JP2000243789A - Tape carrier for bga and semiconductor device employing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve reliability of package, especially moisture resistance, by preventing intrusion of moisture to the terminal electrode side of a semiconductor chip along a feeder line in the structure of a ball grid array(BGA) package provided with an electrode in the center of the semiconductor chip. SOLUTION: A wiring pattern 8 comprising a circuit pattern 22, which includes leads and lands and a feeder line 13 for electroplating the circuit pattern 22 is provided integrally on a tape base material 7, a punched part 17 or 20 is formed to intersect the feeder line 13, in order to disconnect the circuit pattern 22 electrically from the feeder line 13 after electroplating, and a film elastomer 3 is bonded to wiring pattern side. In such a tape carrier 2, the feeder line 13 exposed to the punched part 17 or 20 is covered with resin 15 or an elastomer adhesive, in order to prevent intrusion of moisture from the feeder line 13.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a BGA package using a tape carrier.

[0002]

2. Description of the Related Art With the miniaturization of semiconductor packages,
Several types of packages having a size approximately equal to the chip size have been developed. Among them, US Tessera (TES
Micro Ball Grid, devised by SERA)
Array (μBGA) packages have recently attracted attention as highly reliable packages.

FIG. 8A is a sectional view showing an example of the structure of a μBGA package, FIG. 8B is a top view, and FIG. 8C is a bottom view. Structurally, the semiconductor chip 1, the tape carrier 2,
An elastomer (low-elasticity resin) 3 for fixing them, a sealant 5 for protecting the terminal electrode 4 of the semiconductor chip, and a solder ball 6 serving as a package electrode. That is, μB
GA package is a tape BGA type CSP (Chip
The semiconductor chip 1 and a tape carrier 2 made of a TAB tape have an elastomer 3 interposed therebetween, and further, between the semiconductor chip 1 and the tape carrier 2, the terminal electrode 4 and the power supply line 13 are formed in an S-shape. It has a structure connected by the formed leads 9. In this μBGA technology, since the elastomer 3 is interposed between the semiconductor chip 1 and the tape carrier 2, the thermal stress generated between the package and the printed board can be reduced, and the life of the solder ball joint is improved. be able to.

On the other hand, in the method of forming the above-mentioned elastomer in the μBGA package structure, conventionally, a silicone-based elastomer was printed on a TAB tape and an adhesive was applied thereon. Therefore, workability was poor and the process was complicated. That is, the liquid silicone resin is printed (coated, cured) on the tape carrier to form an elastomer,
Due to the thick film printing, it is difficult to obtain flatness, and there is a problem that adhesive printing must be performed again at the time of chip mounting.

[0005] In order to solve this problem, the present applicant has a method of punching out a film elastomer (film-shaped elastomer) also serving as a chip adhesive, that is, a film elastomer capable of being bonded on both sides by a press and attaching it to a TAB tape. Is developing.

FIG. 9A is a cross-sectional view showing a wiring pattern for one BGA of a tape carrier having a length to which a plurality of BGAs are connected, and FIG. 9B is a plan view. The tape carrier 2 includes a tape base 7 made of a polyimide film and a wiring pattern 8 formed by a conductor layer thereon.
A lead 9 which constitutes a part of the wiring pattern 8 and is electrically connected to the terminal electrode 4 of the semiconductor chip, a hole 10 in which the lead extends in a cantilever shape, and a solder ball 6
, A land portion 12 forming a part of the wiring pattern 8, a power supply line 13 for applying electroplating to these wiring patterns 8, gold plating (electric Au plating layer) 14, and An outer shape removing portion 17 for cutting the power supply line 13 after electroplating is provided.

The method of manufacturing the tape carrier 2 is as follows: after punching a tape base material 7 to form a bonding hole 10 and a via hole 11, laminating a conductor layer; A wiring pattern 8 such as 13 is formed. Then, after performing the electro-gold plating 14 on the wiring pattern 8 using the power supply line 13, finally, the power supply line 13 is cut by forming an outer shape removing portion 17 as shown in FIG. 9C.

After that, a double-sided adhesive sheet elastomer 3 is attached to the surface of the tape carrier 2 where the wiring pattern 8 exists, as shown in FIG.
The sheet elastomer 3 is formed as shown in FIG. At this time, the sheet elastomer 3 is formed so as not to protrude from the tape carrier 2.

Next, as shown in FIGS. 10A and 10B,
The semiconductor chip 1 is joined to the above-mentioned tape carrier with elastomer 2 from the side where the sheet elastomer 3 exists. Then, the terminal electrode 4 of the semiconductor chip 1 and the lead 9 of the tape carrier are joined, and the terminal electrode 4 and the lead 9 of the joined semiconductor chip are sealed with the sealing agent 5. Then, the solder balls 6 are mounted on the lands 12 of the tape carrier 2, and finally, the individual cutting lines 19 (see FIG. 9C) are cut to form individual BGA packages.

[0010]

However, the BGA package using the above-described tape carrier has the following problems.

That is, when a PCT (Pressure Cooker Test) is performed to evaluate moisture resistance after the package is completed, moisture enters from the power supply line 13 exposed outside the package as shown by an arrow in FIG. However, there is a problem that moisture reaches the leads 9 connected to the terminal electrodes 4 of the semiconductor chip 1 and corrosion of the terminal electrodes 4 of the semiconductor chip 1 occurs. Therefore, a package structure for solving these problems is required.

In view of the foregoing, an object of the present invention is to solve the above-mentioned problems, and particularly to obtain a structure of a BGA package in which an electrode is provided at a central portion of a chip, by preventing the ingress of moisture from a power supply line. It is an object of the present invention to provide a BGA tape carrier with improved reliability, especially improved moisture resistance, and a semiconductor device using the same.

[0013]

In order to achieve the above object, a tape carrier for BGA of the present invention comprises a tape base, a wiring pattern provided on the tape base, and a terminal electrode of a semiconductor chip. A lead electrically connected to the lands, a land on which a solder ball is mounted, and a circuit pattern including a connection portion connecting the leads and the lands,
A wiring pattern having a power supply line for performing electroplating on these circuit patterns, a punched portion formed to intersect with the power supply line to cut off electrical continuity after the electroplating, It has a configuration including a film elastomer adhered to the surface on the side where it exists, and a resin covering a power supply line exposed at the punched portion (claim 1).

[0014] The punching portion may be a form which is also used as an outer shape punching portion for singulation.
Alternatively, it may be a form formed between the outer shape cutout for individualization and the land (claim 4).

In the case where the punching portion is also used as an external shape cutting portion for singulation, the resin covering the power supply line may be formed by extruding the adhesive of the elastomer ( Claim 3).

A portion of the power supply line on the side of the punched portion between the punched portion and the land may be removed, and the removed portion may be sealed with the film elastomer.

According to the tape carrier for BGA of the present invention, since water does not enter from the power supply line exposed outside the package, the water level reaches the lead connected to the terminal electrode of the semiconductor chip. However, the problem of corrosion of the terminal electrodes of the semiconductor chip can be avoided.

A semiconductor chip is mounted on a film elastomer of the tape carrier for BGA of the present invention (claim 1, 2, 3, 4 or 5), and the leads are provided at the center of the semiconductor chip. By connecting to the terminal electrode, a highly reliable semiconductor device without corrosion of the terminal electrode can be easily obtained.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The gist of the present invention is a structure in which a power supply line portion of a tape carrier exposed outside a package in a BGA package is embedded with a resin such as a sealing agent.

Hereinafter, the present invention will be described based on the illustrated embodiment.

(Embodiment 1) FIG. 1 shows the structure of a tape carrier for BGA of the present invention, and FIG. 2 shows an example of the structure of a BGA package using the same.

The basic structure of the BGA tape carrier shown in FIG. 1 is the same as that already described with reference to FIGS. That is, the tape carrier 2 includes a tape base material 7 and a wiring pattern 8 provided on one surface thereof, and the wiring pattern 8 includes a lead 9 electrically connected to the terminal electrode 4 of the semiconductor chip 1, Land 1 on which solder balls 6 are mounted
2 and a connection portion 21 connecting the leads 9 and the lands 12 to form a circuit pattern 22 (FIG. 9B). It has a power supply line 13. Further, the tape carrier 2 includes a punched portion including an outer shape punched portion 17 (FIG. 9C) formed so as to intersect with the power supply line 13 so as to cut off the electrical continuity after the electroplating. And a film elastomer 3 adhered to the surface on the existing side.

However, in that the resin 15 covering the power supply line 13 exposed in the outer shape removing portion 17 is provided,
8 and 9 are different.

This tape carrier 2 is manufactured by the following method. First, after forming a bonding hole 10 and a via hole 11 by punching out a tape base material 7, a conductor layer is laminated, and a wiring pattern 8 such as a lead 9, a land 12, and a power supply line 13 is formed on the conductor layer by a photoetching method (FIG. 9). (See (b)). Next, after performing the electrogold plating 14 using the power supply line 13, the power supply line 13 is cut by forming an outer shape punched portion 17 shown in FIG. 9C by a punch.

Then, a double-sided adhesive film elastomer 3 is attached to the surface of the tape carrier 2 on the side where the wiring pattern 8 exists. The film elastomer 3 is formed by punching out a continuous tape-shaped elastomer in which an adhesive is formed on both sides of a porous core into a sheet by pressing.

Next, in the above-mentioned tape carrier with elastomer 2, the resin 1 extends from the punched end face of the outer shape punched portion 17 which is a punched portion to the end face of the film elastomer 3.
5 is applied. As a result, the end of the power supply line 13 exposed in the outer shape removing portion 17 is covered with the resin, and is shielded from the external atmosphere.

Thus, the BGA tape carrier shown in FIG. 1 is obtained.

As already described with reference to FIG. 10, the power supply line 13 is conventionally exposed at the end face of the outer shape-removed portion 17 of the tape carrier 2, and when a moisture resistance test is performed, moisture is transmitted through the power supply line 13. It reaches the lead 9 and corrodes the electrode 4 of the semiconductor chip. However, when the resin 15 such as a sealing agent is applied to the exposed portion of the power supply line 13 to eliminate the exposure of the power supply line 13 and fill with resin as shown in FIG. .

FIG. 2 shows an example of the structure of a BGA package using the BGA tape carrier. The BGA package of FIG. 2 has basically the same structure as that already described in FIG. 8, and the BGA tape carrier 2 having the configuration of FIG. 1 is used.

This BGA package is manufactured as follows. First, the above-described tape carrier with elastomer 2
Then, the semiconductor chip 1 is joined and mounted from the side where the film elastomer 3 exists. The semiconductor chip 1 is connected to a tape carrier 2 via an elastomer 3 which is a double-sided adhesive film.
Adhered to.

Next, the lead 9 of the tape carrier 2 is
And is connected to the terminal electrodes 4 of the semiconductor chip 1.
That is, the bonding tool cuts the notch 24 of the lead 9, forms the lead 9 in an S-shape, and performs bonding (Au / Al) on the electrode 4 by heat and ultrasonic waves.

Next, the terminal electrodes 4 and the leads 9 of the bonded semiconductor chip 1 are sealed with a sealant 5. Then, the solder balls 6 are mounted on the lands 12 of the tape carrier 2, and finally, the individual cutting lines 19 (see FIG. 9C) are cut to form individual BGA packages.

In the BGA package, the exposed portion of the power supply line 13 is buried in the resin 15 and sealed according to the present invention, so that entry of moisture can be prevented. Therefore, even when the moisture resistance test is performed, the water does not reach the leads 9 along the power supply line 13 as in the related art, and the corrosion of the electrodes 4 of the semiconductor chip can be prevented.

In the embodiment of FIG. 2, the resin 15 is applied before cutting into individual pieces. However, in assembling a BGA package, the resin 15 is applied after the semiconductor chip 1 is mounted on the tape carrier 2. You can also.

(Embodiment 2) FIG. 3 shows a second embodiment. This is a method of preventing the power supply line 13 from being left exposed in the outer shape removing portion 17 by exposing the adhesive 16 of the elastomer 3 to the end surface of the outer shape removing portion 17 so that the power supply line 13 is In this way to prevent the ingress of moisture.

For this purpose, when the elastomer 3 is formed on the tape carrier 2 as shown in FIG.
An operation is performed so that the elastomer 3, which is an elastic body, protrudes from the position where the stamp 3 is punched. Specifically, an adhesive layer is formed on both surfaces of the elastomer 3, or the entire elastomer 3 is prepared with the adhesive 16, and heat or load is applied.
As a result, the adhesive 16 protrudes and the power supply line 13
Is embedded in the adhesive 16 to prevent the power supply line 13 from being exposed. By using this method, the application step of the resin 15 performed in the first embodiment or the second embodiment described later can be omitted, so that the exposure of the power supply line 13 can be prevented by a simpler method.

(Embodiment 3) FIGS. 4 and 5 show a third embodiment. This is because the punched portion 20 for cutting the electrical continuity after the electroplating is not used as the cutout portion 17 for singulation as in the first and second embodiments, but is separately provided inside the package. It is an embodiment example provided on the side.

In other words, the tape carrier 2 has an outer portion 17 for singulation and, more precisely, a land 1 inside the package.
2, a power supply line punching portion 20 is formed in the form of a slit intersecting with the power supply line 13, and a resin 15 as a sealing agent is applied to a portion 20 where the power supply line has been punched out. The exposure of the line 13 is prevented.

As described above, the power supply line punching portion 20 is formed on the inner side of the package, and the power supply line punching portion 20 is filled with the resin 15 so that the power supply line 13 is not exposed, and the moisture from the power supply line 13 is removed. Can be prevented from entering.

(Embodiment 4) FIGS. 6 and 7 show a fourth embodiment. This is a structure in which a portion of the power supply line 13 on the side of the outer shape removing portion 17 between the outer shape removing portion 17 and the land 12 is removed, and the removed portion 23 is sealed with the film elastomer 3.

First, as shown in FIG. 7A, a cut 18 is formed in the power supply line 13 with a mold or the like. Then, with the cut 18 as a boundary, the portion (stripping portion) 13a of the power supply line 13 on the side of the outer shape cutout 17 is stripped and removed. FIG. 7B shows the surface of the tape base material 7 after the stripping as a removed portion 23. Thus, the tape carrier 2 in which only the power supply line 13 is cut while leaving the tape base 7 made of polyimide is formed.

Using this tape carrier 2, a film elastomer 3 having an adhesive layer on both surfaces is bonded to the surface on the side where the power supply line 13 exists. By doing so, as shown in FIG. 6, a part of the film elastomer 3 is deformed and penetrates into the removal portion 23 which is the surface of the tape base material after the stripping portion 13a of the power supply line 13 is stripped. And the power supply line 13 is also sealed at the same time. Therefore, the power supply line 13 can be buried at the same time as the formation of the film elastomer 3, and the exposure of the power supply line 13 can be eliminated by a simpler method.

In FIG. 6 and FIG. 7, the portion of the power supply line 13 on the side of the outer shape removing portion 17 between the outer shape removing portion 17 and the land 12 is removed. However, as shown in FIGS. In the embodiment in which the punching portion 20 for cutting off the conduction is provided independently, a portion of the power supply line 13 on the punching portion 20 side between the punching portion 20 and the land 12 may be removed.

[0044]

As described above, according to the tape carrier for BGA of the present invention and the semiconductor device using the same,
Since the power supply line exposed at the punched portion is covered with the resin so as not to be exposed to the outside atmosphere, it is possible to prevent the intrusion of moisture that has conventionally been generated and transmitted into the package through the power supply line. Therefore, the occurrence of corrosion in the pad electrode can be eliminated, and the moisture resistance of the package can be improved.

[Brief description of the drawings]

FIG. 1 is a sectional view of a BGA tape carrier according to a first embodiment of the present invention.

FIG. 2 is a sectional view of a BGA semiconductor device of the present invention using the BGA tape carrier of FIG.

FIG. 3 is a left side sectional view of a BGA semiconductor device using a BGA tape carrier according to a second embodiment of the present invention.

FIG. 4 is a left side sectional view of a BGA semiconductor device using a BGA tape carrier according to a third embodiment of the present invention.

FIG. 5 is a partial plan view of the semiconductor device of FIG. 4;

FIG. 6 is a left side sectional view of a BGA semiconductor device using a BGA tape carrier according to a fourth embodiment of the present invention.

7A and 7B show a part of a manufacturing process of the semiconductor device of FIG. 6, in which FIG. 7A is a plan view showing a state in which a notch for stripping is cut, and FIG. It is the top view which showed the state after having done.

FIG. 8 shows a conventional BGA semiconductor device.
(A) is a sectional view, (b) is a top view, and (c) is a bottom view.

9A and 9B show a conventional BGA tape carrier, in which FIG. 9A is a cross-sectional view, FIG. 9B is a plan view before the outline is removed, and FIG. 9C is a plan view after the outline is removed.

FIG. 10 shows a conventional BGA semiconductor device.
(A) is a sectional view, and (b) is a bottom view.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor chip 2 Tape carrier 3 Elastomer 4 Terminal electrode 5 Sealant 6 Solder ball 7 Tape base material 8 Wiring pattern 9 Lead 12 Land 13 Power supply line 14 Gold plating 15 Resin 16 Elastomer adhesive 17 Outer cutout part 20 Punching part 21 Connection 22 Circuit pattern

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4M109 AA02 BA05 CA05 DA07 EE02 EE03 5F044 MM03 MM07 MM16 MM25 MM35 MM48 NN09 RR18

Claims (6)

[Claims] 1. A tape base, a wiring pattern provided on the tape base, a lead electrically connected to a terminal electrode of a semiconductor chip, a land on which a solder ball is mounted, and a lead A circuit pattern consisting of connection portions for connecting the lands, a wiring pattern having a power supply line for performing electroplating on these circuit patterns, and crossing the power supply line to cut off electrical continuity after the electroplating And a film elastomer adhered to the surface on the side where the wiring pattern is present, and a resin covering a power supply line exposed at the punched portion. Tape carrier for BGA. 2. The BGA tape carrier according to claim 1, wherein said punched portion is also used as an outer shape cutout portion for singulation. 3. The BG tape carrier according to claim 1, wherein the resin covering the power supply line is formed by extruding the adhesive of the elastomer.
Tape carrier for A. 4. The BGA tape carrier according to claim 1, wherein the punched portion is formed between the outer shape cutout portion for singulation and the land. . 5. The BGA tape carrier according to claim 1, wherein a portion of the power supply line on the side of the punching portion is removed between the punching portion and the land, and the removed portion is replaced with the film. A tape carrier for BGA, which is sealed with an elastomer. 6. The B according to claim 1, 2, 3, 4 or 5.
A semiconductor device using a GA tape carrier, mounting a semiconductor chip on a film elastomer thereof, and connecting the leads to an electrode provided at a central portion of the semiconductor chip.