JP2000252620A - Soldering equipment, solder withdrawing equipment, removal of oxide, and oxide separation agent - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the contamination of a soldering equipment by oxidation preventive heat-resisting oil, etc., by making a separation agent for separating the solder and an oxide from each other from either one selected among sodium chloride, a mixture of salt and sesame, rice hulls, and a carbide, or a combination of these. SOLUTION: The wave-formed surface 6 of solder is formed by molten solder reflux by a solder jet equipment. A printed wiring board 30 carried in from the direction shown by an arrow is soldered as specified by the wave-formed surface of solder. An oxide 7 floating on the molten solder is collected by a net basket 9 and then about half of the net basket is raised. Next, a sieve container 10 is waved to dissseminate a separation agent 8 stored in the container 10 on the surface of the oxide 7. Thereafter, the net basket 9 is moved up and down or right and left to move the oxide 7 above or below the surface of the molten solder. The separation agent 8 is either one selected among sodium chloride, a mixture of salt and sesame, rice hulls, and a carbide, or a combination of these.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic soldering apparatus for a printed wiring board, a solder recovery apparatus, a method for removing a solder oxide, and an oxide separating agent. The present invention relates to a solder recovery device that separates and recovers solder and oxide, a method of removing oxide, and an oxide separator.

[0002]

2. Description of the Related Art When soldering electronic components to a printed wiring board, a large amount of solder oxide is generated in a dip type soldering apparatus or a flow type soldering apparatus used for soldering. Further, when the oxide is scooped up from the molten solder or discharged out of the solder bath and solidified, a large amount of solder adheres to the oxide.

[0003] The oxide to which the solder is attached is sold to a recycling company at a low price. To prevent solder oxidation, antioxidants such as heat-resistant mineral oil are added to the surface of the molten solder, or an inert gas such as nitrogen is sealed around the solder bath to reduce the oxygen concentration, Was kept to a minimum.

Further, as a separating agent / reducing agent for a solder oxide which separates the solder from the oxide to which the solder is attached and allows only the oxide to be taken out, a powder obtained by adding a potassium salt to ammonium borate is commercially available. . (Product name / Clinox OR-904P / Sold by Electro-Bert Seitec Co., Ltd.) As a jet solder bath having means for allowing oxide to flow out of the solder bath together with heat-resistant oils and fats, see, for example, JP-A-5-63349. Publications and the like have been proposed.

[0005]

However, according to the above-mentioned conventional method of selling to a reclaimer, a large amount of expensive solder adheres to the oxide and the solder loss is large. In the method of adding an antioxidant to the surface of the molten solder, the solder bath becomes sticky and dirty with an antioxidant oil or the like, and the solder bath adheres to a printed wiring board or the like. Japanese Patent Application Laid-Open No. Hei 5-63349 also has a problem in that heat-resistant fats and oils accumulate in the solder pool portion and clogging of the solder duct occurs.

[0006] The method using an inert gas increases the cost and the equipment is large and complicated. The cost of a powdery separating agent containing ammonium borohydrochloride as the main component is about 6,0.
It is expensive at about 00 yen / 450 grams and requires safety management such as care must be taken not to touch the skin and safety glasses must be worn during handling.

SUMMARY OF THE INVENTION The present invention provides a method for removing an oxide, which is capable of preventing a soldering apparatus from being contaminated with a heat-resistant oil or the like for preventing oxidation, being safe, non-polluting, and easily removing an oxide floating on a molten solder. It is intended to provide an attaching device and a solder collecting device. It is another object of the present invention to provide a separating agent capable of easily separating and removing only the oxide when the oxide to which the solder is attached is immersed in the molten solder, and a solder recovery device using the separating agent.

[0008]

In order to solve the above-mentioned problems, a soldering apparatus according to the present invention separates solder and oxide from solder corrugated surface forming means for melting solder to form a solder corrugated surface. Separating agent spraying means for spraying the separating agent to the oxide, wherein the separating agent is sodium chloride Nac
l, a composition comprising one selected from a mixture of salt and sesame, chaff, and carbide, or a combination thereof. The carbonized material was one of carbonized rice husk and activated carbonized rice hull, or a combination thereof. A separating agent or the like was prepared by mixing the salt and sesame in a weight ratio of 100: 20 to 100: 5. Incorporation of sesame into the salt increases the duration of the separation action.

Further, the method for separating oxide from the molten solder includes a step of scooping an oxide floating on the molten solder (about 280 ° C. to 290 ° C.) in a container, and a step of removing any one of the above separating agents (for example, A step of spraying rice husk) or a combination thereof on the oxide, a step of pulling up the container from the solder bath and separating solder and oxide, and means for discharging the separated oxide (oxide slag). Configuration.

Further, another method for separating oxides is as follows:
A step of spraying any one of the above-mentioned separating agents (for example, carbonized rice hulls) or a combination thereof on an oxide floating in the molten solder; a step of scooping the solder oxide floating in the molten solder in a container; From the solder bath to separate the solder and the oxide, and a step of discharging the separated oxide.

Further, a container for scooping up the oxide floating on the molten solder is prepared by setting the opening area of the mesh to 1 to 10 mm ↑ 2.
Degree, desirably a net basket of about 1-2.25 mm ↑ 2,
Alternatively, punching metal is formed by pressing so as to have a plurality of openings of about 1 to 2.25 mm ↑ 2 on the bottom surface and each side surface. The opening area of the mesh or punched metal in the range of 1 to 10 mm１０2 is set so that the solder separated from the oxide is smoothly returned to the solder melting tank and the slag (oxide) remains in the container. Was determined by experiment. Further, the constituent members of the net basket and the punching metal were made of a material such as stainless steel to which solder does not adhere. The mesh basket has a wire diameter of 0.3 to 0.7 mm and a side of a rectangular opening of 1.0 to 3 mm.
Degree. Preferably, the wire diameter of the mesh is about 0.5 mm, and one side of the rectangular opening is about 1.2 mm.

The mechanism by which each of the separating agents separates the oxide to which the solder adheres or the oxide in contact with (floats) the molten solder into the solder and the oxide is as follows. That is,
Oil component of the separating agent (organic acid R. (C
It is considered that the OOH) n component (ie, oleic acid, linoleic acid, palmitic acid, etc.) exerts a reducing action on the metal oxide. For example, SnO ↓ 2 + 4RCOOH →
[RCOO] ↓ 4Sn + 2H ↓ 2O It is also considered that phosphorus (P) contained in the separating agent and the oils and fats serve to prevent the oxidation of the solder. Sesame fatty acids are rich in oleic and linoleic acids. Further, fibers constituting the separating agent,
It is thought that carbohydrates and the like bind to the oxide (dross) and hinder the bonding with the molten solder. It is considered that the component heated to the molten solder and turned into carbon C or the carbide such as rice hull reacts with SnO ↓ 2 + C → Sn + CO ↓ 2. (It acts as a reducing agent.) Further, when sodium (Na) is contained in the separating agent, Na also acts as a reducing agent.

The sodium chloride Nacl is brought into a molten state when it comes into contact with or heated by the molten solder, and sodium ions Na
It is ionized into ↑ + and chloride ion ↑-. The ionized sodium ions combine with oxygen of the oxide to perform a reducing action.

Rice husk has an oil and fat content, and the organic acid R. (COO)
H) The n component reduces the metal oxide.

The carbonized rice hulls may be carbonized by smoking rice husks by a general method. The firing point of the rice husk is 400 ° C., and it may be heated (smoked) and carbonized at a temperature lower than the firing point with a small supply of oxygen. The composition of carbonized rice husk is about 30 carbon
%, Silicate (Si content about 20-30%), trace amounts of potassium, calcium, magnesium, aluminum,
Contains iron, manganese, etc.

Activated carbonized rice hulls are obtained by adding an inorganic acid (hydrochloric acid,
Sulfuric acid, acetic acid, phosphoric acid, HF) and / or an aqueous alkali solution (NaOH, KOH, etc.) are added, heated, filtered, and dried to greatly increase the surface area and the accompanying adsorption capacity. Activated carbonized husk has a carbon content of about 70-90%
And the silicate decreases accordingly. The carbonized rice hulls and activated carbonized rice hulls combine with oxygen to perform a reducing action.

Sesame seeds are generally attached with seed coats and are effective as a separating agent. However, peeled sesame, roasted sesame, and powdered sesame are more effective. In peeled sesame, roasted sesame, and powdered sesame, the oil component exudes from the beginning to the surface of sesame, and the reaction with the solder oxide occurs instantaneously. In the case of peeled sesame, it takes about 10 seconds to cause a separating action.

The particle size distribution of each of the powdery or granular separating agents does not need to be particularly adjusted. The particle size distribution of the powder was in the range of about 1 mm to about 0.01 μm. The separating agent in the present invention may be composed of one type, and may be a combination of two or more types of members.

According to the present invention, there is provided a separating agent for separating a solder and an oxide, which is safe and inexpensive, has no harm to the human body, and has no pollution, and a soldering apparatus using the separating agent.
And a separation method. Further, the work of separating the oxide can be easily automated, and the amount of solder that adheres to the oxide and is discarded can be reduced. In addition, the utilization rate and the recovery rate of the solder are improved, which contributes to global environmental protection.

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A first aspect of the present invention is a solder corrugated surface forming means for melting a solder to form a corrugated solder surface, and a separating method for spraying a separating agent for separating the solder and the oxide on the oxide. Soldering means, wherein said separating agent is made of any one selected from sodium chloride Nacl, a mixture of salt and sesame, rice hull, carbide, or a combination thereof. Since it is a device, it is harmless and does not cause pollution, and the solder and oxide can be separated very easily. In addition, the utilization rate and recovery rate of the solder are improved, which contributes to global environmental protection.

Further, a second invention is a soldering apparatus according to the first invention, wherein the carbide is one of carbonized rice hull and activated carbonized rice hull, or a combination thereof. The solder and oxide can be separated at very low cost. Also, effective use of waste can be achieved.

Further, a third aspect of the present invention is the soldering apparatus according to the first aspect, further comprising an oxide scooping means, wherein the removal of the oxide can be automated,
The soldering work of the printed wiring board can be performed continuously.

Further, a fourth invention is characterized in that a discharging means for discharging the scooped oxide from the container is provided.
According to the soldering apparatus of the invention, the removal of oxides can be automated, and the soldering operation of the printed wiring board can be performed continuously.

Further, a fifth aspect of the present invention is directed to a step of scooping the oxide floating in the molten solder in a container, and any one of the separating agents described in the first or second aspect of the present invention. Spraying one or a combination thereof,
A method for separating a solder oxide, comprising: a step of pulling up the container from a solder bath and separating solder and oxide; and means for discharging the separated oxide (oxide slag). In addition, the removal of oxides can be automated, and the soldering operation of the printed wiring board can be performed continuously. Also, the amount of solder that adheres to the oxide and is discarded is reduced.
In addition, the utilization rate and recovery rate of the solder are improved, which contributes to global environmental protection.

According to a sixth aspect of the present invention, any one or a combination of the separating agents described in any one of the first and second aspects of the invention is sprayed on the oxide floating on the molten solder. A step of scooping the oxide floating in the molten solder into a container, a step of lifting the container from a solder bath and separating the solder and the oxide, and a means for discharging the separated oxide (oxide slag) And a method for separating solder and oxide, characterized in that the removal of oxide can be automated and the soldering work of the printed wiring board can be performed continuously. Also, the amount of solder that adheres to the oxide and is discarded is reduced. Also, the solder utilization rate,
Recovery rate etc. is improved and it is useful for global environment conservation.

Further, a seventh invention is the soldering apparatus according to the first invention, further comprising an oxide scraping means for scraping the oxide separated from the molten solder out of the solder bath. It is harmless, does not cause pollution, and can very easily separate solder and oxide. In addition, the utilization rate and recovery rate of the solder are improved, which contributes to global environmental protection.

Further, an eighth invention is the soldering apparatus according to the first invention, further comprising an oxide flushing means for flushing the oxide separated from the molten solder with an inert gas. The solder and the oxide can be easily separated. In addition, the utilization rate and recovery rate of the solder are improved, which contributes to global environmental protection. Separates solder and oxide easily and efficiently.

[0028]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A soldering apparatus and an oxide removing method according to one embodiment of the present invention will be described below with reference to the drawings.

(Embodiment) FIG. 1 is a sectional view showing a principal part of a concept of a soldering apparatus according to an embodiment of the present invention. FIG. 2 is a sectional view showing a main part of a method for separating and removing oxides according to one embodiment of the present invention. FIG. 3 is a perspective view of a main part of a solder jet device constituting the soldering device of the present invention.

In FIG. 1, reference numeral 1 denotes a solder jet nozzle,
2 is a front rectifying plate, 3 is a rear rectifying plate, 4 is a perforated plate, 5 is a solder bath, 6 is a solder corrugated surface of molten solder, 7 is an oxide (oxidized slag), and 8 is a separating agent (for example, sodium chloride). Reference numeral 9 denotes a container (for example, a net basket), 10 denotes a sieve container for containing and spraying a separating agent, 11 denotes a partition plate, 20 denotes a soldering device, and 30 denotes a printed wiring board. 3, reference numeral 12 denotes a through hole, 13 denotes a discharge pump, 14 denotes a shaft, 15 denotes a molten solder duct, 16 denotes an opening, and 21 denotes a solder jet device.

In FIG. 1 and FIG. 3, the solder corrugated surface 6 is formed of molten solder which is recirculated by the solder jet device 21 and solders the printed wiring board 30 which has proceeded in the direction of the arrow.

The solder jet device 21 is of course installed in the solder bath. In the solder jet device 21, the discharge pump 13 sucks in the molten solder from the opening 16 and jets out from the solder jet nozzle 1 through the duct 15,
The front rectifying plate 2 and the rear rectifying plate 3 form a desired solder corrugated surface. Perforated plate 4 arranged in the middle of solder jet nozzle 1
Is formed by piercing a plurality of through-holes at a predetermined pitch in a multi-row and multi-column manner to remove foreign matters, metal lumps, lead wires and the like mixed in the molten solder. That is, it functions as a filter.

The molten solder flowing down the rear rectifying plate 3 is recirculated by the discharge pump 13, but generates a large amount of oxide when it comes into contact with air. The oxide moves on the surface of the molten solder toward the partition plate 11 in FIG. 1 and accumulates.

An oxide container 9 is provided in the molten solder near the partition plate 11. The container 9 was formed of a mesh-like net cage, and the wire diameter of the net was about 0.5 mm, and one side of the rectangular opening was about 1.2 mm. The container 9 is configured to rise from the position (A) in the solder bath 5, stop at the position (B), or be reversible to the state (C). further,
It can be stopped at any position such as the position shown in FIG. The means for driving the container 9 may be performed by using a general mechanism such as a fluid cylinder and a pulse motor. (Not shown) Further, a sieve container 10 is arranged outside the solder bath 5 and above the container 9. A structure in which a powdery separating agent such as sodium chloride is stored in the sieve container 10, and sodium chloride is sprayed on the oxide accumulated near the partition plate 11 by shaking or vibration from the lower mesh portion. did. The swinging or vibrating means can be implemented using any general means such as an electromagnetic vibrator, an eccentric cam, a motor and a link mechanism. On the right side of the partition plate 11, a space for accumulating and storing oxides (oxidized slag) is provided. (It goes without saying that a dedicated container may be arranged.) Next, a procedure for removing the solder oxide floating on the molten solder by using the soldering apparatus having the above-described configuration will be described.

(Removal Method 1) In the first step, the oxide 7 floating on the molten solder is scooped and collected by a net basket (container 9), and the net basket is pulled up to about half. In the second step, the sieve container 10 is vibrated, and the stored separating agent 8 such as powdered sodium chloride is sprayed on the surface of the oxide 7 (sprinkling). ). The spraying amount may be such that the surface of the oxide 7 is almost covered. For example, volume 1 of oxide 7
The spraying amount of the separating agent was set at about 1 tsp to about 1 cc with respect to 00 cc.

In the third step, the net 7 is moved up and down or left and right to raise and lower the oxide 7 from the solder melting surface. This operation is repeated several times. In the fourth step, it is confirmed that the volume of the solder oxide has been reduced and the solder attached to the oxide has been separated, and the net basket is pulled up from the molten solder surface. (Position (B) in FIG. 1) In the fifth step, the net basket is inverted and the slag is discarded in a waste container or the like. (Position (C) in FIG. 1) In the above steps 1 to 5, the operation of removing the oxides floating and accumulated on the molten solder is completed. During this time, the work time was about 1 minute.

It is needless to say that the first to fifth steps may be arbitrarily changed, added or deleted. For example, (removal method 2), the second step is replaced, and first, a process of spraying the powdery separating agent 8 on the solder oxide 7 floating on the molten solder is prioritized. Thereafter, a step of scooping the solder oxide floating in the molten solder into the container, a step of pulling up the container from the solder bath and separating the molten solder and the oxide, a step of inverting the net basket and removing the oxide slag into a waste container, etc. May be sequentially performed.
(Not shown.) (Removal method 3) In another removal method, in the first step, oxide (solder dross) 7 floating on the molten solder is scooped and collected by a net basket (container 9), and the net is removed. The cage is pulled up to a predetermined position above the molten solder. (Position (B) in FIG. 1) Note that solder is attached to the oxide in this case. In the second step, the sieve container 10 is vibrated, and the contained separating agent 8 such as sodium chloride is sprayed (sprinkled) on the surface of the oxide 7. The spraying amount may be such that the surface of the oxide 7 is almost covered. For example, the volume of oxide 7 is 100
The amount of the separating agent to be sprayed per cc was set at about 1 to 1 teaspoon.

In the third step, the net basket is lowered and immersed about half in molten solder. (Position (D) in FIG. 2) Thereafter, the mesh basket is moved up and down or left and right to raise and lower the oxide 7 above and below the molten solder surface. This operation is repeated several times. In the fourth step, it is confirmed that the volume of the solder oxide has been reduced and the solder attached to the oxide has been separated, and the net basket is pulled up from the molten solder surface. (Position (B) in FIG. 1) In the fifth step, the net basket is inverted and the slag is discarded in a waste container or the like. (Position (C) in FIG. 1) In the above-described removal methods 1, 2, and 3, an example in which a net cage is used as a storage container for the oxide 7 has been described. It goes without saying that the member may be used. For example, the container may be formed of a punching metal having a plurality of circular or rectangular openings.
As an example, an opening area of 1 on the bottom surface and each side surface of the storage container.
The configuration is such that rectangular openings of mm ↑ 2 to 2.25 mm ↑ 2 are arranged in a multi-row and multi-column (matrix form) having an arrangement pitch of about 1.5 mm to 2 mm. In addition, although an example using sodium chloride as the separating agent has been described, it goes without saying that the same effect can be obtained with other separating agents (mixture of salt and sesame, chaff, and charcoal).

Further, in a flow (jet) type soldering apparatus, a plurality of solder jet nozzles may be provided at, for example, two positions. Further, instead of scooping up the separated oxide (oxidized slag) with a container such as a net basket, a scrap made of a heat-resistant squeegee, for example, a plate made of stainless steel or the like may be used. Of course,
The oxide may be flushed from the molten solder surface to the waste container using an inert gas. Further, a timer may be set and controlled so that the oxide removing operation is automatically performed periodically, for example, every two hours.
(Either is not shown.) Further, a means for dispersing the powdery separating agent may have an arbitrary configuration other than the above. For example, as shown in FIG. 4, a cascade (gutter) and a hopper containing a separating agent are electromagnetically vibrated. As shown in FIG. 5, a configuration in which a slide plate having a through-hole disposed in a lower portion of a hopper storing a separating agent is disposed. As shown in FIG. 6, a configuration may be employed in which a rotor having a plurality of cutouts is disposed below a hopper storing a separating agent.

Further, the above-mentioned soldering device may be used not only as a device for soldering various electronic components mounted on a printed wiring board but also as a solder collecting device for collecting solder from oxides to which solder is attached. Needless to say. In this case, the method of recovering the solder involves immersing the oxide to which the solder has adhered in the molten solder, and separating and discharging only the oxide by utilizing the reducing action and the antioxidant action of the separating agent.

As a method for collecting the solder, for example, a step of charging the oxide with the solder attached to a container having a plurality of openings on the bottom surface and side surfaces, and a method of collecting the oxide with the solder attached thereto A step of dipping the molten solder in the molten solder, a step of spraying a separating agent on the oxide to which the solder is attached, and a step of pulling up the container from the molten solder, wherein the separating agent is sodium chloride Nacl, a mixture of salt and sesame. , Rice hulls, and carbides, or any combination thereof. In the case where the carbide is made of one of carbonized rice hulls and activated carbonized rice hulls, or a combination thereof, flow solder (jet solder)
Alternatively, a static (dip) solder bath having a flat solder corrugated surface may be used.

[0042]

As described above, according to the present invention, the separation of oxides floating in the molten solder can be carried out easily, safely, harmless to humans, without pollution, at extremely low cost. Also,
The amount of solder that adheres to the oxide and is discarded is reduced. As a result, the use rate and the recovery rate of the solder are improved, which contributes to global environmental protection.

[Brief description of the drawings]

FIG. 1 is a sectional view of a principal part of a concept of a soldering apparatus according to an embodiment of the present invention.

FIG. 2 is a sectional view of a main part showing a method for removing oxides using the soldering apparatus of FIG. 1;

FIG. 3 is a perspective view of a main part of a solder jet device constituting the soldering device of FIG. 1;

FIG. 4 is a side sectional view of a main part of a separating agent spraying device constituting the soldering device of FIG. 1;

FIG. 5 is a side sectional view of a main part of a separating agent spraying device constituting the soldering device of FIG. 1;

FIG. 6 is a side cross-sectional view of a main part of a separating agent spraying device constituting the soldering device of FIG. 1;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Solder jet nozzle 2 Front rectifying plate 3 Rear rectifying plate 4 Perforated plate 5 Solder tank 6 Solder corrugated surface 7 Oxide (oxidized slag) 8 Separating agent (for example, sodium chloride) 9 Container (for example, net basket) 10 Sieve container 11 Partition plate 12 Through hole 13 Discharge pump 14 Shaft 15 Duct 16 Opening 20 Solder (soldering) device 21 Solder jet device 30 Printed wiring board

Claims (21)

[Claims] 1. A solder corrugated surface forming means for melting a solder to form a solder corrugated surface, and a separating agent dispersing means for dispersing a separating agent for separating the solder and the oxide onto the oxide, wherein the separating agent is provided. Sodium chloride Nacl, a mixture of salt and sesame,
A soldering device comprising one selected from rice hulls and carbides, or a combination thereof. 2. The soldering apparatus according to claim 1, wherein the carbide is one of carbonized rice hull and activated carbonized rice hull, or a combination thereof. 3. The soldering apparatus according to claim 1, further comprising an oxide scooping means for scooping an oxide floating on the molten solder. 4. The soldering apparatus according to claim 3, wherein the scooping means is a container, and further comprising discharging means for discharging the scooped oxide from the container. 5. The container has an opening area of 1 to 5 on the bottom and side surfaces.
5. The soldering apparatus according to claim 4, wherein a plurality of openings of 2.25 mm @ 2 are provided. 6. The soldering apparatus according to claim 5, wherein the container comprises a net basket. 7. A solder corrugated surface forming means for melting a solder to form a solder corrugated surface, a separating agent dispersing device for dispersing a separating agent for separating the solder and the oxide onto the oxide, and an oxide floating on the molten solder Oxide scraping means for scraping off, wherein the separating agent comprises one selected from sodium chloride Nacl, a mixture of salt and sesame, rice husk, charcoal, or a combination thereof. Soldering equipment. 8. A solder corrugated surface forming means for melting a solder to form a solder corrugated surface, a separating agent dispersing means for dispersing a separating agent for separating the solder and the oxide onto the oxide, and an oxide floating on the molten solder. And an oxide flushing means for flushing with an inert gas, wherein the separating agent comprises any one selected from sodium chloride Nacl, a mixture of salt and sesame, chaff, and carbide, or a combination thereof. And soldering equipment. 9. A step of scooping oxides floating on the molten solder in a container, a mixture of sodium chloride Nacl, a salt and sesame,
Rice husk, a step of spraying a separating agent consisting of any one selected from carbides, or a combination thereof, on the oxide, a step of pulling up the container from a solder bath and separating the oxide from molten solder, Removing the oxide by inverting the container. 10. The method for removing oxides according to claim 9, wherein the carbide is one of carbonized rice husk and activated carbonized rice hull, or a combination thereof. 11. The method according to claim 9, further comprising a step of raising and lowering the container from the solder bath and moving the container up and down a plurality of times after spraying the separating agent. Method of removing oxides. 12. A step of spraying a separating agent consisting of any one selected from sodium chloride Nacl, a mixture of salt and sesame, rice husk, and carbide, or a combination thereof, on an oxide floating in the molten solder; A step of scooping the oxide floating in the molten solder into the container, a step of lifting the container from the solder bath and separating the oxide from the molten solder, and a step of inverting the container and discharging the oxide A method for removing a solder oxide, comprising: 13. The method for removing an oxide according to claim 9, wherein the separating agent is sprayed so as to cover almost the surface of the oxide. 14. A solder heating means for heating and melting the solder, and a separating agent spraying means for spraying a separating agent for separating the solder and the oxide onto the oxide, wherein the separating agent comprises sodium chloride, Nacl, and a salt. A solder recovery device comprising a mixture of sesame, rice husk, and carbide, or a combination thereof. 15. The solder recovery apparatus according to claim 14, wherein the carbide is one of carbonized rice hulls and activated carbonized rice hulls, or a combination thereof. 16. The solder collecting apparatus according to claim 15, further comprising an oxide scooping means for scooping the oxide floating on the molten solder. 17. A solder heating means for heating and melting the solder, a separating agent spraying means for spraying a separating agent for separating the solder and the oxide onto the oxide, and an oxide scraper for scraping the oxide floating on the molten solder. And a separating means comprising sodium chloride, sodium chloride, a mixture of salt and sesame, rice husk, and carbide, or a combination thereof. 18. A solder heating means for heating and melting the solder, a separating agent spraying means for spraying a separating agent for separating the solder and the oxide on the oxide, and an oxide gas flowing in the molten solder is flushed with an inert gas. Oxide flushing means,
The solder collecting device, wherein the separating agent is selected from sodium chloride Nacl, a mixture of salt and sesame, rice husk, and carbide, or a combination thereof. 19. The method according to claim 19, wherein the separating agent for separating the solder and the oxide is any one selected from sodium chloride Nacl, a mixture of salt and sesame, rice hull, and carbide, or a combination thereof. Separating agent for oxide to which solder is attached or oxide in contact with molten solder. 20. The oxide separating agent according to claim 19, wherein the carbide is any one of carbonized rice husk and activated carbonized rice hull, or a combination thereof. 21. An oxide to which solder is attached, wherein the separating agent for separating the solder and the oxide is any one of peeled sesame, roasted sesame, and powdered sesame or a combination thereof. Or an oxide separating agent in contact with molten solder.