JP2000150548A - Manufacture of semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing technique by which a sealing section having an accurate external size can be formed by preventing the burring or chipping of the sealing section. SOLUTION: A substrate sheet 9 composed of a plurality of bases 2 each carrying a plurality of connection terminals formed on one surface and a plurality of substrate dividing grooves 11 respectively formed on the other surfaces of the boundary sections of the bases 2 is constituted so that individual sealing sections 7 formed at every base 2 may be separated from each other by bending the sheet 9 from the grooves 11, in such a way that, after semiconductor chips 4 are respectively mounted on the bases 2 and electrically connected to the connection terminals and a sealing resin 13 is supplied to the sheet 9, the resin 13 is divided into parts by mounting a partitioning jig 15 on the sheet 9, and, when the resin is half cured, removing the jig 15 and forming the sealing sections 7 at every base 2. Therefore, the burring and chipping of a semiconductor device can be prevented and sealing sections having accurate outside dimensions can be formed easily, because the sealing sections 7 are not divided at the time of dividing the sheet 9.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device manufacturing technique, and more particularly, to a semiconductor device having a plurality of bases, on each of which a semiconductor chip is mounted. The present invention is effective when applied to a technique for manufacturing a semiconductor device that is divided for each base.

[0002]

2. Description of the Related Art Conventionally, a ceramic type wire bonding type semiconductor device has a semiconductor chip on which a predetermined circuit is formed, the semiconductor chip mounted on one surface, and a plurality of electrode pads of the semiconductor chip and respective wires. A base having a plurality of connection terminals electrically connected to each other, and a surface provided on a surface facing one surface of the base (hereinafter, referred to as another surface). The plurality of connection terminals are connected to each other by wiring or the like provided on the base. External terminals that are electrically connected to each other, and a seal that seals one surface of the base, that is, a semiconductor chip mounted on the base and a whole connection portion between an electrode pad of the semiconductor chip and a connection terminal of the base. And a stop.

Such a semiconductor device is disclosed in, for example,
It was manufactured by a technique as shown in Japanese Patent Application No. 0-150119. As an outline, a substrate sheet for manufacturing the semiconductor device has a substrate dividing groove for each base on the other surface, and is electrically connected to an electrode pad of a semiconductor chip mounted on the base on one surface. A plurality of connection terminals are formed, and an external terminal mounting portion is formed on the other surface of the base to be electrically connected to the plurality of connection terminals and mount an external terminal. And the above-mentioned substrate sheet has an area divided by the substrate dividing groove on one surface thereof,
That is, a semiconductor chip is mounted on each of the bases, and the mounted semiconductor chip and the connection terminals of the base are electrically connected by wires or the like.
The substrate sheet in which the electrode pads of the semiconductor chip and the connection terminals of the base are electrically connected, supplies a liquid sealing resin to the entire surface thereof, and cures the sealing resin to form the base sheet. A sealing portion is formed to seal a whole area of a connection portion between the semiconductor chip and an electrode pad of the semiconductor chip and the connection terminal of the base. After that, the substrate sheet is cut so as to be bent from the direction of the substrate dividing groove to be divided into respective bases. Then, a ball made of metal is mounted on the external terminal mounting portion of the base,
A semiconductor device is manufactured by forming external terminals on the base.

[0004]

However, as described above, a liquid resin is supplied to the entire surface of the substrate sheet, and a sealing portion is formed by curing the liquid resin. In a semiconductor device manufacturing technique in which the substrate sheet is cut so as to be bent from the direction of the division groove and the substrate sheet is divided into respective bases, a substrate division groove is provided in the substrate sheet so that the substrate sheet is easily cut. Although configured, when cutting the substrate sheet to be bent from the direction of the substrate dividing groove,
A problem that the sealing portion is not cut vertically due to a method of applying stress or a void generated in the sealing portion, and burrs 27 as shown in FIG. 13 are generated in the sealing portion of the completed semiconductor device. was there. In this semiconductor device manufacturing technique, the semiconductor device 1 is configured to cut all four directions, and burrs 27 may be generated in a maximum of four directions.

Due to the burrs 27 generated on the sealing portion of the semiconductor device, the external dimensions of the semiconductor device 1 vary, and the standard of the external dimensions of the semiconductor device cannot be satisfied.

When the semiconductor device is mounted by positioning the semiconductor device on the basis of its outer shape, accurate positioning cannot be performed due to burrs 27 generated on the semiconductor device, and the mounting position of the semiconductor device is shifted. There was also a fear that it would.

Further, depending on the size of the burr 27 generated in the sealing portion of the semiconductor device, when the semiconductor device is inserted into the socket for a burn-in test or the like, the external terminals cannot contact the electrodes of the socket, or The burrs 27 hinder the insertion of the semiconductor device into the socket, making it impossible to perform a burn-in test or the like.

Further, since a large number of bases are arranged adjacent to each other on the substrate sheet, the sealing portion 7 of the semiconductor device adjacent to the semiconductor device on which the burrs 27 have occurred is chipped.
Will occur. When a large chip 28 occurs in the sealing portion 7 of the semiconductor device, a wire or the like that electrically connects the electrode pad of the semiconductor chip and the connection terminal of the base may be exposed from the sealing portion 7. There was also. In recent years, the size and thickness of the semiconductor device have been reduced, and the possibility of exposing the wire due to such a chip 28 of the sealing portion 7 tends to increase.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductor device manufacturing technique capable of preventing formation of burrs or chips in a sealing portion and forming a sealing portion having an accurate external dimension.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0011]

The following is a brief description of an outline of a typical invention among the inventions disclosed in the present application.

That is, in a semiconductor device manufacturing technique, a substrate sheet including a plurality of bases having a plurality of connection terminals formed on one surface and a plurality of substrate division grooves formed on the other surface of the boundary portion of the base. A semiconductor chip on which a predetermined circuit is formed is mounted on each of the bases,
Electrically connecting the semiconductor chip mounted on the base to the connection terminal, excluding at least the boundary portion of the substrate sheet, forming a sealing portion on the one surface, and forming the sealing portion on the other surface of the base. Forming a plurality of external terminals electrically connected to the connection terminals, bending the substrate sheet on which the sealing portion is formed from the direction of the substrate division groove, and dividing the substrate sheet for each base. Have

In the above-mentioned semiconductor device manufacturing technique,
The step of forming the sealing portion on the substrate sheet includes supplying a sealing resin to substantially the entire surface of the substrate sheet, and then separating the supplied sealing resin for each of the bases with the substrate jig. The sealing jig is attached to a sheet, and when the sealing resin is semi-cured, the partition jig is removed to form a sealing portion on the one surface except at least the boundary portion of the substrate sheet.

Further, in the semiconductor device manufacturing technique, the step of forming the sealing portion on the substrate sheet includes mounting a partition jig on one surface of the substrate sheet, and forming the base on the base sheet separated by the partition jig. By supplying a sealing resin to one surface, a sealing portion is formed on the one surface except for at least the boundary portion of the substrate sheet.

[0015] The partitioning jig is configured so as to increase in width from a portion in contact with the substrate sheet toward the other side.

Further, the partitioning jig has a releasing agent previously attached to a portion in contact with the sealing resin.

According to the above-described means, in a semiconductor device manufacturing technique, a plurality of bases each having a plurality of connection terminals formed on one surface, and a plurality of substrate dividing grooves formed respectively on the other surface of the boundary portion of the base. Mounting a semiconductor chip on which a predetermined circuit is formed on the base, and electrically connecting the semiconductor chip mounted on the base to the connection terminal; and Excluding the boundary, forming a sealing portion on the one surface, forming a plurality of external terminals electrically connected to the connection terminals on the other surface of the base, forming the sealing portion; Bending the divided substrate sheet from the direction of the substrate dividing groove, and dividing the substrate sheet into each base. When the substrate sheet is bent from the direction of the substrate division groove and divided into each base, only the division of the substrate sheet is sufficient, and the sealing formed on the substrate sheet is not performed. There is no need to divide the stop. Accordingly, since the sealing portion formed on the substrate sheet is not divided, it is possible to prevent burrs and chips from being generated in the semiconductor device when dividing the substrate sheet, and to obtain a highly accurate external shape. A sized seal can be formed.

In the above-mentioned semiconductor device manufacturing technique,
The step of forming the sealing portion on the substrate sheet includes supplying a sealing resin to substantially the entire surface of the substrate sheet, and then separating the supplied sealing resin for each of the bases with the substrate jig. Attached to the sheet, the sealing portion was formed by removing the partition jig when the sealing resin was semi-cured, so that at least the boundary portion of the substrate sheet was easily removed and sealed on the one surface. The stop can be easily formed.

Further, in the semiconductor device manufacturing technique, the step of forming the sealing portion on the substrate sheet includes a step of mounting a partition jig on one surface of the substrate sheet and forming the sealing jig on the base divided by the partition jig. By supplying the sealing resin to one surface, it is possible to easily form a sealing portion on the one surface except for at least the boundary portion of the substrate sheet, and to seal the base sheet separated by the partition jig. Since the sealing resin is supplied, the thickness of the sealing portion to be formed can be easily controlled, and the supply of the sealing resin to unnecessary portions can be eliminated.

Further, the partition jig is configured so as to become wider from the contact portion to the substrate sheet toward the other side, so that the partition jig can be easily removed when the partition jig is removed from the substrate sheet. In addition, the sealing portion formed on the substrate sheet can be formed in a trapezoidal shape. When the substrate sheet is bent and divided, there is no contact with an adjacent sealing portion, and the contact of the sealing portion is eliminated. Can be reduced.

Further, a release agent is attached to a portion of the partition jig in contact with the sealing resin in advance, so that when the partition jig is removed from the substrate sheet, the partition jig is sealed. It can be more easily peeled off from the resin.

[0022]

Embodiments of the present invention will be described below with reference to the drawings.

In all the drawings for describing the embodiments of the present invention, components having the same function are denoted by the same reference numerals, and
The description of the repetition is omitted.

(Embodiment 1) In the present embodiment, a case where the present invention is applied to a ceramic-based wire bonding type semiconductor device, for example, a CSP (Chip Size Package) will be described.

A ceramic-based wire bonding type semiconductor device 1 to which the present invention is applied is configured, for example, as shown in FIG. The semiconductor device 1 has a base 2 made of, for example, ceramic or the like, and the base 2 is formed in a substantially rectangular plate shape. And one surface of the base 2, that is, the surface on which the semiconductor chip is mounted,
A plurality of connection terminals 3 are provided along the vicinity of the end of the base 2. The plurality of connection terminals 3 are formed of a conductive material. On one surface of the base 2, a semiconductor chip 4 on which a predetermined circuit is formed is mounted. The semiconductor chip 4 has a plurality of electrode pads 5 on its circuit forming surface, and the electrode pads 5 of the semiconductor chip 4 and the connection terminals 3 of the base 2 are connected to wires 6 respectively.
Are electrically connected to each other. Further, a sealing portion 7 is provided on one surface of the base 2, the semiconductor chip 4 mounted on the base 2 by the sealing portion 7, the connection terminals 3 of the base 2, and the electrode pads 5 of the semiconductor chip. The whole area of the connection with is covered. A plurality of external terminal mounting portions (not shown) are formed on a surface (hereinafter, referred to as another surface) opposite to one surface of the base 2 so as to correspond to each of the plurality of connection terminals 3. The connection terminals 3 and the corresponding external terminal mounting portions are electrically connected to each other through wires provided on the base 2. The external terminal mounting portions provided on the other surface of the base 2 are provided with external terminals 8 made of, for example, solder or the like.

Next, a description will be given of a method of manufacturing a semiconductor device of the above-structured ceramic-based wire bonding system.

The substrate sheet 9 used for manufacturing the semiconductor device 1 is configured as shown in FIGS. 2 and 3, for example. The substrate sheet 9 is formed in a substantially square plate shape, and is configured so that a plurality of, for example, nine semiconductor devices 1 can be manufactured from one substrate sheet 9. Therefore, a plurality of bases 2 are arranged adjacent to the substrate sheet 9, and an outer frame portion 10 is arranged outside the plurality of bases 2 arranged adjacent to each other. A board dividing groove 11 is formed on the other surface of the substrate sheet 9 at the boundary between the respective bases 2 arranged on the substrate sheet 9 and at the boundary between the base 2 and the outer frame 10. ing. The substrate dividing groove 11 provided at the boundary of the substrate sheet 9 has a thickness of, for example, about 0.4
In the case of mm, it is formed with a depth of about 100 μm so that the substrate sheet 9 can be easily divided. The substrate dividing groove 11 provided in the substrate sheet 9 is formed by, for example, half etching or the like.

Further, one surface of the plurality of bases 2 arranged on the substrate sheet 9 shows a chip mounting portion 12 on which a semiconductor chip is mounted in a die bonding step. A plurality of connection terminals 3 are provided around the chip mounting portion 12 and are arranged so as to be electrically connectable to the semiconductor chip 4 mounted on the base 2. Further, a plurality of external terminal mounting portions are provided on the other surface of the substrate sheet 9, and the plurality of external terminal mounting portions are provided on one surface of the base 2 via wires provided on the base 2. Each of them is electrically connected to the corresponding connection terminal 3 provided. The substrate sheet 9 configured as described above is prepared in advance.

Next, the prepared substrate sheet 9 is subjected to die bonding and further wire bonding as shown in FIG. In the die bonding step, the substrate sheet 9 is held and fixed.
An adhesive, for example, an insulating paste is supplied to the chip mounting portion 12 of the base 2. The semiconductor chip 4 on which a predetermined circuit is formed is supplied to the chip mounting portion 12 to which the adhesive is supplied, and the semiconductor chip 4 is bonded to the chip mounting portion 12 of the base by the adhesive. Thus, the semiconductor chips 4 are bonded to all the bases 2 of the substrate sheet 9. Then, the substrate sheet 9 in which the bonding of the semiconductor chips 4 to all the bases 2 is completed is heated at a predetermined temperature
For example, by curing at about 180 ° C., the adhesive for bonding the base 2 and the semiconductor chip 4 is cured, and the semiconductor chip 4 is attached to the base 2 of the substrate sheet 9.
Fixed to Then, the substrate sheet 9 on which the semiconductor chips 4 are mounted is shifted to a wire bonding step.

In the wire bonding step, the electrode pad 5 provided on the semiconductor chip 4 and the base 2
Are electrically connected to each other by connecting with a wire 6 made of Au (gold) or Cu (copper) or the like. In this wire bonding step, the tip of the wire 6 is melted to form a ball, and then the ball is pressed against the electrode pad 5 while applying ultrasonic vibration to join the wire. Then, the rear end of the wire 6 is ultrasonically bonded to the connection terminal 3 of the base 2 so as to draw a predetermined loop shape. Thus, all the electrode pads 5 on the substrate sheet 9 and the corresponding connection terminals 3 are electrically connected by the wires 6. Then, the substrate sheet 9 after the completion of the wire bonding step is transferred to a sealing step.

The substrate sheet 9 on which the wire bonding has been completed is provided with an encapsulating resin 13 made of an epoxy-based thermosetting resin or the like integrally over substantially the entire surface thereof, so that at least the substrate sheet 9 is formed. The semiconductor chip 4 mounted on one surface and the connection portions between the electrode pads 5 of the semiconductor chip and the connection terminals 3 of the substrate sheet 9 are sealed so as to be covered.

In this sealing step, while the substrate sheet 9 is held and fixed, the sealing resin 13 is supplied to the substrate sheet 9 as shown in FIG. The supply of the sealing resin 13 to the substrate sheet 9 is performed on substantially the entire surface of one surface of the substrate sheet 9, that is, on one surface of the substrate sheet 9 excluding the vicinity of the end of the outer frame portion 10 by, for example, a dispenser 14. The sealing resin 13 is supplied by coating in a drawing method. The applied sealing resin 13 spreads on the substrate sheet 9, and one surface of all the bases 2 provided on the substrate sheet 9 is substantially uniform as shown in FIG. Covered.

Next, the substrate sheet 9 coated with the sealing resin 13 is subjected to a dividing process of the sealing resin 13. In the dividing process of the sealing resin 13, the substrate sheet 9
It is positioned and held at a predetermined position as shown in FIG. Then, a partition jig 15 formed corresponding to the substrate sheet 9 is mounted on one surface of the substrate sheet 9 as shown in FIG.

The partitioning jig 15 is configured to correspond to the substrate sheet 9. For example, the partitioning jig 15 is partitioned at a boundary between the bases 2 provided on the substrate sheet 9, that is, at a position corresponding to a break line. The part 16 is arranged. The leading end portion of the partition portion 16 is configured to be small so as to become wider outward from a portion in contact with the substrate sheet 9, and thereby, the
When extracting the partitioning jig 15 from the
Are configured to be easily removed from the semi-cured sealing resin 13. In the present embodiment, the partitioning portion 16 is formed so that the leading end thereof is small so that the partitioning jig 15 can be easily removed when the partitioning jig 15 is extracted from the substrate sheet 9. However, the partitioning portion 16 is applied on the substrate sheet 9. Any structure may be used as long as the sealing resin 13 can be partitioned for each base 2. In addition, by supplying the release agent to the partition 16 in advance, the sealing resin 13
Out of the vehicle. The partition jig 1
Reference numeral 5 denotes an opening 17 formed at a position corresponding to the upper side of each of the bases 2. When it is difficult to remove the partitioning jig 15 from the substrate sheet 9, the sealing resin 13 is extruded from the opening 17. You can also. Further, at a position corresponding to the outer frame portion 10 of the substrate sheet 9, a resin escape portion 1 is provided.
8 are formed. The partition jig 15 has a positioning portion 19 for positioning the partition 16 so that the partition 16 is arranged at the boundary of the base 2 of the substrate sheet 9. By mounting the partition jig 15 configured as described above on the substrate sheet 9, the partition 16 of the partition jig comes into close contact with the boundary of each base 2, and the sealing resin 13 on the boundary is formed. Is removed, and the sealing resin 13 integrally applied to one surface of the substrate sheet 9 is divided for each base 2. The partition jig 15 attached to the substrate sheet 9 is moved from the substrate sheet 9 to the partition jig 1 when the sealing resin 13 is semi-cured, for example.
5 is removed. Since the sealing resin 13 of the substrate sheet 9 from which the partitioning jig 15 has been removed is semi-cured, the external shape molded by the partitioning jig 15 is maintained, and the base 2 is attached to the sealing portion. Groove 2 on the boundary of
0 is formed. Then, on the base 2 of the substrate sheet 9, a sealing portion 7 covering the semiconductor chip 4 and the wires 6 for electrically connecting the electrode pads 5 of the semiconductor chip and the connection terminals 3 on the substrate sheet is provided. It is divided and formed. The semi-cured sealing portion 7 formed on the substrate sheet 9 is completely cured by further heating, and is sealed for each base 2 on the substrate sheet 9 as shown in FIG. A stop 7 is formed.

The sealing resin 13 is integrally applied to one surface of the substrate sheet 9 to which the plurality of bases 2 are connected as described above, and the sealing resin 13 applied to the substrate sheet 9 is separated by a partition jig 15 or the like. By removing the sealing resin 13 applied to the break line at the base boundary of the substrate sheet 9 and removing the partition jig 15 when the sealing resin 13 of the substrate sheet 9 is semi-cured. Except for the boundary portion on the substrate sheet 9, the sealing portion 7 divided and formed for each base 2 of the substrate sheet can be formed easily and accurately. Further, since the sealing portion 7 formed on the substrate sheet 9 is divided and formed, the stress applied to the substrate sheet 9 is reduced, and the warpage of the substrate sheet 9 can be reduced.

When the sealing resin 13 supplied to one surface of the substrate sheet 9 is divided and formed for each base 2, the substrate sheet 9 is transferred to an external terminal mounting step. In the external terminal mounting step, the substrate sheet 9 on which the predetermined sealing portion 7 is formed is held and fixed such that the other surface of the substrate sheet 9 faces upward as shown in FIG. Then, balls 21 made of, for example, solder or the like are attached to a plurality of external terminal mounting portions formed on the other surface of the substrate sheet 9.
Is supplied. The supply of the balls 21 to the external terminal mounting portion is performed by, for example, a suction mechanism 22 so that the plurality of balls 21 are disposed in an arrangement corresponding to the plurality of external terminal mounting portions of the substrate sheet 9.
And the plurality of balls 21 thus sucked are collectively supplied to the substrate sheet 9. And the substrate sheet 9
The ball 21 supplied to the external terminal mounting portion is fixed to the external terminal mounting portion by reflow,
As shown in FIG. 8B, a plurality of external terminals 8 are formed on the other surface of the substrate sheet 9. Then, the substrate sheet 9 on which the formation of the external terminals 8 is completed is transferred to a substrate dividing step.

In the substrate dividing step, the substrate sheet 9 on which the external terminals 8 are formed is placed on a receiving stand 23 as shown in FIG. The dividing grooves 11 are
It is arranged so that it may come to the end. A protective layer 26 made of, for example, hard rubber is provided on a contact surface of the holding mechanism 24 with the external terminal 8 so as to prevent deformation of the external terminal and to hold down the substrate sheet 9. ing. Then, the substrate sheet 9 held and fixed to the receiving stand 23 is, as shown in FIG.
5 is driven to be bent from the direction of the substrate dividing groove 11, and the substrate sheet 9 is divided from the boundary of the base 2. In the division of the substrate sheet 9, the substrate sheet 9 is provided in the substrate division groove 11 on the other surface.
The substrate sheet is easily divided from the boundary of the base 2. The contact surface of the punch 25 with the external terminal 8 is also provided with a protective layer 2 made of, for example, hard rubber, in order to prevent the displacement of the contacting external terminal 8 similarly to the pressing mechanism 24.
6 are provided. Thus, the substrate sheet 9
As described above, the sealing resin 13 applied to the boundary portion of the base 2 is removed, and the sealing portion 7 is formed separately for each base 2. There is no division, and only the substrate sheet 9 is divided. Therefore, since the division of the sealing portion 7 accompanying the division of the substrate sheet 9 is eliminated, the burr 27 and chipping of the sealing portion 7 do not occur, and the substrate sheet can be divided for each base. it can.

Then, all the substrate dividing grooves of the substrate sheet 9 are cut in the same manner, and the substrate sheet 9 is divided into the respective bases 2 so that burrs as shown in FIG. The semiconductor device 1 of the ceramic type having the good sealing portion 7 and of the wire bonding method can be formed.

(Embodiment 2) Next, a method of manufacturing a semiconductor device according to another embodiment of the present invention will be briefly described with reference to the drawings.

In the present embodiment, similarly to the first embodiment, a substrate sheet 9 configured as shown in FIGS. 2 and 3 is prepared in advance. The prepared substrate sheet 9 is shown in FIG.
As shown in (a), in the die bonding step, the semiconductor chips 4 are bonded and fixed to the respective bases 2 of the substrate sheet 9 via an adhesive. Then, the substrate sheet 9 on which the mounting of the semiconductor chips 4 on all the bases 2 is completed is transferred to a wire bonding step. In the wire bonding step, the electrode pads 5 provided on the semiconductor chip 4 and the connection terminals 3 of the base 2 are electrically connected by wires 6.
Then, the substrate sheet 9 in which the connection between all the electrode pads 5 and the connection terminals is completed is transferred to a sealing step.

In the sealing step according to the present embodiment, first, a partition jig 15 configured in the same manner as in the first embodiment as shown in FIG. You. The partitioning jig 15 mounted on the substrate sheet 9 has a leading end of the partitioning portion 16 in close contact with a boundary portion of the base of the substrate sheet 9,
Each of the bases 2 is partitioned. An opening 17 is formed above the base 2 separated by the partition 16.

The substrate sheet 9 to which the partition jig 15 is attached is held and fixed, and one surface of the base 2 is made of, for example, an epoxy-based thermosetting resin or the like, as shown in FIG. 11C. The sealing resin 13 is supplied. The sealing resin 13 is supplied to the base 2 separated by the partition jig 15 from the opening 17 of the partition jig 15 provided above the base 2 by the dispenser 14 or the like. Supplied by coating. Then, the applied sealing resin 13 spreads on the base 2 partitioned by the partitioning jig 15, the base 2 is uniformly covered with the sealing resin 13, and the outer shape of the sealing portion 7 is molded. . As described above, in the present embodiment, the sealing resin 13 is supplied to the space divided on all sides by the partition jig.
The control of the thickness of the sealing portion 7 formed by the application amount of 3 becomes easy, and the application of the sealing resin 13 to unnecessary portions of the substrate sheet 9 can be eliminated. The substrate sheet 9 in which the application of the sealing resin 13 to all the bases 2 is completed is mounted on the substrate sheet 9 when the sealing resin 13 applied to the substrate sheet 9 is in a semi-cured state. The partitioning jig 15 is removed. The partition jig 1
Since the substrate sheet 9 from which 5 has been removed is in a semi-cured state, the sealing resin 13 maintains the outer shape that has been molded by the partition jig 15. The sealing resin 13 in the semi-cured state is completely cured by curing the substrate sheet 9, and as shown in FIG. 11D, there is no sealing resin 13 at the boundary of the base 2. A sealing portion 7 having a predetermined external dimension can be formed for each base 2. The sealing portion 7 formed on the base is provided with the mounted partition jig 1.
Since the leading end of the partitioning jig 15 is formed small so that the partitioning portion 16 of 5 can easily come off from the sealing resin 13, the sealing portion 7 is formed in a substantially trapezoidal shape on the base 2. I have. In addition, by supplying the release agent to the partition portion 16 in advance, the release agent can be more easily removed from the sealing resin 13.

A partition jig 15 is mounted on the substrate sheet 9 to which the plurality of bases 2 are connected in this way, and a sealing resin 13 is provided on one surface of the base separated by the partition jig 15.
When the sealing resin 13 of the substrate sheet 9 is semi-cured, the partition jig 15 is removed to remove the boundary portion of the base 2 on the substrate sheet 9,
Since the sealing portion 7 can be easily and accurately formed for each of the bases 2 and the sealing resin 13 is supplied to the bases 2 separated by the partition jig 15, the sealing portion 7 is provided. 7 can be easily controlled.

The substrate sheet 9 having the sealing portions 7 formed on the respective bases 2 is transferred to an external terminal mounting step, and a ball 21 made of, for example, solder is supplied to the other surface of the substrate sheet 9. As shown in FIG. 12A, a plurality of external terminals 8 are formed on the external terminal mounting portion.

The substrate sheet 9 on which the plurality of external terminals are formed is divided for each base 2 in a substrate dividing step. In the substrate dividing step, as in the first embodiment, the substrate sheet 9 on which the external terminals 8 are formed
And the substrate dividing groove 11 of the substrate sheet 9 is held and fixed so as to be arranged at the end of the receiving base 23.
Then, the substrate sheet 9 held and fixed to the receiving table drives the punch 25, and the substrate dividing groove 11 provided in the substrate is provided.
The substrate sheet 9 is easily divided from the substrate dividing groove by cutting so as to bend from the direction of FIG. Then, by dividing all the substrate dividing grooves of the substrate sheet 9 in the same manner, a substrate is formed as shown in FIG.
Then, a semiconductor device 1 of a ceramic type and a wire bonding method as shown in FIG. 10 is obtained. Since the sealing portion 7 is divided and formed for each base 2 except for the boundary portion of the base 2 of the substrate sheet 9 in this manner, the sealing portion 7 is not divided in the substrate dividing step, and the sealing is performed. It is possible to eliminate the generation of burrs at the stop.

As described above, the invention made by the inventor has been specifically described based on the embodiment. However, the present invention is not limited to the embodiment, and can be variously modified without departing from the gist of the invention. Needless to say. For example, in the present embodiment, the partition jig 15 is attached to the substrate sheet 9, and the partition 16 of the partition jig 15 is brought into close contact with the substrate sheet 9, except for the boundary portion of the base 2 of the substrate sheet 9, Although the sealing portions 7 are formed separately on the respective bases 2, any configuration may be used as long as the sealing resin 13 forming the sealing portions 7 can be partitioned.

In the present embodiment, the substrate sheet 9 is divided by an integral partition 16 corresponding to the boundary of the base, and a sealing portion is attached to each base except for the boundary of the base of the substrate sheet 9. 7 is formed so as to be divided, but the intermittent partition 1 is formed at the boundary of the base.
By dividing by 6, it is also possible to form a sealing portion by intermittently removing the boundary portion of the base of the substrate sheet 9. Thereby, the sealing portion formed on one surface of the substrate sheet 9 has the groove portion 20 formed intermittently along the boundary portion of the base. It can be configured to be easily divided along the groove 20.

Further, in the present embodiment, the case where the present invention is applied to a ceramic type wire bonding type semiconductor device has been described, but the substrate sheet 9 having a plurality of bases is described.
Can be applied to any product as long as it is manufactured so that the base is integrally sealed and then divided into each base.

[0049]

The effects obtained by typical ones of the inventions disclosed in the present application will be briefly described as follows.

That is, in a semiconductor device manufacturing technique, a substrate sheet comprising a plurality of bases having a plurality of connection terminals formed on one surface and a plurality of substrate division grooves formed on the other surface of the boundary portion of the base. A semiconductor chip on which a predetermined circuit is formed is mounted on each of the bases,
Electrically connecting the semiconductor chip mounted on the base to the connection terminal, excluding at least the boundary portion of the substrate sheet, forming a sealing portion on the one surface, and forming the sealing portion on the other surface of the base. Forming a plurality of external terminals electrically connected to the connection terminals, bending the substrate sheet on which the sealing portion is formed from the direction of the substrate division groove, and dividing the substrate sheet for each base. With this configuration, the sealing portion is not formed at the boundary portion of the substrate sheet, so that the sealing portion does not need to be divided when the substrate sheet is divided, and Burrs and chips can be prevented from occurring. Therefore, a sealing portion having an accurate external dimension can be easily formed, and the quality or yield of the semiconductor device can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a schematic configuration of a ceramic type wire bonding type semiconductor device to which the present invention is applied.

FIG. 2 is a plan view showing a schematic configuration of a substrate sheet used in a semiconductor device to which the present invention is applied.

FIG. 3 is a cross-sectional view illustrating a schematic configuration of a substrate sheet used in a semiconductor device to which the present invention is applied.

FIG. 4 is a sectional view showing a schematic configuration of a substrate sheet after die bonding and wire bonding.

FIG. 5 is a cross-sectional view illustrating a process of applying a sealing resin to a substrate sheet according to an embodiment of the present invention.

FIG. 6 is a plan view illustrating a schematic configuration of a substrate sheet after a sealing resin coating process according to an embodiment of the present invention.

FIG. 7 is a cross-sectional view illustrating a substrate dividing process into substrate sheets after a sealing resin coating process according to an embodiment of the present invention.

FIG. 8 is a cross-sectional view showing a process of forming external terminals on a substrate sheet according to an embodiment of the present invention.

FIG. 9 is a cross-sectional view illustrating a substrate dividing process according to an embodiment of the present invention, which divides a substrate sheet into individual semiconductor devices.

FIG. 10 is a sectional view showing a semiconductor device formed by a manufacturing method according to an embodiment of the present invention.

FIG. 11 is a cross-sectional view illustrating a flow of forming a sealing portion on a substrate sheet according to another embodiment of the present invention.

FIG. 12 is a cross-sectional view illustrating a schematic configuration of a substrate sheet after mounting external terminals and dividing the substrate according to another embodiment of the present invention.

FIG. 13 is a cross-sectional view showing a burr and a chip formed in a sealing portion of a semiconductor device, which is a conventional problem.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Semiconductor device, 2 ... Base, 3 ... Connection terminal, 4 ... Semiconductor chip, 5 ... Electrode pad, 6 ... Wire, 7 ... Sealing part,
8 external terminal, 9 substrate board, 10 outer frame part, 11 ...
Substrate dividing groove, 12: chip mounting portion, 13: sealing resin,
14 dispenser, 15 partition jig, 16 partition part, 17 opening, 18 relief part, 19 positioning part,
Reference numeral 20: groove, 21: ball, 22: suction mechanism, 23: receiving mechanism, 24: pressing mechanism, 25: protective layer, 26: punch, 27: burr, 28: chipping.

Claims (5)

[Claims] A predetermined circuit is formed on a substrate sheet including a plurality of bases each having a plurality of connection terminals formed on one surface and a plurality of substrate division grooves formed respectively on the other surface of the boundary portion of the base. Mounting the semiconductor chips mounted on the base respectively, and electrically connecting the semiconductor chips mounted on the base to the connection terminals, and excluding at least the boundary portion of the substrate sheet, a sealing portion on the one surface. Forming a plurality of external terminals electrically connected to the connection terminals on the other surface of the base, and forming the substrate sheet on which the sealing portion is formed from the direction of the substrate division groove. Bending and dividing each of the bases. 2. A step of forming the sealing portion on the substrate sheet, comprising: supplying a sealing resin to substantially the entire surface of the substrate sheet; and dividing the supplied sealing resin for each of the bases. Attach the jig to the substrate sheet, remove the partition jig when the sealing resin is semi-cured, remove at least the boundary portion of the substrate sheet, forming a sealing portion on the one surface. The method for manufacturing a semiconductor device according to claim 1, wherein: 3. The step of forming the sealing portion on the substrate sheet includes mounting a partitioning jig on one surface of the substrate sheet and supplying a sealing resin to one surface of the base separated by the partitioning jig. 2. The semiconductor device according to claim 1, wherein a sealing portion is formed on the one surface except at least the boundary portion of the substrate sheet. 4. The method for manufacturing a semiconductor device according to claim 2, wherein said partitioning jig is configured so as to become wider from a portion in contact with said substrate sheet toward the other side. . 5. The method for manufacturing a semiconductor device according to claim 2, wherein said partitioning jig is preliminarily provided with a release agent at a portion in contact with a sealing resin.