JP2000293816A - Thin film magnetic head and its production - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the high frequency characteristic by reducing the eddy current loss in a magnetic layer forming a magnetic path of an inductive magnetic conversion element without hindering passage of a magnetic flux. SOLUTION: A thin film magnetic head is provided with a reproducing head and a recording head. The recording head is provided with a lower magnetic pole layer and an upper magnetic pole layer 13, which include magnetic pole parts facing each other with a recording gap layer 12 between them, and a thin film coil which is arranged between them in the insulated state. The upper magnetic pole layer 13 consists of plural laminated magnetic material layers 13a to 13c and resistance layers 21, 22 arranged between adjacent magnetic material layers. Resistance layers 21 and 22 are arranged in a partial area of a yoke part 13B of the upper magnetic pole layer 13 except the part in the vicinity of the connection part to a magnetic pole part 13A and that to the upper magnetic pole layer. Resistance layers 21 and 22 are arranged in plural divided areas.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a thin-film magnetic head having at least an inductive magnetic transducer and a method for manufacturing the same.

[0002]

2. Description of the Related Art In recent years, as the areal recording density of a hard disk drive has been improved, the performance of a thin film magnetic head has been required to be improved. As the thin film magnetic head, a composite type having a structure in which a recording head having an inductive magnetic transducing element for writing and a reproducing head having a magnetoresistive (hereinafter also referred to as MR (Magneto-resistive)) element for reading are stacked. Thin film magnetic heads are widely used. As an MR element, an anisotropic magnetoresistance (hereinafter, AMR) is used.
esistive). AMR element using the effect and giant magnetoresistance (hereinafter, GMR (Giant Magneto-resistive))
It is written. And GMR elements utilizing the effect. A reproducing head using an AMR element is an AMR head or simply an MR head.
A reproducing head using a GMR element is called a GM head.
Called the R head. The AMR head has an areal recording density of 1
The GMR head is used as a reproducing head exceeding ² gigabits / (inch) ^2, and has a surface recording density of 3 gigabits / inch.
(Inch) Used as a playback head exceeding ² .

As a method of improving the performance of the reproducing head, a method of changing the MR film from an AMR film to a material having excellent magnetoresistive sensitivity such as a GMR film, or a method of appropriately setting a pattern width of the MR film, particularly, an MR height. There are methods. The MR height refers to the length (height) from the end of the MR element on the air bearing surface side to the end on the opposite side, and is controlled by the amount of polishing when processing the air bearing surface. .
The air bearing surface referred to here is a surface of the thin-film magnetic head facing the magnetic recording medium, and is also called a track surface.

On the other hand, as the performance of the reproducing head is improved, the performance of the recording head is also required to be improved. Factors that determine the performance of the recording head include the pattern width, particularly the throat height (TH). The throat height refers to the length (height) from the end on the air bearing surface side to the end on the opposite side of the portion where the two pole layers face each other via the recording gap layer. In order to improve the performance of the recording head, it is desired to reduce the throat height. This throat height is also controlled by the amount of polishing when processing the air bearing surface.

In order to increase the recording density of the performance of the recording head, it is necessary to increase the track density in the magnetic recording medium. For this purpose, it is necessary to realize a recording head having a narrow track structure in which the width of the lower magnetic pole and the upper magnetic pole formed above and below the recording gap layer on the air bearing surface is reduced from several microns to submicron dimensions. Yes, semiconductor processing technology is used to achieve this.

As described above, in order to improve the performance of the thin-film magnetic head, it is important to form the recording head and the reproducing head in a well-balanced manner.

Here, referring to FIG. 16 to FIG.
As an example of a conventional method of manufacturing a thin film magnetic head, an example of a method of manufacturing a composite thin film magnetic head will be described. 16 to 21, (a) shows a cross section perpendicular to the air bearing surface, and (b) shows a cross section of the magnetic pole portion parallel to the air bearing surface.

In this manufacturing method, first, as shown in FIG.
So, for example, Altic (Al _TwoO_Three・ From TiC)
On a substrate 101 made of, for example, alumina (Al_TwoO_Three)
The insulating layer 102 having a thickness of about 5 to 10 μm.
Stack. Next, a magnetic material is formed on the insulating layer 102.
A lower shield layer 103 for a reproducing head is formed.

Next, as shown in FIG. 17, for example, alumina is coated on the lower shield layer 103 for 100 to 200 nm.
Then, a lower shield gap film 104 as an insulating layer is formed by sputtering to a thickness of m. Next, on the lower shield gap film 104, an MR film for forming an MR element 105 for reproduction is formed with a thickness of several tens nm. Next, a photoresist pattern is selectively formed on the MR film at a position where the MR element 105 is to be formed. At this time, a photoresist pattern having a shape such that the lift-off can be easily performed, for example, a T-shaped cross section is formed. Next, using the photoresist pattern as a mask, the MR film is etched by, for example, ion milling to form the MR element 105. The MR element 10
5 may be a GMR element or an AMR element. Next, a pair of electrode layers 106 electrically connected to the MR element 105 are formed on the lower shield gap film 104 using the same photoresist pattern as a mask.

Next, an upper shield gap film 107 as an insulating layer is formed on the lower shield gap film 104 and the MR element 105, and the MR element 105 is embedded in the shield gap films 104, 107.

Next, on the upper shield gap film 107, an upper shield layer and lower magnetic pole layer (hereinafter, referred to as a lower magnetic pole layer) 108 made of a magnetic material and used for both the read head and the write head is formed. It is formed to a thickness of about 3 μm. Next, a recording gap layer 109 made of an insulating film, for example, an alumina film is formed on the lower magnetic pole layer 108 to a thickness of 0.2 μm.

Next, as shown in FIG. 18, in order to form a magnetic path, the recording gap layer 109 is partially etched to form a contact hole 109a. Next, an upper magnetic pole tip 11 made of a magnetic material for a recording head, for example, permalloy (NiFe) or FeN of a high saturation magnetic flux density material is provided on the recording gap layer 109 in the magnetic pole portion.
0 is formed to a thickness of 0.5 to 1.0 μm. At this time, at the same time, contact holes 109 for forming magnetic paths are formed.
a, a magnetic layer 1 made of a magnetic material for forming a magnetic path
19 is formed.

Next, as shown in FIG. 19, ion milling is performed using the upper magnetic pole tip 110 as a mask.
The recording gap layer 109 and the lower magnetic pole layer 108 are etched. As shown in FIG. 19B, the structure in which the side walls of the upper magnetic pole portion (upper magnetic pole tip 110), the write gap layer 109, and a part of the lower magnetic pole layer 108 are formed in a self-aligned vertical manner is trimmed. (Trim) structure. According to this trim structure, it is possible to prevent the effective track width from increasing due to the spread of the magnetic flux generated when writing in a narrow track.

Next, an insulating layer 111 made of, for example, an alumina film is formed on the entire surface to a thickness of about 3 μm. Next, the insulating layer 111 is polished and flattened to reach the surfaces of the upper pole tip 110 and the magnetic layer 119. As a polishing method at this time, mechanical polishing or CMP (chemical mechanical polishing) is used. By this planarization, the surfaces of the upper pole tip 110 and the magnetic layer 119 are exposed.

Next, as shown in FIG. 20, a first-layer thin-film coil 112 for an inductive recording head made of, for example, copper (Cu) is formed on the flattened insulating layer 111. . Next, on the insulating layer 111 and the coil 112,
A photoresist layer 113 is formed in a predetermined pattern. Next, heat treatment is performed at a predetermined temperature to planarize the surface of the photoresist layer 113. Next, a second-layer thin-film coil 114 is formed on the photoresist layer 113. Next, the photoresist layer 113 and the coil 114
On top, a photoresist layer 115 is formed in a predetermined pattern. Next, heat treatment is performed at a predetermined temperature to planarize the surface of the photoresist layer 115.

Next, as shown in FIG. 21, an upper magnetic pole layer 116 made of a magnetic material for a recording head, for example, permalloy is formed on the upper magnetic pole tip 110, the photoresist layers 113 and 115, and the magnetic layer 119. I do. next,
On the upper magnetic pole layer 116, an overcoat layer 117 made of, for example, alumina is formed. Finally, the slider is machined to form the air bearing surfaces 118 of the recording head and the reproducing head, thereby completing the thin-film magnetic head. FIG. 22 is a plan view of the thin-film magnetic head. Note that, in this figure, the overcoat layer 117 is omitted.

In FIG. 21, TH indicates the throat height, and MR-H indicates the MR height. Also,
P2W represents the magnetic pole width, that is, the recording track width. As a factor that determines the performance of the thin-film magnetic head, there is an Apex Angle as indicated by θ in FIG. 21 in addition to the throat height and the MR height. The apex angle is a top surface of the insulating layer 111 and a straight line connecting a corner of a side surface on a magnetic pole side in a coil portion (hereinafter, referred to as an apex portion) which is covered with the photoresist layers 113 and 115 and is raised in a mountain shape. With the angle.

[0018]

In recent years, as the surface recording density of a hard disk drive used in a computer or the like has been improved, the frequency of recording / reproducing information in a thin-film magnetic head has been increasing. As the frequency of the recorded information increases, the eddy current loss in the magnetic layer forming the magnetic path of the inductive magnetic transducer increases. As a result, the strength of the recording magnetic field generated from the magnetic pole portions facing each other via the recording gap layer decreases, the delay of the recording magnetic field with respect to the recording current supplied to the coil increases, and the time gradient of the rise of the recording magnetic field decreases. And other problems occur. These problems are, for example, nonlinear transition shift (Non-line
ar Transition Shift (NLTS).

Conventional techniques for reducing eddy current loss in a magnetic layer and improving high-frequency characteristics of a thin-film magnetic head include, for example, JP-A-6-139521 and JP-A-6-139521.
Japanese Patent Application Publication No. 0-35315 discloses a technique in which a magnetic layer forming a magnetic path of an inductive magnetic transducer has a structure in which soft magnetic layers and insulating layers are alternately stacked.

However, in this technique, since the entire magnetic layer has the above-mentioned laminated structure, the magnetic flux passage area is narrowed, the passage of the magnetic flux is hindered, and the amount of the magnetic flux passing through the magnetic layer is reduced. There is a problem.

Japanese Patent Application Laid-Open No. 6-139521 discloses that a magnetic layer forming a magnetic path of an inductive magnetic transducer is formed by alternately forming a soft magnetic layer and an insulating layer along a direction perpendicular to a recording gap layer. The technology of the structure arranged in the above is also shown.

However, when the magnetic layer has such a structure, there is a problem that it is difficult to make the direction of magnetization (magnetostriction) of the magnetic layer constant, and it is difficult to efficiently pass magnetic flux.

The present invention has been made in view of the above problems, and an object of the present invention is to reduce eddy current loss in a magnetic layer forming a magnetic path of an inductive magnetic transducer without hindering passage of a magnetic flux. Another object of the present invention is to provide a thin-film magnetic head capable of improving high-frequency characteristics and a method of manufacturing the same.

[0024]

A first thin-film magnetic head according to the present invention includes magnetic pole portions that are magnetically coupled and that oppose each other via a recording gap layer on a part facing the recording medium. A first comprising at least one layer each
And a second magnetic layer, and a thin-film coil disposed between the first and second magnetic layers and insulated from the first and second magnetic layers. A thin-film magnetic head provided with a conversion element, comprising a first and a second
The magnetic layers each have a yoke portion arranged in a region including a region facing the thin-film coil and connected to a magnetic pole portion, and the yoke portion in at least one magnetic layer has a plurality of magnetic material layers, A resistance layer disposed between two adjacent magnetic material layers and having a higher electrical resistance than the magnetic material layer, wherein the resistance layer includes a yoke portion in the vicinity of a connection portion with the magnetic pole portion and other magnetic layers. It is arranged in a part of the region except for the vicinity of the connection portion with the layer.

According to the first method of manufacturing a thin film magnetic head of the present invention, at least a part of a side facing a recording medium includes magnetic pole parts facing each other with a recording gap layer interposed therebetween. A first and a second magnetic layer composed of one layer, and between the first and the second magnetic layer,
An inductive magnetic transducer having a thin-film coil disposed insulated from the first and second magnetic layers, wherein the first and second magnetic layers face the thin-film coil, respectively. A method of manufacturing a thin-film magnetic head having a yoke portion connected to a magnetic pole portion and arranged in a region including a region to be formed, comprising: forming a first magnetic layer;
Forming a gap layer on the magnetic layer, forming a second magnetic layer on the gap layer, and forming a thin film between the first magnetic layer and the second magnetic layer. A step of forming a coil, wherein at least one of the step of forming the first magnetic layer and the step of forming the second magnetic layer is performed between a plurality of magnetic material layers and two adjacent magnetic material layers. A yoke portion having a resistance layer having a higher electric resistance than the magnetic material layer, and forming the yoke portion near the connection portion with the magnetic pole portion and the connection portion with the other magnetic layer in the yoke portion. Are arranged in a part of the area excluding the vicinity of the area.

In the first thin-film magnetic head or the method of manufacturing the same according to the present invention, the yoke portion of at least one magnetic layer is formed so as to have a plurality of magnetic material layers and a resistance layer, and the resistance layer is The yoke is arranged in a part of the yoke except for the vicinity of the connection with the magnetic pole part and the vicinity of the connection with the other magnetic layer. Thus, the eddy current loss in the magnetic layer is reduced without hindering the passage of the magnetic flux.

In the first thin-film magnetic head or the method of manufacturing the same according to the present invention, the resistive layer is arranged, for example, in a plurality of divided regions.

In the first thin-film magnetic head or the method of manufacturing the same according to the present invention, the resistive layer is formed of, for example, an insulating material. In this case, the insulating material is made of, for example, an inorganic material. In the first method of manufacturing a thin-film magnetic head of the present invention, for example, the resistance layer is formed in a predetermined pattern by selectively etching a layer made of an inorganic material by reactive ion etching.

In the first thin-film magnetic head or the method of manufacturing the same according to the present invention, for example, the first magnetic layer includes a first portion disposed in a region including a region opposed to the thin-film coil, A second portion forming a magnetic pole portion, the second portion being connected to a surface of the first portion on the side of the thin film coil, and at least a portion of the thin film coil is disposed on a side of the second portion of the first magnetic layer. The yoke portion of the second magnetic layer has a plurality of magnetic material layers and a resistance layer.

Further, in the first thin film magnetic head or the method of manufacturing the same according to the present invention, the magnetoresistive element is further arranged so that a part of the side facing the recording medium faces the magnetoresistive element with the magnetoresistive element interposed therebetween. The first for shielding the magnetoresistive element
And a second shield layer. In this case, the second shield layer may also serve as the first magnetic layer.

A second thin-film magnetic head according to the present invention includes magnetic pole portions which are magnetically coupled and have a portion on the side facing the recording medium facing each other via a recording gap layer, and each of the at least one layer. And a thin-film coil disposed between the first and second magnetic layers and insulated from the first and second magnetic layers. A thin-film magnetic head provided with an inductive magnetic transducer, wherein the first and second magnetic layers are respectively disposed in a region including a region facing the thin-film coil and are connected to a magnetic pole portion. A yoke portion in at least one of the magnetic layers is disposed between the plurality of magnetic material layers and two adjacent magnetic material layers,
A resistance layer having a higher electric resistance than the magnetic material layer, wherein the resistance layer is disposed in a plurality of divided regions.

According to a second method of manufacturing a thin film magnetic head of the present invention, at least a portion of a side facing a recording medium includes magnetic pole portions facing each other with a recording gap layer interposed therebetween. A first and a second magnetic layer composed of one layer, and between the first and the second magnetic layer,
An inductive magnetic transducer having a thin-film coil disposed insulated from the first and second magnetic layers, wherein the first and second magnetic layers face the thin-film coil, respectively. A method of manufacturing a thin-film magnetic head having a yoke portion connected to a magnetic pole portion and arranged in a region including a region to be formed, comprising: forming a first magnetic layer;
Forming a gap layer on the magnetic layer, forming a second magnetic layer on the gap layer, and forming a thin film between the first magnetic layer and the second magnetic layer. A step of forming a coil, wherein at least one of the step of forming the first magnetic layer and the step of forming the second magnetic layer is performed between a plurality of magnetic material layers and two adjacent magnetic material layers. A yoke portion having a resistance layer having a higher electric resistance than the magnetic material layer is formed, and the resistance layer is disposed in a plurality of divided regions.

In the second thin-film magnetic head or the method of manufacturing the same according to the present invention, the yoke portion of at least one of the magnetic layers is formed so as to have a plurality of magnetic material layers and a resistance layer, and the resistance layer is It is arranged in a plurality of divided areas. Thus, the eddy current loss in the magnetic layer is reduced without hindering the passage of the magnetic flux.

In the second thin-film magnetic head or the method of manufacturing the same according to the present invention, the resistance layer is formed of, for example, an insulating material. In this case, the insulating material is made of, for example, an inorganic material. In the second method of manufacturing a thin-film magnetic head of the present invention, for example, the resistance layer is formed in a predetermined pattern by selectively etching a layer made of an inorganic material by reactive ion etching.

In the second thin-film magnetic head or the method of manufacturing the same according to the present invention, for example, the first magnetic layer includes a first portion disposed in a region including a region opposed to the thin-film coil, A second portion forming a magnetic pole portion, the second portion being connected to a surface of the first portion on the side of the thin film coil, and at least a portion of the thin film coil is disposed on a side of the second portion of the first magnetic layer. The yoke portion of the second magnetic layer has a plurality of magnetic material layers and a resistance layer.

Further, in the second thin film magnetic head or the method of manufacturing the same according to the present invention, the magnetoresistive element is further arranged so that a part of the side facing the recording medium faces the magnetoresistive element with the magnetoresistive element interposed therebetween. The first for shielding the magnetoresistive element
And a second shield layer. In this case, the second shield layer may also serve as the first magnetic layer.

[0037]

Embodiments of the present invention will be described below in detail with reference to the drawings. [First Embodiment] First, a thin-film magnetic head and a method of manufacturing the same according to a first embodiment of the present invention will be described with reference to FIGS. In FIGS. 1 to 7, (a) shows a cross section perpendicular to the air bearing surface, and (b) shows a cross section of the magnetic pole portion parallel to the air bearing surface.

In the method of manufacturing a thin film magnetic head according to the present embodiment, first, as shown in FIG. 1, for example, alumina (Al ₂ O ₃ .TiC) is formed on a substrate 1 made of AlTiC (Al ₂ O ₃ .TiC). _The insulating layer 2 made of ₂ O ₃ ) is about 5 μm
Is deposited with a thickness of Next, a magnetic material,
For example, a lower shield layer 3 made of permalloy for a reproducing head is formed to a thickness of about 3 μm. Lower shield layer 3
Is selectively formed on the insulating layer 2 by plating using a photoresist film as a mask, for example. next,
An insulating layer 20 made of, for example, alumina is formed on the whole to a thickness of, for example, 4 to 6 μm, and is polished by, for example, CMP (chemical mechanical polishing) until the lower shield layer 3 is exposed, thereby flattening the surface.

Next, as shown in FIG. 2, for example, alumina or aluminum nitride is sputter-deposited on the lower shield layer 3 to form a lower shield gap film 4 as an insulating layer. Next, an MR element 5 for reproduction is formed on the lower shield gap film 4 to a thickness of several tens nm. The MR element 5 is formed, for example, by selectively etching an MR film formed by sputtering. The MR element 5 includes an AMR element, a GMR element,
Alternatively, an element using a magneto-sensitive film exhibiting a magnetoresistance effect such as a TMR (tunnel magnetoresistance effect) element can be used. Next, a pair of electrode layers 6 electrically connected to the MR element 5 are formed on the lower shield gap film 4 to a thickness of several tens of nm. Next, an upper shield gap film 7 as an insulating layer is formed on the lower shield gap film 4 and the MR element 5, and the MR element 5 is embedded in the shield gap films 4 and 7.

Next, on the upper shield gap film 7,
The first portion 8a of an upper shield layer and a lower magnetic pole layer (hereinafter, referred to as a lower magnetic pole layer) made of a magnetic material and used for both a read head and a write head is about 1.0 to 2.0 μm.
It is selectively formed with a thickness of m. The first portion 8a of the lower magnetic pole layer is a portion arranged in a region of the lower magnetic pole layer including a region facing a thin-film coil described later.

Next, as shown in FIG. 3, the second portion 8b and the third portion 8c of the lower magnetic pole layer are formed on the first portion 8a of the lower magnetic pole layer by about 1.5-2. It is formed to a thickness of 0.5 μm. The second portion 8b forms a magnetic pole portion of the lower magnetic pole layer, and is connected to a surface of the first portion 8a on the thin film coil side. The third portion 8c is a portion for connecting the first portion 8a and an upper magnetic pole layer described later. In the present embodiment, the position of the end of the second portion 8b on the opposite side (right side in the drawing) to the air bearing surface is the throat height at the position of the end of the magnetic pole portion opposite to the air bearing surface. It becomes the zero position.

The second portion 8b and the third portion 8c of the lower pole layer are made of NiFe (Ni: 80% by weight, Fe: 20).
Wt%) or NiFe (N
i: 45% by weight, Fe: 55% by weight), and may be formed by plating, or may be formed by sputtering using a material such as FeN or FeZrN which is a high saturation magnetic flux density material. . In addition, a high saturation magnetic flux density material such as CoFe or a Co-based amorphous material may be used.

Next, as shown in FIG. 4, an insulating film 9 made of, for example, alumina is entirely formed to a thickness of about 0.3 to 0.6 μm.
Formed to a thickness of

Next, a thin-film coil 10 made of, for example, copper (Cu) is formed by frame plating, for example, to about 1.0 mm.
It is formed to a thickness of 2.0 μm. In the figure, reference numeral 10
“a” indicates a connection portion to which a conductive layer for connecting the thin-film coil 10 and an electrode pad described later is connected.

Next, as shown in FIG. 5, an insulating layer 11 made of, for example, alumina is formed to a thickness of about 3 to 4 μm on the whole. Next, the insulating layer 11 is polished by, for example, CMP until the second portion 8b and the third portion 8c of the lower pole layer are exposed, and the surface is flattened. Here, in FIG. 5, the thin film coil 10 is not exposed,
The thin-film coil 10 may be exposed. When the thin film coil 10 is exposed, the thin film coil 10
And another insulating layer is formed on the insulating layer 11.

Next, as shown in FIG. 6, a recording gap layer 12 made of an insulating material is formed on the exposed second and third portions 8b and 8c of the lower magnetic pole layer and the insulating layer 11.
For example, it is formed to a thickness of 0.2 to 0.3 μm. Generally, alumina, aluminum nitride, silicon oxide-based material, silicon nitride-based material, diamond-like carbon (D
LC).

Next, in order to form a magnetic path, in the portion above the third portion 8c of the lower magnetic pole layer, the recording gap layer 12 is formed.
Is partially etched to form a contact hole.

Next, the upper magnetic pole layer 13 is formed on the recording gap layer 12 in the following procedure. That is, first, a first magnetic material layer 13a made of a magnetic material is formed on the recording gap layer 12 in a predetermined pattern with a thickness of, for example, about 0.5 to 1.5 μm. Next, a first resistance layer 21 having an electric resistance higher than that of the first magnetic material layer 13a is formed on the first magnetic material layer 13a by, for example, several tens to several hundreds of nm.
To form a predetermined pattern. FIG. 8 shows the first magnetic material layer 13 a of the upper magnetic pole layer 13 and the first resistance layer 21.
FIG. Next, a second magnetic material layer 13b made of the same magnetic material as the first magnetic material layer 13a is formed on the first resistance layer 21 by, for example, about 0.5 to 1.5 μm.
To form a predetermined pattern. Next, a second resistance layer 22 having a higher electric resistance than the second magnetic material layer 13b is formed on the second magnetic material layer 13b to a thickness of, for example, several tens to several hundreds of nm. It is formed in the same pattern as the material layer 13a. FIG. 9 is a plan view showing the second magnetic material layer 13b of the upper magnetic pole layer 13 and the second resistance layer 22.
Next, the first magnetic material layer 13 is formed on the second resistance layer 22.
a third magnetic material layer 13c made of the same magnetic material as
For example, it is formed in a thickness of about 0.5 to 1.5 μm and in the same pattern as the first magnetic material layer 13a.

The magnetic material layers 13a to 13c are made of NiFe
(Ni: 80% by weight, Fe: 20% by weight), or NiFe (Ni: 45% by weight, Fe:
55% by weight), and may be formed by a plating method, or FeN, FeZr which is a high saturation magnetic flux density material.
It may be formed by sputtering using a material such as N.
In addition, CoFe and Co, which are high saturation magnetic flux density materials, may be used.
A system amorphous material or the like may be used.

The resistance layers 21 and 22 are made of, for example, alumina,
It is formed of an inorganic insulating material such as aluminum nitride, a silicon oxide-based material, a silicon nitride-based material, and diamond-like carbon (DLC). Also, the resistance layer 2
The layers 1 and 22 are formed in a predetermined pattern by, for example, forming a film made of the above-described inorganic insulating material by sputtering, and then selectively etching the film by, for example, reactive ion etching (RIE).

As described above, the upper magnetic pole layer 13 in the present embodiment has a plurality of stacked magnetic material layers 13a to 13a.
c and resistance layers 21 and 22 arranged between two adjacent magnetic material layers. This upper pole layer 1
The feature 3 will be described later in detail.

Next, using the upper pole layer 13 as a mask, the recording gap layer 12 is selectively etched by dry etching, and the second portion 8b of the lower pole layer is selectively etched by, for example, argon ion milling. About 0.
Etching is performed for about 3 to 0.6 μm to obtain a trim structure as shown in FIG. According to this trim structure,
It is possible to prevent an increase in the effective track width due to the spread of the magnetic flux generated when writing in a narrow track.

Next, as shown in FIG. 7, an overcoat layer 17 made of, for example, alumina
It is formed to a thickness of 0 μm, its surface is flattened, and an electrode pad (not shown) is formed thereon. Finally, the slider is polished to form the air bearing surfaces of the recording head and the reproducing head, thereby completing the thin-film magnetic head according to the present embodiment. FIG. 10 is a plan view of the thin-film magnetic head according to the present embodiment. In this figure, the overcoat layer 17 is omitted. In FIG. 10, reference numeral 8B denotes a portion where the second portion 8b of the lower magnetic pole layer is etched to obtain a trim structure.

In this embodiment, the first portion 8a and the second
The lower magnetic pole layer composed of the portion 8b and the third portion 8c corresponds to the first magnetic layer in the present invention, and the upper magnetic pole layer 13 composed of the magnetic material layers 13a to 13c and the resistance layers 21 and 22 corresponds to the present invention. Corresponds to the second magnetic layer.
Further, the lower shield layer 3 corresponds to the first shield layer in the present invention. Further, since the lower magnetic pole layer also serves as the upper shield layer, it also corresponds to the second shield layer in the present invention.

As described above, the thin-film magnetic head according to the present embodiment has a read head and a write head. The read head is arranged so that the MR element 5 and a part of the side facing the recording medium are opposed to each other with the MR element 5 interposed therebetween, and the lower shield layer 3 for shielding the MR element 5 is provided.
And an upper shield layer (lower pole layer).

The recording head includes magnetic pole portions that are magnetically coupled and that have a portion on the side facing the recording medium facing each other with the recording gap layer 12 interposed therebetween. An upper pole layer 13;
A thin-film coil 10 is provided between the lower magnetic pole layer and the upper magnetic pole layer 13 so as to be insulated therefrom. Each of the lower magnetic pole layer and the upper magnetic pole layer 13 has a yoke portion arranged in a region including a region facing the thin-film coil 10 and connected to the magnetic pole portion.

In the present embodiment, the lower magnetic pole layer includes a first portion 8a arranged in a region including a region facing the thin film coil 10, and a thin film coil 1 in the first portion 8a.
A second portion 8 connected to the 0-side surface to form a magnetic pole portion
b, and the thin-film coil 10 is disposed on the side of the second portion 8b of the lower magnetic pole layer.

Here, features of the upper magnetic pole layer 13 in the present embodiment will be described. As shown in FIGS. 7 to 9, the upper magnetic pole layer 13 has a magnetic pole portion 13A and a yoke portion 13B arranged in a region including a region facing the thin-film coil 10 and connected to the magnetic pole portion 13A. are doing. As shown in FIG. 7, the positions of the magnetic pole portion 13A, the yoke portion 13B, and the connecting portion are at the throat height zero position or a position near the throat height zero position. As shown in FIGS. 8 and 9, the magnetic pole portion 13A has a narrow and constant width. The width of the magnetic pole portion 13A defines the track width of the recording head. The yoke portion 13B is a magnetic pole portion 13A.
Has a certain width larger than the magnetic pole portion 13A, and a portion on the opposite side (right side in the drawing) of the air bearing surface from the portion 23 is away from the air bearing surface. As the width increases,
The shape has a certain width.

The upper magnetic pole layer 13 is composed of a plurality of stacked magnetic material layers 13a to 13c and resistance layers 21 and 22 disposed between two adjacent magnetic material layers. As shown in FIG. 8 and FIG.
2 is a part of the yoke portion 13B of the upper magnetic pole layer 13 excluding a portion 23 near a connection portion with the magnetic pole portion 13A and a portion 24 near another magnetic layer, ie, a portion near a connection portion with the lower magnetic pole layer. Located in the area.

The resistance layers 21 and 22 are respectively arranged in a plurality of divided areas. In the present embodiment, in particular, each of the resistance layers 21 and 22 is formed in a stripe shape. Further, in the present embodiment, as can be seen by comparing FIGS. 8 and 9, the respective portions of the resistance layer 21 and the respective portions of the resistance layer 22 are arranged so as to be substantially alternated. Note that each part of the resistance layer 21 and each part of the resistance layer 22 may be arranged at the same position when viewed from above.

FIGS. 6A and 7A show cross sections taken along line AA 'in FIGS. 8 and 9. FIG.

According to the present embodiment, the upper magnetic pole layer 13
Are connected to a plurality of stacked magnetic material layers 13a to 13c and a resistance layer 21 disposed between two adjacent magnetic material layers.
22, the eddy current loss in the upper pole layer 13 can be reduced.

Incidentally, the yoke portion 1 of the upper magnetic pole layer 13
3B, a portion 2 near the connection with the magnetic pole portion 13A.
3 and the portion 24 near the connection portion with the other magnetic layer, that is, the lower magnetic pole layer, originally has a smaller magnetic flux passage area than the other portion of the yoke portion 13B. Therefore, if a resistance layer exists in these portions 23 and 24, the passage of magnetic flux is prevented by the resistance layer. On the other hand, in the present embodiment, since the resistance layers 21 and 22 are arranged in a part of the yoke portion 13B of the upper magnetic pole layer 13 excluding the portions 23 and 24, the resistance layers 21 and 22 The eddy current loss in the upper pole layer 13 can be reduced without obstructing the passage.

When the resistance layer is formed over the entire upper magnetic pole layer, the magnetic flux passage area is narrowed, and the passage of the magnetic flux is hindered. In contrast, in the present embodiment,
Since the resistance layers 21 and 22 are arranged in a plurality of divided regions, the passage area of the magnetic flux becomes wider as compared with the case where the resistance layer is formed over the entire upper pole layer,
Eddy current loss in the upper pole layer 13 can be reduced without hindering the passage of magnetic flux.

As described above, according to the present embodiment, since the eddy current loss in the upper magnetic pole layer 13 can be reduced, the high-frequency characteristics of the thin-film magnetic head can be improved, and for example, the nonlinear transition shift can be reduced. It becomes possible.

According to the present embodiment, the thin-film coil 10 is disposed on the first portion 8a of the lower magnetic pole layer and beside the second portion 8b to cover the thin-film coil 10. Since the upper surface of the insulating layer 11 is flattened, the upper pole layer 13 can be formed on the flat surface. Therefore, according to the present embodiment, formation of upper magnetic pole layer 13 having a laminated structure is facilitated. Further, according to the present embodiment, the magnetic pole portion 13A of the upper magnetic pole layer 13 can be finely formed in, for example, a half-micron size or a quarter-micron size, and the track width of the recording head can be reduced.

In this embodiment, the magnetic pole portion 13A of the upper magnetic pole layer 13 that defines the track width of the recording head does not define the throat height, but the second portion 8b of the lower magnetic pole layer defines the throat height. Stipulate. Therefore, according to the present embodiment, it is possible to accurately and uniformly define the throat height even if the track width is reduced.

Further, according to the present embodiment, since the thin-film coil 10 can be formed on a flat surface, the thin-film coil 10 can be formed finely. Thus, the magnetic path length of the recording head can be reduced.

In this embodiment, as shown in FIG. 10, the upper magnetic pole layer 13 is located at the throat height zero position T.
The air bearing surface 30 is higher than the position at or near H0.
On the opposite side (right side in the figure), for example, 3 μm
m and a constant width of throat height zero position TH
The portion closer to the air bearing surface 30 than the position at or near zero has a certain width of half-micron size or quarter-micron size. Therefore, the upper magnetic pole layer 13
Does not saturate in the portion on the opposite side of the air bearing surface 30 from the throat height zero position TH0 or a position near the throat height zero position TH0, and the throat height zero position TH0
Alternatively, the saturation occurs at a portion closer to the air bearing surface 30 than at a position in the vicinity thereof. Thereby, the nonlinear transition shift and the overwrite characteristics can be improved.

FIG. 11 is a plan view showing another example of the pattern of the resistive layer of the upper magnetic pole layer. In this example, the resistance layer 21
A resistance layer 31 is provided instead of (FIG. 8). The resistance layer 31 is arranged not in a stripe shape but in a plurality of regions divided into island shapes. Further, in this example, instead of the resistance layer 22 (FIG. 9), a resistance layer having the same pattern as the resistance layer 31 may be provided, and the resistance layers 31 are arranged so as to be substantially alternated with each other. A resistance layer having a pattern having a plurality of portions may be provided.

FIG. 12 is a plan view showing still another example of the pattern of the resistance layer of the upper magnetic pole layer. In this example, a resistance layer 32 is provided instead of the resistance layer 21 (FIG. 8). The resistance layer 32 is not disposed in the plurality of divided regions, but is provided in the yoke portion 13B in the portion 23 near the connection portion with the magnetic pole portion 13A and the connection portion with another magnetic layer, that is, the lower magnetic pole layer. Are arranged over almost the entire area except for the part 24 near the. Further, in this example, instead of the resistance layer 22 (FIG. 9), a resistance layer having the same pattern as the resistance layer 32 may be provided, or a resistance layer having a different pattern from the resistance layer 32 may be provided.

In the example shown in FIG. 12, the effect when the resistance layer is arranged in a plurality of divided regions cannot be obtained.
The resistance layer is arranged in a part of the yoke portion 13B except for a portion 23 near a connection portion with the magnetic pole portion 13A and a portion 24 other than a portion 24 near a connection portion with another magnetic layer, that is, a lower magnetic pole layer. The effect of this is obtained.

[Second Embodiment] Next, a thin-film magnetic head and a method of manufacturing the same according to a second embodiment of the present invention will be described with reference to FIGS. 13A shows a cross section perpendicular to the air bearing surface, and FIG. 13B shows a cross section of the magnetic pole portion parallel to the air bearing surface. FIG. 14 is a plan view of the thin-film magnetic head according to the present embodiment. In this figure, the overcoat layer is omitted.

The thin-film magnetic head according to the present embodiment
This is an example in which a thin-film coil of layers is provided. In the present embodiment, reference numeral 10 represents a first layer portion of the thin-film coil. In the method of manufacturing the thin-film magnetic head according to the present embodiment, the steps up to the step of forming the recording gap layer 12 are the same as those of the first embodiment. In the present embodiment, next, on the recording gap layer 12, the pole portion layer 41 forming the pole portion of the upper pole layer is formed to a thickness of 1.0 to 3.0 μm, and the first pole layer of the lower pole layer is formed. In the position of the contact hole formed on the portion 8c of No. 3, the magnetic layer 42 is 1.0 to 3.0 .mu.m.
m. The magnetic layer 42 is a portion for connecting a yoke portion layer of the upper magnetic pole layer and a lower magnetic pole layer described later. The magnetic layer 42 is larger than the third portion 8c of the lower magnetic pole layer. In the present embodiment, the length of the pole portion layer 41 of the upper pole layer is formed to be longer than the length of the second portion 8b of the lower pole layer.

The magnetic pole portion layer 41 and the magnetic layer 42 of the upper magnetic pole layer are made of NiFe (Ni: 80% by weight, Fe: 20% by weight) or NiFe (Ni: 4
(5% by weight, Fe: 55% by weight) and may be formed by plating, or may be formed by sputtering using a material such as FeN or FeZrN which is a high saturation magnetic flux density material. In addition, a high saturation magnetic flux density material such as CoFe or a Co-based amorphous material may be used.

Next, the write gap layer 1 is formed by dry etching using the pole portion layer 41 of the upper pole layer as a mask.
2 is selectively etched. At this time, for example, a chlorine-based gas such as BCl ₂ or Cl ₂ ,
Reactive ion etching (RIE) using a gas such as a fluorine-based gas such as CF ₄ or SF ₆ is used. Next, the second of the lower magnetic pole layer is formed by, for example, argon ion milling.
Is selectively etched by about 0.3 to 0.6 μm to obtain a trim structure as shown in FIG.

Next, an insulating film 14 made of, for example, alumina is formed in a coil forming region on the recording gap layer 12 to a thickness of about 0.3 to 0.6 μm.

Next, the second layer portion 15 of the thin film coil made of, for example, copper (Cu) is formed to a thickness of, for example, about 1.0 to 2.0 μm by frame plating. In the drawing, reference numeral 15a indicates a connection portion connected to the connection portion 10a of the first layer portion 10 of the thin-film coil.

Next, an insulating layer 16 made of, for example, alumina is formed to a thickness of about 3 to 4 μm. Next, the insulating layer 16 is polished by, for example, CMP until the magnetic pole portion layer 41 and the magnetic layer 42 of the upper magnetic pole layer are exposed,
The surface is flattened.

Next, a yoke portion layer 43 forming a yoke portion of the upper pole layer is formed on the flattened pole portion layer 41 of the upper pole layer, the magnetic layer 42 and the insulating layer 16. The yoke portion layer 43 includes a plurality of stacked magnetic material layers 43a to 43c, and resistance layers 21 and 22 disposed between two adjacent magnetic material layers. The method for forming the yoke partial layer 43 is the same as the method for forming the upper magnetic pole layer 13 in the first embodiment. Also, the patterns of the resistance layers 21 and 22 are the same as in the first embodiment.

In the present embodiment, the end surface of the yoke portion layer 43 of the upper pole layer facing the recording medium (air bearing surface side) is located away from the surface of the thin film magnetic head facing the recording medium (see FIG. At the right).

Next, an overcoat layer 17 made of, for example, alumina is formed to a thickness of 20 to 40 μm, the surface thereof is flattened, and an electrode pad (not shown) is formed thereon. Finally, the slider is polished to form the air bearing surfaces of the recording head and the reproducing head, thereby completing the thin-film magnetic head according to the present embodiment.

In the present embodiment, the upper magnetic pole layer including the magnetic pole portion layer 41, the magnetic layer 42, and the yoke portion layer 43
This corresponds to the second magnetic layer in the present invention.

According to the present embodiment, the magnetic pole partial layer 41 of the upper magnetic pole layer can be formed on a flat surface, so that the magnetic pole partial layer 41 can be formed into a half-micron or quarter-micron size. And the track width of the recording head can be reduced.

Further, according to the present embodiment, since the second layer portion 15 of the thin-film coil is disposed on the side of the pole portion layer 41 of the upper pole layer, the yoke portion layer 43 of the upper pole layer is
It can be formed on a flat surface. Therefore, according to the present embodiment, the yoke partial layer 43 having a laminated structure
Is easy to form. Further, according to the present embodiment, the yoke portion layer 43 can be formed finely, and so-called side light can be prevented from being generated.

In the present embodiment, the end surface of the yoke portion layer 43 of the upper magnetic pole layer on the air bearing surface side is arranged at a position away from the air bearing surface of the thin film magnetic head. Therefore, even when the throat height is small, the yoke portion layer 43 of the upper magnetic pole layer is not exposed on the air bearing surface, and as a result, the occurrence of so-called side light can be prevented.

The other structures, operations and effects of the present embodiment are the same as those of the first embodiment.

[Third Embodiment] Next, a thin-film magnetic head and a method of manufacturing the same according to a third embodiment of the present invention will be described with reference to FIG. FIG. 15 is a plan view of the thin-film magnetic head according to the present embodiment. In this figure, the overcoat layer is omitted.

In the thin-film magnetic head according to the present embodiment, the second portion 8b of the lower magnetic pole layer is formed so as to surround the first layer portion 10 of the thin-film coil. By forming the second portion 8b of the lower magnetic pole layer in such a shape, the flattening process of the insulating layer 11 is facilitated.

The other configurations, operations and effects of the present embodiment are the same as those of the second embodiment. In addition,
Second portion 8b of lower magnetic pole layer according to first embodiment
May be formed in a shape as in the present embodiment.

The present invention is not limited to the above embodiments, and various changes can be made. For example, in each of the above embodiments, only the yoke portion of the upper magnetic pole layer has a structure in which the resistance layer is disposed between the plurality of magnetic material layers, but the yoke portion of the lower magnetic pole layer may have the same structure.

In each of the above embodiments, the throat height is defined by the lower magnetic pole layer. However, the throat height may be defined by the upper magnetic pole layer.

In each of the above embodiments, a thin film magnetic head having a structure in which an MR element for reading is formed on the substrate side and an inductive magnetic transducer for writing is stacked thereon has been described. The stacking order may be reversed.

That is, an inductive magnetic transducer for writing may be formed on the substrate side, and an MR element for reading may be formed thereon. In such a structure, for example, the magnetic film having the function of the upper magnetic pole layer shown in the above-described embodiment is formed on the substrate side as a lower magnetic pole layer, and the magnetic film having the above-described structure is opposed to the magnetic pole layer via a recording gap film. It can be realized by forming the magnetic film having the function of the lower magnetic pole layer shown in the embodiment as the upper magnetic pole layer. In this case, it is preferable to use the upper magnetic pole layer of the induction type magnetic transducer and the lower shield layer of the MR element together.

[0095]

As described above, according to the method of manufacturing a thin film magnetic head according to any one of claims 1 to 7 or the method of manufacturing a thin film magnetic head according to any one of claims 14 to 21, The yoke portion in the layer is formed so as to have a plurality of magnetic material layers and a resistance layer, and the resistance layer is formed in the yoke portion in the vicinity of the connection portion with the magnetic pole portion and the connection portion with the other magnetic layer. Since it is arranged in a part of the area except the vicinity, it is possible to reduce the eddy current loss in the magnetic layer forming the magnetic path of the inductive magnetic transducer without improving the passage of the magnetic flux, and to improve the high frequency characteristics. It has the effect of being able to.

Further, according to the method of manufacturing a thin film magnetic head according to the second aspect or the thin film magnetic head according to the fifteenth aspect, since the resistive layer is arranged in a plurality of divided regions, it is possible to further prevent the passage of magnetic flux. There is an effect that the area is widened and eddy current loss in the magnetic layer can be further reduced.

According to the method of manufacturing a thin-film magnetic head according to the fifth aspect or the thin-film magnetic head according to the nineteenth aspect, the first magnetic layer is disposed in a region including a region facing the thin-film coil. 1 and a second portion which is connected to the surface of the first portion on the side of the thin film coil and forms a magnetic pole portion. At least a part of the thin film coil is a second portion of the first magnetic layer And the yoke portion of the second magnetic layer has a plurality of magnetic material layers and a resistance layer, so that the yoke portion of the second magnetic layer having a laminated structure further has There is an effect that the formation is facilitated.

According to the method of manufacturing a thin-film magnetic head according to any one of claims 8 to 13 or the method of manufacturing a thin-film magnetic head according to any one of claims 22 to 28, the yoke portion of at least one of the magnetic layers can be formed. Since the magnetic layer is formed to have a plurality of magnetic material layers and a resistance layer, and the resistance layer is arranged in a plurality of divided regions, the magnetic path of the inductive magnetic conversion element can be formed without obstructing the passage of magnetic flux. This has the effect of reducing eddy current loss in the magnetic layer to be formed and improving high frequency characteristics.

According to the method of manufacturing a thin-film magnetic head of the present invention, the first magnetic layer is disposed in a region including a region opposed to the thin-film coil. 1 and a second portion which is connected to the surface of the first portion on the side of the thin film coil and forms a magnetic pole portion. At least a part of the thin film coil is a second portion of the first magnetic layer And the yoke portion of the second magnetic layer has a plurality of magnetic material layers and a resistance layer, so that the yoke portion of the second magnetic layer having a laminated structure further has There is an effect that the formation is facilitated.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view for explaining one step in a method of manufacturing a thin-film magnetic head according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view for explaining a step following the step shown in FIG.

FIG. 3 is a cross-sectional view for explaining a step following the step shown in FIG. 2;

FIG. 4 is a cross-sectional view for explaining a step following the step shown in FIG. 3;

FIG. 5 is a cross-sectional view for explaining a step following the step shown in FIG. 4;

FIG. 6 is a cross-sectional view for explaining a step following the step shown in FIG. 5;

FIG. 7 is a cross-sectional view for explaining a step following the step shown in FIG. 6;

FIG. 8 is a plan view showing a first magnetic material layer and a first resistance layer of the upper magnetic pole layer in the thin-film magnetic head according to the first embodiment of the present invention.

FIG. 9 is a plan view showing a second magnetic material layer and a second resistance layer of the upper magnetic pole layer in the thin-film magnetic head according to the first embodiment of the present invention.

FIG. 10 is a plan view of the thin-film magnetic head according to the first embodiment of the present invention.

FIG. 11 is a plan view showing another example of the pattern of the resistive layer of the upper pole layer in the thin-film magnetic head according to the first embodiment of the present invention.

FIG. 12 is a plan view showing still another example of the pattern of the resistive layer of the upper pole layer in the thin-film magnetic head according to the first embodiment of the present invention.

FIG. 13 is a sectional view of a thin-film magnetic head according to a second embodiment of the present invention.

FIG. 14 is a plan view of a thin-film magnetic head according to a second embodiment of the present invention.

FIG. 15 is a plan view of a thin-film magnetic head according to a third embodiment of the present invention.

FIG. 16 is a cross-sectional view for explaining one step in a conventional method of manufacturing a thin-film magnetic head.

FIG. 17 is a sectional view for illustrating a step following the step shown in FIG. 16;

FIG. 18 is a sectional view for illustrating a step following the step shown in FIG. 17;

FIG. 19 is a sectional view for illustrating a step following the step shown in FIG. 18;

FIG. 20 is a cross-sectional view for explaining a step following the step shown in FIG. 19;

FIG. 21 is a cross-sectional view for explaining a step following the step shown in FIG. 20.

FIG. 22 is a plan view of a conventional thin-film magnetic head.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Substrate, 2 ... Insulating layer, 3 ... Lower shield layer, 5 ... MR
Element, 8a: first portion of lower magnetic pole layer, 8b: second portion of lower magnetic pole layer, 9: insulating film, 10: thin film coil, 11
... an insulating layer, 12 ... a recording gap layer, 13 ... an upper magnetic pole layer,
13a to 13c: magnetic material layers, 21, 22: resistance layers, 1
7 ... overcoat layer.

Claims (28)

[Claims] 1. A first and a second magnetic layer, each of which is magnetically coupled and has a magnetic pole part on a side facing a recording medium and a magnetic pole part facing each other via a recording gap layer, each of which comprises at least one layer. An inductive magnetic transducer having a layer and a thin-film coil disposed between the first and second magnetic layers while being insulated from the first and second magnetic layers. A thin-film magnetic head, wherein each of the first and second magnetic layers has a yoke portion arranged in a region including a region facing the thin-film coil and connected to the magnetic pole portion; The yoke portion in the magnetic layer includes a plurality of magnetic material layers and a resistance layer disposed between two adjacent magnetic material layers and having a higher electric resistance than the magnetic material layer. , The yoke part Wherein the thin film magnetic head is arranged in a part of the region except for the vicinity of the connection with the magnetic pole portion and the vicinity of the connection with another magnetic layer. 2. The thin-film magnetic head according to claim 1, wherein said resistance layer is arranged in a plurality of divided regions. 3. The thin-film magnetic head according to claim 1, wherein the resistance layer is formed of an insulating material. 4. The thin film magnetic head according to claim 3, wherein said insulating material is made of an inorganic material. 5. The first magnetic layer is connected to a first portion disposed in a region including a region facing the thin-film coil, and connected to a surface of the first portion on the thin-film coil side. A second portion forming a portion, wherein at least a part of the thin-film coil is arranged on a side of a second portion of the first magnetic layer, and a yoke portion of the second magnetic layer is 5. The thin-film magnetic head according to claim 1, comprising the plurality of magnetic material layers and the resistance layer. 6. A first and a second element for shielding the magnetoresistive element, the magnetoresistive element being disposed so that a part of the side facing the recording medium is opposed to the recording medium with the magnetoresistive element interposed therebetween. 6. The thin-film magnetic head according to claim 1, further comprising: a shield layer. 7. The thin-film magnetic head according to claim 6, wherein the second shield layer also serves as the first magnetic layer. 8. A first and a second magnetic layer, each of which is magnetically coupled and includes a magnetic pole part whose part opposing a recording medium opposes each other via a recording gap layer, and each of which includes at least one layer. An inductive magnetic transducer having a layer and a thin-film coil disposed between the first and second magnetic layers while being insulated from the first and second magnetic layers. A thin-film magnetic head, wherein each of the first and second magnetic layers has a yoke portion arranged in a region including a region facing the thin-film coil and connected to the magnetic pole portion; The yoke portion in the magnetic layer includes a plurality of magnetic material layers and a resistance layer disposed between two adjacent magnetic material layers and having a higher electric resistance than the magnetic material layer. , Split multiple A thin-film magnetic head, wherein the thin-film magnetic head is disposed in a region defined by: 9. The thin-film magnetic head according to claim 8, wherein the resistance layer is formed of an insulating material. 10. The thin-film magnetic head according to claim 9, wherein said insulating material is made of an inorganic material. 11. The first magnetic layer includes: a first portion disposed in a region including a region facing the thin-film coil;
A second portion forming a magnetic pole portion, the second portion being connected to a surface of the first portion on the thin film coil side, wherein at least a portion of the thin film coil is a second portion of the first magnetic layer 11. The thin-film magnetic head according to claim 8, wherein the yoke portion of the second magnetic layer has the plurality of magnetic material layers and the resistance layer. 12. . 12. A first and a second element for shielding the magnetoresistive element, the magnetoresistive element being disposed so that a part of the side facing the recording medium faces the recording medium with the magnetoresistive element interposed therebetween. 12. The thin-film magnetic head according to claim 8, further comprising: a shield layer. 13. The thin-film magnetic head according to claim 12, wherein said second shield layer also serves as said first magnetic layer. 14. A first and a second magnetic layer, each of which is magnetically coupled and includes a magnetic pole part whose part facing the recording medium opposes each other with a recording gap layer interposed therebetween, and each of which comprises at least one layer. An inductive magnetic transducer having a layer and a thin-film coil disposed between the first and second magnetic layers while being insulated from the first and second magnetic layers; The method of manufacturing a thin-film magnetic head, wherein the first and second magnetic layers are respectively disposed in a region including a region facing the thin-film coil and have a yoke portion connected to the magnetic pole portion. Forming a first magnetic layer; forming the gap layer on the first magnetic layer; forming the second magnetic layer on the gap layer; Magnetic layer and the second magnetic layer Forming the thin-film coil so as to be disposed therebetween. At least one of the step of forming the first magnetic layer and the step of forming the second magnetic layer includes a plurality of magnetic material layers. And a resistance layer disposed between two adjacent magnetic material layers and having a higher electrical resistance than the magnetic material layer, and the resistance layer is formed of the magnetic pole of the yoke portion. A method for manufacturing a thin-film magnetic head, comprising: arranging in a partial area excluding the vicinity of a connection portion with a portion and the vicinity of a connection portion with another magnetic layer. 15. The method according to claim 15, wherein at least one of the step of forming the first magnetic layer and the step of forming the second magnetic layer arranges the resistance layer in a plurality of divided regions. A method for manufacturing a thin-film magnetic head according to claim 14. 16. The method according to claim 14, wherein the resistance layer is formed of an insulating material. 17. The method according to claim 16, wherein the insulating material is made of an inorganic material. 18. The thin-film magnetic head according to claim 17, wherein the resistance layer is formed in a predetermined pattern by selectively etching the layer made of the inorganic material by reactive ion etching. Production method. 19. The step of forming the first magnetic layer,
A first portion having a first portion disposed in a region including a region facing the thin-film coil, and a second portion connected to a surface of the first portion on the thin-film coil side to form a magnetic pole portion; Forming the magnetic layer, and forming the thin-film coil, wherein at least a part of the thin-film coil is formed so as to be arranged on a side of a second portion of the first magnetic layer; 19. The step of forming the second magnetic layer, wherein the yoke portion of the second magnetic layer is formed to have the plurality of magnetic material layers and the resistance layer. Or a method for manufacturing a thin-film magnetic head. 20. Further, a first and a second part for shielding the magnetoresistive element are disposed so that the magnetoresistive element and a part of the side facing the recording medium face each other with the magnetoresistive element interposed therebetween. 20. The method of manufacturing a thin-film magnetic head according to claim 14, further comprising the step of forming a shield layer. 21. The method according to claim 20, wherein the second shield layer also serves as the first magnetic layer. 22. First and second magnetic layers which are magnetically coupled to each other and have a magnetic pole part facing a recording medium via a recording gap layer, and each of which has at least one layer. An inductive magnetic transducer having a layer and a thin-film coil disposed between the first and second magnetic layers while being insulated from the first and second magnetic layers; The method of manufacturing a thin-film magnetic head, wherein the first and second magnetic layers are respectively disposed in a region including a region facing the thin-film coil and have a yoke portion connected to the magnetic pole portion. Forming a first magnetic layer; forming the gap layer on the first magnetic layer; forming the second magnetic layer on the gap layer; Magnetic layer and the second magnetic layer Forming the thin-film coil so as to be disposed therebetween. At least one of the step of forming the first magnetic layer and the step of forming the second magnetic layer includes a plurality of magnetic material layers. And a yoke portion having a resistance layer disposed between two adjacent magnetic material layers and having a higher electric resistance than the magnetic material layer, and the resistance layer is disposed in a plurality of divided regions. A method of manufacturing a thin-film magnetic head. 23. The method according to claim 22, wherein the resistance layer is formed of an insulating material. 24. The method according to claim 23, wherein the insulating material is made of an inorganic material. 25. The thin-film magnetic head according to claim 24, wherein the resistance layer is formed in a predetermined pattern by selectively etching the layer made of the inorganic material by reactive ion etching. Production method. 26. The step of forming the first magnetic layer,
A first portion having a first portion disposed in a region including a region facing the thin-film coil, and a second portion connected to a surface of the first portion on the thin-film coil side to form a magnetic pole portion; Forming the magnetic layer, and forming the thin-film coil, wherein at least a part of the thin-film coil is formed so as to be arranged on a side of a second portion of the first magnetic layer; 26. The method according to claim 22, wherein the step of forming the second magnetic layer includes forming a yoke portion of the second magnetic layer so as to include the plurality of magnetic material layers and the resistance layer. Or a method for manufacturing a thin-film magnetic head. 27. A magnetoresistive element, wherein a part on a side facing a recording medium is disposed so as to oppose the magnetoresistive element with the magnetoresistive element interposed therebetween, and first and second shields for shielding the magnetoresistive element. 27. The method of manufacturing a thin-film magnetic head according to claim 22, further comprising the step of forming a shield layer. 28. The method according to claim 27, wherein the second shield layer also serves as the first magnetic layer.