JP2000117760A - Device for applying skin material onto molding base material - Google Patents

Device for applying skin material onto molding base material

Info

Publication number
JP2000117760A
JP2000117760A JP29486298A JP29486298A JP2000117760A JP 2000117760 A JP2000117760 A JP 2000117760A JP 29486298 A JP29486298 A JP 29486298A JP 29486298 A JP29486298 A JP 29486298A JP 2000117760 A JP2000117760 A JP 2000117760A
Authority
JP
Japan
Prior art keywords
mold
skin
die
skin material
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP29486298A
Other languages
Japanese (ja)
Inventor
Koji Asai
好治 浅井
Atsuki Suzuki
厚樹 鈴木
Takeshi Miyajima
健 宮島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Takanichi Co Ltd
Original Assignee
Takanichi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Takanichi Co Ltd filed Critical Takanichi Co Ltd
Priority to JP29486298A priority Critical patent/JP2000117760A/en
Publication of JP2000117760A publication Critical patent/JP2000117760A/en
Pending legal-status Critical Current

Links

Landscapes

  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a device for applying a skin material onto a molding base material which can easily and precisely apply a skin material even onto a molding base material having irregularities on its surface. SOLUTION: In the device for applying a skin material onto a molding base material, a die 1, which holds the molding base material and can be moved back and forth, and a die 11 whose die surface is oppositely oriented to that of the die 1 are oppositely disposed to one another and a skin material is bonded under pressure to a surface of the base material between both the dies 1, 11. The die 11 is of the split type and comprises a fixed main die 12 and a movable outer die 13 which surrounds the die 12 and is movable back and forth, and skin set pins 14 are provided on a die surface of the die 13. Both the dies 1, 11 are moved from a die open state to a die clamping state, wherein the die 13 is retracted by the die 1 to bond the skin material to the surface of the molding base material, through an intermediate skin clamped state, wherein the outer periphery of the skin material set on the pins 14 is pressed against the die surface of the die 1.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は表面に凹凸のある成
形基材に対してでも表皮材を的確容易に被装できる成形
基材へ表皮材を被装する装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for applying a skin material to a molding substrate capable of accurately and easily applying a skin material to a molding substrate having an uneven surface.

【0002】[0002]

【従来の技術】成形基材を型面に保持させる一方の型
と、この一方の型の型面に対応する型面を有する他方の
型とを接離自在に対向させて両型の型面間で一方の型の
型面に保持させた成形基材の表面に表皮材を圧着被装す
るようにした成形基材へ表皮材を被装する装置はよく知
られているが、成形基材が表面に大きな凹凸のあるもの
であるときには表皮材を皺寄りなく的確に被装するに
は、型の外側に表皮材のクランプ装置を設けておく必要
があって装置全体が大型化するという問題がある。
2. Description of the Related Art One mold for holding a molding substrate on a mold surface and the other mold having a mold surface corresponding to the mold surface of this one mold are opposed to each other so as to freely contact and separate from each other. Apparatuses for applying a skin material to a molding base material in which a skin material is pressure-bonded to the surface of a molding base material held on the mold surface of one of the molds are well known. If the surface has large irregularities, it is necessary to provide a skin material clamping device on the outside of the mold in order to accurately coat the skin material without wrinkles, and the entire device becomes large. There is.

【0003】[0003]

【発明が解決しようとする課題】本発明が解決しようと
するところは上記したような従来の問題点を解決し、成
形基材が表面に大きな凹凸のあるものであっても、表皮
材を皺寄ることなく的確に被装することができるコンパ
クトな成形基材へ表皮材を被装する装置を提供すること
にある。
The object of the present invention is to solve the above-mentioned conventional problems. Even if the molding base material has large irregularities on the surface, the skin material is wrinkled. An object of the present invention is to provide an apparatus for covering a skin material on a compact molding base material that can be accurately covered without coming off.

【0004】[0004]

【課題を解決するための手段】上記の課題を解決するた
めになされた本発明に係る成形基材へ表皮材を被装する
装置は、成形基材を型面に保持させる一方の型と、この
一方の型の型面に対応する型面を有する他方の型とを接
離自在に対向させて両型の型面間で一方の型の型面に保
持させた成形基材の表面に表皮材を圧着被装するように
した成形基材へ表皮材を被装する装置において、前記一
方の型を進退動自在とするとともに、他方の型を固定主
型とその周囲を囲む進退動自在な可動外型とよりなる分
割型としてこの可動外型の型面に表皮セットピンを設
け、前記した一方の型と他方の型とを、両型間に充分な
空間が形成された型開き状態から、前記した表皮セット
ピンにより両型間にセットされる表皮材の外周が前進し
た一方の型の型面により押し付けられる中間の表皮クラ
ンプ状態を経て、さらに前進した一方の型による押圧で
可動外型が後退して表皮材が成形基材の表面に接着され
る型締状態に移行されるようにしてあることを特徴とす
るものである。
Means for Solving the Problems To solve the above-mentioned problems, an apparatus for covering a molding material with a skin material on a molding substrate according to the present invention comprises: a mold for holding the molding substrate on a mold surface; The surface of the molding base material, in which the other mold having a mold surface corresponding to the mold surface of one of the molds is detachably opposed to and held on the mold surface of one mold between the mold surfaces of both molds. In a device for covering a skin material on a molding base material to which a material is press-fitted, the one mold is made movable forward and backward, and the other mold is made movable forward and backward surrounding a fixed main mold and its periphery. A skin set pin is provided on the mold surface of the movable outer mold as a split mold composed of a movable outer mold, and the one mold and the other mold are moved from the mold open state where a sufficient space is formed between the two molds. The outer periphery of the skin material set between the two molds by the above-mentioned skin set pin is advanced to the mold surface of one of the molds. After the intermediate skin clamp state is pressed, the movable outer die is retracted by the pressing of one of the further advanced dies, and the state is shifted to a mold clamping state in which the skin material is adhered to the surface of the molding base material. It is characterized by the following.

【0005】[0005]

【発明の実施の形態】次に、本発明を図示する好ましい
実施の形態について詳細に説明する。1は大きな凹凸の
ある成形基材イを型面に保持させる進退動自在な一方の
型、11はこの一方の型1の型面に対応する型面を有し
ていてこの一方の型1に対して接離自在に対向させた他
方の型であって、両型1、11の型面間で一方の型1の
型面に保持させた成形基材イの表面に表皮材ロを圧着被
装するように構成されており、以上の基本構成は従来の
この種の成形基材へ表皮材を被装する装置と変わること
はないが、本発明では特に他方の型11としての下型の
構造に特徴がある。すなわち、他方の型11は中央に設
置される固定主型12と、その周囲を囲むように配置さ
れてスプリング支持機構15により常時は上昇位置にあ
るが、加圧により下降する進退動自在な可動外型13と
よりなる分割型であり、また、前記した可動外型13の
型面にはスプリング16により支持されて型面より出没
自在とされている表皮セットピン14を設けてあり、ま
た、必要に応じ固定主型12にも前記同様の表皮セット
ピン14aを設けてある。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments illustrating the present invention will now be described in detail. Reference numeral 1 denotes one mold that can move forward and backward to hold a molding substrate A having large irregularities on the mold surface, and 11 has a mold surface corresponding to the mold surface of the one mold 1. A surface material B is press-bonded on the surface of a molding base A, which is the other mold which is opposed to the mold 1 so as to be able to freely come and go, and which is held on the mold surface of one mold 1 between the mold surfaces of both molds 1 and 11. Although the basic structure described above is not different from the conventional device for covering a skin material on a molding substrate of this type, in the present invention, in particular, the lower mold as the other mold 11 is used in the present invention. The structure is characteristic. That is, the other mold 11 is arranged at a fixed main mold 12 installed at the center, and is arranged so as to surround the periphery thereof. The movable outer mold 13 is provided with a skin set pin 14 supported by a spring 16 so as to be able to protrude and retract from the mold surface. If necessary, the stationary main mold 12 is also provided with a skin set pin 14a similar to the above.

【0006】そして、前記した一方の型1と他方の型1
1とは、型開きされて両型1、11間に充分な空間が形
成され、成形基材イと表皮材ロのセットを行なうことが
できる図1に示す型開き状態から、図2に示すような、
前記した表皮セットピン14により両型1、11間にセ
ットされる表皮材ロの外周が前進した一方の型1の型面
により押し付けられてクランプされる中間の表皮クラン
プ状態を経て、図3に示すような、さらに前進した一方
の型1によるスプリング支持機構15の支持力を上回る
押圧で可動外型13が後退して表皮材ロが成形基材イの
表面に接着される型締状態に移行されるように構成され
ている。
[0006] The one mold 1 and the other mold 1
1 shows the mold opening state shown in FIG. 2 from the mold opening state shown in FIG. 1 where the mold is opened to form a sufficient space between the two molds 1 and 11 so that the molding base material A and the skin material B can be set. like,
FIG. 3 shows an intermediate skin clamping state in which the outer periphery of the skin material b set between the two dies 1 and 11 by the above-mentioned skin set pin 14 is pressed and clamped by the mold surface of one of the dies 1 that has been advanced. As shown in the drawing, the movable outer die 13 is retracted by a pressure exceeding the supporting force of the spring support mechanism 15 by the one of the dies 1 that has been further advanced, and transitions to a mold clamping state in which the skin material B is adhered to the surface of the molding base material A. It is configured to be.

【0007】このように構成されたものは、一方の型1
が後退した図1に示す型開き状態で一方の型1の型面に
成形基材イを保持させるとともに、他方の型11の上方
に表皮材ロを持込み、その外周をもって可動外型13の
型面に設けてある表皮セットピン14と、必要に応じて
固定主型12の型面に後孔加工する部位に設けてある表
皮セットピン14aにこの表皮材ロをセットする。この
ようにして成形基材イと表皮材ロのセットが終了したな
らば、一方の型1をその型面の外周部分が可動外型13
の型面の内周部分に当接される位置まで前進させれば、
表皮セットピン14により両型1、11間にセットされ
る表皮材ロの外周は前進した一方の型1の型面により可
動外型13の型面に押し付けられてクランプされるか
ら、その後は一方の型1の前進をさらに続ければ、図3
に示すような、前進した一方の型1の押圧力がスプリン
グ支持機構15の支持力を上回ったとき、前記したクラ
ンプ状態を保持したまま可動外型13を後退させ、可動
外型13が最終位置まで後退したとき一方の型1の押圧
力でこの型面に保持させてある成形基材イは固定主型1
2と可動外型13よりなる他方の型11の型面に表皮材
ロを添わせた状態となり、型締状態とされたとき表皮材
ロが成形基材イの表面に接着されることとなり、この
間、表皮材ロはその周囲がクランプされた状態で成形基
材イの表面により加圧されるので、成形基材が表面に大
きな凹凸のあるものであっても、表皮浮き不良が殆どな
い状態として皺寄りなく成形基材イの表面に的確容易に
被着されることとなる。
[0007] The above-described structure is one of the molds 1.
In the mold open state shown in FIG. 1 in which the mold material is held, the molding base material A is held on the mold surface of one mold 1, and the skin material B is brought above the other mold 11, and the outer periphery thereof is used as the mold of the movable outer mold 13. This skin material b is set on a skin set pin 14 provided on the surface and a skin set pin 14a provided on a portion of the mold surface of the fixed main mold 12 where a post hole is to be drilled as required. When the setting of the molding base material A and the skin material B is completed in this way, one of the dies 1 is moved to the outer peripheral portion 13
If it is advanced to the position where it comes into contact with the inner circumference of the mold surface,
The outer periphery of the skin material B set between the two molds 1 and 11 by the skin set pin 14 is pressed against the mold surface of the movable outer mold 13 by the mold surface of one of the molds 1 that has been advanced, and then clamped. If the mold 1 of FIG.
When the pressing force of one advanced mold 1 exceeds the supporting force of the spring support mechanism 15, the movable outer mold 13 is retracted while maintaining the clamped state, and the movable outer mold 13 is moved to the final position. When the mold substrate is retracted to a position where the pressing force of one of the molds 1 is held on this mold surface, the fixed base mold 1
A surface material B is attached to the mold surface of the other mold 11 composed of the movable mold 2 and the movable outer mold 13, and when the mold is in a clamped state, the surface material B is adhered to the surface of the molding base material A. During this time, the skin material B is pressed by the surface of the molding base A with its periphery clamped, so that even if the molding base has a large unevenness on the surface, there is almost no skin floating failure As a result, it can be accurately and easily adhered to the surface of the molding substrate A without wrinkling.

【0008】しかも、表皮セットピン14を他方の型1
1の一部である可動外型13に設けてあるので、型の外
側に表皮材のクランプ装置を設けておく必要がなく、こ
のため、表皮材ロを周囲に無駄のない最小限の大きさに
裁断できるうえに装置全体をコンパクト化できることと
なる。また、可動外型13がスプリング支持機構15に
より支持されて、常時は上昇位置にあるが、一方の型1
による加圧で下降するものとしたときは、装置が簡単で
安価に提供できるうえにメンテナンス上も有利なものと
なる。
Further, the skin set pin 14 is connected to the other mold 1
1, there is no need to provide a skin material clamping device outside the mold because the movable outer mold 13 is a part of the mold 1. In addition, the entire apparatus can be made compact. Further, the movable outer mold 13 is supported by the spring support mechanism 15 and is always in the raised position.
If the apparatus is lowered by pressurization, the apparatus can be provided simply and inexpensively, and it is advantageous in terms of maintenance.

【0009】[0009]

【発明の効果】本発明は以上の説明から明らかなよう
に、成形基材を型面に保持させる一方の型と、この一方
の型の型面に対応する型面を有する他方の型とを接離自
在に対向させて両型の型面間で一方の型の型面に保持さ
せた成形基材の表面に表皮材を圧着被装するようにした
成形基材へ表皮材を被装する装置において、前記一方の
型を進退動自在とするとともに、他方の型を固定主型と
その周囲を囲む進退動自在な可動外型とよりなる分割型
としてこの可動外型の型面に表皮セットピンを設け、前
記した一方の型と他方の型とを、両型間に充分な空間が
形成された型開き状態から、前記した表皮セットピンに
より両型間にセットされる表皮材の外周が前進した一方
の型の型面により押し付けられる中間の表皮クランプ状
態を経て、さらに前進した一方の型による押圧で可動外
型が後退して表皮材が成形基材の表面に接着される型締
状態に移行されるようにしてあるので、成形基材が表面
に大きな凹凸のあるものであっても、表皮材を皺寄るこ
となく的確に被装することができるうえに、表皮材を無
駄のない大きさに裁断できて経済的であり、また、型の
外側に表皮材のクランプ装置を設ける必要がないので、
装置全体をコンパクト化できる利点がある。従って、本
発明は従来のこの種の成形基材へ表皮材を被装する装置
の問題点を解決したものとして業界の発展に寄与すると
ころ極めて大きいものがある。
As is apparent from the above description, the present invention relates to one mold for holding a molding substrate on a mold surface and the other mold having a mold surface corresponding to the mold surface of this one mold. A skin material is applied to a molding base material in which a skin material is pressure-bonded to the surface of a molding base material held between two mold surfaces and held on one mold surface so as to be able to freely contact with and separate from each other. In the apparatus, the one mold is movable forward and backward, and the other mold is a split mold comprising a fixed main mold and a movable outer mold movable around the periphery of the fixed main mold, and a skin set on a mold surface of the movable outer mold. A pin is provided, and the outer periphery of the skin material set between the two dies by the above-described skin set pin from the mold open state in which a sufficient space is formed between the two dies with the one mold and the other mold. Through an intermediate skin clamp state pressed by the mold surface of one of the molds advanced, Since the movable outer die is retracted by pressing with one of the molds and the skin material is shifted to a mold clamping state where the skin material is adhered to the surface of the molding substrate, the molding substrate has large irregularities on the surface However, the skin material can be accurately applied without wrinkling, and the skin material can be cut to a size that is not wasteful, so that it is economical, and the skin material is clamped outside the mold. Since there is no need to install equipment,
There is an advantage that the entire apparatus can be made compact. Therefore, the present invention is extremely large in that it contributes to the development of the industry as a solution to the problems of the conventional apparatus for covering the surface of a molding material with a skin material.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の好ましい実施の形態を型開状態で示す
要部の一部切欠正面図である。
FIG. 1 is a partially cutaway front view of a main part showing a preferred embodiment of the present invention in a mold open state.

【図2】本発明の好ましい実施の形態を中間の表皮クラ
ンプ状態で示す要部の一部切欠側面図である。
FIG. 2 is a partially cutaway side view of a main part showing a preferred embodiment of the present invention in an intermediate skin clamp state.

【図3】本発明の好ましい実施の形態を型締状態で示す
要部の一部切欠側面図である。
FIG. 3 is a partially cutaway side view of a main part showing a preferred embodiment of the present invention in a mold-clamped state.

【符号の説明】[Explanation of symbols]

1 一方の型 11 他方の型 12 固定主型 13 進退動自在な可動外型 14 表皮セットピン 14a 表皮セットピン 15 スプリング支持機構 16 スプリング 1 One mold 11 The other mold 12 Fixed main mold 13 Movable outer mold that can move forward and backward 14 Skin set pin 14a Skin set pin 15 Spring support mechanism 16 Spring

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 4F202 AD08 AF01 AG05 CA09 CB01 CB13 CB22 CK41 CQ05 CQ07 4F204 AD08 AF01 AG05 FA01 FB01 FB13 FB22 FN04 FN06 FN07 FQ15  ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4F202 AD08 AF01 AG05 CA09 CB01 CB13 CB22 CK41 CQ05 CQ07 4F204 AD08 AF01 AG05 FA01 FB01 FB13 FB22 FN04 FN06 FN07 FQ15

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 成形基材を型面に保持させる一方の型
(1) と、この一方の型(1) の型面に対応する型面を有す
る他方の型(11)とを接離自在に対向させて両型(1) 、(1
1)の型面間で一方の型(1) の型面に保持させた成形基材
の表面に表皮材を圧着被装するようにした成形基材へ表
皮材を被装する装置において、前記一方の型(1) を進退
動自在とするとともに、他方の型(11)を固定主型(12)と
その周囲を囲む進退動自在な可動外型(13)とよりなる分
割型としてその可動外型(13)の型面に表皮セットピン(1
4)を設け、前記した一方の型(1) と他方の型(11)とを、
両型(1) 、(11)間に充分な空間が形成された型開き状態
から、前記した表皮セットピン(14)により両型(1) 、(1
1)間にセットされる表皮材の外周が前進した一方の型
(1) の型面により押し付けられる中間の表皮クランプ状
態を経て、さらに前進した一方の型(1) による押圧で可
動外型(13)が後退して表皮材が成形基材の表面に接着さ
れる型締状態に移行されるようにしてあることを特徴と
する成形基材へ表皮材を被装する装置。
1. A mold for holding a molding substrate on a mold surface
(1) and the other mold (11) having a mold surface corresponding to the mold surface of this one mold (1) are opposed to each other so as to be able to approach and separate freely, and both molds (1), (1)
An apparatus for covering a skin material on a molding base material such that a skin material is pressure-bonded on a surface of a molding base material held on a mold surface of one mold (1) between mold surfaces of 1), One mold (1) is movable forward and backward, and the other mold (11) is a split mold consisting of a fixed main mold (12) and a movable outer mold (13) surrounding the periphery of the fixed main mold (12). Set the skin set pin (1
4), the above-mentioned one mold (1) and the other mold (11)
From the mold open state where a sufficient space is formed between both molds (1) and (11), both molds (1) and (1) are set by the above-mentioned skin set pin (14).
1) One type in which the outer circumference of the skin material set between them has advanced
After passing through the intermediate skin clamp state pressed by the mold surface of (1), the movable outer mold (13) is retracted by the further forward pressing of the mold (1), and the skin material is adhered to the surface of the molding base material. An apparatus for covering a skin material on a molding base material, wherein the skin material is shifted to a mold clamping state.
【請求項2】 可動外型(13)がスプリング支持機構(15)
により支持されて常時は上昇位置にあるが、一方の型
(1) による加圧で下降するものとした請求項1に記載の
表皮材を被装する装置。
The movable outer die (13) is provided with a spring support mechanism (15).
It is always in the ascending position supported by
2. The apparatus for covering a skin material according to claim 1, wherein the apparatus is lowered by pressurization by (1).
【請求項3】 固定主型(12)の型面にも表皮セットピン
(14a) を設けてある請求項1または2に記載の成形基材
へ表皮材を被装する装置。
3. A set skin pin on the mold surface of the fixed main mold (12).
The apparatus for covering a skin material on a molded substrate according to claim 1 or 2, further comprising (14a).
【請求項4】 表皮セットピン(14)、(14)がスプリング
(16)により支持されて型面より出没自在としてある請求
項1または2または3に記載の成形基材へ表皮材を被装
する装置。
4. The skin set pins (14), (14) are springs
The apparatus for covering a skin material on a molding substrate according to claim 1, 2 or 3, wherein the apparatus is supported by (16) and is capable of coming out of the mold surface.
JP29486298A 1998-10-16 1998-10-16 Device for applying skin material onto molding base material Pending JP2000117760A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29486298A JP2000117760A (en) 1998-10-16 1998-10-16 Device for applying skin material onto molding base material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29486298A JP2000117760A (en) 1998-10-16 1998-10-16 Device for applying skin material onto molding base material

Publications (1)

Publication Number Publication Date
JP2000117760A true JP2000117760A (en) 2000-04-25

Family

ID=17813226

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29486298A Pending JP2000117760A (en) 1998-10-16 1998-10-16 Device for applying skin material onto molding base material

Country Status (1)

Country Link
JP (1) JP2000117760A (en)

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