JP2000251730A - Sealing method for vacuum-tight container - Google Patents

Abstract

PROBLEM TO BE SOLVED: To seal uniformly and surely the required part of a vacuum-tight container by anode bonding without generating a faulty joint. SOLUTION: This sealing method for a vacuum-tight container 1 is to seal a vacuum gas exhausting hole 4 of the vacuum-tight container 1 in which a substrate glass and an image displaying plate glass are sealed via a frame glass, a metal ring 3 is anode bonded to the periphery of the vacuum gas exhausting hole 4, an exhaust pipe 7 is bonded to the surface of the vacuum- tight container 1 at the periphery of the metal ring 3, and the vacuum-tight container 1 is evacuated, and/or gas is introduced into the vacuum-tight container 1, and a sealing lid 2 covering the vacuum gas exhausting hole 4 is anode bonded on the metal ring 3, so that the exhaust pipe 7 is removed from the vacuum-tight container 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for sealing a vacuum-tight container, and more particularly to a method for sealing a vacuum-tight container in which a substrate glass and an image display plate glass are sealed via a frame glass. A method for sealing a vacuum-tight container to be sealed,
The present invention relates to a method for sealing a vacuum hermetic container in which a sealing lid glass is anodically bonded around a vacuum exhaust hole via a metal ring.

[0002]

2. Description of the Related Art Conventionally, a method of manufacturing a vacuum hermetic container for a flat display panel by anodic bonding is disclosed in, for example, Japanese Patent Application Laid-Open No. Hei 7-112299.

According to this publication, as shown in FIG.
The cathode substrate 100 and the front substrate 102 are anodically bonded via the side substrate 101 to produce a vacuum-tight container.

Specifically, as shown in FIG. 11, the cathode substrate 100 and the side substrate 100 are sealed with a fleet seal portion. Further, the bonding electrode 110 and the thin film glass 111 are formed on the side substrate 101 in a laminated manner. On the other hand, the bonding electrode 112 is formed on the front substrate 102. Then, the side substrate 101 and the front substrate 102 are brought into close contact with each other, and while heating at a relatively low temperature, a voltage of several tens to several thousand volts is applied between the two bonding electrodes 110 and 112 to apply the thin film glass 111 to the front surface. The bonding electrode 112 on the substrate is anodically bonded.

[0005]

However, in the above-mentioned prior art, the side substrate 101 and the front substrate 102 are not provided.
It is difficult to make the surface contact completely. Accordingly, there has been a problem that a bonding failure occurs according to the non-uniform surface contact and a vacuum leak occurs.

Accordingly, an object of the present invention is to uniformly and reliably seal required portions of a vacuum hermetic container by anodic bonding without causing defective bonding.

[0007]

SUMMARY OF THE INVENTION The present invention for solving the above-mentioned problems comprises a substrate glass and an image display plate glass.
A method for sealing a vacuum airtight container that seals a vacuum exhaust hole of a vacuum airtight container sealed via a frame glass, wherein a metal ring is anodic-bonded around the vacuum exhaust hole, and a metal ring is provided around the metal ring. Joining an exhaust pipe to the surface of the vacuum-tight container of
The vacuum hermetic container is evacuated and / or gas is introduced into the vacuum hermetic container, and a sealing lid glass covering the vacuum evacuation hole is anodically bonded on the metal ring, and the exhaust pipe is vacuum hermetically sealed. Remove from container.

Further, the present invention provides a method in which a substrate glass on which an electron-emitting device is arranged and an image display substrate glass on which a phosphor which emits light by receiving electrons emitted from the electron-emitting device are arranged via a frame glass. An image display device using a vacuum-tight container hermetically sealed as an airtight envelope, comprising an anodically bonded vacuum sealing lid glass.

[0009]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows a sealed portion of the vacuum sealed container 1.
The exhaust hole 4 is for evacuating the vacuum-tight container 1, and is provided in the substrate glass and / or the image display plate glass. In particular, if provided at a plurality of locations, the exhaust speed can be improved.

Further, in the case of the vacuum sealed container 1 for a plasma display panel, after evacuating once to a predetermined degree of vacuum, introducing a gas such as Ar or Xe, or purging without performing evacuation. Is repeated until gas reaches a predetermined pressure.

FIG. 2 shows electrodes 13 and 14 for anodic bonding.
FIG. 7 is a cross-sectional view showing a step of aligning the gas and the exhaust hole 4.

The vacuum sealed container 1 is made of glass such as soda glass. Further, as a material of the metal ring 3, a metal plate of Al, Fe, Cu or the like, or an alloy plate of stainless steel or the like can be used. Incidentally, the vacuum-tight container 1 is an envelope of the image display device, and causes a problem that the brightness of the screen is reduced when a vacuum leak occurs from the sealing lid 2. Therefore, it is preferable that the metal ring 3 and the vacuum-tight container 1 have substantially equal thermal expansion coefficients. In this regard, when the material of the sealing lid 2 and the vacuum-tight container 1 is soda glass or the like,
A so-called nickel-chromium-iron 426 alloy (Ni42wt
%, Cr 6 wt% and the balance Fe) are particularly preferred.

The thickness of the metal ring 3 is about 0.2 mm, the outer diameter is about 16 mm, and the inner diameter is about 10 mm. Also, exhaust holes
The diameter of 4 is about 10 mm.

After the above alignment, as shown in FIG.
The electrode 13 is pressed against the metal ring 3 and the electrode 14 is pressed against the side wall of the exhaust hole 4. Here, in order to maintain good contact with the wall surface of the exhaust hole 4, the material of the electrode 14 may be, for example, a disk made of a spring material such as phosphor bronze.

Then, a voltage is applied between the electrode 13 and the electrode 14, and the metal ring 3 and the vacuum-tight container 1 are anodically bonded. Here, a glass float surface is used as a joining surface of the vacuum airtight container 1. On the other hand, the surface roughness of the metal ring 3 is Rm
ax is preferably 1000 °, and Rmax is 200 °.
The following is more preferable.

The joining surface of the metal ring 3 is cleaned before joining. Here, the cleaning is performed in a cleaning solution containing a neutral detergent for 10 minutes.
After ultrasonic cleaning for about a minute, pure water cleaning for about 15 minutes,
Etching and cleaning were performed with a mixed solution of 1 part of hydrofluoric acid + 1 part of nitric acid + 40 parts of water for about 30 seconds, again with pure water for about 15 minutes, and finally with isopropyl alcohol (IPA) for about 10 minutes.

After the metal ring 3 is anodically bonded to the vacuum-tight container 1 in advance in this way, a sealing lid glass is further anodically bonded onto the metal ring 3.

For this purpose, first, as shown in FIG. 4, the position of the oxide pipe (low melting point glass frit) previously provided on the vacuum-tight container 1 and the exhaust pipe 7 are aligned.

Next, as shown in FIG. 5, an exhaust pipe 7 is joined to the vacuum airtight container. That is, the sealing lid 2 is attached to the sealing lid holding mechanism 9 inside the exhaust pipe 7, and the exhaust pipe 7 is melted with an oxide solder such as a frit by the first heating means 12, and the vacuum airtight container 1 and the exhaust pipe 7 and join. Then, a vacuum pump (not shown) is connected to the exhaust pipe 7, and the vacuum sealed container 1 is connected.
Is evacuated.

Next, as shown in FIG. 6, the sealing lid 2 is pressed against the metal ring 3. Here, the sealing lid holding mechanism 9 has a mechanism for holding the periphery of the sealing lid by mechanical chucking. What is necessary is just to be able to hold the sealing lid in a vacuum. By lowering the sealing lid 2 previously held by the sealing lid holding mechanism 9 toward the exhaust hole 4, the sealing lid 2 is placed over the exhaust hole 4 and pressed. The load at this time is preferably about 50 g to 500 g.

Then, the temperature of the vacuum-tight container 1 is raised from 150 ° C. to about 350 ° C., more preferably to about 250 ° C. by the second heating means 5. At the same time, the sealing lid 2 is also heated using a heating means attached to the sealing lid holding mechanism 9 to increase the temperature to the same temperature as the temperature of the vacuum-tight container 1.

Thereafter, a voltage of 200 V to 1000 V, for example, 500 V is applied to the electrode 10 disposed in the center of the sealing lid pressing mechanism and the electrode 11 for pressing the metal ring 3 for 20 minutes, and the metal ring 3 is sealed. Anodically bond with the lid 2. The time required for anodic bonding is determined according to the applied voltage.

After the completion of the anodic bonding, as shown in FIG. 7, the holding of the sealing lid holding mechanism 9 is released, and the sealing lid holding mechanism 9 is evacuated to the sky. Then, oxide solder such as frit is again melted by the first heating means 12 to separate the exhaust pipe 7 from the vacuum-tight container 1.

Although the embodiment of the present invention has been described above, the present invention is not limited to this, and a sealing lid 2 to which a metal ring 3 has been previously anodically bonded can be used.

That is, as shown in FIG. 8, the sealing lid 2 with the metal ring 3 is attached to the sealing lid holding mechanism 9. In this case, the anodic bonding electrode 10 presses the surface of the vacuum airtight container 1, and the plurality of anodic bonding electrodes 11 presses the surface of the metal ring 3. The method of anodically bonding the sealing lid 2 to the vacuum hermetic container 1 is as described above.

FIG. 9 shows a frame glass in which a substrate glass 70 on which electron-emitting devices 74 are arranged and an image display substrate glass 72 on which phosphors 75 which emit light by receiving electrons emitted from the electron-emitting devices 74 are arranged. It is a perspective view of the image display device which makes a vacuum airtight container sealed via 71 an airtight envelope.

As shown in FIG. 9, the arrangement of the electron-emitting devices 74 is formed on an electron source substrate 73, and the electron source substrate 73 is attached to a substrate glass 70. But,
The arrangement of the electron-emitting devices 74 may be formed on the substrate glass 70.

The electron-emitting device 74 emits electrons when selected by the Doxm X-direction wiring and the Doyn Y-direction wiring.

On the image display substrate glass 72, a phosphor 75 is provided.
Are arranged. Further, a metal back 76 is formed on the phosphor 75. The phosphor 75 is made of only a phosphor in the case of a black-and-white image, but in the case of displaying a color image, pixels are formed by phosphors of three primary colors of red, green and blue. The metal back 76 is made of Al
And the like. Metal back 76
Of the light generated from the phosphor, the light traveling toward the electron source substrate 73 is reflected to improve the brightness of the display image, and the gas remaining in the envelope is ionized by the electron beam and generated. It also serves to prevent the phosphor from being damaged by ion bombardment. Further, it provides conductivity to the image display area to prevent accumulation of electric charges, and serves as an anode electrode for the electron source substrate 73.

1 or 2 is attached to the substrate glass 70 and / or the image display substrate glass 72 of the image display device having such a structure.
After the above-described exhaust holes are provided and the inside of the vacuum airtight container is evacuated to a vacuum by the method described above, the sealing lid 2 and the exhaust holes 4 are covered and anodically bonded.

[0032]

According to the present invention described above, in a state where an exhaust pipe is joined around an exhaust hole of a vacuum-tight container, the sealing lid is anodically bonded to the exhaust hole while exhausting the vacuum-tight container. Therefore, the protrusion around the exhaust hole can be minimized, and the outer shape of the vacuum-tight container as a flat display panel can be literally flattened.

Further, according to the present invention, since the sealing lid having a small plate thickness at the center is anodically bonded to the vacuum-tight container, the exhaust hole can be reliably sealed.

[Brief description of the drawings]

FIG. 1 is a plan view and a sectional view around an exhaust hole of a vacuum-tight container.

FIG. 2 is a sectional view showing a step of installing a metal ring on a vacuum-tight container.

FIG. 3 is a sectional view showing a step of anodically bonding a metal ring to a vacuum-tight container.

FIG. 4 is a sectional view showing a step of installing an exhaust pipe on a vacuum-tight container.

FIG. 5 is a sectional view showing a step of joining an exhaust pipe to a vacuum-tight container.

FIG. 6 is a sectional view showing a step of joining a sealing lid onto a metal ring.

FIG. 7 is a cross-sectional view showing a step of detaching the exhaust pipe from the vacuum-tight container.

FIG. 8 is a conceptual diagram of a case where a sealing lid in which a metal ring is anodically bonded is anodically bonded to a vacuum airtight container.

FIG. 9 is a perspective view of a vacuum-tight container of an image display device including an electron-emitting device array and a phosphor array.

FIG. 10 is a sectional view showing a conventional method for sealing a vacuum-tight container.

FIG. 11 is an enlarged sectional view showing a conventional method for sealing a vacuum-tight container.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Vacuum-tight container 2 Sealing lid 3: Metal ring 4 Exhaust hole 5 Second heating means 6 Exhaust device stand 7 Exhaust pipe 9 Sealing lid holding mechanism 10, 11 Electrode 12 First heating means 13, 14 Electrode

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01J 31/12 H01J 31/12 CF term (Reference) 5C012 AA05 AA09 5C032 AA07 BB17 BB18 5C035 AA20 EE04 5C036 EF01 EF06 EF08 EG02 EG05 EH04 5C040 FA01 FA02 GA03 HA06 MA09 MA22 MA23

Claims (9)

[Claims] 1. A method for sealing a vacuum airtight container for sealing a substrate glass and an image display plate glass to a vacuum exhaust hole of a vacuum airtight container, wherein a metal ring is provided around the vacuum exhaust hole as an anode. Joining, joining an exhaust pipe to the surface of the vacuum hermetic container around the metal ring, evacuating the vacuum hermetic container, and / or introducing gas into the vacuum hermetic container; A method for sealing a vacuum-tight container, comprising: anodically bonding a sealing lid glass covering a vacuum exhaust hole; and detaching the exhaust pipe from the vacuum-tight container. 2. A substrate glass and an image display plate glass,
A method for sealing a vacuum-tight container that seals a vacuum exhaust hole of a vacuum-tight container sealed via a frame glass, wherein a metal ring is anodically bonded around the vacuum exhaust hole, and a periphery of the metal ring is provided. An exhaust pipe is joined to the surface of the vacuum-tight container to evacuate the vacuum-tight container, and / or introduce gas into the vacuum-tight container, and cover the metal ring with the vacuum exhaust hole. A method for sealing a vacuum airtight container, comprising: anodically bonding a cover glass; and detaching the exhaust pipe from the vacuum airtight container. 3. The method for sealing a vacuum-tight container according to claim 2, wherein the substrate glass and the image display plate glass are sealed with a low-melting glass via the frame glass. 4. The airtight vacuum according to claim 1, wherein the metal ring is anodically bonded to a float surface of the substrate glass and / or a float surface of the image display plate glass. Container sealing method. 5. The metal ring according to claim 1, wherein the metal ring is nickel 42% by weight.
3. The method for sealing a vacuum-tight container according to claim 1, wherein the ring is made of a nickel-chromium-iron alloy containing chromium and 6% of chromium. 6. The method for sealing a vacuum hermetic container according to claim 1, wherein the exhaust pipe is joined to the surface of the vacuum hermetic container with low melting point glass. 7. In the vacuum-tight container, an electron-emitting device is arranged on the substrate glass, and a phosphor that emits light by receiving electrons emitted from the electron-emitting device is provided on the image display panel glass. 3. The method for sealing a vacuum-tight container according to claim 2, wherein 8. The method according to claim 1, wherein the vacuum hermetic container is an airtight envelope of a plasma display panel. 9. A substrate glass on which electron-emitting devices are arranged,
An image display apparatus using a vacuum-tight container in which a phosphor glass that arranges and emits phosphors that receive and emit electrons from the electron-emitting device is sealed with a vacuum-tight container via a frame glass. An image display device, comprising: a vacuum-exhaust hole of the vacuum-tight container having a sealing lid that is anodically bonded by using the method for sealing a vacuum-tight container according to claim 2. .