JP2000165288A - Composite high frequency component and mobile communication unit using it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a composite high frequency component that requires no matching circuit and is made small in size and to obtain a mobile communication unit using it. SOLUTION: The composite high frequency component 10 comprises a diplexer 2, 1st-3rd high frequency switches 3-5, and 1st and 2nd filters 6, 7. Then the diplexer 2 comprises 1st inductors L11, L12 and 1st capacitors C11-C15. Furthermore, the 1st-3rd high frequency switches 3-5 comprise 1st and 2nd diodes D1, D2, 2nd inductors L21-L23, and 2nd capacitors C21-C23. Moreover, the 1st and 2nd filters 6, 7 comprise a 3rd inductor L31 and 3rd capacitors C31, C32.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite high frequency component and a mobile communication device using the same, and more particularly, to a composite high frequency component usable for three different communication systems and a mobile communication device using the same.

[0002]

2. Description of the Related Art At present, as a mobile communication device, a DCS (Dig) using a plurality of frequency bands, for example, a 1.8 GHz band is used.
ital Cellular System) and PCS (Personal Communica)
Services) and GSM (Glo
bal System for Mobile communications) has been proposed.

FIG. 5 is a block diagram showing a front-end portion of a general triple-band portable telephone, in which first and second communication systems having close frequencies have 1.8.
This shows an example in which DCS and PCS in the GHz band and GSM in the 900 MHz band are used in the third communication system having a different frequency from the DCS and the PCS.

The front end of the triple-band portable telephone includes an antenna 1, a diplexer 2, first to third high-frequency switches 3 to 5, first and second filters 6, 7,
Is provided. Diplexer 2 transmits DCS, P
Combines CS or GSM transmission signals and distributes received signals to DCS, PCS or GSM during reception. The first high-frequency switch 3 includes a DCS and a PC.
S is switched between the transmitter side of the S and the receiver side of the DCS and PCS, and the second high-frequency switch 4 is connected to the receiver Rxd of the DCS.
Side and the receiving section Rxp side of the PCS, and the third high-frequency switch 5 switches the transmitting section Txg side of the GSM and the receiving section Rxp.
It plays the role of switching between the g side. The first filter 6
The second filter 7 transmits and receives DCS and PCS transmission / reception signals and attenuates the second and third harmonics.
And attenuates the third harmonic.

[0005] Here, the operation of the triple band portable telephone will be described first in the case of DCS. At the time of transmission, the transmission unit Txdp common to the PCS is turned on by the first high-frequency switch 3, and the transmission signal from the transmission unit Txdp is transmitted to the first filter 6, and the transmission that has passed through the first filter 6 The signals are multiplexed by the diplexer 2 and transmitted from the antenna 1. At the time of reception, the received signal received from the antenna 1 is demultiplexed by the diplexer 2, the received signal from the antenna 1 is sent to the first filter 6 on the DCS and PCS side, and
The receiving unit side is turned on by the high-frequency switch 3 and the received signal passing through the first filter 6 is passed through the second high-frequency switch 4.
And the second high-frequency switch 4 receives the DCS receiving unit R
When xd is turned on, the received signal that has passed through the second high-frequency switch 4 is sent to the DCS receiving unit Rxd. It should be noted that transmission and reception are performed by the same operation when using the PCS.

Next, the case of GSM will be described. At the time of transmission, the transmission unit Txg is turned on by the third high-frequency switch 5, the transmission signal from the transmission unit Txg is transmitted to the second filter 7, and the transmission signal passing through the second filter 7 is transmitted to the diplexer 2 And transmitted from the antenna 1. At the time of reception, the received signal received from the antenna 1 is split by the diplexer 2, the received signal from the antenna 1 is sent to the second filter 7 on the GSM side, and the receiving unit Rxg Is turned on to send the reception signal that has passed through the second filter 7 to the reception unit Rxg.

[0007]

However, according to the triple band portable telephone which is one of the above-mentioned conventional mobile communication devices, an antenna, a diplexer, a DCS system,
A high frequency switch and a filter constituting the GSM system are discretely mounted one by one on a circuit board. Therefore, in order to ensure matching characteristics, attenuation characteristics, or isolation characteristics of each component, a diplexer and a high frequency switch are required. , It is necessary to add a matching circuit. For this reason, there has been a problem that the circuit board becomes large due to the increase in the number of components and the mounting area accompanying it, and as a result, the triple-band portable telephone (mobile communication device) becomes large.

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and it is an object of the present invention to provide a composite high-frequency component which does not require a matching circuit and which can be downsized, and a mobile communication device using the same. The purpose is to provide.

[0009]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, a composite high-frequency component according to the present invention comprises first and second communication systems having close frequencies, and the first and second communication systems. A composite high-frequency component constituting a front-end unit corresponding to a third communication system having a different frequency, wherein transmission signals from the first to third communication systems are combined at the time of transmission and received. A diplexer for distributing a received signal to the first to third communication systems, and a diplexer for separating the signal into a transmitting unit of the first and second communication systems and a receiving unit of the first and second communication systems. 1 high-frequency switch, a second high-frequency switch separated into a receiving unit of the first communication system and a receiving unit of the second communication system, and a transmitting unit and a receiving unit of the third communication system. The first to separate A high frequency switch, a first filter for transmitting and receiving signals of the first and second communication systems, and a second filter for transmitting and receiving signals of the third communication system. Characterized by being integrated with a ceramic multilayer substrate obtained by laminating the above sheet layers.

[0010] Further, at least one of the first and second filters is arranged on the side of the transmitting section, which is located downstream of the high-frequency switch.

Further, the diplexer includes a first inductance element and a first capacitance element, and the first to third high frequency switches include first and second switching elements and a second inductance element. , And a second capacitance element, and the first and second filters are each formed of a third inductance element and a third capacitance element, and the first to third inductance elements, It is preferable that the first to third capacitance elements and the first and second switching elements are built in or mounted on the ceramic multilayer substrate and are connected by connection means formed inside the ceramic multilayer substrate. Features.

A mobile communication device according to the present invention is characterized by using the above-described composite high-frequency component.

According to the composite high frequency component of the present invention, the diplexer, the first to third high frequency switches, and the first and second filters constituting the composite high frequency component are formed by stacking a plurality of sheet layers made of ceramics. Matching characteristics of each component,
Attenuation characteristics or isolation characteristics can be ensured, and accordingly, a matching circuit between the diplexer and the first and third high-frequency switches becomes unnecessary.

According to the mobile communication device of the present invention, since a composite high-frequency component that does not require a matching circuit is used, the size of a circuit board constituting a front-end unit corresponding to three communication systems is reduced.

[0015]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a circuit diagram of a first embodiment of the composite high-frequency component of the present invention. The composite high-frequency component 10 includes the diplexer 2 shown in the block diagram of FIG.
High frequency switches 3 to 5, first and second filters 6,
And DCS, which is the first to third communication systems.
(1.8 GHz band), PCS (1.8 GHz band), GS
It constitutes a part of the front end unit corresponding to M (900 MHz band).

The first port P of the diplexer 2
21, an antenna 1; a second port P22, a first port P61 of the first filter 6;
3 is connected to the first port P71 of the second filter 7 respectively.

The second port P of the first filter 6
Reference numeral 62 denotes a first port P31 of the first high-frequency switch 3.
Is connected to the second port P of the first high-frequency switch 3.
32 has a common transmitting unit Txdp for DCS and PCS,
The first port of the second high-frequency switch 4 is connected to the third port P33.
Are connected respectively.

Further, a DCS receiving section Rxd is connected to the second port P42 of the second high-frequency switch 4, and a PCS receiving section Rxp is connected to the third port P43.

Further, the second port P of the second filter 7
72 has a first port P51 of the third high-frequency switch 5;
Is connected to the second port P of the third high-frequency switch 5.
52, a GSM transmitting unit Txg is connected to a third port P53.
Is connected to a GSM receiving unit Rxg.

The diplexer 2 includes first inductors L11 and L12, which are first inductance elements, and first inductors L11 and L12.
The first capacitors C11 to C11 which are the capacitance elements
C15.

The first capacitors C11 and C12 are connected in series between the first port P21 and the second port P22, and their connection point is connected to the first inductor L11.
And via a first capacitor C13.

A parallel circuit including a first inductor L12 and a first capacitor C14 is connected between the first port P21 and the third port P23, and the third port P23 of the parallel circuit is connected to the third port P23. Grounded via a first capacitor C15.

The first high-frequency switch 3 includes first and second diodes D1 and D1, which are first switching elements.
2. It is composed of second inductors L21 to L23, which are second inductance elements, and second capacitors C21 to C23, which are second capacitance elements.

Then, a first diode D1 is connected between the first port P31 and the second port P32 such that the cathode is on the first port P31 side, and the second diode is connected to the first diode D1. A series circuit composed of the inductor L21 and the second capacitor C21 is connected in parallel.

The first diode D1 is connected to the second port P32, that is, the anode is connected to the second inductor L2.
2 and the second capacitor C22.
A first control terminal Vc31 is provided at a connection point between the inductor L22 and the second capacitor C22.

Further, a second inductor L23 is connected between the first port P31 and the third port P33,
The third port P33 side of the second inductor L23 is the second port
, And a second control terminal Vc32 is provided via a resistor R at a connection point between the cathode of the second diode D2 and the second capacitor C23.

At this time, the second inductor L21 connected in parallel to the first diode D1 is a parallel trap coil, and the second inductor L22 is a choke coil.

The first filter 6 includes a third inductor L31 as a third inductance element, and third capacitors C31 and C32 as third capacitance elements.
It consists of.

Then, a third inductor L31 is connected in series between the first port P61 and the second port P62, and a third capacitor C3 is connected to the third inductor L31.
1 are connected in parallel.

The second port P62 side of the third inductor L31 is grounded via a third capacitor C32.

The second and third high-frequency switches 4 and 4
Reference numeral 5 denotes a configuration similar to that of the first high-frequency switch 3, and a second filter 7 has a configuration similar to that of the first filter 6.

FIG. 2 is an exploded perspective view of a main part of the composite high-frequency component having the circuit configuration of FIG. Composite high-frequency component 10
Includes a ceramic multilayer substrate 11, which is not shown in the drawing. Although not shown, the first inductors L11 and L12 constituting the diplexer 2, the first capacitors C11 to C15, and the first high-frequency switch 3 Second inductors L21 and L23, second capacitors C21 and C21
22, the second inductor L2 of the second high-frequency switch 4
1, L23, second capacitors C21, C22, second inductors L21, L23 of the third high-frequency switch 5,
The second capacitors C21 and C22, the third inductor L31 forming the first filter 6, and the third capacitor C
31 and C32, a third inductor L31 constituting the second filter 7, and third capacitors C31 and C32 are respectively built therein.

On the surface of the ceramic multilayer substrate 11, first and second diodes D1 and D2 constituting a first high-frequency switch 3 composed of chip components, a second inductor (choke coil) L22, and a second Capacitor C
23, a resistor R, a first high frequency switch 4
And second diodes D1 and D2, a second inductor (choke coil) L22, a second capacitor C23,
A resistor R, first and second diodes D1 and D2 constituting a third high-frequency switch 5, a second inductor (choke coil) L22, a second capacitor C23, and a resistor R are mounted, respectively.

Further, 14 external terminals Ta to Tn are formed by screen printing or the like from the side to the bottom of the ceramic multilayer substrate 11. Among these external terminals Ta to Tn, six external terminals Ta to Tf are on one long side of the ceramic multilayer substrate 11 and six external terminals Th to Tf.
Tm is the other long side of the ceramic multilayer substrate 11 and the remaining 2
The external terminals Tg and Tn are formed on the respective opposite short sides of the ceramic multilayer substrate 11 by screen printing or the like.

The external terminals Ta to Tn are respectively connected to the first port P21 of the diplexer 2, the second port P32 of the first high-frequency switch 3, and the second port P2 of the second and third high-frequency switches 4 and 5. And third ports P42, P
43, P52, P53, first to third high-frequency switches 3
To the first and second control terminals Vc31, Vc32, Vc
c41, Vc42, Vc51, Vc52, and ground terminals.

On the ceramic multilayer substrate 11, a metal cap 12 is placed so as to cover the surface of the ceramic multilayer substrate 11. At this time, the metal cap 12 and the external terminals Tg and Tn serving as ground terminals provided on each of the opposite short sides of the ceramic multilayer substrate 11 are connected.

Here, the operation of the composite high frequency component 10 having the circuit configuration of FIG. 1 will be described. First, when transmitting a DCS or PCS (1.8 GHz band) transmission signal, the first high-frequency switch 3 applies 1 V to the first control terminal Vc 31 and 0 V to the second control terminal Vc 32. By connecting the first port P31 and the second port P32 of the first high-frequency switch 3, the DCS or PCS transmission signal passes through the first high-frequency switch 3, the first filter 6, and the diplexer 2. And transmitted from the antenna 1. At this time, the first filter 6 passes the DCS and PCS transmission signals and attenuates the second harmonic and the third harmonic.

The second and third high-frequency switches 4, 4
5, the first control terminals Vc41 and Vc51
Is applied to the second control terminals Vc42 and Vc52 to shut off the second and third high-frequency switches 4 and 5, respectively.

Next, when transmitting a GSM (900 MHz band) transmission signal, the third high-frequency switch 5 applies 1 V to the first control terminal Vc 51 and 0 V to the second control terminal Vc 52. By connecting the first port P51 and the second port P52 of the third high-frequency switch 5, the GSM transmission signal passes through the third high-frequency switch 5, the second filter 7, and the diplexer 2, and Sent from 1. At this time, the second filter 7 transmits the GSM transmission signal and attenuates the third harmonic.

The first and second high-frequency switches 3 and
4, the first control terminals Vc31 and Vc41
Is applied to the second control terminals Vc32 and Vc42 to shut off the first and second high-frequency switches 3 and 4.

Next, when receiving the DCS reception signal, the first high-frequency switch 3 applies 0 V to the first control terminal Vc 31 and 1 V to the second control terminal Vc 32 to apply the first high-frequency switch. The first port P31 and the third port P33 of the switch 3 are connected to each other, 0 V is applied to the first control terminal Vc41 in the second high-frequency switch 4,
By applying 1 V to the second control terminal Vc42,
By connecting the first port P41 and the third port P43 of the high-frequency switch 4, the DCS reception signal received from the antenna 1 is connected to the diplexer 2, the first filter 6, and the first and second filters. The signal passes through the high frequency switches 3 and 4 and is sent to the DCS receiving unit Rxd. At this time, the first filter 6 passes the DCS reception signal and attenuates the second harmonic and the third harmonic.

In the third high-frequency switch 5, 0 V is applied to the first control terminal Vc51 and the second control terminal Vc5
2 is applied with 1 V, and the third high-frequency switch 5 is cut off.

Next, when receiving the PCS reception signal, the first high-frequency switch 3 applies 0 V to the first control terminal Vc 31 and 1 V to the second control terminal Vc 32 to apply the first high-frequency switch. The first port P31 and the third port P33 of the switch 3 are connected, and 1 V is applied to the first control terminal Vc41 in the second high-frequency switch 4,
By applying 0 V to the second control terminal Vc42,
By connecting the first port P41 and the second port P42 of the high-frequency switch 4, the PCS reception signal received from the antenna 1 is connected to the diplexer 2, the first filter 6, and the first and second filters. The signal passes through the high frequency switches 3 and 4 and is sent to the receiving section Rxp of the PCS. At this time, the first filter 6 passes the PCS reception signal and attenuates the second harmonic and the third harmonic.

In the third high-frequency switch 5, 0 V is applied to the first control terminal Vc51, and the second control terminal Vc5
2 is applied with 1 V, and the third high-frequency switch 5 is cut off.

Next, when receiving a GSM reception signal, the third high-frequency switch 5 applies 0 V to the first control terminal Vc 51 and 1 V to the second control terminal Vc 52 to apply the third high-frequency switch 5. By connecting the first port P51 and the third port P53 of the switch 5,
The GSM reception signal received from the antenna 1 passes through the diplexer 2, the second filter 7, and the third high-frequency switch 5, and is sent to the GSM reception unit Rxg. At this time, the second filter 7 passes the GSM reception signal,
The third harmonic is attenuated.

The first and second high-frequency switches 3, 3
4, the first control terminals Vc31 and Vc41
Is applied to the second control terminals Vc32 and Vc42 to shut off the first and second high-frequency switches 3 and 4.

According to the composite high-frequency component of the first embodiment described above, the diplexer, the first to third high-frequency switches, and the first and second filters constituting the composite high-frequency component are replaced with a plurality of sheets made of ceramics. Since the layers are integrated into a ceramic multilayer substrate, the matching characteristics, attenuation characteristics, or isolation characteristics of each component can be ensured. Accordingly, the diplexer, the first and third high-frequency switches, Is unnecessary.

Therefore, the size of the composite high-frequency component can be reduced. Incidentally, the diplexer, the first to third high-frequency switches, and the first and second filters are 6.3.
It has become possible to integrate it into a ceramic multilayer substrate having a size of 5 mm × 5 mm × 2 mm.

The diplexer comprises a first inductor and a first capacitor, and the first to third high-frequency switches comprise first and second diodes, a second inductor, and a second capacitor. The first and second filters are composed of a third inductor and a third capacitor, and they are built in or mounted on the ceramic multilayer substrate, and are connected by connection means formed inside the ceramic multilayer substrate. Since they are connected, the composite high-frequency component can be configured with one ceramic multilayer substrate, and downsizing can be realized. In addition, the loss due to wiring between components can be improved, and as a result, the loss of the entire composite high-frequency component can be improved.

Further, since the length of the strip line electrodes serving as inductors can be shortened by the wavelength shortening effect, the insertion loss of these strip line electrodes can be improved. As a result, it is possible to reduce the size and the loss of the composite high-frequency component. Therefore, miniaturization and high performance of the mobile communication device equipped with the composite high-frequency component can be realized at the same time.

FIG. 3 is a block diagram showing a second embodiment of the composite high-frequency component according to the present invention. The composite high-frequency component 20 is different from the composite high-frequency component 10 of the first embodiment (FIG. 1) in the arrangement positions of the first and second filters 6 and 7.

That is, the first filter 6 is connected to the first high-frequency switch 3 and the common transmission section Txdp of the DCS and PCS.
Between the second high-frequency switch 4 and the third high-frequency switch 4.
And a GSM transmission unit Txg.

According to the composite high-frequency component of the second embodiment, since the filter is disposed between the high-frequency switch and the transmission unit, the distortion of the high-output amplifier in the transmission unit is reduced during transmission. It can be attenuated by a filter. Therefore, insertion loss on the receiving side can be improved.

FIG. 4 is a block diagram showing a part of the configuration of a triple band portable telephone as a mobile communication device.
This shows an example in which DCS and PCS in the 1.8 GHz band are combined with GSM in the 900 MHz band. The triple-band mobile phone 30 includes the antenna 1 and the composite high-frequency component 10 (FIG. 1).

The port P1 of the composite high-frequency component 10
1 has antennas 1 at ports P32, P42, P43,
P52 and P53 have a common transmission unit T for DCS and PCS.
xdp, PCS receiving unit Rxp, DCS receiving unit Rx
d, GSM transmitting unit Txg, GSM receiving unit Rxg,
Connected respectively.

According to the above-described triple-band portable telephone, since a small and low-loss composite high-frequency component is used, a mobile communication device equipped with the composite high-frequency component can be reduced in size and improved in performance. .

The same effect can be obtained by using the composite high frequency component 20 (FIG. 3) for the composite high frequency component 10.

[0058]

According to the composite high-frequency component of the first aspect, the diplexer, the first to third high-frequency switches, and the first and second filters that constitute the composite high-frequency component are formed of a plurality of ceramic sheet layers. Since the components are integrated into a laminated ceramic multilayer substrate, matching characteristics, attenuation characteristics, or isolation characteristics of each component can be ensured. Accordingly, the distance between the diplexer and the first and third high-frequency switches can be improved. Is unnecessary.

Therefore, since the number of components can be reduced, it is possible to reduce the size of the composite high-frequency component constituting the front end corresponding to the first to third communication systems.

According to the composite high-frequency component of the second aspect, since the filter is disposed between the high-frequency switch and the transmission section, the distortion of the transmission signal by the high-output amplifier included in the transmission section can be attenuated. Therefore, the insertion loss of the receiving unit can be improved.

According to the third aspect of the present invention, the diplexer includes the first inductance element and the first capacitance element, and the first to third high-frequency switches include the first and second switching elements. , A second inductance element, and a second capacitance element,
The first and second filters include a third inductance element and a third capacitance element,
Since they are built in or mounted on the ceramic multilayer substrate and are connected by connecting means formed inside the ceramic multilayer substrate, a composite high-frequency component can be constituted by one ceramic multilayer substrate, and further downsizing can be realized.
In addition, the loss due to wiring between components can be improved, and as a result, the loss of the entire composite high-frequency component can be improved.

Further, the length of the strip line electrodes serving as each inductance element can be shortened by the wavelength shortening effect, so that the insertion loss of these strip line electrodes can be improved. As a result, it is possible to reduce the size and the loss of the composite high-frequency component.

According to the mobile communication device of the fifth aspect, since a small and low-loss composite high-frequency component is used, the miniaturization and high performance of the mobile communication device equipped with the composite high-frequency component are realized. it can.

[Brief description of the drawings]

FIG. 1 is a circuit diagram of a first embodiment according to a composite high-frequency component of the present invention.

FIG. 2 is an exploded perspective view of a main part of the composite high-frequency component of FIG.

FIG. 3 is a circuit diagram of a composite high-frequency component according to a second embodiment of the present invention.

FIG. 4 is a block diagram showing a part of the configuration of a mobile communication device using the composite high-frequency component of FIG.

FIG. 5 is a block diagram showing a configuration of a front end unit of a general triple-band mobile phone (mobile communication device).

[Explanation of symbols]

10, 20 Composite high frequency component 2 Diplexer 3 to 5 First to third high frequency switch 6, 7 First and second filter 11 Ceramic multilayer substrate 30 Mobile communication device (triple band mobile phone) C11 to C15, C21 ~ C23, C31, C32
First to third capacitance elements D1, D2 First, second switching elements L11, L12, L21 to L23, L31 First to third
Third inductor element Txdp, Txg transmitter Rxd, Rxp, Rxg receiver

Claims (4)

[Claims] 1. A composite high-frequency wave comprising a front-end unit corresponding to first and second communication systems having frequencies close to each other and a third communication system having a frequency different from the first and second communication systems. A diplexer that combines transmission signals from the first to third communication systems during transmission and distributes reception signals to the first to third communication systems during reception; A transmitting unit of the first and second communication systems and the first and second communication systems;
A first high-frequency switch for separating the signal into a receiving unit of the communication system, a second high-frequency switch for separating the signal into a receiving unit of the first communication system, and a receiving unit of the second communication system; A third high-frequency switch for separating into a transmitting unit and a receiving unit of the communication system, a first filter for transmitting and receiving signals of the first and second communication systems, and a transmitting and receiving signal of the third communication system A composite high-frequency component comprising a second filter that allows the passage of a ceramic sheet, and integrated with a ceramic multilayer substrate formed by laminating a plurality of ceramic sheet layers. 2. The composite high-frequency component according to claim 1, wherein at least one of the first and second filters is disposed on the side of the transmission unit subsequent to the high-frequency switch. 3. The diplexer includes a first inductance element and a first capacitance element,
The first to third high-frequency switches are composed of first and second switching elements, a second inductance element, and a second capacitance element, and the first and second high-frequency switches are provided.
Is composed of a third inductance element and a third capacitance element, the first to third inductance elements, the first to third capacitance elements, and the first and second capacitance elements. 3. The composite high-frequency component according to claim 1, wherein the switching element is built in or mounted on the ceramic multilayer substrate, and is connected by connection means formed inside the ceramic multilayer substrate. 4. A mobile communication device using the composite high-frequency component according to claim 1.