JP2000212315A - Double-side metallized film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a double-side metallized film excellent in an attenuation effect of an electrical field shielding characteristic and a magnetic field shielding characteristic and useful for electrical equipment, etc., by forming metallized layers on both sides of a polymer film base by a specified metallizing process. SOLUTION: This double-side metallized film is obtained by forming metallized layers on a wide continuously long polymer film base by a vacuum metallizing process equipped with a semi-continuous winder, wherein the metallized layers 6 and 7 are formed on both sides of the polymer film base 1 by using a metal having an electric resistivity of S <=10 μΩ.cm at 20 deg.C for the metallized layer. Polyethylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, polyimide, polyether-imide or polyaramide film is preferably used as the polymer film, and a single metal selected from aluminum (Al), copper (Cu), gold (Au) and silver (Ag) is preferably used as the metal.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric device and an electronic device, and more particularly to a shielding material for an electromagnetic wave shield and an electrostatic shield and an electronic circuit board.

[0002]

2. Description of the Related Art With the advancement of high-performance, high-precision, high-frequency, and digitization of electric and electronic devices, and the development of mobile radio devices represented by mobile phones, the density of electronic components constituting these devices has increased. Is rapidly evolving.

[0003] The most common materials constituting a shielding material and an electronic circuit board include a polymer film, an adhesive,
Uses metal foil. This structure has conventionally been proposed in which a metal foil is laminated on a polymer film via an adhesive.

However, in recent years, the density of devices has been increased, and accordingly, the line width in electronic circuits and the pitch between lines have been narrowed. In addition, generation of unnecessary electromagnetic waves from the equipment and electromagnetic noise entering the equipment are many, so that the electromagnetic wave shielding technology has become important.

It is desired that the shielding material is thin, light, and has excellent shielding characteristics. Conventionally proposed flexible shielding materials and electronic circuit board materials include a metal 3 formed by forming a metal in a foil shape as shown in FIG.
And a polymer film substrate 1 bonded and laminated with an adhesive 2 interposed therebetween.

FIG. 2 shows a conventional example in which a metal 3 formed in a foil shape of a metal and a polymer film substrate 1 are bonded and laminated on one surface via an adhesive 2 and a metal 5 formed in a foil shape on the back surface. Is laminated by bonding via an adhesive 4.

FIG. 3 shows a structure in which a metal layer 6 is directly formed on a polymer film substrate 1 shown as a conventional example by a vapor deposition method.

[0008]

However, since the shielding material and the electronic circuit board having such a structure are provided with an adhesive in the laminate type, the heat resistance of the adhesive at the time of use at a high temperature and the narrowness of the electronic circuit are reduced. There is a problem that a short circuit between lines occurs due to migration of metal due to an adhesive when the space between lines becomes narrow due to the pitch. In the case where a metal vapor deposition layer is formed directly on a polymer film substrate, a single-side vapor deposition film has a drawback in electromagnetic wave shielding characteristics.

[0009]

According to the present invention, as a means for solving these problems, a metal vapor deposition layer is formed on both surfaces of a polymer film substrate by a semi-continuous winding vacuum vapor deposition method. A feature is to provide a double-sided evaporated film as a feature.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION According to the present invention, a metal vapor deposition layer is formed on the surface of a polymer film substrate on a vapor deposition drum 1 while continuously running the polymer film substrate by a semi-continuous winding vacuum vapor deposition method. A metallized layer is continuously formed on another vapor deposition drum 2 on the back surface of the vapor-deposited film.

Hereinafter, the contents of the present invention will be described in detail with reference to embodiments.

[0012]

FIG. 5 shows a method for producing a double-sided deposited film of the present invention.

In FIG. 5, a film substrate is set by a partition plate 13 in a vacuum chamber 10 constituting a vacuum vapor deposition machine. During vacuum vapor deposition, an upper chamber 11 which is usually kept at 10-1 (Pa) or less and a vacuum vapor deposition Is usually 10 during vacuum deposition where
−2 (Pa) or less and is separated into 12 lower chambers. The upper chamber 11 is evacuated by an exhaust pipe 15 via a vacuum valve 14. The lower chamber 12 is evacuated by an exhaust pipe 17 via a vacuum valve 16.

Metal vapor deposition on the film substrate is performed by using a polymer film 19 set on an unwinding shaft 18 provided in the upper chamber 11 and a vapor deposition drum 2 for cooling the polymer film.
After entering the outer surface of the vapor deposition drum and making close contact with the outer surface of the vapor deposition drum, it travels in the rotation direction A in synchronization with the vapor deposition drum 20.

The cooling of the vapor deposition drum 20 was achieved by circulating a cooling medium at -20 ° C. inside the vapor deposition drum in order to enhance the cooling effect of the polymer film.

The vapor deposition section provided in the lower chamber 12 is provided with a vapor deposition separation plate 31 and a vapor deposition separation plate 32 for preventing the vapor deposition metal from scattering on the vapor deposition drum. Rotation direction in synchronization with deposition drum 20
The polymer film traveling to A is the lower chamber evaporation drum 20
The metal 33 accommodated in the evaporation source container 23 made of a refractory provided opposite to the above is heated and melted by the electron beam heating source 22 and attached and deposited on the polymer film as the metal evaporation vapor 24 to form a vapor deposition layer. Form. Thereafter, the single-sided vapor deposition film 21 having the vapor deposition layer formed on one side as shown is reversed through free rollers 34 and 35 and is synchronized with the lower chamber vapor deposition drum 28 on the surface (rear surface) where the vapor deposition drum 20 is not vapor-deposited. -Side deposited film 21 traveling in the rotation direction B
Heats and melts a metal 34 contained in an evaporation source container 26 made of a refractory provided opposite to a lower chamber evaporation drum 28 by an electron beam heating source 25 so that a metal evaporation vapor 27
Is deposited and deposited on the back surface of the single-sided vapor deposition film 21 to form a vapor deposition layer. The vapor deposition film 29 on which the both-side vapor deposition layer is formed is wound around a winding shaft 30.

The double-sided vapor-deposited film produced in this manner is taken out to the atmosphere, processed into a predetermined width, length and shape, and used as a shielding material or an electronic circuit board.

Example 1 FIG. 4 shows the structure of a double-sided vapor-deposited film manufactured according to an example.

A metal deposition layer 6 is formed on the surface of the polymer film 1 by a vacuum deposition method, and a metal deposition layer 7 is formed on the back surface of the polymer film 1 by a vacuum deposition method.

[0020]

According to the present invention, the shielding properties of a double-sided evaporated film having the structure of the present invention and the shielding properties of a conventionally proposed single-sided evaporated film are measured at 1 GHz by the KEC method.
Table 1 shows the results of the electric field attenuation characteristics at 1 GHz, and Table 2 shows the results of the magnetic field attenuation characteristics at 1 GHz similarly measured by the KEC method.
Shown in

The specification of the double-sided vapor deposition film having the configuration of the present invention for measuring the shield characteristics in this case is as follows.
16 μm of polyethylene terephthalate (PET), 0.6 μm of copper (Cu) for the metal 6 and copper (C) for the metal 7
u) 0.6 μm was used. The specifications of a conventionally proposed single-sided vapor deposition film are as follows: a polymer film 1 is made of polyethylene terephthalate (PET) 16 μm;
0.6 μm of copper (Cu) was used.

In Tables 1 and 2, the term "initial" refers to a value obtained by producing a vapor-deposited film and a shield material having the structure of the present invention and then storing the film under normal temperature and normal pressure.

[0023]

[Table 1]

[0024]

[Table 2]

As shown in Table 1, the attenuation effect of the electric field shielding characteristics at 1 GHz was better than that of the single-sided vapor-deposited film.

Further, as shown in Table 2, the attenuation effect of the magnetic field shielding characteristics at 1 GHz was better than that of the single-sided vapor-deposited film.

As described above, the double-sided vapor-deposited film of the present invention in which the metal layers are formed on both sides of the polymer film by evaporation has excellent shielding properties as compared with the single-sided vapor-deposited film. Also, since the electronic circuit board using the double-sided vapor deposition film of the present invention does not use an adhesive, high-density wiring with a narrow pitch is possible, and one side is used as an electronic circuit board and the other side is used as a shield. By doing so, the electronic circuit and the shield can be integrated, and the size and weight can be reduced.

Therefore, according to the present invention: 1. No continuous use at high temperatures because no adhesive is used. thin,
2. Light and flexible. Since it can be manufactured by a semi-continuous winding evaporation method, a long double-sided evaporation film can be manufactured in a relatively short time.

Therefore, the invention is characterized in that a low-cost product can be supplied and the industrial value is high.

Although specific materials and dimensions have been described in the detailed description of the present invention, the present invention is not limited to these. PET on polymer film substrate
As an example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyphenylene sulfide (PP)
S), polyimide (PI), polyetherimide (PE
I), a shield material having the structure of the present invention was produced using polyaramid, and a weather resistance test was carried out. The same result as that of polyethylene terephthalate (PET) was obtained. Further, even when the deposition metal was aluminum (Al), gold (Au), or silver (Ag), the same effect as copper (Cu) was obtained.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing Conventional Example 1.

FIG. 2 is a sectional view showing a conventional example 2;

FIG. 3 is a sectional view showing a conventional example 3;

FIG. 4 is a view showing a structure in which a metal vapor deposition layer 6 is formed on a polymer film substrate 1 and a metal vapor deposition layer 7 is formed on a back surface according to the present invention.

FIG. 5 is a view showing a production example of the shield material of the present invention.

[Description of Signs] 1 Polymer film substrate 2 Adhesive layer 3 Metal foil 4 Adhesive layer 5 Metal foil 6 Metal vapor deposited layer 7 Metal vapor deposited layer

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI theme coat ゛ (Reference) C23C 14/24 C23C 14/24 NF term (Reference) 4F006 AA35 AA38 AA39 AA40 AB73 BA07 CA08 DA01 4F071 AA45 AA46 AA56 AA60 AA62 AB07 AB09 AH12 AH13 BB11 BC01 BC02 4K029 AA11 AA25 BA03 BA04 BA05 BA08 BB04 BC03 BD00 BD02

Claims (3)

[Claims] 1. A metallized film formed by forming a metal vapor deposition layer on a wide and long polymer film substrate by a semi-continuous winding vacuum vapor deposition method, wherein the metal vapor deposition layer has an electric resistivity of 20 ° C. 3. A double-sided vapor-deposited film, wherein the metal-deposited layer is formed on both surfaces of a polymer film substrate using a metal of 10 (μΩ · cm) or less. 2. The polymer film is made of polyethylene terephthalate (PET), polyethylene naphthalate (PE)
N), polyphenylene sulfide (PPS) polyimide (PI), polyetherimide (PEI), and polyaramid, the double-sided vapor-deposited film according to claim 1, wherein 3. The method according to claim 1, wherein the metal deposited is aluminum (Al), copper (C
3. The double-sided vapor-deposited film according to claim 1, wherein the metal is a single metal selected from u), gold (Au), and silver (Ag).