JP2000109654A5 - - Google Patents
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- JP2000109654A5 JP2000109654A5 JP1999206682A JP20668299A JP2000109654A5 JP 2000109654 A5 JP2000109654 A5 JP 2000109654A5 JP 1999206682 A JP1999206682 A JP 1999206682A JP 20668299 A JP20668299 A JP 20668299A JP 2000109654 A5 JP2000109654 A5 JP 2000109654A5
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- red phosphorus
- thermoplastic resin
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- 239000011342 resin composition Substances 0.000 description 32
- 229920005992 thermoplastic resin Polymers 0.000 description 31
- OAICVXFJPJFONN-UHFFFAOYSA-N phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 27
- 239000007788 liquid Substances 0.000 description 23
- 229920000728 polyester Polymers 0.000 description 22
- 229920005989 resin Polymers 0.000 description 13
- 239000011347 resin Substances 0.000 description 13
- PPBRXRYQALVLMV-UHFFFAOYSA-N styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 10
- -1 2,2'-diphenyl dicarboxylic acid Aliphatic dicarboxylic acids Chemical class 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 229920001955 polyphenylene ether Polymers 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 239000003063 flame retardant Substances 0.000 description 4
- 238000004898 kneading Methods 0.000 description 4
- 229920005668 polycarbonate resin Polymers 0.000 description 4
- 239000004431 polycarbonate resin Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- WERYXYBDKMZEQL-UHFFFAOYSA-N 1,4-Butanediol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- BWBGEYQWIHXDKY-UHFFFAOYSA-N 3-(4-hydroxyphenyl)phenol Chemical group C1=CC(O)=CC=C1C1=CC=CC(O)=C1 BWBGEYQWIHXDKY-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N Adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N Sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 229910052801 chlorine Chemical group 0.000 description 2
- 125000001309 chloro group Chemical group Cl* 0.000 description 2
- 125000004435 hydrogen atoms Chemical group [H]* 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- DNIAPMSPPWPWGF-UHFFFAOYSA-N propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 2
- XXMIOPMDWAUFGU-UHFFFAOYSA-N 1,6-Hexanediol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N 2,2-dimethylpropane-1,3-diol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- XBNGYFFABRKICK-UHFFFAOYSA-N 2,3,4,5,6-pentafluorophenol Chemical compound OC1=C(F)C(F)=C(F)C(F)=C1F XBNGYFFABRKICK-UHFFFAOYSA-N 0.000 description 1
- IJFXRHURBJZNAO-UHFFFAOYSA-N 3-Hydroxybenzoic acid Chemical compound OC(=O)C1=CC=CC(O)=C1 IJFXRHURBJZNAO-UHFFFAOYSA-N 0.000 description 1
- RXNYJUSEXLAVNQ-UHFFFAOYSA-N 4,4'-Dihydroxybenzophenone Chemical compound C1=CC(O)=CC=C1C(=O)C1=CC=C(O)C=C1 RXNYJUSEXLAVNQ-UHFFFAOYSA-N 0.000 description 1
- VWGKEVWFBOUAND-UHFFFAOYSA-N 4,4'-thiodiphenol Chemical compound C1=CC(O)=CC=C1SC1=CC=C(O)C=C1 VWGKEVWFBOUAND-UHFFFAOYSA-N 0.000 description 1
- ALYNCZNDIQEVRV-UHFFFAOYSA-N 4-Aminobenzoic acid Chemical compound NC1=CC=C(C(O)=O)C=C1 ALYNCZNDIQEVRV-UHFFFAOYSA-N 0.000 description 1
- BDJRBEYXGGNYIS-UHFFFAOYSA-N Azelaic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 1
- TVIDDXQYHWJXFK-UHFFFAOYSA-N Dodecanedioic acid Chemical compound OC(=O)CCCCCCCCCCC(O)=O TVIDDXQYHWJXFK-UHFFFAOYSA-N 0.000 description 1
- 229940117969 NEOPENTYL GLYCOL Drugs 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229960004050 aminobenzoic acid Drugs 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- AJPXTSMULZANCB-UHFFFAOYSA-N chlorohydroquinone Chemical compound OC1=CC=C(O)C(Cl)=C1 AJPXTSMULZANCB-UHFFFAOYSA-N 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N cyclohexane-1,4-dicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- VKONPUDBRVKQLM-UHFFFAOYSA-N cyclohexane-1,4-diol Chemical compound OC1CCC(O)CC1 VKONPUDBRVKQLM-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
Description
【特許請求の範囲】
【請求項１】スチレン系樹脂、ポリカーボネート系樹脂、ポリフェニレンエーテル系樹脂から選ばれた１種以上の熱可塑性樹脂（Ａ）０．５重量％以上６０重量％未満と下記(I)、(II)、(III)、(IV)の構造単位からなる液晶性ポリエステル（Ｂ）９９．５重量％以下４０重量％超とからなる樹脂組成物（Ｃ）１００重量部および導電率が０．１〜１０００μＳ／ｃｍの赤燐０．０１〜３０重量部を含有してなる熱可塑性樹脂組成物。
【化１】
【化２】
【化３】
【請求項２】樹脂組成物（Ｃ）１００重量部に充填材を０．５〜３００重量部をさらに含有してなる請求項１記載の熱可塑性樹脂組成物。
【請求項３】ＵＬ−９４規格において０．５ｍｍ厚みでＶ−０の難燃性を有する請求項１または２記載の熱可塑性樹脂組成物、
【請求項４】スチレン系樹脂、ポリカーボネート系樹脂、ポリフェニレンエーテル系樹脂から選ばれた１種以上の熱可塑性樹脂（Ａ）の一部もしくは全部、または前記液晶性ポリエステル（Ｂ）の一部もしくは全部または、最終的に含有せしめる（Ａ）および（Ｂ）のうちの一部と赤燐を一旦溶融混練して実際に熱可塑性樹脂組成物に配合されるべき赤燐量よりも赤燐濃度の高い樹脂組成物を作製した後、請求項１〜３のいずれか記載の熱可塑性樹脂組成物を製造することを特徴とする熱可塑性樹脂組成物の製造方法。
【請求項５】請求項１〜３のいずれか記載の難燃性樹脂組成物で構成してなる成形品であって、該成形品が機械機構部品、電気電子部品または自動車部品である成形品。
【請求項６】請求項１〜３のいずれか記載の難燃性樹脂組成物で構成してなる成形品であって、該成形品が板状あるいは箱形でかつ厚み１．０ｍｍ以下の薄肉部を成形品全表面積に対して１０％以上有することを特徴とする成形品。
[Claims]
1. A thermoplastic resin (A) selected from the group consisting of a styrene resin, a polycarbonate resin, and a polyphenylene ether resin (A) in an amount of 0.5% by weight or more and less than 60% by weight and the following (I) and (II): , (III), 100 parts by weight of a resin composition (C) composed of 99.5% by weight or more and more than 40% by weight of a liquid crystalline polyester (B) comprising structural units of (IV) and a conductivity of 0.1 to 1000 μS. A thermoplastic resin composition containing 0.01 to 30 parts by weight of red phosphorus / cm3 .
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2. A resin composition (C) a filler in 100 parts by weight comprising further contain 0.5 to 300 parts by weight of claim 1 Symbol placement thermoplastic resin composition.
3. A process according to claim 1 or 2 thermoplastic resin composition according with a flame retardancy of V-0 at 0.5mm thickness in UL-94 standard,
4. A part or all of one or more thermoplastic resins (A) selected from styrene resins, polycarbonate resins and polyphenylene ether resins, or a part or all of said liquid crystalline polyester (B). Alternatively, a part of (A) and (B) finally contained and red phosphorus are once melt-kneaded, and the concentration of red phosphorus is higher than the amount of red phosphorus to be actually blended into the thermoplastic resin composition. A method for producing a thermoplastic resin composition, comprising: producing the thermoplastic resin composition according to any one of claims 1 to 3 after producing the resin composition.
5. A molded article formed constituted by the flame-retardant resin composition according to any one of claims 1 to 3, the molded article molded article is mechanical mechanism parts, electric or electronic parts or automotive parts .
6. A molded article comprising the flame-retardant resin composition according to any one of claims 1 to 3 , wherein the molded article is a thin plate having a plate shape or a box shape and a thickness of 1.0 mm or less. A molded article characterized by having at least 10% of the total surface area of the molded article.
【０００６】
【課題を解決するための手段】
本発明者らは上記課題を解決すべく鋭意検討した結果、本発明に到達した。
すなわち、本発明は
（１）スチレン系樹脂、ポリカーボネート系樹脂、ポリフェニレンエーテル系樹脂から選ばれた１種以上の熱可塑性樹脂（Ａ）０．５重量％以上６０重量％未満と下記(I)、(II)、(III)、(IV)の構造単位からなる液晶性ポリエステル（Ｂ）９９．５重量％以下４０重量％超とからなる樹脂組成物（Ｃ）１００重量部および導電率が０．１〜１０００μＳ／ｃｍの赤燐０．０１〜３０重量部を含有してなる熱可塑性樹脂組成物、
【化４】
【化５】
【化６】
（２）樹脂組成物（Ｃ）１００重量部に充填材を０．５〜３００重量部をさらに含有してなる上記（１）記載の熱可塑性樹脂組成物、
（３）ＵＬ−９４規格において０．５ｍｍ厚みでＶ−０の難燃性を有するである上記（１）または（２）記載の熱可塑性樹脂組成物、
（４）スチレン系樹脂、ポリカーボネート系樹脂、ポリフェニレンエーテル系樹脂から選ばれた１種以上の熱可塑性樹脂（Ａ）の一部もしくは全部、または前記液晶性ポリエステル（Ｂ）の一部もしくは全部または、最終的に含有せしめる（Ａ）および（Ｂ）のうちの一部と赤燐を一旦溶融混練して実際に熱可塑性樹脂組成物に配合されるべき赤燐量よりも赤燐濃度の高い樹脂組成物を作製した後、上記（１）〜（３）のいずれか記載の熱可塑性樹脂組成物を製造することを特徴とする熱可塑性樹脂組成物の製造方法、
（５）上記（１）〜（３）のいずれか記載の難燃性樹脂組成物で構成してなる成形品であって、該成形品が機械機構部品、電気電子部品または自動車部品である成形品、
（６）上記（１）〜（３）のいずれか記載の難燃性樹脂組成物で構成してなる成形品であって、該成形品が板状あるいは箱形でかつ厚み１．０ｍｍ以下の薄肉部を成形品全表面積に対して１０％以上有することを特徴とする成形品を提供するものである。
[0006]
[Means for Solving the Problems]
The present inventors have conducted intensive studies to solve the above-mentioned problems, and as a result, have reached the present invention.
That is, the present invention relates to (1) at least 0.5% by weight and less than 60% by weight of one or more thermoplastic resins (A) selected from styrene-based resins, polycarbonate-based resins, and polyphenylene ether-based resins , and 100 parts by weight of a resin composition (C) comprising 99.5% by weight or more and more than 40% by weight of a liquid crystalline polyester (B) comprising structural units of (II), (III) and (IV) and a conductivity of 0.1%. A thermoplastic resin composition containing 0.01 to 30 parts by weight of red phosphorus having a concentration of 1 to 1000 μS / cm ;
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(2) The resin composition (C) a filler in 100 parts by weight comprising further contain 0.5 to 300 parts by weight of the (1) Symbol thermoplastic resin composition of the mounting,
(3) The thermoplastic resin composition according to the above (1) or (2) , which has a flame retardancy of V-0 at a thickness of 0.5 mm in the UL-94 standard.
(4) a styrene resin, a polycarbonate resin, a part or all of one or more thermoplastic resins selected from polyphenylene ether-based resin (A), the or a part or all of the liquid crystalline polyester (B) or, A resin composition having a higher concentration of red phosphorus than the amount of red phosphorus to be actually blended into the thermoplastic resin composition by temporarily kneading a part of (A) and (B) and red phosphorus which are finally contained. Producing a thermoplastic resin composition according to any one of (1) to (3) above,
(5) above (1) to (3) a molded article obtained by configuration flame retardant resin composition according to any one of the Ru mechanical mechanism parts, electric or electronic parts or automotive parts der molded article formed molded article,
(6) A molded article comprising the flame-retardant resin composition according to any one of the above (1) to (3) , wherein the molded article has a plate shape or a box shape and a thickness of 1.0 mm or less. It is an object of the present invention to provide a molded article characterized by having a thin portion of 10% or more based on the total surface area of the molded article.
本発明の液晶性ポリエステル（Ｂ）とは、溶融時に異方性を形成し得るポリマーである。 The liquid crystalline polyester of the present invention (B), a polymer capable of forming anisotropy in molten.
本発明で使用できる液晶性ポリエステル（Ｂ）は (I) 、(II)、(III) 、(IV)の構造単位からなるポリエステルである。 The liquid crystalline polyester (B) which can be used in the present invention is a polyester comprising structural units ( I), (II), (III) and (IV).
なお、本発明で用いることができる液晶性ポリエステルは、上記構造単位(I)〜(IV)を構成する成分以外に３，３’−ジフェニルジカルボン酸、２，２’−ジフェニルジカルボン酸などの芳香族ジカルボン、アジピン酸、アゼライン酸、セバシン酸、ドデカンジオン酸などの脂肪族ジカルボン酸、ヘキサヒドロテレフタル酸などの脂環式ジカルボン酸、クロルハイドロキノン、３，４’−ジヒドロキシビフェニル、４，４’−ジヒドロキシジフェニルスルホン、４，４’−ジヒドロキシジフェニルスルフィド、４，４’−ジヒドロキシベンゾフェノン、３，４’−ジヒドロキシビフェニル等の芳香族ジオール、プロピレングリコール、１，４−ブタンジオール、１，６−ヘキサンジオール、ネオペンチルグリコール、１，４−シクロヘキサンジオール、１，４−シクロヘキサンジメタノール等の脂肪族、脂環式ジオールおよびｍ−ヒドロキシ安息香酸、２，６−ヒドロキシナフトエ酸などの芳香族ヒドロキシカルボン酸およびｐ−アミノ安息香酸などを液晶性を損なわない程度の範囲でさらに共重合せしめることができる。 Incidentally, the liquid crystalline polyester Le that may be used in the present invention, in addition to components constituting the structural unit (I) ~ (IV) 3,3'- diphenyl dicarboxylic acid, such as 2,2'-diphenyl dicarboxylic acid Aliphatic dicarboxylic acids such as aromatic dicarboxylic acids, adipic acid, azelaic acid, sebacic acid and dodecanedioic acid, alicyclic dicarboxylic acids such as hexahydroterephthalic acid, chlorohydroquinone, 3,4′-dihydroxybiphenyl, 4,4 ′ Aromatic diols such as -dihydroxydiphenylsulfone, 4,4'-dihydroxydiphenylsulfide, 4,4'-dihydroxybenzophenone, and 3,4'-dihydroxybiphenyl, propylene glycol, 1,4-butanediol, and 1,6-hexane Diol, neopentyl glycol, 1,4-cyclohexanediol, 1 Aliphatic and alicyclic diols such as 4-cyclohexane dimethanol and the like, m-hydroxybenzoic acid, aromatic hydroxycarboxylic acids such as 2,6-hydroxynaphthoic acid, and p-aminobenzoic acid, etc., are of a degree that does not impair the liquid crystallinity. Copolymerization can be further performed within the range.
本発明で使用する液晶性ポリエステル（Ｂ）は、ペンタフルオロフェノール中で対数粘度を測定することが可能である。その際、０．１ｇ／ｄｌの濃度で６０℃で測定した値で０．５〜１５．０ｄｌ／ｇが好ましく、１．０〜３．０ｄｌ／ｇが特に好ましい。 The logarithmic viscosity of the liquid crystalline polyester (B) used in the present invention can be measured in pentafluorophenol. In this case, the value measured at 60 ° C. at a concentration of 0.1 g / dl is preferably 0.5 to 15.0 dl / g, and particularly preferably 1.0 to 3.0 dl / g.
また、本発明における液晶性ポリエステル（Ｂ）の溶融粘度は０．５〜５００Pa・sが好ましく、特に１〜２５０Pa・sがより好ましい。また、流動性により優れた組成物を得ようとする場合には、溶融粘度を５０Pa・s以下とすることが好ましい。 The melt viscosity of the liquid crystalline polyester (B) in the present invention is preferably 0.5 to 500 Pa · s, and more preferably 1 to 250 Pa · s. In order to obtain a composition having better fluidity, the melt viscosity is preferably set to 50 Pa · s or less.
本発明で用いるスチレン系樹脂、ポリカーボネート系樹脂、ポリフェニレンエーテル系樹脂から選ばれた１種以上の熱可塑性樹脂（Ａ）と液晶性ポリエステル（Ｂ）の配合比は（Ａ）と（Ｂ）の合計に対し、（Ａ）０．５重量％以上６０重量％未満、（Ｂ）９９．５重量％以下４０重量％超、好ましくは（Ａ）３〜５５重量％、（Ｂ）９７〜４５重量％、より好ましくは（Ａ）５〜４５重量％、（Ｂ）９５〜５５重量％である。 The compounding ratio of at least one thermoplastic resin (A) selected from styrene resin, polycarbonate resin, and polyphenylene ether resin used in the present invention and liquid crystalline polyester (B) is the sum of (A) and (B). (A) 0.5 wt% or more and less than 60 wt%, (B) 99.5 wt% or less and more than 40 wt%, preferably (A) 3-55 wt%, (B) 97-45 wt% And more preferably (A) 5 to 45% by weight and (B) 95 to 55% by weight.
本発明の熱可塑性樹脂組成物は通常公知の方法で製造される。例えば、熱可塑性樹脂（Ａ）および液晶性ポリエステル（Ｂ）成分中、赤燐およびその他の必要な添加剤および充填材を予備混合して、またはせずに押出機などに供給して十分溶融混練することにより調製されるが、好ましくは、ハンドリング性や生産性の面から、熱可塑性樹脂（Ａ）、液晶性ポリエステル（Ｂ）の一部（例えば（Ａ）の一部もしくは全部、（Ｂ）成分の一部もしくは全部、または、最終的に含有せしめる（Ａ）および（Ｂ）のうちの一部）を一旦溶融混練して実際に熱可塑性樹脂組成物に配合されるべき赤燐量よりも赤燐濃度の高い樹脂組成物（Ｄ）を製造し、残りの熱可塑性樹脂（Ａ）もしくは液晶性ポリエステル（Ｂ）成分中に赤燐濃度の高い樹脂組成物（Ｄ）およびその他の任意に用いることができる添加剤および充填材を溶融混練することにより調製される。 The thermoplastic resin composition of the present invention is usually produced by a known method. For example, in a thermoplastic resin (A) and a liquid crystalline polyester (B) component, red phosphorus and other necessary additives and fillers are premixed or supplied to an extruder or the like without or with sufficient melting and kneading. The thermoplastic resin (A) and a part of the liquid crystalline polyester (B) (for example, part or all of (A), preferably (B) A part or all of the components, or a part of (A) and (B) to be finally contained) is once melt-kneaded and actually mixed with the thermoplastic resin composition in an amount larger than the amount of red phosphorus. A resin composition (D) having a high red phosphorus concentration is produced, and the resin composition (D) having a high red phosphorus concentration and other optional components are used in the remaining thermoplastic resin (A) or liquid crystalline polyester (B) component. Additives and It is prepared by melt-kneading the Hamazai.
あるいは熱可塑性樹脂（Ａ）の一部もしくは全部、液晶性ポリエステル（Ｂ）成分の一部もしくは全部、または、最終的に含有せしめる（Ａ）および（Ｂ）のうちの一部と赤燐およびその他の任意に用いることができる添加剤を一旦溶融混練して、実際に熱可塑性樹脂組成物に配合されるべき赤燐量よりも赤燐濃度の高い樹脂組成物（Ｄ）を製造し、残りの熱可塑性樹脂（Ａ）もしくは液晶性ポリエステル（Ｂ）成分中および赤燐濃度の高い樹脂組成物（Ｄ）の段階で添加した任意に用いることができる添加剤以外の添加剤および充填材を溶融混練することにより調製される。 Alternatively, part or all of the thermoplastic resin (A), part or all of the component of the liquid crystalline polyester (B), or part of (A) and (B) finally contained with red phosphorus and other components Is melt-kneaded once to produce a resin composition (D) having a higher red phosphorus concentration than the amount of red phosphorus to be actually incorporated into the thermoplastic resin composition, and the remaining Melt kneading of additives and fillers other than optional additives added in the thermoplastic resin (A) or liquid crystalline polyester (B) component and in the stage of the resin composition (D) having a high red phosphorus concentration. It is prepared by
かかる赤燐高濃度品（Ｄ）の赤燐配合量は、赤燐高濃度品の製造面、赤燐の分散性の面、および最終的に得られる熱可塑性樹脂組成物の難燃性、機械特性、成形性の面から、熱可塑性樹脂（Ａ）および／または液晶性ポリエステル（Ｂ）からなる樹脂（組成物）１００重量部に対して、５〜３００重量部が好ましく、特に好ましくは１５〜２００重量部である。 The compounding amount of red phosphorus in the high-concentration red phosphorus product (D) depends on the production of the high-concentration red phosphorus product, the dispersibility of red phosphorus, the flame retardancy of the thermoplastic resin composition finally obtained, From the viewpoints of properties and moldability, the amount is preferably 5 to 300 parts by weight, particularly preferably 15 to 300 parts by weight, per 100 parts by weight of the resin (composition) composed of the thermoplastic resin (A) and / or the liquid crystalline polyester (B). 200 parts by weight.
赤燐高濃度品（Ｄ）としては、（１）熱可塑性樹脂（Ａ）のみからなる赤燐高濃度品、（２）液晶性ポリエステル（Ｂ）のみからなる赤燐高濃度品、（３）熱可塑性樹脂（Ａ）および液晶性ポリエステル（Ｂ）からなる赤燐高濃度品のいずれも、本効果を発現する。好ましくは液晶性ポリエステル（Ｂ）のみからなる赤燐高濃度品を用いたものが熱可塑性樹脂組成物中での赤燐の分散性が高く、薄肉難燃性、耐熱性が向上する。 The red phosphorus high concentration product (D) includes (1) a red phosphorus high concentration product consisting of only the thermoplastic resin (A), (2) a red phosphorus high concentration product consisting only of the liquid crystalline polyester (B), and (3) Both of the high-concentration products of red phosphorus composed of the thermoplastic resin (A) and the liquid crystalline polyester (B) exhibit this effect. Preferably, those using a high-concentration product of red phosphorus composed of only the liquid crystalline polyester (B) have high dispersibility of red phosphorus in the thermoplastic resin composition, and have improved thin-walled flame retardancy and heat resistance.
かかる赤燐濃度の高い樹脂組成物（Ｄ）は、いわゆるマスターペレットの形態で好ましく用いられるが、それに限定されず、いわゆるチップ状、粉末状、あるいはそれらの混合物の形態であってもよい。またかかる（Ｄ）成分と配合する熱可塑性樹脂（Ａ）および液晶性ポリエステル（Ｂ）はペレット状であることが好ましいが、それに限定されず、いわゆるチップ状、粉末状あるいは、チップ状と粉末状の混合物であってもよいが、好ましくは熱可塑性樹脂（Ａ）および液晶性ポリエステル（Ｂ）の形態、大きさ、形状はほぼ同等、あるいは互いに似通っていることが均一に混合し得る点で好ましい。樹脂組成物を製造するに際し、例えば“ユニメルト”タイプのスクリューを備えた単軸押出機、二軸、三軸押出機およびニーダタイプの混練機などを用いて１８０〜３５０℃で溶融混練して組成物とすることができるが、好ましくは２軸押出機を用い、液晶性樹脂の融点以下で混練することが好ましく、より好ましくは融点−１０℃で混練することで本発明の効果（特に流動性、衝撃強度等）を大きく発揮する。 The resin composition (D) having a high red phosphorus concentration is preferably used in the form of a so-called master pellet, but is not limited thereto, and may be in the form of a chip, a powder, or a mixture thereof. The thermoplastic resin (A) and the liquid crystalline polyester (B) to be blended with the component (D) are preferably in the form of pellets, but are not limited thereto, and are not limited to so-called chips, powders, or chips and powders. However, it is preferable that the thermoplastic resin (A) and the liquid crystalline polyester (B) have substantially the same form, size, and shape, or that they are similar to each other because they can be uniformly mixed. . In producing the resin composition, the composition is melt-kneaded at 180 to 350 ° C. using, for example, a single-screw extruder equipped with a “Unimelt” type screw, a twin-screw extruder, a tri-screw extruder, and a kneader-type kneader. However, it is preferable to use a twin-screw extruder to knead the mixture at a temperature equal to or lower than the melting point of the liquid crystalline resin, and more preferable to knead the mixture at a melting point of −10 ° C. , Impact strength, etc.).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20668299A JP4296640B2 (en) | 1998-08-03 | 1999-07-21 | Thermoplastic resin composition and molded article |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21884598 | 1998-08-03 | ||
| JP10-218845 | 1998-08-03 | ||
| JP20668299A JP4296640B2 (en) | 1998-08-03 | 1999-07-21 | Thermoplastic resin composition and molded article |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000109654A JP2000109654A (en) | 2000-04-18 |
| JP2000109654A5 true JP2000109654A5 (en) | 2006-09-07 |
| JP4296640B2 JP4296640B2 (en) | 2009-07-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP20668299A Expired - Fee Related JP4296640B2 (en) | 1998-08-03 | 1999-07-21 | Thermoplastic resin composition and molded article |
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| JP (1) | JP4296640B2 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4420548B2 (en) * | 2000-09-28 | 2010-02-24 | 旭化成ケミカルズ株式会社 | Polyphenylene ether resin composition |
| JP2003138125A (en) * | 2001-11-05 | 2003-05-14 | Mitsubishi Chemicals Corp | Aromatic polycarbonate resin composition |
| JP6762228B2 (en) * | 2016-12-26 | 2020-09-30 | ポリプラスチックス株式会社 | Liquid crystal resin composition for camera module and camera module using it |
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1999
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