JP2000169675A - Epoxy resin composition and semiconductor apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a resin composition for sealing a semiconductor having a few aggregate of carbon black and for preventing leak properties and conductivity between inner leads and wires in a semiconductor apparatus. SOLUTION: This epoxy resin composition comprises (A) an epoxy resin, (B) a phenol resin curing agent, (C) an inorganic filler, (D) a curing promoter and (E) 0.1-1.0 wt.% in the whole epoxy resin composition of carbon black having 10-50 nm average particle diameter and 80-400 m2/g specific surface area by a Brunauer-Emmett-Teller method as essential components.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition for semiconductor encapsulation for preventing leakage and conductivity between inner leads and between wires in a semiconductor device, and for encapsulating a semiconductor element using the same. The present invention relates to a semiconductor device comprising:

[0002]

2. Description of the Related Art Conventionally, carbon black has been used in epoxy resin compositions for encapsulating semiconductor devices. However, since the main purpose is to color the resin composition after curing, the type and the amount of addition are determined according to the color of the cured product. However, with the recent trend toward finer pitch IC packages, gaps between inner leads and wires have been rapidly narrowed, and carbon black agglomerates have entered the gaps, leading to problems with leakage and conductivity. I have. Therefore, a resin encapsulating material capable of coping with fine pitch has been demanded.

[0003]

DISCLOSURE OF THE INVENTION The present invention relates to an average particle size of carbon black and a Brunauer-Emme.
As a result of intensive studies focusing on the specific surface area by the tt-teller method (hereinafter referred to as the BET method), the present inventors have found carbon black capable of reducing aggregates and have reached the present invention.

[0004]

The present invention provides (A) an epoxy resin, (B) a phenolic resin curing agent, (C) an inorganic filler, (D) a curing accelerator, and (E) an average particle diameter of 10 to 5 particles.
0 nm and Brunauer-Emmett-Tel
An epoxy resin comprising, as an essential component, carbon black having a specific surface area of 80 to 400 m ² / g as determined by the ler method, and 0.1 to 1.0% by weight of the carbon black in the entire epoxy resin composition. A semiconductor device comprising a composition and a semiconductor element sealed with the composition.

[0005]

BEST MODE FOR CARRYING OUT THE INVENTION Each component will be described below.
The epoxy resin used in the present invention is not particularly limited in molecular weight and molecular structure as long as it has two or more epoxy groups in a molecule. For example, ortho-cresol novolak epoxy resin, phenol novolak epoxy resin , Bisphenol type epoxy resin, naphthalene type epoxy resin, triphenol methane type epoxy resin, triazine nucleus containing epoxy resin, biphenyl type epoxy resin, stilbene type epoxy resin, dicyclopentadiene modified phenol type epoxy resin and modified resins thereof. . In order to improve the moisture resistance of the resin composition, it is desirable that impurity ions such as Cl ions and Na ions are as small as possible, and the epoxy equivalent is desirably 150 to 300 g / eq from the viewpoint of curability.

The phenolic resin curing agent is not particularly limited in molecular weight and molecular structure as long as it has a phenolic hydroxyl group in the molecule. For example, phenol novolak resin, phenol aralkyl resin, naphthol aralkyl resin, triphenyl Examples include methane resin, dicyclopentadiene-modified phenol resin, terpene-modified phenol resin, and modified resins thereof. From the viewpoint of curability, the hydroxyl equivalent is preferably from 80 to 250 g / eq. As the inorganic filler, fused silica powder, crystalline silica powder, alumina and the like can be used. The curing accelerator may be any one that promotes the reaction between the epoxy group and the hydroxyl group, and those generally used for a sealing material can be used. For example, 1,8-diazabicyclo (5,
(4,0) Undecene-7, triphenylphosphine, benzyldimethylamine, 2-methylimidazole, tetraphenylphosphonium / tetraphenylborate, etc., and these may be used alone or in combination.

A technical point of the present invention is to use a special carbon black. The carbon black used in the present invention has an average particle diameter of 10 to 50.
nm and Brunauer-Emmett-Tell
Specific surface area by er method (referred to as BET method) is 80 to 40
0 m ² / g of carbon black as an essential component, and the carbon black in the total epoxy resin composition is 0.1 to
It is necessary to contain 1.0% by weight. The method for measuring the average particle size of carbon black refers to an average value obtained by calculating an image obtained by observation with an electron microscope using an analyzer or visually. If the average particle size is less than 10 nm, the oil absorbency is severe and the fluidity of the resin composition is significantly reduced.
When the thickness exceeds 0 nm, the cohesiveness between carbon blacks is so strong that an agglomerate remains in the stirring step and the mixing step in the production of the resin composition, and the semiconductor device sealed with this has a high reliability such as leak failure or conduction failure. Problems arise.

The specific surface area by the BET method is 80 m ^2.
If it is less than / g, the dispersion state of carbon black in the epoxy resin composition is poor, and the appearance of the cured product of the epoxy resin composition becomes patchy or grayish white, which causes a problem in practical appearance. If the specific surface area exceeds 400 m ² / g, the particle size becomes too fine, and a problem occurs for the same reason as when the average particle size becomes too fine. Further, the carbon black used in the present invention accounts for 0.1% of the total epoxy resin composition.
To 1.0% by weight. If the amount is less than 0.1% by weight, the appearance color of the cured product of the epoxy resin composition is close to gray, which is a practical problem. 1.0% by weight
If the carbon black is exceeded, the probability of generation of agglomerates increases even when the carbon black is used, and reliability problems such as leak failure and conduction failure occur. The carbon black used in the present invention is not particularly limited as long as it has the above performance, but is preferably a powder in order to be uniformly dispersed in the epoxy resin composition. Further, even if these particles are granulated, there is no particular problem as long as they are easily loosened.

The present invention comprises an epoxy resin, a phenolic resin curing agent, an inorganic filler, a curing accelerator and carbon black as essential components. In addition to these, a silane coupling agent, a flame retardant, and a flame retardant auxiliary may be used if necessary. , A release agent, and various additives such as a silicone-based or synthetic rubber-based low stress agent may be appropriately compounded. In order to produce the epoxy resin composition of the present invention as a molding material, an epoxy resin, a phenol resin curing agent, an inorganic filler, a curing accelerator, carbon black and other additives are mixed by a mixer, and then further heated by a hot roll. It can be melt-kneaded in a kneader or a kneader, cooled and pulverized to obtain a molding material. These molding materials can be applied to sealing, coating, insulation, and the like of semiconductor components. In order to encapsulate an electronic component such as a semiconductor and produce a semiconductor using the resin composition of the present invention, it is only necessary to mold and cure by a conventionally known method such as a transfer mold, a compression mold, and an injection mold.

[0010]

The present invention will be specifically described below with reference to examples. << Example 1 >> Orthocresol novolak type epoxy resin: 150 parts by weight (softening point 62 ° C., epoxy equivalent 200) ・ Phenol novolak resin: (softening point 95 ° C., hydroxyl equivalent 100) 80 parts by weight ・ Brominated epoxy resin: (Bromine content 49%, softening point 70 ° C) 20 parts by weight-fused silica powder 700 parts by weight-antimony trioxide 10 parts by weight-carnauba wax 5 parts by weight-silicone oil 5 parts by weight-1,8-diazabicyclo (5, 4,0) undecene-7: (hereinafter abbreviated as “DBU”) 3 parts by weight Carbon black A: 5 parts by weight (average particle diameter 20 nm, specific surface area 180 m ² / g) were mixed at room temperature with a mixer, The mixture was kneaded with a twin-screw kneader at ~ 110 ° C, cooled and pulverized to obtain a molding material.

<< Evaluation Method >> Carbon black agglomerate: The obtained molding material is tableted and subjected to low-pressure transfer molding at 175 ° C. for 7 minutes.
Molded under the conditions of 0 kg / cm ² and 120 seconds, 100φ
(Thickness: 2 mm) was obtained. The obtained molded article was polished from the surface by 0.2 to 0.3 mm with a water-resistant abrasive paper having a particle size (GRIT No.) of 180, and the aggregate of carbon black on the entire molded article was counted. The number of test pieces is n = 10. [Determination method]-Number of carbon black aggregates A: Ten molded articles were observed, and a total of three or more aggregates having a size of 50 to 100 m was determined to be defective. -Number B of carbon black agglomerates: 10 molded articles were observed, and a total of one or more agglomerates exceeding 100 µm were judged to be defective. Spiral flow: Measured using a mold for measuring spiral flow according to EMMI-I-66, at a mold temperature of 175 ° C., an injection pressure of 70 kg / cm ² , and a curing time of 120 seconds. Less than 60 cm was judged to be defective from the viewpoint of moldability. Appearance color: The appearance of the molded article was visually inspected, and a patchy one and a gray one were judged to be defective.

<Examples 2 to 5> The components were blended according to the formulation shown in Table 1, and a molding material was obtained in the same manner as in Example 1 and evaluated in the same manner. Table 1 shows the evaluation results. << Comparative Examples 1 to 5 >>
A molding material was obtained in the same manner as described above, and was similarly evaluated. Table 2 shows the evaluation results.

The characteristics of the carbon black used in the examples and comparative examples are shown below. Average particle diameter Specific surface area (nm) (m ² / g) Carbon black A 20 180 Carbon black B 15 260 Carbon black C 30 100 Carbon black D 8 540 Carbon black E 85 25 Carbon black F 15 600

[0014]

[Table 1]

[0015]

[Table 2]

[0016]

The semiconductor device using the epoxy resin composition of the present invention has a small amount of carbon black agglomerates, and can prevent leakage and conductivity between inner leads and between wires inside the semiconductor device. .

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Claims (2)

[Claims] 1. An epoxy resin, (B) a phenolic resin curing agent, (C) an inorganic filler, (D) a curing accelerator, (E) an average particle diameter of 10 to 50 nm, and Brunau.
A carbon black having a specific surface area of 80 to 400 m ² / g by an er-Emmett-Teller method is an essential component, and the epoxy resin composition contains 0.1 to 1.0% by weight of the carbon black. Epoxy resin composition. 2. A semiconductor device comprising a semiconductor element encapsulated with the epoxy resin composition according to claim 1.