JP2000195668A - Manufacture of display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture a display panel having EL elements with excellent luminous characteristics individually, and having a small interval between the EL elements each other. SOLUTION: In this manufacturing method for a display panel, plural EL elements are individually isolated by an insulating barrier rib, at an isolating layer having an isolated part in its component layer, the barrier rib having a slender groove and an irregular surface like a cauliflower is formed, and the isolated part is formed in the isolating layer by forming the barrier plate from plural member having different coefficients of linear expansion. Also, the isolated part is formed in the isolating layer by irradiating a high-energy wave on the barrier rib to divide it after forming the isolating layer, and by forming a contractile material on the isolating layer. By these methods, the isolated part can be easily formed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a display panel for displaying an image by using an EL (electroluminescence) element as a light emitting means, and a method of manufacturing the same.

[0002]

2. Description of the Related Art A first electrode layer is formed on a surface of a transparent substrate, a light emitting layer is formed on the first electrode layer, and a second electrode layer is formed on the light emitting layer. There is an EL element whose first electrode layer is transparent. In particular, in an organic EL device using an organic material for the material of the light emitting layer,
In addition to excellent light-emitting characteristics, some light-emitting devices can emit red, blue, and green light.

There is a display panel that displays an image by using a plurality of such EL elements as light emitting means. For example, FIG.
As shown in FIG. 0, dot-shaped EL elements are formed in a matrix on the surface of the transparent substrate, and each EL element is formed.
A display panel in which elements can emit light separately is one example. In this display panel, various images can be displayed by appropriately selecting an EL element to emit light. Such a display panel is conventionally manufactured by the following manufacturing method.

First, a first electrode layer made of ITO (indium tin oxide) or the like is formed on a transparent substrate by a sputtering method, and the first electrode layer is formed in a stripe shape by etching. Next, a light emitting layer is formed uniformly over the entire surface. Finally, a mask having stripe-shaped through-holes is prepared. As shown in FIG. 31, the through-holes are orthogonal to the first electrode layer as viewed on the projection plane with respect to the transparent substrate and are located above the light-emitting layer. The second electrode layer made of Mg-Ag co-evaporation or the like is formed in a stripe shape by an evaporation method.

In this way, a display panel is obtained in which the EL elements are formed in a portion where the first electrode layer and the second electrode layer overlap on the projected surface with respect to the transparent substrate, and the dot-shaped EL elements are arranged in a matrix. Can be. In this display panel, an EL element at an arbitrary position (coordinate) can emit light by selecting a line of the first electrode layer and a line of the second electrode layer through which a current flows.

In such a display panel, it is necessary to form the electrode layers of each EL element at a distance from each other so as not to short-circuit each other. In addition, as shown in FIG. 32, when a plurality of types of EL elements of different emission colors are formed adjacent to each other, the light-emitting layers are spaced from each other so that the light-emitting layers of each EL element are not adjacent to each other. It is preferable to form it. Therefore, in the conventional display panel, each EL element is formed with an interval between them.

By the way, in the above display panel,
In order to obtain clearer images, miniaturization of EL elements has been promoted. In order to miniaturize an EL element, it is necessary not only to make the EL element itself small, but also to make the interval between each EL element small. In the above-described manufacturing method, the size of the space between the through holes of the mask corresponds to the size of the space between the electrode layers, and thus the size of the space between the EL elements. Therefore, if the distance between the through holes is reduced, the distance between the EL elements can be reduced. However, when the distance between the through holes is reduced,
The following problems arise.

For example, when forming a stripe-shaped second electrode layer, the vapor-phase source material is deposited on the light-emitting layer through a through hole of a mask. At this time, if the interval between the through holes of the mask is small, the gaseous source material that has passed through the through holes is
The second electrode layer may be deposited not only at the place where the second electrode layer is originally formed but also at a place where the EL element is located. When this occurs, the electrode layers may be connected to each other and formed. As a result, E
A desired EL element cannot emit light because of a short circuit between the L elements.

Further, in the mask shown in FIG.
If the gaps between the through holes are reduced, the mechanical strength of those gaps is reduced, and deformation is more likely to occur.
Therefore, it is difficult to form the interval between the through holes with high dimensional accuracy. Further, even if the distance between the through holes is formed with high dimensional accuracy, it is difficult to always maintain the dimensional accuracy for use. For example, if the mask is used under the condition that the mask is heated at the time of film formation, the portion of the space between the through holes is easily deformed by thermal expansion. Even if its thermal expansion is slight, it greatly affects the dimensional accuracy of a fine through-hole. Therefore, each EL
It becomes difficult to form the electrode layer and the light emitting layer of the element with high dimensional accuracy.

Therefore, as shown in FIG. 33, after using a mask having a through-hole at every fixed number of lines of the electrode layer (every other line in FIG. 33), after forming the electrode layer of a predetermined line, the mask is formed. A method has been proposed in which a stripe-shaped electrode layer is formed by shifting the position by one line to form the remaining electrode layer. As the mask used in this method, a mask in which the interval between through holes is increased by a certain number of lines can be used. Therefore, at the time of film formation, it is difficult for the gas-phase source material that has passed through the through-hole to wrap around, and it is possible to prevent the electrode layers from being connected to each other. Further, since the mechanical strength of the mask can be increased, the mask is less likely to be deformed due to a change in temperature or the like. Therefore, a stripe-shaped electrode layer can be formed while maintaining the dimensional accuracy of the through-hole accurately. As a result, the EL element can be formed with high dimensional accuracy.

However, in this method, even if a mask in which fine through holes are accurately formed is prepared, it is extremely difficult to accurately shift the position of the mask and accurately align the mask. Therefore, it is difficult to form the electrode layer of each EL element at an accurate position. Therefore,
In the above-described conventional display panel, it is difficult to reduce the interval between the EL elements. Therefore, it has been difficult to sufficiently reduce the distance between the EL elements. Further, since it is necessary to perform the film formation operation twice or more, there is a problem that it takes time to form the second electrode layer.

On the other hand, as shown in FIG. 34, a stripe-shaped first electrode layer is formed, and a partition wall is provided so as to surround the exposed surface of the first electrode layer in a region where the EL element is formed.
A display panel in which a light emitting layer and a second electrode layer are formed on the exposed surface of the first electrode layer surrounded by the partition walls (at the portion where the EL element is formed) by using a mask having appropriate through holes by an evaporation method. Is known.

According to this manufacturing method, the size of the through hole of the mask can be increased by the area of the partition, and each EL element can be formed with a certain separation by the partition. Therefore, as described above, each E is used without using a partition.
Compared with the method of providing an interval between the L elements, the tolerance of the dimensional accuracy of the through hole of the mask and the positioning accuracy thereof can be increased. Therefore, each EL element can be easily and reliably isolated.

As a method of forming such a partition, a method of forming using a screen printing method, a method of forming using a photoresist, and the like can be mentioned. For example, in a method of forming a partition using a photoresist, a photosensitive resin (including a portion where no transparent electrode layer is formed) is uniformly applied on a transparent electrode layer formed in a stripe shape on a substrate. And a step of forming a partition by covering the upper part of the photosensitive resin on which a partition is to be formed with a mask having a stripe-shaped through hole, exposing the photosensitive resin to light, and developing the same. It has been known.

In the method of forming a partition in this example, the partition is formed by utilizing the fact that the exposed photosensitive resin is dissolved in an alkali. That is, the portion that is blocked from exposure by the mask cannot be dissolved in alkali, and thus remains when developed. The solids remaining in this way serve as partition walls. However, also in the above-described method for manufacturing a display panel using partition walls, if the light-emitting layer and the second electrode layer are formed without using a mask, as shown in FIG.
In some cases, an electrode layer is formed, and a second electrode layer in a portion where an EL element is formed and a second electrode layer on a partition are connected to each other. As a result, a desired EL element cannot properly emit light due to a short circuit between the EL elements. Therefore, by forming the partition walls, it is possible to increase the tolerance of the dimensional accuracy of the through hole of the mask and the accuracy of the alignment thereof. However, the size of each EL element and the width of the partition wall are further increased. If it is desired to reduce the size, it is difficult to obtain good precision.

On the other hand, as shown in FIG. 36, a plurality of partitions having a substantially T-shaped cross section integrally formed of a partition main body portion and a cap portion (overhang portion) protruding toward the EL element. There is known a method of isolating and forming the above-mentioned EL elements (disclosed in Japanese Patent Application Laid-Open No. H8-315981). If a partition having a cap portion protruding toward the EL element is formed as in the partition having a substantially T-shaped cross section, the second electrode layer can be formed without using a mask when the second electrode layer is formed by an evaporation method or the like.
As shown in FIG. 36, the second electrode layer can be formed on the light-emitting layer surrounded by the partition wall without fail and separated from the second electrode layer formed on the partition wall. As a result, each E
The L element can be easily and reliably isolated by the partition.

According to the official gazette, the partition having a substantially T-shaped cross section uniformly coats a photosensitive resin on a substrate on which a transparent electrode layer is patterned in a stripe shape (the surface of the transparent electrode layer and its interval). And forming SiO ₂ on the photosensitive resin.
Forming a layer made of SiO ₂ , etching the layer made of SiO ₂ into a stripe shape using a mask by reactive ion etching to form a cap on the photosensitive resin, and forming a mask on the cap. Forming a partition main body by exposing the photosensitive resin to work and developing the photosensitive resin.

[0018]

As described above, in the method of manufacturing a display panel in which a plurality of EL elements are formed separately from each other by partitions, if a partition having a small width is formed, each EL element is formed.
The distance between the elements is reduced, and a clear image can be obtained. However, in the method of manufacturing a display panel described in the above publication,
It is not always easy to form a partition having a small width and a substantially T-shaped cross section with high dimensional accuracy. The reason is that the cap portion is formed by an extremely complicated forming method as described above, and that such a cap portion is formed with high dimensional accuracy on a small-width partition wall main body portion, that is,
This is because it is difficult to obtain good accuracy of the projection width (to the EL element side) of the cap portion. If the projection width of the cap portion is not precisely set, the second electrode layer cannot be formed on the light emitting layer surrounded by the partition wall and separated from the second electrode layer formed on the partition wall. I will. therefore,
Strict dimensional accuracy is required for forming the cap portion, and it is costly to form a partition having a substantially T-shaped cross section.

Further, since the partition having a substantially T-shaped cross section is formed by a complicated forming process, there is a high possibility that the partition is chipped during the formation of the partition or dust or other dust adheres to the partition. . As described above, when the partition is chipped or dust adheres, the second electrode layer is formed on the chip or dust, and the second electrode layer is placed on the light emitting layer surrounded by the partition. It is difficult to form the second electrode layer separately from the second electrode layer formed thereon.

On the other hand, as described above, since the cap portion is formed separately from the partition wall main portion, the adhesion between the cap portion and the partition wall main portion cannot be said to be perfect. Therefore, there is a possibility that the cap portion may come off the partition main body portion due to vibration or the like. Further, as shown in FIG. 36, when the partition wall is formed by projecting the cap portion from the partition wall main body portion toward the EL element side, the area of the protrusion of the cap portion is reduced by E.
It may be difficult to increase the area of the L element. As a result, the distance between the EL elements is increased by the amount of protrusion of the cap portion.

Further, in the case where EL elements having different emission colors are formed so as to be adjacent to each other, it is preferable that not only the second electrode layer but also the emission layer be formed separated by partition walls. In the case where two electrode layers are to be formed separated by partition walls, as shown in FIG. 37, due to the difference in the ease of wraparound of the gas phase raw material in those layers and the difference in the installation location of their evaporation sources. In addition, there is a possibility that the end of the second electrode layer is formed on the first electrode layer. When the second electrode layer is formed as described above, a short circuit occurs between the first electrode layer and the second electrode layer, and a problem arises in that excellent light emission characteristics cannot be obtained.

Therefore, as shown in FIG. 38, a plate-like partition base is formed between the partition main body and the first electrode layer.
A method has been proposed for preventing the end of the second electrode layer from being formed on the first electrode layer. However, the partition base portion makes it difficult to further increase the area of each EL element. Further, forming the partition base portion complicates the process of forming the partition and further increases the cost of forming the partition.

As described above, in the conventional display panel manufacturing method in which a plurality of EL elements are formed separately from each other by partition walls, excellent light-emitting characteristics can be obtained with each EL element, and each EL element can be reliably formed. It has not always been easy to form minute partition walls that can be isolated at low cost. Therefore, in the conventional method for manufacturing a display panel, it is difficult to manufacture a display panel in which each EL element has excellent light emitting characteristics and the interval between each EL element is small, at low cost.

The present invention has been made in view of the above circumstances, and each EL element has excellent light emitting characteristics and each EL element
It is an object of the present invention to provide a method for manufacturing a display panel which can manufacture a display panel having a small element spacing at a low cost.

[0025]

According to a first aspect of the present invention, there is provided a method of manufacturing a display panel, comprising: a plurality of EL elements formed on a surface of a base; In a method of manufacturing a display panel comprising at least one layer constituting the EL element and being isolated by an isolation layer having an isolation portion, the partition having a narrow groove is formed, and the vapor-phase source material of the isolation layer is removed. Forming the isolation layer on the inner surface of the narrow groove by vapor deposition on a portion where the EL element is formed and the partition from a direction intersecting the depth direction of the narrow groove. It is characterized by the following.

According to a second aspect of the present invention, there is provided a method of manufacturing a display panel, wherein the plurality of EL elements formed on the surface of the base are constituted by insulating partition walls. In a method for manufacturing a display panel comprising at least one isolation layer and being isolated by an isolation layer having an isolation portion, a plurality of insulating members having different linear expansion coefficients are combined before forming the isolation layer isolated by the partition. After forming a partition and forming the isolation layer on the portion where the EL element is formed and the partition, the partition is heated or cooled to make some of the insulating members larger than other insulating members. The isolation portion is formed by dividing the isolation layer on the partition by thermal deformation.

According to a third aspect of the present invention, there is provided a method of manufacturing a display panel, wherein the plurality of EL elements formed on the surface of the base are constituted by insulating partition walls. In a method for manufacturing a display panel comprising at least one layer and being isolated by an isolation layer having an isolation portion, the partition is formed, and the isolation layer is formed on a portion where the EL element is formed and on the partition. Forming a shrinkable shrinkable material on the isolation layer while leaving at least a portion of the isolation layer on the partition, and then contracting the shrinkable material to exert a tensile stress on the isolation layer on the partition. Thereby, the isolation layer on the partition is divided to form the isolation portion.

According to a fourth aspect of the present invention, there is provided a method of manufacturing a display panel, wherein the plurality of EL elements formed on the surface of the base are constituted by insulating partition walls. In a method of manufacturing a display panel comprising at least one isolation layer and being isolated by an isolation layer having an isolation portion, the partition is formed by dividing when irradiated with a predetermined high energy wave, whereby the EL element is formed. After forming the isolation layer on the portion and the partition, the partition is divided by irradiating the high energy wave to the partition, and a tensile stress is applied to the isolation layer on the partition, whereby the partition is formed. The isolation layer is divided to form the isolation portion.

According to a fifth aspect of the present invention, there is provided a method of manufacturing a display panel, wherein the plurality of EL elements formed on the surface of the base are constituted by insulating partition walls. In a method for manufacturing a display panel comprising at least one layer and being isolated by an isolation layer having an isolation portion, the partition having a cauliflower-like uneven surface is formed, and the vapor-phase source material of the isolation layer is converted to the EL element. The isolation layer is formed while forming the isolation portion on the concave surface of the uneven surface by vapor deposition on the portion where the is formed and the partition wall.

[0030]

DESCRIPTION OF THE PREFERRED EMBODIMENTS [Method of Manufacturing a Display Panel According to Claim 1] In the present invention, as shown in FIG. A surface arises. Since the vapor-phase source material of the isolation layer is not deposited on the shadowed surface, the isolation layer 11 and the isolation layer 12 are formed separately as shown in FIG. An isolated portion between the isolation layer 11 and the isolation layer 12 becomes an isolation portion.

In addition, since the insulating layer formed on the partition and the layer formed below the partition do not allow current to flow between these layers due to the insulating partition, the function of the EL element is reduced. It does not work. As a result, as shown in FIG. 3, the isolation layer 11 and the isolation layer 12 are isolated by the isolation portion, and the EL element 1 configured by the isolation layer 11 and the EL element 2 configured by the isolation layer 11 are separated from each other by a partition. Formed in isolation. As described above, according to the present invention, each EL element can be formed separately from each partition.

In the present invention, a partition having a sectional shape shown in FIG. 4 can be used in addition to the partition having the shape shown in FIG.
The method of forming the partition having a narrow groove as exemplified here is not particularly limited, but the following two methods can be exemplified by taking the partition shown in FIG. 1 as an example. . One is a method of forming by a photoresist method. In this formation method, as the photosensitive resin, a resin (negative type) that becomes soluble in a predetermined liquid (developer) when exposed to light, or a resin that becomes insoluble in the developer when exposed to light (Positive type) may be used.
The type of the resin is not particularly limited, and a known photosensitive resin can be used. Examples of the positive type photosensitive resin include a photosensitive polyimide resin and a novolak resin photosensitive type. The photosensitive polyimide resin becomes soluble in an alkaline developer when irradiated with light of a predetermined wavelength. On the other hand, examples of the negative type photosensitive resin include a novolak resin and a synthetic rubber-based resin.

For example, when forming a negative type partition, it can be formed as follows. First, as shown in FIG. 5A, a photosensitive resin is uniformly applied on a surface on which a partition is to be formed to form a photosensitive resin layer. Next, a mask is prepared in which the shape of the space between the through holes (shielding portion) is the same as the shape of the upper surface of the partition, and as shown in FIG. 5B, the upper part of the photosensitive resin layer is covered with the mask.
The photosensitive resin layer is exposed. Subsequently, a mask having the same shape of the through hole as the opening shape of the narrow groove is prepared, and as shown in FIG. 5C, a portion of the photosensitive resin layer where a slit of a partition is to be formed is also exposed. Thereafter, the photosensitive resin layer is developed using an appropriate developing solution. As a result, the exposed portion of the photosensitive resin layer is dissolved and removed in the developing solution, and the partition shown in FIG. 1 is formed.

On the other hand, another partitioning method is to form a partition having a volume including a portion where a narrow groove is to be formed by a method such as a photoresist method or a screen printing method.
This is a method of irradiating a high energy wave such as a laser to a portion where a slit is to be formed and evaporating the portion to form a narrow groove. Like the partition wall forming method, the partition wall having the narrow groove can be formed by an easier method than the above-described partition having a substantially T-shaped cross section.

FIGS. 1 and 4 show an example of a narrow groove formed at the center of the partition wall and extending in the direction of the normal to the surface of the base (the thickness direction of the EL element). The narrow groove may be formed on any of the upper surface and the side surface of the partition wall as long as the condition that the vertical direction intersects the traveling direction of the gaseous raw material is satisfied, and as shown in FIG. It may extend in the direction. In addition, if the partition shown in FIG. 6 is formed,
An isolation part can be formed by vapor-depositing a gas-phase source material from directly above the partition.

Further, the width and depth of the narrow groove are not particularly limited, and the narrow groove is formed to have a size such that the vapor-phase source material is not deposited on a surface which is shaded with respect to the traveling direction of the vapor-phase raw material. It should just be done. Therefore, their dimensional accuracy is not required to be as high as the dimensional accuracy of the projection width of the cap portion when forming a partition having a substantially T-shaped cross section. Therefore, a partition having a narrow groove can be formed much more easily than a partition having a substantially T-shaped cross section.

As described above, in the present invention, there is a possibility that the partition may be chipped during the formation of the partition or dust or the like may adhere to the partition as compared with the case of forming the partition having a substantially T-shaped cross section. Lower. Further, the cost for forming the partition having the narrow groove is lower than that in the case of forming the partition having a substantially T-shaped cross section. As a result, the isolation layer can be reliably and inexpensively formed.

On the other hand, even if a narrow groove is formed in the partition, the partition does not reduce the formation area of each EL element unlike the cap portion of the partition having a substantially T-shaped cross section. Can be formed over the entire area surrounded by As described above, according to the present invention, the respective EL elements can be formed inexpensively and surely in isolation from each other without reducing the formation area of each EL element. Therefore, according to the present invention, it becomes possible to manufacture a display panel in which each EL element has excellent light emitting characteristics and the interval between each EL element is small, at a low cost.

Next, an embodiment of the display panel of the present invention will be described below. Note that the display panel of the present invention may be either a dot display or a segment display, but the dot display is easier to obtain the effects of the present invention described above. . The material of the transparent substrate is not particularly limited, and a known transparent substrate such as transparent glass or transparent resin can be used. When a plurality of transparent substrates are used, they may be formed integrally or separately.

The laminated structure of the EL element is not particularly limited, but includes a first electrode layer formed on the surface of the base, a light emitting layer formed on the first electrode layer, and a light emitting layer formed on the first electrode layer. An EL element comprising a second electrode layer formed thereon and at least one of the first electrode layer and the second electrode layer is transparent. The method for forming the EL element is not particularly limited, and a known formation method can be used. For example, the EL element can be formed as follows.

The first electrode layer needs to be formed from a transparent conductive material. In this case, the first electrode layer may be an anode and the second electrode layer may be a cathode, or the first electrode layer may be a cathode and the second electrode layer may be an anode. However, as described above, most display panels using EL elements have the first
The electrode layer is used as an anode, and the second electrode layer is used as a cathode. It is preferable that this display panel also employs such a combination of electrode layers.

The first electrode layer can be formed from a transparent conductive material such as ITO, AZO (Al-added ZnO), SnO ₂ and the like. The electrode layer made of any of the materials described here can be formed by an evaporation method such as a sputtering method. On the other hand, the second electrode layer may be formed of a transparent conductive material or an opaque conductive material.
When formed of an opaque conductive material, a conductive metal such as Mg-Ag or Al can be used as the material. The electrode layer made of any of these conductive metals can be formed by an evaporation method such as a sputtering method.

The light emitting layer may be formed from an inorganic material,
It may be formed from an organic material (organic EL element). When the light emitting layer is formed from an organic material, a hole injection layer or a hole transport layer is interposed between the electrode layer serving as the anode and the light emitting layer, and the light emitting layer is provided between the electrode layer serving as the cathode and the light emitting layer. It is preferable to interpose an electron injection layer, an electron transport layer, and the like on the substrate. Each layer can be formed from a known material. In the following, a layer in which a hole transport layer, a hole injection layer, a light emitting layer, an electron injection layer, and an electron transport layer are stacked is collectively referred to as an organic layer.

A red EL element which emits red light;
By properly disposing the blue EL element that emits blue light and the green EL element that emits green light, an image can be displayed in full color. As a result, images can be displayed in rich colors. Note that, among the first electrode layer, the light-emitting layer, and the second electrode layer, a method of forming another layer to be separated by a partition is not limited to the evaporation method, and is formed by a known formation method. be able to.

For example, for a display panel in which dot-shaped organic EL elements are arranged in a matrix and each EL element can emit light separately,
The organic layer and the second electrode layer of the device are used as an isolation layer, and each organic E
When the L elements are formed separated by partition walls, the display panel can be manufactured as follows by the method of manufacturing a display panel of the present invention. (Example 1) First, a flat transparent substrate made of transparent glass and having a predetermined thickness is prepared. Hereinafter, the surface of the transparent substrate on which the EL element is formed is referred to as a light emitting surface. A first electrode layer made of ITO is formed in a stripe shape on the light emitting surface of the transparent substrate by a vapor deposition method using a mask having stripe-shaped through holes at predetermined intervals.

Next, a hole injection layer made of CuPc, a hole transport layer made of TPTE, a light emitting layer made of Alq ₃ doped with quinacridone, A
An electron transport layer made of lq ₃ and an electron injection layer made of LiF are sequentially laminated by a vapor deposition method.
After forming the organic layer in this way, as shown in FIG. 7, a partition having a narrow groove is formed on the organic layer by a photoresist method (negative type). This partition can be formed as follows.

First, a photosensitive resin (polyimide resin) in a slurry state is uniformly applied on the surface of the organic layer to form a photosensitive resin layer. Subsequently, a mask in which stripe-shaped through holes are formed at predetermined intervals is prepared, and as shown in FIG. 8A, the mask is used to form the first electrode when the through holes are viewed on the projection surface with respect to the surface of the transparent substrate. The photosensitive resin layer is exposed from a direction oblique to the thickness direction of the photosensitive resin layer so as to cover the upper part of the photosensitive resin layer so as to be orthogonal to the layer. Also, as shown in FIG. 8B, the mask is shifted to cover the upper portion of the photosensitive resin layer with the mask, and the photosensitive resin layer is exposed to the photosensitive resin layer obliquely with respect to the thickness direction of the photosensitive resin layer. I do. Subsequently, a mask having the same through hole shape as the opening shape of the narrow groove was prepared.
As shown in (c), a portion of the photosensitive resin layer where the narrow groove of the partition is to be formed is also exposed.

Thereafter, the photosensitive resin layer is developed using an alkaline developer. As a result, the exposed portions of the photosensitive resin layer dissolve in the developer and are removed. Thus,
As shown in FIG. 7, it has a linear shape and a triangular cross section,
A plurality of partition walls each having a narrow groove at the center thereof are formed on the organic layer so as to be parallel to each other and orthogonal to the first electrode layer when viewed on a projection plane with respect to the surface of the transparent substrate.

Finally, a second electrode layer is formed on the organic layer having the partition walls formed thereon. For the formation of the second electrode layer, FIG.
Can be used. This vapor deposition apparatus is provided with a chamber capable of maintaining a high vacuum, and a vapor-phase raw material (Mg-Ag co-deposition) for the second electrode layer provided in the chamber in the direction of the center of the ceiling (the direction of the arrow). )
And an evaporation source capable of evaporating water.

After mounting a transparent substrate having a partition wall formed on an organic layer in the center of the ceiling in the chamber, a mask having a stripe-shaped through hole is prepared, and the through hole is formed with respect to the surface of the transparent substrate. The vapor source material is evaporated from the evaporation source by covering the upper surface of the organic layer with the mask so as to be orthogonal to the first electrode layer as viewed on the projection surface. That is, the gas-phase source material is evaporated on the entire surface from a direction oblique to the thickness direction of the EL element (the depth direction of the narrow groove of the partition). as a result,
The vapor-phase source material is deposited on a portion where the EL element is formed and on a partition except for a portion (isolation portion) which is a shadow of the narrow groove in the traveling direction of the vapor-phase source material.

In this way, as shown in FIG. 10, the light emitting layer 112 and the second electrode layer 114 and the light emitting layer
The second and second electrode layers 124 are formed so as to be separated by a narrow groove (isolation portion). Therefore, the light emitting layer 112 and the second electrode layer 1
EL element 110 constituted by 14 and light emitting layer 122
EL element 120 constituted by the second electrode layer 124
Are formed separated by a partition. As described above, in the method of manufacturing the display panel according to the present embodiment, the dot-shaped EL elements are formed separately from each other by the partition walls. According to the present invention, in the present invention, among a plurality of insulating members having different coefficients of linear expansion, some of the insulating members are thermally deformed more than other insulating members.
A step is formed between the insulating members. When the step is formed, the isolation layer receives shear stress from the insulating members and is separated. In this manner, the isolation layer on the partition is divided, and an isolation portion is formed. Here, the thermal deformation may be thermal expansion or thermal contraction.

The method of combining a plurality of insulating members having different linear expansion coefficients is not particularly limited.
Can be listed. First, as shown in FIG. 11, an insulating member A and an insulating member B made of an insulating material having a higher linear expansion coefficient than the insulating member A are formed side by side (in the direction of the light emitting surface). is there.

By forming a partition of this combination, each EL
After forming the isolation layer (the light emitting layer and the second electrode layer in the figure) on the portion where the element is formed and on each partition, if the partition is heated, as shown in FIG.
The thermal expansion is larger, and the isolation layer on the partition wall is divided. By separating the isolation layer on the partition walls to form an isolation portion, the isolation layer 212 constituting the EL element 210 is formed.
And the isolation layer 222 constituting the EL element 220 can be isolated by the isolation portion.

Further, since the insulating layer formed on the partition and the layer formed below the partition do not allow current to flow between the layers due to the insulating partition, the function of the EL element is reduced. It does not work. As a result, the EL element 210
And the EL element 220 are formed separated by a partition. Thus, each EL element can be formed separately from each partition.

Here, a partition as shown in FIG. 11 can be formed by using both the insulating members A and B in a state where they are thermally expanded. By forming this partition, the EL element 210 and the EL element 22 including on the partition
When the partition wall is cooled after forming the isolation layer at the portion 0, the insulating member B thermally shrinks more than the insulating member A as shown in FIG. . By separating the isolation layer on the partition wall to form an isolation portion, the isolation layer 212 constituting the EL element 210 and the EL
The isolation layer 222 constituting the element 220 can be isolated by the isolation portion.

Second, as shown in FIG. 14, an insulating member C and an insulating member D made of a material having a higher linear expansion coefficient than the insulating member C are stacked in the vertical direction (the thickness direction of the EL element). It is formed. After forming the partition of this combination and forming the isolation layer on the portion where each EL element is to be formed and on each partition, if the partition is heated, as shown in FIG. Of the partition wall is thermally expanded, and the partition layer of the partition wall is divided at two places on the side surface.
By separating the isolation layer on the partition wall to form an isolation portion, the isolation layer 232 included in the EL element 230 is formed,
The isolation layer 242 constituting the EL element 240 can be isolated by the isolation portion.

Further, the isolation layer formed on the partition and the layer formed below the partition do not exhibit the function of the EL element as described above. As a result, the EL element 230
And the EL element 240 are formed so as to be separated by a partition. Thus, each EL element can be formed separately from each partition. Here, the partition shown in FIG. 14 can be formed by using both the insulating member C and the insulating member D in a state where they are thermally expanded. By forming this partition, the EL element 23 is formed.
When the partition walls are cooled after forming the isolation layer on the portions of the O and EL elements 240 and the partition walls, the insulating member D thermally contracts more than the insulating member C as shown in FIG. The isolation layer is split at two points on its side. By separating the isolation layer on the partition wall to form an isolation portion, the isolation layer 232 constituting the EL element 230 and the isolation layer 242 constituting the EL element 240 can be isolated by the isolation portion.

In particular, the isolation layer formed on the side surface of the partition wall includes:
Since the thickness of the layer is often smaller than that of the isolation layer formed on the upper surface of the partition wall, the second example is easier than the first example. The separating layer can be separated. Note that, in the above example, two or more insulating members having different linear expansion coefficients are combined as the plurality of insulating members having different linear expansion coefficients. However, three or more parts may be combined or three or more types may be used. An insulating member may be used.

As described above, according to the present invention, a part of an insulating member of a partition wall can be thermally deformed to a greater degree than other insulating members to divide an isolation layer to form an isolation part. By forming an isolation layer isolated by the isolation section in this way,
Each EL element constituted by each isolation layer can be separately formed. In the present invention, the method of forming the partition wall in which a plurality of insulating members having different linear expansion coefficients are combined is not particularly limited. However, if the above-described partition wall is used as an example, the partition wall can be formed as follows. it can.

For the first partition, if a positive polyimide is used for the material of the insulating member A and a negative synthetic rubber is used for the material of the insulating member B, the positive polyimide is formed after the formation of the negative synthetic rubber. Can be formed to form a partition. On the other hand, for the second partition, a negative novolak resin was used for the material of the insulating member C, and the insulating member D was used.
It can be formed as follows using a positive novolak resin as the material.

An insulating member C made of a negative novolak resin
Is formed, a negative synthetic rubber of about 0.1 μm is formed on the buffer layer, and then an insulating member D is formed using a positive novolak resin. When the back side is made of metal, heating is performed from the front side. In that case, the configuration of the partition wall is reversed.

As described above, the partition wall in which a plurality of insulating members having different linear expansion coefficients are combined can be formed by an easier method than the above-described partition wall having a substantially T-shaped cross section. In any of the partitions, the dimensional accuracy required for combining a plurality of insulating members is required to be as high as the dimensional accuracy of the protrusion width of the cap portion when forming the aforementioned partition having a substantially T-shaped cross section. Not done. Therefore, in the present invention,
It is extremely easy to form the above-mentioned partition walls as compared to forming a partition cap portion having a substantially T-shaped cross section.

Therefore, in the present invention, during the formation of the partition,
The possibility that the partition is chipped or dust or the like adheres to the partition is lower than when a partition having a substantially T-shaped cross section is formed. In addition, the cost for forming the partition in which a plurality of insulators are combined as described above is lower than that in the case of forming a partition having a substantially T-shaped cross section. As a result, the isolation layer can be reliably and inexpensively formed.

On the other hand, in the above-mentioned example, even if the partition walls shown in the first and second examples are thermally deformed, each of the EL elements is formed like the cap portion of the partition having a substantially T-shaped cross section. Since the area is not reduced, each EL element can be formed over the entire area surrounded by the partition. The partition shown in the third example is thermally deformed to increase the width of the partition, but since the width is increased after the formation of the isolation layer, the partition has a substantially T-shaped cross section. Each E like the cap of the partition
The formation area of the L element is not reduced. Therefore, in the present invention, when each EL element emits light toward the transparent substrate,
Each EL element can be formed without reducing the area of each EL element.

Incidentally, regarding the partition wall shown in the second example,
When the insulating member C and the insulating member D may be separated from each other due to thermal deformation, the insulating member C and the insulating member D
Between them, an intermediate member having excellent adhesion to each of the insulating members and excellent deformability may be provided. This intermediate member can prevent the insulating member C and the insulating member D from being separated from each other due to thermal deformation, as shown in an example in FIG.

As described above, according to the present invention, the respective EL elements can be inexpensively and reliably isolated from each other without reducing the formation area of each EL element. Therefore, according to the present invention, it becomes possible to manufacture a display panel in which each EL element has excellent light emitting characteristics and the interval between each EL element is small, at a low cost. In the present invention, a method for forming a partition and a method for dividing an isolation layer by the partition are described in claim 1.
The display panel can be manufactured in the same embodiment as the method for manufacturing the display panel described in (1).

For example, for a display panel in which dot-shaped organic EL elements are arranged in a matrix and each EL element can emit light separately,
The organic layer and the second electrode layer of the device are used as an isolation layer, and each organic E
When the L elements are formed separated by partition walls, the display panel can be manufactured as follows by the method of manufacturing a display panel of the present invention. (Embodiment 2) First, a striped first electrode layer is formed on a transparent substrate in the same manner as in Embodiment 1.

Next, as shown in FIG. 14, the entire surface of the light emitting surface of the transparent substrate (on the surface of the first electrode layer) is made of an insulating member C and a material having a higher linear expansion coefficient than the insulating member C. A partition formed by stacking the insulating member D in the vertical direction (the thickness direction of the EL element) is formed as follows. After the insulating member C is formed using a negative novolak resin, a negative synthetic rubber having a thickness of about 0.1 μm is formed on the buffer layer, and then the insulating member D is formed using a positive novolak resin.

Subsequently, the entire surface of the light emitting surface (on the partition wall and in E
(Where the L element is formed)
An organic layer in which a hole transport layer, a hole injection layer, a light emitting layer, an electron injection layer, and an electron transport layer are sequentially stacked is formed. Further, in the same manner as in Example 1, the second electrode layer is formed on the organic layer (on the partition wall and at the portion where the EL element is formed). Then
The partition is heated to a predetermined temperature. As a result, the insulating member D thermally expands more than the insulating member C, and the organic layer and the second electrode layer on the side surfaces of the partition are separated.

In this way, as shown in FIG. 15, the light emitting layer 232a and the second electrode layer 232b and the light emitting layer 242a and the second electrode layer 242b are formed so as to be separated by the separating portion. Therefore, the EL element 230 including the light emitting layer 232a and the second electrode layer 232b and the EL element 240 including the light emitting layer 242a and the second electrode layer 242b are formed so as to be separated from each other by the partition. As described above, in the method of manufacturing the display panel according to the present embodiment, the dot-shaped EL elements are formed separately from each other by the partition walls. According to a third aspect of the present invention, a shrinkable material as shown in FIG. 17 is formed as a shrinkage material formed on the partition layer while leaving at least a part of the isolation layer on the partition wall. Can be formed. The contraction material is contracted in the direction of the arrow shown in FIG. 17 to apply a tensile stress to the isolation layer on the partition wall, thereby dividing the isolation layer as shown in FIG. 18 to form an isolation portion. Can be. As a result, the isolation layer 31 and the isolation layer 32 are isolated by the isolation portion.

In addition, the insulating layer formed on the partition and the layer formed below the partition do not allow a current to flow between these layers due to the insulating partition, so that the function of the EL element is reduced. It does not work. Therefore, the EL element composed of the isolation layer 31 and the E element composed of the isolation layer 32
The L element is formed separately from the partition. in this way,
In the present invention, each EL element can be formed separately from each partition.

In the present invention, when an isolation layer is formed on a portion where an EL element is formed and on a partition, a weak portion is formed on at least a part of the isolation layer on the partition, and the weak portion is left. Preferably, a shrink material is formed on the isolation layer. This fragile portion can be easily separated by the tensile stress caused by the shrinkage material. The method for forming the fragile portion on the partition is not particularly limited, but the portion of the isolation layer that is to be the fragile portion has a thickness smaller than that of the isolation layer formed at the portion where the EL element is formed. (I.e., a method of forming a thin wall), a method of irradiating a high-energy wave of a laser or the like to a fragile portion of the isolation layer to scratch the same, or a method of applying a high-energy wave of a laser or the like to the isolation layer A method of irradiating a portion to be a fragile portion to alter the portion.

For example, when an isolation layer is formed on a portion where an EL element is formed and a partition by a vapor deposition method, the isolation layer is formed thinner on the side surface of the partition than on a portion where the EL element is formed. By forming a thinner isolation layer on the side surface of the partition wall than the portion where the EL element is formed, the partition can be easily separated by the tensile stress of the shrinkage material as shown in FIG.

The method for forming the shrinking material is not particularly limited, but it can be formed by a method such as photolithography using synthetic rubber or the like as a material. For example, synthetic rubber shrinks when heated to a high temperature. The method of shrinking the shrinking material is appropriately selected according to the material. On the other hand, the method for forming the partition is not particularly limited, and the partition can be formed by a known forming method. The shape of the partition is not limited to the rectangular shape shown in FIG. 17 but may be a trapezoidal shape or the like. In particular, when a contraction material is formed only in a portion where an EL element is formed, if a partition having a trapezoidal cross section is formed, the isolation layer formed on the side surface of the partition is likely to receive the tensile stress of the contraction material. . Therefore, the portion of the isolation layer can be easily divided. Further, if a weak portion is formed by forming a thin isolation layer on the side surface of the partition wall, the isolation layer can be more easily divided at the weak portion.

At this time, if a partition having a trapezoidal cross section is formed, and the vapor-phase source material of the isolation layer is deposited obliquely to the height direction of the partition, the isolation layer is extremely thin on one side surface of the partition. Can be formed. The fragile portion having such a thin layer is very easily divided by the tensile stress caused by the contraction of the contraction material. As described above, the partition wall and the shrinkable material can be formed by an easier method than the above-described partition having a substantially T-shaped cross section.

The dimensional accuracy of the shrinkable material is not required to be as high as the dimensional accuracy of the protrusion width of the cap portion when forming the partition having a substantially T-shaped cross section. Therefore, forming the partition and the shrinkable material in the present invention is extremely easy as compared with forming a partition cap having a substantially T-shaped cross section. Therefore, in the present invention, during the formation of the partition wall, chipping occurs in the partition wall, there is a possibility that dust such as dust adheres to the partition wall,
It is lower than when a partition having a substantially T-shaped cross section is formed.
Further, the cost for forming the partition and the shrinkage material is lower than forming a partition having a substantially T-shaped cross section. As a result, the isolation layer can be reliably and inexpensively formed.

On the other hand, since the shrinkable material does not reduce the formation area of each EL element unlike the cap portion of the partition having a substantially T-shaped cross section, it is necessary to form each EL element over the entire area surrounded by the partition. Can be. Note that, after forming the isolation portion in the isolation layer on the partition wall with the shrinking material, the shrinking material may be removed by using an appropriate means, and another layer constituting the EL element may be formed on the isolation layer. Further, the shrinking material may be a part of a layer included in the EL element.

As described above, according to the present invention, the respective EL elements can be formed inexpensively and surely in isolation from each other without reducing the formation area of each EL element. Therefore, according to the present invention, it becomes possible to manufacture a display panel in which each EL element has excellent light emitting characteristics and the interval between each EL element is small, at a low cost. In the present invention, a display panel can be manufactured in the same embodiment as the method of manufacturing a display panel according to claim 1 except for the method of dividing the isolation layer with the shrink material and the shrink material.

For example, for a display panel in which dot-shaped organic EL elements are arranged in a matrix and each EL element can emit light separately,
The organic layer and the second electrode layer of the device are used as an isolation layer, and each organic E
When the L elements are formed separated by partition walls, the display panel can be manufactured as follows by the method of manufacturing a display panel of the present invention. (Embodiment 3) First, a striped first electrode layer is formed on a transparent substrate in the same manner as in Embodiment 1.

Next, a plurality of linear and trapezoidal partition walls are formed by a photoresist method so as to be parallel to each other and orthogonal to the first electrode layer when viewed on a projection plane with respect to the surface of the transparent substrate. Subsequently, a hole transport layer, a hole injection layer, a light emitting layer, an electron injection layer, and an electron transport layer are formed on the entire surface of the light emitting surface (on the partition wall and the portion where the EL element is formed) in the same manner as in Example 1. Are formed to form an organic layer. Further, a second electrode layer is formed on the organic layer (on the partition and at a portion where the EL element is formed) in the same manner as in Example 1.

Next, as shown in FIG. 19, a contraction material is formed on the second electrode layer at a portion where the EL element is to be formed.
This contraction material can be formed by a photolithography method. Thereafter, the shrink material is shrunk by heating at an appropriate temperature. As a result, the light emitting layer, the electron injecting layer, the electron transporting layer, and the second electrode layer receive the tensile stress of the contracting material and are separated at the side surfaces of the partition.

Thus, as shown in FIG. 20, the light emitting layer 312 and the second electrode layer 314, and the light emitting layer 322 and the second
The electrode layer 324 is formed so as to be isolated by the isolation portion. Therefore, the EL element 310 including the light emitting layer 312 and the second electrode layer 314, and the light emitting layer 322 and the second electrode layer 32
4 and the EL element 320 formed by the partition wall. As described above, in the method of manufacturing the display panel according to the present embodiment, the dot-shaped EL elements are formed separately from each other by the partition walls. According to the present invention, the partition is irradiated with high energy waves as shown in FIG. 21A, and the partition is divided as shown in FIG. 21B. . At this time, as shown in FIG. 22, the isolation layer formed on the partition wall is divided by receiving tensile stress from the partition wall to be divided, and an isolation portion is formed. As a result, the isolation layer 41 and the isolation layer 42 are isolated by the isolation portion.

In addition, the isolation layer formed on the partition and the layer formed below the partition do not allow a current to flow between the layers due to the insulating partition, so that the function of the EL element is reduced. It does not work. As a result, the EL element constituted by the isolation layer 41 and the EL element constituted by the isolation layer 42 are formed to be separated by the partition. As described above, according to the present invention, each EL element can be formed separately from each partition.

In the present invention, even if the partition is divided, the width of the partition is not increased, so that each EL element can be formed without reducing the area of each EL element. There is no particular limitation on the method for forming the partition wall before the irradiation with the high energy wave, and the partition wall can be formed by a known formation method. On the other hand, the type of high-energy wave is not particularly limited, for example, heat,
Light, laser, or the like can be used. Depending on the material of the partition, a high energy wave in which the partition easily absorbs its energy is appropriately selected. Also, the material of the partition is not particularly limited, but it is preferable to select a material that can efficiently absorb a high energy wave different from that of the isolation layer.

Further, as shown in FIG. 23, a partition wall main body made of a material that contracts when absorbing high-energy light,
It is also possible to use a partition wall which is interposed between the partition wall sections and is made of a material which is in close contact with the partition wall section while pulling the partition wall section and which is made of a material which absorbs and evaporates a high energy wave. When the partition walls are irradiated with a high energy wave, as shown in FIG. 24, the partition members do not evaporate, and the partition wall body contracts rapidly due to the stopping force of the partition members. As a result, the partition wall is vigorously divided, and the isolation layer formed on the partition wall receives a greater tensile stress than the partition wall to be divided, and is reliably separated.

Any of the above-mentioned partitions can be formed by an easier method than the above-mentioned partition having a substantially T-shaped cross section. Although FIGS. 21 and 24 show an example in which the partition is divided at the center of the partition, the partition may be divided at any part of the partition. When a dividing member is used, the dividing member only needs to be formed with a width that can provide a sufficient stopping force so as not to divide the partition main body before heating. As high as the dimensional accuracy of the protrusion width of the cap portion when forming the substantially T-shaped partition wall is not required.
Therefore, forming such a partition is much easier than forming a partition having a substantially T-shaped cross section.

Therefore, in the present invention, during the formation of the partition,
The possibility that the partition is chipped or dust or the like adheres to the partition is lower than when a partition having a substantially T-shaped cross section is formed. Further, the cost of forming the partition and dividing the partition is lower than forming a partition having a substantially T-shaped cross section. As a result,
The isolation layer can be reliably and inexpensively formed.

On the other hand, even if the partition is divided, the formation area of each EL element is not reduced unlike the cap portion of the partition having a substantially T-shaped cross section. Can be formed. As described above, according to the present invention, the respective EL elements can be inexpensively and reliably isolated from each other without reducing the formation area of each EL element. Therefore, according to the present invention, it becomes possible to manufacture a display panel in which each EL element has excellent light emitting characteristics and the interval between each EL element is small, at a low cost.

In the present invention, a display panel can be manufactured in the same embodiment as the method of manufacturing a display panel according to the first aspect, except for the method of forming the partition and the method of dividing the isolation layer by the partition. . For example, for a display panel in which dot-shaped organic EL elements are arranged in a matrix and each EL element can emit light separately,
When the organic layer and the second electrode layer of each EL element are used as an isolation layer and each organic EL element is formed by being separated by a partition, the display panel is manufactured by the method of manufacturing a display panel of the present invention as follows. can do. (Embodiment 4) First, a striped first electrode layer is formed on a transparent substrate in the same manner as in Embodiment 1.

Next, by a photoresist method, a plurality of partition walls made of a polyimide resin and having a linear shape and a semicircular cross section are perpendicular to the first electrode layer as viewed in parallel with each other and on a projection plane with respect to the surface of the transparent substrate. It is formed so that Subsequently, a hole transport layer, a hole injection layer, a light emitting layer, an electron injection layer, and an electron transport layer are formed on the entire surface of the light emitting surface (on the partition wall and the portion where the EL element is formed) in the same manner as in Example 1. Are formed to form an organic layer. Further, a second electrode layer is formed on the organic layer (on the partition and at a portion where the EL element is formed) in the same manner as in Example 1.

Next, as shown in FIG. 24, the partition walls are divided by irradiating the partition walls with a high-energy laser. As a result, the organic layer and the second electrode layer are separated on the partition wall by receiving the tensile stress of the partition wall. Thus, as shown in FIG. 25, the light-emitting layer 412 and the second electrode layer 414 and the light-emitting layer 422 and the second electrode layer 424 are formed so as to be separated by the separation portion. Therefore, the light emitting layer 412 and the second electrode layer 414
And the EL element 420 including the light emitting layer 422 and the second electrode layer 424 are formed separately from each other by the partition. As described above, in the method of manufacturing the display panel according to the present embodiment, the dot-shaped EL elements are formed separately from each other by the partition walls. According to the present invention, since the partition walls have a cauliflower-like uneven surface as shown in FIG. 26, the concave portions of the uneven surface have a shadow with respect to the traveling direction of the gas-phase raw material. The surface can be continuously generated in the longitudinal direction of the partition wall. Since the gaseous source material of the isolation layer is not deposited on the shadowed surface, as shown in FIG.
1 and the isolation layer 52 are formed separately. An isolated portion between the isolation layer 51 and the isolation layer 52 becomes an isolation portion. As a result, the isolation portions 51 and 5 are separated by the isolation portion.
2 are isolated.

In addition, since the insulating layer formed on the partition and the layer formed below the partition do not allow a current to flow between the layers due to the insulating partition, the function of the EL element is reduced. It does not work. Therefore, the EL element composed of the isolation layer 51 and the EL element composed of the isolation layer 52 are formed to be separated by the partition. As described above, according to the present invention, each EL element can be formed separately from each partition.

The method of forming the partition having a cauliflower-like uneven surface is not particularly limited. For example, a method of forming a negative-type partition by a photoresist method is used as a part of the process, as follows. Can be formed. First, a photosensitive resin in a slurry state is uniformly applied to a surface on which a partition is to be formed, with a predetermined thickness. Next, a mask is prepared in which through holes having substantially the same shape as the shape of the projection surface of the partition wall with respect to the base are formed at predetermined intervals, the upper portion of the photosensitive resin layer is covered with the mask, and the photosensitive resin layer is exposed. After this exposure, the photosensitive resin layer is treated with an appropriate developer. As a result, the exposed portion dissolves in the developing solution to form a partition having a smooth surface.

Subsequently, an over-etching solution for dissolving the unexposed photosensitive resin is prepared, and the partition is further processed (over-etching). As a result, FIG.
As shown in FIG. 6 and FIG. 27, the surface of the partition wall is irregularly etched to form a cauliflower-like uneven surface. The type of the photosensitive resin is not particularly limited, and a known photosensitive resin such as a polyimide resin can be used.

By the way, such a cauliflower-like concave
In the method of forming a partition having a convex surface, a slurry-like
Do not dissolve in over-etching solution
It is preferable to use a mixture in which fine particles are mixed. This
When the partition walls are over-etched,
Promotes deepening of recesses on cauliflower-like uneven surface
can do. Fine particle material is over-etchin
If it does not dissolve in the processing solution, it is particularly limited by its type
But not polymers such as nylon and polyethylene
Materials can be used. Also, do not transmit light
To V_TwoO_Five, Ta _TwoO_FiveAdd an insulating inorganic material such as
It is preferable to color so as not to pass. Fine particles
The diameter is not particularly limited.

The concave portion of the cauliflower-shaped uneven surface may be formed at a depth such that the vapor-phase raw material is not deposited on a surface which is shadowed in the direction of travel of the vapor-phase raw material. The dimensional accuracy of the cauliflower-shaped concave portion is not required to be as high as the dimensional accuracy of the protrusion width of the cap portion when forming the partition having a substantially T-shaped cross section. Therefore, a partition having a cauliflower-like surface can be formed much more easily than a partition having a substantially T-shaped cross section.

Therefore, in the present invention, during the formation of the partition,
The possibility that the partition is chipped or dust or the like adheres to the partition is lower than when a partition having a substantially T-shaped cross section is formed. In addition, the cost required to form a partition having a slit is lower than when a partition having a substantially T-shaped cross section is formed. As a result, the isolation layer can be reliably and inexpensively formed.

On the other hand, even when the cauliflower-shaped uneven surface is formed on the partition, the formation area of each EL element is not reduced unlike the cap portion of the partition having a substantially T-shaped cross section.
The element can be formed over the entire area surrounded by the partition. As described above, according to the present invention, the respective EL elements can be inexpensively and reliably isolated from each other without reducing the formation area of each EL element. Therefore, according to the present invention, it becomes possible to manufacture a display panel in which each EL element has excellent light emitting characteristics and the interval between each EL element is small, at a low cost.

According to the present invention, a display panel can be manufactured in the same embodiment as the method of manufacturing a display panel according to the first aspect, except for a method of forming a partition and a method of isolating an isolation layer by the partition. . For example, for a display panel in which dot-shaped organic EL elements are arranged in a matrix and each EL element can emit light separately,
When the organic layer and the second electrode layer of each EL element are used as an isolation layer and each organic EL element is formed by being separated by a partition, the display panel is manufactured by the method of manufacturing a display panel of the present invention as follows. can do. (Embodiment 5) First, a striped first electrode layer is formed on a transparent substrate in the same manner as in Embodiment 1. Subsequently, an organic layer having a hole transport layer, a hole injection layer, a light emitting layer, an electron injection layer, and an electron transport layer laminated on the entire surface of the light emitting surface (on the first electrode layer) in the same manner as in Example 1. The layer is formed by an evaporation method.

Next, on the surface of the organic layer, a partition having a cauliflower-like uneven surface is formed as follows.
First, a photosensitive resin (polyimide) and fine particles (colored glass powder) made of colored glass are mixed to obtain a slurry resist mixture. This resist mixture is uniformly applied to the surface of the electron transport layer at a predetermined thickness by spin coating.

Next, a mask having stripe-shaped through holes formed at predetermined intervals is prepared, the photosensitive resin layer is covered with the mask, and the photosensitive resin layer is exposed. Treat the photosensitive resin layer with a suitable developer. As a result, the exposed portion dissolves in the developing solution to form a partition as shown in FIG. Next, a processing liquid in which the unexposed photosensitive resin is dissolved is prepared, and the partition walls are further processed (over-etching). As a result, as shown in FIG. 29, the surface of the partition is irregularly etched, and a cauliflower-like uneven surface is formed. At this time, the recesses on the uneven surface are deeply formed by the fine particles contained in the partition walls.

Subsequently, the entire surface of the light emitting surface (on the partition wall and in E
The second electrode layer is formed by vapor deposition in the same manner as in Example 1 (at the portion where the L element is formed). As a result, the gaseous source material is placed on the partition walls except for the surface (partition portion) which is a shadow of the concave portion of the cauliflower-shaped uneven surface in the direction of travel of the gaseous source material, and on the portion where the EL element is formed. Material is deposited.

In this manner, as shown in FIG. 29, the second electrode layer 514 and the second electrode layer 524 are formed so as to be separated by the cauliflower-like uneven surface (isolation portion) of the partition. Therefore, the EL element 51 constituted by the second electrode layer 514
0 and the EL element 52 constituted by the second electrode layer 524
0 is formed by being separated by a partition. As described above, in the method of manufacturing the display panel according to the present embodiment, the dot-shaped EL elements are formed separately from each other by the partition walls.

[Brief description of the drawings]

FIG. 1 is a sectional view of a partition schematically showing a partition having a narrow groove in the present invention.

FIG. 2 is a cross-sectional view schematically illustrating an example of an isolation unit formed in an isolation layer according to the present invention.

FIG. 3 is a cross-sectional view of a display panel schematically showing formed EL elements in the present invention.

FIG. 4 is a cross-sectional view of a partition schematically showing an example of a partition having a narrow groove in the present invention.

FIG. 5 is a flowchart schematically showing a process of forming a partition in the present invention. (A) is a sectional view schematically showing a photosensitive resin layer. (B) is a cross-sectional view showing a state in which the photosensitive resin layer is exposed to form a partition. (C) is a cross-sectional view showing a state in which the photosensitive resin layer is exposed to form a narrow groove.

FIG. 6 is a cross-sectional view of a partition schematically showing a modification of the partition having a narrow groove in the present invention.

FIG. 7 is a perspective view of a partition schematically showing a partition having a narrow groove in the first embodiment.

FIG. 8 is a flowchart schematically showing a process of forming a partition wall in Example 1. (A) And (b) is sectional drawing which shows a mode that the photosensitive resin layer is exposed in order to form a partition. (C) is a cross-sectional view showing a state in which the photosensitive resin layer is exposed to form a narrow groove.

FIG. 9 is a front sectional view schematically showing an apparatus for forming a second electrode layer in the first embodiment.

FIG. 10 is a partial cross-sectional view schematically showing a manufactured display panel in Example 1.

FIG. 11 is a partial cross-sectional view schematically illustrating a partition and an isolation layer before isolation according to the present invention. (B)
It is the fragmentary sectional view which looked at a part of (a) further enlarged.

FIG. 12 is a partial cross-sectional view schematically illustrating a manufactured display panel in the present invention.

FIG. 13 is a partial cross-sectional view schematically illustrating a manufactured display panel in the present invention.

FIG. 14 is a partial cross-sectional view schematically illustrating an isolation layer before a partition and an isolation portion are formed in the present invention.
FIG. 2B is a partial cross-sectional view of a part of FIG.

FIG. 15 is a partial cross-sectional view schematically showing a manufactured display panel in Example 2.

FIG. 16 is a partial cross-sectional view schematically showing a manufactured display panel in the present invention.

FIG. 17 is a partial cross-sectional view schematically showing a partition wall, a shrink material, and an isolation layer before isolation.

FIG. 18 is a cross-sectional view schematically illustrating an example of an isolation portion formed in an isolation layer in the present invention.

FIG. 19 is a partial cross-sectional view schematically illustrating an isolation layer before a partition wall, a shrink material, and an isolation portion are formed in Example 3.

FIG. 20 is a partial cross-sectional view of a display panel schematically showing a manufactured display panel in Example 3.

FIG. 21 is a flowchart schematically showing a state in which a partition is divided by irradiating a partition with a high energy wave in the present invention. (A) is the perspective view which showed typically signs that the partition was irradiated with the high energy wave. (B) is a perspective view schematically showing the divided partition walls.

FIG. 22 is a cross-sectional view schematically illustrating an example of an isolation part formed in an isolation layer in the present invention.

FIG. 23 is a perspective view of a partition wall schematically showing a modification of the partition wall in the present invention.

FIG. 24 is a partial cross-sectional view schematically showing an isolation layer before a partition wall, a shrink material, and an isolation portion are formed in Example 4.

FIG. 25 is a partial cross-sectional view schematically showing a manufactured display panel in Example 4.

FIG. 26 is a perspective view of a partition schematically showing the partition in the present invention.

FIG. 27 is a cross-sectional view schematically showing a state in which an isolation layer is formed in the present invention.

FIG. 28 is a perspective view of a partition, schematically showing one process of forming the partition in the present invention.

FIG. 29 is a partial cross-sectional view of a display panel schematically showing a manufactured display panel in Example 5.

FIG. 30 is a front view of a display panel schematically showing a display panel manufactured by a conventional display panel manufacturing method and a partial cross-sectional view thereof.

FIG. 31 is a perspective view schematically showing a state in which a second electrode layer is formed in a conventional display panel manufacturing method.

FIG. 32 is a front view of a display panel schematically showing a display panel manufactured by a conventional display panel manufacturing method and a cross-sectional view thereof.

FIG. 33 is a perspective view schematically showing a state in which a second electrode layer is formed in a conventional display panel manufacturing method.

FIG. 34 is a partial cross-sectional view schematically showing a display panel manufactured by a conventional display panel manufacturing method.

FIG. 35 is a partial cross-sectional view schematically showing a display panel manufactured by a conventional display panel manufacturing method.

FIG. 36 is a partial cross-sectional view schematically showing a display panel manufactured by a conventional display panel manufacturing method.

FIG. 37 is a partial cross-sectional view schematically showing a display panel manufactured by a conventional display panel manufacturing method.

FIG. 38 is a partial cross-sectional view schematically showing a display panel manufactured by a conventional display panel manufacturing method.

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 3K007 AB08 AB15 AB18 BA06 CA01 CB01 DA01 DB03 EB00 FA01 FA03 5C094 AA02 AA05 AA43 AA44 AA55 BA12 BA27 CA19 CA24 DA13 EA04 EB02 EC03 FB15 GB10

Claims (5)

[Claims] 1. A display panel in which a plurality of EL elements formed on a surface of a substrate are separated by an insulating partition by an insulating layer comprising at least one layer constituting the EL element and having an isolating portion. Forming the partition having a narrow groove, and depositing the vapor-phase source material of the isolation layer on a portion where the EL element is formed and on the partition from a direction intersecting a depth direction of the narrow groove. By vapor deposition,
A method of manufacturing a display panel, comprising forming the isolation layer while forming the isolation portion on the inner surface of the narrow groove. 2. A display panel in which a plurality of EL elements formed on the surface of a base are separated by an insulating partition by an insulating layer comprising at least one layer constituting the EL element and having an isolating portion. In the manufacturing method, before forming an isolation layer separated by the partition, the partition is formed by combining a plurality of insulating members having different linear expansion coefficients, and a portion where the EL element is formed and on the partition After forming the isolating layer, the partition is heated or cooled to thermally deform some of the insulating members more than other insulating members, thereby separating the isolating layer on the partition and separating the insulating members. A method for manufacturing a display panel, comprising forming a portion. 3. A display panel in which a plurality of EL elements formed on the surface of a base are separated by an insulating layer and at least one layer constituting the EL elements and separated by a separating layer having a separating part. Forming the partition, forming the isolation layer on the portion where the EL element is formed and the partition, and leaving at least a part of the isolation layer on the partition on the isolation layer. After forming a shrinkable shrinkable material, the shrinkable material is shrunk to apply a tensile stress to the isolation layer on the partition, thereby separating the isolation layer on the partition to form the isolation portion. A method of manufacturing a display panel. 4. A display panel in which a plurality of EL elements formed on the surface of a base are separated by an insulating partition by an insulating layer comprising at least one layer constituting the EL element and having an isolating portion. In the manufacturing method, after forming a partition that divides when a predetermined high-energy wave is irradiated, forming the isolation layer on a portion where the EL element is formed and the partition, A display characterized in that the partition is divided by irradiating an energy wave, and a tensile stress is applied to the isolation layer on the partition, thereby dividing the isolation layer on the partition to form the isolation portion. Panel manufacturing method. 5. A display panel in which a plurality of EL elements formed on the surface of a base are separated by an insulating partition by an insulating layer comprising at least one layer constituting the EL element and having an isolating portion. Forming the partition having a cauliflower-shaped uneven surface, and vapor-depositing the gas-phase raw material of the isolation layer on a portion where the EL element is formed and on the partition, whereby the uneven surface is formed. A method for manufacturing a display panel, comprising forming the isolation layer while forming the isolation portion on a concave surface.