JP2000129089A - Flame-retardant resin composition, prepreg prepared by using same and laminate - Google Patents
Flame-retardant resin composition, prepreg prepared by using same and laminateInfo
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- JP2000129089A JP2000129089A JP29956598A JP29956598A JP2000129089A JP 2000129089 A JP2000129089 A JP 2000129089A JP 29956598 A JP29956598 A JP 29956598A JP 29956598 A JP29956598 A JP 29956598A JP 2000129089 A JP2000129089 A JP 2000129089A
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- epoxy resin
- flame
- resin
- resin composition
- heat resistance
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- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はハロゲン系難燃剤を
使用しなくても優れた難燃性を有する樹脂組成物、プリ
プレグ及び積層板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin composition, a prepreg and a laminate having excellent flame retardancy without using a halogen-based flame retardant.
【０００２】エポキシ樹脂等に代表される熱硬化性樹脂
はその優れた特性から電気及び電子機器部品等に広く使
用されており、火災に対する安全性を確保するため難燃
性が付与されている場合が多い。これらの樹脂の難燃化
は従来臭素化エポキシ樹脂等のハロゲン含有化合物を用
いることが一般的であった。これらのハロゲン含有化合
物は高度な難燃性を有するが、芳香族臭素化合物は熱分
解すると腐食性の臭素、臭化水素を分離するだけでな
く、酸素存在下で分解した場合に毒性の高いポリブロム
ジベンゾフラン及びポリジブロモベンゾオキシンを形成
する可能性がある。また、臭素を含有する老朽廃材の処
分は困難である。このような理由から臭素含有難燃剤に
代わる難燃剤としてリン化合物や窒素化合物が検討され
ている。[0002] Thermosetting resins represented by epoxy resins are widely used in electric and electronic equipment parts due to their excellent properties, and are provided with flame retardancy to ensure fire safety. There are many. Conventionally, these resins have generally used a halogen-containing compound such as a brominated epoxy resin. Although these halogen-containing compounds have high flame retardancy, aromatic bromine compounds not only separate corrosive bromine and hydrogen bromide when thermally decomposed, but also have high toxicity when decomposed in the presence of oxygen. May form bromodibenzofuran and polydibromobenzooxin. In addition, disposal of aging waste materials containing bromine is difficult. For these reasons, phosphorus compounds and nitrogen compounds have been studied as flame retardants instead of bromine-containing flame retardants.
【０００３】前述のように、リン化合物及び窒素化合物
によって難燃化を実現することができる。その機構は、
窒素化合物がリン化合物の分解および熱縮合によるポリ
リン酸の生成を促進し、生成したポリリン酸がエポキシ
樹脂の表面に被膜を形成し、断熱効果、酸素遮断効果を
生じ、その結果、燃焼を防ぐというものである。難燃化
のために用いられる窒素化合物としてはトリアジン変性
ノボラックが難燃性が高く、優れた化合物であることは
周知の事実である。[0003] As described above, flame retardancy can be realized by a phosphorus compound and a nitrogen compound. The mechanism is
Nitrogen compounds promote the generation of polyphosphoric acid by decomposition of phosphorus compounds and thermal condensation, and the generated polyphosphoric acid forms a film on the surface of the epoxy resin, resulting in a heat insulating effect, oxygen blocking effect, and as a result, preventing combustion Things. It is a well-known fact that triazine-modified novolak has high flame retardancy and is an excellent compound as a nitrogen compound used for flame retardation.
【０００４】エポキシの硬化剤としてトリアジン変性フ
ェノールノボラック樹脂を使用した場合、吸湿しやすく
なる。またリン化合物も一般に吸湿しやすく、吸湿によ
り半田耐熱性が低下するという欠点が生じる。このた
め、窒素及びリンの樹脂中に含まれる量は出来るだけ少
量にするべきであるが、一般に用いられるビスフェノー
ルＡエポキシ樹脂を使用すると、窒素及びリン含有量を
少なくした場合難燃性が低下する。When a triazine-modified phenol novolak resin is used as a curing agent for epoxy, it becomes easy to absorb moisture. Phosphorus compounds also generally tend to absorb moisture, resulting in the disadvantage that the moisture absorption lowers the solder heat resistance. Therefore, the amount of nitrogen and phosphorus contained in the resin should be as small as possible. However, when a commonly used bisphenol A epoxy resin is used, the flame retardancy is reduced when the nitrogen and phosphorus contents are reduced. .
【０００５】[0005]
【発明が解決しようとする課題】本発明は、このような
問題を解決すべく検討した結果なされたものであり、エ
ポキシ樹脂として耐熱性の高いノボラックエポキシ樹脂
を使用することにより、少量の窒素とリンで難燃性を実
現でき、吸湿半田耐熱性に優れ、また、トリアジン変性
フェノールノボラック樹脂とリン原子含有化合物を併用
することによって窒素とリンの相互作用によりハロゲン
を使用しないで難燃性を発現させることができるもの
で、高度な難燃性を有する樹脂組成物、これを用いたプ
リプレグ及びこのプリプレグから得られた積層板を提供
するものである。DISCLOSURE OF THE INVENTION The present invention has been made as a result of studying to solve such a problem. By using a novolak epoxy resin having high heat resistance as an epoxy resin, a small amount of nitrogen can be reduced. Phosphorus achieves flame retardancy, excels in heat resistance to moisture-absorbing solder, and uses triazine-modified phenol novolak resin and a phosphorus atom-containing compound to develop flame retardancy without the use of halogen due to the interaction between nitrogen and phosphorus The present invention provides a resin composition having high flame retardancy, a prepreg using the same, and a laminate obtained from the prepreg.
【０００６】[0006]
【課題を解決するための手段】本発明は、（Ａ）ノボラ
ックエポキシ樹脂、（Ｂ）トリアジン変性フェノールノ
ボラック樹脂からなる硬化剤、及び（Ｃ）９，１０−ジ
ヒドロ−９−オキサ−１０−ホスファフェナントレン−
１０−オキシドを必須成分として含有してなることを特
徴とする難燃性樹脂組成物、及び前記難燃性樹脂組成物
を基材に含浸させてなることを特徴とするプリプレグ、
さらに前記プリプレグを１枚以上重ね合わせ加熱加圧し
てなることを特徴とする難燃性積層板又は銅張積層板に
関するものである。SUMMARY OF THE INVENTION The present invention provides a curing agent comprising (A) a novolak epoxy resin, (B) a triazine-modified phenol novolak resin, and (C) 9,10-dihydro-9-oxa-10-phos. Fafenanthrene
Flame-retardant resin composition comprising 10-oxide as an essential component, and a prepreg characterized by impregnating a substrate with the flame-retardant resin composition,
Furthermore, the present invention relates to a flame-retardant laminate or a copper-clad laminate, wherein one or more prepregs are stacked and heated and pressed.
【０００７】前述のように、（Ｂ）トリアジン変性フェ
ノールノボラック樹脂はエポキシ樹脂の窒素系難燃剤と
して有用であるが吸湿しやすい。また一般的にリン化合
物も吸湿しやすい。吸湿により半田耐熱性が低下する。
このため、窒素及びリンの樹脂中に含まれる量は出来る
だけ少量にするべきであるが、一般に用いられるビスフ
ェノールＡエポキシ樹脂では、窒素及びリン含有量を少
なくした場合難燃性が低下する欠点がある。As described above, the triazine-modified phenol novolak resin (B) is useful as a nitrogen-based flame retardant for an epoxy resin, but easily absorbs moisture. In general, phosphorus compounds also tend to absorb moisture. Solder heat resistance decreases due to moisture absorption.
For this reason, the amount of nitrogen and phosphorus contained in the resin should be as small as possible, but the commonly used bisphenol A epoxy resin has the disadvantage that the flame retardancy decreases when the nitrogen and phosphorus content is reduced. is there.
【０００８】一般的に（Ａ）ノボラックエポキシ樹脂は
耐熱性が高く、またベンゼン環含有率が高いため、熱分
解すると炭化されやすい。このためビスフェノールＡエ
ポキシに比べて難燃性が高い特長をもつ。エポキシ樹脂
としてノボラックエポキシ樹脂を使用すれば、窒素及び
リンの樹脂中に含まれる量を出来るだけ少量にすること
ができる。しかしながらノボラックエポキシ樹脂硬化物
は架橋密度が大きくなり堅くなる欠点がある。そこで架
橋密度を下げるためにエポキシ基と反応する官能基を１
つもつ化合物を併用すればよいが、（Ｃ）９，１０−ジ
ヒドロ−９−オキサ−１０−ホスファフェナントレン−
１０−オキシドは１分子がエポキシ基１官能基と反応す
るので、希釈剤と同等の働きをし、かつ難燃性も高い。[0008] In general, the novolak epoxy resin (A) has high heat resistance and a high benzene ring content, so that it is easily carbonized when thermally decomposed. For this reason, it has the feature that flame retardancy is higher than bisphenol A epoxy. If a novolak epoxy resin is used as the epoxy resin, the amount of nitrogen and phosphorus contained in the resin can be made as small as possible. However, the cured novolak epoxy resin has a disadvantage that the crosslink density is increased and the cured product becomes hard. Therefore, in order to lower the crosslink density, one functional group that reacts with the epoxy group
(C) 9,10-dihydro-9-oxa-10-phosphaphenanthrene-
Since one molecule of the 10-oxide reacts with one functional group of the epoxy group, it functions as a diluent and has high flame retardancy.
【０００９】そこで（Ａ）ノボラックエポキシ樹脂と
（Ｂ）トリアジン変性フェノールノボラック樹脂と
（Ｃ）９，１０−ジヒドロ−９−オキサ−１０−ホスフ
ァフェナントレン−１０−オキシドを併用することによ
り、窒素及びリンの樹脂中に含まれる量を出来るだけ少
量にすることで吸湿半田耐熱性を満足できる。以上のよ
うに、本発明においては、エポキシ樹脂としてノボラッ
クエポキシ樹脂、エポキシ樹脂の硬化剤としてトリアジ
ン変性フェノールノボラック樹脂を用い、さらに９，１
０−ジヒドロ−９−オキサ−１０−ホスファフェナント
レン−１０−オキシドを併用することにより、窒素とリ
ンの相互作用によりハロゲン化物を使用しないで優れた
難燃性を発現させることを技術骨子とするものである。Therefore, by using (A) novolak epoxy resin, (B) triazine-modified phenol novolak resin and (C) 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide in combination, nitrogen and By making the amount of phosphorus contained in the resin as small as possible, the moisture absorption solder heat resistance can be satisfied. As described above, in the present invention, novolak epoxy resin is used as the epoxy resin, and triazine-modified phenol novolak resin is used as the curing agent for the epoxy resin.
The technical essence is to develop excellent flame retardancy by using 0-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide without using a halide by the interaction between nitrogen and phosphorus. Things.
【００１０】本発明で用いる(Ａ)成分のノボラックエポ
キシ樹脂としては、フェノールノボラックエポキシ樹
脂、クレゾールノボラックエポキシ樹脂、一般式（１）
で表されるフェノールアラルキルエポキシ樹脂又は一般
式（２）で表されるナフタレンアラルキルエポキシ樹脂
などがあげられるが、これらに限定されるものではな
く、また数種類を同時に用いても差し支えない。耐熱性
を考慮するとクレゾールノボラックエポキシ樹脂が好ま
しく、さらに耐熱性と低吸水率を考慮すると一般式
（１）で表されるフェノールアラルキルエポキシ樹脂又
は一般式（２）で表されるナフタレンアラルキルエポキ
シ樹脂が好ましい。The novolak epoxy resin of the component (A) used in the present invention includes a phenol novolak epoxy resin, a cresol novolak epoxy resin, and a compound represented by the general formula (1):
Or a naphthalene aralkyl epoxy resin represented by the general formula (2), but is not limited thereto, and several kinds may be used at the same time. Considering heat resistance, cresol novolak epoxy resin is preferable, and further considering heat resistance and low water absorption, phenol aralkyl epoxy resin represented by general formula (1) or naphthalene aralkyl epoxy resin represented by general formula (2) is preferable. preferable.
【化１】 Embedded image
【００１１】本発明で用いる（Ｂ）成分はトリアジン変
性フェノールノボラック樹脂からなる硬化剤であるが、
例えば下記一般式（３）で表される。このトリアジン変
性フェノールノボラック樹脂は、エポキシ樹脂の硬化剤
の全部又は一部として配合される。トリアジン変性フェ
ノールノボラック樹脂は、窒素含有量が少ないと難燃性
に対する効果が小さいことから窒素含有量８重量％以上
のものが望ましい。The component (B) used in the present invention is a curing agent comprising a triazine-modified phenol novolak resin.
For example, it is represented by the following general formula (3). This triazine-modified phenol novolak resin is blended as all or a part of a curing agent for the epoxy resin. The triazine-modified phenol novolak resin preferably has a nitrogen content of 8% by weight or more because the effect on flame retardancy is small if the nitrogen content is small.
【化２】 硬化剤の一部として、フェノールノボラック樹脂、芳香
族アミン等、トリアジン変性フェノールノボラック樹脂
以外のものを使用することができる。特に、フェノール
アラルキル樹脂もしくはナフタレンアラルキル樹脂は、
吸水率が低くかつ難燃性が高い特長を持つので、好まし
いものである。さらに、フェノールノボラック樹脂より
も水酸基当量が大きいため、硬化収縮が小さく密着力に
優れる。このためフェノールアラルキル樹脂、ナフタレ
ンアラルキル樹脂を併用すると樹脂特性を向上できる。Embedded image As a part of the curing agent, those other than the triazine-modified phenol novolak resin, such as a phenol novolak resin and an aromatic amine, can be used. In particular, phenol aralkyl resin or naphthalene aralkyl resin,
It is preferable because it has features of low water absorption and high flame retardancy. Furthermore, since the hydroxyl equivalent is larger than that of the phenol novolak resin, curing shrinkage is small and adhesion is excellent. Therefore, when a phenol aralkyl resin and a naphthalene aralkyl resin are used in combination, the resin properties can be improved.
【００１２】本発明の難燃性樹脂組成物は、上述したノ
ボラックエポキシ樹脂とトリアジン変性フェノールノボ
ラック樹脂と９，１０−ジヒドロ−９−オキサ−１０−
ホスファフェナントレン−１０−オキシドを必須成分と
して含有するが、本発明の目的に反しない範囲におい
て、その他の硬化剤、硬化促進剤、カップリング剤、そ
の他の成分を添加することは差し支えない。The flame-retardant resin composition of the present invention comprises the above-mentioned novolak epoxy resin, triazine-modified phenol novolak resin, and 9,10-dihydro-9-oxa-10-
Although phosphaphenanthrene-10-oxide is contained as an essential component, other curing agents, curing accelerators, coupling agents, and other components may be added without departing from the object of the present invention.
【００１３】本発明の難燃性樹脂組成物は種々の形態で
利用されるが、プリプレグを得るために、基材に含浸す
る際には通常溶剤が使用される。用いられる溶剤は組成
に対して良好な溶解性を示すことが望ましいが、悪影響
を及ぼさない範囲で貧溶媒を使用しても構わない。Although the flame-retardant resin composition of the present invention is used in various forms, a solvent is usually used when impregnating a substrate to obtain a prepreg. It is desirable that the solvent used has good solubility in the composition, but a poor solvent may be used as long as it does not adversely affect the composition.
【００１４】本発明の難燃性樹脂組成物を溶剤に溶解し
て得られるワニスはガラス織布、ガラス不織布、あるい
はガラス以外を成分とする織布又は不織布等の基材に塗
布、含浸させ、８０〜２００℃で乾燥させることにより
プリプレグを得ることが出来る。かかるプリプレグは加
熱加圧して積層板又は銅張積層板を製造することに用い
られる。本発明の難燃性樹脂組成物はハロゲン化合物を
含有しなくとも高度な難燃性を有する熱硬化性樹脂組成
物であり、特に、プリント配線板用の積層板等に好適に
使用されるものである。The varnish obtained by dissolving the flame-retardant resin composition of the present invention in a solvent is applied and impregnated on a substrate such as glass woven fabric, glass non-woven fabric, or woven fabric or non-woven fabric containing a component other than glass. Prepreg can be obtained by drying at 80 to 200 ° C. Such a prepreg is used for producing a laminate or a copper-clad laminate by heating and pressing. The flame-retardant resin composition of the present invention is a thermosetting resin composition having high flame retardancy even without containing a halogen compound, and is particularly preferably used for a laminated board for printed wiring boards and the like. It is.
【００１５】[0015]
【実施例】以下、本発明を実施例により具体的に説明す
る。The present invention will be described below in more detail with reference to examples.
【００１６】（実施例１）フェノールノボラックエポキ
シ樹脂（大日本インキ化学工業(株)製エピクロンＮ−７
７０）１００重量部、フェノールアラルキル樹脂（三井
化学(株)製ミレックスＸＬＣ−ＬＬ）４０重量部、トリ
アジン変性フェノールノボラック樹脂（大日本インキ化
学工業(株)製ＬＡ−７０５４）２９重量部、及び９，１
０−ジヒドロ−９−オキサ−１０−ホスファフェナント
レン−１０−オキシド（三光化学(株)製ＨＣＡ）２１重
量部にメチルセルソルブを加え、不揮発分濃度６０重量
％となるようにワニスを調製した。このときエポキシ樹
脂、リン化合物及び硬化剤の合計１００重量部に対し、
リン成分が１．６重量部、窒素成分が１．８重量部とな
った。このワニスを用いて、ガラス織布（厚さ０．１８
ｍｍ、日東紡績(株)製）１００重量部にワニス固形分で
８０重量部含浸させて、１５０℃の乾燥装置で５分乾燥
させ、樹脂含有量４４．４重量％のプリプレグを作製し
た。上記プリプレグを６枚を重ね、上下に厚さ３５μｍ
の電解銅箔を重ねて、圧力４０ｋｇｆ／ｃｍ2 、温度１
９０℃で１２０分加熱加圧成形を行い、厚さ１．２ｍｍ
の両面銅張積層板を得た。(Example 1) Phenol novolak epoxy resin (Epiclon N-7 manufactured by Dainippon Ink and Chemicals, Inc.)
70) 100 parts by weight, 40 parts by weight of a phenol aralkyl resin (Mirex XLC-LL manufactured by Mitsui Chemicals, Inc.), 29 parts by weight of a triazine-modified phenol novolak resin (LA-7054 manufactured by Dainippon Ink and Chemicals, Inc.), and 9 , 1
Methylcellosolve was added to 21 parts by weight of 0-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (HCA manufactured by Sanko Chemical Co., Ltd.) to prepare a varnish so as to have a nonvolatile content of 60% by weight. . At this time, for a total of 100 parts by weight of the epoxy resin, the phosphorus compound and the curing agent,
The phosphorus component was 1.6 parts by weight and the nitrogen component was 1.8 parts by weight. Using this varnish, a glass woven fabric (thickness 0.18
mm, 100 parts by weight of Nitto Boseki Co., Ltd.) was impregnated with 80 parts by weight of varnish solids, and dried in a dryer at 150 ° C. for 5 minutes to prepare a prepreg having a resin content of 44.4% by weight. Six prepregs are stacked, and the thickness is 35 μm
Of electrolytic copper foil, pressure 40 kgf / cm 2 , temperature 1
Heat and pressure molding at 90 ° C for 120 minutes, thickness 1.2mm
Was obtained.
【００１７】（実施例２〜４、及び比較例１〜４）表１
に示した配合処方で、これ以外は全て実施例１と同様の
方法で両面銅張積層板を作製した。(Examples 2 to 4 and Comparative Examples 1 to 4)
, A double-sided copper-clad laminate was produced in the same manner as in Example 1 except for the above formulation.
【００１８】得られた銅張積層板については、難燃性、
半田耐熱性、及びピール強度を測定した。難燃性は、Ｕ
Ｌ−９４規格に従い垂直法により評価した。半田耐熱
性、ピール強度については ＪＩＳ Ｃ ６４８１ に準じ
て測定し、半田耐熱性は煮沸２時間の吸湿処理を行った
後、２６０℃の半田浴に１２０秒浸漬した後の外観の異
常の有無を観察した。これらの評価結果を表１及び表２
に示す。実施例により得られた銅張積層板はいずれも耐
燃性、半田耐熱性に優れていることがわかる。The resulting copper-clad laminate has flame retardancy,
Solder heat resistance and peel strength were measured. Flame retardancy is U
It was evaluated by the vertical method according to the L-94 standard. Solder heat resistance and peel strength were measured in accordance with JIS C 6481. Solder heat resistance was determined by examining the appearance after solder immersion in a 260 ° C. solder bath for 120 seconds after performing a moisture absorption treatment for 2 hours after boiling. Observed. Table 1 and Table 2 show these evaluation results.
Shown in It can be seen that each of the copper-clad laminates obtained in the examples has excellent flame resistance and solder heat resistance.
【００１９】[0019]
【表１】 [Table 1]
【００２０】[0020]
【表２】 [Table 2]
【００２１】表１及び２の注 （１）大日本インキ化学工業(株)製 エヒ゜クロンN-770 エポ
キシ当量＝１９０ （２）大日本インキ化学工業(株)製 エヒ゜クロンN-690 エポ
キシ当量＝２１０ （３）新日鐵化学(株)製 ESN-155 エポキシ当量＝２４
２ （４）三井化学(株)製 ミレックスXLC-LL 水酸基当量＝１７
５ （５）大日本インキ化学工業(株)製 LA-7054 水酸基当
量＝１２５ 窒素含有率＝１２重量％ （６）大日本インキ化学工業(株)製 LA-7052 水酸基当
量＝１２０ 窒素含有率＝８重量％ （７）９,10-ジヒドロ-９-オキサ-10-ホスファフェナン
トレン-10-オキシド リン含有率＝１４.３重量％ （８）油化シェルエポキシ(株)製 エヒ゜コート 828 エポキ
シ当量＝１８０ （９）油化シェルエポキシ(株)製 エヒ゜コート1001 エポキ
シ当量＝４７５Notes to Tables 1 and 2 (1) Epoxy N-770 epoxy equivalent of Dainippon Ink and Chemicals, Inc. = 190 (2) Epoxy N-690 epoxy equivalent of Dainippon Ink and Chemicals, Inc. = 210 (epoxy equivalent) 3) Nippon Steel Chemical Co., Ltd. ESN-155 Epoxy equivalent = 24
2 (4) MILEX XLC-LL manufactured by Mitsui Chemicals, Inc., hydroxyl equivalent = 17
5 (5) LA-7054 hydroxyl equivalent of Dainippon Ink and Chemicals, Inc. = 125 Nitrogen content = 12% by weight (6) LA-7052 hydroxyl equivalent of Dainippon Ink and Chemicals, Inc. = 120 Nitrogen content = 8% by weight (7) 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide Phosphorus content = 14.3% by weight (8) Oil coat 828 Epoxy equivalent by Yuka Shell Epoxy Co., Ltd. = 180 (9) Oil coat 1001 manufactured by Yuka Shell Epoxy Co., Ltd. Epoxy equivalent = 475
【００２２】[0022]
【発明の効果】本発明の難燃性樹脂組成物、これを用い
たプリプレグ及び積層板は、ハロゲン化合物を添加する
ことなく高度な難燃性を有し、半田耐熱性等の特性も優
れている。従って今後要求されるノンハロゲン材料とし
て新規な熱硬化性樹脂組成物、プリプレグ及び積層板を
提供するものである。The flame-retardant resin composition of the present invention, the prepreg and the laminate using the same, have high flame retardancy without adding a halogen compound, and have excellent properties such as solder heat resistance. I have. Accordingly, the present invention provides a novel thermosetting resin composition, prepreg, and laminate as non-halogen materials required in the future.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｂ３２Ｂ 27/38 Ｂ３２Ｂ 27/38 Ｃ０８Ｇ 59/62 Ｃ０８Ｇ 59/62 Ｃ０８Ｊ 5/24 ＣＦＣ Ｃ０８Ｊ 5/24 ＣＦＣ Ｃ０８Ｋ 5/49 Ｃ０８Ｋ 5/49 // Ｂ２９Ｋ 63:00 105:08 309:08 ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) B32B 27/38 B32B 27/38 C08G 59/62 C08G 59/62 C08J 5/24 CFC C08J 5/24 CFC C08K 5/49 C08K 5/49 // B29K 63:00 105: 08 309: 08
Claims (5)
トリアジン変性フェノールノボラック樹脂からなる硬化
剤、及び（Ｃ）９，１０−ジヒドロ−９−オキサ−１０
−ホスファフェナントレン−１０−オキシドを必須成分
として含有してなることを特徴とする難燃性樹脂組成
物。(1) novolak epoxy resin, (B)
A curing agent comprising a triazine-modified phenol novolak resin, and (C) 9,10-dihydro-9-oxa-10
-A flame-retardant resin composition comprising phosphaphenanthrene-10-oxide as an essential component.
レゾールノボラックエポキシ樹脂を含有する請求項１記
載の難燃性樹脂組成物。2. The flame-retardant resin composition according to claim 1, which comprises a cresol novolak epoxy resin as the novolak epoxy resin (A).
般式（１）で表されるフェノールアラルキルエポキシ樹
脂又は一般式（２）で表されるナフタレンアラルキルエ
ポキシ樹脂を含有する請求項１又は２記載の難燃性樹脂
組成物。 【化１】 3. The method according to claim 1, wherein (A) the phenolic aralkyl epoxy resin represented by the general formula (1) or the naphthalene aralkyl epoxy resin represented by the general formula (2) is contained as the novolak epoxy resin. Flammable resin composition. Embedded image
成物を基材に含浸させてなることを特徴とするプリプレ
グ。4. A prepreg comprising a substrate impregnated with the flame-retardant resin composition according to claim 1, 2 or 3.
ね合わせ加熱加圧してなることを特徴とする難燃性積層
板又は銅張積層板。5. A flame-retardant laminate or a copper-clad laminate, wherein at least one prepreg according to claim 4 is superposed and heated and pressed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29956598A JP3400363B2 (en) | 1998-10-21 | 1998-10-21 | Flame-retardant resin composition, prepreg and laminate using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29956598A JP3400363B2 (en) | 1998-10-21 | 1998-10-21 | Flame-retardant resin composition, prepreg and laminate using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000129089A true JP2000129089A (en) | 2000-05-09 |
| JP3400363B2 JP3400363B2 (en) | 2003-04-28 |
Family
ID=17874281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29956598A Expired - Fee Related JP3400363B2 (en) | 1998-10-21 | 1998-10-21 | Flame-retardant resin composition, prepreg and laminate using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3400363B2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001049080A (en) * | 1999-08-09 | 2001-02-20 | Sumitomo Bakelite Co Ltd | Flame-retardant resin composition, prepreg and laminated board |
| JP2002161191A (en) * | 2000-11-27 | 2002-06-04 | Sumitomo Bakelite Co Ltd | Flame retardant resin composition, prepreg and laminated sheet which use the same |
| JP2002226557A (en) * | 2001-01-30 | 2002-08-14 | Dainippon Ink & Chem Inc | Flame-retardant epoxy resin composition |
| JP2003041094A (en) * | 2001-07-27 | 2003-02-13 | Sumitomo Bakelite Co Ltd | Resin composition, prepreg and circuit board |
| EP1312638A1 (en) * | 2001-11-16 | 2003-05-21 | Resolution Research Nederland B.V. | Halogen-free phosphorous-and nitrogen-containing flame-resistant epoxy resin compositions, and prepregs derived from thereof |
| WO2004035308A1 (en) * | 2002-10-18 | 2004-04-29 | Surface Specialties, S.A. | Flame retardant composition |
| WO2008108485A1 (en) * | 2007-03-05 | 2008-09-12 | Tohto Kasei Co., Ltd. | Novel phosphorus-containing epoxy resin, epoxy resin composition essentially containing the epoxy resin, and cured product of the epoxy resin composition |
| JPWO2008035815A1 (en) * | 2006-09-21 | 2010-01-28 | 住友ベークライト株式会社 | Resin composition, prepreg and laminate |
-
1998
- 1998-10-21 JP JP29956598A patent/JP3400363B2/en not_active Expired - Fee Related
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001049080A (en) * | 1999-08-09 | 2001-02-20 | Sumitomo Bakelite Co Ltd | Flame-retardant resin composition, prepreg and laminated board |
| JP2002161191A (en) * | 2000-11-27 | 2002-06-04 | Sumitomo Bakelite Co Ltd | Flame retardant resin composition, prepreg and laminated sheet which use the same |
| JP4534344B2 (en) * | 2000-11-27 | 2010-09-01 | 住友ベークライト株式会社 | Flame retardant resin composition, prepreg and laminate using the same |
| JP2002226557A (en) * | 2001-01-30 | 2002-08-14 | Dainippon Ink & Chem Inc | Flame-retardant epoxy resin composition |
| JP2003041094A (en) * | 2001-07-27 | 2003-02-13 | Sumitomo Bakelite Co Ltd | Resin composition, prepreg and circuit board |
| EP1312638A1 (en) * | 2001-11-16 | 2003-05-21 | Resolution Research Nederland B.V. | Halogen-free phosphorous-and nitrogen-containing flame-resistant epoxy resin compositions, and prepregs derived from thereof |
| WO2003042291A1 (en) * | 2001-11-16 | 2003-05-22 | Resolution Research Nederland B.V. | Halogen-free phosphorous- and nitrogen-containing flame-resistant epoxy resin compositions, and prepregs derived from thereof |
| WO2004035308A1 (en) * | 2002-10-18 | 2004-04-29 | Surface Specialties, S.A. | Flame retardant composition |
| JPWO2008035815A1 (en) * | 2006-09-21 | 2010-01-28 | 住友ベークライト株式会社 | Resin composition, prepreg and laminate |
| JP4502148B2 (en) * | 2006-09-21 | 2010-07-14 | 住友ベークライト株式会社 | Resin composition, prepreg and laminate |
| US8865311B2 (en) | 2006-09-21 | 2014-10-21 | Sumitomo Bakelite Company Limited | Resin composition, prepreg, and laminate |
| WO2008108485A1 (en) * | 2007-03-05 | 2008-09-12 | Tohto Kasei Co., Ltd. | Novel phosphorus-containing epoxy resin, epoxy resin composition essentially containing the epoxy resin, and cured product of the epoxy resin composition |
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|---|---|
| JP3400363B2 (en) | 2003-04-28 |
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