JP2000225769A - Hot stamping foil - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture a hot stamping foil provided with a bonded layer of respective balanced characteristics such as the softening temperature, bonding properties and resin strength and also provided with another bonded layer of superior wear resistance and resin strength, good softening properties and bonding properties. SOLUTION: In a hot stamping foil formed of at least a protective layer, a decorative layer and a bonded layer laminated all together in the above order on a base film, a copolymerized resin composed of a styrene monomer and a (metha)acrylic ester monomer is contained in the above bonded layer, and the foil is provided with features in which the weight average molecular weight of the copolymerized resin is 3×103-5×104, the storage elasticity modulus G' at 120 deg.C is 2.0×103 Pa or less and the glass transition temperature is 40 deg.C or higher.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer method in which a transfer layer comprising a protective layer, a decorative layer, an adhesive layer and the like is laminated on a base film, and the transfer layer is transferred to an object by applying heat and pressure. Foil (hereinafter referred to as "hot stamping foil")
About.

[0002]

2. Description of the Related Art FIG. 1 is a sectional view for explaining a conventional hot stamping foil and a transfer method using the same. In FIG. 1, a hot stamping foil H has a configuration in which a transfer layer 6 including a release layer 2, a protective layer 3, a decoration layer 4 and an adhesive layer 5 is laminated on a base film 1. In order to transfer to the surface of the molded product 7 (hereinafter referred to as “transfer surface”) using the hot stamping foil H, pressure is applied from above the base film 1 while heating with the heating plate 8, and the adhesive layer 5 is transferred to the transfer surface. After the base film 1 is peeled off together with the release layer 2 after the adhesion, the transfer layer 6
Is transferred. Such a transfer method is called a hot stamping method, and is one of the most effective surface decoration methods along with painting, plating, and direct vapor deposition.

[0003] The hot stamping method has the following advantages as compared with the coating method and the like. (1) Pollution prevention equipment is not required because no solvent is used. (2) The transfer process is simple, and handling of the stamping machine is simple. (3) You can freely select a pattern-like design, and there is a wide selection of colors. (4) In addition to plastic, it has a wide range of applications such as paper, cloth, and leather.

However, according to the hot stamping method, since heat and pressure are applied instantaneously, the resin used for the adhesive layer flows by heat and exhibits an adhesive property. Thermoplastic resins such as vinyl and synthetic rubber are used. However, these resins are rarely balanced in the properties of softening temperature, adhesiveness and resin strength, and a large amount of a tackifier is added to a resin having insufficient adhesiveness, and a hot agent is used for a resin having a high softening temperature. Increase the heating temperature when stamping,
In addition, there is a problem that adjustment such as setting a longer pressing time is necessary.

[0005] The hot stamping method is used for surface decoration of home electric appliances, automobile exterior parts, furniture furniture and the like, but such applications require surface hardness and abrasion resistance. For this purpose, there is a method in which an electron beam-curable or ultraviolet-curable resin paint is used for the protective layer of the hot stamping foil (for example, JP-A-60-239277).

Further, it has been proposed to use a composition in which an acrylic copolymer resin and a melamine resin which is a thermosetting resin are blended as a resin for the protective layer (Japanese Patent Application Laid-Open No. 55-55980).
166287). According to this method, the resin strength of the protective layer is improved, so that the abrasion resistance of the protective layer surface is improved. However, the adhesive layer formed following the protective layer is made of a thermoplastic material generally used in hot stamping foils. Since resin (for example, acrylic, polyester, vinyl chloride, synthetic rubber, etc.) is used, the resin strength cannot be increased, and peeling occurs at the interface between the adhesive layer and the transfer surface when rubbing against a contact object. There is a possibility that no improvement in the abrasion resistance of the entire hot stamping foil is observed.

As a means for solving the above-mentioned problem, it has been proposed to include a cross-linking curable resin in the adhesive layer (Japanese Patent Publication No. 53885/1990). According to this method, since the resin strength of the adhesive layer is increased, the wear resistance of the entire hot stamping foil is improved. However, the flow softening point of the adhesive layer resin increases as a result of the inclusion of the cross-linking curable resin in the adhesive layer. Therefore, adjustment such as increasing the heating temperature of the hot stamp or setting a longer pressing time is necessary. And so on.

[0008]

SUMMARY OF THE INVENTION It is a first object of the present invention to provide a hot stamping foil having an adhesive layer which is balanced in softening temperature, adhesiveness and resin strength. A second object of the present invention is to provide a hot stamping foil having an adhesive layer having excellent abrasion resistance and resin strength and exhibiting good softening properties and adhesiveness.

[0009]

According to a first aspect of the present invention, there is provided a hot stamping foil in which at least a protective layer, a decoration layer, and an adhesive layer are laminated in this order on a base film, and the styrene is contained in the adhesive layer. A copolymer resin (A) of a copolymer monomer and a (meth) acrylate monomer, the copolymer resin (A) having a weight average molecular weight of 3 × 10 ^{3 to} 5 × 10 ⁴ . , At 120 ° C., the storage elastic modulus G ′ is 2.0 × 10 ³ Pa or less, and the glass transition temperature is 40 ° C. or more.

A hot stamping hose according to claim 2
At least a protective layer, a decorative layer and
Hot stamping wheel with
A styrene monomer in the adhesive layer
T) Copolymer resin with acrylic acid ester monomer (B)
And the copolymer resin (B) has a weight average molecular weight M
_WLIs 3 × 10^Three~ 5 × 10^FourLow molecular weight copolymer
(B1) and weight average molecular weight M_WHIs 8 × 10^Four~ 2 × 1
0⁶And a high molecular weight copolymer (B2)
The storage modulus G 'at 0 ° C is 2 × 10^ThreeBelow Pa
And a glass transition temperature of 40 ° C. or higher.
Things.

In the present invention, the styrene-based monomers for constituting the copolymer resins (A) and (B) contained in the adhesive layer include, for example, styrene, o-methylstyrene, m-methylstyrene, p-methylstyrene, α-methylstyrene, p-ethylstyrene, 2,4-dimethylstyrene, pn-butylstyrene, pt-butylstyrene, pn-hexylstyrene, pn-octylstyrene, pn-dodecylstyrene, p-methoxystyrene, p-phenylstyrene, p-chlorostyrene,
3,4-dichlorostyrene and the like. Of these, styrene is particularly preferably used.

Examples of (meth) acrylate monomers include methyl acrylate, ethyl acrylate,
Propyl acrylate, n-butyl acrylate, isobutyl acrylate, n-octyl acrylate, dodecyl acrylate, 2-ethylhexyl acrylate, stearyl acrylate, methyl methacrylate, propyl methacrylate, n-butyl methacrylate, methacrylic acid In addition to alkyl esters of acrylic acid or methacrylic acid such as isobutyl, n-octyl methacrylate, dodecyl methacrylate and stearyl methacrylate, acrylic acid 2-
Chloroethyl, phenyl acrylate, α-methyl acrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 2-hydroxybutyl acrylate, glycidyl acrylate, phenyl methacrylate, dimethylaminoethyl methacrylate, methacrylic acid Diethylaminoethyl, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, 2-hydroxybutyl methacrylate, glycidyl methacrylate,
Bisglycidyl methacrylate, polyethylene glycol dimethacrylate, methacryloxy phosphate and the like can be mentioned. Among these, 2-ethylhexyl acrylate, n-butyl acrylate, methyl methacrylate, n-butyl methacrylate and the like are particularly preferably used.

The copolymer resins (A) and (B) include:
Other vinyl monomers may be contained. Other vinyl monomers are not particularly limited, and include, for example, (meth) acrylic acid or (meth) acrylic acid such as α-ethylacrylic acid, crotonic acid, or an α-alkyl derivative or β-alkyl derivative thereof; Unsaturated dicarboxylic acids such as fumaric acid, maleic acid, citraconic acid, and itaconic acid or monoester derivatives or diester derivatives thereof; monoacryloyloxyethyl succinate;
Monomethacryloyloxyethyl succinate, acrylonitrile, acrylamide and the like can be mentioned.

The above-mentioned copolymer resins (A) and (B) may have a crosslinked structure, or may have a crosslinked agent copolymerized. The crosslinking agent is not particularly limited. For example, divinylbenzene, ethylene glycol di (meth)
Acrylate, 1,3-butylene glycol di (meth)
Acrylate, 1,4-butanediol di (meth) acrylate, 1,5-pentanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, diethylene glycol di (meth) acrylate,
Triethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, pentaethylene glycol di (meth) acrylate, polyethylene glycol # 200, # 400, # 600 di (meth) acrylate, dipropylene glycol di ( Bifunctional ones such as meth) acrylate and polypropylene glycol di (meth) acrylate; pentaerythritol tri (meth) acrylate, trimethylolethanetri (meth) acrylate, trimethylolpropane tri (meth) acrylate, tetramethylolmethanetetra ( (Meth) acrylate, oligoester (meth) acrylate, 2,2-bis (4-methacryloxy, polyethoxyphenyl) propane, diallyl phthalate, triallyl cyanurate Triallyl isocyanurate,
Examples include polyfunctional compounds such as triallyl trimellitate and diarylchlorendate.

The copolymer resin (A) in claim 1 needs to have a weight average molecular weight of 3 × 10 ^{3 to} 5 × 10 ⁴ measured by gel permeation chromatography. If the weight-average molecular weight is less than 3 × 10 ³ , the adhesive layer will flow out during transfer, causing dripping on the transfer surface or reducing the resin strength of the adhesive layer. On the other hand, when the weight average molecular weight is larger than 5 × 10 ⁴ , the adhesiveness is reduced.

The low molecular weight copolymer (B) according to claim 2
1) by gel permeation chromatography
Weight average molecular weight M_WLIs 3 × 10^Three~ 5 × 1
0^FourAnd the weight average molecular weight of the high molecular weight copolymer (B2)
Quantity M_WHIs 8 × 10^Four~ 2 × 10 ⁶Must be
You. This is because the low molecular weight copolymer (B1) is a copolymer resin
(B) The overall softening temperature is relatively low,
Gives low-temperature fluidity to the ping foil adhesive layer,
Copolymer (B2) increases the strength of the resin, and as a result
Acts to increase the wear resistance of the stamping wheel
I do. Therefore, low molecular weight
Weight average of polymer (B1) and high molecular weight copolymer (B2)
Equivalent molecular weight M_WLAnd M_WHIs set in the above range.

When the low-molecular-weight copolymer (B1) has a weight average molecular weight _MWL of less than 3 × 10 ³ , the adhesive layer flows out during transfer to cause dripping on the transfer surface, If the resin strength decreases and exceeds 5 × 10 ⁴ , the adhesiveness decreases. On the other hand, when the weight average molecular weight M _{WH of} the high molecular weight copolymer (B2) is less than 8 × 10 ⁴ , the resin strength of the adhesive layer is insufficient and the effect of improving abrasion resistance cannot be expected.
If it is larger than × 10 ⁶ , the softening temperature increases, and it is necessary to increase the heating temperature during transfer, or to lengthen the pressure bonding time, and further, the adhesiveness is reduced.

Copolymer resins (A) and (B) of the above styrene monomer and (meth) acrylate monomer
It is both '(hereinafter referred to as "G" _{12 0} ") storage modulus G 120 ° C. is necessary that is 2.0 × 10 ³ Pa or less. If G ′ ₁₂₀ is larger than 2.0 × 10 ³ Pa, the softening temperature of the resin increases, so that the temperature at the time of transfer must be increased, the pressure bonding time must be increased, and the adhesiveness also decreases.

[0019] G lower limit of _{120 '120} can reduce the temperature setting at the time of transfer smaller, G since advantageous in terms of work efficiency, etc. can be shortened bonding time' is not particularly limited. However, when G ′ ₁₂₀ decreases, the glass transition temperature of the resin also decreases, and after a hot stamping foil using the copolymer resins (A) and (B) as an adhesive layer is transferred to a substrate, a high-temperature environment (eg, in summer) If left unattended in a closed car during the day, etc.), the above-mentioned problems occur, so G '
₁₂₀ is desirably 5 × 10 Pa or more. Incidentally, the G _'120 is a viscoelasticity measuring apparatus RDA700 (manufactured by Rheometrics), is measured according to the measurement conditions of storage elastic modulus at 120 ° C. as shown in Table 1.

[0020]

[Table 1]

The copolymer resins (A) and (B) must have a glass transition temperature (Tg) of 40 ° C. or higher. If the Tg is lower than 40 ° C., the hot stamping foil using the copolymer resin as an adhesive layer is transferred to a transfer surface, and then, when left in a high-temperature environment such as in a closed car during the daytime in summer, the adhesiveness is reduced. There is a possibility that the hot stamping foil may be partially peeled off due to deterioration of the properties. Although the upper limit of Tg is not limited by this, when Tg increases, the flow softening point of the resin also increases, and the above-described problem occurs.
The temperature is desirably 0 ° C. or lower.

In the present invention, the midpoint glass transition temperature T _mg is measured according to JIS K 7121 and described in JIS K 7121 9.3 “Determining the glass transition temperature”.
Is defined as the glass transition temperature (Tg).

The copolymer resin (A) in claim 1 can be prepared by a conventionally known polymerization method, for example, suspension polymerization, emulsion polymerization,
It can be obtained by a method such as solution polymerization or bulk polymerization.

The copolymer resin (B) according to claim 2 comprises the low molecular weight copolymer (B1) and the high molecular weight copolymer (B).
2) can be obtained by separately polymerizing any of the conventionally known polymerization methods, for example, any of suspension polymerization, emulsion polymerization, solution polymerization, and bulk polymerization, followed by hot melt blending.
At this time, after the copolymer (B1) and the copolymer (B2) are separately dissolved in a solvent and mixed, and the solvent is removed, a more uniform blend can be obtained. More preferably,
Low molecular weight copolymer (B1) or high molecular weight copolymer (B
This is a method of obtaining a copolymer (B) by polymerizing either one of 2) and then polymerizing the other copolymer in the presence of the copolymer.

The present invention relates to the above copolymer resins (A) and (B)
Must be contained in the adhesive layer of the hot stamping foil. Hereinafter, the basic configuration of the hot stamping foil of the present invention will be described.

The substrate film used in the present invention may be any film that can be used as a transfer foil, and includes synthetic resin films such as polyester, polypropylene, polyethylene and polyamide represented by polyethylene terephthalate, pulp paper and synthetic paper. Is mentioned. The thickness is preferably from 5 to 200 μm, particularly preferably from 12 to 50 μm.

A protective layer is first laminated on the base film. If the protective film cannot be easily separated from the base film, a release agent is applied to the base film to form a release layer. It should be left. As the release agent, a release agent such as a cellulose-based, acrylic-based, silicone-based, or hydrocarbon-based wax having a function of easily separating the protective layer from the base film at the time of thermal transfer processing is used. The release agent may be applied so as to form a release layer having a thickness of about 0.01 to 2 μm after drying, and a gravure coat, a reverse roll coat, a natural coat, or the like is used as an application means.

As the protective layer, for example, a thermosetting or thermoplastic resin such as an acrylic resin, a polyvinyl chloride resin, a cellulose resin, a polyester resin, a melamine resin, an epoxy resin, and a phenol resin is used. The thickness of the protective layer is suitably about 1 to 10 μm. As a means for applying the protective layer, for example, a gravure coat, a reverse roll coat, a wire bar coat, a blade coat, a doctor knife coat, a silk screen print, or the like is adopted.

A decorative layer is laminated on the protective layer.
The decorative layer referred to in the present invention is, for example, one using a transparent resin layer, a colored layer, a picture layer, or a metal deposition layer alone or in combination. As the transparent resin layer, the same resin as the resin constituting the protective layer can be used. The colored layer is a transparent resin layer containing a coloring agent such as a pigment, and the picture layer is a picture layer, a pattern, and a pattern formed with ink. The metal deposition layer is formed by forming a metal layer of aluminum, tin, copper, chromium, or the like by vacuum deposition. The thickness of the decorative layer is usually 100 to 1000 °. These decorative layers are not limited to one layer, and two or more layers can be provided.

An adhesive layer is laminated on the decorative layer. In the present invention, it is necessary that the adhesive layer contains one of the copolymer resins (A) and (B). However, depending on the performance required for the adhesive layer, other additives besides these copolymer resins may be used. May be included. The copolymer resin is coated by the same means as the protective layer, and its thickness is preferably about 1 to 5 μm.

The hot stamping foil having the above structure is coated on the transfer surface of various synthetic resins and the like, and the heat and pressure of the heating element are applied from the base film side of the hot stamping foil so that the adhesive layer is formed on the transfer surface. After bonding, only the base film is peeled off.

(Operation) According to the first aspect of the present invention,
The weight average molecular weight of the adhesive layer is a specific range and G _{'12 0} and Tg
Since it contains the copolymer resin (A) having the following formula, it eliminates various drawbacks of the resin conventionally used as an adhesive layer, and has an adhesive layer that is well balanced in each property of softening temperature, adhesiveness and resin strength. It becomes a hot stamping foil.

According to the second aspect of the present invention, the copolymer resin (B) in which the adhesive layer comprises a low molecular weight copolymer (B1) and a high molecular weight copolymer (B2) having a weight average molecular weight in a specific range. , The low molecular weight copolymer (B1)
As a result, the softening temperature of the entire resin is lowered, and fluidity and adhesiveness at a low temperature can be obtained. In addition, as a result of increasing the resin strength by the high molecular weight copolymer (B2), the abrasion resistance of the adhesive layer is enhanced. Further, the copolymer resin (B) has a specific range of G ′
_{Since it has 120} and Tg, it is possible to suppress the rise of the softening temperature while improving the resin strength of the adhesive layer, and to obtain a hot stamping foil having an adhesive layer in which the adhesiveness and the resin strength are balanced. Can be.

[0034]

Embodiments of the present invention will be described below. Example 1 A 38 μm thick polyester film (trade name “Lumilar T-70” manufactured by Toray Industries, Inc.) was subjected to corona discharge treatment, and the treated surface was gravure-coated with a 5% by weight solution of cellulose acetate in acetone. For 1 minute to form a release layer having a thickness of 0.5 μm. The release layer surface is gravure coated with a melamine paint (manufactured by Dainippon Ink and Chemicals, Inc.)
After drying at 160 ° C. for 1 minute, a protective layer having a thickness of 5 μm was formed. A coating solution prepared by diluting a copolymer resin (A) of a styrene-based monomer and a (meth) acrylate-based monomer to 20% by weight with toluene was applied to the surface of the protective layer.

[0035]Production of copolymer resin (A) In a separable flask equipped with a cooler, thermometer and stirrer
45 parts by weight of toluene are charged into
After purging with gas, the mixture was heated to the boiling point of toluene. Torr
While stirring with ene refluxing, styrene 80
Parts by weight, 20 parts by weight of n-butyl acrylate, ben peroxide
A mixture of 8 parts by weight of Zoyl (polymerization initiator) was added for 2.5 hours.
Then, solution polymerization was carried out by dropping. After dropping, add toluene
Aging was performed for 1 hour while stirring under reflux. So
After that, gradually raise the temperature inside the flask to 180 ° C.
, The toluene is removed under reduced pressure to remove the copolymer resin (A).
Obtained. The weight average molecular weight of the obtained copolymer resin (A) is
8.8 × 10^ThreeAnd G ' ₁₂₀Is 2.1 × 10^TwoP
a and Tg were 55.4 ° C.

20% by weight of copolymer resin (A) in toluene
The coating liquid diluted in the above was gravure coated on the protective layer and dried at 150 ° C. for 1 minute to obtain a hot stamping foil having an adhesive layer having a thickness of 2 μm.

(Examples 2, 3 and Comparative Examples 1 to 4) The procedure of Example 1 was repeated except that the composition of the copolymer resin (A) and the amount of the polymerization initiator were as shown in Table 2. A copolymer resin (A) was produced, and a hot stamping foil was obtained using this.

The weight average molecular weight, _G'120 and T of the copolymer resin (A) shown in the above Examples 1 to 3 and Comparative Examples 1 to 4
g was as shown in Table 2.

[0039]

[Table 2]

Description of Abbreviations Used in Tables 2 and 3 St: Styrene BA: n-butyl acrylate MMA: Methyl methacrylate AAC: Acrylic acid MAH: Maleic anhydride MAAC: Methacrylic acid

(Examples 4 and 6, Comparative Examples 5 and 8)
A copolymer resin (B) was produced with the compositions and blending amounts of the low-molecular-weight copolymer (B1) and high-molecular-weight copolymer (B2) described as shown in Table 3. Each copolymer resin (B)
And the weight average molecular weights of the low molecular weight copolymer (B1) and the high molecular weight copolymer (B2), G ′ ₁₂₀ , T
g was as shown in Table 3. The above copolymer resin (B) was diluted to 20% by weight with toluene, and this was gravure coated on a protective layer formed in the same manner as in Example 1,
After drying at 150 ° C. for 1 minute, a hot stamping foil having a 2 μm-thick adhesive layer was obtained.

[0042]

[Table 3]

Evaluation Test The hot stamping foils obtained in Examples 1 to 6 and Comparative Examples 1 to 8 were superimposed on a flat plate of ABS resin so that the transfer layer was in contact with the hot stamping foil, and a hot silicone rubber plate heated from above was provided. It was stamped for 2 seconds by the up-down type stamping machine. The heating temperature is 160 ° C, 180 ° C,
The setting was performed at 00 ° C. in three ways. The prepared hot stamping foil transfer ABS flat plate was evaluated as follows, and the results are shown in Tables 4 and 5.

(1) Presence or absence of liquid dripping of the adhesive layer on the ABS flat plate It is visually observed whether or not there is a “drip” in which the adhesive layer protrudes from the contact portion between the hot stamping foil and the ABS flat plate and adheres to the flat plate. , Expressed by the following criteria. ×: Liquid dripping ○: No liquid dripping (2) Adhesion between hot stamping foil and ABS flat plate Commercially available cellotape (manufactured by Sekisui Chemical Co., Ltd., trade name “Cellotape # 252”, width 24 mm) on the upper surface of the protective layer A 90-degree peel test was performed after attaching, and the peel condition from the transfer surface was visually observed, and the result was represented by the following criteria. XX: Peeling over the entire surface X: Peeling about 50% or more of the whole area △ ^- : Peeling about 25 to 50% of the whole area △ ⁺ : Peeling about 25% or less of the whole area ○ ^- : Spot-like peeling and Approximately 5% or less of the entire area is peeled.

(3) Adhesion to the ABS flat plate after standing in a high temperature environment The adhesion between the hot stamping foil and the ABS flat plate after standing for 48 hours in a thermostat at 50 ° C. was visually observed.
The following criteria were used. ×: Peeling △: Slight edge peeling (approximately 5% or less of the total area) ○: No peeling (4) Evaluation of abrasion resistance Fixed to a friction fastness tester with the protective layer side up and fixed. , Put steel wool (# 0000) on the protective layer surface, 500g
After reciprocating the load 500 times and rubbing, the result of observing the degree of peeling was expressed on the same basis as the above (2).

[0046]

[Table 4]

[0047]

[Table 5]

As shown in Tables 2 and 5, the hot stamping foils of Examples 1 to 6 did not cause dripping during hot stamping and had good adhesion to the ABS plate. This is considered that stable adhesion with the ABS plate can be maintained even at a high temperature. Further, the hot stamping foils of Examples 4 to 6 had good abrasion resistance. On the other hand, Comparative Example 1
8 were inferior in any of the evaluation items.
From the above results, it is clear that the hot stamping foil of the present invention has an adhesive layer in which the softening temperature, adhesiveness, and resin strength are balanced.

[0049]

The hot stamping foil according to the present invention eliminates various disadvantages of thermoplastic resins conventionally used as an adhesive layer, and achieves a balance in softening temperature, adhesiveness and resin strength. It has an adhesive layer. The hot stamping foil according to claim 2, while improving the wear resistance and resin strength of the adhesive layer,
It has an adhesive layer that suppresses a rise in softening temperature and balances adhesiveness and resin strength.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram for explaining a configuration of a hot stamping wheel and a transfer method.

[Explanation of symbols]

 1: Base film 2: Release layer 3: Protective layer 4: Decorative layer 5: Adhesive layer 6: Transfer layer 7: Transfer surface 8: Heating plate H: Hot stamping foil

Claims (2)

[Claims] 1. A hot stamping foil comprising a base film on which at least a protective layer, a decorative layer and an adhesive layer are laminated in this order, wherein the adhesive layer has a styrene monomer and a (meth) acrylate monomer in the adhesive layer. The copolymer resin (A) has a weight average molecular weight of 3 × 10 ^{3 to} 5 × 10 ⁴ and a storage elastic modulus G ′ at 120 ° C. of 2.0 × A hot stamping foil characterized by having a glass transition temperature of 10 ³ Pa or less and 40 ° C. or more. 2. A hot stamping foil comprising at least a protective layer, a decorative layer and an adhesive layer laminated in this order on a base film, wherein the adhesive layer contains a styrene monomer and a (meth) acrylate monomer in a single And a low molecular weight copolymer (B1) having a weight average molecular weight M _WL of 3 × 10 ^{3 to} 5 × 10 ⁴ , and a copolymer resin (B). Average molecular weight M _WH is 8 × 10 ⁴ to 2
× 10 ⁶ high molecular weight copolymer (B2),
A hot stamping foil having a storage elastic modulus G ′ at 120 ° C. of 2 × 10 ³ Pa or less and a glass transition temperature of 40 ° C. or more.