JP2000221537A - Electro-optic device, its production and electronic apparatus having the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a connecting structure in which a defect does not occur by forming a ruggedness in a signal input wiring in the connecting part between the electrode formed on substrate and the signal input wiring. SOLUTION: The two substrates 1a and 1b are arranged to face each other and are bonded to each other apart a prescribed spacing with a sealing material 2 with which the peripheral edge of the substrate 1a is printed. The lower substrate 1b is provided with the signal input wiring 5a to 5n formed in such a manner that the one-side ends face the terminal parts of scanning lines 3a to 3n embedded in the sealing material 2 of the upper substrate 1a and are electrically connected to the terminal parts of the scanning lines via conductive particles 8. The ruggedness is formed on the surfaces of the data lines 4a, 4b...4m and the signal input lines 5a to 5n. The ruggedness is formed on the surfaces of the data lines 4a, 4b...4m in the manner described above, thereby, incident light may be randomly reflected and the display can be made more easily visible than the case where the surface is flat.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an electro-optical device used as a display unit of a portable telephone and various information devices. More specifically, liquid crystal is used as an electro-optic material,
The present invention relates to a reflective or transflective electro-optical device having a reflective electrode on the inner surface. Further, the present invention relates to a method for manufacturing the electro-optical device.

[0002]

2. Description of the Related Art As shown in FIG. 10, a conventional electro-optical device has scanning electrodes (or common electrodes) 3a to 3 made of ITO.
A liquid crystal surrounded by a seal 2 member is sandwiched between a substrate 1a on which n is formed and a substrate 1b on which data electrodes (or segment electrodes) 4a to 4m made of ITO are formed. The substrate 1b is provided with signal input wirings 5a to 5n in addition to the data electrodes 4a to 4m, and the signal input wirings 5a to 5n are provided with a liquid crystal IC chip 6 or an FP on which an IC is mounted.
It is electrically connected to a terminal of a C substrate (Flexible Printed circuit). The signal input wirings 5a to 5n are connected to the scanning electrodes 3a to 3n by conductive particles 8 contained in the seal member 2.
The data electrodes 4a to 4m are also connected to the same IC, that is, the liquid crystal IC chip 6.

That is, by connecting the signal input wirings 5a to 5n and the scanning electrodes 3a to 3n, the necessity of mounting the liquid crystal IC chip 6 on the substrate 1a is eliminated.

On the other hand, in recent years, a so-called SPD type reflective electro-optical device, in which the data electrodes (or segment electrodes) 4a to 4m are formed of a reflective material (for example, aluminum), is also on the market. In this reflective electro-optical device, light is scattered and the display is brightened by forming irregularities on the surfaces of the data electrodes 4a to 4m.

[0005]

However, in a conventional electro-optical device which conducts up and down using conductive particles mixed in a sealing member, the surfaces of signal input wirings and data electrodes are flat. In addition, the contact area between the conductive particles and the signal input wiring and the data electrode is small, so that a connection failure may occur depending on the amount of the conductive particles mixed into the sealing member and the pressure bonding condition.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has as its first object to obtain a connection structure in which the above connection failure does not occur. The second object is to realize the process without adding a complicated process.

[0007]

Means for Solving the Problems In order to solve the above problems, the present invention has the following configuration. That is, in the first electro-optical device of the present invention, an electro-optical material is sandwiched between a pair of substrates having electrodes formed on the inner surface side, and the electrode formed on one of the substrates has a reflective surface on which irregularities are formed. An electro-optical device which is an electrode, wherein a signal input wiring electrically connected to the electrode formed on the other substrate via a conductive member is disposed on the one substrate, In the connection portion between the electrode formed on the substrate and the signal input wiring, the signal input wiring is formed with irregularities.

According to a second electro-optical device of the present invention, an electro-optical material is sandwiched between a pair of substrates having electrodes formed on an inner surface thereof, and between one of the substrates and the electrodes formed thereon. Is an electro-optical device having a reflector with irregularities formed thereon, and on one of the substrates, a signal input wiring electrically connected to the electrode formed on the other substrate via a conductive member. Wherein the signal input wiring has irregularities at a connection portion between the electrode and the signal input wiring formed on the other substrate.

In a third electro-optical device according to the present invention, an electro-optical material is sandwiched between a pair of substrates having electrodes formed on the inner surface side, and the electrodes formed on one of the substrates have a reflection formed with irregularities. An electro-optical device, which is provided on the other substrate and has a signal input wiring electrically connected to the reflective electrode via a conductive member; and In the connection portion with the signal input wiring, the reflective electrode is formed with irregularities.

In the first electro-optical device, the second electro-optical device, and the third electro-optical device, the signal input wiring, the reflective electrode, or the reflective plate is provided with irregularities. It is in contact with the opposing electrode or conductive wiring. That is, the contact area of the conductive member is increased by the provision of the unevenness, so that it is possible to reduce poor contact caused by the small contact area.

In the first electro-optical device, the second electro-optical device, and the third electro-optical device, it is preferable that the reflective electrode or the reflecting plate is formed of a metal containing aluminum as a main component. This is because aluminum is relatively inexpensive and has a very high reflectance, so that it is most suitable as a reflective layer for performing a reflective display.

In the first and second electro-optical devices, the signal input wiring is made of the same material as the reflective electrode or the reflective plate.
It is preferable to use a metal containing aluminum as a main component. This is because by using the same material, not only can these be formed simultaneously, but also the formation of irregularities can be performed simultaneously.

In one embodiment of the first electro-optical device and the second electro-optical device, the liquid crystal is driven by the electrodes provided on the other substrate, the liquid crystal being connected to the signal input wiring. A semiconductor device for supplying a signal to the semiconductor device, wherein at a connection portion between the semiconductor device and the signal input wiring, the signal input wiring has irregularities. The semiconductor device in this embodiment is an FPC board (Flexib board) on which an IC chip or IC is mounted.
le Printed circuit (flexible printed circuit board), etc., but of course, other than these specific examples, as long as it is possible to "supply a signal for driving the liquid crystal", it does not matter. .

According to this aspect, since the connection portion of the semiconductor device is also provided with irregularities, the connection reliability between the semiconductor device and the signal input wiring can be secured at the same time. In particular, when a semiconductor device is connected using ACF (anisotropic conductive adhesive), the effect is large because the contact area between the conductive member in the ACF and the signal input wiring increases due to the presence of the unevenness. .
Note that, in this embodiment, the height of the unevenness is made smaller than the diameter of the conductive particles in the ACF. This is because if the height (depth) of the unevenness is larger than the conductive particles, the conductive particles are buried in the unevenness and cannot be connected.

In another aspect of the first electro-optical device, the second electro-optical device, and the third electro-optical device, the electro-optical material is a liquid crystal material.

In another aspect of the first electro-optical device, the second electro-optical device, and the third electro-optical device, the liquid crystal material is sealed between the pair of substrates by a seal member. The conductive member is a conductive particle contained in the seal member.

According to this aspect, since the conductive particles are contained in the seal member, there is no need to separately provide a conductive member for electrically connecting the signal input wiring and the electrode.
Great effect on process.

In another aspect of the first electro-optical device, the second electro-optical device, and the third electro-optical device, an illuminating device is provided on a side of the one of the substrates opposite to the electro-optical material. The reflective electrode and the reflective plate are provided as a semi-transmissive reflective film capable of reflecting and transmitting incident light at a predetermined reflectance and transmittance.

This embodiment relates to a so-called transflective electro-optical device that performs a reflective display during the daytime and a transmissive display at nighttime, for example.

According to this aspect, since the reflecting plate or the reflecting electrode is a semi-transmissive reflecting film capable of reflecting and transmitting incident light at a predetermined reflectance and transmittance, the light from the lighting device can be transmitted. It is possible to perform transmissive display and reflect external light to perform reflective display.

Further, the electronic device of the present invention includes first to third electronic devices.
Since the electro-optical device is provided as a display unit, that is, a panel having no connection failure is mounted, the product life is extended.

According to the method of manufacturing an electro-optical device of the present invention, an electro-optical material is sealed between a pair of substrates having electrodes formed on the inner surface side by a sealing member. A method for manufacturing an electro-optical device, wherein the formed electrode is a reflective electrode provided with projections and depressions at intersections with the electrode provided on the other substrate, wherein the electro-optical material is driven. A step of simultaneously forming a signal input wiring for supplying a signal to the electrode with the reflective electrode on the one substrate, and a step of forming irregularities on the signal input wiring, The unevenness is formed simultaneously with the unevenness of the reflective electrode.

According to the method of manufacturing an electro-optical device of the present invention, the conductive wiring and the reflective electrode or the reflector are formed at the same time, and the irregularities provided on them are formed at the same time.

That is, the electro-optical device of the reflection type or the transflective type can be realized in exactly the same number of steps as in the manufacture of the conventional electro-optical device without any poor contact at the upper and lower conductive portions.

[0025]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) A preferred embodiment of the present invention will be described below with reference to the drawings. 1 and 2
1 shows a plan layout and a cross-sectional view of a first embodiment when applied to a reflective liquid crystal panel as an electro-optical device of the present invention. FIG. 2 is a diagram showing a cross-sectional structure along one arbitrary scanning line (3) in FIG.

First, the schematic structure of the liquid crystal panel of the present embodiment will be described.
As shown in FIG. 2, two glass substrates 1a and 1b are disposed to face each other, and are joined at a predetermined interval by a seal material 2 printed on a peripheral portion of the substrate 1a. Then, a liquid crystal such as a TN (Twisted Nematic) liquid crystal or a SH (Super Homeotropic) liquid crystal is filled between these two substrates.

A plurality of scanning lines (or common electrode lines) 3a, 3b composed of transparent electrodes such as ITO are provided on the surface of one of the two substrates 1a, 1b (upper substrate) 1a. .. 3n are formed in parallel with each other. On the surface of the other substrate (lower substrate) 1b, a plurality of data lines (or segment electrode lines) 4a, 4 mainly composed of a metal having a high reflection efficiency such as aluminum.
4m are formed parallel to each other along a direction intersecting the scanning lines 3a, 3b... 3n.

As shown in FIG. 1, the lower substrate 1b is formed so that one side protrudes outward (to the lower side in the figure) from the upper substrate 1a. An external terminal portion 41 is provided, which is converged so that the extended portions of the lines 4a, 4b... The scanning lines 3a to 3n formed on the surface of the upper substrate 1a are arranged such that the upper half thereof is on the left side of the substrate and the lower half is on the right side of the substrate, and is substantially perpendicular to the edge of the substrate. And are respectively extended toward the sides of the lower substrate on which the external terminal portions 41 are formed, and are terminated in the sealing material 2. The conductive particles 8 are scattered (mixed) in at least a portion of the sealing material 2 where hatching B is applied.

The lower substrate 1b is provided with the upper substrate 1
a signal input wiring 5 formed such that one end thereof is opposed to the end of the scanning lines 3a to 3n embedded in the sealing material 2 of FIG.
a, 5b,... 5n are provided so as to be electrically connected to the end portions of the scanning lines via the conductive particles 8. The other ends of the signal input wirings 5a to 5n are terminated such that the line connecting the end faces thereof is perpendicular to the line connecting the end faces of the external terminal portions 41 of the lower substrate. And
The IC chip 6 that supplies a scanning signal and a data signal to the scanning line and the data line extends over the terminal portion of the signal input wirings 5a to 5n and the surface of the external terminal portion 41 of the lower substrate.
It is mounted in an OG (chip-on-glass) system.

Further, a connection terminal 42 for connecting the IC chip 6 to an external device such as a control LSI (not shown) is provided between the IC chip mounting portion of the lower substrate 1b and the end of the substrate. Are formed. This connection terminal 42
For example, a flat cable or FPC (flexible printed wiring board) via an ACF (anisotropic conductive sheet)
Are connected. The control LSI and the like are mounted on the FPC.

In this embodiment, the data lines 4a, 4b
... Unevenness is formed on the surface of 4m and signal input wirings 5a to 5n. Although not particularly limited, irregularities may be formed on the surface of the connection terminal 42.

Since the surface of each of the data lines 4a, 4b... 4m is formed with irregularities, the incident light can be irregularly reflected, thereby making the display more visible than when the surface is flat. be able to. Moreover, in this embodiment, since the irregularities are formed on the surfaces of the signal input wirings 5a to 5n of the scanning lines 3a to 3n, the contact between the signal input wirings 5a to 5n and the conductive particles is improved.

Further, unevenness is also formed on the surface of the connection terminal 42, and the surface of the connection terminal 42 having the unevenness is
By connecting the FPC board via the ACF,
The substantial contact area of the adhesive contained in the ACF is increased, the connection strength of the FPC board or the like is increased, and the adhesive is hardly peeled off. .. 4m and the surface of the signal input wirings 5a to 5n of the scanning lines and the surface of the external terminal portion 41 can be simultaneously formed in the same step, which complicates the process. It won't be.

The sealing material 2 is applied to the surface of the substrate 1a or 1b by screen printing or the like, and the space between the substrates 1a and 1b (cell gap) is provided in the sealing material 2.
(See FIG. 2) is entirely dispersed. Although not shown, the surface of the scanning lines 3a, 3b,.
.., 4b... On the liquid crystal side surface of 4m, alignment films for aligning the direction of the liquid crystal in a predetermined direction are formed. Further, although not shown, a color filter layer is provided on the liquid crystal side surface of the upper substrate 1a of the liquid crystal panel configured as described above.
A polarizing plate is bonded to the surface of the upper substrate 1a opposite to the liquid crystal, and an FPC board or the like on which a control LSI including a power supply circuit and the like is mounted is connected to the connection terminal 42 via an ACF. It is configured as a liquid crystal display device.

FIG. 3 shows a scanning line 3 in the sealing material 2.
3A to 3N are enlarged cross-sectional views of connection portions between the signal input wirings 5a to 5n. The sealing material 2 applied to the surface of the substrate 1a or 1b is scattered and mixed with conductive particles 8 such as silver particles as a whole or at a portion indicated by hatching B in FIG.

The height or diameter r of the conductive particles 8 contained in the sealing material 2 is higher than the height h of the irregularities on the surface of the external terminal portion 41, as shown in FIG. r>
h). Thus, when the substrates 1a and 1b are thermocompression-bonded, the conductive particles 8 are crushed and the contact area increases as shown in FIG. 3B, and the connection between the scanning lines 3a to 3n and the signal input wirings 5a to 5n is increased. Good contact properties.

Specifically, the height h of the irregularities formed on the surfaces of the signal input wirings 5a to 5n is 0.5 to 0.8 μm,
The diameter r of the conductive particles 8 is substantially the same as the diameter
The thickness may be set to 6 μm. The reason that the diameter of the conductive particles 8 may be the same as the diameter of the spacer material 9 is that the gap between the electrodes provided on the substrate for conducting the electrodes becomes narrower by the thickness of the two electrodes, so that the thickness of the two electrodes is reduced. This is because the conductive particles 8 can be crushed by the amount.

The spacer material 9 is formed of a relatively rigid material such as glass fiber in order to set a predetermined distance between the substrates, whereas the conductive particles 8 are made of a material having a higher rigidity than the spacer material used. It is desirable to use a low metal particle such as silver or a resin film formed around the metal particle. However, the conductive particles 8 are not limited to silver but may be other conductive metals, and the shape is not limited to a sphere.

Next, the data lines 4a to 4c as reflective electrodes
The method of forming the irregularities on the surfaces of 4m and the signal input wirings 5a to 5n will be described.

Data lines 4a to 4m and signal input wiring 5
As a first method of forming irregularities on the surfaces a to 5n, there is a method using etching. More specifically, when the data lines 4a, 4b... 4m are made of aluminum as in the above-described embodiment, the unevenness can be formed mainly by wet etching using oxalic acid. Dry etching may be used instead of wet etching.

As a second method of forming irregularities on the surfaces of the data lines 4a to 4m and the signal input wirings 5a to 5n, as shown in FIG. 4, irregularities are previously formed on the surface of the substrate 1b. Then, there is a method of forming an aluminum layer thereon. Examples of a method for forming irregularities on the surface of the substrate 1b include wet etching using hydrofluoric acid or the like, and a blast treatment method for spraying a particulate abrasive or the like on the substrate surface to form irregularities. However, when irregularities are formed in advance on the surface of the substrate 1b and an aluminum layer is formed thereon, the thicker the aluminum layer is, the more the surface is flattened and the irregularities on the substrate surface are hardly transferred. The thickness is desirably 0.8 μm or less.

In the first method of forming irregularities directly on the surfaces of the data lines 4a to 4m and the signal input wirings 5a to 5n, not only a simple matrix type liquid crystal panel but also electrodes and switching elements are arranged for each pixel. The present invention can also be applied to an active matrix type liquid crystal panel to be provided. On the other hand, the second method of forming irregularities on the surface of the substrate 1b in advance is a simple matrix type liquid crystal in which data lines as reflective electrodes are formed on the surface of the substrate or relatively near the surface of the substrate. Particularly suitable for panels,
An active matrix type liquid crystal panel in which a pixel electrode as a reflective electrode is formed on the surface of the substrate or relatively near the surface of the substrate, or an active matrix type liquid crystal panel having a pixel electrode made of a transparent electrode separately from the reflective electrode And the like.

(Second Embodiment) FIG. 5 shows a second embodiment of the present invention. In this embodiment, the semiconductor chip 6 is placed on the substrate on the incident side, that is, on the side on which the scanning line made of a transparent electrode is formed.
Is applied to a liquid crystal panel on which is mounted.

In the reflection type liquid crystal panel of this embodiment, as shown in FIG. 5, two glass substrates 1a and 1b are arranged to face each other, and a predetermined sealing material 2 is applied along the periphery of the substrate. Joined at intervals. Then, a liquid crystal is sandwiched between these two substrates. Two substrates 1a, 1
b, the surface of one substrate (upper substrate) 1a
A plurality of scanning lines (or common electrode lines) 3a, 3b... 3n formed of transparent electrodes such as O are formed in parallel with each other. On the surface of the other substrate (lower substrate) 1b, a plurality of data lines (or segment electrode lines) 4a, 4 made of a metal having high reflection efficiency such as aluminum.
4m are formed parallel to each other along a direction intersecting the scanning lines 3a, 3b... 3n.

As shown in FIG. 5, the upper substrate 1a is formed so as to protrude laterally from the lower substrate 1a, and extends from the inside of the sealing material 2 to the outside of the panel. A signal input wiring 43 and a connection terminal 42 ′ formed from a position at a predetermined distance from the signal input wiring 43 toward an end of the substrate 1 a are provided. The signal input wiring portion 43 and the connection terminal 42 'are connected to the scanning lines 3a to 3a.
The IC chip 6 for driving scanning lines and data lines is connected by the COG method over the terminals 42 ′ and 43, made of the same material as n (ITO in the embodiment).

In this embodiment, one end of each of the data lines 4a, 4b... 4m on the lower substrate 1b is placed in the sealing material 2 so as to face the end of the signal input wiring 42 on the upper substrate 1a. Extended and terminated. And sealing material 2
The data lines 4a, 4b... 4m are electrically connected to the signal input wiring 42 via the conductive particles 8 dispersed (mixed) therein. In this embodiment, the data lines 4a, 4b
... Unevenness is formed on the surface of 4 m and its extension.

Since the data lines 4a, 4b... 4m have irregularities on the surface, the incident light can be irregularly reflected, thereby making the display more visible than when the surface is flat. be able to. Moreover, in this embodiment, irregularities are also formed on the surfaces of the terminals of the data lines 4a, 4b... 4m extending in the sealing material 2, and the conductive particles are pressed against the surface of the end of the data line having the irregularities. Therefore, the substantial contact area of the conductive particles is increased, and the contact property is improved. Further, the data lines 4a,
4b... 4m and the irregularities on the surface of the end thereof can be formed simultaneously in the same step, so that the process does not become complicated.

Although not shown, the scanning lines 3a, 3b... 3n formed on the surface of the upper substrate 1a have their ends bent toward the IC chip 6 and extended to the outside of the panel. It is connected to the IC chip 6. In the first embodiment, the data lines 4a, 4b,.
It has been described that since the unevenness similar to that of 4 m is formed, the substantial contact area of the adhesive contained in the ACF is increased, the connection strength of the FPC board or the like is increased, and the adhesive is hardly peeled off. However, the ITO constituting the scanning lines 3a to 3n is
Since the connection with the ACF is better than that of aluminum constituting a to 4 m, even if the surface is flat by forming the connection terminal 43 of ITO as in the embodiment of FIG. The connection strength of the FPC board or the like does not decrease so much.

However, irregularities may also be formed on the surfaces of the connection terminals 43 and the signal input wirings 42 made of ITO. As a result, the connection terminals 43
And the contact between the conductive particles 8 in the sealing material and the signal input wiring 42 can be improved. In order to form irregularities on the surface of the connection terminal 43 and the signal input wiring 42 made of ITO, as described in the embodiment of FIG. It is good to use a method of transferring to terminals.

Third Embodiment Next, a third embodiment of the present invention will be described with reference to FIG. The embodiment of FIG.
The present invention is applied to an active matrix type liquid crystal panel using (a metal film-insulating film-diode pair having a metal film structure) as a switching element.

The liquid crystal panel 30 of this embodiment has a pixel electrode 11 made of Cr arranged in a matrix and an MIM (Ta) as a switching element for applying a voltage thereto.
It is composed of a laminated structure of a W layer, a TaOx layer, and a Cr layer.
Data lines 4a and 4 for supplying a voltage applied to each pixel
b, 4c..., a lower substrate 1b having an Al reflective electrode 17 provided on the Cr pixel electrode 11, and a transparent electrode (IT
O) scanning lines 3a to 3n, color filter layer 22
And an incident-side glass substrate (upper substrate) 1a having a black mask 23 and the like are arranged at an appropriate interval,
A liquid crystal 30 such as a TN-type liquid crystal or an SH-type liquid crystal is filled in a gap whose periphery is sealed by the sealing material 2 to constitute a liquid crystal panel. When used as a display device, a polarizing plate is disposed on the surface (upper surface in FIG. 6) of the glass substrate 1a on the incident side opposite to the liquid crystal.

In the liquid crystal panel of this embodiment, the data lines 4a, 4a formed on the liquid crystal side surface of the lower substrate 1b.
1, b, 4c,... are arranged substantially parallel to each other along one direction of the substrate (the direction perpendicular to the plane of FIG. 6 in FIG. 6), and the liquid crystal of the glass substrate (upper substrate) 1a on the incident side. The scanning lines 3a to 3n formed on the side surface are arranged substantially parallel to each other along a direction intersecting the data lines. In addition, the surface of the Al reflective electrode 17 is formed with irregularities for irregularly reflecting incident light. The reflective electrode 17 made of an Al layer is provided on the pixel electrode 11 made of a Cr layer because aluminum has a higher reflectivity than chromium, and the Cr layer serving as an underlayer is omitted. This is because aluminum is easily oxidized on the surface when it is made only of a layer, and it is difficult to obtain desired characteristics.

Further, in this embodiment, the element-side substrate (lower substrate) 1b is formed so as to protrude laterally (to the left in the figure) from the upper substrate 1a. As in the embodiment shown in FIG. 2, signal input wirings 5a to 5n connected to the scanning lines 3a to 3n of the upper substrate 1a and connection terminals (not shown) are formed, and the signal input wiring 5a is formed. 5n are formed on the surfaces of the signal input wirings 5a to 5n and the connection terminals (42).
IC chip (6) for driving scanning lines and data lines over an external connection terminal (41) which is an extension of the data lines.
Is mounted.

In this embodiment, the signal input lines 5a to 5n connected to the scanning lines 3a to 3n are connected to the data lines 4a and 4n.
have a laminated structure in which an aluminum layer constituting the reflective electrode 17 is formed on a Cr layer constituting b, 4c... and a reflective electrode is provided on the surface of the upper aluminum layer of the signal input wirings 5a to 5n. The unevenness formed in the same process as the formation of the unevenness on the surface of No. 17 is provided. Irregularities may also be formed on the surface of the connection terminal (42) to which an FPC or the like for connecting the IC chip (6) to an external device is connected. Also in this case, in the same manner as described with reference to FIG. 4, the surface of the substrate is previously formed with concavities and convexities, and the reflective electrode 17 made of an aluminum layer and the signal input wirings 5a to 5n and Irregularities can be transferred to the surface of the connection terminal (42).

As a result, the incident light is diffusely reflected on the surface of the reflective electrode 17 to make the display easier to see, while the conductive particles (8) and the signal input wirings 5a to 5n are formed in the sealing material.
Good contact with the surface. Further, when the surface of the connection terminal (42) is also formed with irregularities, the contact area of the ACF with the adhesive increases, the connection strength with the FPC board, the IC chip, or the like increases, and the ACF hardly comes off. In addition, since the irregularities on the surface of the reflective electrode 17 and the connection terminal (42) can be formed simultaneously in the same step, the process does not become complicated.

In the embodiment shown in FIG. 6, the reflective electrode 17 made of an Al layer is provided on the pixel electrode 11 made of a Cr layer, but the Cr pixel electrode 11 is omitted and the Al electrode is directly formed on the surface of the substrate. The reflective electrode 17 may be formed. Accordingly, in the embodiment in which the unevenness is formed in advance on the substrate surface and the unevenness is transferred to the reflective electrode, the state of forming the unevenness is improved.

(Fourth Embodiment) FIG. 7 shows a fourth embodiment of the present invention. In this embodiment, in a simple matrix type liquid crystal panel, transparent data lines 4a to 4m made of ITO are provided on reflection plates 44a to 42m made of an aluminum layer on a lower substrate 1b via an insulating film 51. is there.
The upper substrate 1a is provided with ITO in a direction intersecting with the data lines 4a to 4m arranged in a direction perpendicular to the plane of FIG.
The scanning lines 3a to 3n are arranged.

In this embodiment, the signal input wirings 5a to 5n for supplying signals to be applied to the scanning lines 3a to 3n from the lower substrate side are made of the same aluminum layer as the reflection plates 44a to 44m. And reflecting plates 44a-4
The same irregularities are formed on the surface of 4 m and the surfaces of the signal input wirings 5 a to 5 n. The scanning lines 3a to 3n are connected to the corresponding signal input wirings 5a to 5n by the conductive particles 8 mixed in the sealing material 2.

Also in this embodiment, the reflection plates 44a to 44a
Since the unevenness is formed on the surface of 4 m, the display is easy to see, while the contact between the conductive particles 8 and the signal input wirings 5 a to 5 n is good in the sealing material 2. Irregularities may also be formed on the surface of the connection terminal 42 to which an FPC or the like for connecting the IC chip 6 to an external device is connected. As a result, an FPC board, an IC chip, or the like connected to the connection terminal 42 has a substantial contact area with the adhesive contained in the ACF, increases the connection strength, and is hardly peeled off. Further, since the irregularities on the surfaces of the reflection plates 44a to 44m and the connection terminals 42 can be formed simultaneously in the same step, the process does not become complicated.

Moreover, a transparent data line 4 made of ITO is used.
By providing the Al reflectors 44a to 44m slightly narrower than the data lines 4a to 4m separately from the data lines 4a to 4m below the a to 4m, the display quality of the liquid crystal display device can be improved. That is, when the alignment of the liquid crystal is controlled by the data lines 4a to 4m also serving as the reflective electrode as in the first embodiment (FIG. 2), the electric field is not parallel at the edge of the electrode and the alignment of the liquid crystal molecules is not performed. However, by disposing the Al reflective electrodes 44a to 44m slightly narrower than the data lines 4a to 4m below the data lines 4a to 4m separately from the data lines 4a to 4m, There is an advantage that image quality is improved because incident light can be reflected at a portion where liquid crystal molecules are not disturbed. Also in this embodiment, when used as a display device, a polarizing plate is bonded to the surface (upper surface in the figure) of the substrate 1a on the incident side opposite to the liquid crystal.

(Fifth Embodiment) FIG. 8 shows a fifth embodiment of the present invention. This embodiment is applied to a transflective liquid crystal panel. FIG. 7 shows a cross-sectional structure along a scanning line, while FIG. 8 shows a cross-sectional structure along a data line. Therefore, the liquid crystal panels of FIGS. 7 and 8 have different structures from each other. However, the structure of the liquid crystal panel in FIG.
7 is substantially the same as that of FIG. 7, and an Al reflective electrode 44a slightly narrower than the data lines 4a to 4m is provided separately below the data lines 4a to 4m via an insulating film 51 such as SiO2.
To 44 m.

The data lines 4a to 4m are connected to the insulating film 51.
Electrode 44 in contact hole 52 formed in
a to 44 m, and irregularities are formed on the surfaces of the reflective electrodes 44 a to 44 m for irregular reflection of incident light.
On the upper substrate 1a, scanning lines 3a to 3n made of ITO are arranged in a direction intersecting the data lines 4a to 4m (in FIG. 8, a direction orthogonal to the plane of the drawing).

Although not shown, signal input lines (5a to 5n) for supplying signals to be applied to the scanning lines 3a to 3n from the lower substrate side are formed of the same aluminum layer as the reflective electrodes 44a to 44m. And the surfaces of the reflective electrodes 44a to 44m and the signal input wirings (5a to 5m).
The same unevenness is formed on the surface of n). Scanning line 3
a to 3n are connected to corresponding signal input wirings (5a to 5n) by conductive particles (8) mixed in the sealing material 2.

Although not particularly limited, irregularities similar to the surfaces of the reflective electrodes 44a to 44m are also formed on the surface of the external terminal 41 which is an extension of the reflective electrodes 44a to 44m. IC mounted on the lower substrate 1b
A connection terminal 42 to which an FPC for connecting the chip 6 to an external device is connected is also formed of the same aluminum layer as the reflective electrodes 44a to 44m, and the surface thereof is also formed with irregularities.

The liquid crystal panel of FIG. 8 differs from the liquid crystal panel of FIG. 7 in that a plurality of through holes 45 are formed in the reflective electrodes 44a to 44m.
Are formed, and the backlight is arranged on the side opposite to the incident side of the liquid crystal panel (below the substrate 1b in FIG. 8). As described above, the through holes are formed in the reflective electrode and the backlight is arranged. When the backlight is turned on when the incident light is small, the light is transmitted through the through holes 45 formed in the reflective electrodes 44a to 44m. There is an advantage that the amount of emitted light is increased by leaking to the liquid crystal side to make the display easier to see.

Also in this embodiment, the reflective electrode 44a
Since the irregularities are formed on the surface of about 44 m, the display is easy to see, while the contact between the conductive particles (8) and the signal input wirings (5 a to 5 n) becomes good in the sealing material 2. Further, the reflective electrodes 44a to 44m and the signal input wiring (5
a to 5n) and irregularities on the surface of the connection terminal 42 can be formed simultaneously in the same step, so that the process does not become complicated.

(Sixth Embodiment) FIG. 9 shows a liquid crystal panel according to the sixth embodiment, which is used in a portable telephone 200 or a portable information terminal 300.
1 shows a configuration example when applied as a display device.

In FIG. 9A, reference numeral 201 denotes a CP
A body incorporating a LIS such as a U or a memory, a power supply device, a speaker, etc., 202 is a cover also serving as an audio input unit rotatably mounted on the body 201, and 203 is a liquid crystal display using the liquid crystal panel of the above embodiment. The device is mounted such that a display surface (incident surface) comes to the inner surface of the main body 201.

In FIG. 9B, reference numeral 301 denotes a CP inside.
LIS such as U and memory, body with built-in power supply, etc.
302, a key input device provided on the upper surface of the main body 301;
Reference numeral 303 denotes a liquid crystal display device using the liquid crystal panel of the above embodiment, which is mounted so that a display surface (incident surface) comes to an inner surface of a lid portion rotatably attached to the main body 301.

In an electronic apparatus using the liquid crystal panel of the above embodiment as a display device, a backlight is not required and power consumption is small, so that it can be driven for a long time by a battery, and irregularities are formed on the surface of the reflective electrode. Therefore, there is an advantage that the display contents are easy to see, and furthermore, the connection between the liquid crystal panel and the semiconductor integrated circuit chip or the FPC board is hard to be removed, so that the reliability and durability are excellent.

The liquid crystal panel to which the present invention is applied can be used as a display device of a laptop or desktop personal computer in addition to the portable electronic devices such as the above-mentioned portable telephones and personal digital assistants. The present invention can also be used for a projection display device such as a video projector using a panel as a light valve.

[0072]

As described above, according to the electro-optical device of the present invention, one of the signal input wiring and the electrode vertically connected to the electrode via the conductive particles has an uneven shape. The contact area of the conductive particles increases,
This has the effect of increasing connection reliability.

[Brief description of the drawings]

FIG. 1 is a plan view showing one embodiment of a liquid crystal panel to which the present invention is applied.

FIG. 2 is a sectional view of one embodiment of a liquid crystal panel to which the present invention is applied.

FIG. 3 is an enlarged sectional view of a main part showing connection between conductive particles in a sealing material and signal input wiring in the liquid crystal panel of the embodiment.

FIG. 4 is a sectional view showing another embodiment of a method of forming unevenness on a reflective electrode and a signal input wiring.

FIG. 5 is a sectional view showing another embodiment of the liquid crystal panel to which the present invention is applied.

FIG. 6 is a sectional view showing an embodiment in which the present invention is applied to an active matrix type liquid crystal panel using a MIM as a switching element.

FIG. 7 is a cross-sectional view showing an embodiment in which the present invention is applied to a reflective liquid crystal panel in which a reflective electrode is provided separately below a data line made of ITO.

FIG. 8 is a cross-sectional view showing an embodiment in which the present invention is applied to an anti-transmissive liquid crystal panel in which a reflective electrode is provided separately below a data line made of ITO.

FIG. 9 is a perspective view showing a schematic configuration of a portable telephone and a portable information terminal as examples of electronic equipment to which the liquid crystal panel of the embodiment is applied as a display device.

FIG. 10 is a diagram showing an example of a conventional liquid crystal panel.

[Explanation of symbols]

 1a, 1b Glass substrate 2 Sealing material 3a-3n Scanning line 4a-4m Reflective electrode (data line) 5a-5n Signal input wiring (for scanning line) 6 IC chip 8 Conductive member (conductive particle) 9 Spacer material 11 Pixel electrode Reference Signs List 13 MIM element 17 Reflective electrode 22 Color filter layer 23 Black mask 30 Liquid crystal 33 Polarizer 41 External terminal 42 Connection terminal 43 Signal input wiring (for data line) 44a-44m Data line (ITO) 200 Cellular phone 300 Mobile Information terminals 203, 303 Liquid crystal display

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H092 GA48 GA50 GA51 GA55 GA57 HA05 HA06 JA03 JB12 NA15 NA25 NA27 NA28 PA06 PA12 5C094 AA32 AA37 BA43 DA09 DB01 ED11 GB01 5E344 AA01 AA22 BB02 BB06 BB07 CC23 CD04 EE06 A37 BB435 EE42 FF03 KK05 KK09

Claims (9)

[Claims] An electro-optical device in which an electro-optical material is sandwiched between a pair of substrates having electrodes formed on an inner surface side, and the electrodes formed on one of the substrates are reflective electrodes having irregularities formed thereon. And a signal input wiring electrically connected to the electrode formed on the other substrate via a conductive member on the one substrate, and the signal input wiring formed on the other substrate is provided. An electro-optical device, wherein the signal input wiring has irregularities at a connection portion between an electrode and the signal input wiring. 2. An electro-optic material is sandwiched between a pair of substrates having electrodes formed on an inner surface thereof, and a reflector having irregularities formed between one of the substrates and the electrodes formed thereon. An electro-optical device comprising: a signal input wiring electrically connected to an electrode formed on the other substrate via a conductive member on the one substrate; formed on the other substrate An electro-optical device, characterized in that the signal input wiring has irregularities in the connection portion between the electrode and the signal input wiring. 3. The electro-optical device according to claim 1, wherein the electro-optical device is connected to the signal input wiring and drives the liquid crystal to the electrode provided on the other substrate. An electro-optical device, further comprising a semiconductor device for supplying a signal, wherein a projection and a depression are provided on the signal input wiring at a connection portion between the semiconductor device and the signal input wiring. 4. An electro-optical device according to claim 1, wherein an electro-optical material is sandwiched between a pair of substrates having electrodes formed on an inner surface thereof, and said electrodes formed on one of said substrates are reflective electrodes having irregularities formed thereon. And a signal input line provided on the other substrate and electrically connected to the reflective electrode via a conductive member, at a connection portion between the reflective electrode and the signal input line. (2) An electro-optical device according to (1), wherein irregularities are formed on the reflective electrode. 5. The electro-optical device according to claim 1, wherein the electro-optical material is a liquid crystal material. 6. The electro-optical device according to claim 6, wherein the liquid crystal material is sealed between the pair of substrates by a seal member, and the conductive member is a conductive particle included in the seal member. An electro-optical device, characterized in that: 7. The electro-optical device according to claim 5, wherein an illumination device is provided on a side of the one of the substrates opposite to the liquid crystal material, and the reflective electrode and The electro-optical device according to claim 1, wherein the reflection plate is a transflective film capable of reflecting and transmitting incident light at a predetermined reflectance and transmittance. 8. An electronic apparatus comprising the electro-optical device according to claim 1 as a display unit. 9. An electro-optic material is sealed by a sealing member between a pair of substrates having electrodes formed on the inner surface side, and the electrodes formed on one of the substrates are reflective electrodes having irregularities formed thereon. A method for manufacturing an electro-optical device, comprising: simultaneously forming a signal input line for supplying a signal for driving the liquid crystal to the electrode on the one substrate with the reflective electrode; and the signal input line. Forming an unevenness on the signal input wiring, wherein the unevenness formed on the signal input wiring is formed simultaneously with the unevenness on the reflective electrode.