JP2000150601A - Environmental testing device for electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an environmental testing device which is improved in versatility, is reduced in size and cost as a whole, and can perform environmental tests with high accuracy. SOLUTION: An environmental testing device 1 for electronic parts is provided with a cassette supporting section 5 which supports a cassette 2 provided with one-side connectors 3,... at prescribed positions on its rear surface 2r and inserted into the main body 4 of the testing device 1 from the outside, a connecting section 7 which is faced to the rear surface 2r of the cassette 2 supported by the supporting section 5 and on which other-side connectors 6,... connected to the one-side connectors 3,... are arranged at prescribed positions, and a moving mechanism section 8 which selectively positions the supporting section 5 to a taking-out/in position at which the cassette 2 is taken in and out or a connecting position Pc at which the connectors 3,... are connected to the connectors 6,... by relatively moving the section 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an environmental test apparatus for electronic components suitable for use in performing an environmental test of electronic components such as semiconductor wafers held in a cassette.

[0002]

2. Description of the Related Art Generally, there is known an environmental test apparatus for an electronic component, which applies a temperature load to an electronic component held in a cassette to perform a durability test and a pass / fail judgment test. This type of environmental test equipment is equipped with a drive circuit that applies a test signal to electronic components, and this drive circuit is usually placed outside the test tank to avoid high temperatures, and the cassette is housed inside the test tank. At this time, the cassette and the drive circuit were connected via a connector provided inside the test tank.

Conventionally, an environmental test apparatus having such a configuration is known from Japanese Patent Application Laid-Open No. Hei 9-159723.
In this environmental test apparatus, one connector is provided on a cassette (electronic component), the other connector is provided inside a test tank, and when the cassette is inserted into the test tank, the connector is provided on the front end side in the insertion direction of the cassette. One connector was connected to the other connector provided at the back of the test tank. In this case, connection or disconnection between the connectors is performed by an insertion / extraction mechanism provided inside the test tank.

[0004]

However, the above-mentioned conventional environmental test apparatus for electronic parts has the following problems to be solved.

First, when testing an electronic component having a large number of continuous semiconductor chip portions such as a semiconductor wafer,
Although a large number of connectors with a large number of terminals are required, the above-described conventional environmental test apparatus requires the connector to be provided at the front end of the cassette, so that the space for arranging the connector is limited. The number of connectors is limited, the size of the cassette is increased, and a small special connector is required. Therefore, versatility is difficult, and the entire apparatus is increased in size and cost is increased.

Second, the length of wiring connecting the cassette and the drive circuit becomes longer, and the length of wiring between individual electronic components in the cassette and the drive circuit varies. When a signal value is required, a highly accurate environmental test cannot be performed.

[0007] The present invention has been made to solve the problems existing in the prior art, and is intended to improve the versatility, reduce the size and cost of the entire apparatus, and perform an environmental test with high accuracy. The purpose of the present invention is to provide an environmental test device for electronic components that can be used.

[0008]

SUMMARY OF THE INVENTION The present invention relates to an electronic component environmental test apparatus 1 for performing an environmental test of an electronic component such as a semiconductor wafer W held in a cassette 2. One or two or more one-side connectors 3 are provided at predetermined positions on the rear surface 2r, and a cassette support 5 supporting the cassette 2 inserted from the outside in the test apparatus main body 4, and supported by the cassette support 5 One or two or more other connectors 6 facing the back surface 2r of the cassette 2 and connected to the one connector 3 at a predetermined position.
.. And the cassette supporter 5 are relatively moved in a direction H perpendicular to the plane of the cassette 2 so that the cassette 2 can be moved in and out of the cassette 2 or the one-side connector 3.
Are provided at a connection position Pc for connecting the first and second connectors to the other connectors 6.

In this case, according to a preferred embodiment, the semiconductor wafer W (electronic component) is brought into contact with or close to the cassette 2 supported by the cassette support 5 in the test apparatus main body 4.
And a heating mechanism 11 having a heater 12 for heating the heater. The heating mechanism 11 includes a second moving mechanism 1 that moves the heater 12 in a direction H perpendicular to the plane of the cassette 2.
3 is provided. On the other hand, the cassette supporting portion 5 is formed as a frame, and slits 15p, 15q into which the left and right side portions 2p, 2q of the cassette 2 are inserted, and the slits 15q, 15
q, a positioning portion 16p for regulating the cassette 2 inserted in
16q. The connection portion 7 has a semiconductor wafer W
And a drive circuit 17 for applying a test signal to the connector board 1 on which the other connectors 6 are provided.
8 and a circuit board section 19 facing the connector board section 18 and having a drive circuit 17 disposed thereon.

Thus, when the cassette 2 holding the semiconductor wafer W is inserted into the cassette supporting portion 5 located at the entrance / exit position Pi of the test apparatus main body 4, the cassette 2 is positioned and supported by the cassette supporting portion 5. You. On the other hand, the cassette support portion 5 is relatively moved in the direction H perpendicular to the surface of the cassette 2 by the first moving mechanism portion 8, and at the connection position Pc, the one-side connectors 3 arranged at predetermined positions on the rear surface 2r of the cassette 2 The other connectors 6 arranged at predetermined positions of the connection portion 7 are connected. In this case, each connector 3 ... and 6
Are arranged in the connecting portion 7 in the surface of the back surface 2r of the cassette 2 and facing the connecting portion 7, so that the space in which the connectors 3... I do. Further, according to the preferred embodiment, if the heating mechanism section 11 having the heater section 12 for heating the semiconductor wafer W in contact with or close to the cassette 2 is provided in the test apparatus main body 4, only the cassette 2 is locally localized. The drive circuit 17 that supplies a test signal to the semiconductor wafer W because it is heated can be disposed inside a test tank that does not become hot. Therefore, if the drive circuit 17 is provided at the connection portion 7 facing the cassette 2, the wiring connecting the cassette 2 and the drive circuit 17 is shortened, and the individual semiconductor chip portions (electronic components) in the cassette 2 and the drive Variations in the wiring length between the circuits 17 are greatly reduced.

[0011]

Next, preferred embodiments according to the present invention will be described in detail with reference to the drawings.

First, the configuration of an electronic component environmental test apparatus 1 according to this embodiment will be described with reference to FIGS.

FIG. 2 shows an external view of the test apparatus main body 4 in the environmental test apparatus 1. The test apparatus main body 4 is a front panel 2
There are seven steps of entrances 21 formed at zero. Each entrance 2
The horizontal partition plates 22 arranged in a shelf shape inside of 1 ...
The seven test tanks 23 divided by the entrances 21
Provided corresponding to. An equipment box 24 is provided on the right side of the test apparatus main body 4 and is isolated from the test tanks 23. A display 26 and an operation panel 27 are provided on a front panel 25 of the equipment box 24, and a computer is provided on the lower part. Etc. are provided. Reference numeral 29 denotes a setting display section for each test tank 23... Arranged next to each entrance 21.

On the other hand, FIG. 3 shows a cassette 2 for holding one semiconductor wafer (electronic component) W. This cassette 2 is housed in a test apparatus main body 4 and a target environmental test is performed.
The cassette 2 has a quadrangular cassette base 71 at the lowermost portion, and reinforcing frames 72 are fixed to the peripheral edge of the lower surface of the cassette base 71. In this case, particularly, reinforcing frames 72, 72 provided on the left and right of the cassette base 71, respectively.
Is formed in an L-shaped cross section, thereby providing left and right side edges 2p and 2q to be inserted into slits 15p and 15q provided in the cassette support 5 described later. Further, at a predetermined position on the lower surface of the cassette base 71 which is the rear surface 2r of the cassette 2,
A plurality of one-side connectors (for example, inlets) 3 are provided. Although the embodiment shows only two connectors, usually, ten to twenty connectors with sixty terminals are arranged. Further, a disc-shaped contactor 73 containing a sub-heater is mounted on the upper surface of the cassette base 71, and the semiconductor wafer W is held between the contactor 73 and the disc-shaped wafer tray 74. In this case, the contactor 73 is a glass substrate having a number of contacts that come into contact with the circuit of the semiconductor wafer W, and each contact is connected to the one-side connector 3.

FIGS. 4 to 8 show the internal structure of the test apparatus main body 4. First, the connecting portions 7 are provided on the upper surfaces of the partition plates 22. The connection section 7 includes a circuit board section 19 provided via support legs 31... And a connector board section 18 provided on the circuit board section 19 via a reinforcing frame 32. The connector substrate portion 18 faces the back surface 2r of the cassette 2 supported by the cassette support portion 5, and has a plurality of other connectors (for example, outlets) 6 connected to the one connector 3 at a predetermined position on the upper surface. Arrange. Further, a drive circuit 17 for supplying a test signal to the semiconductor wafer W is provided in the circuit board section 19.

On the other hand, as shown in FIG. 5 and FIG. 6, a total of eight guide rods 3
, 40a are arranged at right angles to the partition plates 22. Four guide rods 35a located outside,
Linear bearings 36a, 36b, 36c, 36d are slidably mounted on 35b, 35c, 35d, respectively, and the linear bearings 36a,.
8 are fixed near the four corners of the cassette supporting portion 5 arranged above. The cassette supporting unit 5 includes a left frame 14p,
Right frame 14q, left frame 14p and right frame 14
The front frame 14f connecting the front ends of q and the rear frame 14r connecting the rear ends of the left frame 14p and the right frame 14q form a square frame. And, on the inner surfaces of the left frame 14p and the right frame 14q, there are provided slit portions 15p and 15q into which the left end portion 2p and the right end portion 2q of the cassette 2 are inserted, respectively. As shown in FIG. 6, the slit portions 15p and 15q
The front end is formed to be flared so that the cassette 2 can be easily inserted, and the rear end is provided for each of the frames 14p and 14q.
By inserting the cassette 2 in the middle of the rear part,
Are positioning portions 16p and 16q that regulate the position of the camera. A detection switch 37 for detecting the insertion of the cassette 2 is provided on the upper surface of the rear frame 14r.

Further, a cassette elevating cylinder 38p is arranged on the partition plate 22 located at the center between the front guide rod 35a and the rear guide rod 35b arranged on the left side, and a driving rod for the cassette elevating cylinder 38p is provided. Is connected to the upper surface of the left frame 14p via the link portion 39p, and is also arranged on the right side of the front guide rod 3
A cassette elevating cylinder 38q is disposed on the partition plate 22 located at the center between 5d and the rear guide rod 35c. The driving rod of the cassette elevating cylinder 38q is connected to the upper surface of the right frame 14q via a link 39q. To join. In this case, the cassette lifting cylinders 38p, 3
8q, guide rod 35a ..., linear bearing 36a
.. Constitute the first moving mechanism section 8 and drive the cassette elevating cylinders 38p and 38q to move the cassette support section 5 upwardly from the entrance 21 so that the cassette 2 can be inserted into and taken out of the cassette support section 5. The entry / exit position P located
i or the one-side connector 3 can be selectively moved to a lower connection position Pc for connecting to the other-side connector 6.

On the other hand, a heating mechanism 11 is provided above the cassette support 5. Linear guides 41a, 41b, 41c, 41d are slidably mounted on the four guide rods 40a, 40b, 40c, 40d located on the inner side, respectively. The linear bearings 41a,. Each of the heater support plates 42 is attached to each of the attachment holes provided near the four corners of the heater support plate 42. Heater support plate 42
Is formed in a rectangular shape, and the heater unit 12 is mounted in the center.
The heater unit 12 includes an upper temperature control plate 43 and a lower adapter 44. This adapter 44 is formed in a disk shape,
By attaching the heating surface to the lower surface of the temperature control plate 43, the heating surface is adapted to the heat receiving surface of the contactor 73 described above.

Further, a heater lifting cylinder 45p is disposed on the partition plate 22 adjacent to the rear guide rod 40b disposed on the left side.
Of the heater support plate 42 can be brought into contact with the lower surface of the heater support plate 42, and the heater lifting cylinder 4 is disposed on the partition plate 22 adjacent to the front guide rod 40d disposed on the right side.
5q is provided, and the drive rod of the heater raising / lowering cylinder 45q can be brought into contact with the lower surface of the heater support plate 42. In this case, the heater elevating cylinders 45p, 45q, the guide rods 40a,..., And the linear bearings 41a form the second moving mechanism unit 13, and the heater elevating cylinders 45p, 45q.
, The heater section 12 can be raised (moved in the direction H perpendicular to the plane of the cassette 2).

Reference numeral 50 denotes an entrance opening / closing mechanism. FIG. 7 shows only the configuration on the right side of the entrance opening / closing mechanism section 50 and omits the configuration on the left side. However, the left side has the same configuration except that it is symmetric with respect to the right side. First, the entrance / exit opening / closing mechanism section 50 has a pair of bracket sections 51 that are erected on the left and right on the partition plate 22. Each bracket part 51 ...
Are positioned outside and rearward of the linear bearings 36d (36a), and the brackets 51 ... rotatably support the rear ends of the arms 52 .... Each arm 52
... have the front part bent inward as shown in FIG. 7, and the left and right ends of the entrance cover 53 are joined to the front end. Doorway cover 53
Has a shape slightly larger than the entrance 21 and a sealing member 54 formed of a flexible material such as rubber is fixed to the periphery of the front surface. In FIG. 8, reference numeral 55 denotes a triangular reinforcing plate. On the other hand, engaging pins 56 projecting outward in the left-right direction are fixed to the right frame 14q (left frame 14p), and the engaging pins 56 are positioned below the corresponding arm portions 52. As a result, when the cassette supporting portion 5 is raised to the access position Pi, as shown by the solid line in FIG. 8, the integrally rising engaging pins 56 push up the arm portions 52. And the entrance 21 is opened. On the other hand, when the cassette supporting portion 5 is lowered to the connection position Pc, as shown by the imaginary line in FIG. The cover 53 is displaced downward to close the entrance 21.

Next, a method of using the environmental test apparatus 1 according to the present embodiment and the operation of each unit will be described with reference to FIGS.
This will be described according to the flowchart of FIG.

When the test apparatus main body 4 is not in use, the cassette supporting portions 5 are lowered and all the entrances 21 are closed by the entrance covers 53. The heater support plates 42 are stopped at the raised position.

On the other hand, in use, the start switch of the operation panel 27 is turned on (step S1) to drive the cassette elevating cylinders 38p and 38q, and the cassette support 5 is raised to the entrance position Pi and stopped (step S1). S2). At this time, the engaging pins 56.
.. Are pushed upward, the door cover 53 is displaced upward to open the door 21 (step S3). This state is shown in FIG. Then, the prepared cassette 2 shown in FIG.
And insert the left and right side edges 2p, 2q of the cassette 2 into the slits 15p, 15q of the cassette support 5 (step S4). In FIG. 4, the phantom line indicates the cassette support 5.
Shows the cassette 2 inserted in FIG.

When the cassette 2 is completely inserted into the cassette supporting portion 5, the cassette 2 is positioned while being locked by the positioning portions 16p and 16q, and the detection switch 37 is turned on (step S5). As a result, after a predetermined interval time has elapsed, the cassette lifting cylinders 38p, 3p
8q is driven, and the cassette support 5 descends to the connection position Pc and stops (steps S6 and S7). At this time, the one side connector 3 of the cassette supporting part 5 is connected to the other side connector 6 of the connecting part 7 (step S8). at the same time,
The lowering of the engagement pins 56 causes the arm portions 52 and the entrance / exit cover 53 to descend by their own weight, and the entrance / exit 21 is closed by the entrance / exit cover 53 (step S9). Then
The heater raising / lowering cylinders 45p and 45q are driven, and the drive rods of the cylinders 45p and 45q are lowered. As a result, the heater support plate 42 descends by its own weight, and the heater unit 1
The second adapter 44 rests on and comes into contact with the wafer tray 74 of the cassette 2 (see FIG. 1).

As described above, the cassette 2 is connected to the test apparatus main body 4.
Is set, and a target environmental test is executed (step S10). More specifically, the semiconductor wafer W is heated to 125 ° C. by the heater unit 12 serving as a main heater and a sub-heater built in the contactor 73, and the inside of the test tank 23 is cooled by a ventilation fan and a ventilation duct (not shown).
Maintained at 5 ° C. In addition, a test signal is applied from the drive circuit 17 to the semiconductor wafer W via the one-side connector 6 and the other-side connector 3, and an environmental test is performed for a preset test time.

On the other hand, upon completion of the environmental test, the heater raising / lowering cylinders 45p, 45q are driven, and the drive rods of the heater raising / lowering cylinders 45p, 45q are raised. Thus, the heater support plate 42 is pushed up to the raised position shown in FIG. 4 and stopped. Also, the cassette elevating cylinder 38
p, 38q are driven, and the cassette supporting portion 5
It rises to i and stops (step S11). On this occasion,
The one-side connector 3 is separated from the other-side connector 6, and the entrance cover 53 is displaced upward to open the entrance 21 (steps S12, S13). And cassette 2
Is drawn out of the cassette support portion 5 and taken out of the test apparatus main body 4 through the entrance 21 (step S14).
As a result, the detection switch 37 is turned off, and after a predetermined interval time has elapsed, the cassette lifting cylinder 38
p, 38q are driven, and the cassette supporting portion 5 is moved to the connection position P.
c and stop (steps S15, S16, S
17). Also, the door cover 53 descends by its own weight,
The entrance 21 is closed (Step S18).

As described above, according to the environmental test apparatus 1 according to the present embodiment, the one-side connectors 3 are disposed in the surface of the back surface 2r of the cassette 2 and the connection portion 7 facing the back surface 2r is provided. Since the other connectors 6 are provided, the space in which the connectors 3 and 6 are provided is greatly increased as compared with the case where the connectors 3 and 6 are provided at the end sides of the cassette 2. Further, since only the cassette 2 is locally heated, the drive circuit 17 for supplying a test signal to the semiconductor wafer W is disposed inside the test tank where the temperature does not become high, particularly, at the connection portion 7 facing the cassette 2. Therefore, the wiring connecting the cassette 2 and the drive circuit 17 can be significantly shortened, and the variation in the wiring length between the individual semiconductor chip portions and the drive circuit 17 in the semiconductor wafer W can be greatly reduced.

The embodiment has been described in detail above.
The present invention is not limited to such an embodiment,
The configuration, shape, material, quantity, numerical value, and the like of the details can be arbitrarily changed, added, or deleted without departing from the gist of the present invention.

For example, the electronic component is exemplified by the semiconductor wafer W, but may be any circuit element such as a commercialized semiconductor chip, circuit board, or capacitor. Further, the heater unit 12 may be not only in contact with the cassette 2 but also in the case of being close to it. The relative movement of the cassette support 5 is a concept that includes the case where the connecting portion 7 is moved in a state where the cassette support 5 is fixed.
Further, the driver circuit 17 may be provided on the lower surface of the connector board 18 without providing the circuit board 19.

[0030]

As described above, in the electronic component environmental test apparatus according to the present invention, the one-side connector is provided at a predetermined position on the back surface of the cassette, and the cassette support section for supporting the externally inserted cassette in the test apparatus main body. By moving the cassette supporting portion relative to a connecting portion facing the back surface of the cassette supported by the cassette supporting portion and having a second connector connected to the one connector at a predetermined position, Since the moving mechanism for selectively positioning the cassette in / out position or the connection position for connecting the one-side connector to the other-side connector is provided, the following remarkable effects are obtained.

Since the one-side connector is provided inside the back surface of the cassette and the other-side connector is provided at the connection portion facing the back surface of the cassette, the space for providing each connector is smaller than the space provided at the end of the cassette. As a result, the versatility can be increased, the versatility can be improved, and the size and cost of the entire apparatus can be reduced.

According to the preferred embodiment, if a drive circuit for applying a test signal to an electronic component is provided at the connection portion facing the cassette support portion, the wiring connecting the cassette and the drive circuit can be significantly reduced. In addition, since the variation in the wiring length between the individual electronic components and the drive circuit in the cassette can be greatly reduced, a highly accurate environmental test can be performed.

[Brief description of the drawings]

FIG. 1 is a partial cross-sectional front view of the inside of a test apparatus main body in a state where a cassette showing a main part of an environmental test apparatus according to an embodiment of the present invention is inserted;

FIG. 2 is an external front view of the test apparatus main body,

FIG. 3 is a partial cross-sectional front view of a cassette in the environmental test apparatus;

FIG. 4 is a partial cross-sectional front view of the inside of the test apparatus main body in a state before a cassette showing a main part of the environmental test apparatus is inserted,

FIG. 5 is a partial cross-sectional right side view of the inside of a test apparatus main body showing a main part of the environmental test apparatus;

FIG. 6 is a partial cross-sectional plan view of the inside of a test apparatus main body showing a main part of the environmental test apparatus;

FIG. 7 is a partially cutaway front configuration diagram of an entrance / exit opening / closing mechanism inside a test apparatus main body, showing a main part of the environmental test apparatus;

FIG. 8 is a right side view of the entrance / exit opening / closing mechanism,

FIG. 9 is a flowchart sequentially showing a method of using the environmental test apparatus and the operation of each unit;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Environmental test apparatus for electronic components 2 Cassette 2r Back surface of cassette 2p Left edge 2q Right edge 3 ... One-side connector 4 Test device main body 5 Cassette support 6 ... Other connector 7 Connection part 8 Movement mechanism (first movement) Mechanism unit) 11 heating mechanism unit 12 heater unit 13 second moving mechanism unit 15p slit unit 15q slit unit 16p positioning unit 16q positioning unit 17 drive circuit 18 connector disposition unit 19 circuit disposition unit W semiconductor wafer (electronic component) H cassette At right angles to the plane Pi Out / in position Pc Connection position

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Kazunori Asanuma 246 Koyuki, Sazaka, Nagano Prefecture Inside Orion Machinery Co., Ltd. (72) Inventor Masaaki Ishizaka 4-3-1 Tsunashima Higashi, Kohoku-ku, Yokohama, Kanagawa Prefecture Matsushita Communication Industrial Co., Ltd. F term (reference) 2G003 AA10 AB01 AC03 AD01 AD03 AH04 2G050 AA07 BA10 CA02 DA01 EA01 EA05 EC07 4M106 AA01 AA02 BA14 CA60 DG02 DG28 DH01 DH44 DH60 DJ23 5F031 CA02 DA01 MA33

Claims (7)

[Claims] An electronic component environmental test apparatus for performing an environmental test of an electronic component held in a cassette, wherein one or two or more one-side connectors are provided at a predetermined position on the back surface of the cassette, and the test apparatus main body is provided. A cassette support portion for supporting the cassette inserted from the outside, and one or more other connectors that face the back surface of the cassette supported by the cassette support portion and are connected to the one connector at a predetermined position. By selectively moving the cassette supporting portion and the cassette support portion relative to each other in a direction perpendicular to the plane of the cassette, a connecting position for inserting and removing the cassette or a connecting position for connecting one side connector to the other side connector is selectively provided. An environmental testing device for electronic components, comprising a moving mechanism (first moving mechanism) to be positioned. 2. The apparatus according to claim 1, wherein the test apparatus main body includes a heating mechanism having a heater for heating the electronic component in contact with or close to the cassette supported by the cassette support. Environmental testing equipment for electronic components. 3. The electronic component environmental test apparatus according to claim 2, wherein the heating mechanism includes a second moving mechanism for moving the heater in a direction perpendicular to the plane of the cassette. 4. The cassette supporting portion comprises a frame.
2. The electronic component environmental test apparatus according to claim 1, further comprising a slit portion into which the left and right side edges of the cassette are inserted, and a positioning portion for regulating the cassette inserted into the slit portion. 5. The environmental test apparatus for an electronic component according to claim 1, wherein the connection unit includes a drive circuit for applying a test signal to the electronic component. 6. The connector according to claim 1, wherein the connector includes a connector board on which the other-side connector is provided, and a circuit board facing the connector board and on which the drive circuit is provided. 6. The environmental test device for electronic components according to 1 or 5. 7. The electronic component environmental test apparatus according to claim 1, wherein said electronic component is a semiconductor wafer.