JP2000223539A - Cleaner and cleaning method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To permit easy attachment of a cleaner without attending alignment with a line of probe terminals by arranging a support in the direction of a plurality of abrasive paper stacked and supporting each of the abrasive papers with a scribed gap. SOLUTION: A cleaner 31 comprises an abrasive paper 31A coated with abrasive particles, and a support 31B that is arranged in the direction of a plurality of the abrasive paper 31A stacked and supports each of the abrasive papers 31A with a prescribed gap. Accordingly, when the cleaner 31 is attached to a stage, it is not necessary to pay attention to alignment of the abrasive papers with a line of probe needles 21A. Since average grain size of the abrasive grains on the abrasive papers 31A is adjusted so as to become smaller than the outer diameter of the probe needle 21A, the point of the probe needle 21A is not damaged by the abrasive grains. As a result, the cleaner 31 can be easily attached without attending alignment with a line of probe terminals. In addition, a cleaning mechanism of the cleaner 31 can be reduced with cost.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaner and a cleaning method, and more particularly, to a probe used for inspecting electrical characteristics of an object to be inspected such as a semiconductor wafer (hereinafter, simply referred to as "wafer"). The present invention relates to a cleaner for removing deposits on terminals and a cleaning method.

[0002]

2. Description of the Related Art For example, a probe device is used for inspecting electrical characteristics of a wafer to be inspected. The probe device includes a loader chamber for transporting a wafer W stored in a cassette, and a prober for inspecting electrical characteristics of the wafer W transported via a transport mechanism (not shown) provided in the loader chamber. Room.

[0005] The prober chamber has X, on which a wafer W is placed,
A main chuck movable in the Y, Z, and θ directions, an alignment mechanism for accurately aligning a wafer W mounted on the main chuck with an inspection position, and an electrical inspection of the wafer aligned by the alignment mechanism. A probe card having a probe terminal (for example, a probe needle) for electrically connecting the probe card and a tester (not shown) via a test head to inspect a wafer in contact with the probe needle. It has become.

When inspecting the wafer W, a natural oxide film (made of aluminum oxide) formed on the surface of an electrode pad (made of, for example, aluminum) of the wafer is scraped by a probe terminal, and the probe terminal and the electrode pad are removed. The wafer is inspected by electrically connecting the electrodes to each other. If the inspection is repeated, insulating aluminum oxide or the like may adhere to the tip of the probe terminal, which may hinder the subsequent inspection. Therefore, for example, the tip of the probe terminal is cleaned using a polishing plate attached to the main chuck, and the subsequent inspection is performed without any trouble.

[0005]

However, in the case of cleaning using a conventional polishing plate as a cleaner, the attachment to the probe tip of the probe terminal is removed by moving the polishing plate up and down. Unless the tip of the terminal row and the polishing plate are set in parallel, all the probe terminals do not contact the polishing plate uniformly, and there is a possibility that cleaning unevenness may occur between the probe terminals. In addition, when the polishing plate is mounted on the mounting table, the polishing plate must be set in parallel with the probe terminal row, and the setting work and the like are troublesome, and the polishing plate itself is expensive. There was a problem that the cost itself would be high.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is possible to easily attach a cleaner without worrying about parallelism with a probe terminal row, and to reduce the cost of a cleaning mechanism. The purpose is to provide a cleaner that can. Further, the present invention also provides a cleaning method using the cleaner of the present invention.

[0007]

According to a first aspect of the present invention, there is provided a cleaner having an abrasive grain adjusted to a particle diameter smaller than an outer diameter of a probe terminal used when an electrical characteristic of an object to be inspected is inspected. And a support body arranged in a direction in which a plurality of abrasive papers are overlapped and supporting each of the abrasive papers with a predetermined gap therebetween.

[0008] A cleaner according to a second aspect of the present invention is the cleaner according to the first aspect, wherein the average grain size of the abrasive grains is several μm.

A third aspect of the present invention is directed to the cleaner according to the first or second aspect, wherein the abrasive paper has flexibility.

In the cleaning method according to a fourth aspect of the present invention, abrasive particles adjusted to a particle diameter smaller than the outer diameter of a probe terminal used when performing an electrical characteristic inspection of the device to be inspected are applied. A method of cleaning the probe terminals using a cleaner provided with a polishing paper and a support that is arranged in a direction in which a plurality of polishing papers overlap and supports each polishing paper via a predetermined gap, The cleaner is horizontally moved in a direction in which the polishing paper is arranged at a position where the polishing paper interferes with the probe terminal.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the embodiments shown in FIGS. First, an example of a probe device including the cleaner of the present embodiment will be described.
The probe device 10 includes a loader chamber 1 for transferring a wafer W stored in a cassette C, for example, as shown in FIG.
1, a prober chamber 12 for inspecting the wafer W transferred from the loader chamber 11, a controller 13 for controlling the prober chamber 12 and the loader chamber 11, and a display device 14 also serving as an operation panel for operating the controller 13. It is provided with.

The loader chamber 11 has a wafer transfer mechanism 15
And a sub-chuck 16, while the wafer W is transferred to the prober chamber 12 by the wafer transfer mechanism 15.
The wafer W is pre-aligned with reference to the orientation flat via the reference numeral 6.

The prober chamber 12 is provided with a drive mechanism 1.
A main chuck 19 that moves in the X, Y, Z, and θ directions through the control unit 8, an alignment mechanism 20 that accurately aligns the wafer W mounted on the main chuck 19, and an alignment mechanism 20. A probe card 21 having a probe needle 21A as a probe terminal for performing an electrical inspection of the aligned wafer W; The alignment mechanism 20 includes, for example, an upper and lower CCD camera 20A (only the upper CCD camera is shown in FIG. 1, and a lower CCD camera (not shown) is attached to, for example, a main chuck) and an upper CC camera.
The camera includes an alignment bridge 20B having the D camera 20A disposed downward, and a pair of guide rails 20C that guide the alignment bridge 20B to move in the Y direction. The probe card 21 is fixed via an insert ring to a central opening of a head plate that can be opened and closed with respect to the upper surface of the prober chamber 12. The test head (not shown) is connected to the probe card 2 in the prober chamber 12.
1 and electrically relays between the probe card 21 and a tester (not shown), and transmits and receives a predetermined signal from the tester to and from the wafer W on the main chuck 19 via the probe card 21. The electrical test of a plurality of chips formed in the above is sequentially performed by a tester.

A cleaning mechanism 30 is attached to the main chuck 19. The cleaning mechanism 30 includes, for example, one cleaner 31 for cleaning the probe card 21 and two brush cleaners 32 and 33, as shown in FIG. The cleaner 31 and the brush cleaners 32 and 33 are the main chuck 1
9 is removably mounted on a mounting table (not shown) integrated with 9. A recess is formed in the mounting base in which the cleaner 31 and the brush cleaners 32, 33 are fitted. The cleaner 31 can be easily mounted simply by fitting the cleaners 31, 32, 33 into the recess.

By the way, the cleaner 31 of the present embodiment comprises:
As shown in FIG. 2, for example, a plurality of (for example, six) abrasive papers 31A cut into, for example, 50 mm square, and each of the abrasive papers 31A are set up substantially vertically, and each of the abrasive papers 31A is separated by a predetermined gap. And a supporting body 31B for supporting through the intermediary. The support body 31B includes a support body 31C having a substantially U-shaped side surface, a spacer 31D for forming a predetermined gap between the polishing papers 31A and maintaining the parallelism between the polishing papers 31A, A screw member 3 for attaching each of the polishing papers 31A to the main body 31B via a spacer 31D.
1E. The lower end of each of the polishing papers 31A is connected to the support body 31C and each of the spacers 31 via a screw member 31E.
D, and are arranged in a direction overlapping each other (a direction indicated by an arrow in FIG. 2). The arrow in FIG. 2 coincides with the X direction or the Y direction in the prober chamber 12.

The base material of the polishing paper 31A is formed of synthetic paper made of, for example, polyester resin, and abrasive grains made of, for example, aluminum oxide are uniformly deposited on the surface (for example, one side) of the synthetic paper. As the abrasive grains, those having a diameter smaller than the outer diameter of the probe needle 21A and having a macroscopically adjusted particle diameter such that the metal surface can be mirror-finished are used. As a specific particle size of the abrasive, for example, 30 to 4
When the probe needle 21A of 0 μm is used, abrasive grains having an average particle size of, for example, 3 to 6 μm are used. Further, as the synthetic paper, a flexible and strong paper having a thickness of, for example, 250 μm is used. There are various commercial products as such abrasive paper, and the abrasive paper 31A of the present embodiment can be appropriately selected from commercial products and used.

Next, a cleaning method using the cleaner 31 of this embodiment will be described with reference to FIG. FIG. 3 shows only one abrasive paper 31A and one probe needle 21A. When the wafer W is index-fed through the main chuck 19 driven under the control of the controller 13 and the inspection of the wafer W is repeatedly performed,
The deposit D such as aluminum oxide adheres to the terminal end of the probe needle 21A, which hinders subsequent inspection. Therefore, all the probe needles 21 are cleaned using the cleaner 31 of the present embodiment.
Clean A.

That is, when the probe device is switched from the test mode to the cleaning mode, the main chuck 19 is driven under the control of the controller 13. As a result, the cleaner 31 moves below the probe needle 21A. Next, the cleaner 31 moves up via the main chuck 19, reaches the position where the upper end of the polishing paper 31A overlaps the tip of the probe needle 21A, and the cleaner 31 stops. In this state, the polishing paper 31A is deviated from the probe needle 21A, for example, in the X direction. Subsequently, the cleaner 31 moves through, for example, the X direction indicated by an arrow in FIG. 3 via the main chuck 19, and the first abrasive paper 31A reaches the probe needle 21A as indicated by a dashed line in FIG.

When the cleaner 31 further moves in the same direction, the abrasive paper 31A comes into contact with the probe needle 21A as shown by a solid line in FIG.
The probe tip 21A is scraped off with the polishing paper 31A while the needle tip of the probe and the polishing paper 31A are in sliding contact with each other. When the polishing paper 31A continues to move, the probe needle 21A and the polishing paper 31A further bend as shown by the two-dot chain line in the same figure, the tip of the probe needle 21A tilts to the left, and the polishing paper 31A moves to the right. The tip of the probe needle 21A and the polishing paper 3 are inclined.
1A comes into sliding contact, and the attached matter D on the needle tip peripheral surface is scraped off with the abrasive paper 31A. After removing the deposits D on the peripheral surface of the needle tip, the polishing paper 31 is removed.
After A removes the deposit D on the lower surface of the needle tip while sliding on the lower surface of the needle tip, the polishing paper 31A separates from the probe needle 21A.
By repeating this series of operations for the number of the abrasive papers 31A, the attached matter D on the needle tip is gradually removed. All abrasive paper 3
While 1A is in sliding contact with the probe needle 21A, the deposit D
Can be almost completely removed. Then, after the cleaner 31 stops via the main chuck 19, the cleaner 31 moves in the opposite direction via the main chuck 19, and removes the deposit D from the opposite side of the probe needle 21A. This reciprocating operation is repeated an appropriate number of times depending on the degree of attachment of the attached matter D of the probe needle 21A, thereby obtaining the attached matter D of the probe needle 21A.
Can be reliably removed.

As described above, according to the present embodiment,
The cleaner 31 includes abrasive paper 31A coated with abrasive grains, and a support 31B arranged in a direction in which the plurality of abrasive papers 31A overlap and supporting each of the abrasive papers 31A via a predetermined gap. Therefore, when attaching the cleaner 31 to the mounting table, there is no need to worry about the parallelism between the abrasive paper 31A and the needle tip row of the probe needles 21, so that the cleaner 31 can be easily mounted on the mounting table. Further, in the case of the cleaning method using the cleaner 31 of the present embodiment, the probe needle 21A is polished by being horizontally moved in the direction in which the polishing paper 31A is arranged.
Even if the needle tip row of the probe needles 21A and the probe needles 21A are not set strictly parallel as described above, the probe needles 21
A can be reliably polished, and the attached matter D such as aluminum oxide can be reliably removed. Further, in the present embodiment, since the polishing paper 31A is used in place of the conventional polishing plate, the cleaner 31 itself can be manufactured at a lower cost as compared with the conventional one, and the parallelism between the cleaner 31 and the needle tip row can be improved. May be slightly collapsed, so that the mounting cost of the cleaner 31 can be reduced.

According to the present embodiment, the abrasive paper 31A
The average particle size of the abrasive grains is determined by the outer diameter of the probe needle 21A (for example,
30 to 40 μm) (for example, 3 to 6 μm).
μm), the probe needle 21A
There is no risk of damaging the needle tip. Furthermore, since the synthetic paper having flexibility is used as the base material of the polishing paper 31A, the polishing paper 31A and the probe needle 21A elastically and slidably contact with each other, and the attached matter D on the needle tip can be reliably removed. .

In the above-described embodiment, the case where the inspection is performed by applying the probe needle 21A to the electrode pad on the surface of the wafer W has been described. However, the present invention can be applied to the case where the inspection is performed by applying the probe needle 21A to the solder bump. Needless to say. Further, the cleaner of the present invention is not limited to the probe needle 21A described in the above embodiment, but can be applied to cleaning of various probe terminals such as a vertical probe terminal.

[0023]

According to the first to fourth aspects of the present invention, the cleaner can be easily mounted without worrying about the parallelism with the probe terminal row, and the cost of the cleaning mechanism can be reduced. A cleaner and a cleaning method that can be reduced can be provided.

[Brief description of the drawings]

FIG. 1 is a partially cutaway perspective view showing a probe device to which an embodiment of a cleaner according to the present invention is applied.

FIG. 2 is a perspective view showing the cleaner of the present embodiment used in FIG. 1;

FIG. 3 is an explanatory view of the operation of the cleaner shown in FIG. 2;

[Explanation of symbols]

 Reference Signs List 10 probe device 19 main chuck (mounting table) 21 probe card 21A probe needle (probe terminal) 31 cleaner 31A polishing paper 31B support

Claims (4)

[Claims] An abrasive paper coated with abrasive grains adjusted to a particle diameter smaller than an outer diameter of a probe terminal used for performing an electrical characteristic inspection of an object to be inspected, and a plurality of abrasive papers overlap each other. A support arranged in a row and supporting each of the polishing papers with a predetermined gap therebetween. 2. The cleaner according to claim 1, wherein the average grain size of the abrasive grains is several μm. 3. The cleaner according to claim 1, wherein the polishing paper has flexibility. 4. An abrasive paper coated with abrasive grains adjusted to a particle diameter smaller than an outer diameter of a probe terminal used for performing an electrical characteristic inspection of an object to be inspected, and a plurality of abrasive papers overlap each other. A method of cleaning the probe terminals using a cleaner having a support arranged and supporting each of the polishing papers via a predetermined gap, wherein the polishing paper is disposed at a position where the polishing papers interfere with the probe terminals. A cleaning method characterized by horizontally moving a cleaner in the direction in which the abrasive paper is arranged.