JP2000150691A - Package for housing optical semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable to keep an optical semiconductor device at an appropriate temperature even by a low-power electronic cooling device by effectively preventing the heat of the electronic cooling device from acting on the optical semiconductor device, and to operate the optical semiconductor device normally and in a stable condition over the long term. SOLUTION: A package for housing an optical semiconductor device comprises a substrate 1 having a placing part 1a on the top of which the optical semiconductor device 4 is placed through an electronic cooling device 5, a frame 2 having a through hole 2a and a notch 2b on its sides which is mounted on the substrate 1 in such a way that it surrounds the optical semiconductor device placing part 1a, a cylindrical fixing element 9 which is mounted in the through hole 2a or on the frame around the through hole 2a and to which an optical fiber element 11 is joined, a ceramic terminal 6 which is mounted on the notch 2b and on which a metallized wiring layer 8 is formed for electrically connecting electrodes of the optical semiconductor device 4 to an insulator 7, and a lid 3 which is mounted on the top of the frame 2 for hermetically sealing the optical semiconductor device 4. In this case, the insulator 7 of the ceramic terminal 6 is made of mullite sintered compact.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor element housing package for housing an optical semiconductor element.

[0002]

2. Description of the Related Art Conventionally, an optical semiconductor device housing package for housing an optical semiconductor device is generally made of a metal material such as an iron-nickel-cobalt alloy or a copper-tungsten alloy. A base having a mounting portion to be mounted with the electronic cooling element interposed therebetween, and a base material joined to the optical semiconductor device mounting portion via a brazing material such as silver brazing so as to surround the mounting portion; A frame made of a metal material such as an iron-nickel-cobalt alloy having a through-hole and a notch, and a frame around the through-hole or the through-hole of the frame, and an optical signal is transmitted inside. A cylindrical fixing member made of a metal material such as an iron-nickel-cobalt alloy having a space, and a melting point of the cylindrical fixing member of 300 to 400 ° C.
A translucent member made of amorphous glass or the like that closes the inside of the fixing member attached via a low melting point brazing material such as a gold-tin alloy, and an aluminum oxide that is inserted into the cutout of the frame and is inserted. A ceramic terminal body in which a metallized wiring layer in which each electrode of the optical semiconductor element is electrically connected to an insulator made of a porous sintered body through a bonding wire is attached to an upper surface of the frame, A lid member for hermetically sealing the optical semiconductor element, and mounting and fixing the optical semiconductor element on the optical semiconductor element mounting portion of the base with an electronic cooling element such as a Peltier element interposed therebetween. Each electrode of the optical semiconductor element is electrically connected to the metallized wiring layer of the ceramic terminal body via a bonding wire, and thereafter, a lid member is joined to the upper surface of the frame, and the base, the frame, and the lid are separated from each other. Light guide inside the container An optical fiber member into the cylindrical fixing member accommodates the device in an airtight, for example, the optical semiconductor device as a product by attaching the YAG welding or the like.

In such an optical semiconductor device, while the optical semiconductor element is cooled by an electronic cooling element, optical excitation is caused to the optical semiconductor element by a drive signal supplied from an external electric circuit, and the excited light is transmitted through an optical fiber through a light transmitting member. It is used for high-speed communication and the like by transmitting and receiving the member and transmitting the inside of the optical fiber of the optical fiber member.

[0004]

However, in this conventional package for housing an optical semiconductor element, a metal material such as an iron-nickel-cobalt alloy or a copper-tungsten alloy or a ceramic terminal forming a base and a frame is used. Since the thermal conductivity of the aluminum oxide sintered body forming the insulator of the body is 15 W / m · k or more, the optical semiconductor element is cooled by an electronic cooling element such as a Peltier element or the like from an external electric circuit. When photo-excitation is performed by a supplied drive signal, the temperature of the upper surface of the electronic cooling element such as a Peltier element on which the optical semiconductor element is mounted is low, but the temperature of the lower surface in contact with the base is high (about 100 ° C.). Therefore, the heat generated by the electronic cooling element greatly affects the optical semiconductor element via the base, the frame, the ceramic terminal body, and the bonding wire, and this electronic cooling element It had a drawback that the cooling efficiency by the electronic cooling element of the optical semiconductor element is reduced greatly by heat. Therefore, conventionally, the output of the electronic cooling element is increased to absorb both the heat generated by the optical semiconductor element during operation and the heat of the electronic cooling element transmitted to the optical semiconductor element via the base, the frame, and the like. Needed.

The present invention has been devised in view of the above-mentioned drawbacks, and has as its object to effectively prevent the heat of the electronic cooling element from acting on the optical semiconductor element, and to provide the optical semiconductor element with a low-output electronic cooling element. It is an object of the present invention to provide an optical semiconductor element housing package that can always operate the optical semiconductor element normally and stably for a long time by setting the temperature of the optical semiconductor element to an appropriate temperature.

[0006]

According to the present invention, there is provided a base having a mounting portion on which an optical semiconductor device is mounted via an electronic cooling element on an upper surface, and surrounding the optical semiconductor device mounting portion on the base. Attached to the frame body having a through-hole and a cutout on the side, and a tubular fixing member attached to the through-hole or the frame around the through-hole and joined to the optical fiber member,
A ceramic terminal body having a metallized wiring layer formed in the notch and having an insulator electrically connected to each electrode of the optical semiconductor element, and an optical semiconductor element attached to an upper surface of the frame body; And a lid member for hermetically sealing the ceramic terminal body, wherein the insulator of the ceramic terminal body is made of a mullite sintered body.

According to the package for housing an optical semiconductor element of the present invention, the insulator of the ceramic terminal body is made to have a thermal conductivity of about 5 W.
When the optical semiconductor device is cooled by an electronic cooling device such as a Peltier device and is optically excited by a drive signal supplied from an external electric circuit because the optical semiconductor device is formed of a mullite sintered body that is low and does not easily conduct heat. Even if the heat generated by the electronic cooling element tries to act on the optical semiconductor element via the base, the frame, the ceramic terminal and the bonding wire, the transfer of the heat is cut off by the ceramic terminal and acts on the optical semiconductor element. However, as a result, the cooling efficiency of the optical semiconductor element by the electronic cooling element becomes high, and the optical semiconductor element is always kept at an appropriate temperature and the optical semiconductor element operates normally and stably for a long period of time even with a low-output electronic cooling element. Becomes possible.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the accompanying drawings. 1 to 3 show an embodiment of the package for housing an optical semiconductor element according to the present invention, wherein 1 is a base, 2 is a frame, and 3 is a lid member. The base 1, the frame 2, and the cover 3
A container for accommodating the optical semiconductor element 4 is formed therein.

The base 1 functions as a support member for supporting the optical semiconductor element 4, and has a mounting section 1a for mounting the optical semiconductor element 4 at a substantially central portion of the upper surface thereof. The optical semiconductor element 4 is bonded and fixed to the portion 1a with an adhesive such as a gold-silicon brazing material with an electronic cooling element 5 such as a Peltier element interposed therebetween.

The substrate 1 is made of a metal material such as an iron-nickel-cobalt alloy or a copper-tungsten alloy. It is manufactured by applying a conventionally known metal working method such as a working method or a punching working method.

The substrate 1 has a metal having excellent corrosion resistance on its outer surface and good wettability to a brazing material, specifically, a nickel layer having a thickness of 2 to 6 μm and a thickness of 0.5 to 5 μm. When the gold layers are sequentially applied by a plating method,
Can be effectively prevented from being oxidized and corroded, and an electronic cooling element 5 such as a Peltier element disposed below the optical semiconductor element 4 can be firmly adhered and fixed on the upper surface of the base 1. Therefore, the base 1 effectively prevents oxidative corrosion and has a thickness on its outer surface when an electronic cooling element 5 such as a Peltier element arranged on the upper surface below the optical semiconductor element 4 is firmly adhered and fixed. It is preferable that a nickel layer having a thickness of 2 to 6 μm and a gold layer having a thickness of 0.5 to 5 μm are sequentially applied by a plating method.

A frame 2 is provided on the upper surface of the base 1 so as to surround the mounting portion 1a on which the optical semiconductor element 4 is mounted.
Are formed, and a space for accommodating the optical semiconductor element 4 is formed inside the frame 2.

The frame 2 is made of a metal material such as an iron-nickel-cobalt alloy or an iron-nickel alloy. For example, the frame 2 is formed by pressing an ingot (lumps) of an iron-nickel-cobalt alloy or the like into a frame shape by pressing. And the substrate 1
Attachment is performed by brazing the upper surface of the base 1 and the lower surface of the frame 2 via a silver brazing material.

Further, the frame 2 is provided with a through hole 2a on a side portion thereof, and a cylindrical fixing member 9 is attached to the inner wall surface of the through hole 2a. A light-transmissive member 10 is attached to one end.

A through hole 2a formed in the side of the frame 2 acts as a mounting hole for mounting the fixing member 9 to the frame 2, and a well-known drill is formed in the side of the frame 2. It is formed in a predetermined shape by performing drilling.

A fixing member 9 attached to the through hole 2a of the frame 2 functions as a base fixing member for fixing the optical fiber member 11 to the frame 2, and also converts the light excited by the optical semiconductor element 4 into an optical fiber. A function of transmitting the light to the member 11 is provided.
0 is attached, and an optical fiber member 1
1 is attached and connected.

The cylindrical fixing member 9 is made of a metal material such as an iron-nickel-cobalt alloy or an iron-nickel alloy.
For example, it is formed by pressing an iron-nickel alloy ingot into a tubular shape.

The fixing member 9 has one end on its inner side.
For example, a translucent member 10 is attached, the translucent member 10 closes the internal space of the fixing member 9, and the base 1 and the frame 2
The light excited by the optical semiconductor element 4 that transmits the internal space of the fixing member 9 is transmitted to the optical fiber member 11 that is attached to and connected to the fixing member 9 as it is, while maintaining the hermetic sealing of the container including the lid member 3 and the container. Works.

The light transmitting member 10 is made of, for example, silicon oxide,
It is made of lead-based and boric acid containing lead oxide as a main component, and borosilicate-based amorphous glass containing silica sand as a main component.
Since the amorphous glass has no crystal axis, the light excited by the optical semiconductor element 4 is transmitted and received by the optical fiber member 11 through the light-transmitting member 10. The birefringence does not occur in the member 10 and is transmitted and received to the optical fiber member 11 as it is. As a result, the transmission and reception of the light excited by the optical semiconductor element 4 to and from the optical fiber member 11 becomes highly efficient, and the transmission efficiency of the optical signal is increased. Can be made higher.

As shown in FIG. 3, for example, as shown in FIG. 3, a metallization layer 12 is previously applied to the outer periphery of the light-transmitting member 10 and the light-transmitting member 10 is attached to the fixing member 9. This is performed by brazing the fixing member 12 and the fixing member 9 via a brazing material such as a gold-tin alloy. In this case, since the attachment of the translucent member 10 to the fixing member 9 is performed by brazing with a gold-tin alloy or the like, the attachment is highly reliable. The hermetic sealing of the container housing the optical semiconductor element 4 at the portion where the optical semiconductor element 4 is attached to the container 10 is completed, and the optical semiconductor element 4 housed inside the container can be normally and stably operated for a long period of time.

The metallized layer 12 previously coated on the outer periphery of the light-transmitting member 10 has a low melting point of about 700 ° C. of the amorphous glass constituting the light-transmitting member 10. As shown in FIG. 3, since at least one of titanium, titanium-tungsten, and tantalum nitride which are active with respect to amorphous glass and can be bonded firmly cannot be formed by adopting the Mn method. The first layer 12a and the first layer 12a diffuse into a third layer 12c, which will be described later, due to heat generated when the translucent member 10 is brazed to the fixing member 9, and the metallized layer 12 is applied to the translucent member 10. A second layer (12b) made of at least one of platinum, nickel, and nickel-chromium, which effectively prevents a decrease in bonding strength; A third layer 12c made of at least one of gold, platinum, and copper, in which a brazing material is firmly bonded to the oil layer 12 and the translucent member 10 is firmly attached to the fixing member 9, is sequentially laminated. Particularly, the metallized layer 12 formed by sequentially laminating titanium-platinum-gold has a strong bonding strength with the light-transmitting member 10 and a good wettability with the brazing material, so that the light-transmitting member 10 is fixed. Since it can be brazed to the member 9, it is very suitable as the metallized layer 12.

The above titanium, titanium-tungsten,
First layer 12a made of at least one kind of tantalum nitride
And at least one of platinum, nickel and nickel-chromium
The metallized layer 12 having a three-layer structure of a second layer 12b made of a seed and a third layer 12c made of at least one of gold, platinum and copper is made of a metal material and a nitride. Is formed by sequentially applying a predetermined thickness to the outer peripheral portion by a sputtering method, a vapor deposition method, an ion plating method, a plating method, or the like.

Further, the metallized layer 12 is made of titanium,
A first layer 12a made of at least one of titanium-tungsten and tantalum nitride; a second layer 12b made of at least one of platinum, nickel and nickel-chromium;
When the third layer 12c made of at least one of platinum and copper is used, if the thickness of the first layer 12a is less than 500 angstroms, the bonding strength of the metallized layer 12 to the translucent member 10 tends to be weak. When the thickness exceeds 2000 angstroms, the first layer 12
When the first layer 12a is applied, a large stress is generated in the first layer 12a and the first layer 12a tends to be easily separated from the light transmitting member 10 due to the intrinsic stress.
The thickness of a is preferably in the range of 500 Å to 2000 Å, and the second layer 1
If the thickness of the layer 2b is less than 500 angstroms, it is not possible to effectively prevent the first layer 12a from diffusing into the third layer 12c due to heat generated when the translucent member 10 is brazed to the fixing member 9, Transparent member 10 of metallized layer 12
When the thickness exceeds 10,000 Å, a large stress is generated in the second layer 12b when the second layer 12b is deposited on the first layer 12a. 2nd layer 12b by stress
Has a tendency to peel off more easily than the first layer 12a, so that the thickness of the second layer 12b is 500 Å to 10 Å.
When the thickness of the third layer 12c is less than 0.5 μm, the wettability of the brazing material with respect to the metallized layer 12 is not significantly improved, and the light transmitting member 10 is fixed to the fixing member 9. There is a tendency that it is difficult to firmly braze and attach. If it exceeds 5 μm, a large stress is generated in the third layer 12c when the third layer 12c is applied on the second layer 12b, Since the third layer 12c tends to be easily separated from the second layer 12b due to the intrinsic stress, the thickness of the third layer 12c is 0.5 μm to 5 μm.
It is preferable to keep the range of μm.

Further, the frame 2 has a notch 2b formed on the side thereof, and the notch 2b has a ceramic terminal 6
Is inserted.

The ceramic terminal 6 comprises an insulator 7 made of an electrically insulating material and a plurality of metallized wiring layers 8. The metallized wiring layer 8 is electrically insulated from the frame 2 from the inside to the outside of the frame 2. The metallized metal layer is previously applied to the side surface of the insulator 7 and the metallized metal layer is attached to the cutout 2 of the frame 2.
By being attached to the inner wall surface through a brazing material such as silver brazing, it is inserted into the cutout 2a of the frame 2.

The insulator 7 of the ceramic terminal body 6 is made of a mullite sintered body, and the thermal conductivity of the mullite sintered body is as low as about 5 W / m · k, and it is difficult to conduct heat. When the device 4 is optically excited by a drive signal supplied from an external electric circuit while being cooled by an electronic cooling device 5 such as a Peltier device, the heat generated by the electronic cooling device 5 causes the base 1, frame 2, ceramic terminal 6 and Even if an attempt is made to act on the optical semiconductor element 4 via a bonding wire 12 to be described later, the transfer of heat is cut off by the ceramic terminal body 6 and does not act on the optical semiconductor element 4. The cooling efficiency by the cooling element 5 becomes high,
Even with a low-power electronic cooling element, the optical semiconductor element 4 can be normally and stably operated for a long period of time by keeping the optical semiconductor element 4 at an appropriate temperature.

The insulator 7 made of a mullite sintered body of the ceramic terminal body 6 is formed by adding a suitable organic binder, a solvent and the like to a raw material powder such as aluminum oxide and silicon oxide to form a slurry. The green material (ceramic green sheet) is obtained by applying the doctor blade method or the calendar roll method to the slurry.
After that, a suitable punching process is performed on the ceramic green sheet and a plurality of the ceramic green sheets are laminated,
It is manufactured by firing at a temperature of about 1500 ° C.

A plurality of metallized wiring layers 8 extending from the inside to the outside of the frame body 2 are embedded in the ceramic terminal body 6.
Each electrode of the optical semiconductor element 4 is electrically connected to a region located inside the frame 2 through a bonding wire 12, and an external lead terminal connected to an external electric circuit is located in a region located outside the frame 2. Reference numeral 13 is attached via a brazing material such as a silver brazing material.

The metallized wiring layer 8 functions as a conductive path for connecting each electrode of the semiconductor element 4 to an external electric circuit, and is formed of a high melting point metal powder such as tungsten, molybdenum, manganese or the like.

The metallized wiring layer 8 is made of tungsten,
A metal paste obtained by adding a suitable organic binder, a solvent, and the like to a high melting point metal powder such as molybdenum, manganese, or the like is applied to a ceramic green sheet serving as an insulator 7 in a predetermined pattern by a screen printing method. This is formed on the insulator 7.

The metallized wiring layer 8 is formed by coating a metal having excellent corrosion resistance such as nickel and gold and having excellent wettability with a brazing material to a thickness of 1 μm to 20 μm on an exposed surface by plating. By doing so, the oxidation corrosion of the metallized wiring layer 8 can be effectively prevented, and the brazing of the external lead terminals 13 to the metallized wiring layer 8 can be made firm. Therefore, the metallized wiring layer 8
Is a metal having excellent corrosion resistance, such as nickel and gold, having excellent wettability with a brazing material on the exposed surface of 1 μm to 20 μm.
It is preferable that it is applied to a thickness of μm.

External lead terminals 13 are brazed and attached to the metallized wiring layer 8 via a brazing material such as silver brazing. The external lead terminals 13 are provided for each of the optical semiconductor elements 4 housed in the container. The optical semiconductor element 4 accommodated in the container by connecting the external lead terminal 13 to the external electric circuit serves as a bonding wire 12, a metallized wiring layer 8, and an external lead. The terminal 13 is connected to an external electric circuit.

The external lead terminals 13 are made of a metal material such as an iron-nickel-cobalt alloy or an iron-nickel alloy. For example, an ingot made of a metal material such as an iron-nickel-cobalt alloy is rolled or stamped. It is formed into a predetermined shape by applying a conventionally known metal working method such as a working method.

Further, a lid member 3 made of a metal material such as an iron-nickel-cobalt alloy or an iron-nickel alloy is joined to the upper surface of the frame 2 to thereby form the base 1.
The optical semiconductor element 4 is hermetically sealed inside a container composed of the frame member 2 and the lid member 3. The joining of the lid member 3 to the upper surface of the frame 2 is performed by, for example, welding such as a seam welding method.

Thus, according to the package for housing an optical semiconductor element of the present invention, the optical semiconductor element 4 is interposed between the optical semiconductor element mounting portion 1a of the base 1 and the electronic cooling element 5 such as a Peltier element. While being mounted and fixed, each electrode of the optical semiconductor element 4 is connected to an external lead terminal 3 via a bonding wire 12.
Then, the lid member 3 is joined to the upper surface of the frame 2, and the optical semiconductor element 4 is accommodated in a container including the base 1, the frame 2, and the lid 3, and finally, the frame By attaching and connecting the optical fiber member 11 to the cylindrical fixing member 9 attached to 2, an optical semiconductor device as a final product is obtained.

In such an optical semiconductor device, while the optical semiconductor element 4 is cooled by the electronic cooling element 5, optical excitation is caused to the optical semiconductor element 4 by a drive signal supplied from an external electric circuit, and the excited light is transmitted to the light transmitting member. The optical fiber member 11 is transmitted to and received from the optical fiber member 11 through the optical fiber member 11.
It is used for high-speed communication and the like by transmitting through an optical fiber. In this case, even if the heat generated by the electronic cooling element 5 tries to act on the optical semiconductor element 4 via the base 1, the frame 2, the ceramic terminal 6, and the bonding wire 12, the heat is transmitted with a thermal conductivity of It is not interrupted by the insulator 7 of the ceramic terminal body 6 made of a mullite sintered body which is as low as about 5 W / m · k and does not easily conduct heat, and does not act on the optical semiconductor element 4. The cooling efficiency of the electronic cooling element 5 becomes high, and the optical semiconductor element 4 can be normally and stably operated for a long period of time by keeping the optical semiconductor element 4 at an appropriate temperature even with a low-output electronic cooling element.

The present invention is not limited to the above-described embodiment, and various changes can be made without departing from the gist of the present invention.

[0038]

According to the package for housing an optical semiconductor element of the present invention, the insulator of the ceramic terminal body is made to have a thermal conductivity of about 5%.
Since the optical semiconductor element was formed of a mullite sintered body having a low W / m · k and difficult to conduct heat, the optical semiconductor element was optically excited by a drive signal supplied from an external electric circuit while being cooled by an electronic cooling element such as a Peltier element. In this case, even if the heat generated by the electronic cooling element tries to act on the optical semiconductor element via the base, the frame, the ceramic terminal and the bonding wire, the transfer of the heat is cut off by the ceramic terminal and acts on the optical semiconductor element. As a result, the cooling efficiency of the optical semiconductor element by the electronic cooling element becomes high, and the optical semiconductor element is always kept at an appropriate temperature even with a low-output electronic cooling element to operate the optical semiconductor element normally and stably for a long period of time. It becomes possible.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of a package for housing an optical semiconductor element of the present invention.

FIG. 2 is a plan view of the semiconductor device housing package shown in FIG. 1 without a cover member.

FIG. 3 is a partially enlarged cross-sectional view of the semiconductor device housing package shown in FIG. 1;

[Explanation of symbols]

 1 Base 1a Mounting part 2 Frame 2a Through hole 2b Notch 3 ························································································ Ceramic terminal body 7 ······· Insulator 8 ······ Metalized wiring layer 9 ······ Fixing member 10 ······· Translucent member 11 ··· .... Optical fiber members

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 31/0232 H01L 31/02 C

Claims (1)

[Claims] 1. A base having a mounting portion on which an optical semiconductor element is mounted via an electronic cooling element, and an optical semiconductor element mounted on the base so as to surround the optical semiconductor element mounting portion. A frame having a through-hole and a notch in the portion, a tubular fixing member attached to the through-hole or the frame around the through-hole, and an optical fiber member joined thereto; A ceramic terminal body on which a metallized wiring layer to which each electrode of the optical semiconductor element is electrically connected is formed on the body, and a lid member attached to the upper surface of the frame body and hermetically sealing the optical semiconductor element. An optical semiconductor element housing package comprising: an insulator for the ceramic terminal body comprising a mullite sintered body.