JP2000150690A - Hybrid module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a hybrid module which can be placed without moving a metal case during its manufacturing operations. SOLUTION: A hybrid module 10 is provided with a concave part 11a on a side of a circuit board 11 and an engaging piece 31 on the side of a metal case 30 in a position corresponding to the concave part 11a. The engaging piece exerts a swelling pressure in the direction approximately in parallel to the top of the circuit board and along the side of its side. In this way, when the metal case 30 is mounted on the circuit board 11, the engaging piece 31 is engaged in the concave part 11a on the side of the circuit board and both of the sides of the engaging piece 31 are pressed against both of the sides of the concave part 11a to engage the metal case 30 in the circuit board. Accordingly, the metal case 30 is never shifted even when the circuit board 11 on which the metal case 30 is mounted.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid module having a case mounted on an upper surface of a circuit board on which an electronic circuit is formed.

[0002]

2. Description of the Related Art Conventionally, as this kind of hybrid module, one shown in FIG. 10 is known. FIG. 10 is an exploded perspective view partially showing a hybrid module of a conventional example. This hybrid module 10
Reference numeral 0 denotes a circuit board 101, circuit components such as a chip-shaped electronic component 102 such as a multilayer capacitor or a multilayer inductor mounted on the circuit board 101, a semiconductor element 103 such as an FET, and a metal mounted on the circuit board 101. And a case 104.

The circuit board 101 is a multilayer board formed by laminating a plurality of rectangular green sheets, and a pair of opposing side surfaces is provided with a concave portion 101a having a predetermined width for mounting a case 104 from the upper surface to the lower surface. Are formed. The concave portion 101a is formed by laminating green sheets provided with corresponding cutouts at the edges.

[0004] A plurality of terminal electrodes 101b are formed on the side surface of the circuit board 101 for connection to the parent circuit board. This terminal electrode 101b is soldered to a circuit pattern formed on the parent circuit board.

Further, on the upper surface of the circuit board 101, a land electrode 105 for soldering a metal case 104 is formed at a predetermined position along a side surface on which the concave portion 101a is not formed.

The chip-shaped electronic component 102 is mounted on the circuit board 101.
The semiconductor element 103 is soldered to a circuit pattern 105 formed thereon, and is bonded to a circuit pattern 106 in a cavity (not shown) formed on the bottom surface of the circuit board 101 via a solder bump 103a.

The metal case 104 has a box shape with an open bottom surface, and the bottom edge of the side surface is in contact with the upper surface of the circuit board 101. Further, on the pair of opposed side surfaces of the metal case 104, first mounting feet 104a having a width corresponding to the concave portion 101a are formed to protrude downward at positions corresponding to the concave portion 101a. The first mounting leg 104a is bent slightly outward so that the metal case 104 can be easily mounted on the circuit board 101.

Further, on the other pair of opposing side surfaces of the metal case 104, a second end having an inwardly bent L-shape is formed at a position corresponding to the land electrode 105 formed on the upper surface of the circuit board 101. Is formed, and
These second mounting feet 104b are soldered to the land electrodes 105.

As a result, the metal case 104 comprises the circuit board 101 and the chip-like electronic components 102 mounted thereon.
Etc. are physically protected, and the electronic circuit formed on the circuit board 101 is electrically and magnetically shielded.

[0010] The hybrid module is manufactured as follows.

That is, as shown in FIG. 11, first, an aggregate substrate 200 is formed by laminating a plurality of green sheets in which circuit pattern electrodes, via holes, and the like of a single circuit substrate 101 are formed in a matrix. This collective substrate 200
Are cut into a matrix and fired to form a single circuit board 10.
Get 1. A high-temperature solder 107 is printed on the land electrodes 106a of the circuit pattern 106 and the case mounting land electrodes 105 formed on the upper surface of the circuit board 101, and a flux is applied by a dispenser so as to cover the solder portions.

Next, the chip-like electronic component 102 and the semiconductor element 1 are placed on the land electrodes 106a of the circuit pattern 106.
The components such as 03 are mounted, moved to a reflow furnace, and these components are reflow soldered.

After that, the metal case 1 is placed on the circuit board 101.
04 and moved to the reflow furnace, where the metal case 104
To the land electrode 105 by reflow soldering.

[0014]

However, in the above-described conventional hybrid module 100, the metal case 104 moves and tilts due to vibration or the like during the movement to the reflow furnace, so that the appearance is impaired and the shielding effect is reduced. There was something.

That is, the conventional hybrid module 10
0, the metal case 10 is placed on the circuit board 101.
When 4 is mounted, the solder on the land electrode 105 is solidified, and its height shape varies. For this reason, the metal case 10 mounted on the circuit board 101
4 is in an unstable state, and the metal case 104 sometimes moves and tilts as shown in FIG. 12 due to vibration or the like during movement to the reflow furnace.

In view of the above problems, an object of the present invention is to provide a hybrid module that can be mounted without moving a metal case in a manufacturing process.

[0017]

In order to achieve the above object, the present invention provides a circuit board, a circuit component mounted on the circuit board, and a metal mounted so as to cover an upper surface of the circuit board. A hybrid module including a case, wherein the circuit board has a concave portion on at least the upper surface of the circuit board on a side surface, and the case has an open bottom surface, and at least a bottom edge of a predetermined position of the side surface is a side edge of the upper surface of the circuit board. A locking piece that abuts the upper surface of the circuit board and has the same shape as the upper surface of the circuit board, and is inserted into the recess at a position corresponding to the recess on the side surface and generates a pressing force in a direction substantially orthogonal to the inner surface of the recess. We propose a hybrid module with

According to the hybrid module, when the metal case is mounted on the circuit board, the locking pieces of the metal case are fitted into the recesses on the side surfaces of the circuit board. At this time, the locking piece of the metal case generates a pressing force in a direction substantially orthogonal to the inner surface of the recess. As a result, both sides of the locking piece are pressed against the inner surface of the recess, and the metal case is locked to the circuit board.

According to a second aspect of the present invention, in the hybrid module according to the first aspect, the circuit board has a land electrode for fixing a case on a peripheral portion of an upper surface, and the case is provided at a predetermined position on a side surface of the circuit board. A hybrid module having a mounting foot electrically conductively connected to a land electrode is proposed.

According to the hybrid module, the mounting foot of the metal case is conductively connected to the land electrode while the metal case is locked on the circuit board.

According to a third aspect of the present invention, there is provided the hybrid module according to the first aspect, further comprising a ground electrode formed on the inner surface of the concave portion, wherein the locking piece is conductively connected to the ground electrode. I do.

According to the hybrid module, the locking piece of the metal case is conductively connected to the ground electrode in the recess while the metal case is locked to the circuit board.

According to a fourth aspect of the present invention, there is provided the hybrid module according to the first aspect, wherein the circuit board is formed of a multilayer board in which green sheets having notches corresponding to the concave portions provided at the edges are laminated. I do.

According to the hybrid module, the notch is formed in the green sheet forming the circuit board, so that the hybrid module according to the first and second aspects can be efficiently manufactured.

[0025]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings, taking a specific example of a hybrid module for high frequency power amplification.

FIG. 1 is a partially exploded perspective view showing a hybrid module according to a first embodiment of the present invention, and FIG.
FIG. 2 is an exploded perspective view illustrating a structure of a circuit board.

As shown in FIG. 1, the hybrid module 10 includes a circuit board 11, a plurality of chip-like electronic components 12 mounted on the circuit board 11, a semiconductor element 13 having heat generation properties, and a semiconductor element 13. A heat radiating plate 14 for transmitting heat generated to the main circuit board, and a metal case (hereinafter simply referred to as a case) 30 mounted on the upper surface of the circuit board 11.

The hybrid module 10 has a rectangular parallelepiped shape having an external dimension of, for example, about 7 mm × 7 mm × 2 mm, and is mounted on the parent circuit board with the bottom surface provided with the heat sink 14 facing the parent circuit board.

As shown in FIGS. 1 and 2, the circuit board 11 is made of a rectangular parallelepiped ceramic material mainly composed of alumina, and has a circuit pattern 15 and an insulator formed with via holes 16 for connecting the circuit pattern 15 between layers. Layer 11
This is a four-layer multilayer substrate formed by laminating A to 11D.

On the other hand, at the center of a pair of opposing side surfaces of the circuit board 11, one concave portion 11a for mounting the case 30 is formed. The concave portion 11a is formed in a rectangular tube shape from the bottom surface to the upper surface of the circuit board 11. That is, each of the four insulator layers 11 </ b> A to 11 </ b> D has a square notch 20 at the edge corresponding to the recess 11 a.

A semi-cylindrical terminal electrode groove is provided on the side surface of the circuit board 11, and a terminal electrode 17 for connecting to the parent circuit board is formed in the terminal electrode groove.
This terminal electrode groove can be easily formed by forming and laminating a semicircular cutout 21 corresponding to the terminal electrode groove on each of the insulator layers 11A to 11D.

Further, the upper surface of the circuit board 11 (the insulator layer 1)
1A), a land electrode 18 conductively connected to the case 30 at a predetermined position along the upper edge of the other pair of opposing side surfaces.
a, 18b are formed, and these land electrodes 18a, 1b are formed.
8b is connected to a circuit pattern for grounding.

On the bottom surface of the circuit board 11, a two-stage cavity (not shown) for mounting and housing the semiconductor element 13 and the heat sink 14 is provided. That is,
Hole 2 corresponding to the cavity is formed in the center of insulator layer 11C.
2, and a hole 23 corresponding to the cavity is provided at the center of the insulator layer 11D.

The chip electronic component 12 is an electronic component constituting the hybrid module 10, and is, for example, a multilayer capacitor, a multilayer inductor, or the like. This chip-shaped electronic component 12 is mounted on a circuit pattern 15 formed on the surface of the circuit board 11.

The semiconductor element 13 is an electronic component constituting the hybrid module 10 and has a heat generating property. For example, it is a GaAs MES type FET or the like. The semiconductor element 13 has a plurality of bumps 13a, and each bump 13a is connected to a circuit pattern 15 formed in a cavity. The space between the semiconductor element 13 and the circuit board 11 is filled with a sealing resin (not shown) for protecting the semiconductor element 13.

The heat radiating plate 14 is for radiating heat generated by the semiconductor element 13 to the parent circuit board, and is formed of a material having high thermal conductivity, for example, 42 alloy (nickel: iron = 42: 58 alloy). The circuit board 11 is adhered to the semiconductor element 13 so as to close the cavity. Heat sink 1
4 and the semiconductor element 13 are bonded with a resin (not shown) having high thermal conductivity as an adhesive in order to enhance heat dissipation. The heat radiating plate 14 is subjected to a plating process such as Au plating to improve solder wettability.

The terminal electrode 17 is for connection to the parent circuit board, and is electrically connected to the circuit pattern 15 formed on the surface and the inner layer of the circuit board 11. The terminal electrodes 17 are formed by applying a conductive paste to terminal electrode grooves provided on the side surface of the circuit board 11 and baking the conductive paste.

The case 30 has a rectangular parallelepiped shape with an open lower surface, and is made of, for example, copper. The case 30 physically protects the hybrid module 10 and shields electrical and magnetic noise from the outside. Is for preventing radiation of noise to the outside.

A pair of opposed side surfaces 30a, 30 of the case 30
A locking piece 31 for attaching the case 30 to the circuit board 11 is provided at the center of the lower end of the b, and the locking piece 31 has a shape that fits into the recess 11a of the circuit board 11 and locks. . That is, as shown in FIG.
a has a width (L2) slightly larger than the width (L1) of a and protrudes below the bottom edge of the side surface, and has a notch 31a of a predetermined width and length extending upward from the bottom at the center thereof. It has a symmetrical shape about the notch 31a.

Further, the locking piece 31 has a slightly rounded shape from its tip to both sides. Here, the width (L3) of the notch 31a is set to be slightly larger than the value obtained by subtracting the width (L1) of the recess 11a from the width (L2) of the locking piece 31.

On the other pair of opposing side surfaces 30c and 30d of the case 30, mounting feet 32 having a predetermined width are formed. The distal ends of the mounting feet 32 are bent at approximately 90 degrees toward the inside of the case 30, so that the land electrodes 18a, 18
The contact piece 32a which makes surface contact with b is formed. Here, the height from the bending position of the mounting foot 32 to the upper surface of the case is set to be the same as the vertical height of the other pair of opposing side surfaces 30a and 30b.

According to the configuration described above, when the case 30 is mounted on the circuit board 11, as shown in FIG. 4, the locking pieces 31 are fitted and locked in the recesses 11a, and the case 30 is
Fixed to 1. That is, since the width of the locking piece 31 is slightly larger than the width of the concave portion 11a, the locking piece 31
1a is inserted into the recess 11a while narrowing the width. For this reason, the force (elastic force) P for returning the width of the notch 31a to the original state is applied to the locking piece 31 fitted in the recess 11a.
1, P2 occurs. The forces P1 and P2 serve as pressing forces for pressing both side edges of the locking piece 31 against both side walls of the concave portion 11a. The locking pieces 31 are locked in the recesses 11a by the pressing forces P1 and P2, and the case 30 is fixed to the circuit board 11. At this time, the tip of the mounting foot 32 of the case 30 (contact piece 32a)
Are land electrodes 18a formed on the upper surface of the circuit board 11,
It is pressed into contact with the surface 18b.

Therefore, in the process of manufacturing the hybrid module 10, after the high-temperature solder is printed on the land electrodes 18a and 18b, the case 30 is mounted on the circuit board 11 and moved to the reflow furnace.
Since it does not deviate and move, the appearance and shape of the finished product and the electrical and magnetic shielding effects of the case 30 are improved.

Next, a second embodiment of the present invention will be described.

FIG. 5 is a partially exploded perspective view showing a hybrid module 10 'according to the second embodiment. In the figure, the same components as those in the first embodiment described above are denoted by the same reference numerals, and description thereof will be omitted. Also,
The difference between the first embodiment and the second embodiment is that in the second embodiment, a locking piece 33 having a different shape from the first embodiment.
Metal case (hereinafter simply referred to as case) 3 formed with
0 ′ and a recess 1 corresponding to the locking piece 33.
1c is formed on the side surface of the circuit board 11.

That is, the locking piece 33 is formed on the case 30 'at the same position as the case 30 of the first embodiment. As shown in FIG. 6, the locking piece 33 has a trapezoidal protruding piece 33 protruding below the side surfaces 30a and 30b of the case 30 '.
The projecting piece 33A is formed by slightly bending the protruding piece 33A inside the case 30 'and slightly bending the left and right side edge portions 33b outward.

Here, as shown in FIGS. 7 and 8, the width (L) of the central portion 33a excluding the side edges 33b of the projecting piece 33A.
4) is set to be slightly smaller than the width (L1) of the concave portion 11c, and the entire width (L) of the protruding piece 33A including both side edges 33b.
5) is set wider than the width (L1) of the concave portion 11c. Further, the bending angle of the side edge portion 33b is
3, the width (L6) is set to an angle that is slightly wider than the width (L1) of the concave portion 11c.

According to the above configuration, when the case 30 'is mounted on the circuit board 11, as shown in FIG.
Fits into the recess 11 c and is locked, and the case 30 ′ is fixed to the circuit board 11. That is, the locking piece 33 is the case 30 '
Is slightly bent toward the inside of the
3 presses the inner surface of the recess 11c. Further, the width (L6) of the locking piece 33 is equal to the width (L1) of the recess 11c.
Since it is slightly wider, the locking piece 33 is inserted into the concave portion 11c while reducing the spread width of the side edge portions 33b. For this reason, forces (elastic forces) P1 'and P2' are generated in the locking pieces 33 fitted in the recesses 11c so as to return the spread width of the side edge portions 33b to the original state. The forces P1 'and P2' serve as pressing forces for the side edges 33b of the locking piece 33 to press the side walls of the recess 11c. The locking pieces 3 are formed by the pressing forces P1 and P2.
3 engages with the recess 11c, and the case 30 '
Fixed to At this time, similarly to the first embodiment, the distal ends (contact pieces 32a) of the mounting feet 32 of the case 30 'are connected to the land electrodes 18a, 18b formed on the upper surface of the circuit board 11.
It is pressed so that it comes into surface contact.

Therefore, in the manufacturing process of the hybrid module 10, after the high-temperature solder is printed on the land electrodes 18a and 18b, the case 30 'is mounted on the circuit board 11 and moved to the reflow furnace. Since there is no displacement on the substrate 11, the appearance and shape of the finished product and the electrical and magnetic shielding effects of the case 30 'are good.

The first and second embodiments described above are merely examples, and the present invention is not limited to these. For example, in the first and second embodiments, the case 30 (3
0 ′) is attached to the land electrode 18 on the circuit board 11.
a, 18b, but the case 30 (30 ') is fixed to the circuit board 11 by the locking pieces 31, 33 without soldering, and the mounting foot 32 is applied to the land electrodes 18a, 18b. Since the contact pieces 32a are in close contact with each other, a good conductive connection between them can be obtained.

If a ground (GND) electrode is formed on the inner surfaces of the concave portions 11a and 11c, the case 3
Since the locking pieces 31 and 33 of 0 and 30 'are conductively connected, the shielding effect of the cases 30 and 30' can be further enhanced. Further, the ground electrode and the locking pieces 31 and 33 may be soldered.

[0052]

As described above, according to the first to fourth aspects of the present invention, when the metal case is mounted on the circuit board,
The locking piece of the metal case is fitted into the recess on the side of the circuit board,
Since the metal case is locked to the circuit board, even if the circuit board on which the metal case is mounted is moved, the metal case does not shift on the circuit board. Therefore, the appearance and shape of the finished product and the electrical and magnetic shielding effects of the metal case are improved.

According to the second aspect, in addition to the above effects, the metal case is locked to the circuit board, so that the mounting foot of the metal case is brought into close contact with the land electrode on the circuit board for conductive connection. In this case, a stable connection can be obtained, and in the case of conductive connection by soldering, the metal case does not move during soldering.

According to the third aspect, in addition to the above-described effects, the locking piece of the metal case is conductively connected to the ground electrode in the recess in a state where the metal case is locked to the circuit board. In addition, the shielding effect of the metal case can be enhanced.

According to the fourth aspect, in addition to the above effects, the circuit board can be efficiently manufactured by forming the notch in the green sheet forming the circuit board.

[Brief description of the drawings]

FIG. 1 is a partially exploded perspective view showing a hybrid module according to a first embodiment of the present invention.

FIG. 2 is an exploded perspective view illustrating a structure of a circuit board according to the first embodiment of the present invention.

FIG. 3 is a diagram illustrating dimensions of a locking piece and a concave portion according to the first embodiment of the present invention.

FIG. 4 is a diagram illustrating a locking operation by a locking piece according to the first embodiment of the present invention.

FIG. 5 is a partially exploded perspective view showing a hybrid module according to a second embodiment of the present invention.

FIG. 6 is a diagram illustrating a method for processing a locking piece according to a second embodiment of the present invention.

FIG. 7 is a diagram illustrating dimensions of a locking piece and a concave portion according to the second embodiment of the present invention.

FIG. 8 is a view for explaining dimensions of a locking piece and a concave portion according to the second embodiment of the present invention.

FIG. 9 is a diagram illustrating a locking operation by a locking piece according to the second embodiment of the present invention.

FIG. 10 is a partially exploded perspective view showing a conventional hybrid module.

FIG. 11 is a diagram for explaining a manufacturing process of a conventional hybrid module.

FIG. 12 is a view for explaining a tilt state of a case in a conventional example.

[Explanation of symbols]

10 hybrid module, 11 circuit board, 11
A to 11D: insulator layers, 11a, 11c: concave portions, 12:
Chip-shaped electronic component, 13: semiconductor element, 14: heat sink,
Reference numeral 15: Circuit pattern, 16: Via hole, 17: Terminal electrode, 18a, 18b: Land electrode, 20, 21: Notch, 22, 23: Hole, 30, 30 ': Metal case, 30
a to 30d: side surface, 31: locking piece, 31a: notch,
32: mounting foot, 32a: contact piece, 33: locking piece, 33A
... projecting piece, 33a ... central part, 33b ... side edge part.

Claims (4)

[Claims] 1. A hybrid module including a circuit board, a circuit component mounted on the circuit board, and a metal case mounted so as to cover an upper surface of the circuit board, wherein the circuit board has at least an upper surface opening. A concave portion is provided on the side surface. * The case has an open bottom surface, at least a bottom edge at a predetermined position of the side surface abuts a side edge portion of the upper surface of the circuit board, and an upper surface has the same shape as the upper surface of the circuit board. A hybrid module comprising: a locking piece that is fitted into the recess at a position corresponding to the recess and generates a pressing force in a direction substantially perpendicular to the inner surface of the recess. 2. The circuit board has a land electrode for fixing a case on a peripheral portion of an upper surface, and the case is provided with a mounting foot at a predetermined position on a side surface of the circuit board to be electrically connected to the land electrode of the circuit board. The hybrid module according to claim 1, wherein: 3. The hybrid module according to claim 1, further comprising a ground electrode formed on an inner surface of the concave portion, wherein the locking piece is conductively connected to the ground electrode. 4. The hybrid module according to claim 1, wherein the circuit board is formed of a multi-layer board in which green sheets having notches corresponding to the concave portions provided at the edges are laminated.