JP2000223896A - Method and device for mounting electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To accurately mount electronic parts on their mounting positions provided on a substrate. SOLUTION: After substrate recognizing points 118 on a substrate 103 and parts recognizing points 117 on electronic parts 102 are recognized, the points 118 and 117 are moved to their designed positions. After movement, the parts recognizing points 117 are again recognized from an picked-up image and the re-recognized positions of the points 117 are found. Then the electronic parts 102 are mounted on the substrate 103 based on the found re-recognized positions. Since the re-recognized positions are used, the accuracy of the mounting position of the parts 102 can be improved as compared with the case where the parts 102 are mounted on the substrate 13 by only moving the points 117 to their designed positions.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting method for mounting an electronic component on a substrate, and an electronic component mounting machine for executing the electronic component mounting method.

[0002]

2. Description of the Related Art In recent years, flip-chip mounting, in which electronic components such as ICs are directly mounted on a circuit board, has been used in order to reduce the size and weight of electronic devices. In order to mount electronic components on a circuit board with high accuracy, after recognizing any two points on the electronic component and any two points on the circuit board,
Electronic component mounting methods for mounting are often used. Such a conventional electronic component mounting method will be described. As shown in FIGS. 18 and 19, a conventional electronic component mounting apparatus 20 that executes the electronic component mounting method includes an electronic component 2
A mounting head 1 for mounting the electronic component 2 on a circuit board 3 held by a stage 4 and an electronic component 2 by switching the field of view upward and downward.
And a camera 5 that can recognize the circuit board 3. The camera 5 is configured to freely move between the mounting head 1 located above the camera 5 and the circuit board 3 located below.
The image captured by is recognized by the image processing device 6. The camera 5 is provided on an imaging surface 2 a of the electronic component 2.
As shown in FIG. 19, an image of the pattern 7 in the two dotted frames and the two board marks 8 provided on the circuit board 3 are taken, and the image processing device 6 takes the position of each pattern 7 and The position of each substrate mark 8 is recognized.

Next, a conventional electronic component mounting process will be described with reference to FIGS. 18, 19 and 20. FIG. In step (indicated by "S" in the figure) 1, the camera 5
It moves to recognize the first point first board mark 8a on the circuit board 3 designated in advance among the board marks 8,
In step 2, the first substrate mark 8a is imaged, and the image processing device 6 obtains the position of the first substrate mark 8a, that is, the first recognition position of the substrate. In step 3, after the recognition in step 2 is completed, the camera 5 is moved to recognize the second second substrate mark 8b on the circuit board 3, and in step 4, the second substrate mark 8b is picked up and imaged. The processing device 6 obtains the position of the second substrate mark 8b, that is, the substrate second recognition position. In step 5, after completion of the position recognition of the second board mark 8b, the mounting head 1 moves above the mounting position on the circuit board 3 in the mounting data stored in the electronic component mounting apparatus 20, and 5 to 1 of electronic components 2
It is moved to a first pattern recognition position for recognizing the first pattern 7a of the dot. The mounting head 1 may be moved to a mounting position on the mounting data before executing the above-described board recognition. When the mounting head 1 moves, minute vibrations are often generated in the entire component mounting apparatus 20, and when the mounting head 1 is moved during the board recognition, the recognition position accuracy is deteriorated. The mounting head 1 is moved from before or before performing the board recognition.

In step 6, after the mounting head 1 and the camera 5 have been moved, the camera 5 captures the first pattern 7a of the electronic component 2 and the image processing device 6 recognizes the position of the first pattern 7a. In step 7, after completion of the recognition in step 6, the camera 5 is moved to a second pattern recognition position for recognizing the second pattern 7b of the second point of the electronic component 2, and in step 8, the camera 5 The image processing device 6 images the two patterns 7b and recognizes the position of the second patterns 7b.

In step 9, after the recognition in step 8 is completed, the camera 5 retreats to a position where it does not hinder the vertical movement of the mounting head 1, and the component mounting device 20
The mounting position of the electronic component 2 on the circuit board 3 is calculated based on the recognition result of the circuit board 3 and the electronic component 2, and the mounting head 1 is moved to the actual mounting position. Further, in step 10, the component mounting device 20 determines the electronic component 2 based on the above-described recognition result of the circuit board 3 and the electronic component 2.
Then, the mounting head 1 is rotated by correcting the rotation angle of the circuit board 3. Then, in step 11, after the retraction of the camera 5 is completed, the mounting head 1 is lowered, the held electronic component 2 is mounted on the circuit board 3, and is raised after mounting.

As described above, in the conventional electronic component mounting method, the mounting head 1 is moved to the mounting position on the mounting data so that the electronic component 2 is recognized and the circuit board 3 is mounted.
By adopting a configuration in which the upper two points and the two points on the electronic component 2 are imaged by the same camera 5, it is possible to minimize the influence of ambient environment changes such as temperature on mounting accuracy and realize high-precision mounting. ing.

As shown in FIG. 21, in the conventional recognition operation, the electronic component 2 captured by the camera 5 in step l2 is used.
Is compared with a mark registered in advance in the component mounting apparatus 20 to detect an alignment point used as a reference for calculation. In step S13, the number of pixels from the center of the image to the alignment point detected in step S12 is determined. In step S14, the obtained number of pixels is multiplied by a pre-registered camera scale, that is, a conversion coefficient indicating the number of microns per pixel, and how much the alignment point is shifted from the center of the screen. Is calculated. Note that the above steps 12 to
Each of the operations 14 is a processing operation in the recognition operation by the imaging operation performed in each of the above-described steps 2, 4, 6, and 8.

[0008]

In the conventional electronic component mounting method as described above, the board mark 8 and the pattern 7 are not used.
When the camera 5 is recognized, the camera 5 moves to a position designated in advance, so that the variation in the holding position of the electronic component 2 held in the mounting head 1 and the variation in the setting position of the circuit board 3 on the stage 4 The imaging position of the substrate mark 8 and the pattern 7 in the camera 5 is different each time. Therefore, factors such as distortion of the lens of the camera 5, how the illumination illuminating the circuit board 3 and the electronic component 2 illuminates the circuit board 3 and the electronic component 2 for the recognition operation, and the error of the camera scale Then, when the amount of deviation between the alignment point and the reference point of the image, that is, the center of the screen described above, varies,
An error is included in the calculation result of the shift amount between the alignment point and the center of the screen, and as a result, there is a problem that the electronic component 2 cannot be mounted at a correct position on the circuit board 3.

Further, when an attempt is made to recognize a component in a state where the component is rotated and held by the mounting head, the image is rotated with respect to the image stored in advance, and the alignment point is detected correctly. There is also a problem that it cannot be mounted in the correct position because it cannot be done. In addition, since the mounting head is rotated to place the component after component recognition, the rotation of the head causes a shift in the X and Y directions due to the reason that the rotation center of the mounting head is not accurately determined. There is also a problem that it cannot be mounted in a location. The present invention has been made in order to solve such a problem, and the mounting position on the substrate is not dependent on the holding position of the component, the inclination when setting the substrate, and the variation of the rotation center of the mounting head. It is an object of the present invention to provide an electronic component mounting method and an electronic component mounting device capable of mounting components accurately.

[0010]

To solve the above-mentioned problems, the present invention is configured as follows. That is, in the component mounting method according to the first aspect of the present invention, the first recognition point on the board placed on the board mounting member and the first recognition point on the electronic component held on the component holding member are provided. In the electronic component mounting method of mounting the electronic component on the board based on the respective recognition results obtained by recognizing the respective components and the mounting reference position on the mounting program, the board first recognition point on the board is The first recognition position of the board is obtained by recognizing the first recognition position of the component, the first recognition position of the component is obtained by recognizing the first recognition point of the component on the electronic component, and the first recognition position of the substrate and the first recognition position of the component are obtained. And, after moving at least one of the board and the electronic component in order to match the respective mounting reference positions corresponding to them, those that have moved within the board first recognition point and the component first recognition point. Again after moving To, the substrate first recognition position and the component first
Obtain a re-recognition position with a higher position accuracy than the recognition position, and position and mount the electronic component and the board at a mounting position based on the re-recognition position obtained by the re-recognition after the movement. , Characterized in that.

The component mounting method according to the second aspect of the present invention includes:
A different first recognition point and second recognition point of the substrate on the substrate placed on the substrate mounting member and a different first recognition point and second recognition point of the electronic component held on the component holding member. In the electronic component mounting method for mounting the electronic component on the substrate based on the respective recognition results obtained by the respective recognition and the mounting reference position on the mounting program, the first substrate recognition point on the substrate and the substrate Recognizing the second recognition point to obtain a board first recognition position and a board second recognition position, and recognizing the component first recognition point and the component second recognition point on the electronic component to obtain a component first recognition position. And the component second recognition position, and the board first recognition position, the board second recognition position, the component first recognition position, and the component second
After moving at least one of the board and the electronic component to match the recognition position with each of the mounting reference positions corresponding thereto, the board first recognition point, the board second recognition point, and the component After moving, the first recognition point and the component second recognition point that have moved are re-recognized, and the board first recognition position, the board second recognition position, and the component first
A recognition position, and a re-recognition position having a higher position accuracy than the component second recognition position are obtained, and the electronic component and the electronic component are moved to a mounting position based on the re-recognition position obtained by the re-recognition after the movement. The substrate is positioned and mounted.

According to the first and second aspects, the recognition points of the board and the electronic component are moved so as to coincide with the mounting reference position on the mounting program corresponding to, for example, the center position of the picked-up image. The recognition operation is performed again for the above recognition point to obtain a re-recognition position. Then, the electronic component is positioned and mounted at the mounting position based on the re-recognition position. For example, when the recognition point is moved to match the mounting reference position, there may still be an error between the moved position and the mounting reference position, but the position after the movement must be re-recognized. Thus, the re-recognition position is closer to the mounting reference position. As described above, the re-recognition position acts so that the component can be accurately mounted at the mounting position on the board.

[0013] In the component mounting method according to the second aspect, the re-recognition position is a position between the board first recognition position and a board first design position, which is the mounting reference position of the board first recognition point. The first displacement amount is obtained, and the first board recognition position is set to match the first board recognition position with the first board design position.
A board first re-recognition position obtained by re-recognizing the board first recognition point after moving the board according to the displacement amount, and the mounting of the board second recognition point and the board second recognition point. The second position of the substrate with the reference position of the second substrate on the design
The amount of displacement is determined, and after moving the substrate according to the amount of substrate second displacement in order to match the substrate second recognition position with the position of the substrate second design, the substrate second recognition point is recognized again. Obtaining a component first deviation amount between the obtained substrate second re-recognition position, the component first recognition position, and the component first design position which is the mounting reference position of the component first recognition point;
After moving the electronic component in accordance with the component first deviation amount in order to match the component first recognition position with the component first design position, the component first obtained by recognizing the component first recognition point is obtained. A second recognizing position between the component second recognizing position and a component second design position which is the mounting reference position of the component second recognizing point; After the electronic component is moved in accordance with the component second displacement amount in order to match the position with the component second design position, the component is re-recognized at the component second re-recognition position obtained by recognizing the component second recognition point. The electronic component and the board to a mounting position based on the obtained board first re-recognition position, board second re-recognition position, component first re-recognition position, and component second re-recognition position. It may be positioned and mounted.

Further, with this configuration, the recognition point on the substrate or the electronic component approaches the mounting reference position. Therefore, the re-recognition position on the board and the electronic component can be accurately determined without being affected by factors such as distortion of the lens of the camera that recognizes the electronic component or the board, how to hit the illumination, and registration error of the camera scale. So that it can be mounted on a substrate.

Further, in the component mounting method according to the second aspect, the re-recognition position may be such that a holding angle of the electronic component with respect to the component holding member obtained from the component first recognition position and the component second recognition position is the same. Rotate the electronic component around the axis of the component holding member to match the reference holding angle on the mounting program, and after the rotation of the electronic component,
Again, the component first re-recognition position and the component second re-recognition position obtained by recognizing the component first recognition point and the component second recognition point, the board first recognition position, the board second
A recognition position, the component first re-recognition position, and the component second
After moving the electronic component to the mounting position based on the re-recognition position, the electronic component may be rotated around the axis again to mount the electronic component on the board.

By adopting such a configuration, when the electronic component is rotated and held with respect to the reference position on the mounting program, the electronic component is rotated so as to coincide with the reference position, and thereby the electronic component is rotated. The part approaches the reference position. Furthermore, the re-recognition position is obtained by recognizing the rotated electronic component. Therefore, the re-recognition position acts so that components can be accurately mounted at the mounting position on the board.

Further, in the component mounting method according to the second aspect, the re-recognition position is a position between the board first recognition position and a board first design position which is the mounting reference position of the board first recognition point. After calculating the first displacement amount of the substrate and moving the substrate according to the first displacement amount of the substrate so that the first recognition position of the substrate coincides with the position of the first design of the substrate, the first recognition point of the substrate is again determined. A board second deviation amount between a board first re-recognition position obtained by recognition and the board second design position which is the mounting reference position of the board second recognition point and the board second recognition point. Moving the substrate in accordance with the substrate second shift amount in order to match the substrate second recognition position with the substrate second design position, and then re-recognizing the substrate second recognition point. 2 The re-recognition position, the component on the electronic component Determining the amount of rotation of the component holding member in the direction around the axis for matching the holding angle of the electronic component with respect to the component holding member obtained from the first recognition position and the component second recognition position to the reference holding angle on the mounting program; The component first deviation amount between the component first recognition position and the component first design position which is the mounting reference position of the component first recognition point, and the component second recognition position and the component second recognition point. A component second deviation amount from the component second design position, which is the mounting reference position, is obtained, and the electronic component is moved according to the component first deviation amount and the rotation amount. This is a component first re-recognition position obtained by recognition, and is obtained by re-recognizing the component second recognition point after moving the electronic component according to the component second shift amount and the rotation amount. Part 2 After the electronic component is moved to a mounting position based on the board first re-recognition position, the board second re-recognition position, the component first re-recognition position, and the component second re-recognition position. ,
The electronic component may be rotated around the axis again to mount the electronic component on the board.

With such a configuration, the electronic component approaches the reference position by rotating the electronic component so as to match the reference position on the mounting program. Further, the board and the electronic component are moved so as to match the mounting reference position. After such a movement, the electronic component is recognized again to obtain a re-recognition position. Therefore, the re-recognition position can accurately mount the electronic component on the substrate without being affected by factors such as distortion of the lens of the camera that recognizes the electronic component or the substrate, how to hit the illumination, and registration error of the camera scale. Act like so.

In the component mounting method according to the second aspect, the re-recognition position may be a mounting angle of the board obtained from the board first recognition position and the board second recognition position, which is a reference in the mounting program. A board rotation angle corresponding to the mounting angle is obtained, and a holding angle of the electronic component with respect to the component holding member obtained from the component first recognition position and the component second recognition position matches a reference holding angle in the mounting program. Determining the component rotation angle to be performed, rotating the electronic component in advance before mounting based on the board rotation angle and the component rotation angle, and re-recognizing the component first recognition point and the component second recognition point. The component first re-recognition position and the component second re-recognition position obtained in step (a), the board first recognition position, the board second recognition position, the component first re-recognition position, and the component To the mounting position based on re-recognition position may be implemented by positioning the electronic component and the substrate.

By adopting such a configuration, the component holding member is rotated in the direction around its axis after the component recognition, so that even if the electronic component is displaced in the X and Y directions, it is re-executed after the rotation. Recognition is performed and a re-recognition position is obtained. At the time of mounting, mounting is performed based on the re-recognition position of the electronic component without rotating the component holding member.
Therefore, the re-recognition position acts so that components can be accurately mounted at the mounting position on the board.

Further, in the component mounting method according to the second aspect, the re-recognition position is a position between the board first recognition position and a board first design position which is the mounting reference position of the board first recognition point. A board first re-recognition position obtained by retrieving the board first recognition point after obtaining the board first shift amount, moving the board according to the board first shift amount, and A board second shift amount between a position and a board second design position, which is the mounting reference position of the board second recognition point, is determined, and after moving the board according to the board second shift amount, the board is moved again. The board second re-recognition position obtained by recognizing the second recognition point. The component first re-recognition position and the component second re-recognition position are the board first re-recognition position and the board second re-recognition position. The mounting angle of the board obtained based on the position and the mounting A board rotation angle for making the above-mentioned mounting angle coincide with the reference mounting angle is obtained based on the reference mounting angle of the board on the system, and the holding angle of the electronic component with respect to the component holding member is determined by the mounting program. The component rotation angle that matches the reference holding angle of
A component first deviation amount between the recognition position and the component first design position, which is the mounting reference position of the component first recognition point, and the mounting reference position of the component second recognition position and the component second recognition point. A part second deviation amount from a certain part second design position is obtained, and the electronic component is moved before mounting according to the part first deviation amount, the board rotation angle, and the component rotation angle, and then, again, A component first re-recognition position obtained by recognizing a component first recognition point, and after moving the electronic component before mounting according to the component second shift amount, the board rotation angle, and the component rotation angle. The component second re-recognition position obtained by re-recognizing the component second recognition point. The board first re-recognition position, the board second re-recognition position, the component first re-recognition position, and the component second re-recognition position. Move to the mounting position based on the component second re-recognition position Child components and may be implemented by positioning the substrate.

By adopting such a configuration, by rotating the component holding member around its axis after the component recognition, even if the electronic component is displaced in the X and Y directions, it is re-executed after the rotation. Recognition is performed and a re-recognition position is obtained. Then, at the time of mounting, mounting is performed based on the re-recognized position on the board and the electronic component without rotating the component holding member. Therefore, the re-recognition position on the board and the electronic component acts so that the component can be accurately mounted at the mounting position on the board.

Further, the component mounting apparatus according to the third aspect of the present invention comprises:
The method is characterized by executing the component mounting method according to the first aspect or the second aspect.

[0024]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An electronic component mounting method according to an embodiment of the present invention and an electronic component mounting apparatus for executing the electronic component mounting method will be described below with reference to the drawings.
In the drawings, the same components are denoted by the same reference numerals. In the above-mentioned "means for solving the problem and action", "electronic parts" are not resin-sealed as well as semiconductor parts obtained by resin-sealing a semiconductor chip. The concept also includes bare chips,
The term “substrate” is a concept including, for example, a printed circuit board on which the semiconductor components and the like are mounted, as well as a silicon semiconductor substrate on which the bare chip is mounted. still,
In the embodiments described below, the semiconductor component is taken as an example of the “electronic component”, and a printed board is taken as an example of the “substrate”.

FIG. 1 shows the component mounting apparatus in the above embodiment.
6, and the basic configuration of the component mounting apparatus 120 is the same as the configuration of the conventional electronic component mounting apparatus 20 described with reference to FIG. That is, a mounting head 101 corresponding to the mounting head 1 described above and a substrate mounting member 104 corresponding to the stage 4 and mounting the substrate 103 thereon.
And a recognition device 105 corresponding to the camera 5 described above, an image processing device 106 corresponding to the image processing device 6 described above, and a control device 111 for performing characteristic operation control in the present embodiment. The mounting head 101 can be moved in the X and Y directions orthogonal to each other by a mounting head driving device 107. In the present embodiment, a component holding member 108 composed of a nozzle that suction-holds the electronic component 102 is used. Have. Furthermore, the mounting head driving device 107 can drive the component holding member 108 in the Z direction which is the thickness direction of the electronic component 102 held by the component holding member 108 and is orthogonal to the X and Y directions. Yes, and component holding member 108
Can be rotated around its axis. The operation of the mounting head 101 including the mounting head driving device 107 is controlled by the control device 111.

The substrate mounting member 104 mounts and holds the substrate 103, and the substrate mounting member driving device 109, which is controlled by the control device 111, controls the X and Y directions.
It can move in any direction. As in the case of the camera 5, the recognizing device 105 switches the field of view for both the electronic component 102 held by the component holding member 108 and the board 103 held by the board mounting member 104 to perform an imaging operation. Can be recognized. Here, in the present embodiment, as in the case of the above-described conventional example, as shown in FIG. 17, the object to be imaged by the recognition device 105 is the substrate first recognition point 118a and the substrate second recognition point 118a drawn on the substrate 103. A point 118b (these may be collectively referred to as a board recognition point 118), and a first component recognition point 117a and a second component recognition point 117b drawn on the electronic component 102.
(In some cases, these are collectively referred to as component recognition points 117.) In order to image these imaging targets, the recognition device 105 uses the recognition device driving device 110 to drive the X,
It is movable in the Y direction. Here, the driving device 1 for the recognition device
The operation of the operation 10 is controlled by the control device 111. Therefore, the movement amounts of the recognition device 105 in the X direction and the Y direction are known by the control device 111. The component holding member 1
When the electronic component 102 held at 08 is mounted on the substrate 103 by the mounting head 101, the recognition device 105 can be moved by the recognition device driving device 110 to a retracted position that does not affect the mounting operation.

Image information as a recognition result obtained by the image capturing operation of the recognition device 105 is supplied to the image processing device 106. The image processing device 106 performs image processing on the imaging information to identify the imaging target such as the substrate first recognition point 118a and obtains a coordinate position of the imaging target. The board first recognition point 118a and the board second recognition point 118b
In the present embodiment, the coordinate positions of the first recognition point 118a and the second recognition point 11
8b, which is the coordinate value of the center point 1181 in the present embodiment.
The coordinate positions of the component 7a and the component second recognition point 117b are, as shown in FIG. 17, the coordinate values of the alignment points of the component first recognition point 117a and the component second recognition point 117b, that is, the crossing points 1171 of the cross. Recognition device 1
The position of the recognition device 105 itself is necessary to obtain the movement amount in the X direction and the Y direction of the image 05. In this embodiment, the position of the recognition device 105 is obtained from the recognition device 105, for example, an image 139 shown in FIG. Is determined as the position of the recognition device 105.

On the other hand, before starting the mounting operation, the control device 111 stores the electronic components 10 mounted on the substrate 103 in advance.
For 2, the mounting program including the mounting position information on the substrate 103 is supplied. Note that the mounting position information described in the mounting program corresponds to a design position. The movement of the mounting head 101, the recognition device 105, and the movement of the substrate mounting member 104 are controlled by the control device 111 in accordance with the mounting position information described in the mounting program. Therefore, the substrate 103 is always placed at a predetermined mounting position on the substrate mounting member 104 without deviation, and the component holding member 108 always holds the electronic component 102 at the predetermined holding position without deviation. If it is stored, the position of the recognition device 105, that is, the image 1 of the recognition device 105
39 and the substrate first recognition point 118a
And each center point 118 in the substrate second recognition point 118b
1, component first recognition point 117a and component second recognition point 1
Each intersection point 1171 in 17b matches. However, in practice, the mounting position of the substrate 103 and the holding position of the electronic component 102 deviate from predetermined positions, so that the center point 1391 of the image 139 of the recognition device 105, the substrate first recognition point 118a, and the substrate second recognition point The respective center points 1181 and the respective intersections 1171 at 118b are shifted. Therefore, the control device 111 will be described later in order to compensate for a deviation between the center point 1391 of the image 139 and the center points 1181 and the intersection points 1171 at the board first recognition point 118a and the board second recognition point 118b. A control operation is performed, and in this embodiment, the mounting head driving device 107 is operated, and the electronic component 102 is mounted accurately at the mounting position on the substrate 103. Here, the deviation to be compensated includes (1) the deviation in the X and Y directions,
(2) Deviation of the mounting angle between the reference mounting position on the mounting program of the substrate 103 mounted on the substrate mounting member 104 and the actual mounting position, and the electronic component 102 held by the component holding member 108 At least one of the above (1) and (2) above corresponds to the deviation of the holding angle between the reference holding position on the mounting program and the actual holding position.

In this embodiment, as described above, the mounting head 101 and the substrate mounting member 104 can move in the X and Y directions, but the mounting head 101 can move only in the X direction, for example. The placement member 104 may be movable only in the Y direction orthogonal to the X direction.

With respect to the operation of the electronic component mounting apparatus 120 configured as described above, the operation of the control device 111 will be mainly described below. Therefore, the description will be started from a state where the substrate 103 is mounted on the substrate mounting member 104 and the mounting head 101 holds the predetermined electronic component 102 according to the mounting program. First Embodiment: First, in step (shown by "S" in the figure) 100 shown in FIG. 1, the recognition device 105 is moved to a place corresponding to the first recognition point 118a on the substrate. Next, in step 101, the recognition device 105 images the first recognition point 118a of the substrate. Which is the imaging result,
An image 139 as shown in FIG. 4 is sent to the image processing device 106, processed by the image processing device 106, and then supplied to the control device 111. Then, the control device 111
The coordinate position of the center point 1181 of the board first recognition point 118a is obtained, and the coordinate position is set as the board first recognition position 1181-1. Further, the control device 111 controls the substrate first recognition point 118a.
The amount of movement of the substrate placing member 104 is determined to make the center point 1181 of the image coincide with the center point 1391 of the image 139.
At this time, the recognition device 10 is used instead of the substrate mounting member 104.
5 may be moved. In the present embodiment, as a method of obtaining the above-described movement amount, the center point 1181 of the substrate first recognition point 118a is used.
The number of pixels corresponding to the distance between the image and the center point 1391 of the image 139 is the camera scale (μm
/ Pix) to calculate how many μm the center point 1181 deviates from the center point 1391. In the present embodiment and each of the embodiments described later, the mounting accuracy of the electronic component 102 on the substrate 103 is set to 3 μm or less as a value of 3σ in the standard deviation in the present embodiment.

In step 102, the control device 111
According to the obtained movement amount, the substrate first recognition point 118a
The substrate placing member 104 is moved so that the center point 1181 of the image coincides with the center point 1391 of the image 139. As described above, the recognition device 105 is used instead of the substrate mounting member 104.
Can also be moved. In step 103, the recognition device 105 recognizes again the substrate first recognition point 118a after the movement. FIG. 5 obtained by the re-recognition
Is sent to the image processing device 106,
After the image processing, the first recognition point 118 of the substrate is
The coordinate position of the center point 1181 of a is obtained, and the coordinate position is set as the substrate first re-recognition position 1182-1.

Next, the above steps 100 to 10
In the same manner as in step 3, the substrate second recognition point 118b is recognized in steps 104 to 107. That is, in step 104, the recognition device 105 is moved to the second recognition point 118b of the substrate. In step 105, the image of the substrate second recognition point 118b is
5 and the captured image is processed by the image processing device 106. The control device 111 sets the center point 1181 of the board second recognition point 118b as the board second recognition position 1181-2,
The amount of movement of the substrate mounting member 104 is determined so that the center point 1181 matches the center point 1391 of the image 139. In step 106, the substrate placing member 104 is moved so that the center point 1181 coincides with the center point 1391 of the image 139 according to the amount of movement, and in step 107, the moved substrate second recognition point 118b is again moved. Recognize by imaging. Then, the control device sets the center point 1181 of the recognized board second recognition point 118b to the board second re-recognition position 11b.
82-2.

Next, the electronic component 102 is recognized. In step 108, the recognition device 105 is moved to a location corresponding to the component first recognition point 117a. Then step 1
At 09, the first recognition point 11 of the component is recognized by the recognition device 105.
The part 7a is imaged. The image 132 as shown in FIG. 6, which is the imaging result, is transmitted to the image processing device 106, processed by the image processing device 106, and then supplied to the control device 111. Then, the control device 111 obtains the coordinate position of the center point 1171 of the component first recognition point 117a and sets the coordinate position as the component first recognition position 1171-1. Further, the control device 111 controls the center point 117 of the component first recognition point 117a.
1 to match the center point 1321 of the image 132
The movement amount of the component holding member 108 is obtained. The method of obtaining the movement amount is the same as that of the above-described substrate 103, and the control device 111 calculates how many microns the center point 1171 is shifted from the center point 1321.

At step 106, the control device 111
According to the obtained movement amount, the component first recognition point 117a
The component holding member 108 is moved so that the center point 1171 of the image coincides with the center point 1321 of the image 132. In step 107, the component first recognition point 1 after the movement
17a is recognized again by the recognition device 105. The image 133 shown in FIG.
After the image processing, the controller 111 calculates the coordinate position of the center point 1171 of the component first recognition point 117a, and sets the coordinate position as the component first re-recognition position 1172-1.

Next, in the same manner as in steps 108 to 111, the parts second recognition point 117b is recognized in steps 112 to 115. That is, in step 111, the recognition device 105 is moved to the part second recognition point 117b. In step 112, as shown in FIG. 7, the image of the component second recognition point 117b is captured by the recognition device 105, and the captured image is processed by the image processing device 106. The control device 111 controls the component second recognition point 1
The center point 1171 of 17b is set to the component second recognition position 1171-
2, and the center point 1171 is set to the center point 13 of the image 132.
The amount of movement of the component holding member 108 to match the value 21 is obtained. In step 113, the component holding member 108 is moved so that the center point 1171 coincides with the center point 1321 of the image 132 according to the movement amount.
At 15, as shown in FIG. 9, the component second recognition point 117b after the movement is again imaged and recognized. And the control device is
The center point 1171 of the component second recognition point 117b recognized again.
Is the component second re-recognition position 1172-2.

In the next step 116, the above step 1
03, the board first re-recognition position 1182-1 and the board second re-recognition position 118 obtained by executing the steps 107, 111 and 115.
2-2, the controller 111 moves the component holding member 108 based on the component first re-recognition position 1172-1 and the component second re-recognition position 1172-2. At this time, in step 117, in order to correct the position of the electronic component 102 so that the electronic component 102 is mounted at a predetermined position on the substrate 103, the component holding member 108 holding the electronic component 102 is rotated around its axis. Rotate in the direction. That is, for example, while the state shown in FIG. 12 is the reference position of the board 103 on the mounting program, that is, the mounting position in design, the board 103 is actually tilted as shown in FIG. It is assumed that it is mounted. At this time, the control device 111 recognizes in advance the substrate first recognition position 1181-1 and the substrate second recognition position 1181-2 at the mounting position in the design of FIG. 12, and as described above, the control device 111 13, the substrate first re-recognition position 1182-1 at the substrate first recognition point 118a at the actual mounting position of the substrate 103 in the state shown in FIG. 13, and the substrate second re-recognition position 1182 at the substrate second recognition point 118b. −
Ask for 2. Therefore, the control device 111 includes the above-described designed substrate first recognition position 1181-1 and substrate second recognition position 1181-2 as shown in FIG. 12, and the actual substrate first re-recognition position as shown in FIG. Based on the 1182-1 and the board second re-recognition position 1182-2, a mounting angle 141, which is a rotation angle of the actual board position with respect to the board position on the mounting program, that is, the design, is obtained. Further, similarly to the case of the substrate 103, the electronic component 102 also
The control device 111 includes a reference position in the mounting program, that is, a first component recognition position 1171-1 and a second component recognition position 1171-2 in design, and an actual component first re-recognition position 1172-1 and a component first recognition position 1172-1. Based on the 2 re-recognition position 1172-2, a holding angle which is a rotation angle of the actual component holding position with respect to the designed component holding position is obtained.

The control device 111 rotates the component holding member 108 in the direction around its axis based on the above-mentioned placement angle and the above-mentioned holding angle. In step 118, the electronic component 102 is mounted on the substrate 103.

The operation of the first embodiment described above has the following advantages. That is, as described above, when the component recognition point 117 and the board recognition point 118 do not coincide with the center point of the image at the time of imaging, the shift amount is obtained based on the number of pixels and the camera scale. However, when the measurement accuracy of the camera scale is not good or when the recognition device 1
In the case where the camera lens at 05 has distortion, the center position of the component recognition point 117 and the board recognition point 118 and the above-mentioned shift amount include an error, and as a result, the component mounting position is shifted. become. For example, if the measurement error of the camera scale is 1% and the number of pixels from the image center point to the center position of the component recognition point 117 or the board recognition point 118 is 100 pixels, in the conventional case, one pixel is mounted. It leads to displacement.

On the other hand, in the above-described embodiment, step 103, step 107, step 11
1. In step 115, after moving the electronic component 102 or the board 103 so that the image center point matches the center position of the component recognition point 117 or the board recognition point 118, the component recognition point 117 or The center position of the board recognition point 118 is recognized, and the camera scale is applied based on the obtained re-recognition position. In other words, the measurement error 1 is added to the re-recognition position obtained by performing the re-recognition on the one including the above-mentioned one pixel shift.
% Of the above camera scale. Therefore, when the mounting position is obtained, the mounting position shifts by 1% of the above-mentioned one pixel, that is, 0.01 pixel, and the shift of the mounting position can be greatly reduced as compared with the related art.

When the lens of the camera is distorted, even if the holding position of the electronic component 102 on the mounting head 101 is different from the design position, the above-described step 1 is performed.
At the time of the second recognition in 11 and 115, since the camera is moved so as to be projected at almost the same position of the camera, it is hardly affected by lens distortion.

In the first embodiment, the electronic component 102
And the substrate 103, two points each,
a, 117b and recognition points 118a, 118b. This is, as described above, the electronic component 102 and the substrate 1
This is for obtaining the rotation angle for each of the numbers 03. However, the electronic component 102
When it is not necessary to determine the rotation angle when the rotation of both the electronic component 102 and the substrate 103 is not performed, or the rotation error is ignored, or the like, one recognition point may be provided for each of the electronic component 102 and the substrate 103. The operation in the case of such a configuration is described in steps 104 to 107 and steps 112 to 1 described above.
This is an operation in which the execution in step 15 is deleted.

Further, in order to recognize the electronic component 102, illumination is applied from the camera side of the recognition device 105 to the electronic component 102 and the recognition point 1 on the board 103.
17 and 118 can be captured clearly. However, when the recognition points 117 and 118 are not at specific positions on the screen, the way of lighting is different.
118 The way shadows of themselves and other patterns change,
As a result, the center point of the detected recognition points 117 and 118 may be out of order. However, the recognition point 11
Recognition device 105 so that 7, 118 always appear in the same position.
Is moved, it is possible to always illuminate the recognition points 117 and 118 in the same manner.
Such erroneous recognition can be prevented.

In the first embodiment, the first substrate
The recognition of the recognition point, the recognition of the second recognition point of the board, the recognition of the first recognition point of the component, and the recognition of the second recognition point of the component are performed in this order, but are not limited to this order. For example, replacement may be performed as in the recognition of the board first recognition point, the recognition of the component first recognition point, the recognition of the board second recognition point, and the recognition of the component second recognition point.

In the first embodiment, the first substrate
Each re-recognition operation such as recognition point is performed twice,
Any number of times may be used as long as two or more times. By performing the operation three times or more, the mounting accuracy can be further improved.

Second Embodiment: The Electronic Component Mounting Apparatus 12
The control device 111 of 0 can also operate as follows. In step 200 shown in FIG.
05 is moved to a place corresponding to the substrate first recognition point 118a. Next, in step 201, the recognition device 105 captures an image of the substrate first recognition point 118a. The obtained image is sent to the image processing device 106, subjected to image processing, and then supplied to the control device 111. Control device 111
Then, as in the case of the above-described first embodiment, the center point 1181 of the substrate first recognition point 118a is moved to the substrate first recognition position 11a.
81-1.

In step 202, the recognition device 105 is moved to a place corresponding to the substrate second recognition point 118b. In the next step 203, the recognition device 105 takes an image of the second recognition point 118b on the substrate. The obtained image is sent to the image processing device 106, subjected to image processing, and then supplied to the control device 111. In the control device 111, the center point 1181 of the board second recognition point 118b is set as the board second recognition position 1181-2.

As in steps 200 to 203 described above,
In steps 204 to 207, the component first recognition point 117 is used.
a, the recognition operation is performed on the component second recognition point 117b, and the control device 111 sets the intersection 1171 of the component first recognition point 117a as the component first recognition position and sets the component second recognition point 1
The intersection 1171 of 17b is the component second recognition position.

In the next step 208, the above step 2
The first substrate recognition position and the second substrate
Recognition position, component first recognition position 1171-1 and component second recognition position 117 obtained in steps 205 and 207
As described in the first embodiment, the control device 111 uses the electronic component 102 and the board 103
The above-mentioned holding angle in the direction around the axis of the component holding member 108 at each of the designed position and the actual position is obtained. Then, the control device 111 rotates the component holding member 108 in the direction around its axis so that the electronic component 102 is arranged at the designed component holding position.

In step 209, after the rotation of the electronic component 102, the recognizing device 105 is moved again to the component first recognition point 117a, and in step 210, as shown in FIG. Recognition device 10
Image is taken at 5. The obtained image is sent to the image processing device 106, subjected to image processing, and then supplied to the control device 111. In the control device 111, the component first recognition point 117a
Is set as the component first re-recognition position 1172-1. As in Steps 209 to 210, Step 21
At 1 to 212, an image is taken of the component second recognition point 117b. The captured image is shown in FIG. Further, the control device 111 sets the center point 1171 of the component second recognition point 117b.
Is the component second re-recognition position 1172-2. In the next step 213, the above steps 201 and 20
3. The board first recognition position 1181-1, the board second recognition position 1181-2, and the component first re-recognition position 11 obtained in step 210 and step 212.
Based on 72-1 and the second component re-recognition position 1172-2, the control device 111 moves the mounting head 1 after obtaining the mounting position.

In step 214, the control device 111
The board first recognition position 1181-1 and the board second recognition position 11 obtained in step 201, step 203, step 210, and step 212, respectively.
81-2, the component holding member 108 is rotated around its axis based on the holding angle obtained based on the component first re-recognition position 1172-1 and the component second re-recognition position 1172-2, At step 215, the mounting head 1
01 mounts the electronic component 102 on the substrate 103.

The operation of the second embodiment described above has the following advantages. That is, the electronic component 102 is supplied from a supply head (not shown) to the mounting head 101 or
Alternatively, the electronic component 102 is held from a tray or the like by the direct mounting head 101, and is held in a state where the electronic component 102 is rotated around the axis of the component holding member 108 with respect to the designed holding position at the time of the transfer. Sometimes. In particular, when the transfer operation is not stable with a microchip or the like, the holding angle in the direction around the axis differs for each electronic component 102, and it becomes difficult for the recognition device 105 to correctly detect the component recognition point. As a result, the electronic component 102 cannot be mounted at a correct position on the substrate 103.

In the second embodiment, the first component recognition position 1171-1 and the second component recognition position 1171-2 are used.
The electronic component 102 held by the component holding member 108 is rotated in the direction around the axis by any angle as compared with the designed position based on the design positions corresponding to these. Is held. Therefore,
The rotation of the electronic component 102 in the direction around the axis is corrected by rotating the component holding member 108 by the rotation angle.
Then, after the correction, the component first recognition point 117a and the component second recognition point 117b are recognized again, and the component first recognition point 117b is recognized.
Re-recognition position 1172-1 and component second re-recognition position 1
172-2, and the part first re-recognition position 1172-1
Then, the rotation of the electronic component 102 in the direction around the axis is corrected again using the component second re-recognition position 1172-2.
Therefore, the electronic component 102 is located at the mounting position on the substrate 103.
Can be implemented with high accuracy.

Also in the second embodiment, the electronic component 10
2 and the recognition order of the recognition points 117 and 118 on the board 103 are not limited to the above-described order. For example, the recognition of the board first recognition point, the recognition of the component first recognition point, the recognition of the board second As in the recognition of the recognition points and the recognition of the component second recognition points, the replacement may be performed. Further, the re-recognition operation of the component first recognition point and the component second recognition point is performed twice each, but may be performed any number of times as long as it is performed twice or more. By performing the operation three times or more, the mounting accuracy can be further improved.

In the above-described second embodiment, the first board recognition position 1181-1 and the second board recognition position 118 are used.
1-2, the electronic component 102 is mounted on the board 103 based on the component first re-recognition position 1172-1 and the component second re-recognition position 1172-2. As a modification of the second embodiment, The combination with the operation in the above-described first embodiment can also be achieved. That is, the substrate first re-recognition position 1182-1 and the substrate second re-recognition position 1182-2 described in the first embodiment are used. Furthermore, regarding the electronic component 102, the component first recognition position 1171-
1, the component first deviation amount, which is the amount of deviation between the position 1 and the design position of the component first recognition point 117a, and the component second recognition position 11
A part second deviation amount, which is a deviation amount between the designed position of the part second recognition point 117b and the part second recognition point 117b, is obtained.
Electronic component 1 described in the shift amount and the second embodiment
After moving the electronic component 102 according to the rotation angle of 02, the component first recognition point 117a is recognized again, so that the component first re-recognition position 1172-
Get 1. Further, after the electronic component 102 is moved in accordance with the component second shift amount and the rotation angle, the component second recognition position 1172-2 in the modification is changed by re-recognizing the component second recognition point 117b. obtain. And
The component first re-recognition position 1172-1 in the modified example thus obtained, the component second re-recognition position 1172-2 in the modified example, and the board first re-recognition position 1182.
-1, and the electronic component and the board are positioned and mounted at a mounting position based on the board second re-recognition position 1182-2.

Third Embodiment: The Electronic Component Mounting Apparatus 12
The zero control device 111 can also operate as follows. FIG. 3 shows the operation in the third embodiment. The characteristic operations in the third embodiment are steps 308, 313, and 314.
The operations of 00 to 307 are the same as the operations of steps 200 to 207 described in the above-described second embodiment, and the operations of steps 309 to 312 are performed in steps 209 to 209 described in the above-described second embodiment. The operation at 212 is the same. Therefore, the operations of steps 300 to 307 and steps 309 to 312 will be briefly described. In the above-described second embodiment, as described in step 214, the component holding member 108 is rotated around its axis during mounting. However, in the third embodiment, the rotation of the component holding member 108 during mounting is performed. lost. This will be described in detail below.

At steps 300 to 307, the control device 1
11 is the board first recognition position 1181-1, the board second recognition position 1181-2, the component first recognition position 11
71-1 and the component second recognition position 1171-2 are obtained.
In step S308, steps 301 and 30
3, the board first recognition position 1181-1 and the board second recognition position 118 obtained in steps 305 and 307.
1-2, component first recognition position 1171-1, and component second
As described in the first embodiment, using the recognition position 1171-2, the control device 111 controls the component holding member between the design position and the actual position of the electronic component 102 and the board 103. The rotation angle around the axis 108 is obtained. That is, with the design position of the substrate 103 on the substrate mounting member 104 as shown in FIG. 12, the substrate 1 actually mounted on the substrate mounting member 104
Assuming that the position No. 03 is in the state as shown in FIG. 13, the control device 111 determines the position on the design, the board first recognition position 1181-1 and the board second recognition position 1
The rotation angle 141 of the substrate 103 shown in FIG. 13 with respect to the state shown in FIG. 12 is obtained based on 181-2. Similarly, the electronic component 1 actually held by the component holding member 108
Assuming that the position No. 02 is in a state as shown in FIG. 15, the control device 111 determines the position on the design, the component first recognition position 1171-1 and the component second recognition position 1
171-2 with respect to the design position based on 171-2.
The rotation angle 142 of the electronic component 102 shown in FIG. Then, the control device 111 controls the rotation angle 141 of the substrate 103.
Then, the component holding member 108 is rotated around its axis so that the rotation angle 142 of the electronic component 102 matches the rotation angle 142.

The rotation angle 141 of the substrate 103,
When matching the rotation angle 142 of the electronic component 102, it is necessary to consider the rotation angle of the camera of the recognition device 105 itself. In this embodiment, it is assumed that there is no rotation angle of the camera itself. However, in order to further increase the mounting accuracy, it is necessary to determine the rotation angle of the component in consideration of the rotation angle of the camera itself.

Steps 309 to 309 after such a rotation operation
In 312, the component first recognition point 117a and the component second recognition point 117b are again imaged by the recognition device 105,
By recognizing, the control device 111 sets the component first re-recognition position 1172-1 and the component second re-recognition position 11
72-2 is obtained. 14 shows an image in re-recognition of the component first recognition point 117a in step 310, and FIG. 15 shows an image in re-recognition of the component second recognition point 117b in step 312.

In the next step 313, the above step 3
01, 303, 310, and 312, the first substrate recognition position 1181-1 and the second substrate recognition position 11
81-2, the component first re-recognition position 1172-1, and the component second re-recognition position 1172-2, the control device 111 determines the mounting position, and then moves the mounting head 1. Then, in step 314, the mounting head 10
1 mounts the electronic component 102 on the substrate 103.

The operation of the third embodiment described above has the following advantages. That is, in the above-described second embodiment, the component holding member 108 is rotated around its axis again at the time of mounting in step 214, but in the third embodiment, the electronic component 102 and the substrate 103 are connected in step 308. The component holding member 108 is not rotated during mounting. That is, after the recognition operation is completed, the component holding member 10
8 is rotated around its axis, if the rotation center of the component holding member 108 is not fixed at one point, or if there is a measurement error of the rotation center, the mounting position accuracy will deteriorate. Become. However, in the third embodiment, since the component holding member 108 is not rotated at the time of mounting, X and Y generated by the rotation of the component holding member 108 are not used.
The displacement of the electronic component 102 in the direction can be eliminated, and the electronic component 102 can be mounted with high positional accuracy.

In the third embodiment, the electronic component 10
2 and the recognition order of the recognition points 117 and 118 on the board 103 are not limited to the above-described order. For example, the recognition of the board first recognition point, the recognition of the component first recognition point, the recognition of the board second As in the recognition of the recognition points and the recognition of the component second recognition points, the replacement may be performed. Further, the re-recognition operation of the component first recognition point and the component second recognition point is performed twice each, but may be performed any number of times as long as it is performed twice or more. By performing the operation three times or more, the mounting accuracy can be further improved.

In the third embodiment, the first board recognition position 1181-1 and the second board recognition position 118 are used.
1-2, the electronic component 102 is mounted on the board 103 based on the component first re-recognition position 1172-1 and the component second re-recognition position 1172-2. As a modification of the third embodiment, The combination with the operation in the above-described first embodiment can also be achieved. That is, the substrate first re-recognition position 1182-1 and the substrate second re-recognition position 1182-2 described in the first embodiment are used. Furthermore, regarding the electronic component 102, the component first recognition position 1171-
1, the component first deviation amount, which is the amount of deviation between the position 1 and the design position of the component first recognition point 117a, and the component second recognition position 11
A part second deviation amount, which is a deviation amount between the designed position of the part second recognition point 117b and the part second recognition point 117b, is obtained.
Electronic component 1 described in the shift amount and the third embodiment
After moving the electronic component 102 according to the rotation angle of 02, the component first recognition point 117a is recognized again, so that the component first re-recognition position 1172-
Get 1. Further, after the electronic component 102 is moved in accordance with the component second shift amount and the rotation angle, the component second recognition position 1172-2 in the modification is changed by re-recognizing the component second recognition point 117b. obtain. And
The component first re-recognition position 1172-1 in the modified example thus obtained, the component second re-recognition position 1172-2 in the modified example, and the board first re-recognition position 1182.
-1, and the electronic component and the board are positioned and mounted at a mounting position based on the board second re-recognition position 1182-2.

In the first to third embodiments, both the board recognition point 117 and the component recognition point 118 are divided into two fields of view for recognition. Is low, the component first recognition point 117a and the component second recognition point 117b can be imaged at the same time, or the board first recognition point 118a and the board second recognition point 118b can be imaged at the same time. , May be recognized at once. In the above-described first to third embodiments, the recognition of the board 103 and the electronic component 102 is performed by the camera of the same recognition device 105. However, a plurality of recognitions such as a component camera and a board camera are performed. It is also possible to adopt a configuration in which a device is provided for recognition. When such a configuration is adopted, the component recognition point 117 of the electronic component 102 and the board recognition point 118 of the board 103 may be simultaneously recognized.

[0064]

According to the electronic component mounting method of the first and second aspects of the present invention and the electronic component mounting apparatus of the third aspect,
Recognition operation is performed again on the substrate and the electronic component that have moved to match the reference position on the mounting program, and the re-recognition position is obtained. Then, the electronic component is positioned and mounted at the mounting position based on the re-recognition position. For example, there is a case where an error still exists between the position after the movement and the above-described design position simply by moving the reference position so as to match the reference position. Then, by mounting the electronic component based on the re-recognition position, the electronic component can be mounted closer to the design position. That is, components can be accurately mounted at mounting positions on the board.

[Brief description of the drawings]

FIG. 1 is a flowchart illustrating an electronic component mounting method according to a first embodiment of the present invention.

FIG. 2 is a flowchart illustrating an electronic component mounting method according to a second embodiment of the present invention.

FIG. 3 is a flowchart illustrating an electronic component mounting method according to a third embodiment of the present invention.

FIG. 4 is a diagram showing a state of a visual field in which a board recognition point is recognized in the electronic component mounting method in each of the above embodiments.

FIG. 5 is a diagram illustrating a state of a visual field in which a board recognition point is recognized in the first embodiment.

FIG. 6 is a diagram illustrating a state of a visual field in which a component first recognition point is recognized in the electronic component mounting method in each of the above embodiments.

FIG. 7 is a diagram illustrating a state of a visual field in which a component second recognition point is recognized in the electronic component mounting method in each of the above embodiments.

FIG. 8 is a diagram showing an image when the component first recognition point is moved to the image center position in the first embodiment.

FIG. 9 is a diagram showing an image when the component second recognition point is moved to the image center position in the first embodiment.

FIG. 10 is a diagram illustrating a state of a visual field in which a component first recognition point is recognized in the electronic component mounting method according to the second embodiment.

FIG. 11 is a diagram illustrating a state of a visual field in which a component second recognition point is recognized in the electronic component mounting method according to the second embodiment.

FIG. 12 is a diagram showing a design position of a board recognition point in the third embodiment.

FIG. 13 is a diagram showing actual positions of board recognition points in the third embodiment.

FIG. 14 is a diagram illustrating a state of a visual field in which a component first recognition point is recognized in the third embodiment.

FIG. 15 is a diagram showing a state of a visual field in which a component second recognition point is recognized in the third embodiment.

FIG. 16 is a diagram illustrating a schematic configuration of an electronic component mounting apparatus that executes the electronic component mounting method according to the first to third embodiments.

FIG. 17 is a diagram showing recognition points written on a board and an electronic component used in the electronic component mounting methods of the first to third embodiments.

FIG. 18 is a view showing a schematic configuration of a conventional electronic component mounting apparatus.

FIG. 19 is a diagram illustrating recognition points written on a board and an electronic component used in a conventional electronic component mounting apparatus.

FIG. 20 is a flowchart showing a conventional electronic component mounting method.

FIG. 21 is a flowchart showing a recognition process in a conventional electronic component mounting method.

[Explanation of symbols]

Reference numeral 102: electronic component, 103: substrate, 104: substrate mounting member, 105: recognition device, 106: image processing device, 108
... Component holding member, 111 ... Control device, 117 ... Component recognition point, 117a ... Component first recognition point, 117b ... Component second recognition point, 118 ... Board recognition point, 118a ... Board first recognition point, 118b ... Board number 2 recognition points, 120: electronic component mounting apparatus.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Hiroshi Wada 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture F-term in Matsushita Electric Industrial Co., Ltd. 3C030 DA04 DA05 DA36 DA37 5E313 AA02 AA11 CC03 CC04 DD13 EE02 EE03 EE24 EE35 EE37 FF24 FF26 FF28 FF32

Claims (8)

[Claims] A first recognition point (118a) on a substrate (103) mounted on a substrate mounting member (104), and an electronic component (10) held on a component holding member (108).
2) An electronic component mounting method for mounting the electronic component on the board based on the respective recognition results obtained by recognizing the above component first recognition points (117a) and the mounting reference position on the mounting program. Recognizing the board first recognition point on the board to obtain a board first recognition position;
Recognizing a recognition point to obtain a component first recognition position, the board first recognition position, and the component first recognition position;
After moving at least one of the board and the electronic component in order to match the mounting reference position corresponding to each of them, move one of the board first recognition point and the component first recognition point that has moved. After re-recognition, a re-recognition position having a higher position accuracy than the board first recognition position and the component first recognition position is obtained. And mounting the electronic component and the substrate at a mounting position based on the electronic component. 2. A different substrate first recognition point and a second recognition point (118a, 118b) on a substrate (103) mounted on a substrate mounting member (104) and held by a component holding member (108). Different components on the electronic component (102)
An electronic component mounting method for mounting the electronic component on the substrate based on a recognition result obtained by recognizing a recognition point and a second recognition point (117a, 117b) and a mounting reference position on a mounting program, respectively. Recognizing the board first recognition point and the board second recognition point on the board to obtain a board first recognition position and a board second recognition position; and obtaining the component first recognition point and the board on the electronic component. Part 2
Recognizing a recognition point to obtain a component first recognition position and a component second recognition position, the board first recognition position, the board second recognition position, the component first recognition position, and the component second recognition position. After moving at least one of the board and the electronic component to match the mounting reference positions corresponding to these, the board first recognition point, the board second recognition point, and the component first recognition The point and the component second recognition point, which has moved, are recognized again after moving, and the board first recognition position, the board second recognition position, the component first recognition position, and the component second recognition position. Obtaining a re-recognition position with a higher positional accuracy than that of the above, positioning and mounting the electronic component and the board to a mounting position based on the re-recognition position obtained by the re-recognition after the movement. Electronic component mounting method characterized by . 3. The re-recognition position is obtained by calculating a first displacement amount of the substrate between the first recognition position of the substrate and a first design position of the substrate which is the mounting reference position of the first recognition point of the substrate. After relocating the substrate in accordance with the first displacement amount of the substrate so that the first recognition position coincides with the position on the first design of the substrate, the substrate first re-recognition obtained by re-recognizing the substrate first recognition point A board second deviation amount between the board second recognition position and a board second design position, which is the mounting reference position of the board second recognition point, is determined. A board second re-recognition position obtained by re-recognizing the board second recognition point after moving the board according to the board second shift amount so as to match the second design position. 1 recognition position and the mounting reference position of the component first recognition point After obtaining a component first deviation amount from a certain component first design position, and moving the electronic component according to the component first deviation amount so that the component first recognition position matches the component first design position A component first re-recognition position obtained by re-recognizing the component first recognition point; and a component second design that is the component second recognition position and the mounting reference position of the component second recognition point. The electronic component is moved in accordance with the component second deviation amount in order to obtain the component second deviation amount from the upper position, and to make the component second recognition position coincide with the component second design position, and then, again, A component second re-recognition position obtained by recognizing a second recognition point; the obtained board first re-recognition position, the board second re-recognition position, the component first re-recognition position, and the component 2 To the mounting position based on the re-recognition position, Implemented by positioning the serial board, an electronic component mounting method according to claim 2, wherein. 4. The re-recognition position, wherein a holding angle of the electronic component with respect to the component holding member obtained from the component first recognition position and the component second recognition position matches a reference holding angle in the mounting program. As described above, the electronic component is rotated around the axis of the component holding member, and after the electronic component is rotated, the component first obtained by recognizing the component first recognition point and the component second recognition point again.
A re-recognition position and a component second re-recognition position, to a mounting position based on the substrate first recognition position, the substrate second recognition position, the component first re-recognition position, and the component second re-recognition position The electronic component mounting method according to claim 2, wherein, after moving the electronic component, the electronic component is rotated around the axis again to mount the electronic component on the substrate. 5. The re-recognition position is obtained by calculating a first displacement amount of the substrate between the first recognition position of the substrate and a position on the first design of the substrate which is the mounting reference position of the first recognition point of the substrate. After relocating the substrate in accordance with the first displacement amount of the substrate so that the first recognition position coincides with the position on the first design of the substrate, the substrate first re-recognition obtained by re-recognizing the substrate first recognition point A board second deviation amount between the board second recognition position and a board second design position, which is the mounting reference position of the board second recognition point, is determined. A board second re-recognition position obtained by re-recognizing the board second recognition point after moving the board according to the board second shift amount so as to match the second design position; From the above component first recognition position and component second recognition position. Determining an amount of rotation of the component holding member in a direction around an axis that makes a holding angle of the electronic component with respect to the component holding member coincide with a reference holding angle in the mounting program; A component first deviation amount from the component first design position which is the mounting reference position of the recognition point, and a component second design position which is the mounting reference position of the component second recognition position and the component second recognition point After the electronic component is moved according to the component first deviation amount and the rotation amount, the component first re-recognition obtained by re-recognizing the component first recognition point And a component second re-recognition position obtained by re-recognizing the component second recognition point after moving the electronic component according to the component second shift amount and the rotation amount. Substrate first recognition position Moving the electronic component to a mounting position based on the board second re-recognition position, the component first re-recognition position, and the component second re-recognition position, and then rotating the electronic component around the axis again. 3. The electronic component mounting method according to claim 2, wherein the electronic component is mounted on the substrate. 6. The re-recognition position is a substrate rotation angle at which a mounting angle of the substrate obtained from the substrate first recognition position and the substrate second recognition position matches a reference mounting angle on the mounting program. Determining a component rotation angle at which a holding angle of the electronic component with respect to the component holding member obtained from the component first recognition position and the component second recognition position matches a reference holding angle in the mounting program; After rotating the electronic component before mounting based on the angle and the component rotation angle, the component first re-recognition position obtained by re-recognizing the component first recognition point and the component second recognition point, and The component second re-recognition position, and the power to the mounting position based on the board first recognition position, the board second recognition position, the component first re-recognition position, and the component second re-recognition position. Implemented by positioning the parts and the substrate, an electronic component mounting method according to claim 2, wherein. 7. The re-recognition position is obtained by calculating a first shift amount of the substrate between the first recognition position of the substrate and a position on the first design of the substrate that is the mounting reference position of the first recognition point of the substrate. A substrate first re-recognition position obtained by re-recognizing the substrate first recognition point after moving the substrate according to the first shift amount; and A board second deviation amount from the board second design position, which is the mounting reference position, is obtained, and after moving the board according to the board second deviation amount, the board second recognition point is recognized again. A board second re-recognition position, wherein the component first re-recognition position and the component second re-recognition position are mounted on the board obtained based on the substrate first re-recognition position and the board second re-recognition position Angle and the reference mounting angle of the board in the mounting program. A board rotation angle for matching the mounting angle to the reference mounting angle, and a component rotation angle for which the holding angle of the electronic component to the component holding member matches the reference holding angle in the mounting program. A component first deviation amount between the component first recognition position and the component first design position, which is the mounting reference position of the component first recognition point, and the component second recognition position and the component second recognition point. A component second deviation amount from the component second design position which is the mounting reference position is obtained, and the electronic component is moved before mounting according to the component first deviation amount, the substrate rotation angle, and the component rotation angle. rear,
Again, the component first obtained by recognizing the component first recognition point
After relocating the electronic component before mounting according to the component second shift amount, the board rotation angle, and the component rotation angle, the component second recognition point is obtained again by recognizing the component second recognition point. The component first re-recognition position, the board first re-recognition position, the board second re-recognition position, the component first re-recognition position, and the mounting position based on the component second re-recognition position. The electronic component mounting method according to claim 2, wherein the component and the substrate are positioned and mounted. 8. An electronic component mounting apparatus that executes the electronic component mounting method according to claim 1.