JP2000117476A5 - - Google Patents

Download PDF

Info

Publication number
JP2000117476A5
JP2000117476A5 JP1998287139A JP28713998A JP2000117476A5 JP 2000117476 A5 JP2000117476 A5 JP 2000117476A5 JP 1998287139 A JP1998287139 A JP 1998287139A JP 28713998 A JP28713998 A JP 28713998A JP 2000117476 A5 JP2000117476 A5 JP 2000117476A5
Authority
JP
Japan
Prior art keywords
angle
galvanometer mirror
detected
laser processing
waiting time
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1998287139A
Other languages
Japanese (ja)
Other versions
JP2000117476A (en
JP4049459B2 (en
Filing date
Publication date
Application filed filed Critical
Priority to JP28713998A priority Critical patent/JP4049459B2/en
Priority claimed from JP28713998A external-priority patent/JP4049459B2/en
Publication of JP2000117476A publication Critical patent/JP2000117476A/en
Publication of JP2000117476A5 publication Critical patent/JP2000117476A5/ja
Application granted granted Critical
Publication of JP4049459B2 publication Critical patent/JP4049459B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【００１１】
【課題を解決するための手段】
上記課題を解決するために本発明は、移動指令によってガルバノミラーを回転させ、前記ガルバノミラーの回転角度を検出し、前記検出した回転角度と目標回転角度との角度差を検出し、前記検出した角度差に基づいてガルバノミラーを目標回転角度に位置決めし、前記移動指令から前記ガルバノミラーの移動角度に対応した設定待ち時間後に前記ガルバノミラーに対してレーザ光線を照射し、前記ガルバノミラーで反射されたレーザ光線を集光レンズにより集光して被加工物に照射することでレーザ加工を行うことを特徴とするものである。また、ガルバノミラーの移動角度が小さいほど設定待ち時間が少ないことを特徴とするものである。 0011
[Means for solving problems]
In order to solve the above problems, the present invention rotates the galvano mirror by a movement command, detects the rotation angle of the galvano mirror , detects the angle difference between the detected rotation angle and the target rotation angle, and detects the detection. based on the angular difference positioning the gas Rubanomira the target rotation angle, the laser beam is irradiated to the galvanometer mirror after the setting waiting time corresponding to the moving angle of the galvanometer mirror from the movement command, it is reflected by the galvanometer mirror It is characterized in that laser processing is performed by condensing the laser beam with a condensing lens and irradiating the work piece with the light beam . Further, the smaller the moving angle of the galvano mirror, the smaller the set waiting time.

【００１３】
【発明の実施の形態】
本発明は、移動指令によってガルバノミラーを回転させ、前記ガルバノミラーの回転角度を検出し、前記検出した回転角度と目標回転角度との角度差を検出し、前記検出した角度差に基づいてガルバノミラーを目標回転角度に位置決めし、前記移動指令から前記ガルバノミラーの移動角度に対応した設定待ち時間後に前記ガルバノミラーに対してレーザ光線を照射し、前記ガルバノミラーで反射されたレーザ光線を集光レンズにより集光して被加工物に照射することでレーザ加工を行うことを特徴とするものである。また、ガルバノミラーの移動角度が小さいほど設定待ち時間が少ないことを特徴とするものである。 0013
BEST MODE FOR CARRYING OUT THE INVENTION
The present invention, by rotating the galvanometer mirror by the movement command, the detected rotation angle of the galvanometer mirror, detects an angular difference between the rotational angle and target angle of rotation the detected gas on the basis of the detected angular difference Rubanomira the positioning to the target rotation angle, wherein the movement command after the setting waiting time corresponding to the moving angle of the galvanometer mirror a laser beam irradiates the galvanomirror, the condensing lens of the laser beam reflected by the galvano mirror It is characterized in that laser processing is performed by condensing light and irradiating the work piece . Further, the smaller the moving angle of the galvano mirror, the smaller the set waiting time.

Claims (2)

移動指令によってガルバノミラーを回転させ、前記ガルバノミラーの回転角度を検出し、前記検出した回転角度と目標回転角度との角度差を検出し、前記検出した角度差に基づいてガルバノミラーを目標回転角度に位置決めし、前記移動指令から前記ガルバノミラーの移動角度に対応した設定待ち時間後に前記ガルバノミラーに対してレーザ光線を照射し、前記ガルバノミラーで反射されたレーザ光線を集光レンズにより集光して被加工物に照射することでレーザ加工を行うことを特徴とするレーザ加工方法。 Rotating the galvanometer mirror by the movement command, the detected rotation angle of the galvanometer mirror, detects an angular difference between the rotational angle and target angle of rotation the detected target rotation angle moth Rubanomira on the basis of the detected angular difference positioned in the laser beam irradiates the galvanomirror, the condensing said by reflected condenser lens of the laser beam by the galvano mirror from said movement command after the setting waiting time corresponding to the moving angle of the galvanometer mirror A laser processing method characterized by performing laser processing by irradiating a workpiece. ガルバノミラーの移動角度が小さいほど設定待ち時間が少ないことを特徴とする請求項１記載のレーザ加工方法。2. The laser processing method according to claim 1, wherein the setting waiting time is shorter as the moving angle of the galvanometer mirror is smaller.
JP28713998A 1998-10-09 1998-10-09 Laser processing method Expired - Lifetime JP4049459B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28713998A JP4049459B2 (en) 1998-10-09 1998-10-09 Laser processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28713998A JP4049459B2 (en) 1998-10-09 1998-10-09 Laser processing method

Publications (3)

Publication Number Publication Date
JP2000117476A JP2000117476A (en) 2000-04-25
JP2000117476A5 true JP2000117476A5 (en) 2005-07-21
JP4049459B2 JP4049459B2 (en) 2008-02-20

Family

ID=17713583

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28713998A Expired - Lifetime JP4049459B2 (en) 1998-10-09 1998-10-09 Laser processing method

Country Status (1)

Country Link
JP (1) JP4049459B2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3407715B2 (en) * 2000-06-06 2003-05-19 松下電器産業株式会社 Laser processing equipment
JP4698092B2 (en) * 2001-07-11 2011-06-08 住友重機械工業株式会社 Galvano scanner device and control method thereof
JP4630853B2 (en) * 2006-03-30 2011-02-09 日立ビアメカニクス株式会社 Positioning control device for moving body and laser processing device
JP5167187B2 (en) * 2009-03-31 2013-03-21 日立ビアメカニクス株式会社 Laser drilling method
JP5393598B2 (en) * 2010-06-03 2014-01-22 キヤノン株式会社 Galvano device and laser processing device
JP5724982B2 (en) * 2012-09-27 2015-05-27 ブラザー工業株式会社 2-axis galvanometer mirror device
JP6431333B2 (en) * 2014-10-15 2018-11-28 キヤノン株式会社 Processing equipment

Similar Documents

Publication Publication Date Title
JP3779639B2 (en) Laser marking method and apparatus for carrying out this method
JP2004514053A (en) Apparatus for sintering, material removal and / or labeling with electromagnetic radiation flux and method of operating the apparatus
JP2000117476A5 (en)
JPH04272122A (en) Laser-beam machine
JPH03142092A (en) Laser optical system and laser beam processing method using this system
JP2000317660A (en) Method and device for removing burr by using laser beam
JPH1015682A (en) Laser cutting method for precoated steel sheet
JPS6163387A (en) Laser beam machine
JP2008062257A5 (en)
JPH0716779A (en) Focusing device for laser beam machine
JP2001096381A (en) Laser beam machining process
JPS6138774Y2 (en)
JPS6116939Y2 (en)
JPH05245679A (en) Laser beam machine for body of rotation
JPH05212576A (en) Processing head for laser beam machine
JPS62183990A (en) Laser beam machine
JP7467821B2 (en) Laser processing device and processing method
JPH01306089A (en) Irradiation method of scanning laser light
JPS6138791A (en) Working method on outer peripheral face of annular or tubular article
JPH0639575A (en) Laser beam machine
JPS63123589A (en) Laser beam machine
JP2001042247A5 (en)
JPH0634068Y2 (en) Laser processing equipment
JPH04339239A (en) Detecting device for meterial quality of work
JPS5913589A (en) Laser working device