JP2000252748A - Surface mounted type piezoelectric oscillator - Google Patents

Surface mounted type piezoelectric oscillator

Info

Publication number
JP2000252748A
JP2000252748A JP11050086A JP5008699A JP2000252748A JP 2000252748 A JP2000252748 A JP 2000252748A JP 11050086 A JP11050086 A JP 11050086A JP 5008699 A JP5008699 A JP 5008699A JP 2000252748 A JP2000252748 A JP 2000252748A
Authority
JP
Japan
Prior art keywords
base
oscillator
conductive terminal
substrate
piezoelectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11050086A
Other languages
Japanese (ja)
Other versions
JP4204023B2 (en
Inventor
Hiroshi Narai
博 成相
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Crystal Device Corp
Original Assignee
Kyocera Crystal Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Crystal Device Corp filed Critical Kyocera Crystal Device Corp
Priority to JP05008699A priority Critical patent/JP4204023B2/en
Publication of JP2000252748A publication Critical patent/JP2000252748A/en
Application granted granted Critical
Publication of JP4204023B2 publication Critical patent/JP4204023B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To obtain a base structure of an inexpensive oscillator that a surface mounted type is attained without changing the conventional structure by arranging a base made of a stacked substrate in the direction where a conductive terminal of the substrate extends and connecting the conductive terminal to the electrode of the base. SOLUTION: On both the surfaces of an epoxy substrate 2 having the conductive terminal 1 arranged on one side, a piezoelectric vibrator 3 in sealed structure and oscillation circuit components 4 are mounted to constitute an oscillation circuit. This oscillator has the base 5 made of the laminate epoxy substrate with a flank electrode 7 of the same kind as the epoxy substrate 2 in the extending direction of the conductive terminal 1 (right above the components). A through hole (for connection with the component-mounted substrate) which is connected to the conductive terminal 1 by soldering is formed and a spot facing hole is bored in the base 5 up to its intermediate layer to absorb projection parts of the solder part of the conductive terminal 1.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、圧電発振器の容器
形状を改良することにより、従来のリード端子形態製品
を容易に表面実装型のリード構造にする容器構造に関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a container structure for easily converting a conventional lead terminal type product into a surface mount type lead structure by improving the shape of the container of a piezoelectric oscillator.

【0002】[0002]

【従来の技術】従来から用いられる圧電発振器は、積層
基板に密閉構造の圧電振動子や電子部品を搭載する印刷
パターンを配置し、この積層基板の同一平面上に圧電振
動子や電子部品を搭載し発振器を形成している。圧電発
振器は水晶振動子の中心周波数を逓倍回路により逓倍
し、水晶振動子の出力電圧を増幅したり、波形成形ある
いは発振周波数の2倍以上の発振周波数を出力するもの
である。
2. Description of the Related Art In a conventional piezoelectric oscillator, a printed pattern for mounting a piezoelectric vibrator or an electronic component having a closed structure is arranged on a laminated substrate, and the piezoelectric vibrator or the electronic component is mounted on the same plane of the laminated substrate. To form an oscillator. The piezoelectric oscillator multiplies the center frequency of the crystal unit by a multiplying circuit, amplifies the output voltage of the crystal unit, outputs a waveform, or outputs an oscillation frequency twice or more the oscillation frequency.

【0003】[0003]

【発明が解決しようとする課題】最近の傾向として無線
通信機器や携帯電話機など移動体通信分野、産業機器分
野を中心に小型化が急激な展開を見せている。これらの
分野に組み込まれる発振器にとっても、小型化という要
求が求められると同時に、発振器の発振周波数も高周波
帯域へと移行する傾向にあり、発振器の回路基板搭載形
態も、リード型から表面実装型へと変化しているのが現
状である。
As a recent trend, miniaturization has been rapidly developed mainly in the field of mobile communication such as wireless communication equipment and portable telephones, and in the field of industrial equipment. Oscillators incorporated in these fields are also required to be miniaturized, and the oscillation frequency of the oscillator tends to shift to a higher frequency band, and the circuit board mounting form of the oscillator is changed from a lead type to a surface mount type. It is the present situation that is changing.

【0004】図3に示す側面図は、従来型の発振器の形
態である。従来では部品搭載基板の片面に圧電振動子や
電子部品を搭載し、リード端子により他の回路基板へ搭
載する形状を示すものである(図3(a))。しかし、
リード端子の形態がリード端子から表面実装型へと需要
が変化し、図3(b)に示すような表面実装型が最近の
主流と成ってきている。
FIG. 3 shows a side view of a conventional oscillator. In the related art, a shape in which a piezoelectric vibrator or an electronic component is mounted on one surface of a component mounting board and mounted on another circuit board by a lead terminal is shown (FIG. 3A). But,
The demand for the form of the lead terminal has changed from the lead terminal to the surface mount type, and the surface mount type as shown in FIG. 3B has become the mainstream in recent years.

【0005】一方、前述するように発振器自体の小型化
と、発振器の発振周波数の高周波帯域への移行に伴い、
圧電発振器の回路構成上、逓倍回路を増やすなど発振器
を構成する電子部品回路点数を増やす反面で、発振器自
体の小型化の要求という相い反す事態を克服するため
に、従来では部品搭載基板の片面に圧電振動子や電子部
品を搭載して構成する発振器を、部品搭載基板の両面に
圧電振動子や電子部品を搭載し、発振器を構成する電子
部品点数を増やし発振周波数を高周波帯域に移行しなが
ら、発振器を小型化してきている。
On the other hand, as described above, with the downsizing of the oscillator itself and the shift of the oscillation frequency of the oscillator to a high frequency band,
In the circuit configuration of a piezoelectric oscillator, the number of electronic component circuits constituting the oscillator is increased, such as by increasing the number of multiplier circuits. Oscillator consisting of a piezoelectric vibrator and electronic components mounted on one side is mounted.Piezoelectric vibrators and electronic components are mounted on both sides of the component mounting board, increasing the number of electronic components constituting the oscillator and shifting the oscillation frequency to the high frequency band. However, oscillators have been downsized.

【0006】しかし、この場合図3(c)の側面図のよ
うに、基板両面に発振器を構成する部品(振動子や電子
部品)を搭載し、表面実装型の形態を実現するには、部
品搭載基板のリード形状は図3(c)に示すようなリー
ド形状となり端子の長さが長くなり、その結果端子強度
や端子形状の変形、端子の平面平行度の悪化を招くおそ
れや、表面実装用にリード形状を変えた発振回路基板を
製作することによるコストの発生といった課題がある。
However, in this case, as shown in the side view of FIG. 3 (c), it is necessary to mount components (oscillators and electronic components) constituting the oscillator on both sides of the substrate to realize a surface mount type. The lead shape of the mounting board becomes the lead shape as shown in FIG. 3C, and the length of the terminal becomes longer. As a result, the terminal strength, the shape of the terminal may be deformed, the parallelism of the terminal may be deteriorated, or the surface mounting may be performed. However, there is a problem in that the production of an oscillation circuit board having a different lead shape for use in the device causes a cost.

【0007】[0007]

【課題を解決する手段】これらの課題を解決するために
本発明は、片側に導通端子を配置するエポキシ基板の両
面に密閉構造の圧電振動子と発振回路部品を搭載し、エ
ポキシ基板の導通端子面側に、積層エポキシ基板を配置
し導通端子位置にスルーホールを構成し、更に積層エポ
キシ基板表面より積層エポキシ基板の中間層までバカ穴
をあけ、中間層のランドパターンを露出し、積層エポキ
シ基板と導通端子とをはんだ付けして接続端子とするこ
とにより、はんだの凸部を吸収して表面実装の形態にす
ることを特徴とする表面実装型圧電発振器である。
SUMMARY OF THE INVENTION In order to solve these problems, the present invention provides an epoxy board having a conductive terminal disposed on one side, a piezoelectric vibrator and an oscillator circuit component having a hermetically sealed structure mounted on both sides of the epoxy board. On the surface side, a laminated epoxy board is arranged, a through hole is formed at the position of the conductive terminal, and further, a stupid hole is made from the surface of the laminated epoxy board to the middle layer of the laminated epoxy board, and the land pattern of the middle layer is exposed, and the laminated epoxy board is exposed. A surface-mounted piezoelectric oscillator characterized in that a soldering of the conductive terminal and a conductive terminal to form a connection terminal absorbs a convex part of the solder to form a surface-mounted form.

【0008】[0008]

【背景】本発明は、高周波帯域化する発振器の発振周波
数と圧電発振器を小型化する要求に対して、発振器を構
成するエポキシ基板の両面に圧電振動子や電子部品を搭
載し、高密度の回路構成で小型化を実現する表面実装型
の圧電発振器を特徴とするものである。そのために、図
3(c)に示す側面図のように、片側にリード端子を配
置するエポキシ基板の両面に密閉構造の圧電振動子と発
振回路部品を搭載し、L字型の端子部(他の回路基板と
の導通部)を持つエポキシ基板を配置することにより、
表面実装は実現できるものの、長い導通端子と前述のエ
ポキシ基板とをはんだ付け(接合)するため、端子形状
の変形や各端子間同士の平面平行度の悪化といった不安
定な状態となってしまう。
Background of the Invention The present invention responds to the demand for downsizing the oscillating frequency of an oscillator that has a high frequency band and the size of a piezoelectric oscillator, by mounting piezoelectric vibrators and electronic components on both sides of an epoxy substrate that constitutes the oscillator, and providing a high-density circuit. The present invention is characterized by a surface-mount type piezoelectric oscillator that realizes miniaturization with a configuration. For this purpose, as shown in the side view of FIG. 3 (c), a piezoelectric vibrator and an oscillation circuit component having a hermetically sealed structure are mounted on both sides of an epoxy substrate having lead terminals arranged on one side, and an L-shaped terminal portion (others) is provided. By placing an epoxy board with a conductive part with the circuit board of
Although surface mounting can be realized, since the long conductive terminals are soldered (joined) to the above-mentioned epoxy substrate, an unstable state such as deformation of terminal shapes and deterioration of plane parallelism between terminals is caused.

【0009】この不安定な状態を改善すめために、本発
明は片側に導通端子を配置するエポキシ基板の両面に密
閉構造の圧電振動子と発振回路部品を搭載し、導通端子
側に側面電極部(他の回路基板との導通部)を持つ積層
エポキシ基板を配置し、部品搭載基板と反対側から導通
端子位置の中間層までザグリ穴をあけ、はんだ凸部(は
んだ付け時のはんだ盛り)を吸収した表面実装型の圧電
発振器を提供することにある。本発明は安価なエポキシ
基板により表面実装化することで、発振器自体の価格を
安くすることができる。
In order to improve this unstable state, the present invention mounts a piezoelectric vibrator and an oscillation circuit component having a sealed structure on both sides of an epoxy substrate having conducting terminals on one side, and a side electrode portion on the conducting terminal side. Place a laminated epoxy board with a conductive part with other circuit boards, make a counterbore hole from the side opposite to the component mounting board to the middle layer at the position of the conductive terminal, and make solder bumps (solder pile during soldering) It is an object of the present invention to provide a surface-mounted piezoelectric oscillator that absorbs light. According to the present invention, the price of the oscillator itself can be reduced by performing surface mounting on an inexpensive epoxy substrate.

【0010】[0010]

【発明の実施の形態】本発明は、片側に導通端子を配置
する部品搭載基板の両面に、密閉構造の圧電振動子と発
振回路部品を搭載し、基板の導通端子面に、積層回路基
板を配置して接続端子を構成し、表面実装の形態にした
ことを特徴とし、前述の積層回路基板の接続端子位置に
は中間層までザクリ穴が形成されていることを特徴とす
る表面実装型圧電発振器である。
BEST MODE FOR CARRYING OUT THE INVENTION The present invention has a piezoelectric vibrator and an oscillating circuit component having a hermetically sealed structure mounted on both sides of a component mounting substrate on which conductive terminals are arranged on one side, and a laminated circuit board is mounted on the conductive terminal surface of the substrate. A surface mounting type piezoelectric element characterized in that the connection terminals are arranged and arranged in a surface mounting form, and a counterbore is formed at the connection terminal position of the above-mentioned laminated circuit board to an intermediate layer. It is an oscillator.

【0011】[0011]

【実施例】以下、添付図面に従ってこの発明の実施例を
説明する。なお、各図において同一の符号は同様の対象
を示すものとする。図1に本発明の圧電発振器の斜視図
を示す。片側に導通端子1を配置するエポキシ基板2の
両面に、密閉構造の圧電振動子3と発振回路部品4を搭
載して発振器回路が構成される。エポキシ基板2の詳細
なパターンは記載しないが、発振器として動作するため
の電源や発振周波数出力を得るための導通端子1がエポ
キシ基板2にははんだ付けされている。
Embodiments of the present invention will be described below with reference to the accompanying drawings. In each drawing, the same reference numeral indicates the same object. FIG. 1 shows a perspective view of a piezoelectric oscillator according to the present invention. An oscillator circuit is configured by mounting a piezoelectric vibrator 3 and an oscillation circuit component 4 having a sealed structure on both sides of an epoxy substrate 2 on which a conduction terminal 1 is arranged on one side. Although a detailed pattern of the epoxy board 2 is not described, a power supply for operating as an oscillator and a conductive terminal 1 for obtaining an oscillation frequency output are soldered to the epoxy board 2.

【0012】即ち、図2の部分断面図(図1中の矢印A
部)に示すように、圧電振動子3や発振回路部品4を搭
載するエポキシ基板2の導通端子1の延びる方向(部品
のすぐ下方)に、エポキシ基板2と同種の側面電極7の
付いた積層エポキシ基板から成るベース5を配置して、
前述する導通端子1とはんだで接続するスルーホール9
(部品搭載回路基板との接続として)を構成し、このベ
ース5にザグリ穴6を中間層10まであけることによ
り、上記の導通端子1のはんだ部の凸部を吸収し、エポ
キシ基板により表面実装の形態を実現するものである。
That is, a partial sectional view of FIG. 2 (arrow A in FIG. 1)
As shown in FIG. 2B, a laminate having a side electrode 7 of the same type as the epoxy substrate 2 is provided in the direction in which the conductive terminal 1 of the epoxy substrate 2 on which the piezoelectric vibrator 3 and the oscillation circuit component 4 are mounted extends (just below the component). A base 5 made of an epoxy substrate is arranged,
Through hole 9 connected to conductive terminal 1 by soldering
(As a connection with the component mounting circuit board), and the counterbore hole 6 is drilled in the base 5 up to the intermediate layer 10 to absorb the above-mentioned protrusion of the solder portion of the conductive terminal 1 and to be surface-mounted by an epoxy board. Is realized.

【0013】図2の断面図では、導通端子1の端部がベ
ース5ではんだにより固着し導通をとっているもので、
このはんだ部分にあたるベース5側にはベース5の側面
に引き回す側面電極7(スルーホールによりランドパタ
ーンを形成)が延びており、外部接続用の電極を形成す
るものである。一方、導通端子1とのはんだ付け部の凸
部は積層エポキシ基板で出来ているベース5のはんだ付
け部位置に相当する箇所に中間層10までのザグリ穴6
を形成することによりはんだの凸部をベース5の表面よ
り内部に吸収することができ、外部基板との接続部の平
面平行度の良い外部接続用電極を得ることができる。こ
こで、部品搭載基板2とベース5との間隔は図示しない
導通端子1に設けるストッパーや、製造工程中に用いる
治工具などで決定する。
In the cross-sectional view of FIG. 2, the end of the conductive terminal 1 is fixed to the base 5 by soldering to establish conduction.
On the side of the base 5 corresponding to the solder portion, a side surface electrode 7 (a land pattern is formed by a through hole) extending to the side surface of the base 5 extends, and forms an electrode for external connection. On the other hand, the convex portion of the soldering portion with the conductive terminal 1 has a counterbore hole 6 extending to the intermediate layer 10 at a position corresponding to the soldering portion position of the base 5 made of a laminated epoxy board.
Is formed, the convex portion of the solder can be absorbed into the inside of the base 5 from the surface thereof, and an external connection electrode having a good degree of plane parallelism at the connection portion with the external substrate can be obtained. Here, the interval between the component mounting board 2 and the base 5 is determined by a stopper provided on the conductive terminal 1 (not shown), a jig used during the manufacturing process, and the like.

【0014】なお、本実施例の発振器は圧電発振器(V
CXO、TCXO、CXO)を想定しているが、圧電発
振器に限らずLC発振器やSAW発振器あるいは、他の
電子部品の端子形状を表面実装化することについても応
用できる。また、圧電材料としては水晶振動子、セラミ
ック材料が用いられる。
The oscillator of this embodiment is a piezoelectric oscillator (V
CXO, TCXO, CXO) are assumed, but the present invention is not limited to the piezoelectric oscillator, and can be applied to surface mounting of the terminal shape of an LC oscillator, a SAW oscillator, or another electronic component. Further, a quartz oscillator or a ceramic material is used as the piezoelectric material.

【0015】[0015]

【発明の効果】本発明により表面実装を実現するため
に、特別な表面実装用の端子を用いることなく、安価な
エポキシ基板により表面実装型の形態を構成すること
や、従来から用いている発振回路基板を使用することが
できることから、表面実装型発振器の設計工数を大幅に
削減できることで、低価格、小型で高周波帯域の発振周
波数を出力し、外部基板との接続部の平面平行度の良い
表面実装型圧電発振器を提供することができる。
As described above, in order to realize the surface mounting according to the present invention, it is possible to form the surface mounting type using an inexpensive epoxy substrate without using a special surface mounting terminal, or to use a conventional oscillator. Since the circuit board can be used, the design man-hours of the surface mount type oscillator can be greatly reduced. A surface-mount type piezoelectric oscillator can be provided.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の圧電発振器の斜視図である。FIG. 1 is a perspective view of a piezoelectric oscillator according to the present invention.

【図2】本発明の要部圧電発振器の側面図である。FIG. 2 is a side view of a main part piezoelectric oscillator of the present invention.

【図3】従来の圧電発振器の側面図である。FIG. 3 is a side view of a conventional piezoelectric oscillator.

【符号の説明】[Explanation of symbols]

1 導通端子 2 部品搭載基板 3 圧電振動子 4 発振回路部品 5 ベース 6 ザクリ穴 7 側面電極 DESCRIPTION OF SYMBOLS 1 Conduction terminal 2 Component mounting board 3 Piezoelectric vibrator 4 Oscillation circuit component 5 Base 6 Counterbore hole 7 Side electrode

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 片側に導通端子を配置する部品搭載基板
の両面に、密閉構造の圧電振動子と発振回路部品を搭載
し、該基板の該導通端子の延びる方向に、積層基板から
成るベースを配置し、該導通端子を該ベースの電極と接
続したことを特徴とする表面実装型圧電発振器。
A piezoelectric vibrator and an oscillation circuit component having a hermetically sealed structure are mounted on both sides of a component mounting board on which conductive terminals are arranged on one side, and a base made of a laminated substrate is mounted on the board in a direction in which the conductive terminals extend. A surface-mounted piezoelectric oscillator, wherein the piezoelectric element is disposed and the conductive terminal is connected to the electrode of the base.
【請求項2】 請求項1記載の該ベースの該接続端子位
置にはザクリ穴が形成され、該ベースの側面に延びる電
極と接続されていることを特徴とする表面実装型圧電発
振器。
2. A surface mount type piezoelectric oscillator according to claim 1, wherein a counterbored hole is formed at the connection terminal position of the base and connected to an electrode extending to a side surface of the base.
【請求項3】 請求項1記載の圧電発振器は、スルーホ
ールを持つ積層基板のベースを有し、該スルーホールを
該積層基板の中間層に向かってザクリ穴加工を施し、該
ザグリ穴加工面から見て該中間層のランドパターンを露
出した基板を用いたことを特徴とする表面実装型圧電発
振器。
3. The piezoelectric oscillator according to claim 1, further comprising a base of a laminated substrate having a through hole, wherein the through hole is subjected to a counterbored hole toward an intermediate layer of the laminated substrate, and the counterbored hole processed surface is formed. A surface-mounted piezoelectric oscillator using a substrate having an exposed land pattern of the intermediate layer as viewed from above.
JP05008699A 1999-02-26 1999-02-26 Surface mount type piezoelectric oscillator Expired - Fee Related JP4204023B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP05008699A JP4204023B2 (en) 1999-02-26 1999-02-26 Surface mount type piezoelectric oscillator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP05008699A JP4204023B2 (en) 1999-02-26 1999-02-26 Surface mount type piezoelectric oscillator

Publications (2)

Publication Number Publication Date
JP2000252748A true JP2000252748A (en) 2000-09-14
JP4204023B2 JP4204023B2 (en) 2009-01-07

Family

ID=12849233

Family Applications (1)

Application Number Title Priority Date Filing Date
JP05008699A Expired - Fee Related JP4204023B2 (en) 1999-02-26 1999-02-26 Surface mount type piezoelectric oscillator

Country Status (1)

Country Link
JP (1) JP4204023B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003017940A (en) * 2001-06-29 2003-01-17 Toyo Commun Equip Co Ltd Surface mount highly stable piezoelectric oscillator
JP2010213255A (en) * 2009-02-10 2010-09-24 Nippon Dempa Kogyo Co Ltd Crystal oscillator with pedestal
US7847470B2 (en) 2006-09-28 2010-12-07 Nihon Dempa Kogyo Co., Ltd. Surface mounting piezoelectric oscillator

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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JP2010213255A (en) * 2009-02-10 2010-09-24 Nippon Dempa Kogyo Co Ltd Crystal oscillator with pedestal

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