JP2000124364A - Structure of module for ic card and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce cost by increasing the number of modules which can be manufactured from a raw material film A, when many modules for IC cards having integrated circuit chips mounted on film pieces are manufactured in a longitudinal and lateral array state, at the same time as from the raw material film A. SOLUTION: At parts of both the lateral right and left end parts of the film piece 11 of a module 10, cut-out parts 15 for which the parts of both the right and left end parts of laterally adjacent film pieces 11 when the film pieces 11 are arranged laterally so as to enter into are provided, and then parts of both the right and left end parts of the respective film pieces 11 which are arrayed laterally along the length of the film pieces 11 are made to overlap with each other in the length direction.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a module having an integrated circuit chip used in an IC card and a method of manufacturing the same.

[0002]

2. Description of the Related Art In general, a non-contact type IC card of this type of IC card is, as shown in FIG.
After the module 2 comprising the integrated circuit chip 3 mounted on the film piece 6 is loaded into the recess 1a formed in the antenna, the cover card body 4 is formed on the upper surface of the card body 1 and the antenna is formed on the lower surface thereof. Both ends of the coil 5 are connected to the module 2
Are superposed so as to be electrically connected to the integrated circuit chip 3 in the above.

As shown in FIGS. 2 to 4, a module 2 provided with the integrated circuit chip 3 has a connection terminal electrode 7a and an electrode pad 7b on the upper surface of a film piece 6, respectively.
After the formation of a pair of wiring patterns 7 including the following, the integrated circuit chip 4 is electrically connected to the electrode pads 7 b of the wiring patterns 7 via the anisotropic conductive adhesive film 8. On the other hand, both ends of the antenna coil 5 of the cover card body 4 are electrically connected to the connection terminal electrodes 7a of the both wiring patterns 7 while being mounted so as to be electrically connected. However, in this figure, reference numeral 9 denotes a discard electrode pad for preventing the integrated circuit chip 3 from being inclined when the integrated circuit chip 3 is mounted on the film 6.

Conventionally, when manufacturing the module 2, as shown in FIG. 5, a material film B is prepared in which a large number of the film pieces 6 can be formed in a matrix in a matrix. A pair of wiring patterns 7 and discarded electrode pads 9 are formed on each of the film pieces 6 on the surface of the material film B by a suitable means such as formation of a metal film and etching of the metal film. Then, after mounting the integrated circuit chip 3 via the anisotropic conductive adhesive film 8 so that the integrated circuit chip 3 is electrically connected to the electrode pads 7b of the both wiring patterns 7, , The material film B
Is cut along each of the film pieces 6 along the cutting line B1 in the vertical direction and the cutting line B2 in the horizontal direction between the film pieces 6, or the punching is performed on each of the film pieces 6. I have.

[0005]

However, in the conventional module, the material film B is cut into each film piece 6 or the vertical cutting line B1 and the horizontal cutting line B2 when punching out each film piece. Are formed in a straight line, thereby forming the film piece 6 into a rectangular shape having a width dimension of W and a length dimension of L, and connecting terminal electrodes for both wiring patterns 7 on both left and right ends in the length direction. 7a
Therefore, the vertical dimension and the horizontal dimension of the material film B formed by arranging a large number of the rectangular film pieces 6 in a vertical and horizontal matrix form the width W and the length of the film piece 6. The dimension L is an integral multiple of the dimension L.

That is, since the length of the material film B must be an integral multiple of the length L of the film piece 6, the material film B can be manufactured per unit length. The number of pieces 6, that is, the number of modules 2, is reduced by the length of the material film B, which must be an integral multiple of the length L of the film piece 6, so that the module manufacturing cost is reduced accordingly. There was a problem saying it would come up.

An object of the present invention is to provide a module structure that solves this problem and a method of manufacturing the module.

[0008]

In order to achieve this technical object, the present invention provides a method for electrically connecting an integrated circuit chip on a film piece to an electrode pad in a wiring pattern formed on the film piece. In the IC card module which is mounted so as to be connected to, in a part of the left and right ends of the film piece, when a plurality of the film pieces are arranged in the horizontal direction, the Notches are provided so that a part of both left and right ends can enter. "

Further, the manufacturing method of the present invention provides a method for manufacturing a module with an integrated circuit chip used in an IC card in which a large number of film pieces are simultaneously arranged in a matrix along the vertical and horizontal directions. A prepared material film is prepared, and an integrated circuit chip is electrically connected to an electrode pad in a wiring pattern formed on each film piece on the surface of the material film at each of the film pieces. A module manufacturing method in which the material film is cut or punched for each film piece along the cutting line extending in the vertical direction and the cutting line extending in the horizontal direction after being mounted so as to be connected to each other. The cutting line extending in the vertical direction, a part of the left and right ends in the horizontal direction of each film piece, the film horizontally adjacent That is bent in a crank shape so as to form a notch portion is so enter the left and right end portions and said at. "Is intended.

[0010]

As described above, according to the present invention, when a plurality of the film pieces are arranged in the horizontal direction at a part of the left and right ends of each film piece, A cutout that allows a part of the left and right ends to enter is provided.When manufacturing a large number of modules in a matrix in the vertical and horizontal directions at the same time, the film Each of the film pieces arranged in the horizontal direction along the length direction of the piece overlaps each other in the length direction by an amount corresponding to a part of the left and right end portions entering the cutout provided in the adjacent film piece. .

Accordingly, the number of film pieces that can be manufactured per unit length in the material film, that is, the number of modules, by the amount that the respective film pieces arranged in the horizontal direction overlap each other in the length direction, However, since it is larger than in the conventional case, the manufacturing cost of the module can be surely reduced.

[0012]

Embodiments of the present invention will be described below with reference to the drawings. 6 and 7 show a first embodiment of the present invention. In this figure, reference numeral 10 denotes
A module used for an IC card is shown. This module 10 comprises a rectangular film piece 11 having a width W and a length L, and an integrated circuit chip 12 mounted on the upper surface thereof. On the upper surface of the piece 11, a pair of left and right wiring patterns 13 and a discard electrode pattern 14 having a connection terminal electrode 13a and an electrode pad 13b are provided.
Connection terminal electrode 13a in both wiring patterns 13
Are formed so as to be located at both left and right ends of the film piece 11 in the longitudinal direction, and the integrated circuit chip 12
Is mounted so as to electrically connect the integrated circuit chip 12 to the electrode pads 13a of the wiring patterns 13 via an anisotropic conductive adhesive film (not shown) as in the conventional case. .

A notch 15 is provided in each of the left and right end portions of the film piece 11 in the longitudinal direction, which is located beside the discarded electrode pad 14, so that the film piece 11 is provided in each of the notches 15. When a plurality of sheets are arranged in the horizontal direction along the length direction, a part of the left and right ends of the horizontally adjacent film piece 11 is configured to enter.

In manufacturing the module 10 having the above-described structure, as shown in FIG. 7, a large number of the film pieces 11 are simultaneously arranged in a matrix in the vertical and horizontal directions. Prepare a material film A that can be made. Next, a pair of left and right wiring patterns 13 and discarded electrode patterns 14 each having a connection terminal electrode 13a and an electrode pad 13b are formed on each of the film pieces 11 on the surface of the raw material film A. The connection terminal electrodes 13a are formed so as to be located at both left and right ends of the film piece 11 in the length direction.

Next, the integrated circuit chip 12 is attached to each of the film pieces 11 on the surface of the material film A via an anisotropic conductive adhesive film (not shown). To the two wiring patterns 13
This material film A is mounted on each of the film pieces 11 so as to be electrically connected to the electrode pad 13a of
Vertical cutting line A1 and horizontal cutting line A2 between
Is cut along each piece of film 11 or punched out every piece of film 11.

At the time of cutting or punching, the horizontal cutting line A2 is straightened, while the vertical cutting line A2 perpendicular to the horizontal cutting line A2 is bent in a crank shape, so that each cut or punched film piece 11 is cut. The notch 15 is formed at a part of both right and left ends in the length direction. In this way, a large number of the modules 10 having the configuration shown in FIG. 6 can be simultaneously manufactured from one material film A. In addition, the performance test for the module 10 manufactured here is performed simultaneously for a large number of modules 10 in a state before cutting or punching out each film piece 11 from the material film A. The inspection can be performed efficiently, and the cost required for the inspection can be reduced.

As described above, according to the present invention, each film piece 11
A notch 15 is provided at a part of the left and right ends of the film piece 11 so that a part of the left and right ends of the horizontally adjacent film piece 11 enters when a plurality of the film pieces 11 are arranged in the horizontal direction. Accordingly, when a large number of the modules 10 are simultaneously manufactured in a state of being arranged in a matrix along the vertical direction and the horizontal direction, each of the modules 10 is arranged in the horizontal direction along the length direction of the film piece 11. Film piece 11
Are overlapped with each other in the length direction by an amount corresponding to a part of the left and right end portions entering the notch portion 15 provided in the adjacent film piece 11, and thus are manufactured per unit length in the material film A. The number of film pieces 11 that can be made, that is, the number of modules 10 can be made larger than in the conventional case by the number of modules overlapping each other in the length direction.

Next, FIGS. 8 and 9 show a second embodiment of the present invention. In the second embodiment, the notch 1 is formed in a part of the left and right ends in the length direction of the film piece 11.
In order to provide the cutouts 15 in the left and right end portions of the left and right end portions, which are separated from the discarded electrode pad 14, the vertical cutting line A1 is formed in a crank shape opposite to that of the first embodiment. This is a case in which the first embodiment is bent, and the same effect as that of the first embodiment can be obtained with this configuration.

FIGS. 10 and 11 show a second embodiment of the present invention.
An embodiment will be described. The third embodiment is different from the first embodiment in that both wiring patterns 13 in each of the film pieces 11 arranged in the horizontal direction are used.
Is formed such that the connection terminal electrode 13a is integrally continuous with both of the adjacent film pieces 11, and the other is the same as the first embodiment.
With such a configuration, the first and the second
The same effect as that of the embodiment can be obtained.

FIG. 12 and FIG. 13 show a second embodiment of the present invention. In the third embodiment, a part of the left and right ends in the length direction of the film piece 11 is
When the notch portion 15 is provided, the notch portion 15 is configured to be provided at a diagonal portion between the left and right end portions.
The same effects as those of the first, second, and third embodiments can be obtained. In particular, such a configuration has the following effects.

That is, in the first, second and third embodiments, in the material film A, each of the film pieces 11 arranged in the longitudinal direction and each of the adjacent film pieces 1 arranged in the longitudinal direction are arranged.
1 are opposite to each other, when mounting the integrated circuit chip 12 on each of the film pieces 11 in the material film A, the direction of the integrated circuit chip 12 is changed to the direction of each of the film pieces 11. It must be mounted while changing the direction one by one so that it matches.

On the other hand, as in the fourth embodiment, when the cutouts 15 are provided at diagonally opposite sides of the left and right ends of the film piece 11, the material film A Since the directions of the film pieces 11 can be made the same, the mounting of the integrated circuit chip 12 can be extremely easily and quickly performed without changing the direction one by one, and the manufacturing cost can be further reduced.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of an IC card.

FIG. 2 is a perspective view showing a module.

FIG. 3 is a sectional view taken along line III-III of FIG. 2;

FIG. 4 is an exploded perspective view of the module.

FIG. 5 is a plan view showing a material film used in a conventional manufacturing method.

FIG. 6 is an exploded perspective view of the module according to the first embodiment of the present invention.

FIG. 7 is a plan view showing a material film used when manufacturing the module shown in FIG. 6;

FIG. 8 is an exploded perspective view of a module according to a second embodiment of the present invention.

FIG. 9 is a plan view showing a material film used when manufacturing the module shown in FIG.

FIG. 10 is an exploded perspective view of a module according to a third embodiment of the present invention.

FIG. 11 is a plan view showing a material film used when manufacturing the module shown in FIG.

FIG. 12 is an exploded perspective view of a module according to a fourth embodiment of the present invention.

FIG. 13 is a plan view showing a material film used when manufacturing the module shown in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Module 11 Film piece 12 Integrated circuit chip 13 Wiring pattern 13a Connection terminal electrode 13b Electrode pad 15 Notch A Material film A1 Vertical cutting line A2 Horizontal cutting line

Claims (2)

[Claims] 1. An IC card module comprising: an integrated circuit chip mounted on a film piece so as to electrically connect the integrated circuit chip to an electrode pad of a wiring pattern formed on the film piece; On the left and right ends of the piece,
A structure of an IC card module, wherein a notch is provided so that a part of the left and right ends of a horizontally adjacent film piece is inserted when a plurality of the film pieces are arranged in the horizontal direction. 2. A material film is prepared in which a large number of film pieces in a module with an integrated circuit chip used for an IC card can be simultaneously formed in a state of being arranged in a matrix along the vertical and horizontal directions. And, at the location of each of the film pieces on the surface of this material film,
After mounting the integrated circuit chip so as to electrically connect the integrated circuit chip to the electrode pad in the wiring pattern formed on each film piece, the material film is cut into the cutting line extending in the longitudinal direction and the horizontal direction. In a method of manufacturing a module that cuts or punches each of the film pieces along a cutting line extending in the direction, the cutting line extending in the vertical direction is part of the left and right ends of each film piece in the horizontal direction. A method for manufacturing an IC card module, characterized in that the film piece is bent in a crank shape so as to form a cutout portion into which a part of both left and right ends of a horizontally adjacent film piece is inserted.