JP2000101057A - Sensor panel device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sensor panel device wherein the nonuniformity of the temp. distribution in the sensor panel is reduced to obtain image information signals at a good uniformity. SOLUTION: The sensor panel device comprises a sensor panel 1, a base 2 having one face bonded to the sensor panel 1, integrated circuit boards 4a, 4b for driving the sensor panel 1, and connecting integrated circuit units 5a, 5b for electrically connecting the integrated circuit boards 4a, 4b to the center panel 1. One face of a thermally conductive frame member 3 is bonded to the other face of the base 2 and a pattern of electric heating wires 6 is attached to the other face of the thermally conductive frame member 3 as means for controlling the temp. distribution of the sensor panel 1. The pattern of electric heating wires 6 is divided in a plurality of systems and the electric heating wires 6 of each system can be fed appropriately with electric powers, respectively.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a sensor panel device for electrically outputting image information as a set of pixel signals corresponding to the sensor cells by a sensor panel in which a plurality of sensor cells are arranged.

[0002]

2. Description of the Related Art Image information is read by an optical sensor panel in which a large number of minute optical sensor cells are arranged one-dimensionally or two-dimensionally on a glass substrate. An output from a sensor cell is appropriately processed by a signal processing circuit to obtain an electrical image information signal as a set of pixel signals corresponding to the sensor cell.

FIG. 4 shows a first conventional example of a sensor panel device. FIG. 4A is a plan view, and FIG. 4B is a cross-sectional view along the dashed line.

In FIG. 4, reference numeral 1 denotes an optical sensor panel formed by two-dimensionally arranging a large number of optical sensor cells in a thin film structure on the upper surface of a glass substrate. Is joined to a part of the area. On the upper surface of the base 2, a driving circuit and the like necessary for driving reading of image information by the optical sensor panel 1 including processing of output from each sensor cell of the optical sensor panel 1 are integrated. Integrated circuit boards 4a and 4b having a circuit are joined. The electrode terminals of these integrated circuit boards 4a and 4b are connected to the electrode terminals formed at the ends of the optical sensor panel 1 by the connection integrated circuit units 5a and 5b, respectively. The connection integrated circuit units 5a and 5b are units in which an IC chip 8 or the like is bonded to a metal lead foil formed on an upper surface of a resin film by a conductive coating.

FIG. 5 shows a second conventional example of the sensor panel device. 5 (a) is a bottom view, FIG. 5 (b) is a partially developed plan view, and FIG. 5 (c) is a cross-sectional view taken along a dashed line in FIG. 5 (a). In these drawings, members having the same functions as those in FIG. 4 are denoted by the same reference numerals.

In the conventional example shown in FIG. 5, a large area image is read by using four optical sensor panels 1 as units similar to the conventional example shown in FIG. That is, four joined bodies of the base 2 and the optical sensor panel 1 are joined on the upper surface of the common housing member 3a. However, the connection integrated circuit unit 5a, one end of which is connected to the sensor panel 1, is routed below the housing member 3a via the outside of the end surface of the housing member 3a. The integrated circuit board 4a connected to the other end of 5a is joined to the lower surface of the housing member 3a. The IC chip 8 of the connection integrated circuit unit 5a is also joined to the lower surface of the peripheral part of the housing member 3a.
Further, the connection integrated circuit unit 5b having one end connected to the sensor panel 1 is bent downward along the end face of the housing member 3a, and is connected to the other end of the connection integrated circuit unit 5b. The integrated circuit board 4b is joined to the end surface of the housing member 3a.

In FIG. 5B, the integrated circuit boards 4a and 4b and the connecting integrated circuit units 5a and 5b are shown as being developed on a plane.

However, in the above-described conventional sensor panel device, when the integrated circuit unit for connection that consumes a large amount of current is used, the amount of heat radiated from the IC chip 8 increases. The partial temperature difference increases, and the unevenness of the temperature distribution in the sensor panel surface increases. FIG. 6 shows an example of the temperature distribution measured in the cross section of FIG. As shown in FIG. 6, the temperature rise is large near the end of the panel near the IC chip 8, and the temperature rise is small at the center. Such a tendency becomes remarkable as the thickness of the sensor panel is promoted.

As a result, the output from each sensor cell of the sensor panel 1 changes according to the temperature of the panel portion where the sensor cell is located. That is, even with the same light input, different pixel output signals can be obtained according to the temperature of the sensor cell.

Further, in the above-described conventional sensor panel device, it takes a long time until a required pixel output signal level is obtained after the power is turned on, and there is a demand for a shorter startup time.

The present invention has been made based on the above circumstances, and even if heat is radiated from an IC chip of a connection integrated circuit unit, nonuniformity in the temperature distribution of a sensor panel is reduced and image information having good uniformity is obtained. It is an object to provide a sensor panel device from which a signal can be obtained.

Another object of the present invention is to provide a sensor panel device capable of sufficiently shortening the startup time regardless of the outside air temperature.

[0013]

According to the present invention, in order to solve the above-mentioned problems, a sensor panel, a base having the sensor panel joined to one surface, and a drive unit for driving the sensor panel are provided. A sensor panel device comprising: an integrated circuit board; and a connection integrated circuit unit for electrically connecting the integrated circuit board to the sensor panel, wherein the integrated circuit board is electrically connected to the other surface of the base or the other of the base. A heating device for controlling the temperature distribution of the sensor panel is provided on the other surface of the joining member having one surface joined to the surface of the sensor panel.

In one embodiment of the present invention, the heating means for controlling temperature distribution is a heating wire or a heating sheet.

In one embodiment of the present invention, the temperature distribution control heating means is divided into a plurality of systems.

In one embodiment of the present invention, the sensor panel has a plurality of sensor cells formed on a glass substrate.

In one embodiment of the present invention, the connection integrated circuit unit has an IC chip, and the IC chip is connected to the other surface of the base on which the heating means for controlling the temperature distribution is provided. It is joined to the other surface of the joining member.

In one embodiment of the present invention, the integrated circuit board is joined to the other surface of the base on which the heating means for controlling temperature distribution is provided or to the other surface of the joining member.

[0019]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a diagram showing the structure of a first embodiment of the sensor panel device according to the present invention. 1 (a) is a bottom view, FIG. 1 (b) is a partially developed bottom view, and FIG. 1 (c) is a cross-sectional view taken along a dashed line in FIG. 1 (a).

In FIG. 1, reference numeral 1 denotes an optical sensor panel in which a large number of optical sensor cells are two-dimensionally arranged in a thin film structure on an upper surface of a glass substrate. It is joined to the upper surface of the table 2. On the upper surface of the base 2, a driving circuit and the like necessary for driving reading of image information by the optical sensor panel 1 including processing of output from each sensor cell of the optical sensor panel are provided. Are integrated. The electrode terminals of the integrated circuit boards 4a and 4b are connected to the optical sensor panel 1 by the connection integrated circuit units 5a and 5b, respectively.
Are connected to the electrode terminals formed at the ends of the. The connection integrated circuit units 5a and 5b are units in which an IC chip 8 and the like are bonded to a metal lead foil formed on an upper surface of a resin film by a conductive coating.

Joint 4 of base 2 and optical sensor panel 1
One is joined on the upper surface of the common heat conductive housing member 3. The connection integrated circuit unit 5a, one end of which is connected to the sensor panel 1, is routed below the housing member 3 via the outside of the end surface of the housing member 3, and is connected to the connection integrated circuit unit 5a. The integrated circuit board 4 a connected to the other end is joined to the lower surface of the housing member 3. And
The IC chip 8 of the connection integrated circuit unit 5a is also joined to the lower surface of the housing member 3. Further, the connection integrated circuit unit 5b having one end connected to the sensor panel 1 is bent downward along the end surface of the housing member 3, and is connected to the other end of the connection integrated circuit unit 5b. The integrated circuit board 4 b is joined to the end surface of the housing member 3.

FIG. 1B shows a form in which the integrated circuit boards 4a and 4b and the connecting integrated circuit units 5a and 5b are developed on a plane.

The configuration of the present embodiment described above is equivalent to the conventional example shown in FIG.

However, in the present embodiment, in addition to the above configuration, a pattern of the heating wire 6 as a temperature distribution control heating means is provided on the lower surface of the housing member 3. This pattern is divided into three systems in the direction of the alternate long and short dash line in FIG. That is, there are two systems arranged at both ends of the housing member 3 to which the IC chip 8 of the connection integrated circuit unit 5a is joined, and one system arranged between these two systems.

In the present embodiment as described above, the three heating wires 6 are arranged so as to reduce the non-uniformity of the temperature distribution generated on the sensor panel 1 due to the heat radiation from the IC chip 8 of the connection integrated circuit unit. It is possible to appropriately supply a current to each system. Thereby, temperature control can be performed to reduce non-uniformity of the temperature distribution in the sensor panel 1. FIG. 2 shows an example of the temperature distribution in the sensor panel 1 in the case where the heating wire 6 is energized to perform temperature control in the present embodiment. Compared with the temperature distribution shown in FIG. 6 of the conventional sensor panel device that does not perform such temperature control, it can be seen that the uniformity of the temperature distribution of the present embodiment is good. As can be seen from FIG. 2, the improvement of the uniformity of the temperature distribution is achieved by heating the relatively low temperature portion of the sensor panel with the heating wire 6, so that the temperature fluctuation of the sensor panel 1 due to the change of the external temperature. Can be reduced, and thus a stable image information signal can be obtained. Further, by performing the heating using the heating wire 6, the time until the required pixel output signal level is obtained after the power is turned on, that is, the startup time can be sufficiently reduced regardless of the outside air temperature.

FIG. 3 is a partially developed bottom view showing the structure of a sensor panel device according to a second embodiment of the present invention.
FIG. 2 is a diagram showing a state similar to that of FIG.

This embodiment differs from the first embodiment only in that the pattern of the heating sheet 7 is used in place of the pattern of the heating wire 6 as the heating means for temperature control. FIG.
In the figure, the hatched portion indicates the electric heating sheet 7. The electric heating sheet 7 is divided into five systems.

In this embodiment, the same effects as in the first embodiment can be obtained. It should be noted that the temperature control of the sensor panel 1 can be performed more favorably by increasing the number of system divisions of the heating means, and the uniformity of the temperature distribution can be more easily improved.

In the above embodiment, an example is shown in which the sensor panel is joined to the base, the base is joined to the housing member, and the housing member is provided with a heating means for temperature control. The invention also includes a mode in which a heating means for temperature control is provided on a base to which the sensor panel is joined.

In the above description of the embodiment, an example is shown in which the sensor panel is an optical sensor panel.
The present invention also includes a mode using a sensor panel having a sensor cell that detects an X-ray and converts it into an electric signal.

[0032]

As described above, according to the present invention,
Since the temperature control heating means is attached to the heat conductive member to which the sensor panel is directly or indirectly bonded, the temperature control heating means appropriately generates heat to control the temperature of the sensor panel. Thereby, the nonuniformity of the temperature distribution on the sensor panel surface is reduced, and a pixel signal with good uniformity is obtained.

Further, by performing the heating by the temperature control heating means, a stable image information signal can be obtained irrespective of the outside air temperature, and the start-up time after turning on the power can be sufficiently reduced. .

[Brief description of the drawings]

FIG. 1 is a view showing the structure of a first embodiment of a sensor panel device according to the present invention.

FIG. 2 is a diagram showing an example of a temperature distribution of the sensor panel in the first embodiment of the sensor panel device according to the present invention.

FIG. 3 is a partially developed bottom view showing the structure of a sensor panel device according to a second embodiment of the present invention.

FIG. 4 is a diagram showing an example of a conventional sensor panel device.

FIG. 5 is a diagram showing another example of a conventional sensor panel device.

FIG. 6 is a diagram illustrating an example of a temperature distribution of a sensor panel in a conventional sensor panel device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Sensor panel 2 Base 3, 3a Case 4a, 4b Integrated circuit board 5a, 5b Connection integrated circuit unit 6 Heating wire 7 Electric heating sheet 8 Connection integrated circuit unit IC chip

Claims (6)

[Claims] 1. A sensor panel, a base having the sensor panel joined to one surface, an integrated circuit board for driving the sensor panel, and electrically connecting the integrated circuit board and the sensor panel. A sensor panel device having a connection integrated circuit unit to be connected, wherein the sensor panel is connected directly to the other surface of the base or to the other surface of a joining member having one surface joined to the other surface of the base. A sensor panel device provided with heating means for controlling temperature distribution. 2. The sensor panel device according to claim 1, wherein the heating means for controlling temperature distribution is a heating wire or a heating sheet. 3. The sensor panel device according to claim 1, wherein said temperature distribution control heating means is divided into a plurality of systems. 4. The sensor panel device according to claim 1, wherein the sensor panel has a plurality of sensor cells formed on a glass substrate. 5. The connection integrated circuit unit has an IC chip, and the IC chip is the other surface of the base or the other surface of the joining member provided with the temperature distribution control heating means. The sensor panel device according to claim 1, wherein the sensor panel device is joined to the sensor panel device. 6. The integrated circuit board is bonded to the other surface of the base provided with the heating means for controlling temperature distribution or the other surface of the bonding member. 6. The sensor panel device according to any one of 5.