JP2000255628A - Electronic parts packaging container - Google Patents

Abstract

PROBLEM TO BE SOLVED: To surely hold electronic parts, and to prevent the parts from being shifted by providing an elastic layer having a specified slip angle on a bottom surface of a recessed storage portion in an electronic parts packaging container in which electronic parts are stored in a large number of recessed storage portions opened in face side. SOLUTION: A large number of recessed storage portions 2 opened in face side are formed with specified intervals in the longitudinal direction in a carrier tape 1, a large number of feed holes 3 are formed with specified intervals on one side in the width direction, and semi-conductor packages 9 can be stored in the recessed storage portions 2. The recessed storage portions 2 are slightly larger in plan view shape than the semi-conductor packages 9, the semi-conductor packages 9 are positioned on the side, and a thermoplastic elastomer coating layer or sheet of an elastic layer 4 with 30-60 deg. in slip angle is provided on an inner bottom surface of the recessed storage portions 2. A top cover tape 5 is provided on the surface of the carrier tape 1, and the top cover tape 5 is adhered with an adhesive, etc., after the semi-conductor packages 9 are stored in the recessed storage portions 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a BG for electronic parts.
A (Ball Grid Array), μBGA, CSP (Chip Sca
electronic package for storing small area packages (semiconductor packages) such as flip packages and bare chips, and more specifically to prevent displacement and rattling after storing electronic components such as semiconductor packages. It concerns a suitable carrier tape or tray.

[0002]

2. Description of the Related Art In conventional electronic component packaging containers such as semiconductor packages, trays, carrier tapes, magazines and the like are mainly used. However, the above-described semiconductor package has a plurality of terminals (solder balls, electrode pads, etc.) arranged in a matrix or a random matrix on the bottom surface of the package substrate. Carrier tapes and trays are used. However, when the product is stored and transported on a carrier tape or tray, if the solder balls, etc., which are the terminals on the bottom surface, come into direct contact with the carrier tape or tray,
The solder balls may be deformed or fall off due to the vibration during the transfer, or may be scraped off to generate solder ball scum, thereby contaminating the electrode terminals. As a result, when the semiconductor package is mounted on a printed circuit board or the like on which a circuit is formed, there has been a problem in that the semiconductor package cannot be securely joined through a reflow process, resulting in poor connection or a short circuit caused by solder ball scum.

In order to eliminate this drawback, the present applicant has disclosed an embossed carrier tape in which terminals on the bottom face are prevented from directly contacting the carrier tape even when an area package such as a BGA is accommodated. 8-11930
No., etc. As shown in FIG. 4, the carrier tape has a large number of accommodation recesses s opened on the surface, and a shelf t is formed around the inside of the accommodation recess s. The embossed carrier tape is placed on the portion t, accommodated therein, and positioned by bringing the substrate end surface of the semiconductor package p into contact with the side surface of the accommodation recess s at a position different from the shelf.

[0004] However, this embossed carrier tape is
It is formed by pressure forming, vacuum forming, press forming, etc., but it is difficult to make the shelf surface of the shelf part continuous at right angles to the side wall surface of the accommodation recess because of the limitations of the processing accuracy of the molding die, etc. An arc surface is inevitably formed in a continuous portion of the side wall surface. For this reason, when the semiconductor package is housed in the housing recess, the corner of the substrate end surface of the semiconductor package runs on the circular arc surface, causing a problem that the semiconductor package rattles, and the terminal on the bottom surface comes into contact with the emboss carrier tape. The above-described problem may occur. Therefore, the above-described embossed carrier tape eliminates the influence of the arc surface by the groove formed on the shelf surface, thereby preventing the semiconductor package from rattling.

[0005] Further, in the present applicant, BGA
Japanese Patent Application Laid-Open No. H10-167377 discloses an embossed carrier tape in which terminals on the bottom face are prevented from directly contacting the base material of the embossed carrier tape even when an area package such as the above is stored.
No. in the publication. Japanese Patent Application Laid-Open No. H10-167377 discloses that an embossed carrier tape is formed by an adsorption sheet having a closed cell structure so that a solder ball does not directly contact a base material, or a preformed foamed elastomer sheet is formed of a thermoplastic resin. By sticking and providing the solder ball of the semiconductor package directly on the foamed elastomer sheet on the bottom surface of the storage recess, provided by attaching to the bottom surface of the formed storage recess.
There is described an embossed carrier tape which can prevent a trouble at the time of transportation without forming a shelf by sucking and holding a solder ball or the like.

[0006]

However, even in the case of the above-mentioned embossed carrier tape, when it is formed by press molding, a ridge for forming a groove must be finely machined in a male mold, so that the molding metal is not used. There is a problem that the manufacture of the mold is difficult, and wear is likely to occur due to repeated molding by the ridges, and the durability of the molding die is inferior.

[0007] Also, in other moldings including press molding, the formation of the groove at the edge on the side wall side of the accommodating recess is not necessarily performed by a mold due to the influence of the sheet thickness and the followability of the sheet stretching at the time of molding. It was difficult to form along the groove. Particularly, recently studied semiconductor packages such as μBGA and CSP have a small package outer diameter (substrate outer dimensions) and are accommodated by individual semiconductor manufacturers because the semiconductor manufacturers adopt various shapes individually. Embossed carrier tapes having different concave shapes have to be prepared individually, and there has been a problem that the types to be manufactured are diverse.

Further, in recent semiconductor packages, the pitch between terminals formed on the bottom surface of the substrate tends to be narrower and a large number of terminals tend to be formed. The dimensions from the outermost terminal to the outer edge of the package board must be reduced as the outer edge gets shorter, and the method of storing the board by placing the peripheral edge of the board on the shelf surface of the shelf can be a little. Therefore, it is extremely difficult to form a groove on the edge of the side wall of the storage recess, and the formation of the shelf itself requires a narrow shelf width. Even the way to do it is difficult.

Further, the above-mentioned Japanese Patent Application Laid-Open No. 10-167377
In the embossed carrier tape described in Japanese Patent Laid-Open Publication No. H10 (1995), the above-described solder ball is stored by sucking and holding a solder ball or the like by bringing each semiconductor package into contact with the independent foamed elastomer sheet formed in the storage recess. Although rubbing, falling off, and generation of scum can be prevented, it is difficult to control the formation of a closed-cell structure when the film thickness of the closed-cell foam is formed to 100 μm or less, and uniform smoothness is also obtained. It is difficult. Therefore, the embossed carrier tape using this form has a problem that it can be applied only to a film thickness of the independent foamed elastomer of 100 μm or more, preferably 200 μm or more. Further, the embossed carrier tape using this form has a problem that the depth of the storage recess becomes deeper than that of a normal embossed carrier tape, and the number of windings when winding on a reel is reduced.

On the other hand, there are two types of trays: a soft tray molded by vacuum molding and the like, and a hard tray produced by injection molding. Among them, the hard tray is produced by injection molding. It is formed of a material having a hardness higher than that of. That is, as shown in FIG. 5, a lattice-shaped partition rib g and a shelf h are integrally formed in the storage recess f of the tray e, so that the semiconductor package p is stored between the partition ribs g. . Therefore, when an impact is applied during the transportation, there is a problem that the semiconductor package p is loosened or displaced, so that the sealing resin of the semiconductor package is broken or missing. However, there is a disadvantage that the mounting reliability is impaired because the carbon powder comes off and it may adhere to the solder balls and short-circuit after mounting, and there is a disadvantage that mounting trays of various sizes are not used, and the tray itself can not cope. Production was complicated and complicated. Further, with the carrier tape, the semiconductor package may not be mounted on the shelf, and the semiconductor package may be mounted and stored on an inclined surface close to the bottom where two sidewalls of the storage portion are formed with a continuous inclined surface. However, even this method cannot be applied to the case where the dimension between the outermost terminal of the semiconductor package and the outer edge of the package substrate is small, and when the number of pins is increased, the overhang becomes extremely small, and the shelf surface or the inclined surface is reduced. Is difficult to standardize the specifications of the carrier tape, it is necessary to prepare various types of packaging containers for each PKG, and the handling is complicated and the cost must be increased. there were.

The present invention has been made in view of these conventional problems, and has a simple shape in an accommodating recess in which electronic components of various sizes of semiconductor packages can be commonly used, and can be easily molded, and the electronic components can be formed easily. It is an object of the present invention to provide a low-cost electronic component packaging container that can securely hold electronic components without slipping phenomenon, has improved damage prevention and impact resistance, and can stably store electronic components.

[0012]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a method for forming a large number of embossed recesses having a plurality of substantially rectangular, inclined surfaces opened on the surface at predetermined intervals in the longitudinal direction of the tape. A carrier tape for accommodating electronic components in the accommodating recess, or an electronic component packaging container for an accommodating tray in which a plurality of accommodating recesses capable of accommodating electronic components are arranged in a matrix, An elastic layer having a sliding angle of 30 to 60 degrees is provided.

The slip angle θ = 3 according to the present invention.
The elastic layer having 0 to 40 degrees is made of a thermoplastic elastomer,
The present invention can be configured such that it is formed of silicone rubber or this elastomer sheet and a grid-shaped partitioning body crossed vertically and horizontally (claims 2 and 3).

The elastic body forming the elastic layer having the slip angle is preferably a thermoplastic elastomer or silicone rubber. As the thermoplastic elastomer, for example, polystyrene is used for the hard segment, polybutadiene / polyisoprene is used for the soft segment, and an ethylene-butylene copolymer obtained by hydrogenating them is used as the soft segment. SBS, SIS, SEBS, which are ethylene-propylene copolymers, S
Using polyethylene or polypropylene for styrene-based elastomer (SBC) such as EPS or hard segment,
Olefin-based elastomer (TPO) such as blended or cross-linked raw rubber such as EPM or EPDM for soft segment or completely cross-linked rubber for PP, or polyurethane for hard segment, and soft segment such as polyester, polyether, polyol, etc. Polyurethane elastomers (TPEE) such as urethane-based elastomers (TPU) and aromatic polyesters for the hard segments and aliphatic segments such as aliphatic polyethers and fatty acid polyesters are used as the soft segments, and may be foamed as necessary. The elastic layer may be provided by coating with a thermoplastic elastomer or silicone rubber or by laminating as a sheet.

The measurement of the slip angle as the elastic layer was verified by the following method. Sheets of various materials are uniformly fixed on a flat flat plate, and one BGA27 256 pin, which is a semiconductor package, is mounted thereon.
After that, one end of the flat plate is supported, and the other end is rotated at an angle of 60 minutes per minute.
Lift up each time and measure the angle at which the semiconductor package starts to move. There was no difference in the type of semiconductor package. The results are shown in Table 1. Glass and paper showed slip angles of 17 degrees and Teflon tape showed 12 degrees as slippery materials.
The materials commonly used for carrier tapes are PVC, P
It was a conductive sheet kneaded with S and a PS conductive coating sheet, and they exhibited values of 25, 30, and 20 degrees of sliding angle. On the other hand, a sheet in which A-PET (amorphous polyethylene terephthalate) was coated with a urethane-based elastomer showed a value of 45 degrees, and the semiconductor package was difficult to slide. Next, a sheet obtained by coating the A-PET with a urethane-based elastomer was subjected to air pressure molding so that the dimensions of the accommodation concave portion were 27.3 mm in length, 27.3 mm in width,
It is molded into a carrier tape having a depth of 3.0 mm, and the above-mentioned BGA27 256 pin is housed in the center thereof,
Amplitude 50KHz-2 by IDEX ultrasonic vibrator
G was vibrated for 1 minute, but the stored semiconductor package did not deviate from a predetermined position, whereas a carrier tape molded using a PS sheet (97511C-20) made of Shin-Etsu Polymer was used. Is 2 mm under the same conditions
Deviation was seen. When an experiment was conducted with an ultrasonic vibrator using various materials having different sliding angles, a material having a sliding angle of 30 degrees was shifted by 1 mm. From this result, the slip angle is 30
If it is higher than 45 degrees, it is less slippery than the material of the conventionally used carrier tape, and preferably 45 degrees or higher. These materials having a large slip angle did not hinder the pickup of the semiconductor package at the time of mounting.

[0016]

[Table 1]

The carrier tape is a polystyrene resin,
Vacuum molding of thermoplastic resin sheet such as polyvinyl chloride resin, amorphous polyethylene terephthalate (A-PET), polycarbonate or polypropylene resin,
It is formed by compressed air molding, compressed air plug assist molding or press molding. In this carrier tape, a large number of accommodation concave portions are formed at regular intervals in the longitudinal direction, and a large number of feed holes are formed at one or both sides at regular intervals in parallel with the accommodation concave portions. After the electronic component is accommodated in the accommodating concave portion of the carrier tape, a top cover tape is attached to the opening-side surface of the accommodating concave portion.

According to JIS-C0806, the accommodating concave portion is opened on one surface of the carrier tape, and a large number of the concave portions are formed at regular intervals in the longitudinal direction of the carrier tape.
And electronic components typified by the CSPS area package. The accommodation recess has a planar shape corresponding to the planar shape of the electronic component, usually has a square or rectangular shape, and has a depth from the upper surface of the attraction layer that is at least the thickness including the terminals of the electronic component. The thickness is preferably formed by adding 0.1 to 0.3 mm to the thickness of the electronic component.
In addition, since the housing concave portion performs positioning of the housed electronic component by abutting the side wall surface, the dimension between the side walls and the like is a value corresponding to the external size of the electronic component, preferably, the external size of the electronic component and the carrier tape. In consideration of the variation of the electronic component, the value is obtained by adding about 0.1 to 0.3 mm to the external dimensions of the electronic component.

When the thermoplastic elastomer is coated on the resin sheet or the bottom of the housing recess, the thickness is 10 μm.
If it is less than the above, the cushioning property is small, the sliding angle is reduced, and if it is 200 μm or more, the height dimension of the accommodation recess becomes large, which hinders accommodation and deteriorates air pressure moldability, so coating in the range of 10 to 200 μm. Good to do. Further, when the elastomer sheet is attached to the concave bottom surface of the housing, an adhesive such as a polyurethane resin, a vinyl chloride-vinyl acetate copolymer, an ethylene-vinyl acetate copolymer, an acrylic adhesive, an isopropylene rubber Then, a rubber-based adhesive containing a rubber-based elastomer such as styrene-butadiene rubber is used to adhere to the bottom surface or the like of the housing recess.

As the storage tray, a dish-shaped rectangular hard segment is formed using polyethylene, polystyrene, polypropylene, polyurethane, aromatic polyester, or the like, and the soft segment inserted into the concave portion of the hard segment is formed of the above-mentioned heat segment. An elastomer sheet composed of a plastic elastomer is used in combination with a grid-shaped partitioning body. Semiconductor packages of various sizes are placed in a common housing recess, and the bottom surface of the housing recess has a surface on which the semiconductor package does not slip easily. It is used as an elastic body.

[0021]

In the carrier tape or tray according to the present invention, since the electronic component (semiconductor package) holds the solder balls and the like by the elastic layer provided on the bottom surface of the accommodation recess, it is not necessary to form a shelf or the like. The molding can be easily performed. In the semiconductor package, since the solder balls are adsorbed to the elastic layer, the solder balls and the like are not rubbed during transportation or the like, and the occurrence of later solder defects can be prevented. Further, the tray according to the present invention is provided with the elastic layer made of the partitioning member and the elastomer sheet on the surface (front surface) on the opening side of the storage recess, so that the electronic components are less slippery and can be stably stored without displacement. In addition, it is possible to use a common storage section for electronic components having different sizes, and the tray can be formed in a simple shape and easily formed.

[0022]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a carrier tape according to an embodiment of the present invention, wherein (a) is a partial plan view,
(B) is a vertical cross-sectional view of the same carrier tape along the line BB, (c) is a vertical cross-sectional view of the same carrier tape along the line CC, and (d) is a vertical cross-sectional view in use.

In FIG. 1, reference numeral 1 denotes a carrier tape. The carrier tape 1 has a large number of accommodation recesses 2 formed on its surface formed at regular intervals in the longitudinal direction, and penetrates the front and back sides on one side in the width direction. Are formed at regular intervals. The housing recess 2 has a substantially rectangular parallelepiped shape,
A semiconductor package (electronic component) 9 such as PKG is housed inside. The accommodation recess 2 has a slightly larger planar shape than the semiconductor package 9 in plan view, positions the semiconductor package 9 on the side surface, and has an elastic layer having a slip angle of 30 to 60 degrees on the inner bottom surface of the accommodation recess 2. Four thermoplastic elastomer coating layers or sheets are provided. In the semiconductor package 9, a plurality of solder balls 9b protrude from the bottom surface of the main body 9a in a matrix. Reference numeral 5 denotes a top cover tape provided on the surface of the carrier tape 1 and closing the opening of the housing recess 2. The top cover tape 5 is attached with an adhesive or the like after housing the semiconductor package 9 in the housing recess 2. .

Carrier tape 1 according to this embodiment
In this case, the semiconductor package 9 is held by a pick-and-press suction nozzle of a taping machine or the like, and the solder ball 9b is loaded into the accommodation recess 2 so as to face the elastomer coating layer or the elastic layer 4 of the sheet. At the time of loading, the pick-and-press suction nozzle gently presses the semiconductor package 9 toward the elastic layer 4,
The elastic layer 4 is elastically deformed. Therefore, in the semiconductor package 9, the solder balls 9 b are held by the elastic layer 4. Thereafter, the carrier tape 1 has the top cover tape 5 adhered to the surface thereof, and the opening of the accommodation recess 2 is closed.
Wound on a reel or the like. Then, transportation or the like is performed with the carrier tape 1 wound on a reel or the like.

Therefore, the solder balls 9b and the carrier tape 1 do not rub against each other even when vibration is applied during transportation or the like, and it is possible to reliably prevent the occurrence of defective bonding or the like in later mounting or the like. Since it is not necessary to form a fine shape such as a shelf in the housing recess 2, the overall shape can be simplified,
Molding can be performed easily and inexpensively.

Further, in the carrier tape 1, the accommodating concave portion 2 is formed on a resin sheet in which the elastic layer 4 is entirely coated on one surface of the sheet material or a simple resin sheet by pressure forming or the like, and the feed hole 3 is formed. Take up on reel. In the case of a mere resin sheet, the carrier tape 1
The traveling carrier tape 1
The elastomer sheet of the elastic layer 4 is provided on the bottom surface of the accommodation recess 2 via an adhesive.

2 and 3 show a tray according to another embodiment of the present invention. FIG. 2 (a) is a longitudinal sectional view of a separated state, FIG. 2 (b) is a plan view of a partitioning body, 2C is a plan view of the tray, FIG. 2D is a plan view of the combined state, and FIG. 3 is an enlarged vertical sectional view of a part of the used state.

In this embodiment, the receiving tray 10 in which a plurality of concave portions capable of storing the electronic components 9 are arranged in a matrix is used.
An elastic body layer 14 composed of an elastomer sheet 13 having a sliding angle of 30 to 60 degrees and a grid-shaped partitioning body 11 is provided on the bottom surface of the base 2 so as to be freely inserted and removed.

The elastic layer 14 is constructed as described below. That is, a grid-shaped partitioning body 11 made of a thermoplastic elastomer or another resin material is used by using a dish-shaped tray 10 having a housing recess 12 and the housing recess 12.
Is combined with a thermoplastic elastomer sheet 13 that can be placed on the entire bottom surface of the tray, and is inserted into and detached from the accommodating recess 12 of the tray 10 to form predetermined electronic component accommodating recesses in a matrix.

Also in the embodiment of FIG. 2 described above, the semiconductor package 9 holds the solder balls 9 b by the elastic layer 14. Therefore, rubbing of the solder balls 9b can be prevented during transportation or the like.

In this embodiment, the partition 1
By the replacement of 1, the semiconductor trays of various sizes can be accommodated, and the sharing of the storage tray 10 can be easily realized.

When a sheet material having the elastic layer 4 coated on the entire carrier tape 1 is used, the accommodating recess 2 is embossed on the sheet extruded by an extruder by press molding or the like, and then the feed hole is formed. 3 is formed by punching.

Example 1 A method for attaching a sheet member A silicone sheet having the composition shown in Table 2 was used.

[0034]

[Table 2]

The above composition is kneaded with a two-roll mill for 5 minutes.
And further press-cured at 165 ° C for 10 minutes.
After post-curing at 200 ° C for 4 hours,
A conductive silicone sheet was obtained. Silico obtained here
Sheet has a surface resistance of 10 ⁴Ω with a sliding angle of 53 °
It was a physical property value. Put this silicone sheet in the container as follows
Deployed. A. For the carrier tape, the size of the recess is stored by air pressure molding.
27.3 mm long, 27.3 mm wide, 3.0 mm deep
After molding the carrier tape, insert the silicon
Sheet was cut into 27.0 mm x 27.0 mm.
The object was fixed to the bottom of the recess. B. For the carrier tray, by injection,
External dimensions are 322.6 mm x 135.9 mm, thickness is 7.
62mm, upper surface 311.5mm x 132.5mm, depth
A tray having a 3.0 mm concave portion is formed and the concave portion is formed.
311.0mm x 132.0m with a silicone sheet inside
Those cut to m were fixed. These A and B electrons
In the component packaging container, there is no displacement phenomenon of electronic components in the accommodation recess.
And could be held in a stable state. Example 2 Coating method A coating material having a composition shown in Table 3 was used.

[0036]

[Table 3]

The above arrangement was made on a 0.3 mm thick sheet of A-PET.
30μ coated with gravure coating and molding
A conductive sheet was prepared. This conductive sheet has a surface resistance of 1
0⁴ Ω indicates a physical property value at a slip angle of 47 °. This conductive sheet
The following containers were prepared using a sheet. A. Carrier tape Using the above-mentioned conductive sheet, press-press molding to form a recess A
Dimension 27.3mm, B dimension 27.3mm, depth 3.0m
m of carrier tape was formed. B. Carrier tray The above conductive sheet is cut to 311.0 mm x 132.0 mm.
What was cut was fixed to the tray. These A and B
The electronic component held in a predetermined position in the child component packaging container has an amplitude of 5
No displacement even if vibrated at 0KHz-2G for 1 minute
Was.

[0038]

As described above, according to the carrier tape of the present invention, the elastic body made of thermoplastic elastomer or silicone rubber having a sliding angle of 30 to 60 degrees on the bottom surface of the housing recess for housing the electronic component. Layer,
Since the electronic component is held by the elastic layer, the electronic component is not rubbed during transportation or the like, so that it is possible to prevent the occurrence of a solder defect or the like later, and furthermore, the shape of the housing recess can be simplified, and the cost can be reduced easily. Can be manufactured.

Further, in the carrier tray according to the present invention, semiconductor packages of various sizes are shared by providing an elastic layer in which a thermoplastic elastomer sheet or a silicone rubber sheet and a partitioning body are combined in the accommodating recess. Since the semiconductor package is placed in the housing recess and used as an elastic body having a surface on which the semiconductor package is not slippery on the bottom surface of the housing recess, it can be easily formed with a simple shape, and the electronic component can be securely held without slipping phenomenon. In addition, it is possible to provide a low-cost electronic component packaging container that can also stably store electronic components, with improved damage prevention and impact resistance.

[Brief description of the drawings]

1A and 1B show a carrier tape according to an embodiment of the present invention, wherein FIG. 1A is a partial plan view, FIG. 1B is a longitudinal sectional view taken along line BB, and FIG. Longitudinal section,
(D) is a longitudinal sectional view of a use state.

2A and 2B show a carrier tray according to another embodiment of the present invention, wherein FIG. 2A is a longitudinal sectional view of a separated state, FIG. 2B is a plan view of a partitioning body, FIG. d) is a plan view of the combined state.

FIG. 3 is a partially enlarged longitudinal sectional view of a use state of the example of FIG. 2;

FIG. 4 shows an example of a conventional carrier tape, and FIG.
Is a partial plan view, (b) is a central horizontal sectional view, and (c) is a central vertical sectional view.

5A and 5B show an example of a conventional storage tray, in which FIG. 5A is a plan view, FIG. 5B is a bottom view, and FIG. 5C is a partially enlarged longitudinal sectional view.

[Description of Signs] 1 Carrier tape 2 Housing recess 3 Feed hole 4 Elastic layer 5 Top cover tape 7 Detection hole 9 Semiconductor package (electronic component) 9b Solder ball (terminal) 10 Tray 11 Partitioning unit 12 Housing recess 13 Elastomer sheet 14 Elastic layer

Continued on the front page (72) Inventor Toshiyuki Kamada 1-406, Yoshino-cho, Omiya-shi, Saitama F-term in Shin-Etsu Polymer Co., Ltd. Tokyo Plant (reference) 3E067 AA11 AB41 AB47 AC04 AC11 AC12 AC18 BA02A BA10A BB14A BB21A BC02A BC07A EA32 EC31 EE46 EE59 FA02 FA09 FC01 GD03 3E096 AA06 AA09 BA09 BB05 BB08 CA06 CA15 CB03 DA03 DB06 DC04 EA02X EA02Y FA09 GA05

Claims (3)

[Claims] A plurality of receiving recesses each having a substantially rectangular shape and having an inclined surface are embossed at predetermined intervals in a longitudinal direction of the tape, and a carrier tape or an electronic component is stored in the receiving recess. An electronic component packaging container of a receiving tray in which a plurality of receiving concave portions are arranged in a matrix, wherein an elastic layer having a sliding angle of 30 to 60 degrees is provided on at least a bottom surface of the receiving concave portion of the electronic component packaging container. An electronic component packaging container comprising: 2. A sheet material made of a thermoplastic synthetic resin is coated with a thermoplastic elastomer or silicone rubber having a thickness of 10 to 2 mm.
An electronic component packaging container comprising: a carrier tape having a configuration in which a substantially rectangular accommodating concave portion opened on the surface of a band-shaped resin sheet provided at 00 μm is embossed at predetermined intervals in the tape longitudinal direction. 3. An electronic component packaging container of an accommodation tray in which a plurality of accommodation recesses capable of accommodating electronic components are arranged in a matrix, comprising: an accommodation tray having an accommodation recess formed therein; An electronic component packaging container, comprising a thermoplastic elastomer sheet or a silicone rubber sheet which can be freely incorporated, and a grid-shaped partitioning body.