JP2000114434A - Structure for mounting semiconductor chip or semiconductor device on substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To dismount a semiconductor chip from a substrate easily. SOLUTION: In a structure for mounting a semiconductor chip 10 or a semiconductor device on a substrate 16 in which a plurality of electrode pads 12 formed on the surface of the semiconductor chip 10 and a plurality of lands 18 formed on the surface of the substrate 16 are electrically connected together to mount, a plurality of conductive columnar bodies 20 and 22 are erected at a right angle at intervals on each surface of the electrode pads 12 and the lands 18, respectively. The semiconductor chip 10 is mounted so that a plurality of columnar bodies 20 formed on the electrode pads 12 are inserted among a plurality of columnar bodies 22 formed on the lands 18 in a position corresponding to the electrode pad 12, and further that both of columnar bodies 20 and 22 are fitted with each other under the condition where outer peripheral surfaces of the columnar bodies are brought into contact with each other.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a structure for mounting a semiconductor chip or a semiconductor device on a mounting board.

[0002]

2. Description of the Related Art An outline of a conventional mounting structure of a semiconductor chip or a semiconductor device on a mounting substrate will be described with reference to FIG. First, a bump 14 is formed by mounting a solder ball or the like on a plurality of electrode pads 12 formed in a two-dimensional area on the surface of a semiconductor chip or a semiconductor device (hereinafter also referred to as a mounted body) 10. Then, the mounted body 10 is positioned so that each bump 14 of the mounted body 10 comes into contact with each of a plurality of lands 18 formed on the surface of the mounting board 16 in the same position in the same two-dimensional area. While mounting on the mounting board 16. Finally, the entire structure is heated to melt the bumps 14. As a result, the mounted body 10 is mounted on the mounting board 16 in a state where the electrode pads 12 of the mounted body 10 and the lands 18 of the mounting board 16 are electrically connected by the bump forming material such as solder. .

[0003]

An electrical test of a semiconductor chip or a semiconductor device is also performed alone, and a product judged to be non-defective is mounted on a mounting board. Even in this state, a more detailed electrical test is performed on the functions, and those finally determined to be OK are shipped as non-defective products. And, even after a semiconductor chip or a semiconductor device is determined to be a single good product, it may be determined that the item to be tested only after being mounted on a mounting board is defective. Since they are arranged in a two-dimensional area, the mutual connection state between all the electrode pads and the lands is difficult to determine visually, and a connection failure may become apparent for the first time in a test after mounting.

In such a case, it is necessary to remove the semiconductor chip or the semiconductor device once mounted from the mounting board, replace the semiconductor chip or the semiconductor device with a good semiconductor chip or the like, and mount it again on the mounting board. However, in a conventional mounting structure of a semiconductor chip or a semiconductor device on a mounting substrate using bumps, a bump forming material (solder or the like) connecting all the electrode pads and all the lands spread in a two-dimensional area must be melted at the same time. For example, there is a problem that the semiconductor chip or the semiconductor device cannot be removed from the mounting substrate, and the removal operation is very difficult.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to solve the above-mentioned problems, and an object of the present invention is to provide a structure for mounting a semiconductor chip or a semiconductor device on a mounting substrate in which the semiconductor chip or the semiconductor device can be easily removed from the mounting substrate. Is to provide.

[0006]

In order to solve the above-mentioned problems, according to the present invention, a plurality of electrode pads formed on a surface of a semiconductor chip or a semiconductor device and a plurality of electrode pads formed on a surface of a mounting substrate are provided. In a mounting structure of a semiconductor chip or a semiconductor device mounted on a mounting board, a conductive columnar body is provided on each surface of the electrode pads and the lands at intervals. The semiconductor chip or the semiconductor device is provided with a plurality of pillars formed on the land at positions corresponding to the electrode pads. It is characterized in that it is inserted in between, and fitted and mounted in a state where the outer peripheral surfaces of both columnar bodies are in contact with each other.

According to this, the semiconductor chip or the semiconductor device and the mounting board are connected only by the frictional force between the outer peripheral surfaces of the electrode pads and the columns formed on the respective surfaces of the lands. Have been. Therefore, when the semiconductor chip or the semiconductor device is detached from the mounting substrate, it is only necessary to separate the semiconductor chip or the semiconductor device from the mounting substrate, and the heat treatment as in the related art is unnecessary,
Easy removal. Also, even when a semiconductor chip or a semiconductor device is mounted on a mounting substrate, it is not necessary to melt the bumps as in the related art, and the process can be simplified.

According to a second aspect of the present invention, a plurality of electrode pads formed on a surface of a semiconductor chip or a semiconductor device are electrically connected to a plurality of lands formed on a surface of a mounting substrate. In the mounting structure of the semiconductor chip or semiconductor device on the mounting board,
On each surface of the electrode pad, a plurality of conductive pillars are erected at right angles with an interval therebetween, and on a formation region of a plurality of lands of the mounting substrate, the same length as the thickness along the thickness direction. The anisotropic conductive sheet embedded in a non-conductive rubber material in a state where the myriad of conductive pillars expose both ends and the outer peripheral surfaces do not contact each other is fixed, and the semiconductor chip or the The semiconductor device is pressed against the mounting substrate via the anisotropic conductive sheet, and the plurality of columnar bodies formed on the electrode pad are pierced into the anisotropic conductive sheet and correspond to the electrode pad. It is characterized in that the outer peripheral surfaces of the two pillars are fitted and mounted between the plurality of pillars in the anisotropic conductive sheet in the land area at the position in a state where they are in contact with each other.

According to this, the semiconductor chip or the semiconductor device and the mounting substrate are formed by pressing the semiconductor chip or the semiconductor device against the mounting substrate via the anisotropic conductive sheet and forming the columnar body formed on the surface of the electrode pad. By piercing the anisotropic conductive sheet, the electrode pad and the land are electrically connected. Therefore, when removing the semiconductor chip or the semiconductor device from the mounting substrate, the pressing of the semiconductor chip or the semiconductor device against the mounting substrate is released, and the columnar body formed on the electrode pad of the semiconductor chip or the semiconductor device is anisotropically conductive. Just pull it out of the sheet. Therefore, the heat treatment is not required as in the related art, and the removal is simplified. Also, even when a semiconductor chip or a semiconductor device is mounted on a mounting substrate, it is not necessary to melt the bumps as in the related art, and the process can be simplified.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the mounting structure of a semiconductor chip or a semiconductor device on a mounting board according to the present invention will be described below in detail with reference to the accompanying drawings. The same components as those of the conventional example are denoted by the same reference numerals, and detailed description thereof will be omitted. (First Embodiment) First, the basic concept of the present embodiment will be described with reference to FIGS. The idea is that a semiconductor chip or a semiconductor device (mount 1
0) is mounted on the mounting board 16 by electrically connecting the plurality of electrode pads 12 formed on the surface of the mounted body 10 and the plurality of lands 18 formed on the surface of the mounting board 16 with: First, as shown in FIG. 1, a plurality of conductive pillars 20 and 22 are erected at right angles on each surface of the electrode pad 12 and the land 18 at intervals. Then, the plurality of pillars 20 formed on each electrode pad 12 are
2 is mounted between the plurality of columnar bodies 22 formed on the lands 18 at positions corresponding to the positions of FIG. 2 so that the outer peripheral surfaces of the two columnar bodies 20 and 22 are fitted in a state of being in contact with each other. Is to do.

Then, the mounted body 1 mounted with this structure
No. 0 is easily detached from the mounting substrate 16 even when vibration is applied to the mounting substrate 16 due to a frictional force generated between the outer peripheral surface of the columnar body 20 of the mounted body 10 and the columnar body 22 of the mounting substrate 16 in contact with each other. Absent. On the other hand, since the electrode pads 12 and the lands 18 are not connected by melting the bump forming material (solder or the like) as in the related art, all the contacting columnar members 20 and all the columnar members 22 act between them. If the body 10 is separated from the mounting board 16 by a force higher than the frictional force, the body 10 can be mounted on the mounting board 16 without reheating.
Can be removed from. Further, the mounted body 10 once removed can be mounted on the mounting board 16 again in the same manner.

(Structures of electrode pads, lands, and pillars)
Next, a detailed configuration of each component will be described. The two-dimensional arrangement of each land 18 provided on the mounting board 16 is as follows.
The two-dimensional arrangement of each electrode pad 12 provided on the mounted body 10 electrically connected to each land 18 is set. That is, the mounted body 10 is
And the mounted body 10 is mounted on the land 1 of the mounting board 16.
When they are placed at a predetermined position in the region where 8 is formed, they are arranged so as to overlap each other.

The electrode pad 12 and the land 18
As an example, as shown in FIG. 3, the same number of pillars 20, 22 are vertically projected in a matrix of 4 rows × 4 columns at the same pitch P. The form of the matrix is 4
The number of rows is not limited to 4 × columns, and may be n rows × m columns (both n and m are natural numbers of 2 or more). I do. Further, the pitch between the columnar bodies 20 and 22 is not necessarily required to be the same pitch because it is only necessary that the other columnar body can fit into the gap between one columnar body. It is sufficient that the pitch is an integral multiple of the pitch of one of the columnar bodies.

Similarly, the thickness of each of the pillars 20 and 22 may be the same as long as the other pillar is fitted into the gap between one pillar and the outer peripheral surfaces of both pillars can contact each other.
As shown in FIG. 3, they may be formed to have substantially the same thickness as in the present embodiment, or may have different thicknesses. The thickness of the other column may be determined in consideration of the gap between the columns. Further, the arrangement of the columnar bodies 20 and 22 can be arranged in a staggered manner in addition to the matrix as shown in FIG.

(Step of forming columnar body)
The formation of 2 is performed in the next step shown in FIG. The formation of the pillars 20 on the electrode pads 12 of the mounted body 10 will be described as an example, but the same applies to the case where the pillars 22 are formed on the lands 18 of the mounting board 16. In the first step, a metal layer (not shown) such as a power supply layer such as Ti / Cu, Cr / Cu, or Cr / Ni is formed on the surface of the body 10 on which the electrode pads 12 and other conductive patterns (not shown) are formed. ) Is formed on the entire surface by sputtering or electroless plating. In the second step, as shown in FIG. 4A, a liquid photoresist is applied on the metal layer several times to form a resist film 24 having a predetermined thickness.
To form Thereafter, the resist film 24 is processed by photolithography to form a plurality of (in this example, 4 × 4 = 16) fine holes 26 in the region of each electrode pad 12, and a portion of the metal layer on which the columnar body 20 is to be formed. To expose. Here, the diameter of the fine holes 26 is determined by forming a coating layer made of Ni plating or the like on the surface of the core material 28 to form the final columnar body 20.
Keep the diameter smaller than 0.

In the third step, an electroplating method is used.
As shown in FIG. 4B, Cu plating is performed on the metal layer to form the core material 28 of the columnar body 20. At this time, the tip of the core 28 is prevented from protruding from the surface of the resist film 24. In the case where the core material 28 protrudes, the tip of the core material 28 expands in an umbrella shape on the surface of the resist film 24 to increase the outer diameter.
This is because the gaps between the core materials 28 become narrow even if the tips of the tips 8 contact each other or even if they do not contact each other. here,
In the present embodiment, since the final length of the columnar bodies 20 and 22 is formed to be about 50 μm to about 100 μm, the length of the core material 28 is also approximately the same, and then the surface of the core material 28 is coated with Ni plating, etc. It is necessary to form the layer slightly shorter in consideration of forming the layer.

Note that the second and third steps are performed once.
When the length of the core material 28 cannot be formed to about 50 μm to 100 μm, the above-described second and third steps are repeated as many times as necessary to make the length of the core material 28 a target length. FIG. 4 shows a case where the second step and the third step are repeated twice, and after the first third step, as a second step again, as shown in FIG. A liquid photoresist is applied several times on the resist film 24 formed in the fine holes 26 to form a second resist film 3 having a predetermined thickness.
0 is laminated. The second resist film 30 is processed by photolithography to form a second fine hole 32 having the same diameter as the fine hole 26 communicating with the fine hole 26 on the fine hole 26, thereby exposing the upper portion of the core 28. next,
As a third step again, as shown in FIG. 4D, the upper portion of the exposed core material 28 is further plated by electroplating.
The whole length of the core material 28 is lengthened by performing Cu plating.

After the core material 28 can be formed to a desired length by one or several times of the second and third steps, the resist film is formed as a fourth step as shown in FIG. 24 (and one or more second resist films 30) are removed. As a result, core members 28 having a predetermined thickness are formed on each of the electrode pads 12 in a matrix at a predetermined pitch. Next, the columnar bodies 20, 22 formed on the electrode pad 12 and the land 18 as described above are fitted into the gap formed between the opposing columnar bodies 22, 20, and are removably connected. Therefore, the connection must be slightly inclined (bent) at the time of connection, and must return to the original linear shape when the connection is released. Further, in some cases, the tips of the two may abut each other at the time of connection, so that it is not easy to bend easily. Therefore, the columnar bodies 20 and 22 need to have a certain rigidity and elasticity. For this reason, a coating layer (Ni, Au plating) is formed on the entire surfaces of the columnar bodies 20 and 22.

As a fifth step, as shown in FIG. 4 (f), the surface on which the electrode pads 12 and other conductor patterns (not shown) of the mounted body 10 are formed (specifically, formed on this surface). A liquid photoresist is applied several times on the power supply layer) to form a resist film 44 having a predetermined thickness. Next, as a sixth step, the formed resist film 44 is processed by photolithography to expose each electrode pad 12 region (FIG. 4G). By this process, the core material 28 formed on each electrode pad 12 is also exposed.

Next, as a seventh step, Ni plating is applied to a metal portion exposed from the resist film 44 by supplying power from the power supply layer.
Apply Au plating sequentially. As a result, the coating layer 34 made of Ni plating and Au plating is exposed to the exposed electrode pad 12.
And on the surface of the core material 28 (FIG. 4 (h)). Core material 2
8 becomes the columnar body 20 by forming the coating layer 34 on the surface. Thereafter, the resist film 44 is removed as an eighth step, and the power supply layer is further removed by etching (FIG. 4).
(I)). Further, the columnar body 22 can be formed on each land 18 of the mounting board 16 by the same process.

In the above-described process, the core material 28 is formed by electrolytic Cu plating.
A method of directly forming the core material 28 by electroless Cu plating on the electrode pads 12 in the fine holes 26 formed in the resist film 24 in the second step and the third step described above without forming the core material 28 on the formation surface of the resist film 24 Is also possible. In this case, the length of the core material 28 that can be formed by one electroless Cu plating is considered to be short. Therefore, as described above, the second step and the third step are repeated as many times as necessary, and the core material 28 is formed. To the desired length.
Although not shown, the core member 28 can also be formed by wire bonding.

Further, instead of the steps of FIGS. 4F to 4I, as a fifth step, as shown in FIG. 4F, after the power supply layer is selectively removed by etching, the core is removed. The coating layer 34 may be formed by applying electroless Ni plating (or the underlying electroless Ni plating and electroless Au plating) to the surface of the material 28 (the surface of the electrode pad 12 is also the same). This method can be applied to the case where the columnar body 22 is formed on each land 18 of the mounting board 16. In this case, even if the power supply layer is formed of copper, the thickness of the power supply layer is very thin compared to the thickness of the core material 28 also made of copper, so that the surface of the core material 28 is slightly eroded. However, the power supply layer can be completely removed by etching.

Further, each land 18 of the mounting board 16
In the case of forming the columnar body 22 thereon, in the step of forming the coating layer 34 on the surface of the core material 28, Japanese Patent Application No. 63-96
It is also possible to use the technique disclosed in US Pat.
That is, each land 18 is previously formed in the inner layer of the mounting
The individually connected wiring patterns are led to the peripheral portion of the mounting substrate 16, and the ends on the peripheral side of each wiring pattern are electrically connected to each other by a conductive pattern portion extending along the peripheral edge of the mounting substrate 16. Then, in a seventh step shown in FIG. 4H, Ni plating is applied to the metal portion exposed from the resist film 44 by supplying power from the conductive pattern portion instead of the power supply layer.
Apply Au plating sequentially. Finally, as an eighth step shown in FIG. 4, the resist film 44 is removed, and the periphery of the mounting substrate 16 is ground in place of the operation of removing the power supply layer (when the conductive pattern portion is exposed). Is etched) to remove the conductive pattern portion.
The electrical continuity between the 8 is cut off.

Further, as a coating layer 34 forming the columnar body 22, solder plating is applied, the mounted body 10 such as a semiconductor chip is once mounted on the mounting board 16, and after the electrical test is completed, the test results are as follows. Those that passed the test were then subjected to a heat treatment to melt the solder that had formed the coating layer 34, and the columnar members 2 of both the mounted body 10 and the mounting board 16 were heated.
It is also possible to solder-join 0 and 22 together. As a result, it is possible to ship the accepted product in a stronger connection state. In this case, it is difficult to remove the mounted body 10 after soldering. However, in the case of a failed board, the mounted body 10 is removed from the mounting board 16 and another mounted body 10 is attached again. This is effective because the mounting substrate 16 can be reused.

(Second Embodiment) First, the basic concept of the present embodiment will be described with reference to FIGS. Note that the same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted. The idea is that a semiconductor chip or a semiconductor device (mounted body 10) is mounted on a mounting board 16, a plurality of electrode pads 12 formed on the surface of the mounted body 10 and a plurality of lands 18 formed on the surface of the mounting board 16. When electrically connecting and mounting, first, similarly to the first embodiment, as shown in FIG. 5, a conductive columnar body 20 is provided on each surface of the electrode pad 12 at intervals. Erect multiple at right angles.

Next, as shown in FIG. 5, an infinite number of conductive pillars 36 having the same length as the thickness B along the thickness direction are formed on the regions A where the plurality of lands 18 of the mounting board 16 are formed. Is exposed, and a known anisotropic conductive sheet 40 buried substantially in parallel with the non-conductive rubber material 38 in a state where the outer peripheral surfaces are not in contact with each other is fixed. Actually, it is fixed on the mounting substrate 16 by means such as adhesion. Then, the mounted body 10
As shown in FIG. 6, is pressed against the mounting substrate 16 via the anisotropic conductive sheet 40, and the plurality of columnar bodies 20 formed on the electrode pads 12 pierce the anisotropic conductive sheet 40. The pierced columnar body 20 is the electrode pad 1
2 are fitted and mounted between the plurality of columnar bodies 36 in the anisotropic conductive sheet 40 in the region of the land 18 at the position corresponding to 2 in a state where both outer peripheral surfaces are in contact with each other.

Thus, the columnar body 20 formed on each electrode pad 12 of the mounted body 10 and the anisotropic conductive sheet 40 arranged in the region of the land 18 of the mounting board 16 corresponding to the electrode pad 12 The outer peripheral surfaces of the columnar body 36 are in contact with each other. Then, the anisotropic conductive sheet 40 is
The lower end of the columnar body 36 in the anisotropic conductive sheet 40 in the area of the land 18 comes into contact with the land 18 because it is pressed against the mounting board 16 by the zero. Therefore, the electrode pads 12 of the mounted body 10 and the lands 18 of the mounting board 16 are electrically connected through the respective pillars 20 and 36. Further, since the columnar body 20 of the mounted body 10 is only inserted into the non-conductive rubber material 40 of the anisotropic conductive sheet 40, the pressing of the mounted body 10 against the mounting board 16 is released, Further, by applying an external force having a predetermined magnitude in a direction away from the mounting substrate 16 to the mounted body 10, the columnar body 20 of the mounted body 10
If it comes out, the mounted object 10 can be relatively easily removed from the mounting board 16 as in the first embodiment. It is also possible to mount it again.

In this embodiment, the columnar body 20 is formed on the side of the electrode pad 12 of the mounted body 10 and the anisotropic conductive sheet 4 is formed.
0 is disposed on the mounting board 16 side, but the reverse, that is, the columnar body 22 is formed on the mounting board 16 side and the columnar body 20 is not formed on the electrode pad 12 side as in the first embodiment. A configuration in which the anisotropic conductive sheet 40 is attached may be used. In the case where the column 36 on the mounting board 16 side is embedded in the non-conductive rubber material 38 as in the present embodiment, the column 3
6 is protected by the non-conductive rubber material 38,
There is a feature that it is hard to break and hard to bend. Therefore, also in the case of the first embodiment, the mounted body 10
Either the electrode pad 12 formation region or the land 18 formation region of the mounting substrate 16 is
By covering with an elastic resin material having substantially the same thickness as the length of the columnar bodies 20 and 22 protruding from the land 2 or the land 18, similarly to the case of the anisotropic conductive sheet 40 of the second embodiment, It is also possible to prevent the columnar bodies 20 and 22 covered with the resin material from being bent or bent.
As an example, the formation region C of the electrode pad 12 of the mounted body 10
When applied to the resin material 4 as shown by the dotted line in FIG.
The column 20 may be covered with 2.

As in the above-described first and second embodiments, the electrode pad 12 and / or the land 1
The mounting structure in which the columnar bodies 20 and 22 are erected on the mounting board 8 and the mounted body 10 is detachably mounted on the mounting board 16 has a plurality of electrode pads 12 and lands 18 having a fixed area. Since the pillars 20, 22 must be erected,
When the area of the electrode pads 12 and the lands 18 is small, or when the distance between the electrode pads 12 and the lands 18 is small and the number is large, it takes time to form the columnar bodies 20 and 22. However, it is considered effective for a system LSI having a relatively small number of input / output electrodes, such as a system LSI.

Although the preferred embodiments of the present invention have been described in various ways, the present invention is not limited to the above-described embodiments, and it is noted that many modifications can be made without departing from the spirit of the invention. Of course.

[0031]

According to the structure for mounting a semiconductor chip or a semiconductor device on a mounting substrate according to the present invention, it is not necessary to heat the material for forming bumps (solder or the like) by heating at the time of mounting or removing as in the prior art. A semiconductor chip or a semiconductor device can be mounted on a mounting substrate or removed from the mounting substrate relatively easily. Further, there is an effect that the detached mounted body can be easily remounted.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram for explaining a first embodiment of a mounting structure of a semiconductor chip or a semiconductor device on a mounting substrate according to the present invention (state diagram before mounting).

FIG. 2 is an explanatory diagram showing a state in which the semiconductor chip or the semiconductor device of FIG. 1 is mounted on a mounting board.

FIG. 3 is a plan view showing the relationship between the structure of a columnar body formed on the electrode pad of FIG. 1 and a columnar body on the mounting board side fitted between the columnar bodies.

FIG. 4 is an explanatory view showing a step of forming a columnar body formed on the semiconductor chip or the semiconductor device of FIG. 1 and a mounting substrate.

FIG. 5 is an explanatory diagram for explaining a second embodiment of the mounting structure of the semiconductor chip or the semiconductor device on the mounting substrate according to the present invention (state diagram before mounting).

6 is an explanatory diagram showing a state where the semiconductor chip or the semiconductor device of FIG. 5 is mounted on a mounting board.

FIG. 7 is an explanatory diagram for explaining a conventional mounting structure of a semiconductor chip or a semiconductor device on a mounting substrate using bumps (state diagram before mounting).

[Explanation of symbols]

 REFERENCE SIGNS LIST 10 mounted object (semiconductor chip or semiconductor device) 12 electrode pad 16 mounting substrate 18 land 20 columnar body (electrode pad side) 22 columnar body (land side)

Claims (2)

[Claims] 1. A semiconductor chip or semiconductor device mounting method in which a plurality of electrode pads formed on a surface of a semiconductor chip or a semiconductor device and a plurality of lands formed on a surface of a mounting substrate are electrically connected and mounted. In the mounting structure on the substrate, a plurality of conductive pillars are provided at right angles at intervals on each surface of the electrode pad and the land, and the semiconductor chip or the semiconductor device is provided on the electrode pad. The formed plurality of pillars are inserted between the plurality of pillars formed on the lands at positions corresponding to the electrode pads, and fitted in a state where the outer peripheral surfaces of both pillars are in contact with each other. A mounting structure of a semiconductor chip or a semiconductor device on a mounting substrate, wherein the mounting structure is mounted on the mounting substrate. 2. A semiconductor chip or semiconductor device mounting method, wherein a plurality of electrode pads formed on a surface of a semiconductor chip or a semiconductor device and a plurality of lands formed on a surface of a mounting substrate are electrically connected and mounted. In the mounting structure on the substrate, a plurality of conductive pillars are erected at right angles with an interval on each surface of the electrode pad, and a thickness direction is formed on a region where a plurality of lands of the mounting substrate are formed. Anisotropic conductive sheets embedded in a non-conductive rubber material with both ends exposed by countless conductive pillars of the same length as The semiconductor chip or the semiconductor device is pressed against the mounting substrate via the anisotropic conductive sheet,
The plurality of pillars formed on the electrode pad are pierced into the anisotropic conductive sheet, and between the plurality of pillars in the anisotropic conductive sheet in a region of the land corresponding to the electrode pad. A mounting structure of a semiconductor chip or a semiconductor device on a mounting board, wherein the outer peripheral surfaces of both columnar bodies are fitted and mounted in a state of being in contact with each other.