JP2000232124A - Electronic parts loading device, and wire bonding device and method - Google Patents

Electronic parts loading device, and wire bonding device and method

Info

Publication number
JP2000232124A
JP2000232124A JP11034130A JP3413099A JP2000232124A JP 2000232124 A JP2000232124 A JP 2000232124A JP 11034130 A JP11034130 A JP 11034130A JP 3413099 A JP3413099 A JP 3413099A JP 2000232124 A JP2000232124 A JP 2000232124A
Authority
JP
Japan
Prior art keywords
component mounting
electronic component
electrodes
thin metal
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11034130A
Other languages
Japanese (ja)
Inventor
Hitoshi Iwata
仁 岩田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokai Rika Co Ltd
Original Assignee
Tokai Rika Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokai Rika Co Ltd filed Critical Tokai Rika Co Ltd
Priority to JP11034130A priority Critical patent/JP2000232124A/en
Publication of JP2000232124A publication Critical patent/JP2000232124A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05553—Shape in top view being rectangular
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/481—Disposition
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    • H—ELECTRICITY
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
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    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H—ELECTRICITY
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85385—Shape, e.g. interlocking features
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    • H01L2924/01004—Beryllium [Be]
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    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10162—Shape being a cuboid with a square active surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a wire bonding device where electrodes formed in an electronic parts loading device in different directions are jointed through a metallic thin wire. SOLUTION: A wire bonding device 1 is formed of a main body 3 which is arranged on a substrate 2 and is made in a trapezoid form, and a bonding head part 5 arranged in an X-Y table 4 installed on the main body 3. The bonding head part 5 is provided with a holder driving part 11, a tool holder 12, a capillary 13 and a clamper 14. An installation stand 21 is protrusively installed in the main body 3. A holding part 22 is formed in the flat part 21b of the installation stand 21. An electronic parts loading device 23 is held on the holding part 22. The installation stand 21 is set so that it turns with a line connecting the center of a base end part 21a and the electronic parts loading device 23 as an axial center. The axial center is set so that it becomes parallel to the direction of an arrow Y.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、電子部品搭載装
置、ワイヤ・ボンディング装置、及びワイヤ・ボンディ
ング方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus, a wire bonding apparatus, and a wire bonding method.

【０００２】[0002]

【従来の技術】従来のワイヤ・ボンディング装置におい
ては、金やアルミニウムなどからなる金属細線を、基板
等にそれぞれ設けられた電極間に接合することにより、
各電極間の導通を図るようになっている。2. Description of the Related Art In a conventional wire bonding apparatus, a thin metal wire made of gold, aluminum, or the like is joined between electrodes provided on a substrate or the like.
The connection between the electrodes is achieved.

【０００３】すなわち、例えば図５に示すように、電子
部品搭載装置６０は、チップ支持体６１と半導体チップ
６３とを備えている。チップ支持体６１上には複数の電
極６２が形成されている。また、同チップ支持体６１上
には半導体チップ６３が配設されている。この半導体チ
ップ６３上には、図６にも併せ示すように、各電極６２
と対応する電極６４が、各電極６２の表面が向く方向と
同一方向を向くようにそれぞれ形成されている。そし
て、チップ支持体６１側の各電極６２と半導体チップ６
３側の各電極６４とにそれぞれ金属細線６５が接合され
ている。これにより、電極６２と電極６４との導通が図
られている。[0005] That is, as shown in FIG. 5, for example, an electronic component mounting apparatus 60 includes a chip support 61 and a semiconductor chip 63. A plurality of electrodes 62 are formed on the chip support 61. A semiconductor chip 63 is provided on the chip support 61. As shown also in FIG. 6, each electrode 62 is provided on the semiconductor chip 63.
Are formed so as to face in the same direction as the direction in which the surface of each electrode 62 faces. Then, each electrode 62 on the chip support 61 side and the semiconductor chip 6
A thin metal wire 65 is joined to each of the electrodes 64 on the third side. Thus, conduction between the electrode 62 and the electrode 64 is achieved.

【０００４】[0004]

【発明が解決しようとする課題】ところで、一般に、ワ
イヤ・ボンディング装置は、図６に示すように、前記金
属細線６５を前記各電極６２，６４に接合するボンディ
ングヘッド６６を備えている。このボンディングヘッド
６６は、通常、同図に矢印Ｄで示すように、所定の方向
から各電極６２，６４に近接して金属細線６５を各電極
６２，６４に圧着するようになっている。このため、例
えば同図に２点鎖線で示すように、電極６２が電極６４
の表面と異なる方向を向いて形成されている場合には、
ボンディングヘッド６６によって電極６２に金属細線６
５を圧着することができないという不都合がある。Generally, a wire bonding apparatus includes a bonding head 66 for bonding the thin metal wires 65 to the electrodes 62 and 64, as shown in FIG. The bonding head 66 normally presses the fine metal wire 65 to each of the electrodes 62 and 64 in a predetermined direction, as shown by an arrow D in FIG. Therefore, for example, as shown by a two-dot chain line in FIG.
If it is formed facing different direction from the surface of
The thin metal wire 6 is applied to the electrode 62 by the bonding head 66.
5 cannot be crimped.

【０００５】本発明はこうした実情に鑑みてなされたも
のであり、その目的を以下に列挙する。 ［１］表面が異なる方向を向いてそれぞれ形成された各
電極同士が金属細線を介して接合された電子部品搭載装
置を提供すること。[0005] The present invention has been made in view of such circumstances, and its objects are listed below. [1] To provide an electronic component mounting apparatus in which respective electrodes formed with their surfaces facing different directions are joined via thin metal wires.

【０００６】［２］その電子部品搭載装置の各電極同士
を金属細線を介して接合することのできるワイヤ・ボン
ディング装置を提供すること。 ［３］その電子部品搭載装置の各電極同士を金属細線を
介して接合するワイヤ・ボンディング方法を提供するこ
と。[2] An object of the present invention is to provide a wire bonding apparatus capable of joining the electrodes of the electronic component mounting apparatus to each other via thin metal wires. [3] To provide a wire bonding method for bonding each electrode of the electronic component mounting apparatus via a thin metal wire.

【０００７】[0007]

【課題を解決するための手段】上記の課題を解決するた
めに、請求項１に記載の発明では、表面が互いに異なる
方向を向く複数の電極を有し、それら電極同士が金属細
線を介して接合されていることを要旨とする。In order to solve the above-mentioned problems, the invention according to claim 1 has a plurality of electrodes whose surfaces face different directions, and the electrodes are connected to each other via a thin metal wire. The point is that they are joined.

【０００８】請求項２に記載の発明では、請求項１に記
載の電子部品搭載装置における前記各電極同士を金属細
線を介して接合するワイヤ・ボンディング装置であっ
て、前記電子部品搭載装置の電極に金属細線を圧着する
ボンディングヘッドと、前記電子部品搭載装置を保持す
る保持手段と、前記ボンディングヘッドと前記保持手段
とを相対的に回動させる回動手段とを備えることを要旨
とする。According to a second aspect of the present invention, there is provided a wire bonding apparatus for joining the electrodes to each other via a thin metal wire in the electronic component mounting apparatus according to the first aspect. The present invention comprises a bonding head that presses a thin metal wire to a wire, holding means for holding the electronic component mounting apparatus, and turning means for relatively turning the bonding head and the holding means.

【０００９】請求項３に記載の発明では、請求項１に記
載の電子部品搭載装置における前記各電極同士を金属細
線を介して接合するワイヤ・ボンディング方法であっ
て、前記各電極に金属細線を圧着するボンディングヘッ
ドと前記電子部品搭載装置を保持する保持手段とを相対
的に回動させることにより、表面が互いに異なる方向を
向く電極同士を金属細線を介して接合することを要旨と
する。According to a third aspect of the present invention, there is provided a wire bonding method in which the electrodes of the electronic component mounting apparatus according to the first aspect are joined to each other via a thin metal wire. The gist of the present invention is to relatively rotate the bonding head for crimping and the holding means for holding the electronic component mounting apparatus so that the electrodes whose surfaces are directed in different directions are joined via thin metal wires.

【００１０】以下、本発明の「作用」について説明す
る。請求項１に記載の発明によると、例えば電子部品搭
載装置を角柱状に形成し、その異なる面にそれぞれ電極
を設けて各電極同士を金属細線を介して接合すれば、金
属細線の接合方向からみた電子部品搭載装置の面積を小
さくすることができる。したがって、電子部品搭載装置
を他の基板上に配設する場合などに、その専有面積が大
きくならず、同基板における他の部品及び配線のレイア
ウトが制限されてしまうといった不都合を解消すること
ができる。Hereinafter, the "action" of the present invention will be described. According to the first aspect of the present invention, for example, if the electronic component mounting device is formed in a prismatic shape, electrodes are provided on different surfaces thereof, and the electrodes are joined to each other via thin metal wires. The area of the electronic component mounting apparatus can be reduced. Therefore, when the electronic component mounting apparatus is provided on another board, the inconvenience that the occupied area does not increase and the layout of other components and wiring on the board is limited can be solved. .

【００１１】請求項２に記載の発明によると、回動手段
によってボンディングヘッドと保持手段とを相対的に回
動させることにより、電子部品搭載装置に設けられたそ
れぞれ異なる方向を向く各電極同士を金属細線を介して
接合させることができる。According to the second aspect of the present invention, by rotating the bonding head and the holding means relatively by the rotating means, the electrodes provided in the electronic component mounting apparatus and facing in different directions can be connected to each other. It can be joined via a thin metal wire.

【００１２】請求項３に記載の発明によると、ボンディ
ングヘッドと保持手段とを相対的に回動させて電子部品
搭載装置に設けられた各電極同士を金属細線を介して接
合するようにしている。このため、各電極の表面が異な
る方向を向いていても、それら各電極に金属細線を確実
に接合させることができる。According to the third aspect of the present invention, the bonding head and the holding means are relatively rotated so that the electrodes provided on the electronic component mounting apparatus are joined to each other via thin metal wires. . For this reason, even if the surface of each electrode faces in a different direction, a thin metal wire can be securely bonded to each electrode.

【００１３】[0013]

【発明の実施の形態】以下、本発明を具体化した一実施
形態を図１〜図３に基づき詳細に説明する。図１に示す
ように、ワイヤ・ボンディング装置１は、基台２上に配
設された略台形柱状をなす本体３と、その本体３上にお
いてＸ−Ｙテーブル４を介して配設されたボンディング
ヘッド部５とを備えている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below in detail with reference to FIGS. As shown in FIG. 1, a wire bonding apparatus 1 includes a main body 3 having a substantially trapezoidal column shape provided on a base 2, and a bonding device provided on the main body 3 via an XY table 4. And a head unit 5.

【００１４】ボンディングヘッド部５は、ホルダ駆動部
１１、ツールホルダ１２、キャピラリ１３、及びクラン
パ１４を備えている。ホルダ駆動部１１はＸ−Ｙテーブ
ル４上に配設され、その一側壁１１ａには略棒状のツー
ルホルダ１２が水平方向に延びる状態で取付けられてい
る。ツールホルダ１２の先端にはキャピラリ１３が取付
けられている。ここで、キャピラリ１３は、先端が下方
に伸びる状態となっている。キャピラリ１３は、先端が
テーパ状に形成されており、その内部には基端から先端
に向かって金やアルミニウム等からなる金属細線１５が
挿通されている。すなわち、キャピラリ１３の先端から
は金属細線１５が突出した状態となっている。この金属
細線１５は、キャピラリ１３の上方に設けられたクラン
パ１４によって挟持されるようになっている。また、こ
の金属細線１５は、図示しないワイヤ・スプールからキ
ャピラリ１３側に順次供給されるようになっている。The bonding head unit 5 includes a holder driving unit 11, a tool holder 12, a capillary 13, and a clamper 14. The holder driving unit 11 is provided on the XY table 4, and a substantially bar-shaped tool holder 12 is attached to one side wall 11a of the holder driving unit 11 so as to extend in the horizontal direction. A capillary 13 is attached to the tip of the tool holder 12. Here, the capillary 13 is in a state where the tip extends downward. The capillary 13 has a tapered distal end, and a thin metal wire 15 made of gold, aluminum, or the like is inserted through the inside from the base end toward the distal end. That is, the thin metal wire 15 protrudes from the tip of the capillary 13. The thin metal wire 15 is held by a clamper 14 provided above the capillary 13. The thin metal wires 15 are sequentially supplied to the capillary 13 from a wire spool (not shown).

【００１５】このように構成されたボンディングヘッド
部５においては、ホルダ駆動部１１内に設けられた図示
しない駆動装置によって、ツールホルダ１２の先端が図
１に示す矢印Ｚ方向に移動可能となっている。すなわ
ち、キャピラリ１３が矢印Ｚ方向に移動可能となってい
る。また、Ｘ−Ｙテーブル１１は、図示しない他の駆動
装置によって、本体３上を図１に矢印Ｘ及び矢印Ｙで示
す方向に移動可能となっている。このため、ボンディン
グヘッド部５を介して、キャピラリ１３も矢印Ｘ及び矢
印Ｙ方向に移動することとなる。なお、矢印Ｚ方向とは
図１の垂直方向を示し、矢印Ｘ，Ｙ方向とは水平方向に
おいて９０゜の角度をなす方向を示す。したがって、キ
ャピラリ１３は３次元方向に移動可能となっている。In the bonding head unit 5 configured as described above, the tip of the tool holder 12 can be moved in the arrow Z direction shown in FIG. 1 by a driving device (not shown) provided in the holder driving unit 11. I have. That is, the capillary 13 can move in the arrow Z direction. The XY table 11 can be moved on the main body 3 in directions indicated by arrows X and Y in FIG. 1 by another driving device (not shown). For this reason, the capillary 13 also moves in the arrow X and arrow Y directions via the bonding head unit 5. The arrow Z direction indicates the vertical direction in FIG. 1, and the arrow X and Y directions indicate directions forming an angle of 90 ° in the horizontal direction. Therefore, the capillary 13 can move in a three-dimensional direction.

【００１６】一方、本体３内には、図１に破線で示すよ
うに、回動手段としてのパルスモータ２０が配設されて
いる。このパルスモータ２０は、その回動軸心が本体３
の一側壁３ａ側を向くように配設されている。そして、
同側壁３ａには、保持手段としての載置台２１が水平方
向に突設されている。この載置台２１はクランク形状を
なし、略円柱状に形成された基端部２１ａが側壁３ａ側
から前記パルスモータ２０に接続されている。すなわ
ち、載置台２１は、パルスモータ２０の駆動によって回
動可能となっている。On the other hand, a pulse motor 20 as a rotating means is provided in the main body 3 as shown by a broken line in FIG. The rotation axis of the pulse motor 20 is
Is disposed so as to face the one side wall 3a side. And
On the side wall 3a, a mounting table 21 as a holding means is provided so as to protrude in a horizontal direction. The mounting table 21 has a crank shape, and a base end 21a formed in a substantially cylindrical shape is connected to the pulse motor 20 from the side wall 3a. That is, the mounting table 21 is rotatable by the driving of the pulse motor 20.

【００１７】また、同載置台２１の先端部上面には平坦
部分２１ｂが形成され、この平坦部分２１ｂには保持手
段としての保持部２２が形成されている。そして、この
保持部２２上には、略角柱状をなす電子部品搭載装置２
３が保持されている。この保持部２２は、例えば内部に
吸着装置が設けられ、この吸着装置によって電子部品搭
載装置２３を吸着保持するようになっている。つまり、
電子部品搭載装置２３を着脱可能に保持するようになっ
ている。A flat portion 21b is formed on the upper surface of the tip of the mounting table 21, and a holding portion 22 as holding means is formed on the flat portion 21b. The electronic component mounting device 2 having a substantially prismatic shape is provided on the holding portion 22.
3 are held. The holding unit 22 is provided with, for example, a suction device therein, and the suction device holds the electronic component mounting device 23 by suction. That is,
The electronic component mounting device 23 is detachably held.

【００１８】載置台２１は、図１に１点鎖線で示すよう
に、基端部２１ａの中心と電子部品搭載装置２３とを結
ぶ線を軸心として回動するように設定されている。そし
て、この軸心は前記矢印Ｙ方向と平行となるように設定
されている。すなわち、保持部２２の高さｈは、基端部
２１ａの中心と電子部品搭載装置２３の中心とを結ぶ線
が矢印Ｙ方向と平行となる高さに設定されている。した
がって、載置台２１が回動した際に電子部品搭載装置２
３はその場で回動することとなる。The mounting table 21 is set so as to rotate about a line connecting the center of the base end 21a and the electronic component mounting device 23 as an axis, as shown by a dashed line in FIG. The axis is set to be parallel to the arrow Y direction. That is, the height h of the holding portion 22 is set to a height at which a line connecting the center of the base end portion 21a and the center of the electronic component mounting device 23 is parallel to the arrow Y direction. Therefore, when the mounting table 21 rotates, the electronic component mounting apparatus 2
3 will rotate on the spot.

【００１９】電子部品搭載装置２３は、図２に示すよう
に、略直方体状をなすチップ支持体３１を備えている。
同支持体３１の一壁面３１ａには半導体チップ３２が接
合されている。また、この壁面３１ａと隣り合う壁面３
１ｂには基板３３が接合されている。半導体チップ３２
上の外縁において基板３３側には、アルミニウム箔膜な
どからなる複数の電極３４が列設されている。また、基
板３３上の外縁において半導体チップ３２側にも前記各
電極３４と対応する複数の電極３５が列設されている。
そして、それぞれ対応する電極３４，３５には金属細線
１５が接合され、各電極３４，３５同士が金属細線１５
を介して接合されている。すなわち、各電極３４，３５
間は、金属細線１５によって導通された状態となってい
る。As shown in FIG. 2, the electronic component mounting device 23 includes a chip support 31 having a substantially rectangular parallelepiped shape.
A semiconductor chip 32 is bonded to one wall surface 31a of the support 31. Also, the wall surface 3 adjacent to the wall surface 31a
The substrate 33 is joined to 1b. Semiconductor chip 32
A plurality of electrodes 34 made of an aluminum foil film or the like are arranged in rows on the substrate 33 side at the upper outer edge. Further, a plurality of electrodes 35 corresponding to the respective electrodes 34 are arranged in line on the semiconductor chip 32 side at the outer edge on the substrate 33.
The thin metal wires 15 are joined to the corresponding electrodes 34 and 35, respectively.
Are joined through. That is, each electrode 34, 35
The gap is in a state of conduction by the thin metal wire 15.

【００２０】なお、電子部品搭載装置２３は角柱状に形
成されているため、壁面３１ａと壁面３１ｂとがなす角
度は９０゜である。したがって、各電極３４，３５の表
面が向く方向のなす角度θも９０゜となっている。つま
り、各電極３４，３５は、それぞれ表面が異なる方向を
向いて形成されている。Since the electronic component mounting device 23 is formed in the shape of a prism, the angle between the wall surface 31a and the wall surface 31b is 90 °. Therefore, the angle θ between the direction in which the surfaces of the electrodes 34 and 35 face is also 90 °. That is, the electrodes 34 and 35 are formed so that their surfaces face different directions.

【００２１】次に、こうした電子部品搭載装置２３の各
電極３４，３５に金属細線１５を接合する動作、すなわ
ちワイヤ・ボンディングする動作について説明する。本
実施形態において、金属細線１５は、一般にネイルヘッ
ド・ボンディング方法と呼ばれるボンディング方法によ
って各電極３４，３５に接合される。すなわち、まずキ
ャピラリ１３から下方に突出した金属細線１５の先端が
図示しないボール形成用トーチによって溶融され、ボー
ルが形成される。Next, the operation of bonding the thin metal wires 15 to the respective electrodes 34 and 35 of the electronic component mounting apparatus 23, that is, the operation of wire bonding will be described. In the present embodiment, the thin metal wires 15 are bonded to the respective electrodes 34 and 35 by a bonding method generally called a nail head bonding method. That is, first, the tip of the thin metal wire 15 protruding downward from the capillary 13 is melted by a ball forming torch (not shown) to form a ball.

【００２２】続いて、キャピラリ１３が前記矢印Ｘ，Ｙ
方向に移動されることによって所定の電極３４上に位置
されるとともに矢印Ｚ方向（下方）に移動され、ボール
が同電極３４上に圧着される。そして、キャピラリ１３
が矢印Ｚ方向（上方）に移動される（図３（ａ）参
照）。Subsequently, the capillary 13 is moved by the arrows X, Y
As a result, the ball is positioned on a predetermined electrode 34 and moved in the direction of arrow Z (downward), and the ball is pressed on the same electrode 34. And the capillary 13
Is moved in the arrow Z direction (upward) (see FIG. 3A).

【００２３】次に、載置台２１は、図３（ａ）に矢印θ
ｙで示す方向に９０゜回動される。これにより、図３
（ｂ）に示すように、電子部品搭載装置２３の基板３３
が上方に向けられる。そして、キャピラリ１３が対応す
る電極３５上に位置されるとともに下方に移動され、金
属細線１５が電極３５に圧着される。Next, the mounting table 21 is shown by an arrow θ in FIG.
It is turned 90 ° in the direction indicated by y. As a result, FIG.
As shown in (b), the board 33 of the electronic component mounting device 23
Is directed upward. Then, the capillary 13 is positioned on the corresponding electrode 35 and moved downward, and the thin metal wire 15 is pressed against the electrode 35.

【００２４】その後、前記クランパ１４によって金属細
線１５が挟持され、そのままキャピラリ１３が上方に移
動される。これにより、金属細線１５は引っ張られて切
断される。そして、残りの各電極３４，３５にも同様
に、順次金属細線１５が接合される。すなわち、載置台
２１を往復回動させることにより、異なる方向を向く電
極３４，３５同士を金属細線１５を介して接合させるこ
とが可能となる。Thereafter, the thin metal wire 15 is clamped by the clamper 14, and the capillary 13 is moved upward as it is. Thereby, the thin metal wire 15 is pulled and cut. The thin metal wires 15 are sequentially joined to the remaining electrodes 34 and 35 in the same manner. That is, by reciprocating the mounting table 21, the electrodes 34 and 35 facing different directions can be joined to each other via the thin metal wires 15.

【００２５】したがって、本実施形態によれば以下のよ
うな効果を得ることができる。 （１）載置台２１を回動させることによって、表面が異
なる方向を向く各電極３４，３５同士を金属細線１５を
介して接合させることができる。Therefore, according to the present embodiment, the following effects can be obtained. (1) By rotating the mounting table 21, the electrodes 34 and 35 whose surfaces face different directions can be joined to each other via the thin metal wires 15.

【００２６】（２）載置台２１の回動軸心は、電子部品
搭載装置２３の中心を通る矢印Ｙ方向となっている。こ
のため、載置台２１を回動させた際に、電子部品搭載装
置２３はその場で回転することとなる。したがって、キ
ャピラリ１３と電子部品搭載装置２３との相対的なズレ
も最小限となり、金属細線１５が必要以上に引き出され
てしまうことを防止することができる。(2) The rotation axis of the mounting table 21 is in the direction of the arrow Y passing through the center of the electronic component mounting device 23. Therefore, when the mounting table 21 is rotated, the electronic component mounting device 23 rotates on the spot. Therefore, the relative displacement between the capillary 13 and the electronic component mounting device 23 is minimized, and it is possible to prevent the thin metal wire 15 from being pulled out more than necessary.

【００２７】（３）電子部品搭載装置２３は角柱状をな
し、その異なる壁面３１ａ，３１ｂに設けられた各電極
３４，３５同士が金属細線１５を介して接合されてい
る。このため、壁面３１ａの面積を小さくすることがで
きる。したがって、壁面３１ａを上方に向けた状態で電
子部品搭載装置２３を他の基板上に配設する場合など
に、同基板に対する電子部品搭載装置２３の専有面積が
大きくならない。その結果、同基板における他の部品及
び配線のレイアウトが制限されてしまうといった不都合
を解消することができる。(3) The electronic component mounting apparatus 23 has a prismatic shape, and the electrodes 34 and 35 provided on the different wall surfaces 31a and 31b are joined to each other via the thin metal wires 15. Therefore, the area of the wall surface 31a can be reduced. Therefore, when the electronic component mounting device 23 is disposed on another substrate with the wall surface 31a facing upward, the area occupied by the electronic component mounting device 23 on the same substrate does not increase. As a result, the inconvenience that the layout of other components and wiring on the same board is restricted can be solved.

【００２８】なお、本発明の実施形態は以下のように変
更してもよい。 ・ 前記実施形態では電子部品搭載装置２３を角柱状に
形成したが、この形状に限らず、例えば図４（ａ）に示
すような台形柱状であってもよい。すなわち、この場合
には、同図に示すように、電子部品搭載装置２３の各壁
部４１，４２のなす角度θ１と、各壁部４１，４３のな
す角度θ２とが、それぞれ異なる角度をなしている。こ
の場合においても、回動載置台２１をこれらの角度θ
１，θ２だけ回動させることにより、各電極３４，３５
に金属細線１５を接合させることができる。The embodiment of the present invention may be modified as follows. In the above-described embodiment, the electronic component mounting device 23 is formed in a prismatic shape. However, the present invention is not limited to this shape. For example, a trapezoidal pillar shape as shown in FIG. That is, in this case, as shown in the figure, the angle θ1 between the walls 41 and 42 of the electronic component mounting device 23 and the angle θ2 between the walls 41 and 43 form different angles. ing. Also in this case, the rotation mounting table 21 is set at these angles θ.
By rotating by 1, θ2, each electrode 34, 35
Can be bonded to the thin metal wire 15.

【００２９】また、電子部品搭載装置２３の形状は、図
４（ｂ）に示すような曲面形状であってもよい。すなわ
ち、同図に示すように、電子部品搭載装置２３上に角度
θをなす方向を向いて形成された各電極４４，４５にお
いても、前記回動載置台２１をこの角度θだけ回動させ
ることによって金属細線１５を接合させることができ
る。The shape of the electronic component mounting device 23 may be a curved shape as shown in FIG. That is, as shown in the figure, the rotating mounting table 21 is also rotated by this angle θ in each of the electrodes 44 and 45 formed on the electronic component mounting device 23 so as to face the angle θ. Thereby, the thin metal wires 15 can be joined.

【００３０】・ ワーク保持部２２を、電子部品搭載装
置２３の上方からみた中心を通る矢印Ｚ方向を軸心とし
て回動可能に構成する。このようにすれば、電子部品搭
載装置２３において側壁３１ａと側壁３１ｂとが隣り合
う側壁に基板が設けられ、この基板に形成された電極と
前記電極３４または電極３５とに金属細線１５を接合さ
せることも可能となる。The work holding portion 22 is configured to be rotatable about an arrow Z direction passing through the center of the electronic component mounting device 23 as viewed from above. In this way, the substrate is provided on the side wall where the side wall 31a and the side wall 31b are adjacent to each other in the electronic component mounting apparatus 23, and the thin metal wire 15 is bonded to the electrode formed on the substrate and the electrode 34 or the electrode 35. It is also possible.

【００３１】・ 前記実施形態ではツールホルダ１２が
矢印Ｙ方向と平行に延びているが、これに限らず、矢印
Ｘ方向と平行に延びるようにしてもよい。 ・ 前記実施形態では回動載置台２１が電子部品搭載装
置２３の中心を通る矢印Ｙ方向を軸心として回動可能と
なっている。この回動載置台２１を固定とし、ボンディ
ングヘッド５がキャピラリ１３の先端を通る矢印Ｙ方向
を軸心として回動するようにしてもよい。すなわち、電
子部品搭載装置２３とキャピラリ１３とが相対的に回動
可能となっていればよい。In the above embodiment, the tool holder 12 extends in parallel with the arrow Y direction, but is not limited thereto, and may extend in parallel with the arrow X direction. In the above-described embodiment, the rotation mounting table 21 is rotatable about the axis Y in the direction of the arrow Y passing through the center of the electronic component mounting device 23. The rotation mounting table 21 may be fixed, and the bonding head 5 may rotate about the arrow Y direction passing through the tip of the capillary 13 as the axis. That is, it is only necessary that the electronic component mounting device 23 and the capillary 13 be relatively rotatable.

【００３２】次に、特許請求の範囲に記載された技術的
思想のほかに、前述した実施形態によって把握される技
術的思想を以下に列挙する。 （１） 請求項１に記載の電子部品搭載装置において、
当該装置は、立体構造をなし、その異なる面にそれぞれ
電極を有し、それら各電極同士に金属細線が接合されて
いることを特徴とする電子部品搭載装置。Next, in addition to the technical ideas described in the claims, technical ideas grasped by the above-described embodiment will be enumerated below. (1) In the electronic component mounting apparatus according to claim 1,
The electronic component mounting device, wherein the device has a three-dimensional structure, has electrodes on different surfaces thereof, and a thin metal wire is bonded to each of the electrodes.

【００３３】この技術的思想（１）に記載の発明によれ
ば、各電極の表面が同一方向を向いて形成されている場
合に比べて、金属細線が接合される面の面積を小さくす
ることができる。このため、この電子部品搭載装置を他
の基板上に搭載する際に、その基板に対する同装置の専
有面積を小さくすることができる。したがって、同基板
における他の部品及び配線のレイアウトが制限されてし
まうといった不都合を解消することができる。According to the invention described in the technical concept (1), the area of the surface to which the fine metal wires are bonded is reduced as compared with the case where the surfaces of the electrodes are formed in the same direction. Can be. Therefore, when the electronic component mounting device is mounted on another substrate, the area occupied by the device on the substrate can be reduced. Therefore, the inconvenience that the layout of other components and wirings on the same board is restricted can be solved.

【００３４】（２） 立体構造をなすチップ支持体と、
そのチップ支持体の一壁面に配設された半導体チップ
と、同チップ支持体の他の壁面に設けられた１つまたは
複数の電極と、その電極及び前記半導体チップ上に設け
られた１つまたは複数の電極間にワイヤ・ボンディング
された金属細線とを備えることを特徴とする電子部品搭
載装置。(2) a chip support having a three-dimensional structure;
A semiconductor chip disposed on one wall of the chip support, one or more electrodes provided on another wall of the chip support, and one or more electrodes provided on the electrode and the semiconductor chip; An electronic component mounting apparatus comprising: a plurality of electrodes; and a thin metal wire wire-bonded between the plurality of electrodes.

【００３５】この技術的思想（２）に記載の発明によれ
ば、半導体チップ側からみた壁面の面積を小さくするこ
とができる。このため、前記（１）と同様の効果を得る
ことができる。According to the invention described in the technical concept (2), the area of the wall surface viewed from the semiconductor chip side can be reduced. For this reason, the same effect as (1) can be obtained.

【００３６】（３） 請求項２に記載のワイヤ・ボンデ
ィング装置において、前記回動手段は、前記電子部品搭
載装置を中心として前記ボンディングヘッドと前記ワー
ク保持部とを相対的に回動することを特徴とするワイヤ
・ボンディング装置。(3) The wire bonding apparatus according to claim 2, wherein the rotating means relatively rotates the bonding head and the work holding section around the electronic component mounting apparatus. Characteristic wire bonding equipment.

【００３７】この技術的思想（３）に記載の発明によれ
ば、電子部品搭載装置をその場で回転させることができ
る。したがって、ボンディングヘッドと電子部品搭載装
置との相対的なズレも最小限となり、金属細線が必要以
上に引き出されてしまうことを防止することができる。According to the invention described in the technical concept (3), the electronic component mounting device can be rotated on the spot. Therefore, the relative displacement between the bonding head and the electronic component mounting apparatus is also minimized, and it is possible to prevent the thin metal wire from being pulled out more than necessary.

【００３８】（４） 請求項２または技術的思想（３）
に記載のワイヤ・ボンディング装置において、前記回動
手段は、前記保持手段を回動させることを特徴とするワ
イヤ・ボンディング装置。(4) Claim 2 or technical idea (3)
3. The wire bonding apparatus according to claim 1, wherein the rotating unit rotates the holding unit.

【００３９】（５） 請求項２または技術的思想（３）
に記載のワイヤ・ボンディング装置において、前記回動
手段は、前記ボンディングヘッドに設けられていること
を特徴とするワイヤ・ボンディング装置。(5) Claim 2 or technical idea (3)
3. The wire bonding apparatus according to claim 1, wherein the rotating unit is provided on the bonding head.

【００４０】[0040]

【発明の効果】以上詳述したように、請求項１に記載の
発明によれば、例えば電子部品搭載装置を角柱状に形成
し、その異なる面にそれぞれ電極を設けて各電極同士を
金属細線を介して接合すれば、金属細線の接合方向から
みた電子部品搭載装置の面積を小さくすることができ
る。したがって、電子部品搭載装置を他の基板上に配設
する場合などに、その専有面積が大きくならず、同基板
における他の部品及び配線のレイアウトが制限されてし
まうといった不都合を解消することができる。As described in detail above, according to the first aspect of the present invention, for example, an electronic component mounting device is formed in a prismatic shape, and electrodes are provided on different surfaces thereof, and each electrode is connected to a thin metal wire. The area through which the electronic component mounting apparatus is viewed from the bonding direction of the fine metal wires can be reduced. Therefore, when the electronic component mounting apparatus is provided on another board, the inconvenience that the occupied area does not increase and the layout of other components and wiring on the board is limited can be solved. .

【００４１】請求項２に記載の発明によれば、回動手段
によってボンディングヘッドと保持手段とを相対的に回
動させることにより、電子部品搭載装置に設けられたそ
れぞれ異なる方向を向く各電極同士を金属細線を介して
接合させることができる。According to the second aspect of the present invention, by rotating the bonding head and the holding means relatively by the rotating means, the electrodes provided on the electronic component mounting apparatus and facing in different directions are connected to each other. Can be joined via a thin metal wire.

【００４２】請求項３に記載の発明によれば、表面が異
なる方向を向く電極同士を金属細線を介して接合させる
ことができる。According to the third aspect of the present invention, electrodes whose surfaces are directed in different directions can be joined to each other via thin metal wires.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明に係るワイヤ・ボンディング装置の一実
施形態を示す斜視図。FIG. 1 is a perspective view showing an embodiment of a wire bonding apparatus according to the present invention.

【図２】同実施形態の電子部品搭載装置を拡大して示す
斜視図。FIG. 2 is an enlarged perspective view showing the electronic component mounting apparatus of the embodiment.

【図３】本発明に係る電子部品搭載装置の他の実施形態
を示す正面図。FIG. 3 is a front view showing another embodiment of the electronic component mounting apparatus according to the present invention.

【図４】本発明に係る電子部品搭載装置の他の実施形態
を示す正面図。FIG. 4 is a front view showing another embodiment of the electronic component mounting apparatus according to the present invention.

【図５】従来の電子部品搭載装置を示す平面図。FIG. 5 is a plan view showing a conventional electronic component mounting apparatus.

【図６】従来の電子部品搭載装置を拡大して示す側面
図。FIG. 6 is an enlarged side view showing a conventional electronic component mounting apparatus.

【符号の説明】[Explanation of symbols]

１…ワイヤ・ボンディング装置、５…ボンディングヘッ
ド、１５…金属細線、２０…回動手段としてのパルスモ
ータ、２１…保持手段としての載置台、２２…保持手段
としての保持部、２３…電子部品搭載装置、３１…チッ
プ支持体、３２…半導体チップ、３３…基板、３４…半
導体チップ側の電極、３５…基板側の電極。DESCRIPTION OF SYMBOLS 1 ... Wire bonding apparatus, 5 ... Bonding head, 15 ... Thin metal wire, 20 ... Pulse motor as rotating means, 21 ... Mounting table as holding means, 22 ... Holding part as holding means, 23 ... Electronic component mounting Apparatus, 31: chip support, 32: semiconductor chip, 33: substrate, 34: electrode on the semiconductor chip side, 35: electrode on the substrate side.

Claims (3)

【特許請求の範囲】[Claims] 【請求項１】 表面が互いに異なる方向を向く複数の電
極を有し、それら電極同士が金属細線を介して接合され
ていることを特徴とする電子部品搭載装置。1. An electronic component mounting apparatus, comprising: a plurality of electrodes whose surfaces face different directions, wherein the electrodes are joined via thin metal wires. 【請求項２】 請求項１に記載の電子部品搭載装置にお
ける前記各電極同士を金属細線を介して接合するワイヤ
・ボンディング装置であって、 前記電子部品搭載装置の電極に金属細線を圧着するボン
ディングヘッドと、 前記電子部品搭載装置を保持する保持手段と、 前記ボンディングヘッドと前記保持手段とを相対的に回
動させる回動手段とを備えることを特徴とするワイヤ・
ボンディング装置。2. A wire bonding apparatus for joining the electrodes to each other via a thin metal wire in the electronic component mounting apparatus according to claim 1, wherein the metal thin wire is crimped to the electrode of the electronic component mounting apparatus. A wire, comprising: a head; holding means for holding the electronic component mounting device; and rotating means for relatively rotating the bonding head and the holding means.
Bonding equipment. 【請求項３】 請求項１に記載の電子部品搭載装置にお
ける前記各電極同士を金属細線を介して接合するワイヤ
・ボンディング方法であって、 前記各電極に金属細線を圧着するボンディングヘッドと
前記電子部品搭載装置を保持する保持手段とを相対的に
回動させることにより、表面が互いに異なる方向を向く
電極同士を金属細線を介して接合することを特徴とする
ワイヤ・ボンディング方法。3. A wire bonding method for bonding the electrodes via a metal wire in the electronic component mounting apparatus according to claim 1, wherein the bonding head presses the metal wires to the electrodes and the electronic device. A wire bonding method, characterized in that, by relatively rotating a holding means for holding a component mounting apparatus, electrodes whose surfaces face different directions are joined to each other via thin metal wires.
JP11034130A 1999-02-12 1999-02-12 Electronic parts loading device, and wire bonding device and method Pending JP2000232124A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11034130A JP2000232124A (en) 1999-02-12 1999-02-12 Electronic parts loading device, and wire bonding device and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11034130A JP2000232124A (en) 1999-02-12 1999-02-12 Electronic parts loading device, and wire bonding device and method

Publications (1)

Publication Number Publication Date
JP2000232124A true JP2000232124A (en) 2000-08-22

Family

ID=12405657

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11034130A Pending JP2000232124A (en) 1999-02-12 1999-02-12 Electronic parts loading device, and wire bonding device and method

Country Status (1)

Country Link
JP (1) JP2000232124A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180072755A (en) * 2016-06-02 2018-06-29 가부시끼가이샤가이죠 A bonding apparatus, a bonding method, and a bonding control program

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180072755A (en) * 2016-06-02 2018-06-29 가부시끼가이샤가이죠 A bonding apparatus, a bonding method, and a bonding control program
KR102144376B1 (en) * 2016-06-02 2020-08-14 가부시끼가이샤가이죠 Bonding device, bonding method, and bonding control program

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