JP2996053B2 - Method and apparatus for attaching film to lead frame - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for attaching a film to a lead frame, and more particularly, to a lead frame which enables uniform attachment of a film to a lead frame and eliminates sticking defects and improves quality. And a film sticking method.

[0002]

2. Description of the Related Art In a lead frame on which an IC or an LSI is mounted, as shown in FIGS. Film 7 cut into a shape
Is often done.

Conventionally, for example, a punching die has been used for attaching a film to such a lead frame. That is, after punching and shearing the film into a predetermined shape with a punch, the punched film is lowered as it is, and is attached to the lead end of the lead frame located on the heater plate using the punching force of the punch. ing.

[0004] However, if the punching force of the punch is used as it is for sticking the film, the pressing force at the time of sticking the film becomes at least the punching force necessary to punch the film into a predetermined shape. The punching force required to punch the film into a predetermined shape varies depending on the material, thickness, etc. of the film. However, such a pressing force is far greater than the appropriate pressure for attaching the film to the lead frame. When the film is affixed, the adhesive layer applied to the film becomes thinner and the film also undergoes compression deformation. For this reason, when the pressing force is released in such a state, there is a disadvantage that a small peeling occurs on the bonding surface due to the restoring force of the film, and a sufficient bonding force cannot be obtained.

Therefore, recently, in order to prevent the punching force of the punch from being directly applied to the film when the film is attached, the heater plate is supported by an elastic member or a buffer member such as a fluid pressure supporting member. The pressing force of the punch is controlled.

[0006]

However, according to the conventional device for attaching a film to a lead frame, when a film and a lead frame are sandwiched between a punch and a heater plate, for example, a dimensional change due to thermal expansion or the like occurs. As a result, the parallelism between the punch surface of the punch and the heater plate is not maintained, and the mutual surfaces do not come into close contact at the time of sticking. For this reason, the film cannot be uniformly stuck to the lead frame, and there is a disadvantage that sticking failure occurs.

Accordingly, an object of the present invention is to provide an apparatus for attaching a film to a lead frame, which can apply a uniform film to a lead frame and eliminates sticking defects.

[0008]

DISCLOSURE OF THE INVENTION In view of the above problems, the present invention provides a method for bonding an adhesive film punched by a punch to a lead frame so that a uniform film can be stuck to a lead frame and a sticking defect can be eliminated. When supplying to the heater, the upper surface of the heater receives the rolling force of the punch so that the upper surface of the heater follows the punch surface of the punch.
An object of the present invention is to provide an apparatus for attaching a film to a lead frame having an automatic alignment mechanism .

[0009]

According to the present invention, there is provided an apparatus for attaching a film to a lead film according to the present invention, wherein a heater is supported from below, and the upper surface thereof receives the rolling force of the punch to punch the upper surface of the heater. It has a configuration provided with an automatic alignment mechanism that follows the surface.

The self-centering mechanism has a spherical support member for supporting the heater in a point-like manner with a spherical body, and is configured to move up and down by a cylinder mechanism.

[0012]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a device for attaching a film to a lead frame according to the present invention.

FIG. 1 shows an apparatus for attaching a film to a lead frame according to an embodiment of the present invention. The apparatus for attaching a film to a lead frame includes a plate 12 that moves up and down by the operation of an air cylinder 10, a punch 8 fixed to the plate 12, a die 14 that supports the film 7, and A movable plate 13, and a heater unit 15 fixed to the plate 13 via the self-aligning mechanism 1;
The lead frame 3 is passed between the die 14 and the heater unit 15.

The heater section 15 is constructed by sequentially laminating a heat insulating material 4, a heater 6, a heater block 5, and a heater plate 11 on the upper surface of the self-centering mechanism 1.

The self-aligning mechanism 1 includes a spherical support shaft 2A fixed vertically to the plate 13, and an aligning plate 2B supported at one point on the spherical support shaft 2A.

Next, a method for attaching a film to a lead frame according to the present invention will be described. First, the air cylinder 10 is operated to lower the punch 8 through the plate 12. The punch 8 punches and shears the film 7 supported by the die 14 into a predetermined shape. It is lowered and sandwiched by the heater plate 11 raised by the air cylinder 9 together with the lead frame 3 located below the die 14, and is positioned at a predetermined position of the lead frame 3 (lead tip 3A in FIGS. 2 and 3). The film 7 is attached.

At this time, since the heater portion 15 rising through the plate 13 is supported by the plate 13 via the self-aligning mechanism 1, the heater plate 11 of the heater portion 15 reduces the pressure of the punch 8. Under the force, it follows the punch surface of the punch 8 so as to be in close contact with the entire surface of the punch 8. Therefore, even if a dimensional change due to thermal expansion or the like occurs, the film 7 can be uniformly attached to the lead frame 3, and the quality can be improved.

Further, as described above, the heater 15 may be elastically supported by an elastic member or the like, so that the sticking pressure of the film may be controlled.

[0019]

As described above, according to the film sticking apparatus for a lead frame of the present invention, when the punched punch supplies the punched adhesive film to the lead frame, the upper surface of the heater receives the rolling force of the punch. own to follow the upper surface of the heater to the punch surface of the punch so closely over the punch surface and the entire surface of the punch Te
Since the dynamic alignment mechanism is provided , a uniform film can be stuck to the lead frame, and a high-quality lead frame without sticking defects can be obtained.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention.

FIG. 2 is a plan view showing a lead frame to which a film is attached.

FIG. 3 is a plan view showing another lead frame to which a film is attached.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Self-centering apparatus 2A Spherical support shaft 2B Centering plate 3 Lead frame 3A Lead tip part 4 Insulation material 5 Heater block 6 Heater 7 Film 8 Punching punch 9 Air cylinder 10 Air cylinder 11 Heater plate 12 Plate 13 Plate 14 Die 15 Heater Department

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-60-38825 (JP, A) JP-A-4-196576 (JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB name) H01L 23/50

Claims (2)

(57) [Claims] 1. An adhesive film supported by a die is punched.
Punch it into a predetermined shape with a punch and place it below the die.
To the lead frame located on the top of the heater
In a device for attaching a film to a lead frame, the heater is supported from below, and the upper surface thereof is
The upper surface of the heater is subjected to the punching
Equipped with an automatic alignment mechanism that follows the punch surface of the punch
Film attachment to lead frame
Place. 2. The self-aligning mechanism according to claim 1 , wherein the heater includes a spherical body.
Cylinder having a spherical support member for supporting in a point shape by a cylinder
2. The lead frame according to claim 1, wherein said lead frame is lifted and lowered by a mechanism.
Film sticking device.