JP2000103034A - Manufacture of plasma display and screen printing machine for plasma display - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable the quality level of print by screen printing by measuring the thickness of a glass substrate for plasma display and adjusting an assistant runner to be set on a printing table to an appropriate elevation and further, performing the screen printing, when the glass substrate for plasma display is screen-printed. SOLUTION: When the screen printing of a glass substrate for plasma display (hereafter called 'substrate' 1 is performed, at least, the thickness of the substrate 1 is measured in order to upgrade the quality level of print without dispersion, and the height of an assistant runner 2 to be set on a printing table 3 is adjusted depending upon the measurement results. After that, a paste is applied to perform the screen printing process. In this case, the assistant runner 2 is ideally adjusted to be 0.01-0.02 mm, preferably 0.01-0.1 mm lower in elevation than the substrate 1. When the elevation of the assistant runner 2 is adjusted, a shim spacer is introduced into a space between the assistant runner and its base or the height of the base part on which the assistant runner is set, is changed vertically as the adjustment methods.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a screen printing method for a plasma display and a screen printing machine.

[0002]

2. Description of the Related Art Plasma display panels (PDPs)
Are used in fields such as OA equipment and public information display devices because they can display at a higher speed than a liquid crystal panel and can be easily made larger. The PDP generates a plasma discharge between an anode and a cathode facing each other in a discharge space provided between a front glass substrate and a rear glass substrate, and emits ultraviolet light generated from a gas sealed in the discharge space. The display is performed by hitting a phosphor provided in the discharge space.

[0003] In the manufacture of plasma displays, screen printing can be used for processes such as electrodes, dielectrics, partitions, and phosphors.

In the case of screen printing on a glass substrate for a plasma display, for example, as shown in FIG. 1, after setting the substrate 1 on a printing table 3, the end of the substrate 1 is supported by the run-in plate 2 and printed. . Generally, the thickness of the run-up plate 2 is substantially equal to or slightly thinner than the thickness of the substrate 1.

[0005] However, the plasma display glass substrate usually has a thickness tolerance of about ± 0.1 mm depending on the lot, and simply using the same run-in plate may cause printing failure.

[0006]

SUMMARY OF THE INVENTION An object of the present invention is to improve the print quality of screen printing by maintaining the height of the substrate and the height of the run-in plate in a proper relationship when screen printing a glass substrate for a plasma display. It is an object of the present invention to provide a method of manufacturing a plasma display and a screen printing machine for a plasma display, which can be performed.

[0007]

SUMMARY OF THE INVENTION It is an object of the present invention to manufacture a plasma display which measures the thickness of a substrate at the time of screen printing, adjusts the height of a run-up plate to an appropriate height, and then screen-prints. Method, and measure the thickness of the substrate one by one or intermittently, based on the measurement results,
This is achieved by a screen printing machine for a plasma display, which has a mechanism for adjusting the height of the run-up plate.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION The method of manufacturing a plasma display according to the present invention measures at least the thickness of a substrate and proceeds based on the result in order to improve the print quality of screen printing without variation. It is characterized by printing after adjusting the plate height.

As the method for measuring the thickness of the substrate, either a contact type or a non-contact type can be used. Examples of the contact-type measuring method include a stylus-type thickness measuring device, and examples of the non-contact-type measuring device include a laser displacement meter.
Contact measurement is preferred because of the transparent nature of the substrate.

The location for measuring the thickness of the substrate is not particularly limited, but it is preferable to measure one or more points on the end face of the substrate since the aim is to adjust the level difference with the run-in plate.

It is preferable that the thickness of the substrate is measured on a sheet-by-sheet basis, and the height of the run-in board is adjusted based on the result and printed. Although single wafer measurement may be performed manually, automatic measurement is preferable in terms of accuracy and efficiency.

Since the thickness of the substrate is generally considered to have little variation within a lot, it is also useful to automatically measure the thickness intermittently, for example, when changing lots or at intervals of several tens of sheets.

[0013] The height of the run-up plate is 0.01 times higher than the height of the substrate.
０．２0.2 mm lower, preferably 0.01-0.1 mm lower.

When measuring the thickness of the substrate at several points, it is preferable to make the height of the approaching plate lower than the minimum value.

When the thickness of the substrate fluctuates by 0.01 or more in the plane, the height of the run-up plate near each measuring point can be individually adjusted according to the substrate height.

There are no particular restrictions on the method of adjusting the height of the run-up plate. For example, a method of replacing the run-up plate, a method of inserting a thickness adjusting spacer between the run-up plate and its pedestal, There are a method of raising and lowering the height of the set pedestal portion (the portion where the run-up plate of the printing table 3 is installed) and a method of raising and lowering the pedestal portion integrated with the run-up plate. From the viewpoint of simplicity of operation, it is preferable that the pedestal portion is divided from the printing table and is movable. The area of the movable part is
Preferably, it is variable according to the substrate size used for printing. Up and down movement of the pedestal may be performed manually, but is preferably performed automatically in terms of accuracy and efficiency.

The substrate with the height of the run-up plate adjusted is set at a screen printing position, and a predetermined paste is applied.

The method of manufacturing a plasma display of the present invention can be applied without limitation as long as it is a method of manufacturing a plasma display using screen printing. Examples that can be applied include formation of an electrode, a dielectric, a partition, a phosphor, and the like.

The printing pattern can be applied to both solid printing for photo processing and pattern printing.

The plasma display substrate obtained by the method of the present invention has a very small variation in in-plane printed film thickness.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically described below with reference to embodiments. However, the present invention is not limited to this.

Solid printing of electrodes was performed using a silver paste for photoprocessing. The print thickness was targeted at 5 microns after firing. Table 1 shows the results of printing three lots of a substrate lot and 30 lots of each lot. The substrate thickness was measured at the ten nearest end faces in FIG. 2 using a stylus-type thickness measuring device. To adjust the thickness of the run-up board, prepare a 2.6-mm run-up board,
This was performed by applying a tape of 0 μm or 20 μm. The thickness of the first printed substrate is 2.72,
2.72, 2.73, 2.73, 2.72, 2.73,
2.73, 2.73, 2.72 and 2.73 mm. The thickness of the run-up plate was set to 2.70 mm, which is 0.02 mm thinner from the minimum value of the substrate thickness of 2.72 mm. The thickness of the substrate is measured in the same manner for the second and subsequent substrates, and the minimum value of the substrate thickness−
A 0.02 mm run-in board was used.

The substrate after solid printing was dried at 100 ° C. for 30 minutes and then baked at 560 ° C. for 30 minutes.

The print quality was evaluated based on the coating unevenness and the film thickness variation on the end face of the substrate. As for the coating unevenness, the case where the end surface of the substrate can be applied without unevenness like the center of the substrate is passed. When coating unevenness was observed, it was judged as NG. The film thickness is 1 in FIG.
All the points were measured at 0 points, and the maximum value of the in-plane variation was compared.

From Table 1, when the height of the run-in board is adjusted by one sheet (Example 1), the occurrence of coating unevenness on the end face is zero, and
The maximum in-plane variation of the film thickness was 0.4 μm.
When the thickness of the run-in plate was fixed (Comparative Example 1), coating unevenness on the end face occurred on 11 sheets, and the maximum in-plane variation of the film thickness was 1.0 μm.

[0026]

[Table 1]

[0027]

The present invention is characterized in that the thickness of the substrate is measured on a sheet-by-sheet basis and the height of the approaching plate is adjusted. By setting the appropriate height of the approaching plate each time, the print quality can be improved. Therefore, the printing yield can be improved.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view showing an example of a screen printer for a plasma display to which the present invention is applied.

FIG. 2 is a diagram showing measurement positions of a film thickness of a substrate in Examples and Comparative Examples of the present invention.

[Explanation of symbols]

 1: substrate 2: run-up board 3: printing table

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01J 11/02 H01J 11/02 B

Claims (4)

[Claims] 1. A method of manufacturing a plasma display, comprising: measuring the thickness of a substrate one by one, adjusting the height of a run-in plate, and performing screen printing. 2. A method for manufacturing a plasma display, comprising: automatically measuring the thickness of a substrate one by one, adjusting the height of a run-in plate, and performing screen printing. 3. A method for manufacturing a plasma display, comprising: automatically measuring the thickness of a substrate intermittently; adjusting the height of a run-in plate; and performing screen printing. 4. A screen printing machine for a plasma display, comprising means for measuring the thickness of a substrate one by one or intermittently, and having a mechanism for adjusting the height of a run-in plate based on the measurement result. .