JP2000241501A - Inspecting apparatus for semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inspecting apparatus for semiconductor devices with a constitution whereby leads of the semiconductor devices can be surely brought in contact with measurement terminals of the apparatus. SOLUTION: The inspecting apparatus is in the same constitution as conventional inspecting apparatuses except a chip placement part 40. The chip placement part 40 has a contact sheet 48 set to an upper face thereof. The contact sheet has a suction area 42 for sucking through contact with a chip lower face, measurement terminals 44 disposed at each side of the area and a suction opening 46 connected to a vacuum suction device. The contact sheet is mounted to a chip placement part main body 52 by screwing at sheet fix holes 50. The contact sheet is formed of a ceramic-based porous substance. The suction area has a shape and a size nearly equal to the chip lower face of a semiconductor device to be inspected and functions as a suction face. The measurement terminals are arranged to both sides of the suction area to agree with an arrangement of leads of the semiconductor device and set penetrating a sheet main body. The contact sheet is covered with a seal layer for air-tightly sealing the sheet main body except a face of the suction area and measurement terminals.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection apparatus for a semiconductor device, and more particularly, to an inspection apparatus for a semiconductor device in which a contact between a lead of the semiconductor device and a measurement terminal is ensured so that a contact failure does not occur. It concerns the device.

[0002]

2. Description of the Related Art In a semiconductor device or a semiconductor integrated circuit, an integrated circuit is formed on a wafer, the wafer is diced and cut into chips, and each chip is mounted on a lead frame and wire-bonded. After sealing, it is commercialized as one semiconductor device. Before shipping the manufactured semiconductor device, various function tests are performed by a semiconductor device inspection device in order to confirm the performance of each semiconductor device.

[0003] Inspection of a semiconductor device is performed using an inspection device for inspecting a circuit of the semiconductor device. An inspection apparatus for a semiconductor device includes a measuring device for a circuit of the semiconductor device, and a semiconductor device mounting surface exposing a measuring terminal connected to the measuring device. The semiconductor device is mounted on the mounting surface, and a lead of the semiconductor device is read. Is brought into contact with the measuring terminal to electrically connect the measuring means to the semiconductor device. Therefore, in the inspection of the semiconductor device, it is necessary to surely make the lead of the semiconductor device and the measurement terminal of the inspection device come into contact with each other. Focusing on the contact mechanism between the lead terminal of the semiconductor device and the measurement terminal of the inspection device, the inspection device presses the lead directly against the measurement terminal from above with a lead holder to secure contact between the lead and the measurement terminal. Inspection apparatuses are roughly classified into inspection apparatuses of the type and inspection apparatuses of the type in which the upper surface of the IC is pressed with an IC holder to thereby ensure contact between the lead and the measurement terminal.

Referring to FIGS. 6 to 8, a description will be given of a configuration of a lead holding type inspection apparatus in which a lead is directly pressed against a measuring terminal from above with a lead holder. FIG. 6 is a perspective view showing the overall configuration of the inspection apparatus, FIG. 7 is a perspective view showing the configuration of the chip mounting portion, and FIG. 8 is a schematic diagram illustrating the function of the lead holder. As shown in FIG. 6, a lead holding type inspection apparatus 10 inspects a semiconductor device by cooperation of the inspection apparatus 10 and an IC transport apparatus 12 which transports the semiconductor device to the inspection apparatus 10 and positions the semiconductor device at a predetermined position. are doing. The inspection device 10 includes various measurement devices (not shown).
Arm 14 extending from the inspection device main body 11 having the built-in device toward the IC transport device 12, and a tip 14 a of the arm 14.
And a chip mounting portion 16 for contacting the lead of the semiconductor device with the measurement terminal.

[0005] The arm 14 is a core type arm,
As shown by the arrows, the arm extends from the inspection apparatus main body 11 so as to be able to advance and retreat in the horizontal direction, and the entire arm can be freely moved up and down in the vertical direction. As shown in FIG. 7, the chip mounting portion 16 is formed in a box shape for mounting the semiconductor device to be inspected on the upper surface, and has a contact sheet 18 for mounting the semiconductor device on the upper surface,
Inside the arm 14 and the chip mounting portion 16, wiring for connecting the measuring device of the inspection device main body 11 and the measuring terminal 20 is laid. The contact sheet 18 has a large number of measuring terminals 2 arranged in accordance with the arrangement of the leads of the semiconductor device.
0 is exposed, and is screwed to the chip mounting portion main body with the sheet fixing hole 23.

[0006] As shown in FIG.
It is configured as a pair of two arm-shaped members having a lead holding end 24 that contacts and presses the lead tip, and is provided in the IC transfer device 12. Lead holder 22
Are movable toward and away from each other, as shown by arrows, and descend to contact the tips of the leads L of the semiconductor device IC and press them against the measuring terminals 20.

When inspecting a semiconductor device, first, the arm 14 is extended from the inspection device 10 to position the chip mounting portion 16 at a predetermined position. Next, the IC transfer device 12 positions and mounts the transferred semiconductor device on the contact sheet 18 of the chip mounting portion 16, and presses the lead of the semiconductor device against the measurement terminal 20 with the lead holder 22, and Let me. Inspection device 1 of lead holding system
0 is mainly used when inspecting a large semiconductor device in which the lead can be pressed by the lead holder 22, that is, a semiconductor device having a relatively large chip size and a relatively large lead size.

[0008] By the way, since the semiconductor device is downsized in accordance with the demand for miniaturization of the semiconductor device, and the lead is thin and the pitch is also narrow, the lead holding inspection apparatus 10 described above is used. It is often physically difficult to directly hold the lead with the presser 22.

Therefore, when inspecting a small semiconductor device, an IC upper surface pressing type inspection device is used in which the upper surface of the IC is pressed with an IC holder, thereby ensuring the contact between the lead and the measuring terminal. With reference to FIGS. 9 and 10, the configuration and function of the inspection device of the IC top-down type will be described. FIG. 9 is a schematic diagram illustrating the function of the IC holder, and FIG. 10 is a perspective view illustrating a state where the IC is mounted on the chip mounting portion and the leads are brought into contact. As shown in FIG. 9 and FIG.
Are arranged in accordance with the arrangement of the leads of a small semiconductor device,
It has the same configuration as.

[0010] As shown in FIG.
C is configured as a pair of two arm-shaped members having opposing IC pressing end portions 34 for contacting and pressing the upper surface.
It is provided on the transport device 12. As shown by arrows, the IC holders 32 can approach and separate from each other, and descend to contact the upper surface of the semiconductor device IC and press the lead L to measure the lead L as shown in FIG. Contact the terminal 20.

[0011]

However, as the size of the semiconductor device becomes smaller and smaller, the above-mentioned conventional inspection device of the IC top holding type does not always make sure the contact between the lead and the measuring terminal. And a measurement error may occur. With this, a highly reliable inspection cannot be performed. In order to prevent contact failure, it is necessary to uniformly press the entire IC upper surface with the IC upper surface pressing. Therefore, I
It was necessary to spend a lot of time adjusting the operation of the IC upper surface pressing so that the entire upper surface of the C surface could be uniformly pressed. This makes it difficult to improve inspection efficiency. In addition, to some extent, the above-described conventional lead holding type inspection apparatus also has a problem in that a measurement error occurs due to poor contact between the lead and the measurement terminal.

SUMMARY OF THE INVENTION An object of the present invention is to provide an inspection apparatus for a semiconductor device having a configuration for ensuring contact between a lead of the semiconductor device and a measurement terminal of the inspection apparatus.

[0013]

The inventor of the present invention has investigated the causes of poor contact between the leads of a semiconductor device and the measurement terminals of an inspection device using a conventional inspection device. Difficult to press, and
It has been found that it is difficult to uniformly press the entire upper surface of the semiconductor device and bring it into close contact with the contact sheet in the IC upper surface pressing method. Therefore, the present inventor
The inventors considered that it is important for the semiconductor device to be in close contact with the contact sheet, and conceived of vacuum suction of the semiconductor device on the lower surface in addition to pressing the upper surface, and repeated experiments to complete the present invention.

In order to achieve the above object, an inspection apparatus according to the present invention includes a measuring device for a circuit of a semiconductor device, and a mounting surface of a semiconductor device exposing a measuring terminal connected to the measuring device. A semiconductor device is mounted on a mounting surface, and a lead of the semiconductor device is brought into contact with a measuring terminal, thereby electrically connecting the measuring means to the semiconductor device, and inspecting a circuit of the semiconductor device. The semiconductor device has a chip suction area which is in contact with the chip lower surface of the semiconductor device and functions as a suction surface by vacuum suction, and the chip lower surface of the semiconductor device is suctioned to the chip suction area by vacuum suction.

There is no restriction on the method of suction by vacuum suction, but preferably, the chip suction area is partitioned on the surface of a suction plate formed of a gas-permeable porous material, and vacuum suction is performed through the suction plate. In addition, the semiconductor device can be sucked on the lower surface of the chip. There is no restriction on the material of the gas-permeable porous material. For example, the adsorbing plate is formed of a resin-based or ceramic-based porous material.

When directly holding the leads of a large semiconductor device by the lead holding method, a chip having a chip suction area which is raised from the surface on which the measurement terminals are arranged is used.

[0017]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. Embodiment 1 This embodiment is an example of an embodiment of a semiconductor device inspection apparatus according to the present invention. FIG. 1 is a perspective view of a chip mounting portion, and FIG. Sectional view at -A, FIG.
FIG. 3B is a cross-sectional view taken along line BB in FIG. 1, and FIG. 3A is a cross-sectional view of the state where the semiconductor device is mounted on the chip mounting portion as viewed in a cross-section corresponding to FIG. FIG. 3B is a cross-sectional view of the state where the semiconductor device is mounted on the chip mounting portion as viewed in a cross section corresponding to FIG. 2B, and FIG. 4 is a diagram in which the semiconductor device IC is mounted on the chip mounting portion. It is a perspective view showing the state where the upper surface of the chip was pressed with the press. An inspection device for a semiconductor device according to the present invention comprises:
This is an inspection device of an IC top surface pressing type applied to inspection of a small semiconductor device having short leads and a narrow lead pitch, and has the same configuration as the conventional semiconductor device inspection device 10 except for the configuration of the chip mounting portion 40. It has.

As shown in FIG. 1, the chip mounting section 40 provided in the inspection apparatus of this embodiment has a chip suction area 42 which is in contact with and suctions a chip lower surface, and measurement terminals 44 arranged on both sides thereof. A contact sheet 48 having a suction port 46 connected to a vacuum suction device (not shown) is provided on the upper surface. The contact sheet 48 is attached to the chip mounting portion main body 52 by screwing in a sheet fixing hole 50.

As shown in FIGS. 2A and 2B, the contact sheet 48 is substantially the same as a sheet body 54 formed of a ceramic-based air-permeable porous material and a chip lower surface of a semiconductor device to be inspected. A chip suction area 42 having a shape and dimensions and functioning as a suction surface is provided on the upper surface, and is arranged on both sides thereof so as to match the arrangement of the leads of the semiconductor device, and is mounted through the sheet body 54. Terminal 44
And the surface of the sheet body 54 is covered with a seal layer 56 that hermetically seals it except for the surfaces of the chip suction area 42 and the measurement terminals 44. The seal layer 56 is, for example, a resin layer formed by applying plastic. The contact sheet 48 has a suction port 46 that communicates with the sheet body 54 at one end.

In the chip mounting section 40 provided in the inspection apparatus of this embodiment, as shown in FIG.
The lower surface of C overlaps the chip suction area 42 and the lead L
The semiconductor device IC is positioned such that the semiconductor device IC comes into contact with the measurement terminal 44, the semiconductor device IC is placed on the contact sheet 48, and then the upper surface of the semiconductor device chip is pressed by the IC holder 32. At the same time, as shown in FIG. 3B, the suction port 46 is connected to a vacuum suction device (not shown) to perform vacuum suction. By pressing the upper surface and adsorbing the lower surface of the semiconductor device IC,
As shown in FIG. 4, the lower surface of the semiconductor device IC is vacuum-sucked through a porous sheet main body 54 and adheres to the suction region 42, and the leads L of the semiconductor device IC are connected to the measurement terminals 44.
Make sure contact with Therefore, the contact failure between the lead and the measurement terminal, which occurs in the conventional inspection apparatus, does not occur.

Embodiment 2 This embodiment is another example of the embodiment of the semiconductor device inspection apparatus according to the present invention. FIG.
FIG. 5B is a cross-sectional view corresponding to the cross section taken along line BB in FIG. 1. The semiconductor device inspection apparatus according to the present invention is a lead holding type inspection apparatus applied to inspection of a large semiconductor device having relatively large leads and a wide lead pitch, and a part of the configuration of a chip mounting portion. Except for this, the inspection apparatus has the same configuration as the inspection apparatus of the first embodiment.

As shown in FIGS. 5 (a) and 5 (b), in the contact sheet 60 of the chip placing portion of this embodiment,
The chip suction area 62 is adjusted so that the height difference between the chip suction area 62 and the contact surface of the measuring terminal 44 matches the distance between the lower surface of the chip of the semiconductor device to be inspected and the contact surface of the tip of the lead.
Has the same configuration as that of the chip placing portion 40 of the first embodiment, except that it is raised upward from the surface of the sheet body 54. Thus, the chip mounting portion of the second embodiment provided with the contact sheet 60 functions in the same manner as the chip mounting portion 40 provided in the inspection apparatus of the first embodiment, and the lower surface of the semiconductor device IC is porous. Vacuum suction is performed through the high quality sheet body 54 to be in close contact with the chip suction area 62, and the leads L of the semiconductor device IC are surely in contact with the measurement terminals 44. Therefore, the contact failure between the lead and the measurement terminal, which occurs in the conventional inspection apparatus, does not occur.

[0023]

According to the present invention, a semiconductor device is mounted on a mounting surface, and a lead of the semiconductor device is brought into contact with a measuring terminal, thereby electrically connecting the measuring means and the semiconductor device.
In an inspection device for inspecting a circuit of a semiconductor device, a chip suction region which contacts a lower surface of a chip of a semiconductor device and functions as a suction surface is provided on a mounting surface, and the lower surface of the chip of the semiconductor device is suctioned to the chip suction region by vacuum suction. Thus, the leads of the semiconductor device IC can be reliably brought into contact with the measurement terminals. Therefore, in the inspection device according to the present invention, the contact failure between the lead and the measurement terminal does not occur as in the conventional inspection device.

[Brief description of the drawings]

FIG. 1 is a perspective view of a chip mounting unit.

FIG. 2A is a cross-sectional view taken along line AA in FIG. 1, and FIG. 2B is a cross-sectional view taken along line BB in FIG.

FIG. 3A is a cross-sectional view of a state in which the semiconductor device is mounted on a chip mounting portion as viewed in a cross section corresponding to FIG. 2A, and FIG. FIG. 3 is a cross-sectional view of a state of being placed on a section viewed from a cross section corresponding to FIG.

FIG. 4 shows a semiconductor device IC mounted on a chip mounting portion;
It is a perspective view showing the state where the upper surface of the chip was pressed with the press.

5A is a cross-sectional view corresponding to a cross section taken along line AA in FIG. 1, and FIG. 5B is a cross-sectional view corresponding to a cross section taken along line BB in FIG. .

FIG. 6 is a perspective view showing the entire configuration of the inspection device.

FIG. 7 is a perspective view illustrating a configuration of a chip mounting unit.

FIG. 8 is a schematic diagram illustrating a function of a lead press.

FIG. 9 is a schematic diagram illustrating a function of an IC holder.

FIG. 10 is a perspective view showing a state where an IC is mounted on a chip mounting portion and leads are brought into contact with the IC mounting portion.

[Explanation of symbols]

Reference numeral 10: lead holding type inspection device, 11: inspection device main body, 12: IC transport device, 14: arm, 14
a: tip of arm, 16: chip placement part, 18
... Contact sheet, 20 ... Measurement terminal, 22 ... Lead retainer, 23 ... Sheet retaining hole, 32 ... IC retainer, 40 ... Chip mounting part provided in the inspection apparatus of the first embodiment, 42 ... Suction area, 44 Measurement terminal, 46
Suction ports 46, 48 Contact sheet, 50 Sheet stopper hole 52, Chip mounting portion main body 54 Sheet main body 56 Seal layer 60 Provided in the inspection apparatus of the second embodiment. Contact sheet, 62... Adsorption area.

Claims (4)

[Claims] A measuring device for measuring a circuit of the semiconductor device;
A semiconductor device mounting surface on which a measuring terminal connected to the measuring means is exposed, the semiconductor device is mounted on the mounting surface, and a lead of the semiconductor device is brought into contact with the measuring terminal, whereby the measuring means and the semiconductor device are separated from each other. In an inspection apparatus for electrically connecting and inspecting a circuit of a semiconductor device, a mounting surface has a chip suction region which contacts a lower surface of a chip of the semiconductor device and functions as a suction surface by vacuum suction. An inspection apparatus for a semiconductor device, wherein a lower surface of a chip is sucked into a chip suction area by vacuum suction. 2. The semiconductor device according to claim 1, wherein the chip adsorbing area is partitioned on a surface of an adsorbing plate formed of a gas-permeable porous material, and the semiconductor device can be adsorbed on a lower surface of the chip by vacuum suction through the adsorbing plate. The inspection device for a semiconductor device according to claim 1, wherein: 3. The semiconductor device inspection apparatus according to claim 2, wherein the suction plate is formed of a resin-based or ceramic-based air-permeable porous material. 4. The semiconductor device inspection apparatus according to claim 1, wherein the chip suction area is raised from a surface on which the measurement terminals are arranged.