JP2000216023A - Laminated inductor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize high L value in a laminated inductor. SOLUTION: An electric insulating layer and a conductive pattern are alternately laminated, an end of each conductive pattern is successively connected to form a coil in the electric insulating body 2, and an end of the coil is connected to external electrodes 3, 4 by protruding conductors 9, 10. Thus, a laminated inductor is fabricated. In this case, the coil comprises a plurality of coils 5, 6 which are independently arranged and formed without riding over the other coils on the way of forming, and an inside coil and an outside coil are connected at the top or the bottom. By this constitution, the conductive pattern of each layer can be simply connected, and the surface of the coil is always made flat without deformation, resulting in forming a multiple coil which is small-sized and has high accuracy. Thus, high L value is realized with an ultrasmall-sized laminated inductor having chip size of 1005 or lower.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer inductor used for a high-frequency circuit of a mobile communication device or the like,
The present invention relates to a small-sized multilayer inductor having a high L value.

[0002]

2. Description of the Related Art Conventionally, as a method of forming a coil of a laminated inductor, a sheet laminating method in which ceramics are formed on a sheet and a print laminating method in which an electric insulating layer and internal conductors are all formed by screen printing are known. I have. 12 to 14 show a typical coil structure in each insulating layer 90 at the time of forming the coil. Here, FIG.
FIG. 13 shows an example in which a coil 91 having a turn is formed, and the coil is formed in a spiral structure in one layer in one or more turns (two turns).
FIG. 14 shows an example in which the inner coil and the outer coil are formed separately.

[0003] In recent years, there has been a tendency for electronic components to become lighter, thinner and smaller, and it is indispensable to realize a small-sized and high L value in a laminated inductor manufactured using the above-mentioned lamination technology.

[0004]

By the way, when a high inductance having an L value of 20 nH or more is realized by a method of forming a one-turn coil 91 in each insulating layer 90 shown in FIG. It is necessary to increase the number of turns or increase the number of turns of the coil. However, in order to increase the number of turns, it is necessary to form a multilayer coil inside the chip, which increases the chip size.

Further, in order to increase the number of windings, the coil is formed in a spiral structure so that the coil 92 has one or more turns in one layer.
The method shown in FIG.
Since the outer peripheral end 93 and the inner peripheral end 94 are sequentially connected for each layer, as shown in FIG.
5 and 96, the upper coil is always printed and laminated so as to straddle the lower coil.
In the case of ultra-small size chips of 05 or less, the lamination surface (printing surface) was uneven and could not be accurately stacked.

In order to solve the inconvenience of the vertical connection in the above-mentioned spiral structure, Japanese Utility Model Application Laid-Open No. 3-3440 has been proposed.
No. 7, JP-A-9-330818, and the like are disclosed. The disclosed technology connects each coil through a through-hole provided in ceramics, and has a structure that allows easy connection up and down, so that a high L value can be realized with a relatively small number of layers. However, this method has drawbacks in that the chip size is small, stable printing cannot be performed when the size of the through-hole is 100 μm or less, and the position of the through-hole moves and a flat printing surface cannot be secured. For this reason, it has been difficult to apply the method to the production of a very small chip.

[0007] As shown in FIG.
No. 4507 is disclosed, but reference numeral 9 in FIG.
Because of the structure in which the coils straddle each other at the portions indicated by reference numerals 7 and 98, a step occurs on the printing surface, and it is difficult to perform high-precision printing.

As described above, it is important how to form a coil of one turn or more with high precision in an ultra-small chip. However, the above-described prior art has a structure in which steps or irregularities are generated on a printing surface. As a result, a flat printing surface required for realizing high-precision printing could not be secured.

The present invention has been made in view of the above-mentioned problems, and has an outer coil and an inner coil formed independently, and each coil has a structure that does not straddle other coils. It is an object of the present invention to provide a multilayer inductor having a multi-layered structure capable of performing high-accuracy printing by securing a proper printing surface and realizing a small-sized, high-accuracy, and high-L value.

[0010]

That is, according to the first aspect of the present invention, the electric insulating layer is formed by alternately laminating the electric insulating layers and the conductor patterns, and the ends of the respective conductor patterns are sequentially connected. A coil superposed in the laminating direction is formed therein, and the ends of the coil are connected to the external electrodes (3, 4) by lead conductors (9, 10). A plurality of formed coils (5,
6) In the multilayer inductor (1) constituted by:
The plurality of coils (5, 6) were independently formed without straddling other coil conductors on the way, and the inner and outer coils were respectively connected at the uppermost portion or the lowermost portion.

As described above, when a coil having one or more turns is formed in one layer, the outer coil and the inner coil are formed independently of each other, instead of being circulated in one layer, and both coils are connected to end portions. The connection of the conductor patterns on each layer can be simplified by connecting the layers. At this time, by forming the coil in the same place so that the inner coil and the outer coil do not straddle each other, the printed surface of the coil can be always flat and free from distortion. As a result, high-precision coil printing can be performed, and a small, high-accuracy multi-coil with a high L value can be formed.

According to the second aspect of the present invention, the electrical insulating layers and the conductor patterns are alternately laminated, and the ends of the conductor patterns are sequentially connected so as to overlap the electrical insulator (2) in the laminating direction. Coil is formed, and the ends of the coil are connected to the external electrodes (3,
4), wherein the coil is composed of a plurality of coils (5, 6) arranged and formed independently of each other.
0) is arranged at the center of the cross section of the chip and connected to the inner coil (5) and the outer coil (6), respectively, and the coils (5, 6) are wound upside down, respectively, and They were formed independently without straddling other coil conductors on the way, and connected to the opposite coil at the top and bottom, respectively.

As described above, this configuration can simplify the connection of the conductor patterns in the upper and lower layers and does not straddle other coil conductors on the way, so that a highly accurate coil can be formed. By arranging the lead conductor to the external electrode at the center of the cross section of the chip, the coil can be formed symmetrically in the vertical direction, so that the vertical direction related to the L value can be eliminated. Thereby, when aligning and packing chips, it is not necessary to align the vertical direction.

According to the present invention, the coil (5, 6) is formed by combining two types of conductor patterns of one turn or less, and the two types of conductor patterns are connected in phase. The conductor width of the connecting part is different.

For example, as shown in FIG. 10, U-shaped conductor patterns 102, 103 and I-shaped conductor patterns 100,
U-shaped conductor pattern 1 at connection portions 105 and 104 of 101
By changing the widths of 02 and 103, the connectivity between patterns can be improved. In this case, the inner conductor pattern 1
02 and the conductor pattern 103 on the outer side where the conductor width is increased are on the opposite sides, and the center of each coil is intentionally shifted, so that a more reliable connection can be achieved.

Further, according to the present invention, a dielectric ceramic is used as a material of the electric insulating layer. Thereby, a high Q value can be obtained even when used at a high frequency.

[0017]

Embodiments of the present invention will be described below with reference to the drawings.

First, a first embodiment of the present invention will be described with reference to FIGS.
1 is a perspective view showing the internal structure of a laminated inductor according to the present invention, FIG. 2 is a diagram showing a coil structure of the laminated inductor, and FIG. 3 is a diagram showing a method of manufacturing the laminated inductor. 4 to 6 are process diagrams showing another example of the method for manufacturing a laminated inductor.

As shown in FIG. 1, the laminated inductor 1 has a rectangular parallelepiped shape made of an electric insulator 2 and external electrodes 3 and 4 for external connection are formed at both ends. A circular coil having a double structure composed of coils 5 and 6 is formed inside the electric insulator 2, and its ends are connected to the external electrodes 3 and 4 via lead conductors 9 and 10 from the bottom of the chip, respectively. ing.

As shown in FIG. 2, the above-mentioned orbiting coils are arranged and formed independently and concentrically, and an inner coil 5 (a coil shown by a broken line in FIG. 2) and an outer coil 6 (a coil shown in FIG. 2). , A coil indicated by a solid line) are connected by a connection pattern 7 at the lowermost portion.

Next, a method of manufacturing the laminated inductor 1 will be described. As described above, a sheet laminating method or a printing laminating method is possible as a coil forming method, but the latter will be described here.

First, a dielectric ceramic which was added with glass and sintered at a low temperature was used as a ceramic-based electric insulating material. Here, a dielectric material in which borosilicate glass is mixed with alumina in a ratio of 70:30 by volume is used, and a mixture of ethylcellulose, a dispersant, and a plasticizer as a vehicle is mixed and mixed with the dielectric material for printing. Was prepared.

Also, silver was used as a conductor, and the above-mentioned vehicle was mixed with the silver to prepare a conductor paste. In addition, PVB, methylcellulose, or acrylic resin may be used as a binder other than ethylcellulose. Further, silver palladium may be used as the conductor paste. The dispersant and the plasticizer need to be added in consideration of improvement in printability and handling during production.

The process diagram shown in FIG. 3 is an example in which a double-turn coil is formed by combining a U-shaped pattern and an I-shaped pattern.

First, as shown in FIG.
3 is repeatedly printed and laminated to form an electric insulating layer having a predetermined thickness, and as shown in FIG. 3B, conductor patterns 22 and 23 are printed on the electric insulating layer to form lead conductors 9 and 10. I do. At this time, by making the width of the conductor patterns 22 and 23 larger than the width of the internal conductor, the connectivity between the patterns is improved, and thus the connectivity to the external electrodes 3 and 4 can be enhanced.

Next, as shown in FIG. 3C, a part of the conductor patterns 22 and 23 is left in an I-shape, and the other conductor is covered with a dielectric pattern 24, as shown in FIG. 3D. Thus, the U-shaped conductor patterns 25 and 26 are printed from above so as to be connected to the exposed end portions of the conductor patterns 22 and 23. The conductor pattern 26 is for the inner coil 5 and the conductor pattern 25 is for the outer coil 6. Here, as described above with reference to FIG. 10, as described above with reference to FIG. 10, the connection accuracy between the patterns can be increased by increasing the width of the conductor on the U-shaped side of the portion connected in the same direction.

Next, as shown in FIG. 3 (e), the exposed portions of the conductor patterns 22 and 23 are covered with a dielectric pattern 27, and further as shown in FIG. 3 (f), the U-shaped conductor pattern 25 is formed. , 26 are printed with I-shaped conductor patterns 28, 29. At this time, as shown in FIG. 11, the ends of the I-shaped conductor patterns 29 and 28, which are connected to the U-shaped conductor patterns 25 and 26 at right angles, are slightly pulled out toward the U-shaped conductor patterns 25 and 26 so that the connection portions 3 are formed.
6, 37, the connection area can be increased, and the reliability at the time of connection can be further improved.

Thus, each of the inner coil 5 and the outer coil 6
This means that the turns are separately formed.

Next, as shown in FIG. 3 (g), the conductor patterns 25 and 26 are covered with
As shown in (h), the U-shaped conductor patterns 31 and 32 are printed so as to be connected to the ends of the exposed I-shaped conductor patterns 28 and 29. Thereafter, the steps (e) to (h) are repeated a predetermined number of times. As a result, the inner coil 5 and the outer coil 6 having a predetermined number of turns are formed concentrically in the laminating direction and independently from each other.

Next, as shown in FIG. 3I, after the I-shaped conductor patterns 28 and 29 are covered with a dielectric pattern 33, as shown in FIG. Conductor patterns 34 to connect the conductor patterns 34
(Corresponding to the connection pattern 7 in FIGS. 1 and 2). Thereby, the inner coil 5 and the outer coil 6 are connected to form a series of circulating coils.

Finally, as shown in FIG. 3K, the dielectric 35 is repeatedly printed and laminated to a predetermined thickness. In the actual process, the coil is usually manufactured as a multilayer block in which a large number of coils are arranged and arranged.

As described above, the laminated block manufactured through the steps (a) to (k) is cut into chips, degreased, fired, and burred, and then the external electrodes 3 and 4 are formed on both ends of the chip, and baked and plated. By performing the processing, a multilayer inductor as shown in FIG. 1 is completed.

As described above, according to the present invention, when a coil having one or more turns is formed in one layer, the coil is not spirally wound in one layer as in the conventional case, but is first formed in a one-layer one-turn structure. The outer coil 6 and the inner coil 5 are formed independently of each other by a predetermined number of layers, and then the upper and lower layers of the laminated coil are connected to each other to form the upper and lower layers, which are conventionally performed over the coils. Instead of the connection of the conductor patterns in the above, a laminated structure in which the inner coil and the outer coil do not straddle each other can be obtained. As a result, the printed surface of the coil can be made flat and free from distortion, and high-precision printing can be performed. Therefore, a high-precision multiple-turn coil can be formed.

Therefore, with the above structure, size 1
Even with an ultra-small chip of 005 or less, a multilayer inductor with a high L value can be realized.

Further, by forming the coil pattern by combining the U-shaped pattern and the I-shaped pattern as in the present embodiment, it is possible to reduce the variation in the coil cross-sectional area caused by the misalignment of the I-shaped and U-shaped prints. Accurate printing becomes possible.

Next, FIG. 4 shows another example of a method for manufacturing a laminated inductor. While the embodiment of FIG. 3 described above is based on a combination of a U-shape and an I-shape, the present embodiment shown in FIG. This is an example of forming a coil. However, also in this case, similarly to the above, the conductor pattern is printed after the dielectric pattern is always printed.

First, as shown in FIG.
1 is repeatedly printed until a predetermined thickness is obtained, and FIG.
As shown in FIG. 7, conductor patterns 42 and 43 are printed thereon to form lead conductors 9 and 10.

Next, as shown in FIG. 4C, the right half of the laminated surface is covered with a dielectric pattern 44, and as shown in FIG. 4D, the conductive patterns 42 and 43 are exposed thereon. The U-shaped conductor patterns 45 and 46 are printed so as to be connected to the terminal portions.

Next, as shown in FIG. 4 (e), the left half of the laminated surface is covered with a dielectric pattern 47, and as shown in FIG. 4 (f), the U-shaped conductor pattern 45,
The U-shaped conductor patterns 48 and 49 are printed so as to be connected to the exposed end portions 46. Thus, one turn of each of the inner coil 5 and the outer coil 6 is formed.

Next, as shown in FIG. 4 (g), the right half of the laminated surface is covered with a dielectric pattern 50, and as shown in FIG. 4 (h), U-shaped conductor patterns 48 and 49 are formed thereon. U-shaped conductor patterns 52, 51 so as to be connected to the exposed terminations.
Print. Thereafter, the steps (e) to (h) are repeated a predetermined number of times. Thus, the inner coil 5 and the outer coil 6 having a predetermined number of turns are formed concentrically in the laminating direction in an independent state.

Next, as shown in FIG. 4 (i), after covering the left half of the laminated surface with the dielectric pattern 53, as shown in FIG. 4 (j), the inner conductor pattern and the outer conductor pattern are formed. The conductor pattern 54 (corresponding to the connection pattern 7 in FIGS. 1 and 2) is printed in order to connect the end portions of the conductor pattern 54. Thus, the inner coil 5 and the outer coil 6 are connected to form a series of winding coils.

Finally, as shown in FIG. 4K, the dielectric 55 is repeatedly printed and laminated to a predetermined thickness to complete a laminated block.

Although the above two embodiments relate to the formation of a coil having a double structure, it is also possible to form a coil having a further multiple structure by the same procedure. One example is shown in FIGS.

First, FIG. 5 shows an example in which a winding coil having a triple structure is formed by a combination of U-shapes.
By repeating the step (c), the winding coils having a predetermined number of independent windings are formed concentrically on the inner side, the inner side, and the outer side. Thereafter, as shown in FIG. 5D, the inner coil and the middle coil are connected by printing the conductor pattern 56.

Next, an example of forming a quadruple-structured spiral coil will be described with reference to FIG. This case is similar to FIG.
6 (a) to 6 (c) are repeated to form independent quadruple winding coils. The connection between the coils is made by conductor patterns 57 and 58.

Note that the printing and laminating steps of the above-described triple-structure and quadruple-structure coils are basically the same as those in the case of FIG. 4 described above, and a detailed description thereof will be omitted.

Next, the second embodiment of the present invention will be described with reference to FIGS.
An embodiment will be described. 7 is a perspective view showing the internal structure of the multilayer inductor according to the present invention, FIG. 8 is a diagram showing the coil structure of the multilayer inductor, and FIG. 9 is a process diagram showing an example of the method for manufacturing the multilayer inductor.

As shown in FIG. 7, the laminated inductor 1 of the present invention has a rectangular parallelepiped shape having external electrodes 3 and 4 at both ends, and includes an inner coil 5 and an outer coil 6 inside an electric insulator 2. A winding coil having a double structure is formed. This point is substantially the same as that of the first embodiment shown in FIG. 1, but in this embodiment, the coil ends are connected to the external electrodes 3 and 4.
The extraction conductors 9 and 10 for extracting the coil are arranged at the center of the cross section of the chip. Therefore, the formation of the orbital coil differs from that of the first embodiment in this point. Further, these coils may be printed as one unit instead of being printed separately.

That is, in the present embodiment, outer coils 6, 6 (coils indicated by solid lines in FIG. 8) are formed in the vertical direction of the chip from the lead conductors 9, 10 arranged at the center as shown in FIG. The inner coil 5 (FIG. 8) formed continuously by the connection patterns 7, 7 at the uppermost portion and the lowermost portion, respectively.
(Middle, broken lines) to form a double-turn coil.

Since the laminated inductor 1 of the present invention has the above-described structure, the connection of the conductor patterns in each of the upper and lower layers can be simplified, and a highly accurate coil can be formed, as in the first embodiment. Since the coils 9 and 10 are arranged at the center of the cross section of the chip, the coil can be formed vertically symmetrically, the directionality of the chip is lost, and the change of the L value due to the placement in the vertical direction can be eliminated.

Next, a method of manufacturing the laminated inductor 1 will be described. The coil was formed by a printing lamination method, and the same dielectric material and conductive paste for printing as in the first embodiment were used.

The process diagram shown in FIG. 9 is an example in which a circulating coil having a double structure is formed by combining U-shaped patterns.

First, a double coil is formed to extend downward from the center of the cross section of the chip.

First, as shown in FIG. 9A,
After the dielectric 61 is repeatedly printed and laminated to form an electric insulating layer having a predetermined thickness, as shown in FIG. 9B, U-shaped conductor patterns 62 and 63 are further printed on the insulating layer, and A conductor pattern 65 (corresponding to the lower connection pattern 7 in FIG. 8) for connecting the terminal portions is printed. The conductor pattern 62 is for the outer coil 6, and the conductor pattern 63 is for the inner coil 5.

Next, as shown in FIG. 9C, the left half of the lamination surface is covered with a dielectric pattern 66, and as shown in FIG. The U-shaped conductor patterns 67 and 68 are printed so as to be connected. Thereafter, the same printing and lamination are performed, and the conductor pattern 73 is connected to the end of the conductor pattern 70 in FIG.
Is printed to form the lead conductor 10. This completes the lower coil.

Next, a double coil is formed which extends upward from the center of the cross section of the chip.

First, as shown in FIG. 9 (i), the right half of the lamination surface is covered with a dielectric pattern 75, and FIG.
As shown in (j), the conductor pattern 76 is printed thereon, and the other lead conductor 9 is formed. At this time, the conductor pattern 77 printed at the same time is for the inner coil 5,
Conductor pattern 7 for inner coil 5 printed in the previous process
4 is connected.

Thereafter, the conductor patterns 79, 80, 82, 83, 85 and 86 are sequentially printed and laminated in the same procedure as in the case of the lower coil, and the end portions of the conductor patterns 85 and 86 are shown in FIG. Are printed (corresponding to the upper connection pattern 7 in FIG. 8). Thus, the outer coil 6 and the inner coil 5 are connected, and the upper coil is completed.

Finally, as shown in FIG. 9S, the dielectric 89 is repeatedly printed and laminated to a predetermined thickness.

As described above, the laminated block produced through the steps (a) to (s) is cut into chips, degreased, fired, and burred, and then external electrodes 3 and 4 are formed on both ends of the chip, and baked and plated. By performing the processing, the multilayer inductor 1 as shown in FIG. 7 is completed.

[0061]

As described above, according to the first aspect of the present invention, the inner coil and the outer coil are independently formed so that other coils do not straddle on the way. After that, the lower and upper parts of the coil are connected to each other, so that the coil connection in each upper and lower layer can be simplified, and the printed surface of the coil can always be flat and free from distortion. And a highly accurate multiple coil can be formed, and a high L value can be realized with an ultra-small multilayer inductor having a chip size of 1005 or less. Incidentally, in the multilayer inductor of the chip size 1005 in the above embodiment, L
Values of 120-220 nH have been confirmed.

According to the second aspect of the present invention,
Since the lead conductor for connecting the coil and the external electrode is arranged at the center of the cross section of the chip, the coil shape in the vertical direction can be symmetrical, and the vertical direction related to the L value can be eliminated. This eliminates the need to align the upper and lower positions of the coil each time the coils are aligned and packed, thereby greatly improving workability. Also, in this case, since no other coil conductor is straddled on the way as described above, a highly accurate coil can be formed.

According to the third aspect of the present invention,
The coil is formed by a combination of two types of conductor patterns of one turn or less, and the width of a connection portion where the two types of conductor patterns are connected to each other is different, so that the connectivity between the respective conductor patterns is improved. And the reliability as a multilayer inductor is improved.

Further, according to the present invention, since the dielectric ceramic is used as the electric insulating layer, the stray capacitance between lines can be reduced, and a high Q value can be obtained in a high frequency band. it can. Further, since low-temperature firing is possible, the production of the multilayer inductor becomes easy.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an internal structure of a multilayer inductor according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a coil structure of the multilayer inductor shown in FIG.

FIG. 3 is a process chart showing an example of a method for manufacturing the laminated inductor shown in FIG.

FIG. 4 is a process drawing showing another example of the method for manufacturing the laminated inductor shown in FIG. 1, which is different from FIG.

5 is a process chart showing another example of the method of manufacturing the laminated inductor shown in FIG. 1 which is different from FIG. 4;

6 is a process chart showing another example of the method of manufacturing the laminated inductor shown in FIG. 1 which is different from FIG. 5;

FIG. 7 is a perspective view showing an internal structure of a multilayer inductor according to a second embodiment of the present invention.

8 is a diagram showing a coil structure of the multilayer inductor shown in FIG.

9 is a process chart showing an example of a method for manufacturing the laminated inductor shown in FIG.

FIG. 10 is a diagram showing a connection mode between conductor patterns.

FIG. 11 is another process chart corresponding to FIGS. 3 (e) to 3 (h).

FIG. 12 is a diagram showing a coil structure of a conventional laminated inductor.

FIG. 13 is a diagram showing a coil structure of the laminated inductor different from that of FIG. 12;

FIG. 14 is a diagram showing another coil structure of the laminated inductor different from FIG. 13;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Multilayer inductor 2 Electric insulator 3, 4 External electrode 5 Inner coil 6 Outer coil 9, 10 Lead-out conductor

 ────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yoshinari Noyoro 5-36-11 Shimbashi, Minato-ku, Tokyo Fuji Electric Chemical Co., Ltd. F-term (reference) 5E070 AA01 AB01 AB04 CB04 CB13 CB17 CB20 EA01

Claims (4)

[Claims] An electric insulating layer and a conductor pattern are alternately laminated, and the ends of each conductor pattern are sequentially connected to form a coil superposed in an electric insulator (2) in a laminating direction. Are connected to external electrodes (3, 4) by extraction conductors (9, 10), and the coils are independently arranged and formed in a plurality of coils (5, 5).
6) In the laminated inductor (1) constituted by 6), the plurality of coils (5, 6) are independently formed without straddling other coil conductors on the way, and the inner and outer coils are respectively formed at the most. A multilayer inductor, which is connected at an upper portion or a lower portion to form a multiplex structure. 2. An electric insulation layer and a conductor pattern are alternately laminated, and ends of each conductor pattern are sequentially connected to form a coil superposed in an electric insulator (2) in a laminating direction. Are connected to external electrodes (3, 4) by extraction conductors (9, 10), and the coils are independently arranged and formed in a plurality of coils (5, 5).
6) In the laminated inductor (1), the lead conductors (9, 10) are arranged at the center of the cross section of the chip, and the inner coil (5) and the outer coil (6), respectively.
And the coils (5, 6) are independently formed so as to be wound upside down and without straddling other coil conductors in the middle, respectively. Wherein the multilayer inductor is connected to the coil on the opposite side to form a multiplex structure. 3. The coil (5, 6) is formed of a combination of two types of conductor patterns of one turn or less, and
3. The multilayer inductor according to claim 1, wherein a conductor width of a connection portion where the two types of conductor patterns are connected in phase is different from each other. 4. 4. The multilayer inductor according to claim 1, wherein a material of the electrical insulator (2) is a dielectric ceramic.