JP2000158580A - Metal body having insulating layer, heater using it, and hot roller for fixing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture a metal body having good moisture resistance by setting up the quantities of magnesium and oxygen elements in a metal surface in contact with an insulating layer of an organic material in an atomic ratio of a specified value or below. SOLUTION: In a metal body 1 of an aluminum pipe, the surface in which the quantity of elemental magnesium is set up at 25 atom % or below, and the quantity of elemental oxygen is set up at 55 atom % or below is cleaned and dried, and an insulating layer 2 is formed on the surface. Moreover, a heating element 3 comprising a print-formed electrode 5 containing Ag as a main component, Ni foil, and others is formed on the layer 2. After the electrode member 5 is fixed to the heating element 3 through a conductive adhesive 4, a releasing layer 6 is formed on the outer surface of the metal body 1 of aluminum. In this way, the adhesion between the insulating layer 2 and the metal body 1 is improved, and the peeling of the layer 2 can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal body having an insulating layer mainly made of an organic material on a surface thereof and a heater using the same. More specifically, the present invention relates to a package for mounting a semiconductor element and a copying machine. And a heater for fixing toner of an electrophotographic apparatus such as a printer.

[0002]

2. Description of the Related Art Conventionally, packages for mounting semiconductor elements are:
Ceramics were mainly used. However, in recent years, the density of a semiconductor device has been increased, and accordingly, the calorific value of the semiconductor device has been increased. When the temperature of a semiconductor element rises, the probability of malfunction of the element increases, so that cooling of the element has become an issue.

As a countermeasure, there is a movement to change the ceramics of the base material from conventional aluminum oxide to aluminum nitride having high thermal conductivity in order to improve the thermal conductivity of the package itself.

However, compared to aluminum oxide, aluminum nitride has not yet been put into practical use because the technology for internal wiring and external metallization has not been established.

Therefore, a package for a semiconductor element has been proposed in which a metal material having better thermal conductivity than ceramics is used as a base material and Ag or Cu is internally wired through an insulating organic material such as polyimide. In this type of package, the relative dielectric constant of the insulating layer can be reduced to about 4 by using an insulating organic material such as polyimide as the insulating layer, so that the effect of shortening the signal propagation delay time can be expected.

In a toner fixing device in an electrophotographic apparatus such as a printer, a heat roller having a heat generating means and a pressure roller are arranged to face each other, and the printed paper is passed between these rollers. The toner is fixed.

[0007] As the above-mentioned heat roller, a roller in which a heating element such as a halogen lamp is provided in a metal pipe such as aluminum or stainless steel has been used. However, since the heat generation efficiency is poor, a warm-up time of one minute or more is required. However, there is a problem that power consumption is large.

Therefore, recently, a heat roller for fixing a toner, which is equipped in a copying machine or the like, has a rapid temperature rise, high heat efficiency,
A heat roller of a direct heating type having a structure shown in FIG. 1 having a feature of low power consumption has recently been devised and is about to become mainstream. As shown in FIG. 1, the heat roller has a release layer 6 outside a metal pipe 1, an insulating layer 2 of high heat resistance such as polyimide inside, and a heating resistor 3 on the insulating layer. An electrode portion 5 for supplying power to the body is adhered by a conductive adhesive 4. When power is supplied to the electrode unit 5 from the power supply unit 7, the heating resistor 3 generates heat, and the heating resistor 3 passes through the insulating layer 2.
The structure is such that the metal pipe 1 is heated.

As described above, a metal body in which an insulating layer made of an organic material is formed on a metal body and a heating resistor or a wiring material containing Ag or Cu as a main component is disposed on or in the inside thereof has attracted attention. ing.

[0010]

However, considering the use environment of a metal body having an insulating layer used for a package for mounting a semiconductor element, a heat roller for fixing a printer, and the like, for example, drying at a low temperature in the middle of winter. It is used in various environments, such as when exposed to a humid atmosphere and when exposed to a hot and humid atmosphere during the rainy season. For example, the above-mentioned rapid temperature rising type heat roller often has an insulating layer in a metal pipe made of an organic material typified by polyimide, and thus has a stable operability particularly in a high-temperature and high-humidity environment. It becomes important. However, when the heat roller of the above-mentioned rapid temperature rise type is left in a high-temperature and high-humidity state and then rapidly rises in temperature, the moisture absorbed in the insulating layer evaporates instantaneously, and the stress generated at this time causes insulation. There was a risk that the layer would peel off from the metal pipe. The exfoliation of the insulating layer causes a problem in that the heating resistor on the insulating layer is cracked, and the heating resistor eventually generates abnormal heat, resulting in burning.

[0011]

An object of the present invention is to prevent the peeling of an insulating layer made of an organic material in a metal body having an insulating layer as described above. Another object of the present invention is to provide a metal body having an insulating layer made of an organic material on a surface typified by a package for mounting a semiconductor element or a heat roller for fixing of a printer, which can be operated.

[0012]

SUMMARY OF THE INVENTION The present invention relates to a metal body having an insulating layer mainly composed of an organic material on the surface, wherein the amount of magnesium element on the metal surface in contact with the insulating layer is 2%.
By adjusting the content to 5 atomic% or less, a metal body having good moisture resistance was produced. Further, by setting the amount of oxygen element on the surface of the metal body to 55 atomic% or less, a metal body having good moisture resistance was produced. These operations are each independently effective in preventing the insulating layer from peeling off from the metal body.

The present invention is characterized in that a heater, a heat roller for fixing, and a substrate for mounting a semiconductor element are formed using the metal body having the above-mentioned insulating layer.

[0014]

As a result of extensive studies by the present inventors, in a metal body having an insulating layer, peeling of the insulating layer which occurs when the metal body is operated after being left for a long time under a high temperature and high humidity condition, and magnesium on the metal surface. It has been found that there is a correlation between the amounts of elements.

That is, the magnesium element on the surface is an oxide or a hydroxide, and the insulating layer is formed from the surface of the metal body by volume expansion due to moisture absorption or rapid evaporation of the magnesium oxide or magnesium hydroxide. It is presumed that it will peel.

[0016] Further, regarding the influence of the oxygen element, if a brittle oxide layer is formed on the metal surface, the oxide layer is peeled off by the cycle of heating and cooling, and the insulating layer is easily peeled off.

Therefore, the metal body of the present invention can control the amount of oxygen and the amount of magnesium by controlling the heat treatment step in the manufacturing process and controlling the moisture and humidity, so that the adhesion between the metal body and the organic material can be improved. It is considered that a metal body provided with a strong and highly reliable insulating layer can be provided.

When polyimide is used as the organic material, the polyimide reacts with the magnesium phase,
The flexibility of the polyimide is lost. In particular, when aluminum is used as the metal body, in order to enhance corrosion resistance, magnesium is often contained, so that this tendency is remarkable. On the other hand, if the range of the present invention is used, the above disadvantages are eliminated. Can be.

The good adhesion between pure aluminum and polyimide is generally well known, but it has been found that the adhesion of aluminum oxide, aluminum oxide, is significantly reduced. in this way,
ADVANTAGE OF THE INVENTION According to this invention, the metal body which has an insulating layer which consists of an organic material on the surface and which is stable under high temperature and high humidity conditions can be provided.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG.

In FIG. 1, a heat roller includes a metal body 1 made of an aluminum pipe for support, an insulating layer 2 between a metal body 1 made of an aluminum pipe and a heating resistor 3,
Heating resistor 3, electrode members 5 connected to both ends of heating resistor 3, conductive adhesive 4 for fixing electrode member 5 to heating resistor 3, formed on outer surface of metal body 1 made of aluminum And a release layer 6 to be formed. Usually, polyimide is used as the insulating layer 2 and A
A material composed of a metal containing g as a main component and a matrix made of glass or a heat-resistant organic material is used.

The metal body 1 made of an aluminum pipe has a surface magnesium element content of 25 atomic% or less and an oxygen element content of 55 atomic% or less. These amounts
Precipitation of magnesium oxide on the metal pipe surface by passing through heat treatment processes such as annealing of the metal pipe and baking of the insulating layer, heating resistor, and release layer, water during washing of the metal pipe, and environment such as rainy season It changes due to hydration and oxidation of the surface of the metal pipe due to the adhesion of water due to dew condensation and the like, but by controlling these conditions to the above range, the adhesion between the insulating layer and the metal pipe is improved. Thus, it is possible to provide a heat roller for fixing a toner that can operate normally for a long period of time.

For example, after cleaning and drying the surface of a metal body 1 made of an aluminum pipe, the insulating layer 2 is quickly formed on the surface.
To form The insulating layer is usually formed a plurality of times in order to make the thickness uniform without defects. At this time, if the drying temperature is set to 300 ° C. or more, the magnesium element contained in the metal body precipitates on the surface to form an oxide layer. When the material layer absorbs moisture and is rapidly heated at the time of use, the water evaporates rapidly, and the insulating layer formed on the surface of the metal body is peeled off from the metal layer, resulting in generation of black spots. When the temperature is about 200 ° C., the amount of magnesium element on the surface of the metal body can be reduced to 25 atomic% or less. When the metal body is stored under low humidity conditions of 40% or less relative humidity so as not to absorb moisture, the amount of oxygen on the surface can be reduced to 55 atom% or less. It is also possible to obtain a metal body having good moisture resistance.

FIG. 2 shows an example in which the metal body of the present invention is applied to a ceramic heater. An insulating layer 2 is formed on a surface of a metal body 1 serving as a base material. Further, an electrode 5 mainly composed of Ag printed on the insulating layer 2 is formed.
A heating element 3 made of, for example, Ni foil or the like is formed. The surface of the metal body 1 has a magnesium element content of 55 atomic% or less and an oxygen element content of 25 atomic% or less. Insulating layer 2
For example, an organic material such as polyimide, polyimide amide, or epoxy is used. Further, the heating element 3 may be formed on the insulating layer, or may be formed in the insulating layer so as to be sandwiched between the insulating layers. Ag as a heating element material
And Ni, but noble metals typified by Pt and metals having good oxidation resistance of nichrome can be used depending on the application.

In the above embodiments of the present invention, the advantage of using the metal body as the base material is that the metal body has a higher degree of freedom in shape workability than other materials. By using the metal body of the present invention as a heater, the operation is stable even under a high-temperature and high-humidity condition. Therefore, the metal body can be used as a heater for defrosting a refrigerator in addition to the above.

FIG. 3 shows an example in which the metal body of the present invention is used for a substrate for mounting a semiconductor element.

In the case of a package for mounting a semiconductor element, an insulating layer 2 is formed on a metal body 1, and further, a semiconductor element mounting pad 9 and a wiring conductor 10 are formed on the surface thereof. The surface of the metal body before the formation of the insulating layer is adjusted to have a magnesium element content of 25 atomic% or less and an oxygen element content of 55 atomic% or less. An organic material such as polyimide, polyimide amide, or epoxy is used for the insulating layer. Since semiconductor elements with high-density wiring generate a large amount of heat when energized,
Cooling is required, but since the base material is a metal body and has a high thermal conductivity, cooling of the element is very advantageous.

When the metal body of the present invention is used for a substrate for mounting a semiconductor element, the insulating layer formed on the surface of the metal body is peeled off even when used under high-temperature and high-humidity conditions, and the wiring pattern is broken. It is possible to supply a good semiconductor element mounting substrate free from the occurrence of the problem.

As the material of the metal body of the present invention, Ni, Cu, brass, stainless steel or the like can be used in addition to the above. Further, as a material of the insulating layer, an imide resin having good heat resistance, an epoxy resin having good fixing strength, a silicon resin having high elasticity, or the like can be selected according to the application.

[0030]

Embodiment 1 In this embodiment, a metal body 1 made of an aluminum pipe is made of an aluminum alloy 5052 and has an outer diameter of 20 mm.
A metal body 1 made of aluminum pipe having a thickness of 1.0 mm and a length of 280 mm was subjected to heat treatment in a heat treatment furnace.
Heat treatment is performed at temperatures of 0, 350, 400, 450, and 500 ° C., respectively, to form a metal body 1 made of aluminum pipe.
Different amounts of magnesium oxide layers were deposited on the surface.
The amount of oxygen was 12 hours in water at 90 ° C.,
The amount of oxygen on the surface of the metal body 1 made of an aluminum pipe was varied by immersion for three days. As an insulating layer on the inner peripheral surface of the aluminum pipe subjected to the above-described processing and the untreated aluminum pipe, polyimide is formed to a thickness of 50 μm by a known spray coating or the like, and the insulating layer is formed by baking at a temperature of 350 ° C. or more. A metal body 1 made of the formed aluminum pipe was produced.

The heat generating resistor 3 is formed by mixing silver and palladium as conductive materials and a PbO-based crystallized glass as a bonding layer, and transferring the mixed glass using a known screen printing method. It was formed by baking.

The release layer on the aluminum pipe was formed of Teflon by a known spray coating method (baking at 390 ° C.). The electrode portion 5 for supplying power to the heating resistor 3 was directly bonded to the heating resistor 3 with the conductive adhesive 4. Its shape is a cap as shown in FIG. 1, and power is supplied from the end by a sliding brush or the like.

Tables 1 and 2 show the results of a humidity resistance test performed on the thus prepared samples.

In the evaluation of the adhesion between the insulating layer and the metal body in this experiment, the heater to be evaluated first was set to 200 ° C. for 2 hours.
To remove water. Then 80 ℃ × 9
It is left in an environment of 8% RH, and 30 mg of water is absorbed by polyimide as an insulating layer. In this experiment, the weight was measured every 4 hours with an electronic balance, and the weight was left to increase by 30 mg. Incidentally, at the time of this evaluation, a predetermined amount of water was absorbed at 20 hours. Immediately after water absorption, power is applied to the heater, the temperature is raised from room temperature to 200 ° C. at a rate of 20 ° C./sec, and immediately after reaching 200 ° C., the current is stopped and the product is cooled naturally. Thereafter, the electrode portion was removed, and it was confirmed whether the insulating layer was peeled off from the metal surface and blisters did not occur. Those with blisters were evaluated as x, and those without blisters were evaluated as o.

The amounts of magnesium and oxygen on the metal surface were measured by peeling off the insulating layer from the sample after the above-mentioned evaluation, exposing the metal surface, and then measuring the surface on which the insulating layer was formed by ESCA. (Made by ULVAC PHI: Qua
ntum-2000 type) and qualitatively analyze the surface layer. Thereafter, the measurement range was 100 μm diameter, the output was 20 W, and the output was 0.2 mm.
All the elements detected by the qualitative analysis described above were measured as atomic% in the depth direction while etching at a rate of 25 nm / sec every 5 nm to a depth of 250 nm (measurement depth was Si
O ₂ film equivalent). One example of the measurement results is shown in FIG. Also,
Conversion to atomic% was performed as follows. The intensity distribution of each element in the depth direction is determined by the high purity of each element (99.99%).
By dividing the product by the strength when measured under the same conditions, the amount of each element at each depth was determined, and the amount of each element determined at each depth was calculated as atomic% by the following formula. .

Atomic% of element A = Amount of element A / sum of amounts of all measured elements * 100 (%) Thereafter, atomic% at the maximum of each element within the measurement range.
Was read and the numerical value was calculated as the amount of each element.

The results are shown in Tables 1 to 6 and Tables 2 to 13.
7 is shown. The oxygen content of the sample shown in Table 1 was 55
Atomic% or less. The magnesium element content of the samples shown in Table 2 is 25 atomic% or less. When the amount of magnesium element exceeds 25 atomic% as in 1 and 2, blisters occur in the insulating layer 8. On the other hand, when the amount of the oxygen element exceeds 55 atomic% as in 13 and 14, blisters are generated in the insulating layer 8, which is not preferable. When the amount of magnesium element is controlled to 25 atomic% or less as in Tables 3 to 6, no blistering occurs. Further, when the amount of oxygen element was controlled to 55 atomic% or less as shown in Tables 17 to 17, blisters did not occur.

[0038]

[Table 1]

[0039]

[Table 2]

Embodiment 2 Hereinafter, an embodiment of the present invention will be described with reference to FIG.

In FIG. 2, the heat roller includes a metal body 1 made of a supporting iron pipe and a metal body 1 made of an iron pipe.
An insulating layer 2, a heating resistor 3, and an electrode portion 5 joined to both ends of the heating resistor 3 by a conductive adhesive 4.

In this embodiment, the material of the metal body 1 made of an iron pipe is STKM11A, the outer diameter is 20 mm, and the thickness is 1.
By using a metal body 10 made of an iron pipe having a length of 0 mm and a length of 280 mm, the metal body 10 was left in a thermo-hygrostat at 30 ° C. and 90% RH for 10 minutes, 30 minutes, 1 hour, and 2 hours. The amount of oxygen on the surface of the metal body 1 was varied. As an insulating layer on the inner peripheral surface of the iron pipe that has been subjected to the above-described processing and the untreated iron pipe, polyimide is formed to a thickness of 50 μm by a known spray coating or the like, and baked at a temperature of 350 ° C. or more, so that the insulating layer A metal body 1 made of an iron pipe formed with No. 2 was produced.

The heat generating resistor 3 is formed by mixing silver and palladium as conductive materials and a PbO-based crystallized glass as a bonding layer, and transferring the mixed glass using a known screen printing method. It was formed by baking.

The release layer 6 on the metal body 1 made of iron pipe is coated with Teflon by a known spray coating method (390 ° C.).
(Firing). The electrode portion 5 for supplying power to the heating resistor 3 was directly bonded to the heating resistor 3 with the conductive adhesive 4. Its shape is a cap as shown in FIG. 1, and power is supplied from the end by a sliding brush or the like.

The evaluation results are shown in Tables 18 to 22.
If the amount of oxygen element exceeds 55 atomic% as in 18 and 19, blisters occur in the insulating layer 8. In contrast, 20
When the amount of oxygen element was controlled to 55 atomic% or less as in 22, no blistering occurred. Embodiment 3 As an example of a shape other than a pipe, a method of manufacturing a plate-like heater will be described with reference to FIG.

The metal body 1 has a width of 50 mm and a length of 280
An aluminum alloy 5052 having a thickness of 1 mm and a thickness of 1 mm was prepared, and this was treated with a heat treatment furnace at 200, 350, 400, and 45.
Heat treatment was performed at temperatures of 0 and 500 ° C., respectively, to deposit different amounts of magnesium oxide layers on the surface of the metal body 1 made of an aluminum plate. With respect to the amount of oxygen, the amount of oxygen on the surface of the metal body 1 made of an aluminum plate was varied by immersing it in water at 90 ° C. for 12 hours for 1 day, 2 days, and 3 days. An aluminum alloy 5052, a width of 50 mm, a length of 280 mm, and a thickness of 1.0 mm was used as the metal body 1 made of the aluminum plate prepared in this way, and the metal body 1 made of the aluminum plate was heated in a heat treatment furnace at 200 ° C. for 2 hours.
After performing a dry heat treatment for a long time, a 50 μm-thick polyimide film was formed as an insulating layer on the surface of the metal body 1 made of an aluminum plate by a known spray coating or the like and baked at a temperature of 350 ° C. or more.

The heat generating resistor 3 is formed by mixing silver and palladium as conductive materials and a PbO-based crystallized glass as a bonding layer and transferring the mixed glass by a known screen printing method. It was formed by baking.

The plate heater thus manufactured is
Since the amount of magnesium element deposited on the surface is small and the amount of oxygen on the surface can be reduced, the insulating layer does not peel off even when used under high temperature and high humidity conditions.

The evaluation results were obtained by comparing 7 to 12 in Table 1 and 23 to 23 in Table 2.
27. In the case where the amount of magnesium element on the surface of the metal body 1 exceeds 25 atomic% as shown in FIGS.
In the case where the oxygen element amount exceeded 55 atomic%, blistering occurred in the insulating layer 8. On the other hand, blisters did not occur in 9 to 12 in which the amount of magnesium element was 25 atomic% or less and in 25 to 27 in which the amount of oxygen element was controlled to 55 atomic% or less.

Embodiment 4 An example in which the metal body of the present invention is used for a substrate for mounting a semiconductor element will be described in detail with reference to FIG. First, the metal body 1 was washed in methylene chloride vapor, and then the insulating layer 2 was formed on the metal body 1. Polyimide was used as the insulating layer. To improve the adhesion of the base material to the metal body 1, 15
An insulating film having a thickness of 60 μm was formed by laminating four times each of μm. Further, the semiconductor element mounting pad 9 and the wiring conductor 1 are provided on the surface thereof.
0 was formed by a printing method.

The surface of the metal body 1 before the formation of the insulating layer has a magnesium element content of 55 atomic% or less and an oxygen element content of 25 atomic%.
It has been adjusted below. As the insulating layer, polyimide,
An organic material such as polyimide amide or epoxy is used.
A semiconductor element with high-density wiring requires a large amount of heat when energized, and therefore requires cooling. However, since the base material is a metal body and has a high thermal conductivity, cooling of the element is very advantageous.

When the metal body of the present invention is used for a substrate for mounting a semiconductor element, the insulating layer formed on the surface of the metal body may be peeled off and the wiring pattern may be broken even when used under high temperature and high humidity conditions. But no longer occurs.

The substrate for mounting a semiconductor element manufactured as described above can be used stably even in an environment where the humidity greatly changes.

[0054]

According to the present invention, the adhesion between the insulating layer and the metal body is controlled by controlling the amount of magnesium element on the metal surface in close contact with the insulating layer to 25 atomic% or less and the amount of oxygen to 55 atomic% or less. It is possible to improve the force and prevent peeling of the insulating layer due to repetition of heating and cooling during actual use.

[Brief description of the drawings]

FIG. 1A is a side view showing a fixing heat roller of the present invention, and FIG. 1B is a sectional view taken along line XX in FIG.

FIG. 2 (a) is a perspective view showing a heater of the present invention,
(B) is a YY sectional view in (a).

FIG. 3 is a perspective view showing a semiconductor element mounting substrate using a metal body having an insulating layer according to the present invention.

FIG. 4 is a diagram showing an example of an ESCA measurement chart.

[Explanation of symbols]

 1: Metal body 2: Insulating layer 3: Heating resistor 4: Conductive adhesive 5: Electrode section 6: Release layer 7: Power supply section 8: Insulating layer 9: Semiconductor element mounting pad 10: Wiring conductor

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) // H05K 1/05 H01L 23/36 C

Claims (3)

[Claims] 1. A metal having an insulating layer, wherein an insulating layer made of an organic material is provided on a metal surface having a magnesium element content of 25 atomic% or less and / or an oxygen element content of 55 atomic% or less. body. 2. A heater according to claim 1, wherein a heating element is provided on or in the insulating layer of the metal body provided with the insulating layer. 3. A fixing heat roller comprising: a metal body provided with the insulating layer according to claim 1 having a cylindrical shape; and a heating element provided on a surface of the metal body.