JP2000252674A - Semiconductor heat radiator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simply and reliably prevent rotations of a plurality of sheets of heat radiating plate, without preventing surrounding air from being taken in. SOLUTION: In a semiconductor heat radiator, a sheet of heat radiating plate 2 is fixed to a printed wiring board 1, and a remaining heat radiating plate 3 is screwed and fixed at a point and to the heat radiation plate 2 at a fixing side together with a semiconductor 4 for use. A projection part 7 is provided in a specified heat radiating plate 3, and a cutout part 6 mating with the projection part 7 is provided in the remaining heat radiating plate 2, and the projection part 7 mates with the cutout part 6, so that relative rotation between a plurality of the heat radiating plates 2, 3 is prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor radiator used for a switching regulator power supply device and the like.

[0002]

2. Description of the Related Art Conventionally, as a semiconductor heat radiating device having a structure in which two or more heat radiating plates of this kind are combined, for example, there is one shown in FIG.

FIG. 3A is a plan view, and FIG. 3B is a front view. A heat sink 102 having both ends bent is fixed on a printed wiring board 101, and a semiconductor 103 is provided at the center of the heat sink 102. The other heat sink 105 is fixed at one point by one screw 104.

[0004]

However, in a heat radiating device for a semiconductor in which such two heat radiating plates 102 and 105 are fixed with a single screw for fixing the semiconductor, the heat radiating plates 102 and 105 are not fixed. When force is applied from the outside in the direction of rotation,
There is a problem that the heat radiating plate 105 supported by the screw 104 rotates with respect to the fixed-side heat radiating plate 102, so that the screw 104 is loosened and the heat radiation efficiency of the semiconductor 103 is reduced.

Further, the rotation of the heat radiating plate 105 with respect to the heat radiating plate 102 causes a problem of an increase in external dimensions.
Further, there is a problem that the heat radiation efficiency is reduced due to the fact that the heat radiation plate 105 screwed to the heat radiation plate 102 fixed to the printed wiring board 101 is no longer in an optimal positional relationship with a gap formed in the periphery.

A heat sink 1 fixed by screws 104 to a heat sink 102 fixed to such a printed wiring board 101
If only measures to prevent the rotation of the fuel cell 05 are provided, the rotation preventing protrusions 106 may be provided on the heat sink 105 as shown in FIG. However, the rotation preventing projections 106
Is provided, the rotation-preventing projection 106 is located in the gap between the printed wiring board 101 and suppresses the flow of air, and there is a problem that the heat radiation efficiency of the semiconductor 103 is reduced.
Further, there is a problem that even a short component cannot be mounted on the printed wiring board 101 near the rotation preventing protrusion 106.

SUMMARY OF THE INVENTION In order to solve the above-mentioned conventional problems, the present invention provides a heat radiating device for a semiconductor in which rotation of a plurality of heat radiating plates can be easily and reliably prevented without obstructing intake of ambient air. With the goal.

[0008]

In order to achieve this object, the present invention is configured as follows. In the present invention, two or more heat sinks for semiconductors are combined, one heat sink is fixed on the printed wiring board, and the remaining heat sink is fixed to the fixed heat sink together with the semiconductor at one point with screws. The target is a semiconductor heat dissipation device to be used.

According to the present invention, as a heat radiating device for a semiconductor, a specific heat radiating plate is provided with a projection, and a notch is formed on the remaining heat radiating plate so as to mesh with the projection. It is characterized by preventing rotation.

As described above, in the heat radiating device for a semiconductor according to the present invention, the notches are provided in the remaining heat radiating plates with respect to the projections of the heat radiating plate on the fixed side, so that the rotation of both radiators after the mounting is prevented. However, even if a structure for preventing rotation is provided, intake of surrounding air is not hindered, and heat can be efficiently dissipated.

[0011]

FIG. 1 shows an embodiment of a heat radiating device for a semiconductor according to the present invention. FIG.
FIG. 1B shows a front view, and FIG. 1C shows a side view.

The heat radiating device for semiconductor shown in FIG. 1 combines two heat radiating plates 2 and 3. Among them, the heat radiating plate 2 is fixed to the printed wiring board 1 in order to maintain the strength.
In order to allow air to flow between the heat sink 2 and the heat sink 3, and to allow air to be easily taken in around the heat sink 3. Floating from the printed wiring board 1.

To mount the heat radiating plate 3 floating around the heat radiating plate 2 fixed to the printed wiring board 1 side, the semiconductor 4 is arranged outside the heat radiating plate 2, and the screws 5 are connected to the semiconductor 4 and the heat radiating plate 2 from here. The heat radiating plate 3 is attached to the heat radiating plate 3 on the fixed side at one point by screws 5.

In order to prevent the radiator plate 3 from being rotated by fixing the radiator plate 3 to the radiator plate 2 at one point with respect to the radiator plate 2 by such screws 5, in this embodiment, FIG. As is clear from the side view of the heat radiating plate 3 shown in FIG. 3C, a cutout 6 is formed on the tip side surface of the bent portion on the right side of the heat radiating plate 3. The projection 7 is formed.

Therefore, when the heat sink 3 is screwed to the heat sink 2 together with the semiconductor 4 at one point with the screws 5, the projections 7 of the heat sink 3 are engaged with the cutouts 6 of the heat sink 2, thereby forming the screws. 5, the rotation of the heat sink 3 fixed at one point with respect to the heat sink 2 on the fixed side is suppressed.

Since the protrusion 7 provided on the heat sink 3 for preventing rotation is not so large, the periphery of the heat sink 2 has a sufficient clearance with the printed wiring board 1 and the heat sink 2 side. Even if a structure for preventing rotation by the projection 7 and the notch 6 is provided, it does not obstruct the intake of air around the heat sink 2 and the heat sink 3.

FIG. 2 shows another embodiment of the heat radiating device for a semiconductor according to the present invention. In this embodiment, the heat radiating plate 2 fixed to the printed wiring board 1 is opposite to the embodiment of FIG. A protrusion 9 is provided on the side of the printed circuit board 1, and a cutout 8 is provided on the side of the heat radiating plate 3 provided so as to float from the printed wiring board 1.

Also in this case, the notch 8 and the projection 9 are provided on the heat sink 3 which is supported in a floating state with respect to the printed wiring board 1 which is fixed at one point to the fixed heat sink 2 by screws 5.
The rotation of the radiator plate 3 with respect to the fixed-side radiator plate 2 can be suppressed.

Note that the present invention is not limited to the above embodiment, and the heat sink 3 is fixedly provided on the printed wiring board 1 and the heat sink 2 is provided.
The side may be made to float from the printed wiring board 1.

In the above embodiment, one of the two heat sinks is fixed and the other is rotated. However, the present invention can be applied to a structure in which both are rotated.

Further, in the above-described embodiment, an example is given in which one of the two radiating plates is provided with a protruding portion and the other is provided with a cutout portion which engages with the protruding portion. May be provided with a notch and a projection.

Further, in the above-described embodiment, the heat radiating device for a semiconductor in which two heat radiating plates are combined is taken as an example, but a structure in which a plurality of heat radiating plates such as three or four heat radiating plates are combined. Of course, it is possible.

[0023]

As described above, according to the present invention, two or more heat sinks for semiconductors are combined, one heat sink is fixed on the printed wiring board, and the other heat sink is fixed to the fixed side. For a heat dissipation device for semiconductors that is fixed to the board with screws at one point together with the semiconductor, a projection is provided on a specific heat dissipation plate,
The remaining radiator plate is provided with a notch that meshes with the protrusion, and the relative rotation between the plurality of radiator plates is prevented by the engagement of the protrusion and the notch. Even if a structure for preventing rotation and preventing rotation is provided, it is possible to efficiently radiate heat without obstructing the intake of surrounding air.

[Brief description of the drawings]

FIG. 1 is a plan view, a front view, and a side view of an embodiment of the present invention.

FIG. 2 is a plan view, a front view, and a side view of another embodiment of the present invention.

FIG. 3 is a plan view and a front view of a conventional example.

FIG. 4 is a plan view and a front view of a conventional example provided with a rotation prevention special note.

[Explanation of symbols]

 1: printed wiring board 2: radiator plate (fixed side) 3: radiator plate 4: semiconductor 5: screw 6, 8: notch 7, 9: protrusion

Claims (1)

[Claims] 1. A combination of two or more heat sinks for a semiconductor,
In a heat radiating device for a semiconductor in which one heat radiating plate is fixed on a printed wiring board and the remaining heat radiating plate is fixed to the fixed side heat radiating plate together with the semiconductor at one point with screws, a specific heat radiating plate is used. A heat radiation device for semiconductors, wherein a protrusion is provided on the other heat radiation plate, and a notch is provided on the remaining heat radiation plate to engage with the protrusion, and relative rotation between the plurality of heat radiation plates is prevented by the engagement of the protrusion and the notch.