JP2000235057A - Method and device for generating information for production of printed board inspecting jig board printed board inspecting jig board, and printed board inspecting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To extremely easily generate the information concerning a common inspecting electrode by performing a grouping processing and a common electrode forming processing for forming a single virtual common electrode. SOLUTION: A driving mechanism 19 is driven by a control mechanism 23 governed by a control computer 22 in an inspection control mechanism B, a lower head 10 is laid in the state pressed to an upper head 11 to pressure connect an inspecting jig board 12 to a board to be inspected 20, whereby the electric connection of the both is attained through connector sheets 16, 17. At this time, the conducting state of the electrode to be inspected of the board to be inspected 20 is transmitted to a tester 24 trough the lower head 10 and the upper head 11 to execute the inspection. According to this, the geometric information and electric connection information for a common inspecting electrode to be formed n an intended continuity inspecting jig board can be easily generated in an extremely short time.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an information generating method and apparatus for producing a jig substrate for printed circuit board inspection, a jig substrate for printed circuit board inspection, and a printed circuit board inspection method.

[0002]

2. Description of the Related Art A printed wiring board (hereinafter simply referred to as a "printed board") is a support for supporting active and passive elements such as integrated circuits (ICs), large-scale integrated circuits (LSIs), transistors, and resistors. Along with the function as
It has a wiring function to achieve the required electrical connection between the electrodes of these elements. That is, in the printed circuit board, the specific arrangement of each electrode is determined according to the arrangement state and connection state of the elements supported by the printed circuit board, and further, the electrical connection state between these electrodes or The formation of the isolation state forms a plurality of electrical networks.

In general, the inspection of the electrical performance of a printed circuit board is performed by a continuity check (hereinafter simply referred to as a “continuity test”) for checking the presence or absence of a break in a wiring for electrically connecting a plurality of electrodes on the board. ) And an insulation state inspection test (hereinafter simply referred to as an “insulation inspection”) for inspecting the presence or absence of insulation failure between wiring nets formed independently on the substrate. In addition, as a method of performing these inspections, in addition to an individual inspection method such as a flying probe method in which an inspection probe is individually brought into contact with each pair of electrodes to be inspected and an electric resistance between the two is measured. As a batch inspection method, a method in which a pin-shaped probe placed at a position corresponding to a large number of electrodes to be inspected is brought into contact with all the electrodes to be inspected at once to perform an inspection, or a pin-shaped probe is used. Instead, there is a method using an inspection jig substrate formed of a printed circuit board in which an inspection electrode having a shape and size suitable for a position corresponding to the electrode to be inspected is arranged as a probe.

In recent years, the wiring density on a printed circuit board has been rapidly increasing, and the distance (pitch) between the wirings has been reduced, and the inspection electrodes themselves have also been reduced in size and density. Has been reached. As a result, as a matter of course, even in the inspection probe device, it is required that the expected inspection can be reliably performed on the inspection target substrate on which the extremely minute electrodes to be inspected are arranged very close to each other. It is supposed to be.

[0005] The above-mentioned individual inspection method can relatively easily respond to this requirement, but it is necessary to perform inspection by performing individual contact for all of a large number of electrode pairs to be inspected. Inspection takes a very long time,
Not realistic. On the other hand, in the collective inspection method, even when a pin-shaped probe is used, or when an inspection jig substrate having an inspection electrode is used, a minute pin is used in those inspection probe devices. It is necessary to arrange a probe or an electrode for inspection with high positional accuracy in a limited narrow area, and to achieve this, extremely high technology is required. A large amount of cost and time is required to make the probe device for the measurement unrealistic.

Further, in the inspection of a printed circuit board having a fine and high-density pattern, in practice, even a slight displacement occurs between the inspected substrate to be inspected and the inspection jig substrate that is in contact with the inspected substrate. In such a case, the intended inspection cannot be performed, and the inspection result becomes unreliable. Therefore, a technique of precisely aligning them is required at the same time.

As described above, in the field of the current probe apparatus for inspecting a printed circuit board, a fine pin-shaped probe or an electrode for inspection is required to be high in order to cope with a higher density and finer wiring pattern on the printed circuit board. There is a need for a specific method for arranging with high density and high positional accuracy, and research is currently being conducted along that direction.

More specifically, FIG. 1 shows an example of a conventional inspection jig substrate used as an inspection probe in a collective inspection method of a printed substrate to be inspected (hereinafter, also referred to as “substrate to be inspected”). FIG. 4 is an explanatory diagram showing a state in which the inspection electrode and the terminal electrode in FIG. On one surface of the inspection jig substrate which is in contact with the substrate to be inspected at the time of inspection, inspection electrodes 51 and 51 shown in a black or black rectangle are arranged, and on the other surface, white or white electrodes are provided. Terminal electrodes 52 and 5 shown by blank circles
2 are arranged on grid points at regular intervals to form grid electrodes, and the corresponding test electrodes 51 and terminal electrodes 52 are electrically connected by printed wiring 53 in a state of forming a pair. . Here, each of the test electrodes 51 is
The shape, size, and position of each of a large number of electrodes to be inspected on the substrate to be inspected correspond to each other.

Such an inspection jig substrate is mounted on a printed circuit board inspection apparatus, and is used for inspecting the electrical performance of the substrate to be inspected. FIG. 2 shows an example of a printed board inspection apparatus, wherein A is an inspection head mechanism, and B is an inspection control mechanism.
In the inspection head mechanism A, reference numeral 10 denotes a lower head. An inspection jig substrate 12 is mounted on the lower head 10, and a substrate 20 to be inspected is arranged on the inspection jig substrate 12. Specifically, for example, the connector sheets 16 and 17 such as an anisotropic conductive rubber sheet are used for the inspection jig substrate 12.
Are mounted on the lower head 10,
The substrate to be inspected 20 is disposed thereon. Similarly, an inspection jig substrate 12 and connector sheets 16 and 17 are mounted on the upper head 11 above the lower head 10 in a stacked manner.

Reference numeral 19 denotes a drive mechanism, which is an inspection control mechanism B
Is driven by a control mechanism 23 controlled by a control computer 22 in the lower head 10.
Is pressed against the upper head 11, the inspection jig substrate 12 and the substrate to be inspected 20 are crimped, and an electrical connection therebetween is achieved via the connector sheets 16 and 17. The conduction state of the electrodes to be inspected of the substrate to be inspected 20 is sent to the tester 24 via the lower head 10 and the upper head 11 to execute the inspection.

[0011] With such an inspection apparatus, the substrate to be inspected 20
In order to carry out a required inspection on
It is indispensable to obtain a state where the position of the electrode to be inspected on the inspection jig 0 and the position of the electrode for inspection on the inspection jig substrate 12 are exactly coincident with each other. A mechanism is built into the inspection device. However, in recent years, the electrodes of the printed circuit board are miniaturized and the density is increased, and it is extremely difficult to achieve accurate alignment of the substrate 20 to be inspected with the inspection jig substrate 12. .

Further, in a conventional inspection jig substrate,
Inspection electrodes of the same number as the electrodes to be inspected need to be provided in the same arrangement corresponding to each of a large number of the electrodes to be inspected on the substrate to be inspected. Inspection capacity is required.

Further, at present, with the miniaturization and high density of the electrodes of the printed circuit board, the electrical connection by the wiring between the inspection electrode and the terminal electrode (grid electrode) on the inspection jig substrate is also the same. In the past, a sufficient wiring area was obtained only on both sides of the substrate. Recently, however, if a multi-wiring structure in which one or more interlayer wirings are formed is used, a substrate is required. It has become impossible to form the required wiring in the inside.

A printed circuit board to be put into practical use is usually manufactured on the assumption that the same printed circuit board is manufactured in at least a certain quantity or more, so that it takes a considerable time and cost to design and manufacture the printed circuit board. Although acceptable, the jig board for inspection is essentially a single item,
The manufacturing period is required to be as short as possible and the cost is required to be low. Therefore, adopting a multilayer wiring structure similar to that of the substrate to be inspected in response to miniaturization and high density of the substrate to be inspected imposes a very large load on the production of the inspection jig substrate.

Under the circumstances described above, an improved jig substrate for inspecting a printed circuit board has been proposed in Japanese Patent Application No. 10-176172. This inspection jig substrate has a large common inspection electrode formed at a pitch larger than the minimum pitch of the fine and high-density electrodes to be inspected on the substrate to be inspected. The required electrical inspection can be performed by the device (tester), and the design and production of the inspection jig substrate itself is easy.

Specifically, two types of jig substrates for printed circuit board inspection have been proposed, and the first inspection jig substrate is for conducting a continuity inspection of each wiring net on the substrate to be inspected. is there. The first inspection jig substrate includes an inspection electrode at a position corresponding to the positions of the plurality of electrodes to be inspected on the substrate to be inspected, and at least one of the inspection electrodes is provided.
One is a common inspection electrode having a shape corresponding to an electrode group to be inspected constituted by two or more electrodes to be inspected, and the common inspection electrode is brought into contact with the substrate to be inspected for inspection. In addition, mutually independent wiring nets formed on the substrate to be inspected are formed so as not to form an electrically closed circuit with each other via the common inspection electrode. A plurality of the above-mentioned inspection electrodes may be electrically connected to each other by wiring.

On the other hand, the second inspection jig substrate is for performing an insulation inspection between wiring nets on the substrate to be inspected. The second inspection jig substrate includes an inspection electrode, and the inspection electrode corresponds to only one inspected electrode belonging to each of the independent wiring nets formed on the inspected substrate. Is formed as a representative test electrode electrically connected to the test electrode.

Hereinafter, each of the inspection jig substrates will be described in detail. FIG. 3 is an explanatory diagram showing a state in which an inspection electrode on the first inspection jig substrate and an electrode to be inspected on the substrate to be inspected are superimposed on each other (a transparent state).
In this figure, a rectangle, square, or circle figure filled in black represents an electrode X to be inspected on a substrate to be inspected, and a white rectangle represents a common inspection substrate of an inspection jig substrate (not shown). Represents an electrode Y. In addition, an inspection electrode Z corresponding to the inspection target electrode X other than the common inspection electrode is formed. The number assigned to the electrode X to be inspected specifies the individual electrode X to be inspected, and is indicated in parentheses in this specification, and the number assigned to the electrode Y for common inspection. Lowercase letters specify the individual test electrodes Y, and are shown in parentheses in this specification.

As is apparent from this figure, each common inspection electrode Y does not correspond in shape and size to each individual electrode X to be inspected, but is formed by two or more electrodes X to be inspected. A state in which one common inspection electrode Y corresponds to the inspection electrode group, in other words, the common inspection electrode Y
Are formed as electrodes having a shape, a size, and a position that are in common contact with the plurality of electrodes X to be inspected belonging to the electrode group to be inspected.

More specifically, in the example of FIG.
The common inspection electrode (a) has four electrodes to be inspected (1 to 4).
The common inspection electrode (b) is formed in a band-like shape and a dimension arrangement position so as to commonly cover the electrode group to be inspected constituted by the electrodes to be inspected.
7) are formed in a shape and a dimension arrangement position so as to commonly cover the electrode group to be inspected constituted by 7);
The same applies to the other common inspection electrodes (ci).

When the common inspection electrode Y is brought into contact with the substrate to be inspected for inspection, mutually independent wiring nets formed on the substrate to be inspected are electrically connected to each other via the common inspection electrode. It must be formed in such a state that a closed circuit is not formed. That is, since each of the common test electrodes Y is electrically connected to all of the specific plurality of test electrodes X at the same time, the test electrode group related to a certain common test electrode Y is The plurality of electrodes X to be inspected must belong to mutually independent wiring nets.

Referring to the example of FIG. 3, for example, four electrodes to be inspected (1 to 4) corresponding to the common inspection electrode (a) are:
It is necessary to belong to four independent wiring nets, otherwise, for example, the electrode under test (2)
If the common inspection electrode (a) comes into contact with the electrodes to be inspected (1 to 4) when both the electrode and the electrode to be inspected (3) belong to the same wiring net, ) And the wiring net related to the electrode under test (3) are short-circuited via the common inspection electrode (a), so that an electrical closed circuit is formed. Inspection becomes impossible.

The first inspection jig substrate is formed with the common inspection electrodes Y in a state where the above conditions are satisfied, and by using this, all wirings of the inspection target substrate are formed. The required continuity test on the net can be performed.

More specifically, referring to the example of FIG.
Now, assuming that the substrate to be inspected is wired as shown by the thin line L, in order to perform a required inspection, that is, a continuity inspection between the electrodes X to be inspected relating to all the wirings, as in the related art, It is sufficient for each of the independent wirings to check for continuity in all electrode pairs belonging to the wiring.

However, when the first inspection jig substrate is used, an equivalent inspection can be performed without performing the inspection for every electrode pair to be inspected. For example, inspecting the presence / absence of continuity between the common inspection electrodes (a) and (g) is based on the presence / absence of continuity between the inspected electrode (3) and the inspected electrode (18) electrically connected thereto. Inspection of the presence or absence of continuity between the common inspection electrodes (b) and (g) is equivalent to inspecting the inspected electrode (3) and the inspected electrode ( 19) It is equivalent to checking whether there is continuity between them. In the same manner, by inspecting the presence or absence of continuity of all combinations of the common inspection electrode Y and other non-common inspection electrodes Z on the inspection jig substrate, the continuity of each inspected electrode pair is determined. The result is equivalent to that obtained when the presence or absence is checked.

As described above, according to the first inspection jig substrate, the following effects can be obtained. (A) As an inspection jig substrate for performing a continuity inspection required for a substrate to be inspected, a substrate in which the electrodes for inspection are arranged at a pitch larger than the minimum pitch of the electrodes to be inspected on the substrate to be inspected. Since it can be used, the load in designing the wiring in the inspection jig substrate is greatly reduced, and the load in manufacturing the inspection jig substrate is reduced. The conditions for the alignment are relaxed. (B) It is possible to conduct a continuity test on a substrate to be inspected having electrodes to be inspected whose number is equal to or greater than the inspection capacity of the tester.

As is clear from the above description with reference to FIG. 3, in the first inspection jig substrate, it is necessary to inspect the electrical continuity between all the electrode pairs to be inspected on the substrate to be inspected. The number of test electrodes (including the common test electrode) to be provided on the first test jig substrate is significantly smaller than the number of test electrodes. As a result, in the first inspection jig substrate, the number of terminal electrodes (grid electrodes) to be connected to the tester can be made smaller than the total number of electrodes to be inspected, and as a result, the testable capacitance is reduced. Even with a small number of testers, it is possible to perform a continuity test on a larger number of electrode pairs to be tested.

As described above, the first inspection jig substrate is
It is characterized in that a common inspection electrode that acts in common on a plurality of electrodes to be inspected belonging to one electrode group to be inspected is provided, and such a correspondence between the electrodes for inspection and the electrodes to be inspected is realized. In order to perform the inspection, it is not always necessary that the plurality of electrodes to be inspected belonging to one electrode group to be inspected are located close to each other and arranged in one integrated region, and one electrode to be inspected is electrically connected. What is necessary is just to comprise an electrode group.

In the above jig board for inspection,
Further, the inspection electrodes (including the common inspection electrode) arranged at the separated positions can be connected to each other by additional connection wiring. In this case, the number of terminal electrodes to be provided on the first inspection jig substrate is further reduced. Since the total number of independent inspection electrodes can be reduced in this manner, the pitch between the inspection electrodes can be increased, and the wiring design can be facilitated. Furthermore,
By lowering the wiring density, it becomes possible to form thicker wiring lines and large-diameter via holes, and to set required wiring by using a board with a smaller number of stacked layers. Will also reduce the load in the fabrication of. As the total number of test electrodes increases and the density increases, on a single substrate, the test electrodes arranged on one surface and the terminal electrodes (grid electrodes) on the other surface are efficiently wired so that electric power is supplied. This is because the wiring work for making the connection is difficult.

As described above, according to the first inspection jig substrate, the number of inspection electrodes can be reduced.
While reducing the capacity of the tester and the load in the design and fabrication of the test jig substrate, and with the conditions for the alignment between the test jig substrate and the test substrate being relaxed, one test It is clear that the required jig substrate can be used to perform a required continuity test on all of the electrodes to be inspected on the substrate to be inspected.

On the other hand, in the first inspection jig substrate,
Since the common inspection electrode is electrically connected to a plurality of electrodes to be inspected in common, the presence or absence of an insulation state between each of the wiring nets (wiring patterns) independently formed in the substrate to be inspected is determined. No test results can be obtained. However, this insulation test is also essential. The second inspection jig substrate is for performing the insulation inspection. The second inspection jig substrate is configured such that an appropriate one of a large number of electrodes to be inspected belonging to each of continuous wiring nets forming one electric line is connected to each of the wiring nets on the inspection target substrate. The selected electrodes are selected as representative electrodes to be inspected, and an inspection electrode corresponding to each of the representative electrodes to be inspected is provided as a representative electrode for inspection. By using the jig substrate for insulation inspection, a required insulation inspection can be reliably performed.

Here, since the representative electrode to be inspected may be any one of those in each wiring pattern, for example, the electrode to be inspected having the largest dimension or the electrode to be inspected having the largest distance between adjacent electrodes is selected. The inspection electrode in the second inspection jig substrate, that is, the representative inspection electrode, has a considerably smaller arrangement density than the electrode to be inspected on the inspection substrate. The dimensions of the electrodes can be large and therefore their design and fabrication are very easy.

According to the first inspection jig substrate and the second inspection jig substrate, the restrictions in the design and fabrication of each substrate are greatly relaxed, and the degree of freedom is extremely large. The overall practical benefit, such as reduction and shortening of the period, is much greater, even when considering the disadvantage of having to perform both continuity and insulation tests. can get.

As described above, the first inspection jig substrate and the second inspection jig substrate are basically very excellent in that great profit can be obtained. When manufacturing, it turned out that there were some major problems.

For example, based on the principle of each inspection jig substrate described above, when a specific design of an inspection jig substrate for inspecting a specific inspection substrate is performed manually, the inspection substrate may be inspected. It takes several days or more to analyze the electrical connection state of the electrodes to be inspected, and furthermore, the work to determine the position and shape of the electrode for common inspection considered to be optimal, and the results obtained from these operations It is necessary to perform an input operation to record the information on a computer for a subsequent process.

In particular, in the operation of determining the condition of the common inspection electrode on the first inspection jig substrate, specifically, the size and position of the common inspection electrode, the inspection target electrode corresponding to one common inspection electrode It is necessary to determine the conditions of the common inspection electrode so that the number of the electrodes to be inspected belonging to the group is larger. On the other hand, if the conditions of the common inspection electrode are carelessly determined, the Electrodes may also occur. Therefore, this operation must be performed carefully by a person who fully understands the purpose and principle of the operation, and depends on the size of the substrate to be inspected and the complexity of the electric circuit. A period of about a week is required.

In general, the basic rules in designing a printed circuit board include the type of equipment (for example, a telephone, a controller of a machine tool, a game machine, etc.) into which the printed circuit board is incorporated, and the application (for consumer equipment, industrial, military, etc.). For example), the type of electrical signal to be processed (analog signal or digital signal, or a mixture of both), and the use environment (portable or stationary), etc. As a result, the content of the design of the substrate to be inspected (the number, shape, size, arrangement of the electrodes, and the network that is the electrical connection between the electrodes) varies widely, and in all cases, unconditional There is no common inspection jig substrate information forming method that can be adapted to the above.

[0038]

As described above, in the production of the first inspection jig substrate, compared with the conventional inspection jig substrate having inspection electrodes corresponding to each one of the electrodes to be inspected. In particular, there is a problem that an extremely long working process is required for the design. On the other hand, in the production of the second inspection jig substrate having the representative inspection electrode,
This is basically the same as the case of the first inspection jig substrate.

The present invention has been made in order to solve the above-mentioned problems, and a first object of the present invention is to provide information on a common inspection electrode very easily in correspondence with an actual substrate to be inspected. It is an object of the present invention to provide an information generating method for producing a jig substrate for printed circuit board inspection that can be generated in a computer. A second object of the present invention is to provide a printed circuit board inspection jig substrate having a common inspection electrode manufactured according to the information obtained by the above method, and to provide an inspection object using the inspection jig substrate. An object of the present invention is to provide a printed circuit board inspection method for performing a continuity inspection of a substrate.

A third object of the present invention is to provide a printed circuit board inspection tool capable of extremely easily generating information on a representative inspection electrode and information on a monitor inspection electrode corresponding to an actual substrate to be inspected. Another object of the present invention is to provide an information generation method for manufacturing a component substrate. A fourth object of the present invention is to provide a printed circuit board inspection jig substrate having a representative inspection electrode and a monitor inspection electrode manufactured according to the information obtained by the above method, and the inspection jig substrate To provide a printed circuit board inspection method for performing an insulation inspection of a substrate to be inspected by using the method.

A fifth object of the present invention is to provide an information generating method for producing both the first inspection jig substrate and the second inspection jig substrate, and a second method for the continuity inspection obtained thereby. It is an object of the present invention to provide a method of inspecting a substrate to be inspected using the first inspection jig substrate and the second inspection jig substrate for insulation inspection.

[0042]

According to the present invention, there is provided a method for producing a jig board for producing a printed circuit board inspection, comprising an inspection electrode at a position corresponding to a plurality of electrodes to be inspected on a printed circuit board to be inspected. , At least one of the test electrodes is a common test electrode having a shape corresponding to a test electrode group composed of two or more test electrodes, and the common test electrode is used for testing. When the printed wiring board is brought into contact with the printed wiring board, the independent wiring nets formed on the printed wiring board are formed so as not to form an electric closed circuit through the common test electrode. (1) Using the geometric information and mutual electrical connection information of all the electrodes to be inspected on the inspected printed circuit board to manufacture the printed circuit board inspection jig substrate A grouping process for forming at least one electrode group to be inspected comprising a plurality of electrodes to be inspected, and (2) a state in which all the electrodes to be inspected belonging to one electrode group to be inspected are electrically connected. And a common electrode forming process for forming one virtual common electrode to generate information about the common inspection electrode.

The jig board for printed circuit board inspection of the present invention comprises:
It is characterized by having a common inspection electrode made by the information generated by the above method.

A method of inspecting a printed circuit board according to the present invention is characterized in that a continuity test of a printed circuit board to be inspected is performed using the above jig substrate for inspecting a printed circuit board.

The information generating apparatus according to the present invention includes an inspection electrode at a position corresponding to a plurality of electrodes to be inspected on a printed circuit board to be inspected, and at least one of the inspection electrodes has two or more electrodes. A common inspection electrode having a shape corresponding to the electrode group to be inspected constituted by the electrodes to be inspected. When the common inspection electrode comes into contact with the inspection target printed board for inspection, Independent wiring nets formed on the substrate are used for producing a printed circuit board inspection jig substrate formed without forming an electrically closed circuit with each other via the common inspection electrode. An information processing apparatus comprising: (1) a plurality of electrodes to be inspected using geometric information and mutual electrical connection information about all electrodes to be inspected on a printed circuit board to be inspected; (2) one virtual common corresponding to a state where all of the electrodes to be inspected belonging to one electrode group to be inspected are electrically connected to each other; A common electrode formation processing function of forming an electrode, and generating information on a common inspection electrode.

The method for generating information for producing a jig for printed circuit board inspection according to the present invention includes an electrode for inspection, and at least one of the electrodes for inspection is provided with an independent wiring formed on a printed circuit board to be inspected. A printed board inspection jig formed as a representative inspection electrode electrically connected to the representative inspection electrode at a position corresponding to the representative inspection electrode consisting of only one inspection electrode belonging to each of the nets (1) For each independent wiring net formed on the printed circuit board to be inspected, only one of a plurality of electrodes to be inspected belonging to the wiring net is selected as a representative electrode to be inspected. (2) an electrode to be inspected, which is different from the representative electrode to be inspected among the electrodes to be inspected formed on the printed circuit board to be inspected; A monitor inspected electrode selection process of selecting at least one electrode to be inspected from the electrodes to be inspected that is electrically connected to the electrode as a monitor electrode to be inspected. Generating information on the inspection electrode for use.

The jig board for printed circuit board inspection of the present invention comprises:
It has a representative test electrode and a monitor test electrode produced by the information generated by the above method.

A method of inspecting a printed circuit board according to the present invention is characterized in that an insulation test of a printed circuit board to be inspected is performed by using the above-described jig substrate for inspecting a printed circuit board.

The information generating apparatus according to the present invention comprises an inspection electrode, and at least one of the inspection electrodes is a single electrode belonging to each of independent wiring nets formed on the printed circuit board to be inspected. Information processing used for manufacturing a printed circuit board inspection jig board formed as a representative inspection electrode electrically connected to the representative electrode to be inspected at a position corresponding to the selected electrode to be inspected. An apparatus for: (1) selecting, for each independent wiring net formed on a printed circuit board to be inspected, only one of a plurality of electrodes to be inspected belonging to the wiring net as a representative electrode to be inspected; An inspection electrode selection processing function, and (2) an electrode to be inspected, which is different from the representative electrode to be inspected, among the electrodes to be inspected formed on the inspected printed circuit board; A monitoring electrode to be inspected selection function of selecting at least one electrode to be inspected as an electrode to be monitored from the electrodes to be inspected that are electrically connected to each other; Generating information on the inspection electrode for use.

In the information generation method according to the present invention, the above-described grouping process and common electrode forming process are performed.
It is preferable to perform the above-described representative inspection target electrode selection processing and monitoring inspection target electrode selection processing.

The information processing apparatus of the present invention preferably has the above-described grouping processing function and common electrode formation processing function, and the above-described representative inspection electrode selection processing function and monitor inspection target electrode selection processing function. . In the printed board inspection method of the present invention, it is preferable to perform the above-described continuity inspection and insulation inspection on the inspected printed board.

According to the present invention, when manufacturing the first inspection jig substrate and the second inspection jig substrate, information on the electrodes to be inspected on the substrate to be inspected is processed and In order to generate information on the common inspection electrode, the representative inspection electrode, and the monitoring inspection electrode corresponding to the electrode to be inspected, a plurality of processing means and setting of conditions are prepared, and these are arbitrarily switched and applied. By doing
Even for many types of substrates to be inspected, information can be processed so as to obtain optimum results according to the intended purpose, and therefore, the intended inspection jig substrate can be obtained very easily. be able to.

[0053]

BEST MODE FOR CARRYING OUT THE INVENTION The basic circumstances of two types of jig substrates to which the present invention is applied are as follows. (A) First inspection jig substrate for continuity inspection In the first inspection jig substrate for continuity inspection, a common inspection electrode is provided according to specific conditions. There are three. (A) Each of the common inspection electrodes is to be in contact with a plurality of electrodes to be inspected at the same time. (B) The electrode to be inspected belongs to any of the wiring nets on the substrate to be inspected, but the wiring nets to which the plurality of electrodes to be inspected corresponding to one common inspection electrode belong are mutually independent. thing. (C) When the inspection jig substrate and the substrate to be inspected come into contact with each other for electrical inspection, a circuit constituted by the wiring net on the inspection substrate and the inspection electrode of the inspection jig substrate Neither should constitute a closed circuit.

According to the inspection jig substrate having the inspection electrodes formed in accordance with the above conditions (a) to (c), the continuity inspection of all the wiring nets on the inspection target board is performed independently for each wiring net. This is shown in FIG.
It is clear from the above description of the example. That is, in FIG. 3, one electrode to be inspected, such as the electrode to be inspected (3), and another electrode to be inspected, for example, (1
Inspection of the presence or absence of continuity between the test target electrode (3) and the other test target electrode (a) corresponds to the test target electrode group to which the one test target electrode (3) belongs. 1
8) inspecting the presence or absence of conduction between the common inspection electrode (g) corresponding to another electrode group to be inspected to which belongs;
Are equivalent. Therefore, instead of conducting a continuity test for each pair of electrodes to be inspected, if all the combinations of the electrodes for inspection on the inspection jig board are inspected, exactly the same result as when inspecting each pair of electrodes to be inspected is obtained. Is obtained. In this way, the continuity test for all the wiring nets on the test substrate can be performed without fail.

(B) Second inspection jig substrate for insulation inspection In designing the second inspection jig substrate for insulation inspection,
From the respective wiring nets on the substrate to be inspected, only one electrode to be inspected is selected as a representative electrode to be inspected. That is, in the insulation test, a voltage is not detected between any of the other representative electrodes under inspection in a state where a voltage is applied to the representative electrode under inspection in the wiring net to which the electrode under inspection to be inspected belongs. Is performed by sequentially repeating the operation of confirming the above for all the representative electrodes to be inspected. Then, when the above-described confirmation operation for all combinations of the representative electrodes to be inspected is completed, the intended insulation inspection is completed. According to this insulation inspection, the following effects can be obtained. The tester in the substrate inspection apparatus can have a capacitance smaller than the capacitance corresponding to the electrode to be inspected on the substrate to be inspected.・ The electrode pitch of the test electrode on the test jig board
It can be larger than the minimum pitch of the electrodes to be inspected on the substrate to be inspected.

With the above circumstances as background, the present invention will be specifically described. In the present invention, for a certain substrate to be inspected, a first inspection jig substrate used for continuity inspection and a second inspection jig substrate used for insulation inspection are basically manufactured. , The following steps are performed. (1) Step of inputting information about electrodes to be inspected on a substrate to be inspected (2) Step of generating information about electrodes for inspection of a first inspection jig board (3) Inspection of second inspection jig board Step of Generating Information on Electrodes for Use (4) Step of Outputting Generated Information Hereinafter, each of these steps will be described in detail.

(1) Step of inputting information about electrodes to be inspected on the substrate to be inspected This step involves the relative positions of the electrodes (electrodes to be inspected) on a specific printed circuit board (substrate to be inspected) to be inspected. , Shape, size and other geometrical information, as well as electrical connection information between electrodes (ie, information on conduction or insulation state) as basic information, a computer,
This is a step of reading into an arbitrary medium processed by another information processing device. The information source to be input in this step is not particularly limited as long as the above-mentioned information on the board to be inspected can be obtained. The information obtained by doing so can be used. In addition, the information of the inspection jig substrate for inspecting the target substrate to be inspected by the conventional method is also substantially equivalent to the above information of the electrode to be inspected. It can also be an information source.

As means for reading basic information, removable hard disk, floppy disk, M
Although a method using a recording medium such as O, a magnetic tape, and a CD-R is generally used, as an input means, direct reading can be performed by communication means such as the Internet, a LAN, and personal computer communication. Although manual input is possible, it takes a long time and the possibility of erroneous input is high. Therefore, it is disadvantageous except in the case of slight correction when there is a design change.

(2) Step of Generating Information on Inspection Electrodes of First Inspection Jig Substrate This step is performed by adding the geometric information and the electrical connection information on the electrodes to be inspected in the step (1). This is a step of performing a process of converting some of the electrodes to be inspected into information on a common inspection electrode corresponding thereto as a group. This process is divided into two stages, a grouping process for forming the electrode group to be inspected and a common electrode forming process.

(2-1) Grouping Processing Effectively improve the capacity (capacity) of a printed circuit board inspection apparatus actually used for inspecting a substrate to be inspected and the capacity of wiring between the inspection jig substrate and the substrate to be inspected. The electrodes to be inspected are grouped so as to obtain high inspection efficiency. Specifically, grouping is performed according to the following conditions by a procedure described later.

A: Conditions of the electrodes to be inspected to belong to the same group For all or a part of the electrodes to be inspected, mainly the actual electrodes such as the size, relative position, shape, and distance between adjacent electrodes, etc. Based on the biological information, a plurality of electrodes to be inspected to belong to a single group are selected. More specifically, at least one or more items selected from the following condition items are applied, and a plurality of electrodes to be inspected belong to the same group. The numerical value shown in each item is an example of the threshold value, and is not absolute or restrictive. When a plurality of items are applied in combination, more favorable results can be obtained by weighting each item as needed. An electrode group having a short electrode center distance (for example, 10
00 μm or less). -The distance between adjacent electrodes is small (for example, 500 μm or less). An electrode group that exists in a narrow area at a high density (for example, 30 electrodes / cm ² or more). An electrode group having a specific arrangement such as a grid-like electrode corresponding to an integrated circuit. In addition, the electrode group is particularly suitable to be grouped.

B: Conditions of electrodes to be inspected to be excluded from the same group The same or all of the electrodes to be inspected are mainly determined based on the electrical connection information so as to enable electrically independent inspection. The electrodes to be inspected to be excluded from the group are selected. Normally, all of the items of the following conditions are applied, and the corresponding electrodes to be inspected are excluded. However, in the case where it is clear that no disconnection has occurred in the manufacturing, the applicable item may not be applied. -One of the electrodes included in the same wiring net. -Electrodes that are electrically connected via other groups. -Electrodes that are particularly unsuitable for grouping.

C: Other Conditions Although not essential conditions for the grouping process, the following conditions can be added. This makes it possible to perform grouping processing quickly and accurately,
Further, it is possible to more easily execute the inspection and analyze the inspection result. The items of these conditions are applied alone or in combination. When applied in combination, more favorable results can be obtained by weighting each item. Also, unlike the items belonging to a or b described above, there are cases where the above is not applied at all.

These restrictions include, for example, a restriction by setting one or both of an upper limit and a lower limit, a restriction by setting and setting a certain allowable range or a prohibited range, and the like. You can also set it. Actually, each limit may be given as a direct limit in the form of number, area, etc., but as an indirect limit in the form of the total number of electrodes to be inspected, the ratio to the area, etc., the electrode density, etc. May be given. -Limit the total number of electrodes belonging to one group. -A limit is imposed on the total number of electrodes that are grouped on the whole substrate to be inspected. -Limit the area occupied by one group. -Limit the total number of groups created. -Limit the distance between generated groups and the size of the interval. -With the generated groups and the electrodes to be inspected which do not belong to the groups as elements, the distance between them and the size of the intervals are limited. -A limit is imposed on the total number of electrodes that are grouped to form one wiring net.

The procedure for forming a group by applying the above items to the electrodes to be inspected on the substrate to be inspected can be selected from the following three methods depending on the order of application. The items belonging to a and the items belonging to b are sequentially applied to all the electrodes on the substrate to be inspected simultaneously, and grouping and exclusion are performed simultaneously. First, the items belonging to a are sequentially applied to all the electrodes on the substrate to be inspected, and a temporary group is created.
By excluding the electrodes corresponding to the items belonging to b, a final group is obtained. First, the electrodes belonging to b are sequentially applied to all the electrodes on the substrate to be inspected to exclude electrodes inappropriate for grouping, and then the items belonging to a are applied to the group. Become

The procedure of the actual process is simple, and standard results can be obtained for the amount of the common inspection electrode corresponding to the group of the electrodes to be generated and the speed of the grouping process. Can be In the procedure,
The quality of the generated common test electrode is better than in the case of, but requires a large working area in the processing system. In the above procedure, the speed of the grouping process is high, but when the arrangement of the electrodes to be inspected is complicated, there is a possibility that an electrode that newly corresponds to the item belonging to b may be generated by grouping. It is preferable to check again. Based on the above, the procedure should be selected when the jig board design system has sufficient processing speed and work area for the complexity and scale of the board to be inspected, and otherwise. Is preferred.

Further, as a method for excluding the electrode corresponding to the item belonging to b, the following two types can be selected. -A method of simply excluding from the applicable group or grouping candidate. -How to divide a group into multiple. In this electrode exclusion process, there is a case where there is a choice of an electrode to be excluded and an exclusion method. In such a case, in addition to the electrical connection information of the electrode, the size, shape, and relative size of the electrode are determined. The electrodes to be actually excluded and the method of exclusion can be determined with reference to geometrical information such as the positional relationship, the distance between adjacent electrodes, and the regularity of the arrangement when a particular arrangement is followed.

In the above description, in order to facilitate understanding,
Although the case in which the entirety of the electrodes to be inspected on the substrate to be inspected is processed as one unit has been described, the substrate to be inspected is divided into a plurality of blocks, and the same grouping processing as described above is sequentially performed on the electrodes in each block. An execution method can also be adopted. The method of processing for each block has an advantage that the work area required for the information processing device and the processing system may be small, but the group is necessarily divided at the boundary of the block. Need to be considered. As for the items belonging to c, it is necessary to apply the restriction at an appropriate timing for each item as the processing proceeds.

In the above grouping processing, the item or procedure selected for the processing does not match the target substrate to be inspected, and therefore, the processing is not completed or the processing is completed. May not be able to achieve the expected result, but in such a case, change the threshold value as a criterion or change the combination of items, and then repeat the process. By doing so, the desired result can be obtained.

(2-2) Common Electrode Forming Process The process of electrically connecting the electrodes (electrodes to be inspected) belonging to the same group to each other and forming one virtual common electrode by the above grouping process. is there. By performing this process, direct information on the common inspection electrode of the target inspection jig substrate, that is, its geometric information and electrical connection information can be obtained. As the means for forming the common electrode, there are roughly three methods as shown below.

A: Means for simply electrically connecting. In this means, for example, in the display of the inspection jig substrate on which the electrodes to be inspected are displayed, an operation of connecting the electrodes belonging to one group with a line having an actual width is performed.

B: A means for assuming an arbitrary area corresponding to each of the electrodes belonging to one group and utilizing the overlap. Specifically, there are the following means. b-: Draw a circle of an appropriate radius centered on a certain point in each region of the electrodes belonging to one group, obtain a state where a circle by one electrode overlaps a circle related to any other electrode, Means for setting the region inside the outer contour as a common electrode forming region. b- For each of the electrodes belonging to one group, by performing an operation of enlarging the outline while maintaining the similar shape, a region related to one electrode overlaps a region related to any other electrode. Means for determining the area within the outer contour as a common electrode forming area.

C: Means for finding a polygonal common electrode formation area that includes all the electrodes belonging to one group. Specifically, there are the following means. c-1 A means for setting a rectangular, circular or other shaped area surrounding all the electrodes belonging to one group, and using this area as a common electrode forming area. c- Set a polygon circumscribing each of the electrodes belonging to one group, and in any two pairs of all polygons, a straight line connecting all vertices of one polygon and all vertices of the other polygon The task of listing all of
A means for performing for all pairs of polygons, excluding those that intersect each other from all of the resulting straight line groups, and setting a region surrounded by a composite polygon formed by the remaining straight line groups as a common electrode formation region . c-1 A polygon circumscribing each of the electrodes belonging to one group is set, and one of the vertices located at the end along the set X-axis or Y-axis is set as a starting point, clockwise or counterclockwise. Means for defining a region surrounded by a composite polygon formed by sequentially connecting the outermost points among points within a certain distance by a straight line as a common electrode formation region.

These methods can be used properly according to the individual state of each group, and it is not necessary to apply a specific means to one test substrate in a unified manner. Also,
In some cases, the obtained common electrode formation region includes an unnecessary portion with respect to the actually required inspection electrode formation region. In this case, the unnecessary portion may be deleted. it can.

In any case, depending on the shape, size, relative positional relationship, etc. of the electrodes belonging to one group, the electrodes may actually deviate from the formed common electrode formation region. There is a possibility that an electrode that is in contact with or overlaps with an electrode that is present or an electrode of another adjacent common electrode formation region may occur. For this reason, it is necessary to confirm that such a problem does not occur, and if there is a problem, it is desirable to provide a system that changes the conditions and method and performs the process again.

(3) Step of Generating Information on Inspection Electrodes of Second Inspection Jig Substrate This step includes the geometric information and the electrical connection information on the electrodes to be inspected in the above step (1). This is a step of generating information for producing a second inspection jig substrate used for insulation inspection for confirming insulation between wiring nets on the inspection target substrate. This step is
A representative inspection target electrode selection process for selecting a representative inspection target electrode for applying a voltage to a wiring net to be inspected, and when the representative inspection target electrode is correctly contacted with the inspection jig substrate, the representative inspection target electrode (Electrode for inspection), and a process for selecting an electrode to be inspected for monitoring to select an electrode to be inspected for monitoring to confirm that the electrode is electrically connected to the electrode.

(3-1) Representative Inspection Electrode Selection Process The representative inspection electrode is an electrode for applying an inspection voltage to each of the wiring nets on the inspection target substrate to be inspected. One electrode is selected. The representative electrode to be inspected can also be used as a probe electrode for detecting a short-circuit state with another wiring net.

As the representative electrode to be inspected, an electrode to be inspected satisfying the following conditions is selected. An electrode having a size that ensures sufficient mechanical contact with the inspection electrode to achieve stable electrical connection. Therefore, usually, the electrode having the largest area in each wiring net is set as the representative electrode to be inspected.・ A contact with the inspection electrode can be easily achieved.
The electrodes must be square or circular. -The electrode must be located in a region where the electrode density is low.

(3-2) Monitor Inspection Electrode Selection Process The monitoring electrode to be inspected is selected from the electrodes to be inspected which are electrically connected to the representative electrode to be inspected. Using a monitor test electrode formed on the test jig substrate corresponding to the monitor test target electrode and a representative test electrode formed on the test jig substrate corresponding to the representative test target electrode It is possible to check the conduction state between the monitoring target electrode and the representative target electrode, whereby the representative target electrode is correctly in contact with the representative target electrode,
As a result, it can be confirmed that a required voltage is applied to the target wiring net or a current is flowing. Ideally, one monitor electrode to be inspected should be selected for each wiring net in order to check the electrical connection with the representative test electrode. However, several to more than ten are sufficient.

It is preferable that the following conditions are satisfied in selecting the monitoring target electrode. • The monitored electrode to be inspected must be smaller than the representative inspected electrode. The monitored electrode to be inspected is an electrode having a shape such as a square or a circle that can easily achieve contact with the monitored electrode. A part of the plurality of electrodes to be inspected for monitoring is usually present at four corners of the substrate to be inspected or an area close thereto. The monitoring target electrodes are distributed over the entire target substrate.

By selecting a monitoring target electrode that satisfies the above conditions, it is ensured that the representative inspection electrode on the inspection jig substrate is electrically connected to the representative inspection electrode existing over the entire target substrate. The state of electrical connection is checked by checking the presence or absence of electrical connection between the monitored electrode to be inspected and the inspection electrode for monitoring of the inspection jig substrate. It is guaranteed with sufficient accuracy.

(4) Step of Outputting Generated Information Step of outputting the information obtained in the information generation step of (2) above as information for designing a first inspection jig substrate, and This is a step of outputting the information obtained in the information generation step (3) as information for designing a second inspection jig substrate.

In designing the first inspection jig substrate,
A single virtual common electrode may be specifically assumed by the common electrode formation process, and an actual common inspection electrode may be manufactured corresponding to a region occupied by the common electrode, that is, a common electrode formation region. Therefore, when the geometric information and the electrical connection information relating to the common electrode generated by the above-described processing are output, the geometric information and the electrical connection information are output from the common inspection electrode to be formed on the first inspection jig substrate. Geometric information for actually determining conditions such as size,
Further, it is specific information for obtaining an electrical connection state to be achieved in the common inspection electrode. Therefore,
Utilizing this information, a first inspection jig substrate for continuity inspection for a target substrate to be inspected can be designed. In a normal case, the inspection jig substrate also has a non-common inspection electrode corresponding to the electrode to be inspected, in addition to the common inspection electrode. The electrical connection information naturally includes the inspection electrode.

In the above description, it is preferable that additional information indicating the belonging relationship between the common inspection electrode to be formed and the corresponding electrode to be inspected is output together with the output information. Further, it is more preferable that the electrical connection information between the electrodes to be inspected which are brought into a conductive or insulated state by the common inspection electrode to be formed is output. Outputting such additional information has, for example, the advantage that data used for inspection in a substrate inspection apparatus can be generated from such information.

In designing the second inspection jig substrate,
When the geometric information and the electrical connection information of the selected representative electrode to be inspected and the monitored electrode to be inspected are output, this information is output to the representative inspection electrode and the monitor to be formed on the second inspection jig substrate. Geometric information for actually determining conditions such as the position, shape, and size of the test electrode, and for obtaining the electrical connection state to be achieved in the representative test electrode and the monitor test electrode. Is specific information. Therefore, using this information, it is possible to design a second inspection jig substrate for insulation inspection for a target substrate to be inspected.

The information in each of the steps described above does not necessarily need to be collected in one file, but may be divided into a plurality of files according to the nature and importance of the information and the next step. Information output means include removable hard disk, floppy disk, M
O, a magnetic tape, a writable recording medium such as a CD-R can be used,
It is also possible to directly output to a computer that controls the next process by communication means such as LAN and personal computer communication. In addition, necessary information may be displayed on a display so that the operator can check the progress of the process and the result.

In the above, identification marks for individually specifying the electrodes to be inspected, the group of electrodes to be inspected, the representative electrodes to be inspected, and the electrodes to be monitored on the substrate to be inspected are previously assigned, The indicators can indicate or specify each of the outputs or inputs. In this case, a number, a symbol such as a character, an individual name, or another code can be used as the identification mark.

By the processes in the above steps (1) to (4), information necessary for actually producing the first inspection jig substrate and the second inspection jig substrate, especially To generate in a very short time specific and direct information about the common test electrode, representative test electrode and monitor test electrode to be performed, that is, their geometrical information and electrical connection information. A few minutes to ten and several minutes are sufficient.

The combination of conditions and thresholds used in each stage of the processing in each of the above processes need to be incorporated in the information processing apparatus or processing system in advance. However, if the setting can be changed as necessary, it is possible to execute exceptional processing,
This is advantageous in that the range of the target substrate to be inspected becomes wide.

Usually, it is necessary to prepare and use a first inspection jig substrate and a second inspection jig substrate as a set. It is preferable that the setting is made so as to automatically execute the entire processing by all the steps. However, there is a case where only one of the continuity test and the insulation test needs to be performed on the substrate to be inspected. In such a case, the first inspection jig substrate and the second inspection jig substrate are required. The processing system can be configurable to accommodate either one or the other design. Further, in each of the above steps, it is also possible to perform information processing so that a plurality of results are created under different setting conditions,
In this case, an inspection jig substrate having high reliability can be obtained by selecting and using an optimal one by comparing the respective design contents.

The first inspection jig substrate and the second inspection jig substrate are manufactured according to the design contents based on the information generated as described above. As a specific production means, a conventionally known means can be used. Using the first inspection jig substrate and the second inspection jig substrate thus manufactured, a continuity inspection and an insulation inspection are respectively performed on the substrate to be inspected for which basic information has been obtained. Is

In the continuity inspection, the first inspection jig substrate has a common inspection electrode, and in the insulation inspection, the second inspection jig substrate has the representative inspection electrode and the monitor electrode. By having the electrode to be inspected,
The excellent effects described above can be obtained.
In addition, by performing both the continuity test and the insulation test, the electrical performance of the substrate to be inspected can be confirmed with sufficiently high reliability.

According to the method or the apparatus of the present invention, although it depends on the size of the substrate to be inspected and the complexity of the configuration of the wiring net, the necessary processing can be usually performed in several minutes to several tens of minutes. Since the result can be transferred to the next process as it is, it is possible to greatly reduce the required time and labor in designing and manufacturing the inspection jig substrate. Operators who are actually involved in information processing mainly work to supply information on the specified board to be inspected to the processing system of an information processing device such as a personal computer, and receive the information processing result as it is in the next process. It is a passing work, and it is not necessary to understand the principle and purpose inherent in this processing, it is sufficient to know the basic operation method of the information processing device, and it is necessary to be an expert or an expert. And any person can easily execute it.

[0094]

According to the present invention, geometric information and electrical connection information about an electrode to be inspected on a substrate to be inspected are read into an information processing apparatus such as a personal computer, and the electrode to be inspected is read based on this information. Performing the grouping process and the common electrode forming process, based on the information obtained as a result, specific information on the condition of the common inspection electrode to be formed on the inspection jig substrate is generated, By setting conditions necessary for processing of such information in the information processing apparatus or information processing system or as conditions to be selected, it is possible to easily and easily achieve the purpose and the purpose in a very short time. Generating geometric information and electrical connection information about a common test electrode to be formed on a test jig substrate for a continuity test. Kill.

Further, according to the present invention, geometric information and electrical connection information on an electrode to be inspected on a substrate to be inspected are read into an information processing apparatus, and based on this information,
The representative test electrode selection process and the monitor test electrode selection process for each wiring net are performed, and based on the information obtained as a result, the representative test electrode and the monitor test to be formed on the test jig substrate. Specific information on electrode conditions is generated, but conditions necessary for processing the information must be set in the information processing device or information processing system, or set as conditions to be selected. Thus, in a very short time, easily and easily, the geometric information and the electrical connection information about the representative test electrode and the monitor test electrode to be formed on the target test jig substrate for insulation test. Can be generated.

Further, according to the present invention, based on the information generated as described above, an inspection jig substrate for continuity inspection having an intended common inspection electrode, an intended representative inspection electrode, An inspection jig substrate having an inspection electrode for monitoring for insulation inspection can be extremely easily and easily manufactured, and the inspection jig substrate is highly reliable. Therefore, by using the inspection jig substrate, required continuity inspection and insulation inspection can be reliably and reliably performed on the substrate to be inspected.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a state in which an inspection electrode and a terminal electrode in an example of a conventional inspection jig substrate are overlapped with each other.

FIG. 2 is an explanatory diagram illustrating an outline of a configuration of a printed board inspection device.

FIG. 3 is an explanatory view showing a state in which an inspection electrode on an inspection jig substrate targeted by the method of the present invention and an electrode to be inspected on a substrate to be inspected are overlapped with each other.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Lower head 11 Upper head 12 Inspection jig board 20 Inspection board 16, 17 Connector sheet 19 Drive mechanism 22 Control computer 23 Control mechanism 24 Tester X Inspection electrode Y Common inspection electrode A Inspection head mechanism B Inspection control Mechanism 51 Test electrode 52 Terminal electrode 53 Printed wiring

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2G011 AA16 AA21 AB06 AB08 AC06 AC14 AE01 2G014 AA02 AA13 AA15 AB59 AC10 2G032 AA00 AF02 AF03 AL03 9A001 BB03 BB04 BB05 CC08 JJ46 JJ48 JJ50 JJ76 KK31 KK31 KK36

Claims (11)

[Claims] An inspection electrode is provided at a position corresponding to a position of a plurality of electrodes to be inspected on a printed circuit board to be inspected, and at least one of the electrodes for inspection is constituted by two or more electrodes to be inspected. A common inspection electrode having a shape corresponding to the electrode group to be inspected, and the common inspection electrode is formed on the inspection target printed board when the common inspection electrode is brought into contact with the inspection target printed board for inspection. In order to produce a printed circuit board inspection jig substrate in which independent wiring nets are formed without forming an electric closed circuit with each other via the common inspection electrode, (1) Print to be inspected Utilizing geometric information and mutual electrical connection information about all the electrodes to be inspected on the substrate, at least one electrode group to be inspected consisting of a plurality of electrodes to be inspected is formed. Performing grouping processing and (2) common electrode forming processing for forming one virtual common electrode corresponding to a state in which all of the electrodes to be inspected belonging to one electrode group to be inspected are electrically connected. A method for generating information for manufacturing a printed circuit board inspection jig substrate, wherein the method generates information on a common inspection electrode. 2. A jig substrate for printed circuit board inspection, comprising: a common inspection electrode made by information generated by the method according to claim 1. 3. A printed circuit board inspection method, wherein a continuity test of a printed circuit board to be inspected is performed using the printed circuit board inspection jig substrate according to claim 2. 4. An inspection electrode is provided at a position corresponding to a position of a plurality of electrodes to be inspected on a printed circuit board to be inspected, and at least one of the electrodes for inspection is constituted by two or more electrodes to be inspected. A common inspection electrode having a shape corresponding to the electrode group to be inspected, and the common inspection electrode is formed on the inspection target printed board when the common inspection electrode is brought into contact with the inspection target printed board for inspection. An information processing apparatus used for manufacturing a printed circuit board inspection jig substrate in which mutually independent wiring nets are formed without forming an electric closed circuit with each other via the common inspection electrode. (1) An electrode group to be inspected comprising a plurality of electrodes to be inspected by utilizing geometric information and mutual electrical connection information about all the electrodes to be inspected on a printed circuit board to be inspected. A grouping processing function for forming at least one; and (2) a common electrode for forming one virtual common electrode corresponding to a state in which all of the electrodes to be inspected belonging to one electrode group to be inspected are electrically connected. An information generating apparatus used for manufacturing a printed circuit board inspection jig substrate, the information generation apparatus having a formation processing function and generating information on a common inspection electrode. 5. An electrode for inspection, wherein at least one of the electrodes for inspection is a representative of only one electrode to be inspected belonging to each of independent wiring nets formed on a printed circuit board to be inspected. To produce a printed circuit board inspection jig substrate formed as a representative inspection electrode electrically connected to the representative electrode to be inspected at a position corresponding to the electrode to be inspected, A representative inspected electrode selection process for selecting, as a representative inspected electrode, only one of the plurality of inspected electrodes belonging to the interconnect net for each of the formed independent interconnect nets; Of the electrodes to be inspected, the electrodes to be inspected are different from the representative electrodes to be inspected, and at least one of the electrodes to be inspected electrically connected to any of the representative electrodes to be inspected. And a monitor inspection electrode selection process of selecting one of the electrodes to be inspected as the monitoring electrode to be monitored, thereby generating information about the representative inspection electrode and information about the monitoring inspection electrode. A method for generating information for producing a printed circuit board inspection jig substrate. 6. A jig board for printed circuit board inspection, comprising a representative inspection electrode and a monitor inspection electrode produced by the information generated by the method according to claim 5. 7. A method of inspecting a printed circuit board, comprising performing an insulation inspection of a substrate to be inspected using the jig substrate for printed circuit board inspection according to claim 6. 8. An electrode for inspection, wherein at least one of the electrodes for inspection is selected from only one electrode to be inspected belonging to each of independent wiring nets formed on a printed circuit board to be inspected. An information processing apparatus used for manufacturing a printed circuit board inspection jig substrate formed as a representative inspection electrode electrically connected to the representative inspection target electrode at a position corresponding to the inspection target electrode, 1) For each independent wiring net formed on the printed circuit board to be inspected, a representative inspected electrode selection processing function for selecting only one of the plurality of inspected electrodes belonging to the wiring net as a representative inspected electrode. (2) Of the electrodes to be inspected formed on the inspected printed circuit board, the electrodes to be inspected are different from the representative electrodes to be inspected, and are electrically connected to any of the representative electrodes to be inspected. And a monitor inspection electrode selection processing function of selecting at least one electrode to be inspected from the electrodes to be inspected as a monitoring electrode to be inspected, and information about the representative inspection electrode and information about the monitoring inspection electrode are provided. An information generation apparatus used for manufacturing a jig substrate for printed circuit board inspection, wherein the jig substrate is generated. 9. A grouping process and a common electrode forming process according to claim 1, and a representative electrode selecting process and a monitoring electrode selecting process according to claim 5 are performed. A method for generating information used for manufacturing a jig substrate for printed circuit board inspection. 10. A grouping processing function and a common electrode forming processing function according to claim 4, and a representative electrode selection processing function and a monitoring electrode selection processing function for monitoring according to claim 8. An information processing apparatus used for producing a printed circuit board inspection jig substrate. 11. A method for inspecting a printed circuit board, comprising performing the continuity test according to claim 3 and the insulation test according to claim 7 on a printed circuit board to be inspected.