density of the wiring. Many have been proposed. To increase the wiring density by these methods, it is necessary to make the cross-sectional shape of the patterned resist layer for plating rectangular. Therefore, the currently supplied resist material and its processing method are the same as those of the resist layer having a rectangular cross section. What is convenient for forming is mainly used.

[0003]

In a product manufactured by a patterned plating method, if a part of the cross-section is rectangular, not only the characteristics of the product are impaired, but also a fatal defect as a product is caused. Therefore, it is desired to use a patterned resist layer having a shape suitable for the product when performing patterned plating. For example, one example is a case where a color selection mechanism used for a certain type of cathode ray tube is manufactured by a plating method. This color selection mechanism is a member that plays the role of a slit in order to correctly hit the electron beam emitted from the electron gun on the phosphor screen. If the slit is rectangular, the electron beam reflects on the wall surface, which is different from the original. A color shift occurs on the phosphor screen, and it becomes difficult to obtain a clear image. Since the wall surface of the slit portion of the color selection mechanism obtained by a general etching method has a taper at a required angle with respect to the normal direction of the color selection mechanism, the above-described image deterioration does not occur.

On the other hand, in recent years, a demand for a high-definition color selection mechanism has been increasing, and as a means for obtaining the same, a plating method has been used. In this case, since the electrode is manufactured by the electroplating method using the patterned resist layer, the cross-sectional shape of the slit portion is rectangular, and the above-described image deterioration occurs. Therefore, it is necessary to take measures such as performing an etching process on the rectangular portion in a later step to form a taper. Similarly, a color selection mechanism that does not require a damper wire by using a two-layered tape with a slit portion by plating has also been proposed. However, it is very difficult to form a taper by etching because of its structure. It has been desired to form a taper by manipulating the shape of the layer.

An object of the present invention is to provide a patterned resist layer which can be formed into a desired cross-sectional shape other than a rectangular shape and which is used for patterned plating which does not require processing such as etching in a later step. It is intended for.

[0006]

SUMMARY OF THE INVENTION The present inventor has proposed a resist having a rectangular cross section having a different pattern width in consideration of effective use of existing resist layers, methods for forming a resist layer, and apparatuses therefor. The inventors have found that by laminating the layers, it is possible to obtain a patterned resist layer for plating having a cross-sectional shape other than a rectangle, and have completed the present invention. That is, in order to solve the above-mentioned problems, the patterned resist layer for plating according to the present invention is a patterned resist layer used when performing patterned plating on a conductive substrate, and has a sectional shape. The resist layer is characterized by being laminated so as to have a step-like shape with steps, wherein the resist layer is an ultraviolet-curing type, a thermosetting type, a heating drying type, an electrodeposition type resist ink, a liquid resist, a dry film. It is preferable to use a resist, an insulating paste or a solder resist.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The gist of the present invention is to form a patterned resist layer having a stepped cross section by laminating resist layers having different slit widths on a conductive substrate. Is what you do. That is, by laminating resist layers having different slit widths, a step is generated due to the difference between the different slit widths and the layer thickness of the laminated resist layer, so that the cross-sectional shape is not rectangular but step-shaped. It becomes.

In the present invention, it is preferable to use a photolithography technique for forming a patterned resist layer in order to improve the pattern accuracy. In particular, when high accuracy is not required or when an existing device is used, Considering the equipment, the material of the resist layer should be infrared curable, thermosetting, heat drying, electrodeposition type resist ink, liquid resist, dry film resist, insulating paste or solder resist as appropriate for practical use. It can be selected for use and applied in a manner appropriate for the material.

Next, a method of manufacturing an aperture grill using the patterned resist layer according to the present invention will be described. A patterned resist layer laminated so that the cross-sectional shape according to the present invention has a stepped shape is disposed at the center as a slit portion, and a desired aperture grill pattern is formed on a conductive substrate. The sectional shape of the tape-like plating film of the aperture grill obtained by forming the plating film by the electroplating method up to the film thickness becomes a step-like shape reflecting the resist layer. As a result, although a line formed by connecting the end of the wide portion and the end of the narrow portion of the tape is simulated, it functions as a taper angle, so that a clear image can be obtained without the above-described color shift or the like. . At this time, since the wider tape substantially functions as a color selection mechanism, the thickness of the plating film in this portion is considered to be such that the reflection of the electron beam on the wall does not affect image deterioration.
It is necessary to stop around 0 μm. On the other hand, the narrower tape has a role to support the strength of the plating film,
It is necessary to provide a plating film having a thickness corresponding to the strength. Further, in order to obtain a product having a desired cross-sectional shape as described above, the layer thickness of a patterned resist layer corresponding to the product is determined, and not only is the slit width of the resist layer reflected in the design of the mask, but also the characteristics of pattern plating are reduced. It is necessary to form a patterned resist layer with high accuracy. Therefore, in view of emphasizing the pattern accuracy, it is preferable to form the resist layer by the photolithography technique as described above.

In the present invention, the positional accuracy when laminating the resist layer is also an important requirement. For the alignment when laminating the resist layer, for example, an alignment mark is previously marked on the conductive substrate to form the resist layer. Is formed, the first mask is positioned on the basis of this, and exposure is performed. Further, a resist layer is formed, the next mask is positioned, exposed, and developed. In addition, exposure is performed using a mask containing alignment marks at positions not involved in the pattern of the conductor substrate on which the resist layer is formed, only the alignment marks are developed, and a resist layer is further formed. For example, a method of performing alignment based on the reference can be used. The numerical values required for the above-described steps may be determined in advance as appropriate in accordance with the strength of the plating film, the specifications of the aperture grille, etc. It is preferable to stack the layers and form a patterned resist layer having a cross-sectional shape that is convex on the upper surface because positional accuracy can be obtained and the formation of a plating film is easy.
The positional relationship between the upper and lower resist layers to be laminated is not particularly limited, but each center line in the width direction is overlapped according to the purpose of use of the product, and the center line is symmetrical, or moves away from the product to the left or right. For example, a method in which the center lines are shifted from each other and laminated to form an asymmetric shape can be appropriately adopted.

[0011]

Next, examples of the present invention will be described together with comparative examples. [Example] Using a titanium plate having a length of 440 mm, a width of 560 mm, and a thickness of 0.3 mm as a conductive substrate, a negative photoresist was formed to a thickness of 25 μm, and the slit width was 140 mm.
250 μm having alignment marks at four corners of the mask, that is, positions not related to the black pattern of 110 μm, the white pattern of 110 μm and the aperture grill pattern
A first photolithographic mask having a desired aperture grill pattern with a tape pitch was placed, exposed, and developed only for the alignment mark portion. The alignment portion is masked, the same negative type photoresist is further formed as a second layer on the substrate surface including the masked portion and the undeveloped resist layer, the masking is removed to expose the alignment mark, and the slit width is reduced. A second photolithographic mask having a desired aperture grill pattern of a 250 μm tape pitch having a black pattern of 194 μm and a white pattern of 56 μm, respectively, is positioned with the alignment mark, exposed, and developed. This was performed to form a patterned resist layer in which the cross section of the slit portion had a convex step on the upper surface.

Thereafter, the exposed surface of the conductive substrate was subjected to electric iron plating under the plating solution composition and conditions shown in Table 1 below, and subsequently, bright electro-nickel plating was laminated under the plating solution composition and conditions shown in Table 2 below. The first plating film was formed by proceeding a little short of the height of the first layer surface of the patterned resist layer. Next, the non-slit portion is masked, oxidized by dipping under the solution composition and conditions shown in Table 3 below, and an oxide film is formed on the nickel plating surface of the first plating film to an average film thickness of 0.01 μm and peeled off. Layers. Next, remove the masking of the non-slit part,
The entire surface of the aperture grill is exposed, bright electro-nickel plating is performed on the first plating film and the oxide film for twice the plating time as described above, and then plating under the same conditions as the iron plating conditions described above is performed. A plating film was formed.

After that, the above-mentioned patterned resist layer is placed on a substrate.
The titanium plate was bent by immersing it in a 5% alkaline solution, and the entire plating film was peeled off from the titanium plate. At this time, stress is applied to the plating film, and the first and second plating films are separated via the release layer at the slit portion of the plating film,
An aperture grill having a two-layered tape-like plating film was obtained. The aperture grille of the two-layer structure obtained in this way was mounted on a TV frame, and a cathode ray tube was mounted without a damper wire. As a result of an image projection test, the electron beam reflected on the slit-shaped tape wall was found to be A clear image without color shift was obtained without hitting the phosphor screen.

[0014]

Table 1 Composition and conditions of iron plating solution (solution composition) FeCl ₂ .4H ₂ O 2.01 M CaCl ₂ 1.62 M saccharin 9.13 M Sodium lauryl sulfate 0.30 mM (plating conditions) Temperature 90 ° C. Cathode current density 3 A / dm ² anode Pt time 2 minutes

[0015]

Table 2 nickel electroplating solution composition and conditions (liquid _{composition) Ni (NH 2 SO 3)} 2 · 4H 2 O 600g / l NiCl ₂ · _{6H 2} O 5g / l boric acid 30 g / l CoCl ₂ · _6H 2 O 40 g / Liter Brightener appropriate amount (plating conditions) Temperature 60 ° C Cathode current density 3A / dm ² Anode Ni Time 24 minutes

[0016]

[Table 3] (Liquid composition) Potassium dichromate 5g / L (Treatment conditions) Temperature 25 ° C Treatment form Substrate immersion time 3 minutes

[Comparative Example] Each slit width was 194 μm.
250 having a black pattern of m and a white pattern of 56 μm
A photolithographic mask having a desired aperture grill pattern with a μm tape pitch is placed, exposed, developed, and a photoresist layer having a rectangular cross section is formed,
Electroplating time of nickel plating is 3 after oxidation treatment
An aperture grill was prepared in the same procedure as in Example 1 except that the time was set to 6 minutes and 28 minutes, and an image projection test was performed. As a result, the electron beam reflected by the slit-shaped tape wall hit an inappropriate position on the phosphor screen, causing color misregistration and an image which was slightly hard to see. In the above embodiment, an aperture grill having a two-layer structure has been described. However, it is needless to say that the present invention can be applied to an aperture grill having a one-layer structure. Grooves, recesses and protrusions, non-through holes and through holes that are larger than the order are mixed, and can be applied to products that conventionally require machining such as press molding and cutting.

[0018]

As described above, according to the present invention, a patterned resist which can be formed into a desired cross-sectional shape other than a rectangular shape and is used for patterned plating which does not require a post-process. The aperture grille manufactured by plating using this patterned resist layer makes it possible to obtain a clear image without the electron beam reflected on the slit-shaped tape wall hitting the phosphor screen. Was.

[Procedure amendment]

[Submission date] April 8, 1999 (1999.4.8)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[The scope of the appended billed]

[請 Motomeko 2 wherein the resist layer is UV-curable, thermosetting, heat drying type, electrodeposition type resist ink, liquid resist, claims, characterized in that it consists of a dry film resist, an insulating paste or a solder resist Item 4. A patterned resist layer for plating, which is patterned according to Item 1.

Claims (1)

[Claims] 1. A patterned resist layer used for performing patterned plating on a conductive substrate, wherein the patterned resist layer is laminated so as to have a step-like cross-sectional shape. Patterned resist layer for plating. 2. The resist layer according to claim 1, wherein the resist layer is made of an ultraviolet curing type, a thermosetting type, a heat drying type, an electrodeposition type resist ink, a liquid resist, a dry film resist, an insulating paste or a solder resist. 2. The patterned resist layer for plating according to 1 above.