JP3830070B2 - Thin film magnetic head and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a thin film magnetic head having at least an inductive magnetic transducer and a method for manufacturing the same.
[0002]
[Prior art]
In recent years, with the improvement in the surface recording density of hard disk devices, there has been a demand for improved performance of thin film magnetic heads. As a thin film magnetic head, a composite thin film having a structure in which a recording head having an inductive magnetic transducer for writing and a reproducing head having a magnetoresistive (MR) element for reading are laminated. Magnetic heads are widely used. As the MR element, an AMR element using an anisotropic magnetoresistance (hereinafter referred to as AMR (Anisotropic Magneto Resistive)) effect and a giant magnetoresistance (hereinafter referred to as GMR (Giant Magneto Resistive)) effect are used. GMR element. A reproducing head using an AMR element is called an AMR head or simply an MR head, and a reproducing head using a GMR element is called a GMR head. The AMR head is used as a reproducing head having a surface recording density exceeding 1 gigabit / (inch) ² , and the GMR head is used as a reproducing head having a surface recording density exceeding 3 gigabit / (inch) ² .
[0003]
As a method for improving the performance of the reproducing head, there are a method of changing the MR film from an AMR film to a material having excellent magnetoresistance sensitivity such as a GMR film, and a method of optimizing the MR film pattern width, in particular, MR height. is there. This MR height refers to the length (height) from the end of the MR element on the air bearing surface side to the opposite end, and is controlled by the amount of polishing when processing the air bearing surface. . The air bearing surface referred to here is a surface of the thin film magnetic head that faces the magnetic recording medium, and is also called a track surface.
[0004]
On the other hand, with an improvement in the performance of the reproducing head, an improvement in the performance of the recording head is also required. Factors that determine the performance of the recording head include the pattern width, in particular, the throat height (TH). The throat height refers to the length (height) from the end on the air bearing surface side to the end on the opposite side of the portion where the two pole layers face each other with the recording gap layer interposed therebetween. In order to improve the performance of the recording head, it is desired to reduce the throat height. This throat height is also controlled by the polishing amount when the air bearing surface is processed.
[0005]
Of the performance of the recording head, in order to increase the recording density, it is necessary to increase the track density in the magnetic recording medium. For this purpose, it is necessary to realize a recording head having a narrow track structure in which the width of the lower and upper magnetic poles formed above and below the recording gap layer on the air bearing surface is reduced from several microns to sub-micron dimensions. In order to achieve this, semiconductor processing technology is used.
[0006]
Here, with reference to FIGS. 11 to 16, an example of a method of manufacturing a composite thin film magnetic head will be described as an example of a method of manufacturing a conventional thin film magnetic head. 11 to 16, (a) shows a cross section perpendicular to the air bearing surface, and (b) shows a cross section parallel to the air bearing surface of the magnetic pole portion.
[0007]
In this manufacturing method, first, as shown in FIG. 11, an insulating layer 102 made of alumina (Al ₂ O ₃ ), for example, is formed on a substrate 101 made of Altic (Al ₂ O ₃ · TiC), for example. It is deposited with a thickness of about 5 to 10 μm. Next, a lower shield layer 103 for a reproducing head made of a magnetic material is formed on the insulating layer 102.
[0008]
Next, as shown in FIG. 12, on the lower shield layer 103, for example, alumina is sputter deposited to a thickness of 100 to 200 nm to form a lower shield gap film 104 as an insulating layer. Next, an MR film for forming the reproducing MR element 105 is formed on the lower shield gap film 104 to a thickness of several tens of nm. Next, a photoresist pattern is selectively formed on the MR film at a position where the MR element 105 is to be formed. At this time, a photoresist pattern having a shape that can be easily lifted off, for example, a T-shaped cross section is formed. Next, using the photoresist pattern as a mask, the MR film is etched by, for example, ion milling to form the MR element 105. The MR element 105 may be a GMR element or an AMR element. Next, a pair of electrode layers 106 electrically connected to the MR element 105 is formed on the lower shield gap film 104 using the same photoresist pattern as a mask.
[0009]
Next, an upper shield gap film 107 as an insulating layer is formed on the lower shield gap film 104 and the MR element 105, and the MR element 105 is embedded in the shield gap films 104 and 107.
[0010]
Next, an upper shield layer / lower magnetic pole layer (hereinafter referred to as a lower magnetic pole layer) 108 made of a magnetic material and used for both the reproducing head and the recording head is formed on the upper shield gap film 107 with a thickness of about 3 μm. Form to thickness. Next, a recording gap layer 109 made of an insulating film such as an alumina film is formed on the lower magnetic pole layer 108 to a thickness of 0.3 μm.
[0011]
Next, as shown in FIG. 13, in order to form a magnetic path, the recording gap layer 109 is partially etched to form a contact hole 109a. Next, on the recording gap layer 109 in the magnetic pole portion, an upper magnetic pole chip 110 made of a magnetic material for a recording head, for example, a high saturation magnetic flux density material permalloy (NiFe) or FeN, is 0.5 to 1.0 μm. Form to thickness. The top pole tip 110 forms part of the top pole. At the same time, a magnetic layer 119 made of a magnetic material for forming a magnetic path is formed on the contact hole for forming the magnetic path.
[0012]
Next, as shown in FIG. 14, the recording gap layer 109 and the lower magnetic pole layer 108 are etched by ion milling using the upper magnetic pole chip 110 as a mask. As shown in FIG. 14B, the structure in which the side walls of a part of the upper magnetic pole (upper magnetic pole chip 110), the recording gap layer 109, and a part of the lower magnetic pole layer 108 are formed in a self-aligned manner is a trim ( Trim) structure. According to this trim structure, it is possible to prevent an increase in effective track width due to the spread of magnetic flux generated when writing a narrow track.
[0013]
Next, an insulating layer 111 made of, for example, an alumina film is formed on the entire surface to a thickness of about 3 μm. Next, the insulating layer 111 is polished and flattened to reach the surfaces of the top pole tip 110 and the magnetic layer 119. As a polishing method at this time, mechanical polishing or CMP (chemical mechanical polishing) is used. By this planarization, the surfaces of the top pole tip 110 and the magnetic layer 119 are exposed.
[0014]
Next, as shown in FIG. 15, a first-layer thin film coil 112 for an inductive recording head made of, for example, copper (Cu) is formed on the planarized insulating layer 111. Next, a photoresist layer 113 is formed in a predetermined pattern on the insulating layer 111 and the coil 112. Next, heat treatment is performed at a predetermined temperature in order to flatten the surface of the photoresist layer 113. Next, a second thin film coil 114 is formed on the photoresist layer 113. Next, a photoresist layer 115 is formed in a predetermined pattern on the photoresist layer 113 and the coil 114. Next, heat treatment is performed at a predetermined temperature in order to flatten the surface of the photoresist layer 115.
[0015]
Next, as shown in FIG. 16, an upper magnetic pole layer 116 made of a magnetic material for a recording head, for example, permalloy, is formed on the upper magnetic pole chip 110, the photoresist layers 113 and 115, and the magnetic layer 119. Next, an overcoat layer 117 made of alumina, for example, is formed on the top pole layer 116. Finally, the slider is machined to form the air bearing surface 118 of the recording head and the reproducing head, thereby completing the thin film magnetic head.
[0016]
In FIG. 16, TH represents the throat height, and MR-H represents the MR height. P2W represents the magnetic pole width, that is, the recording track width. In addition to the throat height and MR height, there are apex angles as shown by θ in FIG. 16 as factors that determine the performance of the thin film magnetic head. This apex angle is a straight line that connects a corner of the side surface on the magnetic pole side in a coil portion (hereinafter referred to as an apex portion) that is covered with the photoresist layers 113 and 115 and is raised in a mountain shape, and the upper surface of the insulating layer 110. The angle between
[0017]
[Problems to be solved by the invention]
In order to improve the performance of the thin film magnetic head, it is important to accurately form the throat height TH, MR height MR-H, apex angle θ, and track width P2W as shown in FIG.
[0018]
Particularly in recent years, in order to enable high surface density recording, that is, to form a recording head having a narrow track structure, the track width P2W is required to have a submicron dimension of 1.0 μm or less. For this purpose, a technique for processing the upper magnetic pole to a submicron dimension using a semiconductor processing technique is required. In addition, with the narrow track structure, it is desired to use a magnetic material having a higher saturation magnetic flux density for the magnetic pole.
[0019]
Here, the problem is that it is difficult to finely form the upper magnetic pole layer formed on the apex portion.
[0020]
By the way, as a method of forming the upper magnetic pole layer, for example, a frame plating method is used as disclosed in JP-A-7-262519. When the upper magnetic pole layer is formed by using the frame plating method, first, a thin electrode film made of, for example, permalloy is formed on the apex portion entirely by, for example, sputtering. Next, a photoresist is applied thereon and patterned by a photolithography process to form a frame (outer frame) for plating. Then, the upper magnetic pole layer is formed by a plating method using the previously formed electrode film as a seed layer.
[0021]
However, the apex portion and other portions have a height difference of, for example, 7 to 10 μm or more. On this apex part, a photoresist is apply | coated with the thickness of 3-4 micrometers. If the photoresist film thickness on the apex portion is required to be at least 3 μm, the flowable photoresist collects on the lower side. Therefore, below the apex portion, for example, a photo resist having a thickness of 8 to 10 μm or more. A resist film is formed.
[0022]
As described above, in order to realize a recording track width of a submicron dimension, it is necessary to form a frame pattern having a width of a submicron dimension by a photoresist film. Therefore, a fine pattern with a submicron dimension must be formed on the apex portion by a photoresist film having a thickness of 8 to 10 μm or more. However, it has been extremely difficult in the manufacturing process to form such a thick photoresist pattern with a narrow pattern width.
[0023]
Moreover, at the time of photolithography exposure, the exposure light is reflected by the base electrode film as the seed layer, and this reflected light also sensitizes the photoresist, resulting in a photoresist pattern breakage and the like, which is sharp and accurate. A photoresist pattern cannot be obtained.
[0024]
As described above, conventionally, when the magnetic pole width is submicron, it is difficult to accurately form the upper magnetic layer.
[0025]
For this reason, a track width of 1.0 μm or less is formed by the upper magnetic pole chip 110 effective for forming a narrow track of the recording head, as shown in the steps of FIGS. 13 to 16 of the conventional example. Thereafter, a method of forming the upper magnetic pole layer 116 serving as a yoke portion connected to the upper magnetic pole chip 110 is also employed (see Japanese Patent Application Laid-Open Nos. 62-245509 and 60-10409). In this way, the normal top pole layer is divided into the top pole tip 110 and the top pole layer 116 serving as the yoke portion, so that the top pole tip 110 for determining the track width is flattened on the recording gap layer 109. On a smooth surface, it can be finely formed with a submicron width.
[0026]
However, such a thin film magnetic head still has the following problems.
[0027]
(1) First, in the conventional magnetic head, the throat height is determined at the end of the upper magnetic pole tip 110 on the side far from the air bearing surface 118. However, when the width of the upper magnetic pole chip 110 becomes narrow, the pattern edge is rounded in photolithography. For this reason, the throat height requiring high-precision dimensions becomes non-uniform, and there has been a situation where the balance with the track width of the MR element is lacking in the processing and polishing steps of the air bearing surface 118. For example, when the track width is required to be 0.5 to 0.6 μm, the end of the upper magnetic pole tip 110 on the side far from the air bearing surface 118 is the throat height zero position (the air bearing surface of the insulating layer that determines the throat height) This often causes a problem that recording data cannot be written due to a large recording gap that is displaced from the air bearing surface 118 side to the air bearing surface 118 side.
[0028]
(2) Next, in the conventional thin film magnetic head shown in FIG. 16, since the track width of the recording head is defined by the upper magnetic pole chip 110, the upper magnetic pole layer 116 is processed as finely as the upper magnetic pole chip 110. You don't have to. However, since the position of the upper magnetic pole layer 116 is determined on the upper part of the upper magnetic pole chip 110 by alignment of photolithography, when viewed from the air bearing surface 118 side, the upper magnetic pole layer 116 is greatly displaced to one side. In some cases, writing is performed on the side 116, and the effective track width becomes wide. As a result, there has been a problem in that a so-called sidelight is generated on the recording medium, in which data is written in an area other than the area where data should be recorded.
[0029]
When the track width of the recording head is extremely fine, particularly 0.5 μm or less, the upper magnetic pole layer 116 is also required to have a processing accuracy of a submicron width. That is, when viewed from the air bearing surface 118 side, if the lateral dimension difference between the upper magnetic pole tip 110 and the upper magnetic pole layer 116 is too large, sidelight is generated as described above, and the area other than the original data recording area is generated. The problem that writing is performed also in this area occurs.
[0030]
For this reason, it is necessary to process not only the upper magnetic pole tip 110 but also the upper magnetic pole layer 116 to have a submicron width, but the apex portion below the upper magnetic pole layer 116 still has a large height difference. Therefore, it is difficult to finely process the upper magnetic pole layer 116.
[0031]
(3) Further, the conventional thin film magnetic head has a problem that it is difficult to shorten the magnetic path length (Yoke Length). That is, as the coil pitch is smaller, a head having a shorter magnetic path length can be realized, and in particular, a recording head having excellent high frequency characteristics can be formed. However, when the coil pitch is reduced as much as possible, the throat The distance from the height zero position to the outer peripheral end of the coil is a major factor that hinders shortening of the magnetic path length. Since the magnetic path length can be shorter in the two-layer coil than in the one-layer coil, many high-frequency recording heads employ a two-layer coil. However, in the conventional magnetic head, after forming the first layer coil, a photoresist film is formed with a thickness of about 2 μm in order to form an insulating film between the coils. Therefore, a rounded small apex portion is formed at the outer peripheral end of the first layer coil. Next, a second layer coil is formed thereon. At that time, in the inclined portion of the apex portion, the coil seed layer cannot be etched, and the coil is short-circuited. It is necessary to form on a flat part.
[0032]
Therefore, for example, if the thickness of the coil is 2 to 3 μm, the thickness of the inter-coil insulating film is 2 μm, and the apex angle is 45 ° to 55 °, the magnetic path length is the length of the portion corresponding to the coil. In addition, twice the distance of 3 to 4 μm, which is the distance from the outer peripheral edge of the coil to the vicinity of the throat height zero position (the distance from the contact portion between the upper magnetic pole layer and the lower magnetic pole layer to the inner peripheral edge of the coil is also 3 to 4 μm) 6-8 μm is required. The length other than the portion corresponding to the coil is a factor that hinders the reduction of the magnetic path length.
[0033]
Here, for example, a case where an 11-turn coil having a coil wire width of 1.5 μm and a space of 0.5 μm is formed in two layers is considered. In this case, as shown in FIG. 16, when the first layer has 6 turns and the second layer has 5 turns, the length of the magnetic path length corresponding to the second layer coil 114 is 9.5 μm. It is. In addition to this, the magnetic path length is a total of 6 distances from the outer peripheral end and inner peripheral end of the second layer coil 114 to the end of the photoresist layer 115 for insulating the second layer coil 114. A length of ˜8 μm is required. The magnetic path length further requires a total length of 6 to 8 μm as the distance from the end of the photoresist layer 115 to the end of the photoresist layer 113 for insulating the first coil 112. Become. In the present application, the magnetic path length is represented by the length of a portion of the pole layer excluding the magnetic pole portion and the contact portion. In FIG. 16, the magnetic path length L ₀ is 21.5 μm. In the prior art, the magnetic path length cannot be further reduced, which hinders improvement of the high frequency characteristics.
[0034]
The present invention has been made in view of such problems, and an object of the present invention is to provide a thin-film magnetic head capable of reducing the magnetic path length of a recording head and a method of manufacturing the same.
[0035]
[Means for Solving the Problems]
The thin film magnetic head of the present invention includes two magnetic pole portions that are magnetically coupled and that part of the side facing the recording medium is opposed via a gap layer, and each of the first and second layers is composed of at least one layer. Two magnetic layers, a thin film coil disposed in an insulated state between the first and second magnetic layers, and a substrate, the first and second magnetic layers, the gap layer, and the thin film coil Is a thin film magnetic head that is stacked on a substrate, and of the first and second magnetic layers, the first magnetic layer is disposed closer to the substrate,
The first magnetic layer is disposed in a region including a region facing the thin film coil, and includes a first portion without a step, a second portion that forms a magnetic pole portion and is connected to the first portion, A third portion for connecting the first portion and the second magnetic layer;
The thin film coil has a portion made of one layer, and the whole portion made of one layer is disposed on the first portion via the insulating film, and at least a part of the portion made of one layer is formed. , Arranged to pass between the second part and the third part ,
The second part is arranged so as to surround the entire outer peripheral part of the part composed of one layer,
The thin film magnetic head further includes an insulating layer that covers a portion composed of one layer and has a flattened upper surface together with the second portion and the third portion .
[0036]
The method of manufacturing a thin film magnetic head according to the present invention includes two magnetic pole portions that are magnetically coupled and that part of the side facing the recording medium is opposed to each other via a gap layer, each comprising at least one layer. A method of manufacturing a thin film magnetic head comprising: first and second magnetic layers; and a thin film coil disposed in an insulated state between the first and second magnetic layers,
Forming a first magnetic layer; forming a gap layer on the first magnetic layer; forming a second magnetic layer on the gap layer; and Forming a thin film coil so as to be insulated between the two magnetic layers,
The step of forming the first magnetic layer is arranged in a region including a region facing the thin film coil, and forms a first portion without a step, a magnetic pole portion, and is connected to the first portion. And forming a first magnetic layer so as to have a third portion for connecting the first portion and the second magnetic layer,
The thin film coil has a portion made of one layer,
The step of forming the thin-film coil is such that the entire portion composed of one layer is disposed on the first portion via the insulating film, and at least a portion of the portion composed of one layer is the second portion and the third portion. of as being arranged so as to pass between the parts, to form a thin film coil,
The second part is arranged so as to surround the entire outer peripheral part of the part composed of one layer,
The method of manufacturing a thin film magnetic head further includes a step of forming an insulating layer covering a portion composed of one layer, and a step of flattening the upper surfaces of the insulating layer, the second portion, and the third portion. It is.
[0037]
In the thin film magnetic head or the method of manufacturing the same of the present invention, the first portion disposed in the region including the region facing the thin film coil, and the second portion formed with the magnetic pole portion and connected to the first portion And a first magnetic layer having a third portion for connecting the first portion and the second magnetic layer, and the thin film coil has a portion composed of one layer, The entire layer portion is disposed on the first portion through the insulating film, and at least a portion of the one layer portion is disposed between the second portion and the third portion. Is done.
[0038]
In the thin film magnetic head or the manufacturing method thereof according to the present invention, the second portion of the first magnetic layer may define the throat height.
[0039]
In the thin film magnetic head or the method of manufacturing the same of the present invention, the second magnetic layer forms a first portion disposed in a region including a region facing the thin film coil, a magnetic pole portion, and the first magnetic layer. You may make it have the 2nd part connected to the part, and the 3rd part for connecting the 1st part and the 1st magnetic layer.
[0040]
In the thin film magnetic head of the present invention or the manufacturing method thereof, the end surface of the second magnetic layer on the side facing the recording medium of the first portion is located away from the surface facing the recording medium of the thin film magnetic head. It may be arranged.
[0041]
In the thin film magnetic head of the present invention or the manufacturing method thereof, the length of the second portion of the second magnetic layer is the length of the portion defining the throat height of the second portion of the first magnetic layer. You may make it become more than this.
[0042]
In the thin film magnetic head of the present invention or the method of manufacturing the same, the first layer portion in which the thin film coil is disposed so as to pass between the second portion and the third portion of the first magnetic layer, You may make it have the 2nd layer part arrange | positioned so that it may pass between the 2nd part and 3rd part in 2 magnetic layers.
[0043]
In the thin film magnetic head of the present invention or the method of manufacturing the same, the thin film magnetic head is further arranged so that the magnetoresistive element and a part of the side facing the recording medium are opposed to each other with the magnetoresistive element interposed therebetween. You may make it provide the 1st and 2nd shield layer for shielding a resistive element. In this case, the second shield layer may also serve as the first magnetic layer.
[0044]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[First embodiment of the present invention]
First, a manufacturing method of a composite thin film magnetic head as a manufacturing method of a thin film magnetic head according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 6, (a) shows a cross section perpendicular to the air bearing surface, and (b) shows a cross section parallel to the air bearing surface of the magnetic pole portion.
[0045]
In accordance with the present embodiment, first, as shown in FIG. 1, for example on the AlTiC (Al ₂ O ₃ · TiC) than consisting substrate 1, made of for example alumina (Al ₂ O ₃₎ insulating Layer 2 is deposited with a thickness of about 5 μm. Next, a lower shield layer 3 for a reproducing head made of a magnetic material, for example, permalloy, is formed on the insulating layer 2 to a thickness of about 3 μm. For example, the lower shield layer 3 is selectively formed on the insulating layer 2 by plating using a photoresist film as a mask. Next, although not shown, an insulating layer made of alumina, for example, is formed to a thickness of, for example, 4 to 5 μm on the entire surface, and is polished by, for example, CMP (chemical mechanical polishing) until the lower shield layer 3 is exposed. Is flattened.
[0046]
Next, as shown in FIG. 2, for example, alumina or aluminum nitride is sputter deposited on the lower shield layer 3 to form a lower shield gap film 4 as an insulating layer. Next, an MR film for forming the reproducing MR element 5 is formed on the lower shield gap film 4 to a thickness of several tens of nm. Next, a photoresist pattern is selectively formed on the MR film at a position where the MR element 5 is to be formed. Next, using the photoresist pattern as a mask, the MR film is etched by, for example, ion milling to form the MR element 5. The MR element 5 may be a GMR element or an AMR element. Next, a pair of electrode layers 6 electrically connected to the MR element 5 is formed on the lower shield gap film 4 with a thickness of several tens of nm using the same photoresist pattern as a mask. Next, an upper shield gap film 7 as an insulating layer is formed on the lower shield gap film 4 and the MR element 5, and the MR element 5 is embedded in the shield gap films 4 and 7. Next, a first portion 8a of an upper shield layer / lower magnetic pole layer (hereinafter referred to as a lower magnetic pole layer) made of a magnetic material and used for both the reproducing head and the recording head is formed on the upper shield gap film 7. Are selectively formed with a thickness of about 1.0 to 1.5 μm. The first portion 8a of the lower magnetic pole layer is a portion disposed in a region including an in-plane region facing the entire thin film coil described later.
[0047]
Next, as shown in FIG. 3, the second portion 8b and the third portion 8c of the bottom pole layer are formed on the first portion 8a of the bottom pole layer to a thickness of 1.5 to 2.5 μm. To form. The second portion 8b forms a magnetic pole portion of the lower magnetic pole layer and is connected to the first portion 8a. The third portion 8c is a portion for connecting the first portion 8a and the upper magnetic pole layer. In the present embodiment, the position of the end of the second portion 8b opposite to the air bearing surface (the right side in the figure) defines the throat height. That is, this position is the throat height zero position.
[0048]
The second portion 8b and the third portion 8c of the bottom pole layer are made of NiFe (Ni: 80 wt%, Fe: 20 wt%) or NiFe (Ni: 45 wt%, Fe: (55 wt%) material may be used for plating, or a high saturation magnetic flux density material such as FeN or FeZrN may be used for sputtering. In addition, CoFe, a Co-based amorphous material, which is a high saturation magnetic flux density material, or the like may be used.
[0049]
Next, an insulating film 10 made of alumina, for example, is formed on the entire surface. The thickness of the insulating film 10 is preferably 1 μm or less. The reason is that the magnetic path length becomes too large if the thickness is further increased. In the present embodiment, the insulating film 10 is formed to have a thickness of about 0.3 to 0.6 μm.
[0050]
Next, although not shown, a seed layer for forming the first layer portion of the thin film coil is formed by, for example, sputtering by plating. Next, a photoresist is applied thereon and patterned by a photolithography process to form a frame 11 for plating.
[0051]
In the present embodiment, the first layer portion of the thin-film coil is disposed around the third portion 8c of the lower magnetic pole layer on the third portion 8c of the lower magnetic pole layer, and a part thereof is the lower magnetic pole. The frame 11 is formed so as to pass between the second portion 8b and the third portion 8c of the layer.
[0052]
Next, the first layer portion 12 of the thin film coil made of, for example, copper (Cu) is formed to have a thickness of about 1.0 to 2.0 μm, for example, by frame plating using the frame 11. The pitch of the first layer portion 12 is, for example, about 1.2 to 2.0 μm.
[0053]
In this way, in the present embodiment, the first layer portion 12 of the thin film coil is disposed on the third magnetic pole 8c of the lower magnetic pole layer and around the third portion 8c of the lower magnetic pole layer. A portion is disposed so as to pass between the second portion 8b and the third portion 8c of the bottom pole layer.
[0054]
Next, as shown in FIG. 4, after removing the frame 11 and the seed layer therebelow, an insulating layer 13 made of alumina, for example, is formed on the whole with a thickness of about 3 to 4 μm. Next, the insulating layer 13 is polished and planarized by, for example, CMP until the second portion 8b and the third portion 8c of the lower magnetic pole layer are exposed. Here, in FIG. 4, the first layer portion 12 of the thin film coil is not exposed by the planarization process, but may be exposed. However, when the portion 12a connected to the second layer portion of the thin film coil to be described later is not exposed in the first layer portion 12 by the planarization process, the portion 12a is exposed by the photolithography technique.
[0055]
Next, as shown in FIG. 5, the recording gap layer 14 made of an insulating material is formed on the second portion 8 b and the third portion 8 c of the lower magnetic pole layer and the insulating layer 13 by 0.2 to 0. It is formed with a thickness of 3 μm. Generally, the insulating material used for the recording gap layer 14 includes alumina, aluminum nitride, silicon oxide-based material, and silicon nitride-based material.
[0056]
Next, in order to form the magnetic path, the recording gap layer 14 is partially etched to form a contact hole in the portion above the third portion 8c of the lower magnetic pole layer, and the first layer portion of the thin film coil is formed. In order to connect the portion 12a to the second layer portion, the recording gap layer 14 is partially etched in the portion above the portion 12a to form a contact hole.
[0057]
Next, a second portion 15b of the upper magnetic pole layer is formed to a thickness of 2.0 to 3.0 μm on the recording gap layer 14, and an upper portion is formed on the third portion 8c of the lower magnetic pole layer. The third portion 15c of the pole layer is formed to a thickness of 2.0 to 3.0 μm. The second portion 15b forms a magnetic pole portion of the upper magnetic pole layer and is connected to a first portion of the upper magnetic pole layer described later. The third portion 15c is a portion for connecting a first portion of the upper magnetic pole layer, which will be described later, and the lower magnetic pole layer. In the present embodiment, the length of the second portion 15b of the upper magnetic pole layer is longer than the length of the second portion 8b of the lower magnetic pole layer. Further, the second portion 15 b of the top pole layer is formed so as to overlap a part of the first layer portion 12 of the thin film coil via the recording gap layer 14.
[0058]
The second portion 15b and the third portion 15c of the top pole layer are made of NiFe (Ni: 80% by weight, Fe: 20% by weight) or NiFe (Ni: 45% by weight, Fe: (55 wt%) material may be used for plating, or a high saturation magnetic flux density material such as FeN or FeZrN may be used for sputtering. In addition, CoFe, a Co-based amorphous material, which is a high saturation magnetic flux density material, or the like may be used.
[0059]
Next, the recording gap layer 14 is selectively etched by dry etching using the second portion 15b of the top pole layer as a mask. For this dry etching, for example, reactive ion etching (RIE) using a gas such as a chlorine-based gas such as BCl ₂ or Cl ₂ or a fluorine-based gas such as CF ₄ or SF ₆ is used. Next, the second portion 8b of the lower magnetic pole layer is selectively etched by about 0.3 to 0.6 [mu] m by, for example, argon ion milling to obtain a trim structure as shown in FIG. According to this trim structure, it is possible to prevent an increase in effective track width due to the spread of magnetic flux generated when writing a narrow track.
[0060]
Next, an insulating film 16 made of alumina, for example, is formed on the entire surface. The thickness of the insulating film 16 is preferably 1 μm or less. The reason is that the magnetic path length becomes too large if the thickness is further increased. In the present embodiment, the insulating film 16 is formed to a thickness of about 0.3 to 0.6 μm.
[0061]
Next, although not shown, a seed layer for forming the second layer portion of the thin film coil is formed by sputtering, for example, by sputtering. Next, a photoresist is applied thereon and patterned by a photolithography process to form a frame for plating.
[0062]
In the present embodiment, the second layer portion of the thin film coil is arranged around the third portion 15c of the upper magnetic pole layer, and a part thereof is the second portion 15b and the third portion 15c of the upper magnetic pole layer. The frame is formed so as to pass between the two.
[0063]
Next, using this frame, the second layer portion 18 of the thin film coil made of, for example, copper (Cu) is formed to a thickness of, for example, about 1.0 to 2.0 μm by frame plating. The pitch of the second layer portions 18 is, for example, about 1.2 to 2.0 μm. Here, of the second layer portion 18, a portion 18a disposed on the portion 12a of the first layer portion 12 is connected to the portion 12a through a contact hole.
[0064]
In this manner, in the present embodiment, a part of the second layer portion 18 of the thin film coil is disposed between the second portion 15b and the third portion 15c of the upper magnetic pole layer.
[0065]
Next, as shown in FIG. 6, after removing the frame and the seed layer therebelow, an insulating layer 19 made of alumina, for example, is formed on the entire surface with a thickness of about 3 to 4 μm. Next, the insulating layer 19 is polished and planarized by, for example, CMP until the second portion 15b and the third portion 15c of the upper magnetic pole layer are exposed.
[0066]
Next, the first portion 15a of the top pole layer made of a magnetic material for a recording head is formed on the second portion 15b and the third portion 15c of the planarized top pole layer and the insulating layer 19, For example, it is formed to a thickness of about 2 to 3 μm. The first portion 15a of the top pole layer is a portion disposed in a region including the in-plane region facing the thin film coils 12 and 18 between the second portion 15b and the third portion 15c of the top pole layer. It is. The first portion 15a of the upper magnetic pole layer is in contact with the third portion 8c of the lower magnetic pole layer via the third portion 15c and is magnetically coupled. The first portion 15a of the upper magnetic pole layer is made of NiFe (Ni: 80% by weight, Fe: 20% by weight) or NiFe (Ni: 45% by weight, Fe: 55% by weight) which is a high saturation magnetic flux density material. May be formed by plating, or may be formed by sputtering using a material such as FeN, FeZrN which is a high saturation magnetic flux density material. In addition, CoFe, a Co-based amorphous material, which is a high saturation magnetic flux density material, or the like may be used. In order to improve the high frequency characteristics, the first portion 15a of the upper magnetic pole layer may have a structure in which an inorganic insulating film and a magnetic layer such as permalloy are stacked in layers.
[0067]
In the present embodiment, the end surface of the first pole portion 15a of the upper magnetic pole layer on the side facing the recording medium (air bearing surface side) is positioned away from the surface facing the recording medium of the thin film magnetic head (right side in the figure). ).
[0068]
Next, an overcoat layer 20 made of, for example, alumina is formed on the first portion 15a of the upper magnetic pole layer so as to have a thickness of 20 to 40 μm, and the surface thereof is flattened. A pad is formed. Finally, the slider is polished to form the air bearing surfaces of the recording head and the reproducing head, thereby completing the thin film magnetic head according to the present embodiment.
[0069]
In the present embodiment, the bottom pole layer composed of the first portion 8a, the second portion 8b, and the third portion 8c corresponds to the first magnetic layer in the present invention, and the first portion 15a, the second portion The upper magnetic pole layer composed of the first portion 15b and the third portion 15c corresponds to the second magnetic layer in the present invention.
[0070]
FIG. 7 is a plan view of the thin film magnetic head according to the present embodiment manufactured as described above. In this figure, the overcoat layer 20 is omitted. In FIG. 7, reference numeral 8 </ b> B in the drawing represents a portion where the second portion 8 b of the lower magnetic pole layer is etched to form a trim structure.
[0071]
As shown in FIG. 7, the first portion 8 a of the lower magnetic pole layer is disposed in a region including an in-plane region that faces the entire thin film coils 12 and 18. Therefore, according to the present embodiment, the entire first layer portion 12 of the thin film coil can be formed on the first portion 8a of the lower magnetic pole layer without a step through the insulating film 10. The first layer portion 12 of the thin film coil can be finely formed. Further, in the present embodiment, the second layer portion 18 of the thin film coil can also be formed on the flat surface of the recording gap layer 14, so that it can be formed finely. For these reasons, according to the present embodiment, the pitch of the thin film coils 12 and 18 can be reduced. As a result, according to the present embodiment, the magnetic path length of the recording head can be reduced by, for example, about 30% to 40% compared to the conventional case. Therefore, according to the present embodiment, it is possible to provide a thin film magnetic head having excellent high frequency characteristics. Further, according to the present embodiment, by reducing the magnetic path length, the total length of the coil can be significantly shortened even if the number of turns of the coil is the same. As a result, the thickness of the coil can be reduced from, for example, the conventional 2-3 μm to about 1-1.5 μm.
[0072]
Here, the magnetic path length when the thin-film coils 12 and 18 in the present embodiment are formed with the same design rule as the conventional example shown in FIG. 16 is set to L ₁ as shown in FIG. As an example of a specific numerical value of the magnetic path length, L ₁ is 14.5 μm.
[0073]
Further, according to the present embodiment, the second portion 8b of the lower magnetic pole layer and the second portion 15b of the upper magnetic pole layer that form the magnetic pole portion of the recording head are both formed on a flat surface. Therefore, the second portions 8b and 15b can be finely formed. Therefore, the second portion 15b of the upper magnetic pole layer that determines the track width of the recording head can be formed in a half micron dimension or a quarter micron dimension, and the track width of the recording head can be reduced. Thereby, a thin film magnetic head having a surface recording density of 20 gigabit / (inch) ² to 30 gigabit / (inch) ² that will be required in the future can be realized.
[0074]
In the present embodiment, the throat height is defined by the second portion 8b of the bottom pole layer. Since the second portion 8b of the lower magnetic pole layer is formed as a wide pattern using photolithography as shown in FIG. 8, the throat height is reduced by the magnetic pole portion of the upper magnetic pole layer that needs to be finely formed. Compared with the case of defining, the position of the end of the pattern can be controlled more accurately, and as a result, the throat height can be accurately defined.
[0075]
In the present embodiment, the end surface on the air bearing surface side of the first portion 15a of the upper magnetic pole layer is disposed at a position away from the air bearing surface of the thin film magnetic head. Therefore, even when the throat height is small, the first portion 15a of the upper magnetic pole layer is not exposed to the air bearing surface, and as a result, so-called sidelight is not generated and the effective track width is prevented from increasing. be able to.
[0076]
In the present embodiment, the inorganic insulating film 10 that is thin and has a sufficient withstand voltage is provided between the bottom pole layer (8a, 8b, 8c) and the first layer portion 12 of the thin film coil. Therefore, a large withstand voltage can be obtained between the lower magnetic pole layer and the first layer portion 12. In addition to the recording gap layer 14, an inorganic insulating layer 13 and an inorganic insulating film 16 are provided between the first layer portion 12 and the second layer portion 18 of the thin film coil. A large withstand voltage can be obtained between the first layer portion 12 and the second layer portion 18 and leakage of magnetic flux from the thin film coils 12 and 18 can be reduced.
[0077]
In the present embodiment, as shown in FIG. 7, the second portion 8b of the lower magnetic pole layer is widely arranged around the thin film coils 12 and 18, and therefore the first layer portion 12 of the thin film coil. The flattening process after forming is easy.
[0078]
[Second embodiment of the present invention]
First, a thin film magnetic head and a method for manufacturing the same according to a second embodiment of the present invention will be described with reference to FIG. 8A shows a cross section perpendicular to the air bearing surface, and FIG. 8B shows a cross section of the magnetic pole portion parallel to the air bearing surface.
[0079]
The thin film magnetic head according to the present embodiment is the second thin film coil except for the insulating film 16 provided below the second layer portion 18 of the thin film coil in the thin film magnetic head according to the first embodiment. The layer portion 18 is formed directly on the recording gap layer 14. The method of manufacturing the thin film magnetic head according to the present embodiment is the same as the method of manufacturing the thin film magnetic head according to the first embodiment except for the step of forming the insulating film 16.
[0080]
Other configurations, operations, and effects in the present embodiment are the same as those in the first embodiment.
[0081]
[Third embodiment of the present invention]
First, with reference to FIG. 9, a thin film magnetic head and a method for manufacturing the same according to a third embodiment of the invention will be described. 9A shows a cross section perpendicular to the air bearing surface, and FIG. 9B shows a cross section parallel to the air bearing surface of the magnetic pole portion.
[0082]
In the thin film magnetic head according to the present embodiment, the upper surface of the second layer portion 18 of the thin film coil in the thin film magnetic head according to the first embodiment is the same as the upper surface of the second portion 15b of the upper magnetic pole layer. It arrange | positions on the same surface as the upper surface of the part 15c. The second layer portion 18 and the first portion 15a of the top pole layer are disposed on the second layer portion 18 of the thin film coil between the second portion 15b and the third portion 15c of the top pole layer. An insulating layer 31 is provided to insulate between the two. This insulating layer 31 is formed of, for example, a photoresist.
[0083]
In the method of manufacturing the thin film magnetic head according to the present embodiment, in the method of manufacturing the thin film magnetic head according to the first embodiment, the second portion 15b and the third portion 15c of the top pole layer are formed by CMP, for example. The insulating layer 19 is polished until it is exposed, and when the surface is planarized, the second layer portion 18 of the thin film coil is also exposed. Thereafter, the insulating layer 31 is formed on the second layer portion 18 of the thin film coil between the second portion 15b and the third portion 15c of the upper magnetic pole layer.
[0084]
Other configurations, operations, and effects in the present embodiment are the same as those in the first embodiment.
[0085]
[Fourth embodiment of the present invention]
First, with reference to FIG. 10, a thin film magnetic head and a method for manufacturing the same according to a fourth embodiment of the invention will be described. 10A shows a cross section perpendicular to the air bearing surface, and FIG. 10B shows a cross section parallel to the air bearing surface of the magnetic pole portion.
[0086]
In the thin film magnetic head according to the present embodiment, as in the second embodiment, the second layer portion 18 of the thin film coil is formed directly on the recording gap layer 14, and this second layer portion 18 is formed into a photo Covered with a resist layer 41. In the present embodiment, the first portion 15 a of the top pole layer is formed on the second portion 15 b and the third portion 15 c of the top pole layer and the photoresist layer 41.
[0087]
In the present embodiment, the first portion 15a of the upper magnetic pole layer is not formed on the flat surface. Therefore, the first portion 15a is formed on the flat surface among the effects of the first embodiment. There is no effect of being done.
[0088]
However, according to the present embodiment, since the number of CMP processes is small, the manufacturing cost can be reduced.
[0089]
Other configurations, operations, and effects in the present embodiment are the same as those in the first embodiment.
[0090]
In addition, this invention is not limited to said each embodiment, A various change is possible. For example, in each of the above-described embodiments, both the lower magnetic pole layer and the upper magnetic pole layer have the first portion, the second portion, and the third portion, and the first layer portion 12 of the thin film coil having two layers. And the second layer portion 18 are arranged so as to pass between the lower magnetic pole layer or the second portion 8b, 15b of the upper magnetic pole layer and the third portion 8c, 15c, but only the lower magnetic pole layer. Has a first portion, a second portion and a third portion, and only the first layer portion 12 passes between the second portion 8b and the third portion 8c of the bottom pole layer. It may be arranged.
[0091]
In each of the above embodiments, the throat height is defined by the lower magnetic pole layer. However, the throat height may be defined by the upper magnetic pole layer.
[0092]
In each of the above embodiments, a thin film magnetic head having a structure in which an MR element for reading is formed on the substrate side and an inductive magnetic transducer for writing is stacked thereon has been described. It may be reversed.
[0093]
That is, an inductive magnetic transducer element for writing may be formed on the substrate side, and an MR element for reading may be formed thereon. In such a structure, for example, the magnetic film having the function of the upper magnetic pole layer shown in the above-described embodiment is formed on the substrate side as the lower magnetic pole layer, and the above-described implementation is performed so as to face the recording gap film. This can be realized by forming the magnetic film having the function of the lower magnetic pole layer shown in the embodiment as the upper magnetic pole layer. In this case, it is preferable to use both the upper magnetic pole layer of the inductive magnetic transducer and the lower shield layer of the MR element.
[0094]
In the thin film magnetic head having such a structure, it is preferable to use a substrate having a recess. The size of the thin film magnetic head itself can be further reduced by forming a coil portion in the recess of the base.
[0095]
The present invention can also be applied to a thin film magnetic head that includes only an inductive magnetic transducer and performs reading and writing with the inductive magnetic transducer.
[0096]
【The invention's effect】
As described above, in the method of manufacturing the thin film magnetic head according to any one of claims 1 to 8 or the thin film magnetic head according to any one of claims 9 to 16, the thin film magnetic head is disposed in a region including a region facing the thin film coil. A first portion formed, a second portion forming a magnetic pole portion and connected to the first portion, and a third portion for connecting the first portion and the second magnetic layer, The thin film coil has a portion composed of one layer, and the entire portion composed of one layer is disposed on the first portion via the insulating film. It arrange | positions so that at least one part of the part which consists of two layers may pass between between a 2nd part and a 3rd part. Therefore, according to the thin film magnetic head or the method of manufacturing the thin film magnetic head, it is possible to form the portion composed of one layer of the thin film coil on the first portion of the first magnetic layer having no step. Therefore, it is possible to finely form a portion composed of one layer , and as a result, it is possible to reduce the magnetic path length of the recording head.
[0097]
According to the method of manufacturing the thin film magnetic head according to claim 2 or the thin film magnetic head according to claim 10, the throat height is defined by the second portion of the first magnetic layer. There is an effect that the height can be accurately defined.
[0098]
According to the manufacturing method of claim 4 thin-film magnetic head or a thin film magnetic head according to claim 12, wherein the wherein the first portion of the second magnetic layer, disposed in a region including a region opposed to the thin film coil And forming a magnetic pole portion, a second portion connected to the first portion, and a third portion for connecting the first portion and the first magnetic layer. Since the end face of the second magnetic layer on the side facing the recording medium is disposed away from the face of the thin film magnetic head facing the recording medium, the effective track width is further increased. There is an effect that can be prevented.
[0099]
The thin film magnetic head according to claim 6 or the thin film magnetic head according to claim 14 is arranged such that the thin film coil passes between the second portion and the third portion of the first magnetic layer. And the second layer portion disposed so as to pass between the second portion and the third portion of the second magnetic layer. Both the first layer portion and the second layer portion can be formed on a flat surface. As a result, the coil pitch can be reduced and the magnetic path length can be further reduced. Play.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view for explaining one step in a method of manufacturing a thin film magnetic head according to a first embodiment of the invention.
FIG. 2 is a cross-sectional view for explaining a step following the step in FIG. 1;
FIG. 3 is a cross-sectional view for explaining a step following the step of FIG. 2;
4 is a cross-sectional view for explaining a process following the process in FIG. 3; FIG.
FIG. 5 is a cross-sectional view for explaining a process following the process in FIG. 4;
6 is a cross-sectional view for illustrating a process following the process in FIG. 5. FIG.
FIG. 7 is a plan view of the thin film magnetic head according to the first embodiment of the invention.
FIG. 8 is a cross-sectional view of a thin film magnetic head according to a second embodiment of the invention.
FIG. 9 is a cross-sectional view of a thin film magnetic head according to a third embodiment of the invention.
FIG. 10 is a cross-sectional view of a thin film magnetic head according to a fourth embodiment of the invention.
FIG. 11 is a cross-sectional view for explaining one step in a conventional method of manufacturing a thin film magnetic head.
FIG. 12 is a cross-sectional view for explaining a process following the process in FIG. 11;
FIG. 13 is a cross-sectional view for explaining a process following the process in FIG. 12;
FIG. 14 is a cross-sectional view for explaining a process following the process in FIG. 13;
FIG. 15 is a cross-sectional view for explaining a process following the process in FIG. 14;
16 is a cross-sectional view for illustrating a process following the process in FIG. 15. FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Substrate, 2 ... Insulating layer, 3 ... Lower shield layer, 5 ... MR element, 8a ... 1st part of a bottom pole layer, 8b ... 2nd part of a bottom pole layer, 8c ... 3rd of a bottom pole layer , 10 ... insulating film, 12 ... first layer part of thin film coil, 14 ... recording gap layer, 15a ... first part of upper magnetic pole layer, 15b ... second part of upper magnetic pole layer, 15c ... upper magnetic pole 3rd part of layer, 16 ... insulating film, 18 ... 2nd layer part of thin film coil, 20 ... overcoat layer.

Claims (16)

First and second magnetic layers each including at least one layer including two magnetic pole portions that are magnetically coupled and part of the side facing the recording medium is opposed to each other with a gap layer therebetween. A thin film coil disposed in an insulated state between the first and second magnetic layers, and a substrate, the first and second magnetic layers, the gap layer, and the thin film coil are stacked on the substrate; And among the first and second magnetic layers, the first magnetic layer is a thin film magnetic head disposed closer to the substrate,
The first magnetic layer is disposed in a region including a region facing the thin film coil, and forms a first portion having no step, a magnetic pole portion, and a second portion connected to the first portion. A portion, and a third portion for connecting the first portion and the second magnetic layer,
The thin film coil has a portion made of one layer, and the whole portion made of the one layer is disposed on the first portion with an insulating film interposed therebetween, and the portion made of the one layer At least a portion is disposed to pass between the second portion and the third portion ;
The second part is arranged so as to surround the entire outer peripheral part of the part composed of the one layer,
The thin film magnetic head further comprises an insulating layer that covers a portion made of the one layer and has a flattened upper surface together with the second portion and the third portion .   2. The thin film magnetic head according to claim 1, wherein the second portion of the first magnetic layer defines a throat height.   The second magnetic layer includes a first portion arranged in a region including a region facing the thin film coil, a second portion forming a magnetic pole portion and connected to the first portion, 3. The thin film magnetic head according to claim 1, further comprising a third portion for connecting the first portion and the first magnetic layer.   4. The end face of the second magnetic layer on the side facing the recording medium is disposed at a position away from the face of the thin film magnetic head facing the recording medium. Thin film magnetic head. 4. The length of the second portion in the second magnetic layer is equal to or greater than the length of the portion defining the throat height in the second portion of the first magnetic layer. Or the thin film magnetic head described in 4;   The thin film coil includes a first layer portion disposed so as to pass between the second portion and the third portion of the first magnetic layer, and the second portion of the second magnetic layer. 6. The thin film magnetic head according to claim 3, further comprising a second layer portion disposed so as to pass between the first portion and the third portion.   Further, the magnetoresistive element is arranged so that a part of the side facing the recording medium faces the magnetoresistive element, and the first and second shield layers for shielding the magnetoresistive element are provided. 7. A thin film magnetic head according to claim 1, further comprising a thin film magnetic head.   8. The thin film magnetic head according to claim 7, wherein the second shield layer also serves as the first magnetic layer. First and second magnetic layers each including at least one layer including two magnetic pole portions that are magnetically coupled and a part of the side facing the recording medium is opposed to each other with a gap layer therebetween. A method of manufacturing a thin film magnetic head comprising a thin film coil disposed in an insulated state between a first magnetic layer and a second magnetic layer,
Forming the first magnetic layer;
Forming the gap layer on the first magnetic layer;
Forming the second magnetic layer on the gap layer;
Forming the thin film coil so as to be disposed in an insulated state between the first magnetic layer and the second magnetic layer,
The step of forming the first magnetic layer is disposed in a region including a region facing the thin film coil, and forms a first portion without a step, a magnetic pole portion, and is connected to the first portion. Forming a first magnetic layer so as to have a second portion and a third portion for connecting the first portion and the second magnetic layer;
The thin film coil has a portion composed of one layer,
In the step of forming the thin film coil, the entire portion composed of the one layer is disposed on the first portion via an insulating film, and at least a portion of the portion composed of the one layer is the second layer. Forming a thin film coil so as to pass between the portion and the third portion ,
The second part is arranged so as to surround the entire outer peripheral part of the part composed of the one layer,
The method of manufacturing a thin film magnetic head further includes a step of forming an insulating layer covering a portion composed of the one layer, and a step of flattening the upper surfaces of the insulating layer, the second portion, and the third portion. A method of manufacturing a thin film magnetic head, comprising:   10. The method of manufacturing a thin film magnetic head according to claim 9, wherein in the step of forming the first magnetic layer, the first magnetic layer is formed so that the second portion defines a throat height. .   The step of forming the second magnetic layer includes forming a first portion disposed in a region including a region facing the thin film coil, a magnetic pole portion, and a second portion connected to the first portion. The thin film according to claim 9, further comprising: a second magnetic layer having a first portion and a third portion for connecting the first portion and the first magnetic layer. Manufacturing method of magnetic head.   In the step of forming the second magnetic layer, the end surface of the second magnetic layer on the side facing the recording medium is disposed at a position away from the surface facing the recording medium of the thin film magnetic head. The method of manufacturing a thin film magnetic head according to claim 11. 12. The length of the second portion of the second magnetic layer is set to be equal to or longer than the length of the second portion of the first magnetic layer that defines the throat height. Or a method for producing a thin-film magnetic head according to 12.   The step of forming the thin film coil includes a first layer portion disposed so as to pass between the second portion and the third portion of the first magnetic layer, and the second magnetic layer. 14. A thin film magnetic head according to claim 11, wherein a thin film coil having a second layer portion arranged to pass between the second portion and the third portion is formed. Manufacturing method.   Further, the magnetoresistive element is arranged so that a part of the side facing the recording medium faces the magnetoresistive element, and the first and second shield layers for shielding the magnetoresistive element are provided. 15. The method of manufacturing a thin film magnetic head according to claim 9, further comprising a forming step.   16. The method of manufacturing a thin film magnetic head according to claim 15, wherein the second shield layer also serves as the first magnetic layer.

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