JP2000182212A - Thin-film magnetic head and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the magnetic path length of the magnetic head. SOLUTION: A lower magnetic pole layer and an upper magnetic pole layer have 1st parts 8a and 15a which are arranged in areas including areas facing the whole thin-film coils 12 and 18, 2nd parts 8b and 15b which form magnetic pole parts and are connected to the 1st parts 8a and 15a, and 3rd parts 8c and 15c for connecting the 1st parts 8a and 15a to each other. The thin-film coils 12 and 18 are arranged facing the 1st parts 8a and 15a so that they partially pass between the 2nd parts 8b and 15b and 3rd parts 8c and 15c. The thin-film coil 12 is formed on the 1st part 8a of the lower magnetic pole layer having no step.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a thin-film magnetic head having at least an inductive magnetic transducer and a method for manufacturing the same.

[0002]

2. Description of the Related Art In recent years, as the areal recording density of a hard disk drive has been improved, the performance of a thin film magnetic head has been required to be improved. As the thin film magnetic head, a composite thin film having a structure in which a recording head having an inductive magnetic transducer for writing and a reproducing head having a magnetoresistive (MR) element for reading is stacked. Magnetic heads are widely used. As an MR element, an anisotropic magnetoresistance (hereinafter, AMR) is used.
stive). An AMR element using the effect and a GMR element using a giant magnetoresistance (hereinafter, referred to as GMR (Giant Magneto Resistive)) effect. A reproducing head using an AMR element is called an AMR head or simply an MR head. A reproducing head using a GMR element is a GMR head.
Called the head. The AMR head is used as a reproducing head having a surface recording density exceeding 1 gigabit / (inch) ² , and the GMR head is used as a surface recording density of 3 gigabit / (inch) ^2.
(Inch) Used as a playback head exceeding ² .

As a method of improving the performance of the reproducing head, a method of changing the MR film from an AMR film to a material having excellent magnetoresistive sensitivity such as a GMR film, or a method of appropriately setting a pattern width of the MR film, particularly, an MR height. There are methods. The MR height refers to the length (height) from the end of the MR element on the air bearing surface side to the end on the opposite side, and is controlled by the amount of polishing when processing the air bearing surface. .
The air bearing surface referred to here is a surface of the thin-film magnetic head facing the magnetic recording medium, and is also called a track surface.

On the other hand, as the performance of the reproducing head is improved, the performance of the recording head is also required to be improved. Factors that determine the performance of the recording head include the pattern width, in particular, the throat height (TH). The throat height refers to the length (height) from the end on the air bearing surface side to the end on the opposite side of the portion where the two pole layers face each other via the recording gap layer. In order to improve the performance of the recording head, it is desired to reduce the throat height. This throat height is also controlled by the amount of polishing when processing the air bearing surface.

In order to increase the recording density of the performance of the recording head, it is necessary to increase the track density in the magnetic recording medium. For this purpose, it is necessary to realize a recording head having a narrow track structure in which the width of the lower magnetic pole and the upper magnetic pole formed above and below the recording gap layer on the air bearing surface is reduced from several microns to submicron dimensions. Yes, semiconductor processing technology is used to achieve this.

Here, referring to FIGS. 11 to 16,
As an example of a conventional method of manufacturing a thin film magnetic head, an example of a method of manufacturing a composite thin film magnetic head will be described. 11 to 16, (a) shows a cross section perpendicular to the air bearing surface, and (b) shows a cross section of the magnetic pole portion parallel to the air bearing surface.

In this manufacturing method, first, as shown in FIG. 11, for example, alumina (Al ₂ O ₃ .TiC) is formed on a substrate 101 made of AlTiC (Al ₂ O ₃ .TiC).
_An insulating layer 102 of ₂ O ₃ ) is deposited with a thickness of about 5 to 10 μm. Next, a lower shield layer 103 for a read head made of a magnetic material is formed on the insulating layer 102.

Next, as shown in FIG. 12, for example, alumina is coated on the lower shield layer 103 for 100 to 200 nm.
Then, a lower shield gap film 104 as an insulating layer is formed by sputtering to a thickness of m. Next, on the lower shield gap film 104, an MR film for forming an MR element 105 for reproduction is formed with a thickness of several tens nm. Next, a photoresist pattern is selectively formed on the MR film at a position where the MR element 105 is to be formed. At this time, a photoresist pattern having a shape such that the lift-off can be easily performed, for example, a T-shaped cross section is formed. Next, using the photoresist pattern as a mask, the MR film is etched by, for example, ion milling to form the MR element 105. The MR element 10
5 may be a GMR element or an AMR element. Next, a pair of electrode layers 106 electrically connected to the MR element 105 are formed on the lower shield gap film 104 using the same photoresist pattern as a mask.

Next, an upper shield gap film 107 as an insulating layer is formed on the lower shield gap film 104 and the MR element 105, and the MR element 105 is embedded in the shield gap films 104, 107.

Next, on the upper shield gap film 107, an upper shield layer and lower magnetic pole layer (hereinafter, referred to as a lower magnetic pole layer) 108 made of a magnetic material and used for both the read head and the write head is formed. It is formed to a thickness of about 3 μm. Next, on the lower magnetic pole layer 108, a recording gap layer 109 made of an insulating film, for example, an alumina film is formed to a thickness of 0.3 μm.

Next, as shown in FIG. 13, in order to form a magnetic path, the recording gap layer 109 is partially etched to form a contact hole 109a. Next, on the recording gap layer 109 in the magnetic pole part, the upper magnetic pole tip 11 made of a magnetic material for a recording head, for example, a permalloy (NiFe) or FeN of a high saturation magnetic flux density material.
0 is formed to a thickness of 0.5 to 1.0 μm. The upper magnetic pole tip 110 forms a part of the upper magnetic pole. At this time, a magnetic layer 119 made of a magnetic material for forming a magnetic path is simultaneously formed on the contact hole for forming a magnetic path.

Next, as shown in FIG. 14, the upper magnetic pole tip 110 is used as a mask to perform ion milling.
The recording gap layer 109 and the lower magnetic pole layer 108 are etched. As shown in FIG. 14B, the structure in which the side walls of the upper magnetic pole (the upper magnetic pole tip 110), the write gap layer 109, and a part of the lower magnetic pole layer 108 are vertically formed in a self-aligned manner is a trim ( Trim) structure. According to this trim structure, it is possible to prevent the effective track width from increasing due to the spread of the magnetic flux generated when writing in a narrow track.

Next, an insulating layer 111 made of, for example, an alumina film is formed on the entire surface to a thickness of about 3 μm. Next, the insulating layer 111 is polished and flattened to reach the surfaces of the upper pole tip 110 and the magnetic layer 119. As a polishing method at this time, mechanical polishing or CMP (chemical mechanical polishing) is used. By this planarization, the surfaces of the upper pole tip 110 and the magnetic layer 119 are exposed.

Next, as shown in FIG. 15, a first-layer thin-film coil 112 for an inductive recording head made of, for example, copper (Cu) is formed on the flattened insulating layer 111. . Next, on the insulating layer 111 and the coil 112,
A photoresist layer 113 is formed in a predetermined pattern. Next, heat treatment is performed at a predetermined temperature to planarize the surface of the photoresist layer 113. Next, a second-layer thin-film coil 114 is formed on the photoresist layer 113. Next, the photoresist layer 113 and the coil 114
On top, a photoresist layer 115 is formed in a predetermined pattern. Next, heat treatment is performed at a predetermined temperature to planarize the surface of the photoresist layer 115.

Next, as shown in FIG. 16, an upper magnetic pole layer 116 made of a magnetic material for a recording head, for example, permalloy is formed on the upper magnetic pole tip 110, the photoresist layers 113 and 115, and the magnetic layer 119. I do. next,
On the upper magnetic pole layer 116, an overcoat layer 117 made of, for example, alumina is formed. Finally, the slider is machined to form the air bearing surfaces 118 of the recording head and the reproducing head, thereby completing the thin-film magnetic head.

In FIG. 16, TH indicates the throat height, and MR-H indicates the MR height. Also,
P2W represents the magnetic pole width, that is, the recording track width. As a factor that determines the performance of the thin-film magnetic head, there is an Apex Angle as indicated by θ in FIG. 16 in addition to the throat height and the MR height. This apex angle corresponds to the photoresist layer 1
The angle formed by a straight line connecting the corners of the side surface on the magnetic pole side in the coil portion (hereinafter, referred to as an apex portion) which is covered with 13, 115 and rises in a mountain shape and the upper surface of the insulating layer 110.

[0017]

To improve the performance of the thin-film magnetic head, the throat height TH, MR height MR-H, apex angle θ as shown in FIG.
It is important to accurately form the track width P2W.

In particular, in recent years, in order to enable high areal density recording, that is, to form a recording head having a narrow track structure, the track width P2W is required to have a submicron size of 1.0 μm or less. . For this purpose, a technology for processing the upper magnetic pole into a submicron size using a semiconductor processing technology is required. Also, with the narrow track structure, it is desired to use a magnetic material having a higher saturation magnetic flux density for the magnetic pole.

Here, the problem is that it is difficult to finely form the upper magnetic pole layer formed on the apex portion.

As a method of forming the upper magnetic pole layer, for example, a frame plating method is used as shown in Japanese Patent Application Laid-Open No. Hei 7-262519. When the upper magnetic pole layer is formed by using the frame plating method, first, a thin electrode film made of, for example, permalloy is entirely formed on the apex portion by, for example, sputtering. Next, a photoresist is applied thereon and patterned by a photolithography process to form a frame (outer frame) for plating. Then, the upper magnetic pole layer is formed by plating using the previously formed electrode film as a seed layer.

However, there is a height difference of, for example, 7 to 10 μm or more between the apex portion and other portions. On this apex portion, a photoresist is applied in a thickness of 3 to 4 μm. If the thickness of the photoresist on the apex portion is required to be at least 3 μm or more, the photoresist having fluidity is gathered on the lower side. A resist film is formed.

As described above, in order to realize a recording track width of a submicron size, it is necessary to form a frame pattern of a submicron width by a photoresist film. Therefore, a fine pattern having a submicron size must be formed on the apex portion by a photoresist film having a thickness of 8 to 10 μm or more. However, it is extremely difficult in the manufacturing process to form such a thick photoresist pattern with a narrow pattern width.

Further, at the time of photolithographic exposure,
Exposure light is reflected by a base electrode film as a seed layer,
The photoresist is also exposed to the reflected light, causing the photoresist pattern to be distorted and the like, making it impossible to obtain a sharp and accurate photoresist pattern.

As described above, conventionally, when the magnetic pole width has a submicron size, there has been a problem that it is difficult to form the upper magnetic layer accurately.

From the above, FIG.
As shown in the steps of FIGS. 3 to 16, the upper pole tip 110 effective for forming a narrow track of the recording head forms a track width of 1.0 μm or less, and then is connected to the upper pole tip 110. A method of forming the upper magnetic pole layer 116 serving as a portion is also adopted (see Japanese Patent Application Laid-Open Nos. 62-245509 and 60-10409). As described above, the normal upper magnetic pole layer is replaced with the upper magnetic pole tip 110 and the upper magnetic pole layer 116 serving as a yoke.
The upper magnetic pole chip 110 for determining the track width can be finely formed on the flat surface on the recording gap layer 109 with a submicron width.

However, such a thin film magnetic head still has the following problems.

(1) First, in the conventional magnetic head, the throat height is determined at the end of the upper pole tip 110 far from the air bearing surface 118. However, when the width of the upper magnetic pole tip 110 is reduced, the pattern edge is formed round in photolithography. Therefore, the throat height, which requires high-precision dimensions, becomes non-uniform, and the air bearing surface 11
In the processing and polishing steps of No. 8, a situation where the balance with the track width of the MR element was lacked occurred. For example,
When a track width of 0.5 to 0.6 μm is required,
The end of the upper pole tip 110 remote from the air bearing surface 118 is at the throat height zero position (the position of the end of the insulating layer on the air bearing surface side that determines the throat height).
From the air bearing surface 118 side, a large recording gap is opened, and writing of recording data becomes impossible.

(2) Next, in the conventional thin film magnetic head shown in FIG. 16, since the track width of the recording head is defined by the upper magnetic pole chip 110, the upper magnetic pole layer 116
It can be said that it is not necessary to process as finely as the upper pole tip 110. However, since the position of the upper magnetic pole layer 116 is determined by the photolithographic alignment on the upper magnetic pole chip 110, the air bearing surface 1
When viewed from the 18 side, if both are largely displaced to one side, writing is performed on the upper magnetic pole layer 116 side, and the effective track width may be increased. As a result, there is a problem that a so-called side write occurs in which data is written in a region other than the region where data should be originally recorded on the recording medium.

The track width of the recording head is extremely fine,
In particular, when the thickness becomes 0.5 μm or less, the upper magnetic pole layer 116
Also, a processing accuracy of a submicron width is required. That is, when viewed from the air bearing surface 118 side, if the lateral dimensional difference between the upper magnetic pole tip 110 and the upper magnetic pole layer 116 is too large, a side light is generated in the same manner as described above, and the area other than the original data recording area is generated. The problem that writing is performed also occurs in the region of.

From the above, the upper magnetic pole tip 11
Not only the upper pole layer 116 but also the upper magnetic pole layer 116 needs to be processed to a submicron width. However, since the apex portion under the upper magnetic pole layer 116 still has a large height difference, the fine processing of the upper magnetic pole layer 116 is performed. Was difficult.

(3) Further, in the conventional thin film magnetic head,
There is a problem that it is difficult to shorten the magnetic path length (Yoke Length). That is, as the coil pitch is smaller, a head having a shorter magnetic path length can be realized. In particular, a recording head having excellent high-frequency characteristics can be formed. The distance from the height zero position to the outer peripheral end of the coil has been a major factor that prevents shortening the magnetic path length. Since the magnetic path length can be shorter in a two-layer coil than in a one-layer coil, many high-frequency recording heads employ a two-layer coil. However, in the conventional magnetic head, after forming the first-layer coil, a photoresist film is formed by about 2 μm in order to form an insulating film between the coils.
m. Therefore, a small rounded apex portion is formed at the outer peripheral end of the coil of the first layer. Next, a second-layer coil is formed thereon. At this time, the coil seed layer cannot be etched at the inclined portion of the apex portion, and the coil is short-circuited.
The second-layer coil needs to be formed on a flat portion.

Therefore, for example, the thickness of the coil is set to 2-3 μm.
m, the thickness of the inter-coil insulating film is 2 μm, and the apex angle is 45 ° to 55 °. In addition to the length of the portion corresponding to the coil, the magnetic path length is zero throat height from the outer peripheral end of the coil. Twice the distance of 3 to 4 μm which is the distance to the vicinity of the position (the distance from the contact portion between the upper magnetic pole layer and the lower magnetic pole layer to the inner peripheral end of the coil is also 3 to 4 μm)
necessary. ) Of 6 to 8 μm is required. The length other than the portion corresponding to the coil has been a factor that hinders the reduction of the magnetic path length.

Here, for example, the line width of the coil is 1.5 μm.
Consider a case where an 11-turn coil having m and a space of 0.5 μm is formed in two layers. In this case, as shown in FIG.
If the first layer has 6 turns and the second layer has 5 turns, of the magnetic path lengths,
The length corresponding to the coil 114 of the second layer is 9.5 μm.
m. In addition to the magnetic path length, the coil 1 of the second layer
14 from the outer peripheral end and the inner peripheral end
A total length of 6 to 8 μm is required as the distance to the end of the photoresist layer 115 for insulating the substrate. The length of the magnetic path is further changed by 1 from the end of the photoresist layer 115.
A total length of 6 to 8 μm is required as the distance to the end of the photoresist layer 113 for insulating the coil 112 of the layer. In the present application, the magnetic path length is represented by the length of the magnetic pole layer excluding the magnetic pole portion and the contact portion. In FIG. 16, the magnetic path length L ₀ is 21.5 μm. In the prior art, it is impossible to further reduce the magnetic path length, which has hindered the improvement of the high frequency characteristics.

The present invention has been made in view of such a problem, and an object of the present invention is to provide a thin-film magnetic head capable of reducing the magnetic path length of a recording head and a method of manufacturing the same.

[0035]

A thin-film magnetic head according to the present invention includes two magnetic pole portions which are magnetically connected and a part of a side facing a recording medium is opposed via a gap layer. A thin film provided with an inductive magnetic transducer having first and second magnetic layers each composed of one layer, and a thin-film coil disposed insulated between the first and second magnetic layers In a magnetic head, a first magnetic layer forms a magnetic pole portion with a first portion disposed in a region including an in-plane region facing the entire thin film coil, and is connected to the first portion. A second portion, and a third portion for connecting the first portion and the second magnetic layer, at least a portion of the thin-film coil faces the first portion, and It is arranged so as to pass between the second part and the third part.

The method of manufacturing a thin-film magnetic head according to the present invention includes two magnetic pole portions which are magnetically connected and a part of the side facing the recording medium is opposed via a gap layer, and each has at least one layer. Of a thin-film magnetic head having an inductive magnetic conversion element having first and second magnetic layers made of the following, and a thin-film coil disposed insulated between the first and second magnetic layers: A manufacturing method, comprising: forming a first magnetic layer; forming a gap layer on the first magnetic layer; forming a second magnetic layer on the gap layer; Forming a thin-film coil so as to be insulated between the first magnetic layer and the second magnetic layer, wherein the step of forming the first magnetic layer faces the entire thin-film coil. A first portion disposed in a region including an in-plane region to be formed; A first magnetic layer having a second portion connected to the first portion and a third portion for connecting the first portion and the other magnetic layer; Forming a thin film coil, wherein at least a part of the thin film coil is opposed to the first portion and
The thin film coil is formed so as to be disposed so as to pass between the portion and the third portion.

In the thin-film magnetic head or the method of manufacturing the same according to the present invention, the first portion and the magnetic pole portion are formed in a region including an in-plane region opposed to the entire thin-film coil, and the first portion is formed. A first magnetic layer having a connected second portion and a third portion for connecting the first portion and the second magnetic layer is provided, and at least a part of the thin-film coil is formed of a first magnetic layer. It is arranged so as to face the first part and pass between the second part and the third part.

In the thin-film magnetic head or the method of manufacturing the same according to the present invention, the second portion of the first magnetic layer may define the throat height.

Further, in the thin film magnetic head or the method of manufacturing the same according to the present invention, the second magnetic layer forms the first portion disposed in the region including the in-plane region facing the thin film coil, and the magnetic pole portion. A second portion connected to the first portion, and a third portion for connecting the first portion to the first magnetic layer.
May be included.

In the thin-film magnetic head or the method of manufacturing the same according to the present invention, the end face of the first portion of the second magnetic layer facing the recording medium is separated from the surface of the thin-film magnetic head facing the recording medium. May be arranged at different positions.

In the thin-film magnetic head or the method of manufacturing the same according to the present invention, the length of the second portion in the second magnetic layer is set to be longer than the length of the second portion in the first magnetic layer. You may.

In the thin-film magnetic head or the method of manufacturing the same according to the present invention, the first-layer portion in which the thin-film coil is arranged to pass between the second portion and the third portion in the first magnetic layer. And a second portion and a third portion of the second magnetic layer.
And a second layer portion disposed so as to pass between the portions.

In the thin-film magnetic head or the method of manufacturing the same according to the present invention, the thin-film magnetic head is further disposed so that the magneto-resistive element is partially opposed to the recording medium with the magneto-resistive element interposed therebetween. And a first and a second shield layer for shielding the magnetoresistive element. In this case, the second shield layer may also serve as the first magnetic layer.

[0044]

Embodiments of the present invention will be described below in detail with reference to the drawings. [First Embodiment of the Invention] First, referring to FIGS. 1 to 7, a method of manufacturing a composite thin film magnetic head as a method of manufacturing a thin film magnetic head according to a first embodiment of the invention will be described. Will be described. 1 to 6,
(A) shows a cross section perpendicular to the air bearing surface, (b)
Indicates a cross section of the magnetic pole portion parallel to the air bearing surface.

In the manufacturing method according to the present embodiment, first,
As shown in FIG. 1, for example, Altic (Al ₂ O ₃
On a substrate 1 made of TiC, for example, alumina (A
An insulating layer 2 of l ₂ O ₃ ) is deposited with a thickness of about 5 μm. Next, a lower shield layer 3 for a reproducing head made of a magnetic material, for example, permalloy is formed on the insulating layer 2 by about 3 μm.
It is formed to a thickness of μm. The lower shield layer 3 is, for example,
Using the photoresist film as a mask, plating
It is selectively formed on the insulating layer 2. Next, although not shown, an insulating layer made of, for example, alumina is entirely formed to a thickness of, for example, 4 to 5 μm, and polished by, for example, CMP (chemical mechanical polishing) until the lower shield layer 3 is exposed. Is flattened.

Next, as shown in FIG. 2, for example, alumina or aluminum nitride is sputter deposited on the lower shield layer 3 to form a lower shield gap film 4 as an insulating layer. Next, on the lower shield gap film 4, an MR film for forming the reproducing MR element 5 is formed.
It is formed to a thickness of several tens nm. Next, on this MR film,
A photoresist pattern is selectively formed at a position where the MR element 5 is to be formed. Next, using the photoresist pattern as a mask, the MR film is etched by, for example, ion milling to form the MR element 5. Note that the MR element 5 may be a GMR element or an AMR element.
Next, a pair of electrode layers 6 electrically connected to the MR element 5 are formed on the lower shield gap film 4 with a thickness of several tens nm using the same photoresist pattern as a mask. Next, the lower shield gap film 4 and the MR element 5
An upper shield gap film 7 as an insulating layer is formed thereon, and the MR element 5 is embedded in the shield gap films 4 and 7. Next, on the upper shield gap film 7, a first portion 8a of an upper shield layer and a lower magnetic pole layer (hereinafter, referred to as a lower magnetic pole layer) made of a magnetic material and used for both the read head and the write head. Is selectively formed with a thickness of about 1.0 to 1.5 μm. First portion 8a of lower pole layer
Is a portion arranged in a region including an in-plane region facing the entire thin film coil described later.

Next, as shown in FIG. 3, the second portion 8b and the third portion 8c of the lower magnetic pole layer are formed on the first portion 8a of the lower magnetic pole layer in a range of 1.5 to 2. It is formed to a thickness of 5 μm. The second portion 8b forms the pole portion of the lower pole layer and is connected to the first portion 8a. Third part 8c
Is a portion for connecting the first portion 8a and the upper magnetic pole layer. In the present embodiment, the position of the end of the second portion 8b on the opposite side (right side in the drawing) from the air bearing surface defines the throat height. That is, this position is the throat height zero position.

The second portion 8b and the third portion 8c of the lower pole layer are made of NiFe (Ni: 80% by weight, Fe: 20).
Wt%) or NiFe (N
i: 45% by weight, Fe: 55% by weight), and may be formed by plating, or may be formed by sputtering using a material such as FeN or FeZrN which is a high saturation magnetic flux density material. . In addition, CoFe, Co-based amorphous material or the like, which is a high saturation magnetic flux density material, may be used.

Next, an insulating film 10 made of, for example, alumina is formed entirely. The thickness of the insulating film 10 is 1 μm
The following is preferred. The reason is that if the thickness is further increased, the magnetic path length becomes too large. In the present embodiment, the thickness of the insulating film 10 is formed to a thickness of about 0.3 to 0.6 μm.

Next, although not shown, a seed layer for forming the first layer portion of the thin-film coil by plating is formed by, for example, sputtering. Next, a photoresist is applied thereon and patterned by a photolithography process to form a frame 11 for plating.

In the present embodiment, the first layer portion of the thin-film coil is disposed above the third portion 8c of the lower pole layer, around the third portion 8c of the lower pole layer, and a part thereof is formed. The frame 11 is formed so as to pass between the second portion 8b and the third portion 8c of the lower pole layer.

Next, using the frame 11, the first layer portion 12 of the thin film coil made of, for example, copper (Cu) is formed to a thickness of about 1.0 to 2.0 μm by frame plating.
Formed to a thickness of The pitch of the first layer portion 12 is, for example, about 1.2 to 2.0 μm.

As described above, in the present embodiment, the first layer portion 12 of the thin-film coil is formed by the third portion 8 of the lower pole layer.
c, around the third portion 8c of the lower pole layer, a portion of which is arranged to pass between the second portion 8b and the third portion 8c of the lower pole layer. You.

Next, as shown in FIG.
Then, after removing the seed layer therebelow, an insulating layer 13 made of, for example, alumina is formed with a thickness of about 3 to 4 μm on the whole. Next, for example, by CMP, the second
Until the portion 8b and the third portion 8c are exposed, the insulating layer 13 is polished to flatten the surface. Here, in FIG. 4, the first layer portion 12 of the thin film coil is not exposed by the flattening process, but may be exposed.
However, of the first layer portion 12 due to the planarization process,
Portion 12 connected to the second layer portion of the thin film coil described later
If a is not exposed, this portion 12a is exposed by photolithography.

Next, as shown in FIG. 5, the second portion 8b and the third portion 8c of the lower pole layer and the insulating layer 1
3, a recording gap layer 14 made of an insulating material,
It is formed with a thickness of 0.2 to 0.3 μm. Insulating materials used for the recording gap layer 14 generally include alumina, aluminum nitride, silicon oxide-based materials, and silicon nitride-based materials.

Next, in order to form a magnetic path, the recording gap layer 14 is formed in a portion above the third portion 8c of the lower magnetic pole layer.
Is partially etched to form a contact hole, and in order to connect the portion 12a in the first layer portion and the second layer portion of the thin-film coil, the recording gap layer 14 is partially formed above the portion 12a. Etching to form a contact hole.

Next, a second portion 15b of the upper pole layer is formed on the recording gap layer 14 to a thickness of 2.0 to 3.0 μm, and a third portion 8c of the lower pole layer is formed on the second portion 15b. The third portion 15c of the upper pole layer is changed to 2.0 to 3.0.
It is formed to a thickness of μm. The second portion 15b forms a pole portion of the upper pole layer, and is connected to a first portion of the upper pole layer described later. The third portion 15c is a portion for connecting a first portion of the upper magnetic pole layer described later and the lower magnetic pole layer. In the present embodiment, the second portion 1 of the upper pole layer
The length of 5b is formed longer than the length of the second portion 8b of the lower magnetic pole layer. Also, the second portion 15b of the upper pole layer
Are formed so as to overlap a part of the first layer portion 12 of the thin film coil via the recording gap layer 14.

The second portion 15b and the third portion
The portion 15c of NiFe (Ni: 80% by weight, Fe:
20% by weight) or NiFe which is a high saturation magnetic flux density material.
(Ni: 45% by weight, Fe: 55% by weight) and may be formed by a plating method, or may be formed by sputtering using a material such as FeN or FeZrN which is a high saturation magnetic flux density material. Good. In addition, CoFe, Co-based amorphous material or the like, which is a high saturation magnetic flux density material, may be used.

Next, the recording gap layer 14 is selectively etched by dry etching using the second portion 15b of the upper pole layer as a mask. For the dry etching at this time, for example, reactive ion etching (RIE) using a gas such as a chlorine-based gas such as BCl ₂ or Cl ₂ or a fluorine-based gas such as CF ₄ or SF ₆ is used. Next, the second portion 8b of the lower magnetic pole layer is selectively etched by about 0.3 to 0.6 μm by, for example, argon ion milling to obtain a trim structure as shown in FIG. 5B. According to this trim structure, it is possible to prevent the effective track width from increasing due to the spread of the magnetic flux generated when writing in a narrow track.

Next, an insulating film 16 made of, for example, alumina is formed entirely. The thickness of the insulating film 16 is 1 μm
The following is preferred. The reason is that if the thickness is further increased, the magnetic path length becomes too large. In the present embodiment, the thickness of the insulating film 16 is formed to a thickness of about 0.3 to 0.6 μm.

Next, although not shown, a seed layer for forming the second layer portion of the thin-film coil by plating is formed by, for example, sputtering. Next, a photoresist is applied thereon and patterned by a photolithography process to form a frame for plating.

In the present embodiment, the second layer portion of the thin-film coil is disposed around the third portion 15c of the upper pole layer, and a part thereof is formed by the second portion 15b of the upper pole layer and the third portion 15b.
The frame is formed so as to pass between the portion 15c of FIG.

Next, using this frame, a second layer portion 18 of a thin film coil made of, for example, copper (Cu) is formed to a thickness of, for example, about 1.0 to 2.0 μm by frame plating. The pitch of the second layer portion 18 is, for example, about 1.2 to 2.0 μm. Here, the second layer portion 18
Of these, the portion 18a disposed on the portion 12a of the first layer portion 12 is connected to the portion 12a via a contact hole.

As described above, in the present embodiment, the second layer portion 18 of the thin film coil is partially disposed between the second portion 15b and the third portion 15c of the upper pole layer. .

Next, as shown in FIG. 6, after removing the frame and the seed layer under the frame, an insulating layer 19 made of, for example, alumina is formed on the whole to a thickness of about 3 to 4 μm. Next, the insulating layer 19 is polished by, for example, CMP until the second portion 15b and the third portion 15c of the upper pole layer are exposed, and the surface is flattened.

Next, the first portion of the upper magnetic pole layer made of a magnetic material for a recording head is placed on the flattened second portion 15b and third portion 15c of the upper magnetic pole layer, and on the insulating layer 19. 15a is formed to a thickness of, for example, about 2-3 μm. The first portion 15a of the upper pole layer is a portion disposed between the second portion 15b and the third portion 15c of the upper pole layer in a region including an in-plane region facing the thin-film coils 12 and 18. It is. The first portion 15 of this upper pole layer
a is in contact with and magnetically coupled to the third portion 8c of the lower magnetic pole layer via the third portion 15c. The first portion 15a of the upper pole layer is made of NiFe (Ni: 80% by weight, F
e: 20% by weight) or NiF which is a high saturation magnetic flux density material
e (Ni: 45% by weight, Fe: 55% by weight), and may be formed by plating, or may be formed by sputtering using a material such as FeN or FeZrN which is a high saturation magnetic flux density material. Is also good. In addition, CoFe, Co-based amorphous material or the like, which is a high saturation magnetic flux density material, may be used. Further, in order to improve the high frequency characteristics, the first portion 15a of the upper magnetic pole layer may have a structure in which an inorganic insulating film and a magnetic layer such as permalloy are superposed on any number of layers.

In this embodiment, the end surface of the first portion 15a of the upper pole layer on the side facing the recording medium (air bearing surface side) is separated from the surface of the thin-film magnetic head facing the recording medium (see FIG. (Right side in the figure).

Next, an overcoat layer 20 made of, for example, alumina is formed on the first portion 15a of the upper magnetic pole layer.
It is formed to a thickness of 20 to 40 μm, its surface is flattened, and an electrode pad (not shown) is formed thereon. Finally, the slider is polished to form the air bearing surfaces of the recording head and the reproducing head, thereby completing the thin-film magnetic head according to the present embodiment.

In this embodiment, the first portion 8a and the second
The lower magnetic pole layer composed of the portion 8b and the third portion 8c corresponds to the first magnetic layer in the present invention, and the upper magnetic pole layer composed of the first portion 15a, the second portion 15b, and the third portion 15c. Corresponds to the second magnetic layer in the present invention.

FIG. 7 is a plan view of the thin-film magnetic head according to the present embodiment manufactured as described above. In this figure, the overcoat layer 20 is omitted. In FIG. 7, reference numeral 8B denotes a portion where the second portion 8b of the lower magnetic pole layer is etched to obtain a trim structure.

As shown in FIG. 7, the first portion 8a of the lower magnetic pole layer is arranged in a region including an in-plane region opposed to the entire thin film coils 12, 18. Therefore, according to the present embodiment, the entire first layer portion 12 of the thin film coil is
Since the insulating layer 10 can be formed on the first portion 8a of the lower magnetic pole layer having no step, the first layer portion 12 of the thin-film coil can be formed finely. Also,
In the present embodiment, the second layer portion 18 of the thin film coil can also be formed on the flat surface of the recording gap layer 14, so that it can be formed finely. From these facts, according to the present embodiment, the pitch between the thin film coils 12 and 18 can be reduced. As a result, according to the present embodiment, for example, the magnetic path length of the recording head can be reduced by about 30% to 40% as compared with the related art. Therefore, according to the present embodiment, it is possible to provide a thin-film magnetic head having excellent high-frequency characteristics. Further, according to the present embodiment, the overall length of the coil can be significantly reduced by reducing the magnetic path length, even if the number of turns of the coil is the same. As a result, the thickness of the coil can be reduced from, for example, the conventional 2-3 μm to about 1-1.5 μm.

Here, under the same design rules as in the conventional example shown in FIG.
18, the magnetic path length is formed as shown in FIG.
_Set to ₁ . As an example of a specific numerical value of the magnetic path length, L ₁
Is 14.5 μm.

Further, according to the present embodiment, the second portion 8b of the lower magnetic pole layer and the second portion 15b of the upper magnetic pole layer forming the magnetic pole portion of the recording head are both placed on a flat surface. These second parts 8 can be formed
b and 15b can be formed finely. Therefore, the second portion 15b of the upper pole layer that determines the track width of the recording head can be formed to have a half-micron or quarter-micron dimension, and the track width of the recording head can be reduced. As a result, a thin-film magnetic head having a surface recording density of 20 gigabits / (inch) ² to 30 gigabits / (inch) ² , which will be required in the future, can be realized.

In this embodiment, the throat height is defined by the second portion 8b of the lower pole layer.
Since the second portion 8b of the lower magnetic pole layer is formed as a wide pattern using photolithography as shown in FIG. 8, the throat height is reduced by the magnetic pole portion of the upper magnetic pole layer which needs to be finely formed. The position of the end of the pattern can be controlled more accurately than in the case where it is defined, and as a result, the throat height can be accurately defined.

In this embodiment, the end surface of the first portion 15a of the upper pole layer on the air bearing surface side is located at a position away from the air bearing surface of the thin-film magnetic head. Therefore, even when the throat height is small, the first portion 15a of the upper magnetic pole layer is not exposed to the air bearing surface, and as a result, so-called side light does not occur and the effective track width is prevented from increasing. be able to.

In this embodiment, the lower magnetic pole layer (8
a, 8b, 8c) and the first layer portion 12 of the thin-film coil, the inorganic insulating film 10 which is thin and has a sufficient withstand voltage is provided. A large withstand voltage can be obtained during the process. Also, between the first layer portion 12 and the second layer portion 18 of the thin film coil,
Since the inorganic insulating layer 13 and the inorganic insulating film 16 are provided in addition to the recording gap layer 14, a large withstand voltage can be obtained between the first layer portion 12 and the second layer portion 18 of the thin-film coil. And leakage of magnetic flux from the thin film coils 12 and 18 can be reduced.

In the present embodiment, as shown in FIG. 7, the second portion 8b of the lower magnetic pole layer is
Since they are widely arranged around the peripheral portions 2 and 18, the flattening process after forming the first layer portion 12 of the thin film coil is easy.

[Second Embodiment of the Present Invention] First, FIG.
A thin-film magnetic head according to a second embodiment of the present invention and a method for manufacturing the same will be described with reference to FIG. 8A shows a cross section perpendicular to the air bearing surface, and FIG. 8B shows a cross section of the magnetic pole portion parallel to the air bearing surface.

The thin film magnetic head according to the present embodiment is different from the thin film magnetic head according to the first embodiment in that the insulating film 16 provided under the second layer portion 18 of the thin film coil is provided.
, Except that the second layer portion 18 of the thin film coil is formed directly on the recording gap layer 14. The method of manufacturing the thin-film magnetic head according to the present embodiment is the same as the method of manufacturing the thin-film magnetic head according to the first embodiment except that the step of forming the insulating film 16 is omitted.

The other structures, operations and effects of the present embodiment are the same as those of the first embodiment.

[Third Embodiment of the Invention] First, FIG.
A thin-film magnetic head according to a third embodiment of the present invention and a method for manufacturing the same will be described with reference to FIG. 9A shows a cross section perpendicular to the air bearing surface, and FIG. 9B shows a cross section of the magnetic pole portion parallel to the air bearing surface.

In the thin-film magnetic head according to the present embodiment,
In the thin-film magnetic head according to the first embodiment, the upper surface of the second layer portion 18 of the thin-film coil is arranged on the same plane as the upper surface of the second portion 15b and the upper surface of the third portion 15c of the upper pole layer. ing. And the second portion 15 of the upper pole layer.
b of the thin-film coil between the third portion 15b and the third portion 15c.
On the layer portion 18, an insulating layer 31 for insulating the second layer portion 18 from the first portion 15a of the upper pole layer is provided. This insulating layer 31 is formed of, for example, a photoresist.

In the method of manufacturing a thin-film magnetic head according to the present embodiment, the method of manufacturing a thin-film magnetic head according to the first embodiment differs from the method of manufacturing a thin-film magnetic head according to the first embodiment in that the second portion 15b of the upper pole layer and the third The insulating layer 19 is polished until the portion 15c is exposed, and when the surface is flattened, the second layer portion 18 of the thin film coil is also exposed. Then, thereafter, an insulating layer 31 is formed on the second layer portion 18 of the thin-film coil between the second portion 15b and the third portion 15c of the upper pole layer.

Other configurations, operations, and effects of the present embodiment are the same as those of the first embodiment.

[Fourth Embodiment of the Present Invention] First, FIG.
A thin-film magnetic head and a method of manufacturing the same according to a fourth embodiment of the present invention will be described with reference to FIG. In addition,
10A shows a cross section perpendicular to the air bearing surface, and FIG. 10B shows a cross section of a magnetic pole portion parallel to the air bearing surface.

In the thin-film magnetic head according to the present embodiment,
As in the second embodiment, the second layer portion 1 of the thin-film coil
8 is formed directly on the recording gap layer 14 and the second
Layer portion 18 is covered by a photoresist layer 41. In the present embodiment, the first portion 15a of the upper pole layer is formed on the second portion 15b and the third portion 15c of the upper pole layer, and on the photoresist layer 41.

In the present embodiment, since the first portion 15a of the upper pole layer is not formed on a flat surface, of the effects of the first embodiment, the first portion 15a has a flat surface. There is no effect of being formed on top.

However, according to the present embodiment, since the number of CMP steps is small, the manufacturing cost can be reduced.

Other configurations, operations and effects of the present embodiment are the same as those of the first embodiment.

The present invention is not limited to the above embodiments, and various changes can be made. For example, in each of the above embodiments, both the lower pole layer and the upper pole layer have the first portion, the second portion, and the third portion, and the first layer portion 12 of the two-layer thin-film coil is formed. And the second layer portion 18 are both formed by the second portion 8b, 1 of the lower pole layer or the upper pole layer.
5b and the third portion 8c, 15c, but only the lower magnetic pole layer has the first portion and the second portion.
And a third portion, and only the first layer portion 12 may be arranged so as to pass between the second portion 8b and the third portion 8c of the lower pole layer.

In each of the above embodiments, the throat height is defined by the lower magnetic pole layer. However, the throat height may be defined by the upper magnetic pole layer.

In each of the above embodiments, a thin film magnetic head having a structure in which a reading MR element is formed on the substrate side and an inductive magnetic conversion element for writing is stacked thereon has been described. The stacking order may be reversed.

That is, an inductive magnetic transducer for writing may be formed on the substrate side, and an MR element for reading may be formed thereon. In such a structure, for example, the magnetic film having the function of the upper magnetic pole layer shown in the above-described embodiment is formed on the substrate side as a lower magnetic pole layer, and the magnetic film having the above-described structure is opposed to the magnetic pole layer via a recording gap film. It can be realized by forming the magnetic film having the function of the lower magnetic pole layer shown in the embodiment as the upper magnetic pole layer. In this case, it is preferable to use the upper magnetic pole layer of the induction type magnetic transducer and the lower shield layer of the MR element together.

In the thin-film magnetic head having such a structure, it is preferable to use a substrate having a concave portion. Then, by forming a coil portion in the concave portion of the base,
The size of the thin-film magnetic head itself can be further reduced.

The present invention can also be applied to a thin-film magnetic head that includes only an inductive magnetic transducer and performs reading and writing with the inductive magnetic transducer.

[0096]

As described above, in the method of manufacturing a thin-film magnetic head according to any one of claims 1 to 8 or the method of manufacturing a thin-film magnetic head according to any of claims 9 to 16, A first portion disposed in a region including an in-plane region to form a magnetic pole portion;
A first magnetic layer having a second portion connected to the portion and a third portion for connecting the first portion and the second magnetic layer is formed, and at least a part of the thin film coil is formed. Are disposed so as to face the first portion and pass between the second portion and the third portion. Therefore, according to the thin-film magnetic head or the method of manufacturing the thin-film magnetic head, the thin-film coil can be formed on the first portion of the first magnetic layer having no step. It is possible to form finely, and as a result, it is possible to reduce the magnetic path length of the recording head.

According to the method of manufacturing a thin-film magnetic head of the second aspect or the thin-film magnetic head of the tenth aspect, the throat height is defined by the second portion of the first magnetic layer. Further, there is an effect that the throat height can be accurately defined.

According to the method of manufacturing a thin-film magnetic head of the fourth aspect or the thin-film magnetic head of the twelfth aspect, the second magnetic layer is disposed in a region including an in-plane region facing the thin-film coil. A first portion, a second portion forming a magnetic pole portion and connected to the first portion, and a third portion for connecting the first portion and the first magnetic layer. And the end face of the first portion of the second magnetic layer on the side facing the recording medium is arranged at a position away from the surface of the thin-film magnetic head facing the recording medium. This has the effect of preventing the width from increasing.

According to the thin film magnetic head of the sixth aspect or the thin film magnetic head of the fourteenth aspect, the thin film coil passes between the second portion and the third portion in the first magnetic layer. And a second layer portion disposed so as to pass between the second portion and the third portion in the second magnetic layer.
Further, both the first layer portion and the second layer portion of the thin film coil can be formed on a flat surface, so that the pitch of the coil can be reduced, and the magnetic path length can be further reduced. It has the effect that it becomes possible.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view for explaining one step in a method of manufacturing a thin-film magnetic head according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view for explaining a step following the step shown in FIG.

FIG. 3 is a cross-sectional view for explaining a step following the step shown in FIG. 2;

FIG. 4 is a cross-sectional view for explaining a step following the step shown in FIG. 3;

FIG. 5 is a cross-sectional view for explaining a step following the step shown in FIG. 4;

FIG. 6 is a cross-sectional view for explaining a step following the step shown in FIG. 5;

FIG. 7 is a plan view of the thin-film magnetic head according to the first embodiment of the present invention.

FIG. 8 is a sectional view of a thin-film magnetic head according to a second embodiment of the present invention.

FIG. 9 is a sectional view of a thin-film magnetic head according to a third embodiment of the present invention.

FIG. 10 is a sectional view of a thin-film magnetic head according to a fourth embodiment of the present invention.

FIG. 11 is a cross-sectional view for explaining one step in a conventional method of manufacturing a thin-film magnetic head.

FIG. 12 is a cross-sectional view for explaining a step following the step shown in FIG. 11;

FIG. 13 is a cross-sectional view for explaining a step following the step shown in FIG. 12;

FIG. 14 is a sectional view for illustrating a step following the step shown in FIG. 13;

FIG. 15 is a sectional view for illustrating a step following the step shown in FIG. 14;

FIG. 16 is a cross-sectional view for explaining a step following the step shown in FIG. 15;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Substrate, 2 ... Insulating layer, 3 ... Lower shield layer, 5 ... MR
Element, 8a: first portion of lower pole layer, 8b: second portion of lower pole layer, 8c: third portion of lower pole layer, 10
... insulating film, 12: first layer portion of thin film coil, 14: recording gap layer, 15a: first portion of upper magnetic pole layer, 15b
... second portion of upper pole layer, 15c ... third portion of upper pole layer
, 16 ... insulating film, 18 ... second layer portion of thin film coil, 20 ... overcoat layer.

Claims (16)

[Claims] 1. A first magnetic recording medium comprising two magnetic pole portions which are magnetically coupled and have a portion facing a recording medium facing a recording medium via a gap layer, each of which has at least one layer.
And a second magnetic layer, and a thin-film magnetic head including an inductive magnetic transducer having a thin-film coil disposed insulated between the first and second magnetic layers, The first magnetic layer has a first portion disposed in a region including an in-plane region opposed to the entire thin film coil, and a second portion which forms a magnetic pole portion and is connected to the first portion. And a third part for connecting the first part and the second magnetic layer. At least a part of the thin film coil faces the first part, and A thin-film magnetic head, which is disposed so as to pass between a second portion and a third portion. 2. The thin-film magnetic head according to claim 1, wherein the second portion of the first magnetic layer defines a throat height. 3. The second magnetic layer forms a magnetic pole portion with a first portion disposed in a region including an in-plane region facing the thin-film coil, and is connected to the first portion. 3. The thin-film magnetic head according to claim 1, further comprising a second portion, and a third portion for connecting the first portion and the first magnetic layer. 4. The thin-film magnetic head according to claim 1, wherein an end surface of the first portion of the second magnetic layer facing the recording medium is located away from a surface of the thin-film magnetic head facing the recording medium. 4. The thin-film magnetic head according to claim 3, wherein: 5. The device according to claim 3, wherein the length of the second portion in the second magnetic layer is longer than the length of the second portion in the first magnetic layer. Thin film magnetic head. 6. The first thin-film coil comprises: a first layer portion disposed so as to pass between the second portion and the third portion in the first magnetic layer; 4. The method according to claim 3, further comprising a second layer portion disposed so as to pass between the second portion and the third portion.
6. The thin-film magnetic head according to any one of items 5 to 5. 7. A first and a second element for shielding the magnetoresistive element, wherein the magnetoresistive element and a part of the side facing the recording medium face each other with the magnetoresistive element interposed therebetween. 7. The thin-film magnetic head according to claim 1, further comprising: a shield layer. 8. The thin-film magnetic head according to claim 7, wherein said second shield layer also serves as said first magnetic layer. 9. A first magnetic recording medium comprising two magnetic pole portions which are magnetically coupled and which face each other on a side facing the recording medium via a gap layer, each of which includes at least one layer.
And a second magnetic layer, and a thin-film magnetic head provided with an inductive magnetic transducer having a thin-film coil insulated between the first and second magnetic layers. Forming the first magnetic layer; forming the gap layer on the first magnetic layer; forming the second magnetic layer on the gap layer; Forming the thin-film coil so as to be insulated from the first magnetic layer and the second magnetic layer. The step of forming the first magnetic layer comprises: A first portion disposed in a region including an in-plane region opposed to the entire thin film coil; a second portion forming a magnetic pole portion and connected to the first portion; and the first portion And a third portion for connecting the other magnetic layer to the first magnetic layer. Forming the conductive layer and forming the thin-film coil so that at least a part of the thin-film coil faces the first portion and passes between the second portion and the third portion. A method for manufacturing a thin-film magnetic head, comprising forming a thin-film coil so as to be arranged. 10. The step of forming the first magnetic layer,
The method according to claim 9, wherein the first magnetic layer is formed so that the second portion defines a throat height. 11. The step of forming the second magnetic layer,
A first portion disposed in a region including an in-plane region facing the thin-film coil; a second portion forming a magnetic pole portion and connected to the first portion; 11. The method according to claim 9, wherein a second magnetic layer having a third portion for connecting to the first magnetic layer is formed. 12. The step of forming the second magnetic layer,
2. The thin-film magnetic head according to claim 1, wherein an end face of the first portion of the second magnetic layer on the side facing the recording medium is separated from a surface of the thin-film magnetic head facing the recording medium.
2. The method for manufacturing a thin-film magnetic head according to 1. 13. The method according to claim 11, wherein a length of the second portion in the second magnetic layer is equal to or longer than a length of the second portion in the first magnetic layer. A method for manufacturing a thin film magnetic head. 14. The step of forming the thin-film coil includes the steps of: forming a first layer portion passing through the first magnetic layer between the second portion and the third portion;
14. A thin-film coil having a second layer portion disposed so as to pass between the second portion and the third portion in the magnetic layer described above, is formed. The manufacturing method of the thin film magnetic head according to the above. 15. A first and a second element for shielding the magnetoresistive element, wherein the magnetoresistive element and a part of the side facing the recording medium face each other with the magnetoresistive element interposed therebetween. 15. The method for manufacturing a thin-film magnetic head according to claim 9, further comprising the step of forming a shield layer. 16. The method according to claim 15, wherein the second shield layer also serves as the first magnetic layer.